JP2007122544A - Substrate rotating mechanism and substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate rotating mechanism suitably used for adjustment of in-plane inclination of a substrate 12 placed on a linearly moving table or the like, in which reduction in weight or increase in positioning accuracy is facilitated. <P>SOLUTION: This mechanism comprises two fixed positioning pins 15 and 16 and a movable positioning pin 17 abutting on the edge of the substrate 12 which are provided on the table for placing the substrate 12, and pushers 18-20 pressing the edge of the substrate 12 to allow the substrate 12 to abut on each pin 15-17. The movable positioning pin 17 is driven to adjust its position, whereby the in-plane inclination of the substrate 12 is adjusted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mechanism for rotating a substrate placed on a substrate placement surface by a minute angle within the surface or a substrate processing apparatus provided with such a substrate rotation mechanism.

When a substrate is placed on a table and processing is performed on the substrate, the substrate is generally placed on a rotary stage (θ stage) when the substrate is rotated in the plane and the orientation of the substrate is adjusted. Done. For example, Patent Document 1 describes that a θ stage is provided on an XY stage, and a workpiece is placed thereon to expose the workpiece.
JP-A-10-105242

  If a rotary stage is mounted on a linear motion stage such as an XY stage or a uniaxial motion stage, the mass of the movable part of the linear motion stage increases, which is disadvantageous for speeding up the linear motion and improving the accuracy of the amount of movement. In addition, a slight displacement or deformation in the rotating part due to the acceleration applied to the rotating stage during the movement of the linear moving stage is an error in the amount of linear movement of the substrate placed on the rotating stage.

  An object of the present invention is to provide a substrate rotation mechanism that is suitable for applications such as adjusting the in-plane inclination of a substrate placed on a linear motion stage and that is easy to reduce the weight and increase the accuracy of positioning. To do.

  (1) The substrate rotation mechanism according to the present invention includes a substrate placement surface, a positioning portion that is provided on the substrate placement surface and contacts the three locations of the substrate to position the substrate, A pressing portion that presses the substrate so as to contact the three locations; and a drive mechanism that displaces at least one of the three locations that contact the substrate of the positioning portion in a direction in which the inclination in the plane of the substrate is changed. I have.

  The “pressing portion” may be one that presses the substrate and releases the pressing, or may change the pressing force. In this case, the substrate is brought into contact with three positions of the positioning portion. It is preferable to allow the displacement by reducing the pressing force when at least one of the three positions of the positioning portion is displaced in the direction of changing the inclination in the plane of the substrate as compared with the pressing force at that time.

  The contact position of the “positioning portion” with the substrate other than the contact position with the substrate directly driven by the drive mechanism may be passively displaceable with the displacement of the substrate due to the action of the drive mechanism. . At this time, it is preferable that the passively displaced contact portion is displaced while pressing the substrate. This configuration makes it easy to cause the substrate to be displaced close to a rotational movement with the vicinity of the center as the center of rotation.

  According to the rotating mechanism of the present invention, the in-plane inclination of the substrate can be changed. Moreover, it is easy to reduce the weight of the rotation mechanism and increase the accuracy of positioning compared to the case of using a rotation stage.

  (2) A substrate processing apparatus according to the present invention includes a table having the substrate rotation mechanism according to (1), a camera that images the substrate placed on the table from above the table, and an image captured by the camera. And a control device that determines a driving amount of the driving mechanism by processing an image of the substrate.

  Here, the substrate processing apparatus widely includes a position measuring device, a dimension measuring device, an exposure device, a processing device, and the like for the substrate. The processing apparatus includes, for example, an apparatus that repairs a pattern provided on the substrate by irradiating the substrate with laser light.

  The camera may be dedicated for determining the drive amount of the drive mechanism, or may be used for other purposes such as inspection of the substrate.

  The camera may be fixed to a table, or may be fixed to a table base when the table is movable. The camera may be movable relative to the table or, if present, the table base.

  According to the substrate processing apparatus of the present invention, the in-plane inclination of the substrate can be controlled. Moreover, it is easy to reduce the weight of the rotation mechanism and increase the accuracy of positioning compared to the case of using a rotation stage. Therefore, when the table is made movable, it is advantageous for speeding up and improving the accuracy of table movement.

