JP2007266358A - Light emitting device and lighting device - Google Patents

Abstract

To provide a light-emitting device that has good light-emitting performance and excellent long-term reliability while suppressing fluctuation in reflectance on the inner peripheral surface of a reflecting member.
A light-emitting device is mounted on a base 1 having a mounting portion 1a for a light-emitting element 2 on an upper surface, a reflection member 4 provided on the upper surface of the base 1 so as to surround the mounting portion 1a, and the mounting portion 1a. The reflecting member 4 is made of aluminum, and an anodized film 4b is formed on the inner peripheral surface 1a. A good reflection performance can be obtained by the anodic oxide coating 4b, and since the anodic oxide coating 4b is chemically stable, a light emitting device with excellent long-term reliability can be obtained.
[Selection] Figure 1

Description

  The present invention relates to a light emitting device that efficiently radiates light emitted from a light emitting element to the outside.

  FIG. 9 shows a light-emitting device that emits near-ultraviolet light emitted from a light-emitting element such as a conventional light-emitting diode (LED) and light in the visible region wavelength such as blue, red, green, blue, and yellow. In FIG. 9, 11 is a base | substrate and 12 shows a light emitting element.

  The conventional light emitting device has a mounting portion 11a for mounting the light emitting element 12 on the upper surface, and an insulator in which a wiring conductor 11b is formed to electrically connect the inside and outside of the light emitting device from the mounting portion 11a or its periphery. And a light emitting element 12 that is flip-chip mounted and electrically connected and fixed to the mounting portion 11a via the wiring conductor 11b and the conductive member 15, and is disposed on the upper surface of the base 11 so as to surround the light emitting element 12. The reflecting member 14 is mainly composed.

  The reflecting member 14 is made of a metal material having a good reflectivity in the ultraviolet to visible light region such as aluminum (Al), silver (Ag), rhodium (Rh), or chromium (Cr), and these metal materials. The inner peripheral surface 14a facing the light emitting element 12 is made of a metal, resin, or the like coated on the inner peripheral surface 14a.

This light-emitting device is a light-emitting device that can cause the light-emitting element 12 to emit light and emit light from the light-emitting element 12 by a drive current supplied from a light-emitting device drive circuit board (not shown). In recent years, such light-emitting devices have begun to be used as illumination light sources, and in particular, there are increasing demands for light-emitting efficiency, environmental performance, and long-term reliability of light-emitting devices.
JP 2003-110146 A

  However, in the conventional light emitting device, the metal used for the inner peripheral surface 14a of the reflecting member 14 generally tends to easily undergo an oxidation reaction, and an oxide film tends to be formed on the surface thereof. . For this reason, the reflectance with respect to the light from the light emitting element 12 on the inner peripheral surface 14a of the reflecting member 14 is lowered, and there is a problem that the light output of the light emitting device is lowered and the light emission characteristics are changed.

  Therefore, the present invention has been completed in view of the above problems, and its purpose is to suppress the fluctuation of the reflectance on the inner peripheral surface of the reflecting member and to have good light emitting performance and excellent long-term reliability. The object is to provide a light emitting device.

  The light emitting device of the present invention includes a base having a light emitting element mounting portion on an upper surface, a reflecting member provided on the upper surface of the base so as to surround the mounting portion, and a light emitting element mounted on the mounting portion. In the light emitting device provided, the reflecting member is made of aluminum, and an anodized film is formed on an inner peripheral surface.

  In the light emitting device of the present invention, preferably, the light emitting element is a light emitting element that emits light included in an ultraviolet region to a blue region, and a wavelength conversion member including a phosphor that converts the wavelength of light emitted from the light emitting element. It is arranged on the light emitting element.

  The illuminating device of the present invention includes the light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having an electrical wiring for driving the light emitting device, and light reflecting means for reflecting light emitted from the light emitting device. It is characterized by including.

  In the light emitting device of the present invention, a porous surface composed of a large number of fine holes is formed on the inner peripheral surface by forming an anodized aluminum film on the inner peripheral surface of the reflecting member. The surface area of the inner peripheral surface increases depending on the surface. Further, a strong reflecting surface made of an anodized film is formed on the inner peripheral surface of the reflecting member. As a result, it is possible to obtain a reflectance equal to or higher than that of metal aluminum in comparison with the reflectance including diffuse reflected light, to efficiently extract the light emitted from the light emitting element to the outside, and to further oxidize the surface. It is possible to suppress a decrease in reflectance due to being performed. As a result, a light emitting device with stable and high luminous efficiency can be obtained.

