JP2007116015A - Electronic equipment - Google Patents

Abstract

In an electronic device in which an electronic component is disposed in the vicinity of a semiconductor device in order to improve EMC (Electromagnetic Compatibility) resistance, a chip-type electronic component is conventionally mounted on a land of a lead frame and soldered. In order to solve the problem that the size of the electronic device becomes large and the soldering portion is damaged depending on the step difference of the land of the lead frame, an electronic device that is compact and does not cause damage is provided.
A chip-type electronic component installed on a substrate is mounted on a semiconductor device, molded together with a lead terminal, the semiconductor device is connected to the lead terminal, and the chip-type electronic component is connected via a connection point of the substrate. Connect to lead terminal and ground.
[Selection] Figure 1

Description

  The present invention relates to an electronic device in which a chip-type electronic component for improving EMC (Electromagnetic Compatibility) resistance is arranged on an upper part of a semiconductor device, and in particular, noise reduction in a voltage regulator or the like of a rotating electrical machine for a vehicle. The present invention relates to an electronic device provided with an indispensable semiconductor device.

  Conventionally, in order to mount a chip-type electronic component on a semiconductor device, it has been shown that a land is formed on a part of a lead frame, and the chip-type electronic component is mounted and soldered (for example, Patent Document 1). ).

Japanese Unexamined Patent Publication No. 07-245377 (FIG. 1)

  The device disclosed in Patent Document 1 requires a region on which a chip-type electronic component is placed on a lead frame, so that the size of the device itself is increased. In addition, there is a problem such as the occurrence of damage to the soldered portion of the electronic component due to the deflection of the lead frame.

  The present invention has been made in order to solve the above-described problems. A chip-type electronic component placed on a substrate is mounted on a semiconductor device, and the semiconductor device is mounted on a lead terminal. The component is connected to the lead terminal and the ground via the connection point provided on the board, so that the chip-type electronic component can be mounted stably, the electronic device package can be downsized, and the noise prevention characteristics can be achieved. It is an improvement.

  An electronic device according to the present invention is an electronic device in which chip-type electronic components installed on a substrate are mounted on a semiconductor device and molded together with a lead terminal that transmits a signal. The semiconductor device is a lead terminal. The chip-type electronic component is connected to the lead terminal through a connection point provided on the substrate.

  In the electronic device according to the present invention, a chip-type electronic component installed on a substrate is mounted on a semiconductor device, molded together with a lead terminal, the semiconductor device is connected to the lead terminal, and the chip-type electronic component is connected to the substrate. Since it is connected to the lead terminal and the ground via a connection point provided on the semiconductor device, the package of the electronic device can be reduced in size, the chip electronic component can be stably mounted, and the semiconductor device and the chip electronic component Since these are electrically connected at close locations, the effect of preventing noise to the semiconductor device can be enhanced.

Embodiment 1 FIG.
Hereinafter, the first embodiment will be described with reference to the drawings.
1A is a plan perspective view inside the package of the electronic device 100, and FIG. 1B is a partial side view taken along the line AA in FIG.
As shown in FIG. 1B, a substrate 2 is installed on the upper surface 1 a of the semiconductor device 1, and a land on which a chip-type electronic component 3 such as a ceramic capacitor is provided on the substrate 2. 4 is installed by soldering or the like. On the other hand, a heat spreader 5 that diffuses heat generated by the semiconductor device 1 is provided on the lower surface 1 b of the semiconductor device 1. As shown in FIG. 2, which is an enlarged view of the substrate, the substrate 2 is provided with the land 4 and a plurality of pads 6a and 6b electrically connected to the land 4 through the surface wiring of the substrate 2 or internal pattern wiring. ing.

Three types of bonding wires 7 are connected to the pads 6a and 6b and electrodes (not shown) of the semiconductor device 1.
That is, as shown in FIG. 1, the bonding wire 7a connected to the inner part 8a of the semiconductor device 1 and the lead terminal 8, the bonding wire 7b connected to the pad 6a and the inner part 8a of the lead terminal 8, and the pad 6b And a bonding wire 7c connected to the heat spreader 5 corresponding to the ground.
Thus, since the chip-type electronic component 3 is connected to the semiconductor device 1 by the bonding wire 7b and further connected to the ground by the bonding wire 7c, noise entering the semiconductor device 1 can be prevented. In the first embodiment, the connection with the bonding wire 7 is shown. However, the pad 6a of the substrate 2 and the electrode of the semiconductor device 1 or the lead terminal 8 may be directly electrically connected.

