JP2007281364A - Resin sealing and molding method and apparatus for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify the structure of a die 110 for resin sealing and molding an electronic component mounted on a substrate 400, to absorb the variation of the thickness of the substrate 400 when resin sealing and molding the electronic component, and to improve the adhesion of the substrate and a resin sealed and molded body further. <P>SOLUTION: The die 110 for resin sealing and molding the electronic component comprises a first die 111 and a second die 112, and a substrate supply set surface 113 in a plane shape without a level difference is provided on the die joining surface (P.L surface) of both dies. Also, a pot block 140 is arranged so as to be freely joined and separated to/from the side face position 110a of the die 110 matched with the die joining surface of both dies, the die joining surface and the pot block 140 are joined, and a molten resin material inside the pot block 140 is directly injected into a cavity 114. Further, before injecting the molten resin material into the cavity 114, an intra-die space part such as a pot and the cavity is set to a vacuum decompressed state through a vacuum mechanism 500. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for sealing and molding a relatively small electronic component such as a semiconductor chip with a resin material, and a resin sealing molding apparatus for an electronic component used for carrying out this method. In particular, the present invention relates to an improvement in the case of using a resin sealing mold in which a pot block in a resin sealing molding mold of an electronic component is arranged so as to be separable from a side surface position of the mold.

In recent years, a semiconductor package (hereinafter abbreviated as a package) in which a relatively small electronic component such as a semiconductor chip (hereinafter abbreviated as an electronic component) is sealed and formed with a resin material has recently been developed in particular. Is required. Specifically, there is a strong demand for higher integration, higher reliability, and lighter and shorter size such as a so-called large map-type substrate.
For this reason, in the case of molding a semiconductor package, it is necessary to perform resin sealing molding so as to make the outer shape as light and thin as possible while maintaining the quality of a highly integrated resin sealed molded product. It will not be.
In order to maintain the quality of the package which is a resin-sealed molded product at the time of such resin sealing molding, a resin material for sealing the electronic component and a lead frame or a substrate mounted with the electronic component ( Hereinafter, it is important to improve the adhesiveness (or adhesion) with the substrate.

By the way, when an electronic component on a substrate is molded by resin sealing, the substrate is a predetermined part of a cavity portion provided on a mold-matching surface (parting line surface; hereinafter abbreviated as PL surface) of a resin sealing mold. Then, the mold is clamped to close the PL surface, and then the molten resin material is injected and filled into the cavity. Is being sealed.
In addition, the PL surface is provided with a recess for mounting and setting the board (required depth clearance corresponding to the thickness of the board), but the thickness of each part of the board is not uniform. In particular, a large substrate has a noticeable variation in the thickness of each part. In addition, since a large number of such large substrates are fitted and set on the PL surface at the same time, even if mold clamping pressure is applied to each large substrate at the same time, Since the tightening state is not uniform, for example, a part of the resin material may flow out between each large substrate and the PL surface to form a resin burr on the substrate surface and the PL surface. Conversely, when mold clamping pressure is applied to each substrate for the purpose of preventing this resin burr formation, if the mold clamping pressure is excessive, there is a problem that the semiconductor elements and wiring on each substrate are damaged. To do.
Therefore, the variation in the thickness of the substrate is a factor that significantly deteriorates the quality of the molded product.
Furthermore, since the cavity part and the passage for transferring the molten resin material, etc. provided on the PL surface are configured as an in-mold space part, the gas generated during heating and melting of the air, moisture and resin material remaining in the in-mold space part As a result, the resin is mixed in the molten resin material, and as a result, this is formed as a void (bubble) in the package, and further causes a problem of weakening the adhesion between the substrate and the package. For this reason, prior to the injection of the molten resin material into the cavity, evacuation (decompression) of the space in the mold can positively exclude the air remaining in the space in the mold to the outside. (For example, refer to Patent Document 1).
Also, the main purpose of improving the effective utilization rate of resin materials used for resin sealing molding of electronic components is to provide a molten resin injection cylinder (pot for resin material supply) on the PL surface of the resin sealing molding die. Is known that is configured to be bonded and separated with respect to the side surface position of the mold that coincides with (see, for example, Patent Document 2).
JP 05-008250 A JP 59-052842 A

Prior to injection of the molten resin material into the cavity described above (Patent Document 1), the air remaining in the mold space is positively removed to the outside. As a result, it is possible to prevent the formation of voids in the package due to the presence of the residual air and the like, and to expect an effect such as not lowering the adhesion between the substrate and the package. .
Further, in the case where the molten resin injection cylinder (pot) is configured to be bonded and separated with respect to the side surface position of the mold that coincides with the PL surface of the resin sealing molding mold (Patent Document 2), By shortening the resin passage for transferring the resin material, the effective utilization rate of the resin material can be improved.
However, in the mold structure as shown in both, the resin sealing molding of these electronic components is performed with a large number of substrates supplied and set on the PL surface. Because the mold clamping pressure for each substrate cannot be equalized due to the difference in thickness, the resin burr is formed on each substrate surface and PL surface, or each substrate The harmful effect of damaging the upper semiconductor element and wiring cannot be reliably prevented.
In both cases, not only is the adjustment or setting of the mold clamping pressure applied to a large number of substrates supplied and set on the PL surface, but the area to which the mold clamping pressure is applied corresponds to a large number of substrate supply parts. Therefore, there is a problem that the mold clamping pressure increases and the overall shape of the apparatus increases.