  In the light-emitting device of the present invention, preferably, the light-emitting element is a light-emitting element that emits light included in at least the ultraviolet region to the blue region, and the wavelength conversion member that includes a phosphor that converts the wavelength of light emitted from the light-emitting element emits light. By being disposed on the element, the light of the light emitting element having a short wavelength from the ultraviolet region to the blue region and having high energy is diffusely reflected by the inner peripheral surface of the reflecting member, and the wavelength converting member disposed on the light emitting element. The whole area is irradiated uniformly. The light of the light emitting element having a short wavelength and high energy is efficiently converted into fluorescence having a long wavelength and low energy by the wavelength converting member, and the diffuse reflected light is irradiated without being concentrated locally on the wavelength converting member. Thus, fluorescence corresponding to the wavelength conversion efficiency is efficiently emitted from the wavelength conversion member. Accordingly, a light-emitting device with little color unevenness and color variation and high light emission efficiency can be obtained.

  The lighting device of the present invention includes the light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having electric wiring for driving the light emitting device, and a light reflecting means for reflecting light emitted from the light emitting device. Therefore, it is possible to provide an illumination device that can obtain a uniform illuminance surface without lowering light output or changing light emission characteristics over a long period of time.

  The light emitting device of the present invention will be described in detail below. 1 to 4 are a sectional view and an enlarged sectional view showing an example of various embodiments of the light emitting device according to the present invention, respectively. FIG. 2 is an enlarged view of the inner peripheral surface of the reflecting member in FIG. It is a principal part expanded sectional view. 5 and 6 are sectional views showing other examples of the embodiment of the light emitting device of the present invention.

  In each figure, 1 is a base having a mounting portion 1a for the light emitting element 2 on the upper surface, 2 is a light emitting element mounted on the mounting portion 1a, and 4 is a reflective member provided so as to surround the mounting portion 1a or the light emitting element 2. These mainly constitute the light emitting device. Further, 1b is a wiring conductor formed from one end of the mounting portion 1a of the substrate 1 or its periphery to the outside of the light emitting device, and 5 is an electrode (not shown) formed on one end of the wiring conductor 1b and the light emitting element 2. 3 is a wavelength conversion member that includes a phosphor that converts the wavelength of light emitted from the light emitting device 2, and 6 is a transparent member that is disposed in the inner opening of the reflection member 4 so as to cover the light emitting element 2. It is a light-sensitive member and is appropriately used for a light-emitting device as necessary.

  The substrate 1 of the present invention is an insulator made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a ceramic such as a glass ceramic, or a resin such as an epoxy resin or a liquid crystal polymer (LCP). In addition, the light emitting element 2 is mounted on the upper surface of the base body 1 and functions as a support member for supporting the light emitting element 2.

  In addition, when the substrate 1 is made of ceramics or the like, tungsten (W), molybdenum (Mo), manganese (Mn), The wiring conductor 1b made of a metal paste such as copper (Cu) is disposed, and the base 1 having the wiring conductor 1b is formed by firing the base 1 and simultaneously firing the metal paste. Such a wiring conductor 1b is formed using the known metallization method, plating method or the like.

  When the substrate 1 is an insulator made of resin, the wiring conductor 1b is made of a metal material such as Cu, Ag, Al, iron (Fe) -nickel (Ni) -cobalt (Co) alloy, or Fe—Ni alloy. The lead terminal is formed by embedding the lead terminal in the base 1, leading one end of the lead terminal to the mounting portion 1 a, and leading the other end to the side surface or the bottom surface of the base 1 and exposing it.

  In addition, the wiring conductor 1b is coated with a metal layer having excellent corrosion resistance such as a Ni layer having a thickness of 0.5 to 9 μm or a gold (Au) layer having a thickness of 0.5 to 5 μm on the exposed surface of the substrate 1. Thus, it is possible to effectively prevent the wiring conductor 1b from being oxidatively corroded, and to firmly join the light emitting element 2 with the conductive member 5 such as solder.

