JP2007189098A - Chip component for connecting between boards, manufacturing method thereof, and connecting method of wiring board using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To readily mount a circuit module to a printed-wiring board without requiring a special facility, and to efficiently and easily position between boards. <P>SOLUTION: A first and a second surface facing each other of a chip component 30 for connecting between boards used for connecting wiring boards with a wiring pattern formed comprise a flat surface. A plurality of conductive regions 31 are arranged on the first and the second surface via an insulating region, and the conductive regions are formed separate so that a plurality of conductive paths for connecting from the first surface to the second surface are constituted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip component for inter-board connection, a method for manufacturing the same, and a method for connecting a wiring board using the same, and more particularly to a chip component for connection used for batch connection between wiring boards.

  Mounting circuit modules are widely used by mounting semiconductor elements, resistors, capacitors, etc. on a resin or ceramic wiring board. The structure is generally composed of a wiring layer formed on a substrate and an insulating layer that insulates the wiring layer, and the wiring layer on the substrate is a hole-like conductor plating layer called a via (through) hole provided in the substrate ( Are connected to each other by conductive vias).

  In recent years, a high-density circuit board such as a surface wiring printed circuit (SLC) board has been used as the circuit board. The SLC is composed of a substrate and a surface wiring layer thereof. The surface wiring layer is a laminated body of a wiring layer and an insulating layer, and the wiring layers are connected to each other through conductive vias. Moreover, the connection between the wirings on both sides of the substrate is made by conductive vias (through holes) in the substrate. The lower part of the build-up board of the mounting circuit module using such an SLC board is electrically connected to a mounting board (motherboard or the like) via a solder ball (ball grid array) for carrier connection. On the other hand, a semiconductor chip is electrically connected to the upper part of the buildup substrate via chip connection bumps (solder bumps).

For connection, as shown in FIG. 12, a method is used in which the printed circuit board 10 on which the electronic component 20 is mounted is individually connected to the connection terminals 43 on the flexible substrate 40 via the solder balls 130.
In the above structure, the solder balls 130 are positioned at desired positions on the printed circuit board 10 (FIG. 13A) on which the electronic component 20 is mounted, as shown in FIGS. 13A to 13D. Then, it is formed by attaching it to the connection terminal 43 (FIG. 13C) on the flexible substrate 40 and reflowing it (FIG. 13D). In the case of this method, it is necessary to individually mount solder balls 130 for connection between connection plates at connection points.

JP2001-102749

As described above, in the above-described structure, as shown in the connection process in FIG. 13, it is necessary to individually mount the solder balls 130 for connecting the plates at the connection points, and there is a problem that the number of parts increases. In addition, positioning is an important problem, and it takes a lot of time for mounting, and there is also a problem that misalignment easily occurs.
In addition, in order to connect efficiently, a dedicated facility for mounting solder balls is required, leading to a problem of increased costs.

The present invention has been made in view of the above circumstances, and an object thereof is to enable easy mounting of a circuit module on a printed circuit board without requiring special equipment.
In addition, another object is to efficiently facilitate alignment between substrates.

The present invention is an inter-plate connecting chip component used for connection between substrates with a wiring substrate on which a wiring pattern is formed, wherein the first and second surfaces facing each other form a flat surface, A plurality of conductive regions are arranged on the first surface and the second surface via insulating regions, and the conductive region has a plurality of conductive paths connected to the second surface from the first surface. As formed, the insulating region is formed separately.
According to this configuration, the connection between the substrates can be easily realized by chip components with good workability, and the presence of the insulating region can surely prevent a short circuit between the conductive paths.

According to the present invention, in the above-described chip component for connecting plates, the conductive region includes at least one of the first and second surfaces arranged one-dimensionally.
According to this configuration, it can be cut into a predetermined length and can be attached to any location, so that versatility is high.

Further, the present invention includes the above-described chip component for board connection, wherein the conductive region is a columnar region arranged from the first surface toward the second surface.
According to this configuration, the conductive path is reliably ensured by the columnar region.

Further, the present invention is the above-described chip component for inter-plate connection, wherein the conductive region is formed on a side surface from the first surface toward a second surface contacting the end portions of the first and second surfaces. It includes a conductive pattern disposed.
According to this configuration, the configuration is simple and the manufacture is easy.

