JP2007124591A - Communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a communication module capable of reducing the size, height and cost of a communication module.
A communication module according to the present invention includes an integrated circuit element mounted on a wiring board and a piezoelectric vibration element connected to the integrated circuit element. The problem is solved by providing a column member on the outer periphery to be mounted.
[Selection] Figure 1

Description

  The present invention relates to a communication module that has a communication module for electronic components that is downsized and has a shielding effect.

Along with the miniaturization of communication devices, miniaturization of communication modules used for Bluetooth and the like incorporated in the communication devices is also required. Generally, a communication module has a structure in which an upper surface of a wiring board is used as a surface on which an electronic component is mounted in order to reduce the size, and the electronic component is mounted on the upper surface of the wiring board.
A conventional communication module includes an integrated circuit element and a crystal resonator mounted on a wiring board, and the integrated circuit element is sealed or molded, or a part is covered with a lid, and is housed in the lid. There is a structure. (See Patent Document 1)

In addition, the applicant has not found any prior art documents related to the present invention by the time of the filing of the application other than the prior art documents specified by the prior art document information described above. .

However, in the conventional communication module, as the communication device is reduced in size, the communication module is required to be reduced in size and height. However, since a recess for mounting the crystal resonator element is required, the communication module is no longer installed. There was a drawback that it was not possible to reduce the size and height.
Further, when the crystal resonator element is mounted on the wiring board, there is a drawback that a lid for hermetically sealing the crystal resonator element is displaced at the time of bonding and contacts the integrated circuit element.

  In view of the above problems, an object of the present invention is to provide a communication module that can reduce the size, height, and cost of the communication module.

  A communication module according to the present invention includes an integrated circuit element mounted on a wiring board and a piezoelectric vibration element connected to the integrated circuit element. Is characterized in that a column member is provided.

  The communication module according to the present invention is characterized in that a lid is disposed so as to cover the piezoelectric vibration element.

  Furthermore, the communication module of the present invention is characterized in that the pillar member is connected to a ground terminal.

  Furthermore, in the communication module of the present invention, the integrated circuit element and the piezoelectric vibration element are covered with an insulating resin, a conductive resin layer is formed on the surface of the insulating resin, and the conductive resin layer is connected to the column member. It is characterized by being connected.

  According to the communication module of the present invention, the pillar member is provided on the outer periphery on which the piezoelectric vibration element is mounted, so that the pillar member for hermetically sealing the piezoelectric vibration element is displaced even when it is joined. By making contact with the integrated circuit element, the integrated circuit element is not contacted, and a stable output can be supplied.

  Further, according to the communication module of the present invention, since the pillar member is connected to the ground terminal, the piezoelectric vibration element is surrounded by the ground terminal, and the influence of external noise and the like can be reduced. Become.

  According to the communication module of the present invention, the integrated circuit element and the piezoelectric vibration element are covered with an insulating resin, a conductive resin layer is formed on the surface of the insulating resin, and the conductive resin layer is the column member. The integrated circuit element and the piezoelectric vibration element that are mounted are completely covered with the wiring board, the insulating resin layer, and the conductive resin layer, so that high-accuracy and reliable insulation and shielding are achieved. Since the effect and high-density mounting can be made possible, it is possible to effectively prevent the influence of an external electromagnetic field or static electricity.

  FIG. 1 is an exploded perspective view illustrating a communication module according to an embodiment of the present invention, and FIG. 2 is an external perspective view of the communication module according to the present invention. FIG. 3 is a cross-sectional view of the communication module according to the present invention. Further, in the drawing, there is a gap between the column member 5 and the lid 4, but the gap between the column member 5 and the lid 4 is actually small. As shown in the figure, the communication module according to the embodiment of the present invention includes a wiring board 1 on which a wiring pattern is formed, an integrated circuit element 2 on the component mounting surface (one main surface: upper surface) of the wiring board 1 and The piezoelectric vibration element 3 is mounted and a lid 4 for hermetically sealing the piezoelectric vibration element 3 is disposed. A column member 5 is disposed on the outer periphery of the piezoelectric vibration element. Further, the insulating resin layer 6 formed on the upper surface of the wiring substrate 1 so as to cover the integrated circuit element 2 and the piezoelectric vibration element 3, and the influence from static electricity and electromagnetic field formed on the surface of the insulating resin layer 6. And a conductive resin layer 7 that shields and shields.

Referring to FIGS. 1 and 2, FIG. 1 is an exploded perspective view. As a material of the insulating layer constituting the wiring board 1 described above, for example, a ceramic material such as glass ceramics is used. The thickness is set to, for example, 50 μm to 300 μm.
When the insulating layer is made of a ceramic material, the wiring board 1 is formed by laminating a plurality of ceramic green sheets obtained by adding and mixing a suitable organic solvent, organic solvent, etc. to the ceramic raw material powder. It is manufactured by press-molding and then firing the laminate at a high temperature and processing the outer shape.

Moreover, as a material of the wiring pattern and via-hole conductor provided in the wiring substrate 1, for example, a conductive material mainly composed of silver is preferably used, and the thickness of each wiring is set to 5 μm to 20 μm, for example. The
On the other hand, on the upper surface of the wiring board 1, connection pads connected to the wiring pattern, surface wiring (not shown), and the like are formed.
The wiring patterns and connection pads are, for example, a conductive paste containing Ag-based powder such as Ag, Ag-Pd, Ag-Pt, borosilicate-based low melting point glass frit, organic binder such as ethyl cellulose, organic solvent, etc. Is formed on a ceramic green sheet corresponding to the uppermost layer of the wiring substrate 1 by screen printing or the like, and is fired.

