JP2007220868A - Substrate transfer / processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simply provide substrate carrying/treating equipment capable of stably holding the place of a substrate without contaminating a substrate rear inexpensively. <P>SOLUTION: The substrate carrying/treating equipment has a substrate gripping means 110 rotated by its own weight of the substrate when the substrate is loaded. The substrate can be gripped surely and stably by a force generated by its own weight of the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate transport / processing apparatus provided with a gripping device for gripping a substrate, and more particularly to a transport / processing apparatus for various substrates such as a semiconductor wafer and a liquid crystal glass substrate.

Conventionally, when a substrate is transferred or rotated for processing, if the operation is performed at a high speed in order to improve the throughput, there has been a problem that the position of the substrate is shifted or dropped.
In order to solve these problems, a substrate transfer / processing apparatus including a substrate gripping mechanism that operates by its own weight is known. (For example, see Patent Documents 1 to 3).

Hereinafter, an outline of the substrate transfer / processing apparatus having the substrate gripping mechanism described in Patent Documents 1 to 3 will be described.
In FIG. 6, reference numeral 1 denotes a substrate gripping mechanism. Before the substrate 2 is mounted, the substrate gripping mechanism 1 contacts the substrate mounting table 4 at a position rotated clockwise in FIG. 6 due to the weight balance of the substrate gripping mechanism 1. Still at position. When the substrate 2 is mounted, the back surface of the substrate 2 comes into contact with the substrate back surface support 1g, and the substrate gripping mechanism 1 rotates counterclockwise in FIG. The rotation is stopped by the stopper 1c, and the substrate 2 is held at this position. At this time, the board | substrate 2 is fixed by the board | substrate edge part contact part 1e and the board | substrate back surface support 1g. Further, when the substrate 2 is fixed, the plurality of substrate gripping mechanisms 1 operate simultaneously, and the substrate gripping mechanism 1 and the substrate 2 come into contact with each other to position the substrate 2. When the substrate 2 is taken out from the substrate gripping mechanism 1, when a substrate lifting means such as a robot (not shown) lifts the back surface of the substrate 2, the substrate gripping mechanism 1 stopped by the stopper 1c due to its own weight is shown in FIG. Rotating clockwise, the substrate 2 is lowered from the substrate gripping mechanism 1. At this time, the substrate gripping mechanism 1 rotates clockwise according to the weight balance and stops at a position where it contacts the substrate mounting table 4.

  Next, the substrate transfer / processing apparatus described in Patent Document 2 has a substrate gripping mechanism on the fork of the transfer robot. The basic configuration is the same as that of Patent Document 1 except that the stopper 1c in FIG. 6 is not provided and the substrate gripping mechanism directly contacts the fork.

  Next, the substrate transfer / processing apparatus described in Patent Document 3 has basically the same configuration as that of Patent Document 1.

JP-A-6-155213 (page 2-3, FIG. 1) Japanese Patent Laid-Open No. 10-74816 (page 3-4, FIG. 2) Japanese Patent No. 3138554 (page 5-7, FIG. 1)

  A conventional substrate transport / processing apparatus having a substrate gripping mechanism grips the substrate by its own weight, so that the back surface of the substrate comes into contact with the substrate gripping means, which contaminates the back surface of the substrate. Further, since the rotation fulcrum of the substrate gripping means is in the vicinity under the substrate, there is a problem that particles generated from the substrate contaminate the back surface of the substrate. Furthermore, when the substrate is gripped, the substrate gripping means collides with the stopper portion in a vigorous state, and the stopper is located near the bottom of the substrate, so that particles are similarly generated from this and contaminate the back surface of the substrate. There was a problem.

That is, although the problem that the substrate itself vibrates and particles are generated by being gripped is solved, particles are generated from the mechanism (substrate back support, rotation fulcrum, stopper) for operating the substrate gripping means. Eventually, the effects of pollution could not be avoided.
Concerning the generation of the above particles, contamination is prevented by downflow, but the particle generation source is located very close to the substrate, and the downflow is combined with the shape of the apparatus to which the substrate gripping means is attached. Since air current disturbance such as rewinding occurs, this cannot be completely prevented.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a substrate transport / processing apparatus capable of minimizing the contamination of the substrate and stably holding the substrate.

