JP2007242090A - Optical disc molding method, molding apparatus, and optical disc obtained by the method - Google Patents

Abstract

An optical disc molding method, a molding apparatus, and an optical disc obtained by the method capable of generating a substrate shrinkage effect, improving the peelability from a mirror surface, and reducing surface deflection of the molded substrate.
In a method for molding an optical disk, when a resin molded product is peeled from a mold after molding, the resin is peeled from the stamper side by utilizing substrate shrinkage generated by blowing to the molded product. Optical disc molding method, molding apparatus, and optical disc obtained by the method.
[Selection] Figure 1

Description

  The present invention relates to an optical disk molding method, a molding apparatus, and an optical disk obtained by the method.

The molded substrate of the optical disk is molded by an injection molding method. When the resin is injected into the mold and pressure holding and cooling are completed, release air is jetted from the surface facing the stamper just before the mold is opened, and the molded product is released from the stamper side. During mold opening, mold release air is ejected from the mirror side after mold opening is completed, and the molded product is released from the mirror surface.
Later, the molded product is ejected by an ejector mechanism, and the molded substrate is taken out by adsorbing the substrate with a substrate take-out device.
When peeling the molded product from the mirror surface, the release property from the mirror surface has been improved by using release air.
However, if the pressure of the release air on the mirror surface side is too small, the molded substrate cannot be completely released, and the mechanical properties are deteriorated because it is forcibly separated by the ejector.
In order to improve this, Patent Document 1 describes a method for peeling a molded product from a stamper as a method for peeling a flattened product.
This is a method in which the release air can be released at a high pressure by making the stamper side negative and holding the molded product firmly.

JP-A-4-93208

  The present invention provides an optical disk molding method, a molding apparatus, and an optical disk obtained by the method, in which the substrate shrinkage effect occurs, the peelability from the mirror surface is improved, and the surface deflection of the molded substrate can be reduced. With the goal.

The first aspect of the present invention is that in the method of molding an optical disk, when the resin molded product is peeled from the mold after molding, the stamper side peels off using the substrate shrinkage generated by blowing to the molded product. The present invention relates to an optical disc molding method.
The second aspect of the present invention is that when the resin molded product is peeled off from the mold after molding, it is blown to the molded product from the stamper side, and the substrate contraction that occurs at that time improves the peelability of the substrate outer peripheral portion. The method of forming an optical disk according to claim 1.
A third aspect of the present invention relates to an optical disc molding apparatus characterized in that an air blow injection device is mounted on a device for taking out a resin molded product from a mold after molding.
4. The optical disk molding apparatus according to claim 3, wherein the air blow device has a mechanism for uniformly injecting air from a concentric circle and has a control means capable of changing the circle diameter. About.
According to a fifth aspect of the present invention, there is provided the optical disk molding apparatus according to claim 4 or 5, wherein a pressure control mechanism is mounted on the air blow injection device so that the peelability can be controlled.
A sixth aspect of the present invention relates to an optical disc manufactured by the optical disc forming method according to claim 1 or 2.

Hereinafter, a method for molding an optical disk, a molding apparatus of the present invention, and features relating to the optical disk obtained by the method will be described in detail.
In the present invention, when a molded substrate of an optical disk is molded by injection molding, the mold is filled with a molding resin, held and cooled, and after molding the molded substrate, the mold opens when the molded substrate is taken out of the mold. In some cases, the substrate is contracted by jetting air from the stamper side, and the molded substrate is peeled off from the mirror surface by the contraction.
In a general molding process, polycarbonate molding resin is filled into a mold having a fixed mold and a movable mold constituting a cavity for forming an optical disk substrate, and pressure holding and cooling are performed in the cavity to form a molded substrate. Form. After cooling, air is injected from the side facing the stamper, the molded substrate is peeled off from the stamper, and the movable mirror side opens. After mold opening is completed, the molded substrate take-out device moves into the mold.
On the other hand, mold release air is jetted from the fixed mirror surface side, and the molded substrate is released from the mirror surface.
Thereafter, the molded substrate is ejected by an ejector mechanism, and the molded substrate is taken out by adsorbing the substrate with a substrate take-out device.
As an improvement method, an air blow injection device is mounted on a molded substrate take-out device having a substrate suction mechanism.

FIG. 1 is a diagram showing a positional relationship between a mold and an air blow injection device.
1 is an air blow injection device, 3 is a molded substrate take-out device, 4 is a substrate suction mechanism, 5 is a molded substrate, 6 is a stamper, 7 is an air blow injection direction, 11 is a mold fixing side, and 12 is a mold. The mold movable side is shown.
A state where only the optical disk substrate information surface side is released while the optical disk substrate mirror surface side is in close contact with the movable mold mirror surface is shown.
In such a state, from 0.5 to 10 seconds before the completion of cooling of the optical disk substrate, release air is injected from the inner periphery of the fixed mold, and the optical disk substrate is moved to the movable mold side during the mold opening operation.
In the present invention, when the mold opening is completed, the substrate take-out machine enters the center of the mold and advances toward the movable mold, and at the same time, air is sprayed onto the surface of the optical disk that is in close contact with the mirror surface of the movable mold, thereby contracting the substrate. Is used to peel the outer peripheral portion of the optical disk substrate from the mirror surface of the movable mold.
The temperature of the substrate in close contact with the movable mold mirror surface at this time is 100 to 120 ° C., and air of 20 to 25 ° C. is jetted onto this surface.