  Therefore, the present invention simplifies the mold structure or the entire structure of the apparatus, and efficiently prevents the formation of resin burrs on each substrate surface and the PL surface during resin sealing molding of electronic components. Resin-sealed molding of electronic components that can reliably prevent the harmful effects of damaging semiconductor elements and wiring on each substrate, and can also reliably prevent the formation of voids in the molded package It is an object to provide a method and apparatus thereof.

  According to the resin sealing molding method of the electronic component of the present invention, the shape of the supply set surface of the substrate in the mold that can be freely opened and closed is formed in a planar shape without the step for positioning the substrate, and the predetermined supply surface of the supply set surface is formed. Supplying and setting the substrate before resin sealing molding with electronic parts mounted at the position, and the mold surface when closing the mold surface (PL surface) and closing the mold A mold clamping process in which an electronic component on a substrate before resin sealing and a required peripheral portion thereof are fitted in a molding cavity provided therebetween, and a necessary mold clamping pressure is applied to the substrate surface in this state. And after the mold-clamping process, the molten resin material is filled in the cavity, and the electronic component fitted in the cavity and the required peripheral portion thereof are sealed with the resin material, and the resin-sealed molded body (package) Resin for close integration with the substrate A resin sealing molding method for an electronic component comprising: a sealing molding step; and a resin sealing molded substrate removal step of opening a mold and taking out the substrate after resin sealing molding after the resin sealing molding step, By placing the pot block for injecting the molten resin material at the time of the resin sealing molding process so as to be joined and separable to the side surface position of the mold that coincides with the mold fitting surface (PL surface) at the time of the mold clamping process, At the time of the process, it is set so that the molten resin material is directly injected into the cavity from the side surface position of the mold, and at the time of the above-mentioned at least the resin sealing molding process, A depressurization step is performed in which a configured mold space is set to a vacuum depressurized state.

  Moreover, the resin sealing molding method of the electronic component of the present invention is set so that the step of supplying the substrate before resin sealing supplies a single substrate before resin sealing molding between the mold surfaces. It is characterized by.

  Further, the resin sealing molding method of the electronic component according to the present invention is such that the supply step of the substrate before resin sealing is set so that the end surface of the substrate before resin sealing matches the side surface position of the mold. Features.

  In addition, the resin sealing molding method of the electronic component of the present invention can be added to the mold structural unit by laminating and arranging the mold structural units supplied with a single substrate before resin sealing molding as a plurality of units between the mold surfaces. The mold clamping pressure is set so as to be simultaneously applied to the mold structural units arranged in layers.

  The electronic component resin sealing molding apparatus according to the present invention is configured to fit the electronic component mounted on the substrate into the molding cavity provided in the resin sealing molding die of the electronic component, and to form the mold surface. The mold is closed and a mold clamping pressure is applied to the substrate surface, and the molten resin material is filled in the cavity in the mold clamped state, so that the electronic component fitted in the cavity is sealed with the resin material. A resin sealing molding apparatus for electronic parts to be stopped, wherein the shape of the substrate supply set surface in the mold is formed in a planar shape by eliminating the step for positioning the substrate, and matches the mold matching surface of the mold A pot block for injecting molten resin material is disposed so as to be separable from the side surface of the mold, and the molten tree in the pot block is joined by joining the mold matching surface (PL surface) and the pot block. It is configured so that the grease material can be directly injected into the cavity, and is further provided with a pressure reducing mechanism that sets the space in the mold including the cavity formed on the die mating surface to a vacuum reduced pressure state. It is characterized by being.

  Moreover, the resin sealing molding apparatus for electronic parts according to the present invention is characterized in that a single substrate supply unit is provided on the mold-matching surface.

  Also, the resin sealing molding apparatus for electronic parts according to the present invention, when supplying the substrate before resin sealing for fitting the electronic component mounted on the substrate in the cavity, the end face of the substrate before resin sealing and the mold A supply mechanism for the substrate before resin sealing that matches the side surface position is provided.

  The electronic component resin sealing molding apparatus of the present invention is added to a mold structure unit at the time of mold clamping by laminating and arranging the mold structure unit supplied with a single substrate between the mold surfaces as a plurality of units. The present invention is characterized in that the mold clamping pressure is applied simultaneously to the mold structural units arranged in a stacked manner.

By adopting the resin sealing molding method and apparatus for electronic parts according to the present invention, it is not necessary to use a resin sealing molding apparatus for electronic parts having a mold having a complicated structure as in the prior art. Or workability | operativity can be improved and the practical use becomes easy.
Further, according to the present invention, it is possible to efficiently and reliably prevent the formation of resin burrs on the substrate surface without being affected by variations in the thickness of the substrate. Furthermore, since it is possible to efficiently and reliably prevent the formation of voids in the molded package, it is possible to mold a resin-sealed molded product of an electronic component having high quality and high reliability. it can.
Further, according to the present invention, the mold clamping pressure can be uniformly applied to the substrate surface by forming the PL surface other than the cavity for resin molding as a planar shape.
Furthermore, since the resin sealing molding apparatus of the present invention can adopt a simple structure, the overall shape of the apparatus can be reduced, and maintenance work of the mold and the apparatus can be easily performed. Furthermore, it is possible to contribute to resource saving by suppressing the generation of the amount of waste resin.