In order to solve the above problem, the present invention is configured as follows.
The invention according to claim 1 is a substrate mounting portion on which a substrate is placed, a rotation support portion provided on the substrate mounting portion, a first grip portion and a second grip portion that contact the substrate, and the substrate grip A substrate gripping means that has at least a weight for biasing the means in an open state and is rotatable about the rotation support portion in the substrate radial direction; and a stopper provided on the substrate mounting portion. In the substrate transport / processing apparatus in which the substrate gripping means rotates around the rotation support portion by the weight of the substrate and grips the substrate, the substrate gripping means holds the substrate at a position where the substrate grips the substrate and releases the substrate, respectively. A stopper with which the weight abuts is provided.
The invention described in claim 2 is characterized in that a vent hole is provided under the substrate gripping means of the substrate mounting portion.
According to a third aspect of the present invention, there is provided a magnetic body provided in the gripping means, a magnetism generating means for generating magnetism provided in the substrate mounting portion, and a position detection means for detecting a gripping position of the substrate gripping means. It is characterized by comprising.
According to a fourth aspect of the present invention, the strength of magnetism generated by the magnetism generating means is changed according to the gripping position detected by the position detecting means.
The invention described in claim 5 is characterized in that the substrate contact portion of the substrate gripping portion is provided with comb-like irregularities.
The invention described in claim 6 is characterized in that the substrate contact surface in the substrate contact portion of the substrate gripping portion has a mountain-and-valley shape.
According to a seventh aspect of the present invention, there is provided a substrate mounting portion on which a substrate is placed, a rotation support portion provided on the substrate mounting portion, and a substrate gripper that is rotatable about the rotation support portion in the substrate radial direction. And a stopper provided on the substrate mounting portion, wherein the substrate gripping means rotates around the rotation support portion by its own weight and grips the substrate. A vent hole is provided under the substrate gripping means of the mounting portion.
According to an eighth aspect of the present invention, there is provided a substrate mounting portion on which a substrate is placed, a rotation support portion provided on the substrate mounting portion, and a substrate gripper capable of rotating in the substrate radial direction around the rotation support portion. And a stopper provided on the substrate mounting portion, wherein the substrate gripping means rotates around the rotation support portion by its own weight and grips the substrate. Comprising: a magnetic body provided in the means; a magnetism generating means for generating magnetism provided in the substrate mounting portion; and a position detecting means for detecting a gripping position of the substrate gripping means. It is.

According to the first aspect of the present invention, the substrate can be held in a stable position, and the weight provided outside the rotation support part also serves as a stopper, so that particles from the stopper are generated at a location away from the substrate, The possibility of contamination of the substrate is low.
Further, according to the second and seventh aspects of the present invention, particles generated from the substrate gripping means or the rotation support portion flow out through the vent hole without being rewound by the downflow, so that the substrate is contaminated. Very unlikely.
Further, according to the third, fourth, and eighth aspects of the invention, a force can be applied to the substrate gripping means in a non-contact manner, so that a soft gripping operation can be performed and the generation of particles is minimized. Can be suppressed. Furthermore, since the gripping operation can be performed reliably, stable gripping is possible regardless of the type of substrate.
Further, according to the fifth and sixth aspects of the invention, the contact area between the substrate gripping portion and the substrate is reduced, and the possibility of particle adhesion to the substrate when the substrate gripping portion and the substrate are in contact is reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of a substrate mounting portion side view of a substrate transfer / processing apparatus according to a first embodiment of the present invention. FIG. 1A shows a state where the substrate is not gripped (open state), and FIG. 1B shows a state where the substrate is gripped (gripping state). The figure shows only a part, and a plurality of substrate gripping means, stoppers and the like, which will be described later, are provided symmetrically with respect to the center of the substrate.
In the figure, reference numeral 100 denotes a substrate such as a silicon wafer or a glass substrate.
Reference numeral 101 denotes a substrate mounting portion for mounting the substrate 100, which corresponds to an end effector in a semiconductor transfer robot, a rotary table for a pre-aligner, or the like. The substrate mounting unit is for mounting the substrate 100 via a substrate gripping mechanism described later.
Reference numeral 102 denotes a rotation support unit such as a bearing provided in the substrate mounting unit 101.
Reference numeral 110 denotes a substrate gripping means including a first gripping part 111, a second gripping part 112 and a weight 113. The substrate gripping means 110 can rotate in the radial direction of the substrate (in the direction of the arrow in FIG. 1) around the rotation support portion 102. The 1st holding part which comprises the board | substrate holding means 110 contacts the lower end part of a board | substrate, and a 2nd holding part contacts the upper end part of a board | substrate. The weight 113 is provided on the outer side in the substrate radial direction with respect to the rotation support portion 102 and generates a moment around the rotation support portion 102 so as to maintain the substrate gripping portion 110 in an open state.
Reference numeral 105 denotes a first stopper that comes into contact with the weight 113, and reference numeral 106 denotes a second stopper that comes into contact with the weight 113. The first stopper 105 limits the movement of the substrate gripping means when the substrate gripping means 110 is in the substrate open state (FIG. 1A), and the second stopper is the substrate gripping means 110 in the substrate gripping state. The movement of the substrate gripping means is limited when it is in (FIG. 1B).