Dotted lines shown in FIGS. 1A and 1B indicate the molding resin exterior 9. The semiconductor device 1, the substrate 2 on which the chip-type electronic component 3 is mounted, and the inner portion 8 a of the lead terminal 8 are molded by the molding resin, and the outer portion 8 b of the lead terminal 8 is exposed from the exterior 9 of the molding resin. ing. In the electronic device 100, the frame 10 is mechanically fastened and fixed to the heat spreader 5 via the crimping portion 11 during the manufacturing process.
The chip-type electronic component 3 is a noise prevention component such as a capacitor provided to prevent noise, and a ceramic capacitor or the like is mounted on the substrate 2. The substrate 2 is a resin substrate based on epoxy or phenol, or a ceramic substrate based on alumina or the like. Although FIG. 1A shows an example in which two chip-type electronic components 3 are provided, the number is not limited to this number.

  In this way, the substrate 2 on which the chip-type electronic component 3 is mounted is arranged on the upper surface 1 a of the semiconductor device 1, and the semiconductor device 1 and the chip-type electronic component 3 are stacked and mounted, thereby mounting the chip-type electronic component 3. Therefore, it is not necessary to provide a space for other parts such as on the lead terminal 8, so that the package of the electronic device 100 can be reduced in size. In addition, since the chip-type electronic component 3 and the semiconductor device 1 are arranged close to each other, there is a further effect in preventing noise.

  In FIG. 1A according to the first embodiment, the bonding wire 7 is connected to the inner portion 8 a of the lead terminal 8. However, as another example, an electrode pad is provided on the semiconductor device 1. May be provided and wire-bonded from the pad 6 a of the substrate 2 to the electrode pad of the semiconductor device 1. By doing so, electronic components can be connected closer to the circuit portion that needs to prevent noise in the semiconductor device 1, and the effect of noise prevention is high.

  Further, in the configuration in which the chip type electronic component shown in the prior art is fixed to the lead terminal portion, depending on the dimensional accuracy of the lead terminal portion, the solder portion of the chip type electronic component may be distorted and a crack may occur. In the first embodiment, since chip-type electronic components are mounted on the semiconductor device 1 via the substrate 2, more stable quality can be ensured for the electronic device 100 with on-vehicle vibration. .

In addition, the heat spreader 5 can diffuse the heat generated by the semiconductor device 1, and the electronic device 100 can be obtained in which a local temperature rise is prevented.
On the other hand, depending on the installation environment of the electronic device 100, when the cooling of the semiconductor device 1 is considered separately, the heat spreader 5 is not necessarily required and may be a resin flat plate or the like.

Embodiment 2. FIG.
Next, the second embodiment will be described with reference to the drawings.
FIG. 3A is a plan perspective view of the inside of the package of the electronic device 100, and is a view of the surface provided with the semiconductor device 1 as viewed from above.
FIG.3 (b) shows the AA arrow partial side view of Fig.3 (a).
FIG. 4 is a back view as viewed in the direction of the arrow B in FIG. In the second embodiment, instead of the heat spreader 5 of the first embodiment, the semiconductor device 1 is mounted on the upper surface 11a of the die pad 11, and the chip type is installed on the substrate 2 on the lower surface 11b of the die pad 11. An electronic component 3 is mounted. The substrate 2 has a configuration in which the same chip type electronic component 3 as that of the first embodiment is mounted on the land 4. Bonding wires 7 for connecting the semiconductor device 1 and the chip-type electronic component 3 are provided on the upper and lower surfaces with the die pad 11 interposed therebetween.

Such a configuration of the second embodiment is effective when the size of the chip-type electronic component 3 on the substrate 2 is larger than the size of the semiconductor device 1. That is, depending on the installation location of the electronic device 100, for example, when it is necessary to provide three chip-type electronic components 3 as shown in FIG. 4 or when the semiconductor device is downsized, the size of the substrate 2 is larger than that of the semiconductor device 1. May grow. Even in such a case, the size of the die pad 11 and the substrate 2 can be appropriately set, and the compact electronic device 100 in which the chip-type electronic component 3 is mounted on the semiconductor device 1 can be obtained. Further, as shown in FIG. 3A, the die pad 11 may adopt a configuration in which lead terminals 8c are formed integrally. With such a configuration, the number of lead terminals 8 which are separate components can be reduced.
Note that the description of the same configuration as that of the first embodiment is omitted.

Embodiment 3 FIG.
Next, Embodiment 3 will be described based on the side view shown in FIG.
In FIG. 3B of the second embodiment described above, the semiconductor device 1 is mounted on the upper surface 11a of the die pad 11, and the chip-type electronic component 3 installed on the substrate 2 is mounted on the lower surface 11b of the die pad 11. Showed things. In the third embodiment, as shown in the side view of FIG. 5, chip-type electronic components are also mounted on the upper surface of the semiconductor device 1 of FIG. That is, the semiconductor device 1 is mounted on the upper surface 11 a of the die pad 11, and the first chip-type electronic component 3 a is mounted on the first substrate 2 a on the upper surface 1 a of the semiconductor device 1 and the die pad 11. On the lower surface 11b, the second chip electronic component 3b is mounted on the second substrate 2b. The loading state of the first and second chip-type electronic components 3a and 3b on the first and second substrates 2a and 2b is the same as in the first and second embodiments. Such a configuration can provide a compact electronic device without increasing the floor area with respect to the electronic device 100 in the case where a large number of chip-type electronic components are required for noise countermeasures.