  According to the present invention, the in-plane inclination of the substrate can be changed. Moreover, it is easy to reduce the weight of the rotation mechanism and increase the accuracy of positioning compared to the case of using a rotation stage.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a position measuring system as a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the position measuring apparatus.

  As shown in FIG. 1, the position measurement system of this embodiment includes a position measurement device 1 and a control device 2 connected to the position measurement device 1 so as to be able to transmit information to each other. A computer that executes a control program for controlling the position measuring apparatus 1 is incorporated.

  The position measuring device 1 includes a base 3 made of stone such as granite, a table 5 movable along a pair of guide rails 4 installed on the base 3, and the base 3 in a form straddling the table 5. A gate-type gantry 6 installed at a fixed position, a plurality of camera movement mechanisms (not shown) provided in the gantry 6, and a plurality of cameras (three in this embodiment) supported by each camera movement mechanism A to C are provided.

  The rectangular plate-like table 5 can be moved in the y direction (left and right direction in FIG. 2) by a drive mechanism such as a linear motor (not shown). Each of the cameras A to C can be moved independently of each other in the x direction by each camera moving mechanism having an x direction (vertical direction in FIG. 2) orthogonal to the y direction as a movable direction.

  On the base 3, a linear scale 10 extending along the y direction, which is the moving direction of the table 5, is provided. On the table 5, an encoder head (not shown) that moves integrally with the table 5 is installed. The linear scale 10 and the encoder head constitute a linear encoder that measures the amount of movement of the table 5 in the y direction.

  Two linear scales 10 and two encoder heads are provided to form two linear encoders, and each linear encoder measures the amount of movement of the table 5 on the near side and the far side in FIG.

  Each encoder head includes a light projecting unit and a light receiving unit. The light receiving unit receives reflected light that is emitted from the light projecting unit and modulated by the linear scale 10. A pulse signal can be obtained. In addition, since an origin pattern is provided at one location of each linear scale 10, an origin signal at the table position can be obtained. The two linear scales 10 are provided to correct an error in the amount of table movement caused by yawing (rotation in the horizontal plane) of the posture of the table 5.

  Instead of the linear encoder, a laser interferometer or other various known movement amount measuring devices can be used.

  The table 5 is made of stone such as granite like the base 3, and the upper surface thereof is used as a substrate mounting surface, and the substrate 12 to be measured is mounted thereon.

  The table 5 is provided with two first and second fixed positioning pins 15 and 16 and one movable positioning pin 17, and these positioning pins 15 to 17 correspond to the positioning portion of the substrate.

  Each positioning pin 15 to 17 has a cylindrical shape and protrudes from the upper surface of the table 5 which is a substrate mounting surface, and its side surface abuts on the edge of the substrate 12. The first fixed positioning pin 15 is provided at a position in contact with substantially the center of the first side (the left side in FIG. 2) of the substrate 12. The second fixed positioning pin 16 is provided at a position in contact with a location near the first side in the second side (lower side in FIG. 2) adjacent to the first side of the substrate 12. The movable positioning pin 17 is provided at a position where the movable positioning pin 17 is in contact with a location far from the first side of the second side of the substrate 12. The first and second fixed positioning pins 15 and 16 are fixed to the table 5. The movable positioning pin 17 will be described later with reference to FIG.

  Instead of abutting these positioning pins 15 to 17 on the edge of the substrate 12, holes are provided in the substrate 12, and these positioning pins are inserted into the holes so that the pins abut on the inner surface of the hole. Good. However, the hole corresponding to the fixed positioning pin must be sized so that the inclination of the substrate 12 can be adjusted.

  The table 5 is provided with first to third pushers 18 to 20 as pressing portions that press the substrate 12 at three positions facing the positioning pins 15 to 17 with the substrate 12 interposed therebetween. Each of the pushers 18 to 20 has a piston-cylinder structure driven by air pressure, and the cylinder part is fixed to the table 5 so that the piston part pushes the edge of the substrate 12.

  The arrangement of the fixed positioning pins 15 and 16, the movable positioning pins 17, and the pushers 18 to 20 is not limited to this, and may be any arrangement that can change the in-plane inclination of the substrate. The number of pushers can be more or less than three.

  Two movable positioning pins (in this case, one fixed positioning pin) or three movable positioning pins (in this case, no fixed positioning pin is provided) may be used. When a plurality of movable positioning pins are provided, for example, there are few translational movement components (non-rotational movement components), and the substrate can be displaced such that the vicinity of the center of the substrate is the center of rotation.