The present invention is different from Patent Documents 1 to 3 in that there is no portion that directly supports the back surface of the substrate, and the substrate gripping means 110 grips the substrate only at the edge of the substrate.
Further, the weight 113 is different in that it also serves as a stopper.

The operation will be described below.
First, in a state where no substrate is placed, the substrate gripping portion 110 is in the state of FIG. The center of gravity of the weight 113 is provided outside the rotation support portion 102 in the substrate radial direction, and generates a moment around the rotation support portion 102 so as to maintain the substrate gripping portion 110 in an open state. However, by contacting the first stopper 105, the substrate gripping means 110 is stationary with the substrate open.
Next, when the substrate is placed on the first gripping portion 111 of the substrate gripping means by an apparatus (not shown), the substrate gripping means is brought into a gripping state that overcomes the moment generated by the weight 113 due to its own weight. A rotating moment is generated around the rotation support portion 102. That is, in the process of placing the substrate 100, the substrate gripping means 110 gradually rotates around the rotation support portion 102.
Finally, as shown in FIG. 1B, the weight 113 comes into contact with the second stopper, and the placement of the substrate 100 is completely completed.
In this state, the upper and lower end portions of the substrate 100 are gripped by the first grip portion 111 and the second grip portion 102, respectively.
Here, since the place where the weight 113 is in contact with the first and second stoppers is a place away from the substrate, the structure is such that particles do not easily adhere to the substrate.

  As described above, in the substrate transfer / processing apparatus according to this embodiment, the substrate gripping means is in line contact only with the upper and lower ends of the substrate, and the position of the stopper that determines the substrate gripping position and the opening position is separated from the substrate. Is less likely to be contaminated.

FIG. 2 is a side view of the substrate mounting portion of the substrate transfer / processing apparatus according to the second embodiment of the present invention.
In the figure, reference numeral 201 denotes a vent hole provided in the substrate mounting portion 101, which is located below the substrate gripping means.
The other parts are the same as those in the first embodiment, and thus the description thereof is omitted.
In the substrate transfer / processing apparatus according to the first embodiment, during the substrate gripping operation, the substrate is in contact with the first and second gripping portions, the rotary support portion is in contact with the substrate gripping portion, and the weight is in contact with the stopper. For example, particles are generated. However, compared with the conventional case, the location of the occurrence is far from the substrate, so the possibility that the substrate is contaminated is low, but the downflow from the upper part of the device is rolled back at the substrate mounting part. The generated particles may adhere to the substrate.
Therefore, in the present invention, a vent hole through which the downflow flows is provided under the substrate gripping means of the substrate mounting portion 101 so that the generated particles flow out of the vent hole together with the downflow without being rewound. .

  As described above, since the generated particles are not rewound in the substrate transfer / processing apparatus of this embodiment, the degree of contamination of the substrate is low.

FIG. 3 is a side view of the substrate mounting portion of the substrate transfer / processing apparatus according to the third embodiment of the present invention.
In the first and second embodiments, when the substrate is placed, the weight collides with the stopper vigorously, and there is a possibility that particles are generated at this time. Therefore, in this embodiment, the weight is prevented from colliding with the stopper vigorously.
In the figure, reference numeral 301 denotes a magnetic body provided on the substrate gripping means 110, which is a magnet in this embodiment.
Reference numeral 302 denotes magnetism generating means for applying magnetism to the magnet 301, and in this embodiment, a solenoid. The solenoid is provided in the second stopper 106.
Reference numeral 303 denotes position detection means for detecting the state of the substrate gripping means 110, which is a reflective optical position detection sensor in this embodiment. In this embodiment, the open / close state of the substrate gripping means 110 is detected by detecting the position of the back surface of the substrate. In addition to detecting the position of the back surface of the substrate, the position detecting means may detect the position of the first gripping portion 111, the position of the weight 113, and the like, and as a result, the open / closed state of the substrate gripping means is detected. Any thing can be used as long as it is possible.

