JP2007209090A - Electrical junction box - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connection box connecting an internal circuit at the electric connection box side and an electronic circuit assembled in the electric connection box at low cost and with high reliability, and with a reduced space in the electric connection box assembled with the electronic circuit. <P>SOLUTION: In the electric connection box assembled with the electronic circuit, a wiring board formed with a circuit pattern 21 for a large current of ≤200 μm thick is formed in a housing as the internal circuit at the electrical connection box side on the surface of a hard base material 1, and a circuit pattern 22 for a small current of 18 to 70 μm thick is formed on the same board, thus constituting the electronic circuit. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrical connection box having a built-in connection terminal for electrically connecting a connector, a fuse or the like to a wiring circuit, and more particularly to an electrical connection box incorporating an electronic circuit.

When wiring branches of automobiles or the like, an electric junction box is used for the purpose of saving space and cost. The electrical junction box has a structure that can connect and connect parts such as fuses and relays to the wire harness in one place, and the wire harness is connected to the electrical junction box by a connector containing the connection terminals. Connection to the fuse circuit stored in the junction box and branching of the circuit are performed.
The conventional electric junction box has constituted the internal circuit for large currents by laminating | stacking the bus bar which punched the metal plate, and the insulating board which hold | maintains and insulates this bus bar. In an electrical junction box incorporating a printed circuit board constituting an electronic circuit, an electrical connection between the internal circuit on the electrical junction box side (large current side) and the electronic circuit on the printed circuit board side (small current side) is intended. The female terminal built-in connector which incorporates the female terminal is attached to the printed circuit board, and the male terminal of the conductor of the electric connection box is inserted and connected to the connector.
In addition, as an electrical junction box incorporating a printed circuit board that constitutes an electronic circuit, a transition conductor having a pressure contact terminal at the tip is mounted on the printed circuit board, and the conductor on the electrical junction box side is connected to the pressure contact terminal at the tip of the transition conductor. In addition, there has been proposed a method for establishing an electrical connection between the internal circuit on the electrical junction box side and the electronic circuit on the printed circuit board side (see, for example, Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 10-322853 Japanese Patent Laid-Open No. 10-322854

However, in the electrical junction box incorporating the printed circuit board constituting the electronic circuit, in order to achieve electrical connection between the internal circuit (large current) on the electrical junction box side and the electronic circuit (small current) on the printed circuit board side, When the female terminal built-in connector is attached to the printed circuit board, there is a problem that the cost is increased.
Moreover, when the internal circuit and the electronic circuit are electrically connected using a printed circuit board on which a transition conductor having a pressure contact terminal is mounted, the cost can be reduced, but in addition to the space necessary for forming the electronic circuit, the tip There is a problem in that the size of the printed circuit board is increased because a space for providing a transition conductor having a pressure contact terminal is required, and the electrical connection box incorporating the printed circuit board is increased. It was.

  Accordingly, the present invention provides an electrical junction box incorporating an electronic circuit, wherein the electrical circuit and the internal circuit of the electrical junction box can be connected at low cost and with high reliability, and the electrical connection can be performed in a small space. Provide a connection box.

  According to the present invention, in an electrical junction box incorporating an electronic circuit, a wiring board in which a circuit pattern for large current having a thickness of 200 μm or more is formed on the surface of a hard base substrate is provided in the housing as an internal circuit on the electrical junction box side. In addition to mounting, a circuit pattern for small current having a thickness of 18 to 70 μm is formed on the same substrate to constitute an electronic circuit.

  According to the electrical junction box of the present invention, a wiring board in which a circuit pattern for large current having a thickness of 200 μm or more is formed on the surface of a hard base substrate is mounted in the housing as an internal circuit on the electrical junction box side, and A circuit pattern having a thickness of 18 to 70 μm is formed on the same substrate to constitute an electronic circuit, and a circuit portion for large current and a circuit portion for small current having different layer thicknesses are connected at a joint portion to connect an internal circuit and an electronic circuit. Since the circuit is electrically connected, the electronic circuit and the internal circuit on the electrical junction box side can be connected with low cost and high reliability without using a connector or the like, and the connection is made in a small space. Therefore, the electrical junction box can be made small.