  Further, instead of the first and second fixed positioning pins 15 and 16, the first and second pushers having a pressing force stronger than the pushers 18 to 20 used as the pressing portions may be used as the substrate positioning portions. it can. For example, the pressing force of the pushers 18 to 20 is 1 kgf, and the pressing force of the first and second pushers used as the positioning portions is 2 kgf. If it does in this way, since the 1st, 2nd pusher will hardly move only by pushing only with the pressing force of the pushers 18-20, it can fulfill | perform the function as a positioning part. However, when the movable positioning pin 17 is displaced, the first and second pushers are also passively slightly displaced due to the effect of friction between the table 5 and the substrate 12. It was found that No. 12 has a displacement close to a rotational movement with the translational component being small and the vicinity of the center of the substrate 12 being the center of rotation. According to such a manner of displacement of the substrate 12, the surface of the substrate 12 is hardly damaged because the sliding movement amount with respect to the table 5 is small. The first and second pushers used as the positioning unit can set a state in which the movable unit is extended most as a reference state for positioning. In this case, the contact portion with the substrate 12 can be displaced only in the direction in which the movable portion of the pusher is pushed. On the other hand, the first and second pushers can set the reference state for positioning to the state where the movable part is most retracted. In this case, the contact point with the substrate 12 can be displaced only in the direction of being pushed out by the movable portion of the pusher. The neutral position of the movable part of the first and second pushers can also be set as a positioning reference state. In this case, the contact portion with the substrate 12 can be displaced in any of the movable directions of the pusher. These reference states of the first and second pushers may be arbitrarily combined.

  The table 5 is provided with suction holes for sucking air from under the substrate 12 to bring the substrate 12 into close contact with the table 5.

  Further, a reference scale 13 extending in the x direction perpendicular to the moving direction (y direction) of the table 5 is installed near one end (the left end in the figure) on the table 5. Information about the position of the visual field of each of the cameras A to C is given in the captured image when the images are captured by .about.C.

  The substrate 12 is, for example, a glass substrate for a liquid crystal panel, and has a size of 730 mm in the x direction and 920 mm in the y direction. A wiring pattern and a reference mark (not shown) are formed on the substrate 12 by etching the metal film. The cross marks P, Q, R, and S in FIG. 2 are reference marks. Position measurement with an accuracy of ± 0.5 μm over the entire area of the substrate 12 is required.

  Each camera moving mechanism built in the gantry 6 moves each camera A to C that images the substrate 12 placed on the table 5 in the x direction. This camera moving mechanism is provided with a linear encoder, and each camera A to C is moved to the x coordinate commanded from the control device 2 while measuring the amount of movement of each camera A to C in the x direction with this linear encoder. Let Since the error of the camera movement amount is corrected by imaging of the reference scale 13, there is no problem even if the linear encoder has a coarse resolution of about 1 μm, for example.

  Each of the cameras A to C has a configuration having an objective lens like a microscope, and includes a two-dimensional CCD image sensor. The imaging magnification can be changed by exchanging the objective lens. The field of view on the substrate 12 when the magnification is highest is 144 μm in the x direction and 110 μm in the y direction in FIG.

  The first and second fixed cameras D and E for imaging the reference marks P and Q on the substrate 12 are fixed to the base 3 and are on the substrate 12 when the table 5 is at a specific position. The reference mark P is provided at a position where the first fixed camera D and the reference mark Q can be simultaneously imaged by the second fixed camera E. Each of the fixed cameras D and E is also configured to have an objective lens like a microscope, and includes a two-dimensional CCD image sensor. The imaging magnification can be changed by exchanging the objective lens.

  The first and second fixed cameras D and E may be fixed to the table 5 instead of being fixed to the base 3 and may be provided at positions where the reference marks P and Q can always be imaged.

  The control device 2 includes a keyboard and a display, and sends a command to the position measurement device 1 in real time, observes an image captured by the position measurement device 1, and controls a program for controlling the position measurement device 1. You can enter. The program for controlling the position measurement device 1 can also be downloaded from the outside via a network.

  The control device 2 processes the images captured by the first and second fixed cameras D and E, determines the driving amount of the movable positioning pin 17, and controls the driving of the movable positioning pin 17.