The operation will be described below.
First, the substrate position in the substrate gripping state is measured in advance.
Next, when the substrate is placed on the first gripping portion 111 of the substrate gripping means by an apparatus (not shown), the substrate gripping means is brought into a gripping state that overcomes the moment generated by the weight 113 due to its own weight. A rotating moment is generated around the rotation support portion 102. That is, in the process of placing the substrate 100, the substrate gripping means 110 gradually rotates around the rotation support portion 102.
At this time, the position of the substrate is monitored by a reflective optical position detection sensor.
Next, as the substrate gripping means 110 gradually rotates around the rotation support unit 102, the substrate position gradually drops, so that a current is passed through the solenoid 302 according to the position.
When a current is passed through the solenoid 302, a repulsive force is generated in the magnet 301 provided in the substrate gripping means 110 due to the generated magnetism. Then, a moment that hinders the substrate holding means from reaching the holding state is generated around the rotation support portion 102.
When supplying a current according to the substrate position, various control methods are conceivable in which a large current is supplied when the substrate is separated and the current is reduced as the substrate is lowered.
In the case where the solenoid is provided in the first stopper 105, the magnet may be arranged in the direction in which the attractive force is generated or the magnetic body may be made of a silicon steel plate or the like in order to generate the attractive force. That is, it is only necessary to select whether to generate a suction force or a repulsive force depending on the installation location of the solenoid.
Finally, since it is known from the measurement of the substrate position in advance that the substrate has been held, when the substrate position is detected by the reflective optical position detection sensor, the flow of current to the solenoid is stopped. That is, the substrate is held only by its own weight. However, at this time, when more stable gripping is required, it is possible to securely grip the substrate by passing an electric current in a direction that generates an attractive force to the magnet.

  As described above, in this embodiment, a force can be applied in a non-contact manner to the substrate gripping means, so that a soft gripping operation can be performed and generation of particles from the stopper is minimized. Can do. Furthermore, since the gripping operation can be performed reliably, stable gripping is possible regardless of the type of substrate.

FIG. 4 is a diagram showing the shape of the gripping portion of the substrate transport / processing apparatus according to the fourth embodiment of the present invention, and is a view of the substrate gripping means viewed from above.
Since other parts are the same as those in the first to third embodiments, the description thereof is omitted.
In the first to third embodiments, or even the conventional substrate gripping means, there is a possibility that particles are attached to the substrate contact surface of the substrate gripping means. If the substrate is held in this state, particles may adhere to the back surface of the substrate.
Therefore, in this embodiment, the possibility of particle adhesion to the back surface of the substrate is reduced.
In FIG. 4, the 1st holding part 111 has a comb-shaped unevenness | corrugation. In the present embodiment, the concavo-convex portion is one set (that is, a U-shape), but may be plural. Moreover, even if the shape of the convex portion is a square shape, a shape with a rounded tip, or a triangular shape, the contact area between the substrate gripping portion and the substrate may be reduced as a result. Any shape can be used.

The operation will be described below.
First, as in the first embodiment, when the substrate is not placed, the substrate gripping portion 110 is in the state of FIG. 1A, and the substrate is placed on the first gripping portion 111 of the substrate gripping means by an apparatus (not shown). Placed. At this time, the substrate 100 is first placed on the first gripping portion 111 of the substrate gripping portion 110, and the back surface of the substrate 110 and the top surface of the first gripping portion 111 are in contact with each other. That is, the contact area between the upper surface of the first grip 111 and the back surface of the substrate 100 is maximized. Thereafter, when the state of FIG. 1B is reached by the weight of the substrate 110 itself, the contact area is minimized.
In Example 3, in order to reduce the contact area at the moment when the substrate 100 is placed on the substrate gripping means 110, the shape of the first gripping portion of the substrate gripping portion 110 is a U-shape.

  As described above, in this embodiment, when the substrate 100 is gripped, only the convex portion of the first gripping portion 111 is in contact with the back surface of the substrate 100. And the possibility of attaching particles that may be attached to the substrate gripping means to the substrate is reduced. Further, the substrate gripping means can be reduced in weight by adopting this shape.

FIG. 5 is a view showing the shape of the gripping portion of the substrate transfer / processing apparatus according to the fifth embodiment of the present invention, and FIG. 5 (a) is a view of the substrate gripping means from above, and FIG. ) Is a view seen from the center direction of the substrate 100.
Since other parts are the same as those in the first to fourth embodiments, description thereof will be omitted.
In the first to fourth embodiments, or even a conventional substrate gripper, particles may be attached to the substrate contact surface of the first gripper 111 of the substrate gripper 110. If the substrate 100 is held in this state, particles may adhere to the back surface of the substrate.
Therefore, in this embodiment, in order to reduce the possibility of particle adhesion to the back surface of the substrate, the possibility of particle adhesion to the first grip portion 111 which is the substrate contact surface of the substrate gripping means 110 is reduced. .
In FIG.5 (b), the cross-sectional shape of the 1st holding part 111 has a shape of a mountain and valley. In the present embodiment, the shape of three peaks and valleys is configured, but the number of peaks and valleys may be larger or smaller. Further, in this embodiment, a triangular peak-and-valley shape is used, but any shape can be used as long as the contact area between the substrate gripping portion and the substrate is reduced as a result. I do not care.
Since the operation is the same as that of the fourth embodiment, the description thereof is omitted.