  The light emitting element 2 is electrically connected to one end of the wiring conductor 1b on the upper surface of the base body 1 via the conductive member 5, and is connected to the other end of the wiring conductor 1b led out to the side surface or the lower surface of the base body 1 and the light emitting device. By electrically connecting the drive circuit board (not shown), the light emitting device drive circuit board and the light emitting element 2 are electrically connected.

  Further, the base 1 is designed not to be electrically short-circuited to the wiring conductor 1b for the purpose of suppressing light transmission from the light emitting element 2 on the upper surface and reflecting light efficiently on the upper side of the base 1. More preferably, a metal layer such as Al, Ag, Au, platinum (Pt), Cu, Cr, Rh is formed by a vapor deposition method or a plating method, and a reflective layer for reflecting light is provided above the substrate 1. preferable.

  Further, the base 1 includes a frame-like reflecting member 4 disposed on the upper surface so as to surround the light emitting element 2. Thereby, the light emitted from the light emitting element 2 to the side is reflected upward by the inner peripheral surface 4a of the reflecting member 4 and is emitted to the outside of the light emitting device. Further, the configuration in which the inner peripheral surface 4a is a reflecting surface that efficiently reflects the light of the light emitting element 2, the light emitted from the light emitting element 2 to the side is efficiently reflected above the light emitting device. At the same time, absorption and transmission of light by the base 1 and the reflecting member 4 are effectively suppressed. As a result, the light output and light emission efficiency of the light emitting device are significantly improved. Furthermore, the reflecting member 4 has a function of protecting the light emitting element 2 from an external environment or an impact when the light emitting device is dropped, and is disposed between the base 1 and the wavelength converting member 3 as shown in FIG. Thus, it has a function as a holding member for holding the wavelength conversion member 3.

  In addition, the base | substrate 1 should just have the function to mount the light emitting element 2 combining the metal used as the wiring conductor 1b in this way, and the insulator which insulates this, The said structure is the example, This is not a limitation. For example, the wiring conductor 1b is not necessarily disposed inside the base 1, and may be directly connected to the electrode of the light-emitting element 2 from the outside of the light-emitting device by a conductive wire.

  The reflecting member 4 of the present invention is made of ceramics such as an aluminum oxide sintered body, a zirconium oxide sintered body, an aluminum nitride sintered body, or a resin such as an epoxy resin or a liquid crystal polymer (LCP). An aluminum film is formed on the surface 4a by metal plating, vapor deposition, or the like. Then, the reflecting member 4 in which the anodizing treatment is applied to the aluminum film and the aluminum anodic oxide coating 4b is formed on the inner peripheral surface 4a can be produced. Alternatively, the reflecting member 4 in which the anodized film 4b is formed on the inner peripheral surface 4a by forming an aluminum that has been cut or molded into a desired shape by electrolytic polishing or chemical polishing, and then anodizing the aluminum. Can be produced.

The anodizing treatment is an acidic solution such as sulfuric acid, oxalic acid, chromic acid, boric acid, or a mixed solution of ammonium hydroxide (NH ₄ OH) and ammonium fluoride (NH ₄ F), sodium hydroxide (NaOH). ) And hydrogen peroxide (H ₂ O ₂ ), in an electrolytic solution such as an alkaline solution such as a sodium phosphate (Na ₃ PO ₄ ) solution, Al or Al—Cu, Al—Mn, Al— By applying a DC voltage using an aluminum alloy such as Si-based, Al-magnesium (Mg) -based, Al-Mg-silicon (Si) -based, Al-zinc (Zn) -based as an anode and carbon or lead as a cathode, Aluminum or aluminum alloy connected to the anode reacts with active oxygen in the electrolytic solution, and an anodized nonporous aluminum film is formed on the surface thereof.

  Furthermore, by proceeding the oxidation reaction of the anodized nonporous aluminum film, a high electric field is generated in the concave portion of the surface formed in the nonporous aluminum film. For example, when using a sulfuric acid solution, The sulfate ions inside enter into the recesses, and a portion where the surface becomes aluminum sulfate and elutes locally is formed. By repeating the process and the oxidation reaction at the same time, the porous anodic oxide coating 4b is formed so that the surface having innumerable recesses on the surface of the non-porous aluminum film has fine irregularities. In addition, the surface of the anodic oxide coating 4b is silver white, grayish white, yellowish brown by appropriately selecting conditions such as the material used, the composition of the electrolytic solution, the applied voltage, the applied current density, the processing temperature, and the processing time. , Grayish brown, gray, transparent, etc., and may be appropriately determined in consideration of the wavelength of light emitted from the light emitting element 2 and the like.