  3 is an enlarged view of a part of the reference scale 13 in FIG. 2. The x direction (vertical direction) in FIG. 2 corresponds to the vertical direction in FIG. 3, and the y direction (horizontal direction) in FIG. ) Corresponds to the horizontal direction in FIG.

  The reference scale 13 is made of glass such as soda glass. In this embodiment, a repetitive pattern having a period of 100 μm is formed in the x direction (vertical direction). This repetitive pattern is a pattern in which a cross pattern is arranged at the center of a horizontally long rectangular pattern so as to connect the upper and lower sides without connecting the left and right sides of the rectangular pattern.

  This rectangular pattern has a length in the x direction (up and down direction) of 100 μm, a length in the y direction (left and right direction) of 200 μm, and the length of the central cross pattern in the y direction (left and right direction) is 100 μm. The line width of each line constituting the pattern is 10 μm.

  The variation in the position of the visual field of the cameras A to C caused by the movement amount error of the cameras A to C and the posture variation of the cameras A to C is made to be sufficiently smaller than 100 μm due to mechanical accuracy. Therefore, by using the command value or measurement value of the camera position in the x direction, it is not indefinite which pattern of the reference scale 13 is being viewed. The x coordinate in the coordinate system with reference to the table 5 of the pattern of the reference scale 13 can be known, and the x coordinate of the center of the visual field in the coordinate system with reference to the table 5 can be known from the x coordinate of this pattern.

  Since the fluctuation of the visual field in the y direction is also sufficiently smaller than 100 μm, if the table 5 is moved to a predetermined position, the reference scale 13 can be surely placed in the visual field of the cameras A to C, and the captured image of the reference scale 13 is captured. Thus, the y coordinate of the center of the visual field at this time can be known.

  It should be noted that information on the coordinates of the location is added to the pattern of the reference scale 13 in the form of a numeral or a figure at an interval such that at least one enters the field of view of the cameras A to C, and coordinate values are obtained from the captured images. May be read directly. Then, the coordinates of the visual field center can be obtained from only the captured image without using the command value and measurement value of the camera position and table position.

  4A, 4B, and 4C show three embodiments of the drive mechanism for the movable positioning pin 17. FIG. All the drive mechanisms are provided under the substrate placement surface of the table 5, and all the drawings are driven through the substrate placement surface from above the substrate placement surface (with the substrate placement surface removed). It looks at the mechanism. The movable positioning pin 17 protrudes from the long holes 21 and 22 or the circular hole 23 provided on the substrate mounting surface onto the substrate mounting surface.

  In the drive mechanism shown in FIG. 5A, a worm gear 24 coupled to a motor (not shown) is rotated to rotate a gear 25 and a feed screw 26 integrated with the gear 25. The feed screw 26 is screwed into the base of the movable positioning pin 17, and when the feed screw 26 rotates, the movable positioning pin 17 moves in the direction of the arrow.

  In the drive mechanism of FIG. 6B, one end (lower end in the figure) of the laminated piezoelectric element 27 is fixed, and the other end is connected to the base of the movable positioning pin 17. When a voltage is applied to the laminated piezoelectric element 27 and the laminated piezoelectric element 27 expands and contracts, the movable positioning pin 17 moves in the direction of the arrow.

  In the drive mechanism shown in FIG. 2C, a worm gear 28 coupled to a motor (not shown) is rotated to rotate a gear 29 and a movable positioning pin 17 which is an eccentric pin integrated with the gear 29. When the movable positioning pin 17, which is an eccentric pin, rotates around the rotation shaft 30, the substrate 12 in the vicinity of the portion in contact with the movable positioning pin 17 moves in the vertical direction in the figure.

  FIG. 5 shows a state where the table 5 is moved to a predetermined position and the reference mark P is in the field of view Vd of the first fixed camera D and the reference mark Q is in the field of view Ve of the second fixed camera E.

  At the initial movable positioning pin position, that is, at the initial substrate position, each side of the substrate 12 is parallel or perpendicular to the moving direction of the table 5. However, in the illustrated example, since the pattern on the substrate including the reference mark is provided so as to be rotationally shifted with respect to the outer shape of the substrate 12, the straight line connecting the centers of the reference marks P and Q indicated by broken lines is a table. 5 is no longer parallel to the direction of movement.