  As described above, in this embodiment, when the substrate is gripped, only the portion that becomes the mountain of the substrate gripping means comes into contact with the substrate, so the contact surface itself with the substrate rather than the conventional gripping means. This reduces the possibility of particles adhering to the substrate, and consequently reduces the possibility of particles adhering to the substrate. Further, the substrate gripping means can be reduced in weight by adopting this shape.

  As described above, since the upper and lower ends of the substrate are securely gripped, the substrate can be securely gripped without contaminating the back surface of the substrate. In addition, since the structure is simple without using a complicated actuator, the cost can be kept low and the substrate can be held at a stable position.

  In addition, the said Example 1 thru | or 5 can be implemented not only individually but also combining suitably.

1 is a side view of a substrate transfer / processing apparatus according to a first embodiment of the present invention. Side view of substrate mounting portion of substrate transfer / processing apparatus showing second embodiment of the present invention Side view of substrate mounting portion of substrate transfer / processing apparatus showing third embodiment of the present invention The top view which shows the holding part shape of the board | substrate conveyance and processing apparatus which shows 4th Example of this invention The figure which shows the holding part shape of the board | substrate conveyance and processing apparatus which shows 5th Example of this invention Side view showing a conventional substrate edge gripping mechanism

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Substrate mounting part 102 Rotation support part 110 Board | substrate holding means 111 1st holding part 112 2nd holding part 113 Weight 201 Vent 301 Magnet 302 Solenoid 303 Optical reflection type position detection sensor

Claims (8)

For biasing the substrate mounting portion on which the substrate is placed, the rotation support portion provided in the substrate mounting portion, the first gripping portion and the second gripping portion that contact the substrate, and the substrate gripping means to an open state. A substrate gripping means capable of rotating in the radial direction of the substrate about the rotation support portion, and a stopper provided on the substrate mounting portion, and holding the substrate by its own weight. In the substrate transfer / processing apparatus in which the means rotates around the rotation support portion and grips the substrate,
An apparatus for transporting and processing a substrate, comprising: a stopper for contacting the weight at a position where the substrate gripping means grips the substrate and a position where the substrate is released. 2. The substrate transfer / processing apparatus according to claim 1, further comprising a vent hole under the substrate gripping means of the substrate mounting portion. A magnetic body provided in the gripping means;
Magnetism generating means for generating magnetism provided in the substrate mounting portion;
The substrate transport / processing apparatus according to claim 1, further comprising a position detection unit that detects a gripping position of the substrate gripping unit. 4. The substrate transfer / processing apparatus according to claim 3, wherein the intensity of magnetism generated by the magnetism generating means is changed in accordance with a gripping position detected by the position detecting means. 5. The substrate transfer / processing apparatus according to claim 1, wherein the substrate contact portion of the substrate gripping portion includes comb-like irregularities. 6. The substrate transport / processing apparatus according to claim 1, wherein a substrate contact surface in the substrate contact portion of the substrate gripping portion has a mountain-valley shape. A substrate mounting portion on which a substrate is placed, a rotation support portion provided in the substrate mounting portion, a substrate gripping means that can rotate in the radial direction of the substrate around the rotation support portion, and provided in the substrate mounting portion A substrate transporting and processing apparatus in which the substrate gripping means rotates around the rotation support portion by the weight of the substrate and grips the substrate.
A substrate transfer / processing apparatus comprising a vent hole under the substrate gripping means of the substrate mounting portion. A substrate mounting portion on which a substrate is placed, a rotation support portion provided in the substrate mounting portion, a substrate gripping means that can rotate in the radial direction of the substrate around the rotation support portion, and provided in the substrate mounting portion A substrate transporting and processing apparatus in which the substrate gripping means rotates around the rotation support portion by the weight of the substrate and grips the substrate.
A magnetic body provided in the gripping means;
Magnetism generating means for generating magnetism provided in the substrate mounting portion;
And a position detecting means for detecting a gripping position of the substrate gripping means.

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