Embodiment 4 FIG.
Next, a fourth embodiment will be described.
In the first embodiment described above, the electronic device 100 having the configuration of the substrate 2 in which the chip-type electronic component 3 is mounted on the upper surface 1a of the semiconductor device 1 is shown. However, in the fourth embodiment, the semiconductor device 1 not shown in the figure. The first chip type electronic component 3a is mounted on the first substrate 2a on the upper surface 1a of the semiconductor device, and the second chip type electronic component on the second substrate 2b is mounted on the lower surface 1a of the semiconductor device 1. 3b is loaded. Note that the manner of loading the first and second chip-type electronic components 3a and 3b on the first and second substrates 2a and 2b is the same as that of the third embodiment. Such a configuration has the same effect as the third embodiment.

In any of the first to fourth embodiments described above, since the semiconductor device and the electronic component can be arranged close to each other, there is a further effect in noise prevention, and particularly in an electronic device including an in-vehicle semiconductor device. It is effective against this.
In-vehicle semiconductor devices, such as engine rooms where various components are laid out, are required to further improve noise tolerance, as represented by, for example, voltage regulators mounted on in-vehicle rotating electrical machines, Miniaturization is required for each part. On the other hand, the electronic device according to the present invention can provide an extremely useful device that can achieve both of the above.

  Embodiments 1 to 4 of the present invention can be used for an electronic device provided with an electronic component for noise prevention on a semiconductor device, and are particularly effective when used for an electronic device on which an in-vehicle semiconductor device is mounted.

1 is a plan perspective view and a partial side view of an electronic device according to Embodiment 1 of the present invention; It is a board | substrate enlarged view of Embodiment 1 of this invention. It is the plane perspective view and the partial side view of the electronic device of Embodiment 2 of this invention. It is a back surface perspective drawing of the electronic device of Embodiment 2 of this invention. It is a partial side view of the electronic device of Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device, 1a Semiconductor device upper surface, 1b Semiconductor device lower surface,
2, 2a, 2b substrates, 3, 3a, 3b chip-type electronic components, 5 heat spreaders,
8 Lead terminal, 11 Die pad, 11a Die pad top surface,
11b Die pad bottom surface, 100 electronic device.

Claims (5)

A chip-type electronic component installed on a substrate is mounted on a semiconductor device, and is molded with a lead terminal for transmitting a signal, the semiconductor device being connected to the lead terminal, An electronic device, wherein the chip-type electronic component is connected to the lead terminal and the ground through a connection point provided on the substrate. A semiconductor device is mounted on the upper surface of the die pad, a chip-type electronic component placed on the substrate is mounted on the lower surface of the die pad, and is molded with a lead terminal for transmitting a signal, The semiconductor device is connected to the lead terminal, and the chip-type electronic component is connected to the lead terminal and the ground via a connection point provided on the substrate. A semiconductor device is mounted on the upper surface of the die pad, a first chip-type electronic component placed on the first substrate is mounted on the upper surface of the semiconductor device, and a second device is mounted on the lower surface of the die pad. A second chip-type electronic component placed on the substrate is molded and molded together with a lead terminal for transmitting a signal, wherein the semiconductor device is connected to the lead terminal; An electronic device, wherein the first and second chip-type electronic components are connected to the lead terminal and the ground through connection points provided on the first and second substrates, respectively. Chip-type electronic components installed on a substrate are mounted on the upper surface of the semiconductor device, and a heat spreader for diffusing the heat generated by the semiconductor device is provided on the lower surface of the semiconductor device, and molded with lead terminals for transmitting signals. The semiconductor device is connected to the lead terminal, and the chip-type electronic component is connected to the lead terminal and the ground via a connection point provided on the substrate. An electronic device characterized by the above. A first chip type electronic component installed on a first substrate is mounted on the upper surface of the semiconductor device, and a second chip type installed on the second substrate is placed on the lower surface of the semiconductor device. An electronic device on which electronic components are mounted and molded together with lead terminals for transmitting signals, wherein the semiconductor device is connected to the lead terminals, and the first and second chip-type electronic components are respectively An electronic device, wherein the electronic device is connected to the lead terminal and the ground via a connection point provided on the first and second substrates.

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