According to a first aspect of the present invention, there is provided a resin sealing molding method for an electronic component in which a shape of a substrate supply set surface in a mold that can be freely opened and closed is formed in a planar shape without a step for positioning the substrate. When supplying the substrate before resin sealing molding in which electronic components are mounted at predetermined positions on the supply set surface and supplying the substrate before resin sealing molding, and when performing mold clamping by closing the mold surface The electronic component on the substrate before resin sealing and the required peripheral portion thereof are fitted in the molding cavity provided between the mold surfaces, and the required mold by the mold is mounted on the substrate surface in this state. A mold clamping step for applying a clamping pressure, and after the mold clamping step, the molten resin material is filled into the cavity, and the electronic component fitted in the cavity and its required peripheral portion are sealed with the resin material, and And its resin-sealed molded body and the front A resin sealing molding step for tightly integrating the substrate; and a resin sealing substrate removal step of opening the mold and taking out the substrate after the resin sealing molding after the resin sealing molding step. . And, by arranging the pot block for injecting the molten resin material at the time of the resin sealing molding step so as to be bonded and separable with respect to the side surface position of the die that coincides with the mold fitting surface at the time of the mold clamping step, The mold is set so as to directly inject the molten resin material into the cavity from the side surface position of the mold during the mold clamping process, and further includes the cavity including the cavity at least during the resin sealing molding process. Is set so as to perform a pressure reducing step for setting the space in the mold formed on the mold matching surface to a vacuum reduced pressure state.
According to a fifth aspect of the present invention, there is provided a resin seal molding apparatus for an electronic component, wherein the electronic component mounted on the substrate is fitted into a molding cavity provided in a resin seal molding die of the electronic component. Then, the mold surface is closed, a mold clamping pressure by the mold is applied to the substrate surface, and the molten resin material is filled in the cavity in the mold clamping state, so that the electron fitted in the cavity A resin sealing molding apparatus for electronic components that seals a component with a resin material, wherein the shape of the substrate supply set surface in the mold is formed in a planar shape without the step for positioning the substrate. Further, a pot block for injecting a molten resin material is disposed so as to be separable from the side surface position of the mold that coincides with the mold mating surface of the mold, and the mold mating surface and the pot block are joined. In the mold space, the molten resin material in the pot block can be directly injected into the cavity, and the mold interior space is formed on the mold-matching surface of the mold including the cavity. A decompression mechanism is provided for setting the part in a vacuum decompression state. Therefore, each means which can perform the resin sealing molding method of the electronic component which concerns on this invention of Claim 1 is provided.
According to each of the present inventions described above, since there is no step for positioning the substrate as in the prior art on the mold mating surface, the relationship between the thickness of the substrate and the recess for the fitting set is considered. In addition, it is possible to apply a mold clamping pressure evenly to each portion of the substrate supplied to the mold-matching surface. Furthermore, this mold clamping pressure is equal to each part of each substrate even when, for example, the same type of substrate having variations in thickness or other substrates having different thicknesses are subjected to resin sealing molding. Will be added to.
Therefore, not only can the thickness variation in the same type of substrate be handled appropriately and simply, but also when the resin-sealed molded product is changed and the resin-sealed molding of different types of substrates is performed, Since it can respond to this appropriately and simply, a resin-sealed molded product of an electronic component having high quality and high reliability can be molded.

In the resin sealing molding method for an electronic component according to the second aspect of the present invention, the step of supplying the substrate before resin sealing supplies a single substrate before resin sealing molding between the mold surfaces. It is set to be.
According to a sixth aspect of the present invention, there is provided a resin sealing molding apparatus for an electronic component, wherein a single substrate supply unit is provided on the die mating surface of the mold. Therefore, each means which can perform the resin sealing molding method of the electronic component which concerns on this invention of Claim 2 is provided.
According to each of the present inventions as described above, the mold and the resin sealing molding apparatus using the mold are compared with the conventional one in which a plurality of substrates before resin sealing molding are simultaneously supplied and set between the same mold surfaces as described above. The overall shape can be reduced in size.
Further, when a plurality of substrates are supplied and set at the same time between the same mold surfaces as described above, each substrate has a different thickness variation as described above. When a mold clamping pressure is applied to each substrate to prevent resin burrs from forming on the substrate surface, if the mold clamping pressure is excessive, there is a problem that the semiconductor elements and wiring on each substrate are damaged. On the contrary, when the mold clamping pressure is insufficient, there is a problem that the formation of resin burrs on each substrate cannot be prevented uniformly and reliably.
However, by supplying a single pre-resin-molded substrate between the mold surfaces, even if there is a variation in the thickness of the substrate, the thickness of the substrate is larger than when supplying a plurality of substrates as described above. Since the influence due to the variation can be minimized, it is possible to easily select and set the clamping pressure for the substrate before the resin sealing molding.