  In such a reflection member 4, the surface of the anodic oxide coating 4b is porous and the effective surface area of the inner peripheral surface 4a is increased by forming the anodic oxide coating 4b of aluminum on the inner peripheral surface 4a. . Thereby, the light emitted from the light emitting element 2 is efficiently reflected upward when reflected by the anodic oxide coating 4b, and a light emitting device with high light extraction efficiency can be obtained. That is, since the anodic oxide coating 4b is a porous surface having innumerable recesses, the light incident on the anodic oxide coating 4b is diffusely reflected, and the light from the light emitting element 2 can be evenly emitted upward. it can. As a result, intensity unevenness and intensity variation of the light-emitting device are reduced, and a light-emitting device having favorable light-emitting characteristics can be obtained.

  Further, since the surface of the anodic oxide coating 4b is made porous, the light incident on the anodic oxide coating 4b from the light emitting element 2 and reflected by the underlying aluminum is reflected from the porous surface to the anodic oxide coating 4b. It becomes easy to take out to the exterior of 4b. That is, when the inner peripheral surface 4a of the reflecting member 4 is made of a flat anodic oxide coating 4b, total reflection based on Snell's law occurs due to the refractive index difference between the anodic oxide coating 4b and the outside, and enters the anodic oxide coating 4b. However, light that is going to be emitted from the anodic oxide coating 4 at an angle larger than the critical angle is confined by repeated reflection in the anodic oxide coating 4b. While being confined and repeatedly reflected, light absorption corresponding to the reflectance of the underlying aluminum occurs, so that the light radiated to the outside of the light emitting device through the reflecting member 4 is attenuated. On the other hand, the surface of the anodic oxide coating 4b is formed with a porous surface comprising a large number of fine holes (recesses), so that the surface of the anodic oxide coating 4 is arranged at various angles. The light reflected by the aluminum is not reflected through the porous surface and is easily transmitted to the outside of the anodic oxide coating 4b. Therefore, the light output emitted from the light emitting device and the light emission efficiency are improved.

  Further, the anodic oxide coating 4b is an oxide film formed of chemically stable aluminum oxide, so-called a passive film, so that it is a coating material (for example, low melting point glass having excellent transmittance in the ultraviolet to visible light region). , Sol-gel glass, silicone resin, epoxy resin, acrylic resin), etc., can improve the corrosion resistance, chemical resistance and weather resistance of the inner peripheral surface 4a, and can emit light with lower cost and longer-term reliability. A device can be made.

  The anodic oxide coating 4b preferably has a thickness of 30 μm or less. While the amount of light loss increases in proportion to the thickness of the anodic oxide coating 4b, the volume of the porous portion on the surface increases and the reflectance increases as the thickness increases. When the thickness of the anodic oxide coating 4b is 30 μm or more, the amount of light loss is larger than the amount of increase in the diffuse reflectance, so that the reflectance is lowered and the light emission efficiency of the light emitting device is lowered.

  The anodic oxide coating 4b is preferably white. White means that the light is continuously reflected at a high reflectance in the spectrum of light from the ultraviolet region to the visible light region, for example, 80% or more in the ratio of the light intensity of the incident light to the reflected light. Various light radiated from the light emitting element 2 and included in the visible region from the ultraviolet region can be efficiently extracted upward through the reflecting member 4.

  Moreover, the anodic oxide coating 4b is, for example, a reflective member made of a 1000 series (pure Al series) or 7000 series (Al-Zn series) alloy (JIS H4100: 1999 extruded aluminum and aluminum alloy) on the anode side. 4 is connected to the cathode side by carbon, Pt, etc., and is white so as to cover the surface of the reflecting member 4 connected to the anode side by conducting electricity while immersed in a dilute sulfuric acid solution. 4b is formed.

  Further, the anodic oxide coating 4b is made of other alloy materials such as 2000 series (Al-Cu series), 3000 series (Al-Mn series), 5000 series (Al-Mg series) or 6000 series (Al-Mg-Si series). ) Is used, the ratio of Cu, Mn, Mg, Si is higher than that of 1000 series and 7000 series. Therefore, it is necessary to adjust the thickness of the anodic oxide coating 4b to be thin, but dilute sulfuric acid. The anodic oxide coating 4b can be formed in the same manner in the solution.