The present invention also includes an insulating coating layer disposed between the conductive regions on at least one of the first and second surfaces in the chip component for connecting plates.
According to this configuration, the presence of the insulating coating layer can suppress the flow of solder and prevent a short circuit.

According to the present invention, in the above chip component for connecting plates, the conductive region forms a recess in the vicinity of at least one of the first and second surfaces.
According to this configuration, the recess serves as a liquid reservoir that prevents the solder from flowing out, and the solder can be more reliably prevented from flowing out.

Further, the present invention includes the above-described chip component for inter-plate connection, wherein the columnar region includes concave grooves penetrating from the first surface to the second surface on both side surfaces.
According to this configuration, the concave groove serves to increase the contact area between the connection terminal on the wiring board surface and the solder layer, and serves as a liquid reservoir that prevents the solder layer from flowing out. The insulative area becomes a dam. As a result, the solder is prevented from spreading indefinitely, the area of the solder joint is increased, and the electrical and physical connection is ensured and strengthened.

The present invention also includes a structure in which an insulating region made of an insulating substrate and a conductive region made of a conductive substrate are stacked in a direction perpendicular to the first and second surfaces.
According to this configuration, the concave portion plays a role of a liquid reservoir that prevents the solder from flowing out, and can more reliably suppress the solder from flowing out.

Further, the present invention includes the above-described chip component for board connection, wherein the insulating substrate is a ceramic substrate.
According to this configuration, it is possible to configure a firm and reliable chip component for inter-plate connection.

The present invention also includes the above chip component for inter-plate connection, wherein the insulating substrate is a resin substrate.
According to this configuration, it is possible to configure a firm and reliable chip component for inter-plate connection.

Further, the present invention includes the above chip component for connecting plates, wherein the conductive substrate is a metal substrate.
According to this configuration, it is possible to configure a firm and reliable chip component for inter-plate connection.

  The present invention also relates to a method of manufacturing a chip component for inter-plate connection used for connecting substrates with a wiring substrate on which a wiring pattern is formed, wherein the first and second surfaces facing each other form a flat surface. A plurality of conductive regions are arranged on the first and second surfaces through insulating regions, and the plurality of conductive regions are connected from the first surface to the second surface. The conductive region and the insulating region are arranged so as to constitute the conductive path.

Further, according to the present invention, in the method for manufacturing a chip component for inter-plate connection, a step of alternately laminating an insulating substrate and a conductive substrate to form a laminate, and the cut surfaces are first and second. Cutting the layered body perpendicularly to the stacking direction so as to constitute the surface.
According to this configuration, since the stacked body is cut perpendicularly to the stacking direction so that the cut surfaces constitute the first and second surfaces, a flat surface can be easily formed and more reliable connection can be achieved. Is possible.

According to the present invention, in the method for manufacturing a chip component for inter-plate connection, a step of forming a through hole in the conductive substrate along the cut surface after the step of forming the laminated body and prior to the step of cutting. And the step of cutting includes a step of cutting at a position where the through hole is divided.
According to this configuration, by forming the through hole and cutting it so as to divide it, the concave portion on the side surface is simultaneously formed, and the productivity is improved.

According to the present invention, in the method for manufacturing a chip component for inter-plate connection, a step of forming a stripe-shaped first conductive pattern on the front surface and the back surface of the insulating substrate, and orthogonal to the first conductive pattern. And cutting the insulating substrate into a predetermined width to form a plate-like body having a predetermined width, and the surfaces on which the first conductive patterns are formed in contact with the plate-like body. A rearrangement step of rearranging and aligning the cut surfaces, and a step of forming a stripe-shaped second conductive pattern on the rearranged cut surfaces so as to coincide with the first conductive pattern; including.
According to this configuration, the same effect can be achieved at low cost by forming the conductive pattern in a stripe shape on the surface of the insulating substrate.

According to the present invention, in the method for manufacturing a chip component for inter-plate connection, the step of forming the first and second conductive patterns includes a screen printing step.
According to this configuration, since the process of forming the first and second conductive patterns is a screen printing process, it is possible to efficiently perform highly accurate pattern formation.