In the resin sealing molding method for an electronic component according to the third aspect of the present invention, the supplying step of the substrate before resin sealing matches the end surface of the substrate before resin sealing with the side surface position of the mold. Is set to
According to a seventh aspect of the present invention, there is provided a resin sealing molding apparatus for an electronic component, wherein the resin sealing is performed at the time of supplying a pre-resin sealing substrate in which the electronic component mounted on the substrate is fitted into the molding cavity. A supply mechanism for the pre-resin-sealing substrate that matches the end surface of the pre-stop substrate with the side surface position of the mold is provided. Therefore, each means which can perform the resin sealing molding method of the electronic component which concerns on this invention of Claim 3 is provided.
According to each of the present inventions described above, since no gap is generated between the end surface of the substrate before resin sealing and the side surface position of the mold, the gap is filled in the resin sealing molding step. It is possible to prevent the adverse effect that the molten resin material remains and is cured and molded. Further, it is possible to efficiently and surely prevent such an adverse effect that a part of the molten resin material filled in the gap enters the bottom surface side of the substrate to form a resin burr on the substrate surface.

According to a fourth aspect of the present invention, there is provided a resin sealing molding method for an electronic component comprising: stacking and arranging a plurality of mold structural units each provided with a single pre-sealing molding substrate between the mold surfaces. The mold clamping pressure applied to the mold structural units is set to be simultaneously applied to the mold structural units arranged in a stacked manner.
Further, in the electronic component resin sealing molding apparatus according to claim 8, by laminating and arranging the mold structural units to which a single substrate is supplied between the mold surfaces as a plurality of units, The mold clamping pressure applied to the mold structural unit is configured to be simultaneously applied to the mold structural units arranged in a stacked manner. Therefore, each means which can perform the resin sealing molding method of the electronic component which concerns on this invention of Claim 4 is provided.
According to each of the present inventions as described above, the device shape in the stacking arrangement direction increases corresponding to the size of the plurality of mold structural units stacked and arranged, but the plurality of substrates are arranged in a stacked state. The mold clamping pressure at this time is substantially the same as the pressure required for a single sheet clamping pressure.
Therefore, the mold area expands corresponding to the number of supply sets of substrates, like a conventional mold structure that is set to supply and set a plurality of substrates before resin sealing molding between the same mold surfaces. There is no need to increase the size of the corresponding mold and device and to set a high mold clamping pressure. In addition, since it is not necessary to set the mold clamping pressure sequentially higher in response to the increasing number of mold structure units, the overall shape of the mold and the apparatus can be reduced as compared with the conventional mold structure. . Furthermore, since the electronic components on each substrate can be simultaneously resin-sealed and molded under the same molding conditions, products with high quality and high reliability can be produced efficiently and efficiently.

Embodiments of the present invention will be described below with reference to the drawings.
In addition, FIG. 1 has shown the principal part of the resin sealing molding apparatus for enforcing the resin sealing molding method of the electronic component which concerns on this invention.
FIG. 2 schematically shows the main part of the resin sealing molding portion in the resin sealing molding apparatus, and the resin sealing is performed at a predetermined position on the mold mating surface (PL surface) of each mold that is opened. It is explanatory drawing in the case of supplying a resin material in a pot while supplying and setting the board | substrate before shaping | molding.
FIG. 3 schematically shows the arrangement relationship of the sealing members provided on the mold mating surface and the pot block.
FIG. 4 shows a supply set state of the substrate before resin sealing molding on the mold mating surface of the mold and a resin material supply state in the pot.
Further, FIG. 5 shows a state in which each mold is clamped, a state in which a seal member disposed at the front end of the pot block is joined to a side surface position of each mold, a space between mold surfaces of each mold, and each mold and pot block. Shows the state in which residual air or the like in the mold interior space formed between the molds is forcibly discharged to the outside of the molds. At this time, between the mold surfaces of each mold and each mold and the front end of the pot block This is a preliminary mold clamping state in which the part is not completely closed, and the inside and outside of the mold space are blocked from each other by a seal member.
FIG. 6 shows a complete mold clamping state in which the mold surfaces of the molds and the molds and the pot block front end are completely closed. At this time, predetermined mold clamping pressure is applied to both the front and back surfaces of the pre-resin-molded substrate that is set to be supplied between the mold surfaces of each mold, and the inner space portion has a sealing member. Thus, the inside / outside ventilation state is more reliably blocked.
FIG. 7 shows a state where the resin material in the pot is transferred under pressure. In addition, since the resin material in the pot is heated and melted by each mold, the heat-melted resin material is injected and filled into the cavity of each mold.
FIG. 8 shows a state where the pot block is retracted after the resin sealing molding.
FIG. 9 shows the mold open state of each mold.
Moreover, FIG. 10 has shown the taking-out state of the board | substrate after resin sealing molding.
Moreover, FIG. 11 has shown the other example of a shape and structure of the sealing member arrange | positioned at the front-end part of a pot block.

FIG. 1 schematically shows the entire configuration of a resin sealing molding apparatus, and FIG. 2 shows an enlarged main part of a resin sealing molding part in this resin sealing molding apparatus. 3 shows an enlarged view of the main part of the mold mating surface and the pot block. The configuration of this resin sealing molding apparatus will be described below with reference to the drawings.
This resin sealing molding apparatus transports a resin sealing molding part 100 for resin sealing molding of electronic components on a substrate to a predetermined position to be described later of the resin sealing molding part. A substrate supply / extraction mechanism 200 for supplying and taking out a resin-sealed molded substrate from the resin-sealed molded portion, and for transporting and supplying a resin material to a predetermined position to be described later of the resin-sealed molded portion The resin material transport and supply mechanism 300 is included.