On the anode or cathode side, the anodic oxide coating 4b can be formed in a transparent color by conducting electricity as a mixed solution of NH ₄ OH and NH ₄ F in the same manner as described above. You may form by apply | coating a white dye etc. to this.

  The anodic oxide coating 4b is described as white, but is not particularly limited as long as it is white in the wavelength band of light to be reflected by the reflecting member 4. 1 to 6, the anodic oxide coating 4b is shown only on the inner peripheral surface 4a. However, for example, the anodic oxide coating 4a may be formed on the entire surface of the reflecting member 4, and the upper surface of the substrate 1 may be further formed. Needless to say, there is no problem even if the anodic oxide coating 4b is also formed on the surface of the Al metal layer formed so as not to be electrically short-circuited to the wiring conductor 1. It is only necessary that the anodic oxide coating 4a be formed on at least the inner peripheral surface 4a.

  The reflecting member 4 is made of alloy brazing material (not shown) such as Ag-Cu, lead (Pb) -tin (Sn), Au-Sn, Au-silicon (Si), Sn-Ag-Cu, silicone, etc. It is attached to the upper surface of the substrate 1 or formed integrally with the substrate 1 so as to surround the light emitting element 2 by a resin bonding material (not shown) such as resin, epoxy resin, acrylic resin or the like.

  The bonding material for bonding the reflecting member 4 and the substrate 1 may be appropriately selected in consideration of the material of the substrate 1 and the reflecting member 4, the thermal expansion coefficient, etc., and is not particularly limited. Further, when high reliability is required for joining the base 1 and the reflecting member 4, a metal brazing material or solder may be used.

  The reflecting member 4 may be formed integrally with the base 1. For example, when the base 1 and the reflecting member 4 are made of ceramics, a ceramic green sheet to be the base 1 and a ceramic green sheet to be the reflecting member 4 are laminated. And it can form by baking simultaneously. Then, an Al metal layer is formed on the inner peripheral surface 4a and other required portions to form the anodic oxide coating 4b.

  When the base 1 and the reflecting member 4 are made of an insulator made of a resin such as a thermosetting resin such as an epoxy resin or LCP or a thermoplastic resin, the base 1 and the reflecting member 4 are integrally formed. It can also be formed by integrally molding an insulator made of resin and a metal lead using a molding die. Then, an Al metal layer is formed on the inner peripheral surface 4a and other required portions to form the anodic oxide coating 4b.

  In addition, in order to reflect the light of the light emitting element 2 efficiently upwards, the inner peripheral surface 4a is preferably inclined so as to spread outward as it goes upward. As a result, the inner peripheral surface 4a can efficiently reflect the light emitted from the light emitting element 2 to the side toward the upper side of the light emitting device.

  Further, the reflecting member 4 may be mounted and fixed with a lid (not shown) made of a transparent member such as glass, sapphire, quartz, epoxy resin, silicone resin, acrylic resin or the like in the opening. In this case, while protecting the light emitting element 2, the wiring conductor 1b, etc. which are installed inside the reflecting member 4, the inside of the light emitting device can be hermetically sealed, and the light emitting element 2 can be stably operated for a long time. In addition, by forming the lid in the shape of a lens and adding the function of an optical lens, it is possible to collect or disperse the light, and take out the light to the outside of the light emitting device with a desired radiation angle and intensity distribution. The water resistance inside the device is improved, and the long-term reliability of the light emitting device is improved.

  In addition, the reflecting member 4 covers the at least the surface of the light emitting element 2 after the light emitting element 2 is mounted on the mounting portion 1a and is electrically connected to the wiring conductor 1b via the conductive member 5. The translucent member 6 may be disposed (see FIG. 3), or the translucent member 6 may be injected so as to cover the light emitting element 2 inside the reflective member 4 (see FIG. 4). Thereby, the difference in refractive index between the light emitting element 2 and the translucent member 6 is reduced, and the light emitted from the inside of the light emitting element 2 is reflected at the interface between the light emitting element 2 and the translucent member 6 to emit light. It becomes easy to take out outside without being confined in the element 2. As a result, the light from the light emitting element 2 is easily radiated from the outside through the translucent member 6, and the light output and light emission efficiency of the light emitting device are improved.