Moreover, this invention is a manufacturing method of the said chip component for board connection, The process of forming a said 2nd conductive pattern includes the application | coating process by an inkjet method.
According to this configuration, it is possible to efficiently form a highly accurate pattern even on an uneven surface.

Further, according to the present invention, the first and second surfaces facing each other form a flat surface in the first connection terminal region of the first wiring board, and a plurality of conductive materials are formed on the first and second surfaces. The insulating region is arranged through the insulating region, and the conductive region is separated from the first surface so as to form a plurality of conductive paths connected to the second surface. A first step of arranging and soldering the inter-plate connecting chip component so that the first surface is in contact with the connecting terminal region; and the second surface of the inter-chip connecting chip component Includes a second step of placing the second wiring board in contact with the second connection terminal region of the second wiring board and soldering.
According to this structure, it becomes easy to connect between boards efficiently and collectively.

In the wiring board connection method according to the present invention, the first and second steps may be performed more than the contact surfaces of the first and second connection terminal regions with the first and second surfaces. A solder layer is also formed on the outside, and a bonding region is formed from the first and second surfaces to the side surfaces connected to these.
According to this configuration, electrical connection and physical connection are made not only on the contact surfaces of the first and second connection terminal regions with the first and second surfaces, but also on the side surfaces. Connection is possible.

In the wiring board connection method according to the present invention, a concave groove is formed on a side surface of the conductive region. In the first and second steps, a bonding region is formed so that solder flows into the concave groove. It includes what is the process of forming.
According to this configuration, since the joining region is formed so that the solder flows into the recessed groove, the connection area can be increased, the joining property is improved, and the wall surface of the recessed groove acts as a liquid reservoir. Therefore, bonding that is stronger and more reliable is possible.

According to the present invention, in the above wiring board connection method, at least one of the first and second wiring boards is a hard board (rigid board).
According to this configuration, since the hard substrate can maintain flatness, peeling between the two wiring substrates can be prevented.

According to the present invention, in the above wiring board connection method, at least one of the first and second wiring boards is a flexible board.
According to the said structure, since a flexible wiring board has flexibility and it is easy to utilize space, it is often used for the connection between wiring boards or a glass substrate. By applying the present invention, the directly connected flexible substrate is less likely to be peeled off, which leads to the suppression of the yield and reliability of electronic products.

  According to the present invention, it is possible to connect a plurality of inter-plate connection points in a lump and to reduce the number of parts. In addition, a dedicated mounting facility for mounting components is unnecessary, and efficient mounting can be realized with a standard facility configuration.

Next, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)

  FIG. 1 is a cross-sectional view showing a circuit module 100 mounted using a chip part for connecting between boards according to an embodiment of the present invention. 2 is a top view of the circuit module 100 of FIG. 1, and FIG. FIG. 4 is a diagram illustrating a circuit module mounting process using the inter-plate connection method using the inter-plate connecting chip component, and FIGS. 5 to 7 are diagrams illustrating manufacturing steps of the inter-plate connecting chip component.

  In the present embodiment, as shown in FIG. 1, a flexible wiring board 40 having wiring patterns 43 and 41 formed on the front and back surfaces of a polyimide resin film material 42 is connected via a chip component 30 for inter-plate connection. The multilayer wiring board 10 is connected to achieve inter-plate connection.

  Here, the inter-plate connecting chip component 30, as shown in FIG. 2, is an inter-plate connecting chip component used for connecting the substrates with the wiring substrate on which the wiring pattern is formed, and is opposed to each other. And the second surfaces 30a and 30b constitute a flat surface, and a plurality of conductive regions 31 having the same width are arranged on the first and second surfaces with an insulating region 32 interposed therebetween. 31 is separated from the first surface by an insulating region 32 so as to constitute a plurality of conductive paths connected to the second surface.

  In addition, this conductive region constitutes a columnar conductive path, and has concave grooves 33 penetrating from the first surface 30a to the second surface 30b on both side surfaces.