  In addition, the resin sealing molding unit 100 described above includes a mold 110 for resin sealing molding of electronic components, a mold opening / closing mechanism 120 for mold opening and clamping of the mold, and the mold 110 being clamped. A pressing mechanism 130 for applying a required mold clamping pressure to the mold in a state, a pot block 140 for supplying a resin material disposed on the side of the mold 110, and the pot block 140 as a mold mating surface of the mold 110 And a pot block reciprocating drive mechanism 150 disposed so as to be separable from the side surface position 110a of the mold that coincides with the (PL surface).

The mold 110 includes at least one set of mold structural units. In the example shown in the drawing, two sets of mold structural units composed of one mold 111 and two molds 112 are vertically moved. The case where it is configured by stacking is shown.
Further, a supply set surface 113 of the substrate 400 is provided on the mold surface of the one mold 111, that is, the mold matching surface (PL surface). The supply set surface 113 serves as a single substrate supply unit for supplying and setting a single substrate 400 on which an electronic component (not shown) is mounted. That is, only one substrate 400 is supplied and set on the supply set surface 113 of the substrate 400 in the set of mold structural units. Further, the supply set surface 113 of the substrate 400 is not provided with a step for positioning the substrate, which is provided as a shape such as a recess in the conventional mold surface. Accordingly, the supply set surface 113 of the substrate is formed in a planar shape. A cavity 114 for resin molding is provided on the mold surface of the second mold 112 disposed opposite to the supply set surface 113 of the one mold 111. The cavity 114 and the side surface position 110a of the mold communicate with each other via a molten resin material transfer passage 115.

Further, the substrate positioning pins 116 having a required shape and number are erected at predetermined positions on the mold surface (substrate supply set surface 113) of the one mold 111, and the positions and numbers of the pins 116 correspond to the positions and numbers. By providing a pin hole (not shown) for inserting the pin at each position of the second mold 112, the substrate 400 is guided to a predetermined position on the supply set surface 113, and the supply set is surely set at that position. May be provided.
The above-mentioned predetermined position refers to a position where the substrate end portion 400a and the side surface position 110a of the mold are completely matched. In this case, there is no gap between the end surface of the substrate before resin sealing and the side surface position of the mold, so that part of the molten resin material enters the bottom surface side of the substrate during the resin sealing molding process. Defects such as formation of resin burrs on the surface can be prevented efficiently and reliably.

Further, the mold combining surface of the second mold 112 is provided with required heat resistance and elasticity arranged so as to cover the periphery of the substrate 400 supplied to the substrate supply set surface 113 of the one mold 111. A long seal member 501 is provided.
The seal member 501 protrudes toward the substrate supply set surface 113 side of the one mold 111 so as to be longer than the thickness of the substrate 400. Further, both end surfaces of the seal member 501 are respectively arranged at positions that coincide with the side surface position 110a of the mold described above, and are not provided at the side surface position 110a of the mold. Accordingly, the seal member 501 is provided so as to cover other positions on the side of the substrate 400 excluding the side surface position 110a side of the mold (positions on the three surfaces excluding the substrate end portion 400a side in the illustrated example) (FIG. 3). reference).

A rectangular seal member 502 for joining to the side surface position 110a of the mold is disposed at the front end of the pot block 140 on the side surface position 110a side of the mold.
The seal member 502 has required heat resistance and elasticity, like the seal member 501 provided at the side surface position 110a of the mold. When the pot block 140 is moved forward and joined to the side surface position 110a of the mold, the pot block 140 is joined to both end faces of the seal member 501 provided at the side surface position 110a of the mold. The mold 111 and the second mold 112 are provided so as to be joined to the outer periphery of the mold combining surface. Therefore, when the first mold 111 and the second mold 112 are aligned (when the mold is clamped) and when the pot block 140 and the side surface position 110a of the mold are joined, the mold alignment surfaces of both molds and the side surfaces of both molds are used. Since the space formed between the position 110a and the front position of the pot block is covered with the seal members (501 and 502), the space is set in a state of being blocked from the outside ( (See FIG. 5).
The space covered by the sealing member 501 and the outside are connected to the vacuum source (not shown) side through the intake passage 503, and further, the space covered by the sealing member 502 The outside is connected to a vacuum source (not shown) through an intake passage 504. For this reason, when this vacuum source is operated, residual air in both space portions that are blocked from the outside by both seal members (501, 502) are forced to the outside through both intake paths (503, 504). Suction will be eliminated.
Therefore, both the sealing members (501, 502), the two intake passages (503, 504), and the vacuum source constitute a vacuum (decompression) mechanism 500.

The mold opening / closing mechanism 120 described above is a mechanism for simultaneously opening or closing the two sets of mold structural units (molds 110) that are stacked (overlapped) in the vertical direction. Shows a case in which one side of the first mold 111 or the second mold 112 is moved in the vertical direction by an appropriate drive mechanism such as hydraulic pressure, pneumatic pressure, or electric power.
Instead of this, the mold opening / closing mechanism 120 may employ a so-called rack and pinion mechanism, or an appropriate mold opening / closing mechanism using a crank mechanism or the like.

The press mechanism 130 is a mechanism for applying a required mold clamping pressure to the mold 110 in a state in which the mold 110 is clamped. Appropriate pressing means are provided.
Note that, for example, the mold opening / closing mechanism 120 and the press mechanism 130 may be configured as the same drive source, and the both functions of the mold opening / closing mechanism 120 and the press mechanism 130 are provided by combining both functions ( 120/130) may also be used.