  In addition, when the translucent member 6 is injected into the reflective member 4 so as to cover the light emitting element 2, the translucent member 6 enters a large number of fine holes formed in the anodic oxide coating 4b. As a result, the adhesive strength between the translucent member 6 and the reflective member 4 is improved, deterioration and peeling of the adhesive strength caused by changes over time are suppressed, and the long-term reliability of the light emitting device is improved.

  Examples of the translucent member 6 include a silicone resin, an epoxy resin, an acrylic resin, a fluorine resin, a polycarbonate resin, and a polyimide resin, but are not limited thereto. And may be selected as appropriate in consideration of the thermal expansion coefficient and the like. The translucent member 6 does not need to be transparent. For example, the light transmissive member 6 may be a member that scatters light in the light-emitting device, or may be a material that absorbs less light in the wavelength band of light in the light-emitting device. Good.

  Further, the translucent member 6 is an injector such as a dispenser so that the uncured translucent member 6 covers at least the surface of the light emitting element 2 or the inner surface of the reflecting member 4 covers the light emitting element 2. Injected with. Thereafter, the uncured translucent member 6 is cured and solidified by heating, natural standing or light irradiation. In addition, although it is necessary to cover the upper part of the translucent member 6 with a translucent cover body, it cannot be overemphasized that the liquid translucent member 6 may be used.

  In the light emitting device of the present invention, the light emitting element 2 is a light emitting element 2 that emits light included in the ultraviolet region to the blue region, and includes a phosphor (not shown) that converts the wavelength of light emitted from the light emitting element 2. The wavelength converting member 3 may be disposed on the light emitting element 2 (see FIGS. 5 and 6). Accordingly, light having a desired wavelength spectrum converted by the phosphor or light having a desired wavelength spectrum obtained by mixing the light from the light emitting element 2 and the light having the wavelength converted by the phosphor is emitted from the light emitting device. it can.

  The light of the light emitting element 2 having a short wavelength from the ultraviolet region to the blue region and having high energy is converted into fluorescence having a long wavelength and low energy by the phosphor contained in the wavelength conversion member 3. Many phosphors that convert light contained in a region have high conversion efficiency, and the light output and light emission efficiency of the light emitting device are improved.

  In addition, since the wavelength conversion member 3 is disposed away from the light emitting element 2, the light emitted from the light emitting element 2 in all directions is reflected directly or by the reflecting member 4 and enters the wavelength conversion member 3. . The light reflected by the inner peripheral surface 4 a of the reflecting member 4 is diffusely reflected and reaches the wavelength conversion member 3 because the anodized film 4 b is formed on the inner peripheral surface 4 a. As a result, since the light dispersed without being concentrated locally is evenly applied to the wavelength conversion member 3, the fluorescence corresponding to the wavelength conversion efficiency specific to the phosphor without being saturated at various points of the wavelength conversion member 3. Is emitted, and the conversion efficiency of the entire wavelength conversion member 3 is improved. Therefore, the light output and light emission efficiency of the light emitting device are improved, and color unevenness and color variation of light emitted from the light emitting device are suppressed.

  Moreover, when using the translucent member 6, it is preferable that the wavelength conversion member 3 is arrange | positioned through the space | gap 7 so that it may not contact the translucent member 6 as shown in FIG. Thereby, the deformation | transformation of the wavelength conversion member 3 in the adhesive surface with the translucent member 6 which generate | occur | produces by the shrinkage | contraction at the time of hardening the translucent member 6, or thermal expansion by environmental temperature can be suppressed. Further, a part of the light emitted from the wavelength conversion member 3 to the light emitting element 2 side is upward at the interface between the gap 7 and the wavelength conversion member 3 provided between the wavelength conversion member 3 and the translucent member 6. It becomes easy to be totally reflected. As a result, color unevenness and color variation due to deformation of the wavelength conversion member 3 are suppressed, and light output and light emission efficiency of the light emitting device are improved.

  The wavelength conversion member 3 is made of a transparent resin such as a silicone resin, an epoxy resin, a urea resin, or a fluorine resin having a high transmittance with respect to light contained in the ultraviolet region to the visible light region, a low-melting glass, or a sol-gel glass. Apply a non-cured phosphor mixed with a transparent member made of transparent glass such as a flat plate or curved plate made of a smooth or rough glass plate, etc., and leave it in the air or in the atmosphere, It is formed by being cured by light irradiation. And the wavelength conversion member 3 is installed inside the opening part of the reflection member 4 so that the light emitting element 2 may be covered.