In the circuit module 100, as shown in a top view in FIG. 3, six inter-plate connecting chip components 30 are arranged on the peripheral edge of the multilayer wiring board 10 of the circuit module. Further, chip parts such as a solid-state imaging device chip 21, a capacitor 22, and a resistor 23 are connected to the surface side of the multilayer wiring board of the circuit module by a solder layer 24.
As shown in FIG. 1, the multilayer wiring board 20 is composed of a multilayer ceramic substrate, and the wiring patterns 12a, 14 and 14 are respectively formed on the first substrate 11, the second substrate 15, and the third substrate 18 from the chip component side. 17, 12b Through holes 13, 16, and 19 are formed to connect them.

Next, an inter-plate connection method using the inter-plate connection chip component 30 will be described.
As shown in FIG. 4A, the interchip connecting chip component 30 shown in FIG. 2 is prepared. Then, as shown in FIG. 4B, the solder layer 24 is applied to the connection terminal region of the multilayer wiring board 10 using a dispenser, and the chip component 30 for inter-plate connection is placed and heated, whereby the multilayer wiring board 10 is heated. And the chip component 30 for inter-plate connection.
Subsequently, as shown in FIG. 4C, positioning is performed such that the second surface 30 b of the inter-plate connecting chip component 30 comes into contact with the wiring pattern 43 of the flexible wiring board 40.
Then, as shown in FIG. 4D, heating is performed while supplying solder from the side of the dispenser, and the inter-plate connecting chip component and the flexible wiring board 40 are connected.
In this way, the inter-plate connection can be realized very easily.
As shown in FIG. 3, in the present embodiment, since six inter-plate connection chip components are used, the six inter-plate connection chip components 30 are temporarily fixed at predetermined positions of the multilayer wiring board 10. If bonding is performed by batch heating, bonding can be performed with better workability.

  According to this configuration, the chip parts 30 for connecting between plates can be connected together and the terminals are arranged one-dimensionally, so that it can be used for general purposes. That is, when the connection terminal area is long, a plurality of inter-plate connecting chip components may be arranged and used.

Further, the concave groove 33 provided on the side surface of the conductive region 31 of the inter-plate connecting chip component 30 is useful for increasing the contact area between the connection terminal region on the wiring board surface and the solder layer. Also, it acts as a liquid reservoir that prevents the solder layer from flowing out, and the insulating region that becomes the protruding region functions as a dam. As a result, the solder is prevented from spreading indefinitely, the area of the solder joint is increased, and the electrical and physical connection is ensured and strengthened.
According to this configuration, the connection between the substrates can be easily realized by chip components with good workability, and the presence of the insulating region can surely prevent a short circuit between the conductive paths.

Next, a method for manufacturing the chip component for inter-plate connection will be described.
In this method, the insulating substrate constituting the insulating region 32 and the conductive substrate constituting the conductive region 31 are alternately laminated to form a laminated body, and the cut surface is the first surface 30a and Cutting the stack perpendicularly to the stacking direction so as to form the second surface 30b.
According to this configuration, since the stacked body is cut perpendicularly to the stacking direction so that the cut surfaces constitute the first and second surfaces, a flat surface can be easily formed and more reliable connection can be achieved. Is possible.

First, as shown in FIG. 5A, the insulating substrate constituting the insulating region 32 and the conductive substrate constituting the conductive region 31 are alternately laminated to form a laminate.
Next, as shown in FIG. 5B, the stacked body is cut along the dicing line DL perpendicularly to the stacking direction so that the cut surfaces form the first surface 30a and the second surface 30b.

As shown in FIG. 6A, a base to be the chip-to-board connecting chip component 30 obtained in this way is formed.
Then, as shown in FIG. 6B, an insulating coating 34 is formed on the insulating regions of the first and second surfaces by a coating method.

After that, as shown in FIG. 7A, a resist 35 is applied to the first surface 30a and the second surface 30b, and the conductive region 31 is etched, so that a groove 33 is formed on the side surface of the conductive region 31. Is formed (FIG. 7B).
In this way, the interchip connecting chip component shown in FIG. 2 is formed.

In this way, it is possible to form a chip component for connecting between plates with extremely high controllability and high dimensional accuracy.
In the above-described embodiment, the interchip connecting chip component in which the conductive regions 31 are formed at an equal pitch has been described. However, the chip parts may not be at an equal pitch, and the first surface and the second surface are electrically conductive. You may form so that the pitch of the area | region 31 may differ.