  An electrical junction box according to an embodiment of the present invention will be described with reference to FIGS.

According to the electrical junction box of the present invention, the wiring board 10 in which the circuit pattern 21 for large current having a thickness of 200 μm or more is formed on the surface of the hard base substrate 1 is mounted in the housing as an internal circuit on the electrical junction box side. To do.
Further, when an electronic circuit is incorporated into the electrical junction box, the electronic circuit is configured by forming a circuit pattern 22 for small current having a thickness of 18 to 70 μm on the same substrate 10 on which an internal circuit for large current is formed. To do.

In this embodiment, as shown in FIG. 1, when preparing a laminated board in which a conductor layer (copper foil or the like) 2 is laminated on a hard base substrate 1, an internal circuit for large current is previously provided in the conductor layer 2. A conductor portion 2A having a thickness of 200 μm or more for forming a conductor portion and a conductor portion 2B having a thickness of 18 to 70 μm for forming an electronic circuit for small current are formed. The layer thickness processing of the conductor layer 2 may be performed on one side or both sides.
FIG. 1 (a) shows a laminated board in which conductor portions having different layer thicknesses are formed on the surface of a base substrate. FIG. 1B shows a laminate in which conductor portions having different layer thicknesses are formed on both the front and back surfaces of the base substrate.

In order to form conductor portions having different layer thicknesses on the conductor layer 2, for example, a laminate is prepared in which a conductor layer (copper foil or the like) 2 having a thickness of 200 μm or more is laminated on the front or back surface of the hard base substrate 1. Then, only a part of the conductor layer 2 (for example, the right side part) is thinned by performing an etching process, a cutting process, or the like, thereby forming a conductor part 2A having a thickness of 200 μm or more and a conductor part 2B having a thickness of 18 to 70 μm. Form.
Further, for example, a laminated board in which a conductor layer (copper foil or the like) 2 having a thickness of 18 to 70 μm is laminated on the front or back surface of the hard base substrate 1 is prepared, and copper is applied only to a part of the conductor layer (for example, the left part). By thickening by plating, a conductor portion 2A having a thickness of 200 μm or more and a conductor portion 2B having a thickness of 18 to 70 μm are formed.

  Then, by etching the conductor layer 2 having the conductor portion 2A having a thickness of 200 μm or more and the conductor portion 2B having a thickness of 18 to 70 μm, and forming a circuit pattern on each conductor portion, the same pattern is formed on the same substrate. A circuit pattern 21 (internal circuit) for large current having a thickness of 200 μm or more is formed, and a circuit pattern 22 (electronic circuit) for small current having a thickness of 18 to 70 μm is formed.

In the internal circuit on the electrical junction box side, it is necessary to form a circuit having a thickness of 200 μm or more so that it can cope with a large current. Accordingly, the conductor portion 2A having a thickness of 200 μm or more is etched to form a circuit pattern, thereby forming the internal circuit 21.
On the other hand, since the electronic circuit built in the electrical junction box only needs to handle a small current, the circuit thickness does not need to be 200 μm. In a circuit corresponding to a small current, a thickness of 18 to 70 μm is sufficient. In addition, although circuit patterns are stretched in a complicated manner on a circuit board that constitutes an electronic circuit, when a circuit pattern is formed by etching a conductor layer having a thickness of 200 μm or more, due to the relationship of the minimum circuit pattern width by the etching process, There is a problem that the board space (projected area of the circuit board) for forming the electronic circuit becomes large. Accordingly, the conductor portion 2 </ b> B having a thickness of 18 to 70 μm is etched to form a circuit pattern, thereby forming the electronic circuit 22.