On the surface of the wiring substrate 1, a mounting electrode 8 for mounting the integrated circuit element 2 and the piezoelectric vibration element 3 is provided.
The mounting electrode 8 of the wiring board 1 and the excitation electrodes of the integrated circuit element 2 and the piezoelectric vibration element 3 are connected by solder and a conductive adhesive.
An inner layer pattern is provided inside the wiring board 1 on which the integrated circuit element 2 and the piezoelectric vibration element 3 are mounted, and a ground electrode disposed in the center is provided on the back surface of the wiring board 1. Yes. A wiring pattern provided on the front surface of the wiring substrate 1 and the ground electrode provided on the back surface of the wiring substrate 1 are electrically connected to each other through the inner layer pattern.

  The integrated circuit element 2 includes an RF portion, a baseband portion, and a rewritable storage medium such as a flash memory, and writes RF performance information such as a Bluetooth device (BD) address, transmission power, and frequency to the flash memory. The RF performance in the RF is adjusted based on the written registry information.

The quartz resonator element 3 is formed by attaching and forming a pair of excitation electrodes on both main surfaces of a quartz piece cut along a predetermined crystal axis, and an external voltage is applied to the quartz piece via the pair of excitation electrodes. Then, a thickness shear vibration is caused at a predetermined frequency.
Such a quartz-crystal vibrating element 3 is obtained by electrically and mechanically connecting the excitation electrodes attached to both main surfaces thereof and the corresponding mounting electrodes 8 on the upper surface of the wiring board via a conductive adhesive. Mounted on the wiring board 1. 2A is an external perspective view of FIG. 2A before the cover 4 is put on the communication module, and FIG. 2B is an external perspective view showing the concept of the cover 4 being put on.

  As shown in FIG. 3, for example, the pillar member 5 is made of metal, disposed on the wiring board, and connected to a ground electrode provided on the lower surface of the wiring board 1. By disposing the column member 5 on the outer periphery of the conductor layer 9 in this way, the lid 4 for hermetically sealing the crystal resonator element 3 comes into contact with the column member 5 even if it is displaced during bonding, Contact with the integrated circuit element 2 is eliminated, and a stable output can be supplied. In addition, since the column member 5 is connected to the ground terminal, the crystal resonator element 3 is surrounded by the column member 5 having the ground potential, so that the influence of external noise and the like can be reduced. It becomes possible.

  Further, the lid 4 is manufactured by adopting a conventionally known metal processing method, and molding a metal such as 42 alloy into a predetermined shape, and a nickel (Ni) layer is formed on the upper surface of the lid 4. Further, a gold tin (Au—Sn) layer as the sealing material 10 is formed at a position corresponding to the conductor layer 9 on the upper surface of the nickel (Ni) layer. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing material 10 can relieve unevenness of the conductor layer 9 and prevent a decrease in hermeticity. Moreover, when the sealing material 10 is too thin, the said function is not fully exhibited.

The insulating resin layer 6 is formed, for example, in a substantially rectangular shape, and is formed by vacuum printing a mixture of an epoxy resin and a curing agent.
The insulating resin layer 6 is formed so as to cover the entire surface of the integrated circuit element 2 and the crystal resonator element 3 on the wiring substrate 1.

In addition, the conductive resin layer 7 causes a reduction reaction by throwing a metal ion solution of silver (Ag), copper (Cu), nickel (Ni), palladium (Pd) into hydrogen gas or phosphorus or the like, After that, the reaction is promoted by heating by combustion, and a metal colloid is prepared using a method in which the generated metal colloid is received in a liquid dispersion medium, a method in which the metal ion solution is reduced in the liquid dispersion medium, or the like. It is formed by dispersing in an epoxy together with an organic solvent.
Thus, by attaching the conductive resin layer 7 to the upper surface of the insulating resin layer 6 and the column member, the electromagnetic wave does not easily enter the circuit wiring constituting the oscillation circuit and the amplification circuit in the integrated circuit element. The operation of the communication module can be stabilized.

  In addition, a radio wave absorber layer may be used instead of the conductive resin layer 7, and the radio wave absorber layer is composed of a mixture of magnetic powder particles and a medium such as an organic binder that disperses and bonds the particles. The mixture is used to cover an electromagnetic wave radiating portion such as an electronic component to prevent electromagnetic interference. As the magnetic particles constituting the radio wave absorber of such a radio wave absorber, MnZn ferrite, NiZn ferrite, or FeSi or FeSiAl-based flat metal soft magnetic particles are used.

  In the present embodiment, the column member 5 is described. However, it is needless to say that the column member 5 can be formed of solder bumps, gold bumps, conductive adhesive, or the like to achieve the same effect. . Further, the number of the column members 5 is not limited, and the column members 5 may be continuously arranged.

It is a disassembled perspective view which shows the structure of the communication module in embodiment of this invention. (A) And (b) is an external appearance perspective view which shows the structure of the communication module in embodiment of invention. It is sectional drawing which shows the structure of the communication module in embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Integrated circuit element 3 ... Quartz vibration element 4 ... Lid body 5 ... Column member 6 ... Insulating resin layer 7 ... Conductive resin layer 8. ..Mounting electrode 9 ... conductor layer 10 ... sealing material

Claims (4)

In a communication module in which an integrated circuit element is mounted on a wiring board, and a piezoelectric vibration element connected to the integrated circuit element is mounted,
A communication module, wherein a column member is provided on an outer periphery of a position where the piezoelectric vibration element is mounted. The communication module according to claim 1, wherein a lid is disposed so as to cover the piezoelectric vibration element. The communication module according to claim 1, wherein the column member is connected to a ground terminal. The integrated circuit element and the piezoelectric vibration element are covered with an insulating resin, a conductive resin layer is formed on the surface of the insulating resin, and the conductive resin layer is connected to the column member. The communication module according to claim 1.

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