  The difference between the x coordinate of the center of the reference mark P imaged by the first fixed camera D and the x coordinate of the center of the reference mark Q imaged by the second fixed camera E is obtained and set as Δx.

  The movable positioning pin 17 is moved downward in the figure by the driving amount Δx ′ so that the x coordinates of both marks are the same as the reference marks P and Q indicated by solid lines. Then, the orthogonal coordinate axis direction of the pattern assumed at the time of pattern design is parallel or perpendicular to the moving direction of the table 5.

  The correct value of the drive amount Δx ′ that makes the x coordinates of the reference marks P and Q the same is generally not exactly equal to Δx but is close to Δx. Therefore, the value of Δx is used as it is as the value of Δx ′. Also good. Alternatively, geometric calculation is performed based on the shape of the substrate, the position of the reference mark, and the positions of the two fixed positioning pins 15, 16 and the movable positioning pin 17, and a correct Δx ′ value is obtained from Δx. You may use it.

  FIG. 6 is a flowchart showing the procedure of the correction process of the tilt (rotational deviation) of the substrate.

  First, the edge of the substrate 12 placed on the substrate placement surface of the table 5 is pressed with the first to third pushers 18 to 20, and the edge of the substrate 12 is moved to the first and second fixed positioning pins. The substrate is positioned by contacting the movable positioning pins 15 and 16 and the initial position of the movable positioning pin 17 (step n1).

  When the substrate 12 is placed on the table 5, the table 5 is in a position where the reference marks P and Q of the placed substrate 12 can be imaged by the first and second fixed cameras D and E, respectively. The fiducial marks P and Q are imaged by the fixed cameras D and E, respectively (steps n2 and n3).

  Next, the inclination of the substrate 12, for example, the x coordinate of the center of the reference mark P imaged by the first fixed camera D and the reference mark Q imaged by the second fixed camera E as shown in FIG. The difference between the center x-coordinate is obtained and the substrate inclination Δx is calculated, and further, the correction amount of the substrate inclination, that is, Δx ′ for making the x-coordinates of the reference marks P and Q the same is calculated (step n4). . As described above, Δx may be used as it is as the correction amount Δx ′.

  Next, it is determined whether or not the inclination of the substrate calculated in step n4 is less than or equal to an allowable value (step n5). When the inclination of the substrate is not less than the allowable value, the pressing by the first to third pushers 18 to 20 is released to release the positioning (step n6), and the movable positioning pin 17 is used with the correction amount Δx ′ calculated in the step n4. To correct the position of the movable positioning pin 17 (step n7) and return to step n1. In step n1, the edge of the substrate 12 is pressed again with the first to third pushers 18 to 20, and the edge of the substrate 12 is moved to the first and second fixed positioning pins 15 and 16 and the position-corrected movable. The substrate is positioned by contacting the positioning pins 17.

  In this manner, the imaging of the reference marks P and Q by the first and second fixed cameras D and E and the driving of the movable positioning pin 17 are repeated until the inclination of the substrate 12 becomes less than the allowable value. Note that the reference marks P and Q may be imaged by the first and second fixed cameras D and E and the movable positioning pin 17 may be driven a predetermined number of times.

  Instead of using the fixed cameras D and E, the reference marks P and Q may be imaged using any of the movable cameras A, B, and C provided on the gantry 6. In this case, first, one of the reference marks P and Q is imaged, and then the table 5 is moved to image the other mark. The camera used at this time is configured not to move on the gantry 6 from when one of the reference marks P and Q is imaged until the other is imaged.

  7 and 8 are diagrams illustrating a situation in which position measurement is performed using the position measurement apparatus of the present embodiment.

  Taking the position measurement of the reference marks S and Q as an example, first, as shown in FIG. 7, the table 5 is moved so that the reference mark S enters the field of view of the camera A and the reference mark Q enters the field of view of the camera C. Then, images are taken by the camera A and the camera C. Next, as shown in FIG. 8, the table 5 is moved so that the reference scale 13 enters the visual field of the camera A and the camera C, and the reference scale 13 is imaged by the camera A and the camera C.