FIG. 2 is an explanatory view showing the configuration of the air blow injection device of the present invention.
(A) is the figure which looked at the air blow injection apparatus from the upper direction, (b) is the AA 'sectional drawing.
The air blow injection device 1 has a plurality of air blow injection holes 8, and the air supplied from the air supply port 9 is distributed to the plurality of air blow injection holes 8. The molded substrate take-out device mounting jig 10 is mounted on the molded substrate take-out device.

FIG. 3 is an explanatory diagram for explaining the positional relationship of the molded substrate take-out device equipped with the air blow injection device with respect to the mold, and (a) explains the position of the molded substrate take-out device before the mold is released. (B) explains the position of the molded substrate take-out device after releasing the mold, and (c) explains the position of the molded substrate take-out device after taking out the molded substrate.
In (a), a molded substrate take-out device 3 on which the air blow injection device 1 is mounted is provided at a position where there is no hindrance to the opening and closing of the mold 2.
In (b), the molded substrate take-out device 3 in which the air blow injection device 1 is mounted on the molded substrate 5 in the mold 2 rotates, and air blow is performed here.
(C) shows a state in which the molded substrate take-out device 3 on which the air blow injection device 1 is mounted takes out the molded substrate 5 in the mold 2 and rotates to carry out the molded substrate.

FIG. 4 shows the positional relationship between the air blow injection device 1 having the substrate suction mechanism 4 and the molded substrate 5 in the state shown in FIG. 3B, and shows a state before air blow is performed.
FIG. 5 illustrates the state when air blow is performed in the state of FIG. 4. When air blow is performed in the air blow injection direction 7 from the air blow injection device 1 having the substrate suction mechanism 4, the air blow injection device is illustrated. On the side, the molded substrate 5 contracts, and the molded substrate peels off from the mirror surface.

Due to the shrinkage of the molded substrate by the air from the stamper side, the molded substrate is peeled off from the mirror surface, so that the influence of forced peeling from the stamper by the ejector mechanism is reduced.
Therefore, deterioration of mechanical properties such as surface blurring that occurs when the molded substrate peels from the mirror surface is reduced.
The air blower is a mechanism that sprays the molded substrate from a concentric circle as shown in FIG. 2 with the substrate suction mechanism of the molded substrate takeout device as the center.
Thereby, it becomes possible to uniformly inject air into the periphery of the molded substrate.
As a result, molded substrate peeling unevenness within the circumference from the stamper is eliminated, and deterioration of mechanical properties such as surface blurring is reduced.
In order to shrink the molded substrate 5 uniformly, the air blow injection holes 8 of the air blow injection device 1 are provided on concentric circles to inject air. By changing the diameter (circular shape) of the ring of the air blow injection device 1, it is possible to adjust the peeling state from the mirror surface of the mold movable side 12.
By providing an air pressure control mechanism in the air circuit and controlling the pressure of air sprayed onto the molded substrate, it is also possible to control the amount of contraction of the molded substrate.

1. Since air is sprayed onto the molded product from the side of the stamper, the substrate shrinkage effect occurs, the peelability from the mirror surface is improved, and the surface deflection of the molded substrate can be reduced.
2. Since a mechanism capable of uniformly injecting air from a concentric circle can be mounted on the substrate take-out apparatus, it can be easily mounted on the existing equipment.
3. The peelability of the substrate from the mirror surface can be improved by changing the diameter of the air blow injection device or changing the air injection pressure.

The figure which shows the positional relationship of a metal mold | die and an air blow injection apparatus. Explanatory drawing which shows the structure of an air blow injection apparatus. (A) is the figure which looked at the air blow injection apparatus from the upper direction. (B) is the AA 'sectional drawing. Explanatory drawing for demonstrating the positional relationship with respect to the metal mold | die of a shaping | molding board | substrate taking-out apparatus. (A) is explanatory drawing of the position of the shaping | molding board | substrate taking-out apparatus before metal mold | die release. (B) is explanatory drawing of the position of the shaping | molding board | substrate taking-out apparatus after metal mold | die release. (C) is explanatory drawing of the position of the molded substrate taking-out apparatus after taking out a molded substrate. Explanatory drawing which shows the state before air blow injection. Explanatory drawing which shows the state after air blow injection.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Air blow injection apparatus 2 Mold 3 Molded board taking-out apparatus 4 Substrate adsorption mechanism 5 Molded board 6 Stamper 7 Air blow injection direction 8 Air blow injection hole 9 Air supply port 10 Molded board taking-out apparatus attachment jig 11 Mold fixing side 12 Mold movable side

Claims (6)

  In an optical disc molding method, when a resin molded product is peeled off from a mold after molding, the optical disc molding method is characterized by peeling from the stamper side using substrate shrinkage generated by blowing to the molded product. .   2. When the resin molded product is peeled from the mold after molding, blow to the molded product from the stamper side, and the peelability of the outer peripheral portion of the substrate is improved by contraction of the substrate generated at that time. A method for forming the optical disk as described.   An optical disc molding apparatus comprising an air blow injection device mounted on a device for taking out a resin molded product from a mold after molding.   4. The optical disk forming apparatus according to claim 3, wherein the air blow device has a mechanism for uniformly injecting air from a concentric circle, and has control means for changing the circle diameter.   6. The optical disk forming apparatus according to claim 4, wherein a pressure control mechanism is mounted on the air blow jet device so that the peelability can be controlled. An optical disc manufactured by the method for molding an optical disc according to claim 1.

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