(Embodiment 2)
FIG. 8 is a diagram showing a chip component for connecting between plates according to an embodiment of the present invention.
In the first embodiment, the concave portion 33 is formed on the side surface of the conductive region 31 of the inter-plate connecting chip component 30. However, as shown in FIG.
In manufacturing, it is formed by executing the steps of FIGS. 5 to 6 in the first embodiment.
According to this configuration, it is easier to manufacture than the interchip connecting chip component of the first embodiment, and the number of manufacturing steps can be reduced.

(Embodiment 3)
FIG. 9 is a diagram showing a chip component for inter-plate connection according to an embodiment of the present invention.
In the present embodiment, conductive regions 31P made of a conductor pattern formed by screen printing are formed on the surface of a base substrate 36 made of a ceramic substrate at a predetermined interval, and the base substrate 36 is located between the conductive regions 31P. To constitute an insulating region.
Also here, an insulating coating 35 is formed on the surface of the insulating region.
A method of manufacturing the inter-plate connecting chip component 30 will be described.
As shown in FIG. 10A, a ceramic substrate 36 is prepared, and striped conductive patterns 31P are formed on the surface at a predetermined interval by screen printing.
Then, as shown in FIG. 10B, the ceramic substrate on which the conductive pattern 31P is formed is cut along a dicing line DL so as to form a rectangular parallelepiped shape.
Thereafter, as shown in FIG. 11 (a), the second conductive pattern is rearranged so that the cut surface is on top and again connected to the conductive pattern 31P as shown in FIG. 11 (b). 31S is formed.
In this way, a flat surface can be formed with extremely good workability, and the chip part for connecting between plates shown in FIG. 9 is formed.

  According to the present invention, it is possible to provide a chip-to-board connecting chip component that is small and has high mounting strength, so that a thin and highly reliable board-to-board connection is realized.

The figure which shows the circuit module mounted using the chip component for board connection of Embodiment 1 of this invention. The figure which shows the chip component for board connection of Embodiment 1 of this invention 1 is a top view of a circuit module according to a first embodiment of the present invention. The figure which shows the board connection process using the chip | tip component for board connection of Embodiment 1 of this invention. Manufacturing process diagram of chip component for inter-plate connection according to Embodiment 1 of the present invention Manufacturing process diagram of chip component for inter-plate connection according to Embodiment 1 of the present invention Manufacturing process diagram of chip component for inter-plate connection according to Embodiment 1 of the present invention The figure which shows the chip component for board connection of Embodiment 2 of this invention The figure which shows the chip component for board connection of Embodiment 3 of this invention The figure which shows the manufacturing process of the chip component for board connection of Embodiment 3 of this invention. The figure which shows the manufacturing process of the chip component for board connection of Embodiment 3 of this invention. The figure which shows the circuit module mounted using the chip | tip component for board connection of a prior art example The figure which shows the manufacturing process of the circuit module of a prior art example

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Multilayer wiring board 20 Chip component 30 Chip component for board-to-board connection 31 Conductive region

Claims (22)