  Further, in this embodiment, as shown in FIG. 2, a junction portion 23 is formed in which a large current circuit portion (internal circuit) 21 and a small current circuit portion (electronic circuit) 22 having different layer thicknesses are connected. . That is, in the joint portion 23, an electrical connection between the internal circuit 21 on the electrical junction box side (circuit on the large current side) and the electronic circuit 22 incorporated in the electrical junction box (circuit on the small current side) is achieved. The internal circuit and the electronic circuit are electrically connected without being used.

3A, a large current circuit pattern (internal circuit) 21 having a thickness of 200 μm or more and a small current circuit having a thickness of 18 to 70 μm are formed on the same surface of the hard base substrate 1. A wiring board 10 is formed in which circuit patterns having different patterns (electronic circuits) 22 and circuit patterns having different layer thicknesses are connected to each other at a joint portion 23. As shown in FIG. The electrical connection box is configured by being housed in the housing 30.
In this embodiment, in order to protect the internal circuit 21 and the electronic circuit 22, an insulating coating is provided on the surface of each circuit pattern 21, 22.
As a result, an electric junction box incorporating an electronic circuit can be easily created, and the internal circuit and the electronic circuit can be connected at low cost and with high reliability without using a connector or the like. In addition, there is no problem that the circuit board becomes large in a wiring board in which an electronic circuit having a thickness of 18 to 70 μm is formed on the same substrate on which an internal circuit having a thickness of 200 μm or more is formed. it can.

It is a figure which shows the laminated board in which the conductor part from which layer thickness differs was formed. It is the elements on larger scale which show the electrical connection part (joining part 23) of an internal circuit and an electronic circuit. It is a figure which shows the electrical junction box by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base base material 2 Conductor layer 2A Conductor part of 200 micrometers or more 2B Conductor part of 18-70 micrometers 10 Wiring board 21 Internal circuit 22 Electronic circuit 23 Joint part 30 Housing

Claims (5)

In an electrical junction box incorporating an electronic circuit,
A wiring board in which a circuit pattern for large current having a thickness of 200 μm or more is formed on the surface of the hard base substrate (1) is mounted in the housing as an internal circuit on the electrical connection box side,
An electrical junction box, wherein an electronic circuit is configured by forming a circuit pattern for small current having a thickness of 18 to 70 μm on the same substrate. In the laminated plate in which the conductor layer (2) is laminated on the surface of the hard base substrate (1), the conductor portion (2A) having a thickness of 200 μm and a thickness of 18 to Forming a conductor part (2B) of 70 μm,
Furthermore, by forming circuit patterns on the conductor portions having different layer thicknesses, an internal circuit (21) having a thickness of 200 μm or more and an electronic circuit (22) having a thickness of 18 to 70 μm are formed on the same substrate,
The electrical connection box according to claim 1, wherein the wiring board is mounted in a housing. In the laminated board which laminated the conductor layer (2) on the surface of the hard base substrate (1), by cutting a part of the conductor layer, a conductor part (2A) having a thickness of 200 μm and a thickness of 18 to Forming a conductor part (2B) of 70 μm,
Furthermore, by forming circuit patterns on the conductor portions having different layer thicknesses, an internal circuit (21) having a thickness of 200 μm or more and an electronic circuit (22) having a thickness of 18 to 70 μm are formed on the same substrate. The electrical connection box according to claim 1, wherein the wiring board is mounted in the housing. In the laminated plate in which the conductor layer (2) is laminated on the surface of the hard base substrate (1), by plating a part of the conductor layer, a conductor part (2A) having a thickness of 200 μm and a thickness of 18 to Forming a conductor part (2B) of 70 μm,
Furthermore, by forming circuit patterns on the conductor portions having different layer thicknesses, an internal circuit (21) having a thickness of 200 μm or more and an electronic circuit (22) having a thickness of 18 to 70 μm are formed on the same substrate,
The electrical connection box according to claim 1, wherein the wiring board is mounted in a housing.   The circuit pattern for large current (21) and the circuit pattern for small current (22) having different layer thicknesses are connected at the joint (23), and the internal circuit on the electrical junction box side and the electronic circuit incorporated in the electrical junction box The electrical connection box according to claim 1, wherein the electrical connection box is connected to the electrical connection box.

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