  In particular, the wavelength conversion member 3 is more preferably made of a silicone resin, and has good permeability to light having a short wavelength and high energy such as ultraviolet light, near ultraviolet light, or blue light emitted from the light emitting element 2, and molecules Since the bond is not easily broken, the deterioration of the transmittance of the wavelength conversion member 3 is suppressed, and a light emitting device having excellent sealing reliability can be provided.

Various materials are used as the phosphor. For example, when a red fluorescent color is obtained, a phosphor of La ₂ O ₂ S: Eu (Eu-doped La ₂ O ₂ S), LiEuW ₂ O ₈ , or green is used. A phosphor in the form of ZnS: Cu, Al or SrAl ₂ O ₄ : Eu, or in the case of blue, particles in the form of (BaMgAl) ₁₀ O ₁₂ : Eu or BaMgAl ₁₀ O ₁₇ : Eu are used. Furthermore, such a phosphor is not limited to one type, and a light having a desired emission spectrum and color can be output by blending a plurality of phosphors at a required ratio.

  In addition, the light emitting element 2 emits white light and various colors of light from the light emitting device with good visibility, and emits light with a peak intensity from ultraviolet light in the wavelength range of 200 to 500 nm to near ultraviolet light and blue light. It is preferable that the element has For example, a buffer layer composed of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, etc., an N-type layer, a light-emitting layer, and a P-type layer are sequentially stacked on a sapphire substrate. A gallium nitride compound semiconductor, a silicon carbide (SiC) compound semiconductor, a zinc oxide compound semiconductor, a zinc selenide compound semiconductor, a diamond compound semiconductor, a boron nitride compound semiconductor, or the like is used. It goes without saying that the light emitting device using the red, yellow, and green light emitting elements 2 that do not use a phosphor may be used.

  In addition, the ultraviolet region of the light generated from the light emitting element 2 is the electromagnetic wave having a wavelength range of up to about 1 nm with the short wavelength end of 360 to 400 nm of visible light as the lower limit (RIKEN KENSHU 5th edition / Iwanami Shoten) . The blue region has an upper limit of the short wavelength end of 360 to 400 nm of visible light and a lower limit of a wavelength range up to about 495 nm (chromaticity coordinates of JIS Z8701 XYZ color system).

  The light emitting element 2 has a metal bump using a solder material such as Au-Sn, Sn-Ag, Sn-Ag-Cu, or Sn-Pb, or a metal bump, or a metal using a metal such as Au or Ag. It is electrically connected to the wiring conductor 1b by flip chip mounting through a conductive member 5 made of a conductive resin made of a resin such as a bump and an epoxy resin containing a metal powder such as Ag. For example, the conductive member 5 made of a solder material such as paste Au—Sn or Pb—Sn or Ag paste or the like is placed on the wiring conductor 1 b using a dispenser or the like, and the light emitting element 2 is an electrode of the light emitting element 2. And the conductive member 5 are brought into contact with each other, and then the whole is heated at about 150 ° C. to 350 ° C., whereby the electrode of the light emitting element 2 and the wiring conductor 1b are electrically connected by the conductive member 5. A connected light emitting device is manufactured. Further, a method of electrically connecting the wiring conductor 1b and the electrodes of the light emitting element 2 with a conductive member 5 such as a bonding wire may be used, and only flip chip mounting can be used.

  The lighting device of the present invention includes the light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having electric wiring for driving the light emitting device, and a light reflecting means for reflecting light emitted from the light emitting device. Is included. The light-emitting device of the present invention has high brightness, and fluctuations in the wavelength of emitted light and unevenness in intensity are suppressed, so that the unevenness in intensity of the illumination device of the present invention obtained by collecting them is also suppressed. As a result, the luminance becomes high.

  In the illumination device of the present invention, for example, as shown in FIGS. 7 and 8, one light emitting device 101 is installed in a predetermined arrangement, or a plurality of light emitting devices 101 are arranged in, for example, a grid. Or a predetermined arrangement such as a zigzag pattern, a zigzag pattern, or a radial pattern. Or you may install so that the circular shape which consists of the several light-emitting device 101, or the polygonal-shaped light-emitting device 101 group may form several groups concentrically, etc. may become predetermined arrangement | positioning.