Further, the pot block 140 is disposed on the side of the mold 110, and with respect to the side surface position 110a of the mold that matches the mold alignment surface (PL surface) of the mold 110 by the reciprocating drive mechanism 150. It is provided so as to be freely separable.
The pot block 140 has a resin material supply pot 141 arranged corresponding to the number of upper and lower two sets of mold structural units (type 110) and their arrangement positions, and is supplied into the pot 141. The resin material pressurizing plunger 142, an appropriate reciprocating drive mechanism (not shown) for reciprocating the plunger 142, and an appropriate heater for heating and melting the resin material 301 supplied into the pot 141 (Not shown) is fitted.
Therefore, according to this configuration, the pot block reciprocating drive mechanism 150 can advance the entire pot block 140 so as to be joined to a position matching the die mating surface of the mold 110. Can be retracted to separate from Further, by retracting the plunger 142 by the reciprocating drive mechanism of the plunger, a space for supplying the resin material 301 can be provided in the opening front end portion of the pot 141 (see FIG. 2) and from this position. The resin material 301 supplied to the pot 141 can be pressurized by moving the plunger 142 forward.
Further, the mold combining surface (PL surface) of the one mold 111 and the second mold 112 in the mold structural unit and the pot 141 in the pot block 140 are joined and communicated (see FIG. 5), and the heater The molten resin material 301 in the pot 141 is heated and melted and pressurized by the plunger 142 to inject the molten resin material in the pot 141 directly into the cavity 114 through the transfer passage 115 described above. Can be filled.

Further, the substrate supply / extraction mechanism 200 described above is configured such that the substrate 400 before resin sealing molding is resin-sealed through a substrate supply / extraction member 201 provided with a locking chuck or other appropriate locking mechanism (not shown). The mold 400 is carried into a predetermined position, that is, between the one mold 111 and the two molds 112 in the two upper and lower mold structure units opened, and the substrate 400 is transferred to the one mold 111 described above. It is provided so that it can be set on the substrate supply set surface 113. Further, the substrate supply / withdrawing mechanism 200 becomes a resin-molded substrate 402 (resin-sealed molded product) from the substrate-supplying set surface 113 opened after the resin-sealing molding via the locking mechanism. 10 (see FIG. 10), and the substrate 402 is unloaded from each of the first mold 111 and the second mold 112 in the two upper and lower mold structural units to the next process side. It is provided so that it can be transported.
Therefore, according to this configuration, it is possible to supply and set the substrate 400 before resin sealing molding to a predetermined position of the resin sealing molding portion 100, and to set the substrate 402 after resin sealing molding to the resin sealing molding portion. 100 can be taken out.

Further, the resin material transport / supply mechanism 300 described above places the resin material 301 at a predetermined position of the resin sealing molded portion 100, that is, the pot block 140 and the plunger 142 through the resin material transport / supply member 302 at the required positions. (See FIG. 1), the pot 141 is provided so that it can be supplied into the space provided at the front end of the opening.
The resin material transport and supply member 302 has a resin material charging hole disposed in correspondence with the number of the two upper and lower mold structural units (the mold 110) and the position of the unit. An extruding member or the like for extruding the resin material 301 put into the section and supplying it into the pot 141 is provided.
Therefore, according to such a configuration, the pot block 140 can be retracted to a required position, and the resin material 301 can be supplied to each of the pots 141 in the pot block 140.

The resin sealing molding of the electronic component in the embodiment is performed as follows, for example.
First, in the mold open state of two sets of upper and lower mold structural units (molds 110) shown in FIGS. 1 and 2, the substrate 400 before resin sealing molding is connected to one mold 111 and the mold via the substrate supply / extraction mechanism 200. The substrate 400 is carried into each of the two molds 112, and the substrate 400 is supplied and set on the substrate supply set surface 113 of the one mold 111. Next or in parallel, the pot block reciprocating drive mechanism 150 retracts the entire pot block 140 from the side surface position 110a of the mold 110, and the plunger reciprocating drive mechanism retracts the plunger 142 to retract the pot 141. A space for supplying the resin material 301 is formed in the front end portion of the opening, and the resin material 301 is supplied into the space through the resin material transport / supply member 302 (see FIG. 2).
Next, the mold closing of the two upper and lower mold structure units (the mold 110) is started by the mold opening / closing mechanism 120 described above. Next or in parallel, the pot block reciprocating drive mechanism 150 advances the entire pot block 140 to the side surface position 110a of the mold and joins the seal member 502 at the front end thereof to the side surface position 110a of the mold. (See FIGS. 4 and 5).

  Further, in parallel with the mold clamping action of the mold structural unit (110) and the forward and joining action of the pot block 140 with respect to the side surface position 110a of the mold, by performing the vacuum / decompression action by the vacuum mechanism 500 described above, Residual air or the like in the space that is blocked from the outside by both the sealing members (501, 502) is forcibly removed to the outside through the both intake paths (503, 504). Further, this vacuum / decompression action is performed at the time of the next complete mold clamping and resin sealing molding (FIGS. 6 and 7), which are performed continuously after the intermediate (or preliminary) mold clamping action as shown in FIG. It is preferable that the process is continuously performed.