  From the image of the reference scale 13 imaged as described above, the reference scale 13 at the center of the field of view of each of the cameras A and C when the reference scale is imaged is used as a reference (for example, the lower end center of the reference scale 13 is used as the origin) Coordinates can be obtained. Further, the coordinates of the center of the reference mark S (hereinafter referred to as the point S) based on the field of view of the camera A (for example, with the center of the field of view of the camera A as the origin) are obtained from the image of the reference mark S captured by the camera A. Can do. Since the camera A does not move relative to the base 3 when the reference mark S is imaged and when the reference scale is imaged, the x coordinate of the point S with the reference scale 13 as a reference can be obtained from the above information. Further, by adding information on the movement amount of the table 5 separately measured using a linear encoder, the y coordinate of the point S with the reference scale 13 as a reference can be obtained. Similarly, the x-coordinate and y-coordinate of the center (hereinafter referred to as point Q) of the reference mark Q with reference to the reference scale 13 can be obtained using the image captured by the camera C. Then, the distance between the point S and the point Q can be obtained, and a dimensional inspection can be performed in which this is compared with the design value.

  If the reference mark P is imaged by the camera C according to the same procedure, the coordinates of the center of the reference mark P (hereinafter referred to as point P) with reference to the reference scale 13 can be obtained. You can also find the distance between them.

  Furthermore, the degree of orthogonality between the straight line connecting the point S and the point Q and the straight line connecting the point P and the point Q can also be inspected.

  Since the cameras A, B, and C are movable in the x direction, position measurement can be performed by the same procedure for arbitrary feature points (such as the center and corner of the figure) of the pattern on the substrate. In the case where there are three cameras as described above, since three points can be imaged at the same time, position measurement can be performed efficiently with a small number of table movements.

  By the way, if the pattern on the substrate is inclined in the plane, for example, a situation may occur in which the reference mark S and the reference mark Q that should originally be simultaneously captured by the cameras A and C cannot be captured simultaneously. If cameras A, B, and C have a high imaging magnification and a narrow field of view in order to improve measurement accuracy, such a situation is more likely to occur. In this case, the table 5 must be moved between the imaging of the reference mark S and the imaging of the reference mark Q, and the measurement efficiency is significantly deteriorated.

  However, according to the present embodiment, since the in-plane inclination of the substrate 12 can be adjusted in advance by driving the movable positioning pin 17, efficient position measurement by the cameras A, B, and C can be performed. Can do.

  When the movable positioning pin 17 is driven to adjust the in-plane inclination of the substrate 12, for example, when one of the cameras A, B, and C tries to image one of the reference marks, the target reference mark is surely Since it is sufficient that the image can be adjusted with an accuracy enough to enter the field of view, the imaging magnification of the fixed cameras D and E can be lower than that of the movable cameras A, B, and C. In addition, the wider the field of view of the fixed cameras D and E, the larger the allowable range of initial positional deviation, so the imaging magnification of the fixed cameras D and E is preferably lower than the imaging magnification of the movable cameras A, B and C. .

  The present invention is useful as an apparatus for performing a process on a substrate such as a dimensional inspection of the substrate.

It is a perspective view showing a schematic structure of a position measuring system concerning one embodiment of the present invention. It is a top view of the position measuring apparatus of FIG. It is an enlarged view of a reference scale. It is a figure which shows the drive mechanism of a movable positioning pin. It is a figure for demonstrating correction | amendment of the inclination of a board | substrate. It is a flowchart which shows the process sequence of board | substrate inclination correction. It is a top view of the position measuring apparatus which shows the state which images the points S and Q with the cameras A and C. It is a top view of the position measuring device which shows the state which images a reference scale with cameras A and C.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Position measuring device 5 Table 12 Board | substrate 13 Reference | standard scale 15,16 Fixed positioning pin 17 Movable positioning pin 18-20 Pusher

Claims (2)

A substrate mounting surface;
A positioning portion that is provided on the substrate mounting surface and contacts the three locations of the substrate to position the substrate;
A pressing portion that presses the substrate so that the substrate contacts three locations of the positioning portion;
A drive mechanism for displacing at least one of the three locations in contact with the substrate of the positioning portion in a direction to change the inclination in the plane of the substrate;
A substrate rotation mechanism comprising: A table comprising the substrate rotation mechanism according to claim 1;
A camera that images the substrate placed on the table from above the table;
A substrate processing apparatus comprising: a control device that determines a driving amount of the driving mechanism by processing an image of the substrate picked up by the camera.

Images