  FIG. 7A is a plan view of a lighting device using the light-emitting device of the present invention, and FIG. 7B is a cross-sectional view of FIG. A plurality of light emitting devices 101 are arranged in a plurality of rows on a drive unit 102 having electric wiring for driving the light emitting devices 101, and a reflecting plate that reflects light optically designed in an arbitrary shape around the light emitting devices 101 In the case of the light emitting device in which the light reflecting means 103 such as the light emitting device is installed, the arrangement in which the interval between the adjacent light emitting devices 101 is not shortest, for example, the light emission in the adjacent rows between the plurality of light emitting devices 101 arranged in a row. An arrangement in which the apparatus 101 is arranged, that is, a so-called staggered arrangement is preferable. That is, when the light emitting devices 101 are arranged in a grid, glare is strengthened by arranging the light emitting devices 101 in a vertical and horizontal linear grid, and such a light emitting device 101 enters human vision. Thus, discomfort is likely to occur, but the staggered shape can suppress glare and reduce discomfort to the human eye. Further, since the distance between the adjacent light emitting devices 101 is increased, thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and heat accumulation in the drive unit 102 in which the light emitting devices 101 are mounted is suppressed. Then, heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device that is less uncomfortable for human eyes and has stable optical characteristics over a long period of time.

  Further, as shown in a plan view of FIG. 8A and a cross-sectional view of FIG. 8B, a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on a drive unit 102 is provided. In the case of light-emitting devices formed in a plurality of concentric groups, it is preferable to increase the number of light-emitting devices 101 arranged in one circular or polygonal light-emitting device 101 group from the center side to the outer peripheral side of the light-emitting device. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the light emitting devices. In addition, the density of the light emitting device 101 at the center of the lighting device can be reduced to suppress heat accumulation at the center of the drive unit 102. As a result, the temperature distribution in the drive unit 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board or heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. Can operate stably over a long period of time and can produce a long-life lighting device.

  Examples of the lighting device using such a light emitting device include, for example, general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, and display lighting fixtures that are used indoors and outdoors. Street lighting fixtures, guide lights and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency use Examples include lighting fixtures, flashlights, electric bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, vehicle lights, and the like.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, in the embodiment described above, the inner peripheral surface 4a of the reflecting member 4 has been described as an example of a circular shape in plan view, but is not limited to a circular shape, and a rectangular shape or other polygonal shapes, It may be indefinite shape such as elliptical shape or other star shape. Further, the outer peripheral shape of the reflecting member 4 and the substrate 1 is not limited to a circular shape, and may be other polygonal shapes, quadrangular shapes, elliptical shapes, or other indefinite shapes. Moreover, although the cross-sectional shape of the reflecting member 4 is shown as a right triangle block, it may be formed in a frustum shape with a plate material or the like, for example.

  In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is a principal part expanded sectional view of FIG. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. (A) is a top view which shows an example of the illuminating device using the light-emitting device of this invention, (b) is sectional drawing of (a). (A) is a top view which shows the other example of the illuminating device using the light-emitting device of this invention, (b) is sectional drawing of (a). It is sectional drawing which shows an example of the conventional light-emitting device.

Explanation of symbols

1: Base body 2: Light emitting element 3: Wavelength conversion member 4: Reflective member 4a: Inner peripheral surface 4b: Anodized film 5: Conductive member 6: Translucent member

Claims (3)

In a light emitting device comprising: a base having a light emitting element mounting portion on an upper surface; a reflecting member provided on the upper surface of the base so as to surround the mounting portion; and a light emitting element mounted on the mounting portion. The light-emitting device is characterized in that the reflecting member is made of aluminum, and an anodized film is formed on the inner peripheral surface. The light-emitting element is a light-emitting element that emits light included in an ultraviolet region to a blue region, and a wavelength conversion member including a phosphor that converts the wavelength of light emitted from the light-emitting element is disposed on the light-emitting element. The light-emitting device according to claim 1. The light-emitting device according to claim 1, the light-emitting device mounted thereon, a drive unit having electric wiring for driving the light-emitting device, and light that reflects light emitted from the light-emitting device A lighting device including reflecting means;

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