  As described above, the vacuum mechanism 500 forcibly removes residual air or the like in the space through the both intake paths (503 and 504). Accordingly, at this time, air remaining in the pot 141 on the front surface of the pot block constituting a part of the space portion (for example, not only air / moisture in the atmosphere but also gas generated during heating and melting of the resin material) Etc.) can be forcibly removed to the outside.

As shown in FIG. 6, when complete clamping of the two upper and lower sets of mold structural units (mold 110) is performed, the pressing means in the press mechanism 130 is applied to each mold structural unit (mold 110). A pressing force is applied, and a uniform clamping pressure is simultaneously applied to each of the mold structural units arranged in layers.
When the pot block 140 is completely joined to the side surface position 110a of the mold, the mating surfaces of the one mold 111 and the second mold 112 in each mold structural unit and the pot 141 in the pot block are joined. The resin material 301 supplied into the pot 141 is heated and melted by the heater. Accordingly, the plunger 142 is advanced to pressurize the resin material 301 in the pot 141, so that the molten resin material is directly injected and filled into the cavity 114 through the transfer passage 115. Thus, the electronic component on the substrate 400 fitted in the cavity 114 can be resin-sealed (see FIG. 7).

Next, after the required cure time has elapsed, the pot block 140 is moved backward in the direction away from the side surface position 110a of the mold 110 by the reciprocating drive mechanism 150 of the pot block (see FIG. 8).
Next, or in parallel with this, the mold clamping pressure by the pressing means of the press mechanism 130 with respect to the two upper and lower sets of mold structural units (the mold 110) is released, and the upper and lower two are connected via the mold opening / closing mechanism 120. The mold structure unit of the set is opened (see FIGS. 8 and 9).
Next, the substrate 402 after the resin sealing molding (resin sealing molded product) is locked and taken out from the substrate supply set surface 113 which has been opened through the locking mechanism of the substrate supply and extraction mechanism 200 described above. At the same time, the substrate 402 is unloaded and transferred to the next process side (see FIG. 10).

FIG. 11 shows another shape example and configuration example of the sealing member 502 disposed at the front end portion of the pot block.
That is, the seal member 502 shown in FIG. 2 is provided in such a shape that it can be simultaneously bonded to all of the seal members 501 disposed at the side surface position 110a of the mold. The seal member 502a is different in that the seal member 502a is provided in such a shape as to be individually joined to each of the seal members 501 disposed at the side surface position 110a of the mold.
Obviously, even with such a shape, the same effects as the sealing member 502 described above can be obtained.

As described above, the present invention can simplify the mold structure or the entire structure of the apparatus, and can efficiently form resin burrs on each substrate surface and PL surface during resin sealing molding of electronic components. In addition to being able to prevent bad effects such as damaging semiconductor elements and wiring on each substrate, it is also possible to ensure that voids are formed in the molded package. Can be prevented.
Therefore, according to the present invention, the operability or workability of the resin sealing molding apparatus can be improved, and the resin burr can be efficiently formed on the substrate surface without being affected by variations in the thickness of the substrate. And since it can prevent reliably, the resin-sealed molded product of the electronic component provided with high quality and high reliability can be shape | molded. Furthermore, since a simple structure can be adopted for the resin sealing molding apparatus, the overall shape of the apparatus can be reduced, and maintenance work for the mold and the apparatus can be easily performed. Thus, the present invention has an excellent practical effect that it can contribute to resource saving by suppressing generation of waste resin amount.

  INDUSTRIAL APPLICABILITY The resin sealing molding method and apparatus for electronic components according to the present invention are useful when resin sealing molding of electronic components on a substrate used in a semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially cut longitudinal front view showing a main part of a resin sealing molding apparatus for carrying out a resin sealing molding method for an electronic component according to the present invention. FIG. 2 is a partially cut longitudinal front view schematically showing a main part of a resin sealing molding portion in the resin sealing molding apparatus of FIG. 1, at a predetermined position on a die mating surface (PL surface) of each mold opened. It is explanatory drawing in the case of supplying and setting the substrate before resin sealing molding, and supplying a resin material in a pot. FIG. 3 is a resin sealing molding portion corresponding to FIG. 2, and is a partially cutaway plan view taken along the line AA in FIG. 2, and schematically shows the arrangement relationship of the seal members provided on the mold matching surface and the pot block. Is shown. FIG. 3 is a partially cut longitudinal front view of a resin sealing molding portion corresponding to FIG. 2, showing a supply set state of a substrate before resin sealing molding to a mold matching surface and a resin material supply state into a pot. FIG. 3 is a partially cut longitudinal front view of a resin sealing molding portion corresponding to FIG. 2, a state in which each mold is clamped and a seal member disposed at the front end of the pot block is joined to a side surface position of each mold And the state which is forcibly exhausting the residual air etc. in the space in the mold constituted between the mold surfaces of each mold and between each mold and the pot block to the outside of the mold is shown. FIG. 6 is a partially cut longitudinal front view of a resin sealing molding corresponding to FIG. 5, showing a complete mold clamping state in which the mold surfaces of each mold and the molds and the pot block front end are completely closed. ing. FIG. 7 is a partially cut longitudinal front view of a resin sealing molding portion corresponding to FIG. 6, showing a state in which a resin material in a pot is pressurized and transferred. FIG. 8 is a partially cut longitudinal front view of the resin sealing molding portion corresponding to FIG. 7, showing a state where the pot block is retracted after the resin sealing molding. FIG. 9 is a partially cut longitudinal front view of a resin sealing molding portion corresponding to FIG. 8, showing the mold open state of each mold. FIG. 10 is a partially cut longitudinal front view of a resin sealing molding portion corresponding to FIG. 9, showing a state where a substrate after resin sealing molding is taken out. It is a partially cut longitudinal front view of a resin sealing molding part, and shows another shape example and configuration example of a seal member disposed at the front end part of the pot block.