A chip component for inter-plate connection used for connection between substrates with a wiring substrate on which a wiring pattern is formed,
The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces via insulating regions,
The chip component for board-to-plate connection formed by the insulating region so that the conductive region constitutes a plurality of conductive paths connecting from the first surface to the second surface. It is a chip part for board connection according to claim 1,
The conductive region is an inter-plate connecting chip component that is one-dimensionally arranged on at least one of the first and second surfaces. It is a chip part for board connection according to claim 1 or 2,
The inter-plate connecting chip component, wherein the conductive region is a columnar region arranged from the first surface toward the second surface. It is a chip part for board connection according to claim 1 or 2,
The conductive region includes an inter-plate connection chip including a conductive pattern disposed on a side surface from the first surface toward a second surface that contacts the end portions of the first and second surfaces. parts. A chip part for connecting between plates according to any one of claims 1 to 4,
A chip component for inter-plate connection including an insulating coating layer disposed between the conductive regions on at least one of the first and second surfaces. A chip part for connecting between plates according to any one of claims 1 to 5,
An inter-plate connecting chip component in which the conductive region forms a recess in the vicinity of at least one of the first and second surfaces. It is a chip part for board connection according to claim 3,
The said columnar area | region is a chip component for board-to-plate connection which comprised the ditch | groove penetrated from a 1st surface to a 2nd surface on both side surfaces. A chip part for connecting between plates according to any one of claims 1 to 7,
An inter-plate connecting chip component comprising a laminate in which an insulating region made of an insulating substrate and a conductive region made of a conductive substrate are stacked in a direction perpendicular to the first and second surfaces. It is a chip component for board connection according to claim 8,
The chip part for board-to-board connection, wherein the insulating substrate is a ceramic substrate. It is a chip component for board connection according to claim 8,
The chip component for board-to-board connection, wherein the insulating substrate is a resin substrate. A chip part for connecting between plates according to any one of claims 8 to 10,
The inter-plate connecting chip component, wherein the conductive substrate is a metal substrate. A method of manufacturing a chip component for inter-plate connection used for connection between substrates with a wiring substrate on which a wiring pattern is formed,
The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces via insulating regions,
The inter-plate connection in which the conductive region and the insulating region are arranged so that the conductive region constitutes a plurality of conductive paths connecting from the first surface to the second surface. Of manufacturing chip parts for use. It is a manufacturing method of the chip part for board connection according to claim 12,
A step of alternately laminating insulating substrates and conductive substrates to form a laminate;
A method of manufacturing a chip component for inter-plate connection, including a step of cutting the stacked body perpendicularly to the stacking direction so that the cut surfaces constitute first and second surfaces. It is a manufacturing method of the chip part for board connection according to claim 13,
After the step of forming the laminate, prior to the cutting step, including a step of forming a through hole in the conductive substrate along the cut surface,
The step of cutting is a method of manufacturing a chip component for inter-plate connection, which is a step of cutting at a position where the through hole is divided. It is a manufacturing method of the chip part for board connection according to claim 12,
Forming a stripe-shaped first conductive pattern on the front and back surfaces of the insulating substrate;
Cutting the insulating substrate into a predetermined width in a direction perpendicular to the first conductive pattern to form a plate-like body having a predetermined width;
A rearrangement step of rearranging the plate-like bodies so that the surfaces on which the first conductive patterns are formed are in contact with each other, and aligning the cut surfaces;
Forming a striped second conductive pattern on the rearranged cut surfaces so as to coincide with the first conductive pattern. It is a manufacturing method of the chip part for board connection according to claim 15,
The step of forming the first and second conductive patterns is a method for manufacturing a chip component for inter-board connection, which includes a screen printing step. It is a manufacturing method of the chip part for board connection according to claim 15,
The step of forming the second conductive pattern is a method of manufacturing a chip component for inter-plate connection including a coating step by an ink jet method. In the first connection terminal region of the first wiring board,
The first and second surfaces facing each other form a flat surface, and a plurality of conductive regions are arranged on the first and second surfaces via insulating regions,
The conductive region includes a chip component for inter-plate connection formed separately from the first surface so as to constitute a plurality of conductive paths connected to the second surface,
A first step of placing the first surface in contact with the connection terminal region and soldering;
A wiring board connecting method including a second step of arranging and soldering the second surface of the inter-plate connecting chip component so as to abut on the second connecting terminal region of the second wiring board. The wiring board connection method according to claim 18, comprising:
In the first and second steps, a solder layer is formed outside the contact surface of the first and second connection terminal regions with the first and second surfaces. And a method of connecting a wiring board, wherein a bonding region is formed from the second surface to the side surface connected to these. The connection method for a wiring board according to claim 19,
A concave groove is formed on a side surface of the conductive region,
The wiring substrate connecting method, wherein the first and second steps are steps of forming a joining region so that solder flows into the concave groove. A method for connecting a wiring board according to any one of claims 18 to 20,
At least one of the first and second wiring boards is a hard board (rigid board). A method for connecting a wiring board according to any one of claims 18 to 20,
At least one of the first and second wiring boards is a flexible board, and the wiring board connection method is characterized in that:

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