Explanation of symbols

100 Resin sealing molding part
110 type
Side position of 110a type
111 One mold
112 Second mold
113 Substrate supply set surface
114 cavity
115 Passage for transferring molten resin material
116 Locating pin
120 type opening and closing mechanism
130 Press mechanism
140 pot block
141 pots
142 Plunger
150 Reciprocating drive mechanism
200 Substrate supply / extraction mechanism
201 Substrate supply / extraction member
300 Resin material transport and supply mechanism
301 Resin material
302 Resin material transport and supply member
400 Substrate before resin encapsulation
400a board edge
402 Substrate after resin sealing molding (resin sealing molding product)
500 Vacuum (decompression) mechanism
501 Seal material
502 Seal member
502a Seal member
503 Intake route
504 Intake route
PL Parting line (Molding surface)

Claims (8)

The shape of the substrate supply set surface in the mold that can be freely opened and closed is formed into a flat shape without the step for positioning the substrate, and before the resin sealing molding in which the electronic component is mounted at a predetermined position of the supply set surface. Supplying the substrate before setting the substrate before resin sealing,
When the mold surfaces are closed and the molds are clamped, the electronic parts on the substrate before resin sealing and the required peripheral portions thereof are fitted in the molding cavity provided between the mold surfaces, and this state And a mold clamping step of applying a required mold clamping pressure by the mold to the substrate surface,
After the mold clamping step, the cavity is filled with a molten resin material, and the electronic component fitted in the cavity and its required peripheral portion are sealed with a resin material, and the resin-sealed molded body and the A resin sealing molding process for tightly integrating the substrate;
After the resin sealing molding step, a resin sealing molding method for an electronic component including the step of opening the mold and taking out the substrate after the resin sealing molding and removing the resin sealed substrate,
By disposing the pot block for injecting the molten resin material at the time of the resin sealing molding step so as to be joined and separable with respect to the side surface position of the die coinciding with the mold fitting surface at the time of the mold clamping step described above, During the fastening process, it is set so as to inject the molten resin material into the cavity directly from the side surface position of the mold,
Furthermore, at least in the above-described resin sealing molding step, the pressure reducing step of setting the in-mold space portion formed on the die mating surface of the die including the molding cavity to a vacuum decompression state is performed. Resin sealing molding method for parts. A resin sealing molding method for an electronic component according to claim 1,
The step of supplying the substrate before resin sealing described above is set so as to supply a single substrate before resin sealing molding between the mold surfaces. . A resin sealing molding method for an electronic component according to claim 1 or 2,
A method for resin-sealing molding an electronic component, wherein the step of supplying the substrate before resin sealing described above is set so that the end surface of the substrate before resin sealing matches the side surface position of the mold. A resin sealing molding method for an electronic component according to claim 1 or claim 2 or claim 3, wherein
Each mold structure in which the mold clamping pressure applied to the mold structural unit is stacked and arranged by stacking and arranging the mold structural units supplied with a single substrate before resin sealing molding as a plurality of units between the mold surfaces A resin sealing molding method for electronic parts, characterized in that it is set to be added simultaneously to a unit. An electronic component mounted on a substrate is fitted into a molding cavity provided in a resin-sealed molding die for electronic components, and the mold surface is closed and the mold clamping pressure applied to the substrate surface Furthermore, in this mold-clamped state, by filling the cavity with a molten resin material, the electronic component fitted in the cavity is sealed with a resin material. There,
The shape of the supply set surface of the substrate in the mold described above is formed in a planar shape without the step for positioning the substrate,
Further, a pot block for injecting a molten resin material is disposed so as to be separable and separable with respect to the side surface position of the mold that matches the mold mating surface of the mold, and the mold mating surface and the pot block are joined. The molten resin material in the pot block can be directly injected into the cavity.
Furthermore, a resin-sealed molding of an electronic component, characterized in that a pressure reducing mechanism is provided for setting a space in the mold formed on the die mating surface of the mold including the molding cavity to a vacuum decompressed state. apparatus. It is the resin sealing molding apparatus of the electronic component of Claim 5, Comprising:
A resin sealing molding apparatus for electronic parts, wherein a single substrate supply unit is provided on a mold-matching surface of the mold. It is the resin sealing molding apparatus of the electronic component of Claim 5, Comprising:
Resin sealing that matches the end surface of the pre-resin sealing substrate and the side surface position of the above-mentioned mold when supplying the pre-resin sealing substrate to fit the electronic component mounted on the substrate into the molding cavity. A resin sealing molding apparatus for an electronic component, wherein a pre-stop board supply mechanism is provided. It is the resin sealing molding apparatus of the electronic component of Claim 5, Comprising:
Each mold structure in which the mold clamping pressure applied to the mold structure unit at the time of the mold clamping is stacked and arranged by stacking and arranging the mold structure units supplied with a single substrate between the mold surfaces as a plurality of units. A resin sealing molding apparatus for electronic parts, wherein the apparatus is configured to be added simultaneously to a unit.

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