JP2007179684A - Optical head device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical head device and its manufacturing method capable of preventing damage in a flexible substrate even when position adjustment work for a light-emitting element during a manufacturing process is made with the light-emitting element lit. <P>SOLUTION: In manufacturing the optical head device, after feeding electricity via a lead wire 11 on a sub-frame 22, making a twin laser light source 4 is lit, observing a laser beam and adjusting a twin laser light source 4, the sub-frame 22 is connected to a mainframe 21, and the flexible substrate is connected to the lead wire 11 afterward. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical head device used for reproducing an optical recording disk such as a CD or a DVD, and a manufacturing method thereof.

In an optical head device used for reproduction and recording of an optical recording disk such as a CD or DVD, a light emitting element, a light receiving element for signal detection, an optical path from the light emitting element to the optical recording disk, and an optical path from the optical recording disk to the light receiving element. The constituting optical system is mounted on the apparatus frame (see, for example, Patent Document 1).
JP 2002-8250 A

  In such an optical head device, in general, a flexible substrate is connected to the light emitting element to supply power to the light emitting element. Further, the light emitting element is turned on via the flexible substrate, and the position of the light emitting element is adjusted while observing the emitted light. However, in such a configuration, since the flexible substrate is connected at a relatively early stage during manufacture, there is a problem that the flexible substrate is easily damaged in the subsequent processes.

  In view of the above problems, an object of the present invention is to provide an optical head device capable of preventing damage to a flexible substrate and a method of manufacturing the same, even when the position adjustment operation of the light emitting element is performed by turning on the light emitting element during the manufacturing process. Is to provide.

  In order to solve the above problems, the present invention comprises a light emitting element, a signal detecting light receiving element, an optical path from the light emitting element to the optical recording disk, and an optical path from the optical recording disk to the signal detecting light receiving element. In the optical head device in which the optical system is mounted on the device frame, a lead wire is electrically connected to the terminal of the light emitting element, and a flexible substrate is connected to the lead wire.

  In the present invention, the apparatus frame includes a light emitting element, a signal detecting light receiving element, an optical path from the light emitting element to the optical recording disk, and an optical system forming an optical path from the optical recording disk to the signal detecting light receiving element. In the method of manufacturing the optical head device mounted on the lead wire, after electrically connecting a lead wire to the terminal of the light emitting element, before connecting a flexible substrate to the lead wire, power is supplied through the lead wire, and It is characterized in that at least the position of the light emitting element is adjusted in a state where the light emitting element is turned on, and then a flexible substrate is connected to the lead wire.

  In the present invention, after electrically connecting the lead wire to the terminal of the light emitting element and before connecting the flexible substrate to the lead wire, at least the light emitting element is turned on by supplying power through the lead wire. Since the position of the light emitting element is adjusted, the flexible substrate is not damaged during the position adjustment. Therefore, even when the position adjustment operation of the light emitting element is performed by turning on the light emitting element during the manufacturing, damage to the flexible substrate can be prevented.

  In the present invention, the apparatus frame includes a main frame having bearings formed at both ends, and a plurality of optical elements connected to the main frame and constituting the light emitting element, the signal detecting light receiving element, and the optical system. A configuration including a subframe on which at least a part of the subframe is mounted may be employed.

  Thus, when the apparatus frame includes a main frame having bearings formed at both ends and a subframe connected to the main frame, the light emitting element and the signal are included in the subframe. After mounting at least a part of the plurality of optical elements constituting the light receiving element for detection and the optical system, the light emitting element is fed with power through the lead wire before connecting the subframe to the main frame. It is preferable to adjust the position of at least the light emitting element in a state where the LED is turned on, connect the sub frame to the main frame, and then connect the flexible substrate to the lead wire. If comprised in this way, when connecting a sub-frame to a main frame, it can prevent that a flexible substrate is damaged.

  In the present invention, after electrically connecting the lead wire to the terminal of the light emitting element and before connecting the flexible substrate to the lead wire, the position of the light emitting element is turned on with the power supplied through the lead wire to light the light emitting element. Since adjustment is performed, the flexible substrate is not damaged during such position adjustment. Therefore, even when the position adjustment operation of the light emitting element is performed by turning on the light emitting element during the manufacturing, damage to the flexible substrate can be prevented.

  An example of an optical head device to which the present invention is applied will be described with reference to the drawings. In the following description, the side on which the objective lens is visible is the upper surface, and the opposite side is the lower surface.

[overall structure]
FIG. 1 is a plan view of an optical head device to which the present invention is applied. 2 (a) to 2 (e) are respectively a plan view, a bottom view, a left side view, a right side view in which the main body portion is enlarged by removing a part of the flexible substrate in the optical head device shown in FIG. And FIG. 3A and 3B are a plan view and a bottom view, respectively, showing a state in which the upper surface cover, the lower surface cover, and the actuator cover are removed from the main body portion of the optical head device shown in FIG. 4A to 4E are a plan view, a bottom view, a left side view, a right side view, and an NN sectional view in a state where the flexible substrate and the objective lens driving device are removed from the state shown in FIG. It is. 5A to 5C are a plan view, a bottom view, and a JJ cross-sectional view, respectively, showing a subframe extracted from the state shown in FIG.

  As shown in FIGS. 1 and 2, the optical head device 1 to which the present invention is applied includes a first bearing portion 211 in which a feed screw shaft and a guide shaft of a disk drive device are engaged with both ends of a device frame 2. And the 2nd bearing part 212 is formed, and it drives to the radial direction of an optical recording disc. One side surface of the device frame 2 is curved in an arc shape to prevent interference when approaching a spindle motor (not shown) of the disk drive mechanism.

  On the upper surface side of the apparatus frame 2, the objective lens 91 is positioned substantially in the center, and the upper surface cover 6 made of a thin metal plate is covered on the side where the first bearing portion 211 is positioned with respect to the objective lens 91. The upper surface cover 6 engages with an upper plate portion 61 that covers the upper surface of the device frame 2, and a protrusion formed on the side surface of the device frame 2 by bending downward from one side edge of the upper plate portion 61. A first side plate portion 62 and a second side plate portion 63 that bends downward from the other side edge of the upper plate portion 61 and engages with a protrusion formed on the side surface of the apparatus frame 2 are provided. .

  The bottom surface side of the device frame 2 is covered with a lower surface cover 8 made of a thin metal plate. The lower surface cover 8 includes a lower plate portion 81 that covers the lower surface of the device frame 2 and one of the lower plate portions 81. A first side plate portion 82 that bends upward from the side edge and engages with a protrusion formed on the side surface of the apparatus frame 2, and bends upward from the other side edge to enter the slit of the apparatus frame 2. And a second side plate portion 83 that exhibits an elastic force that holds the bottom cover 8 mounted on the apparatus frame 2.

  In the apparatus frame 2, an actuator cover 7 made of a thin metal plate, which will be described later with reference to FIGS. 10 and 11, is covered from the side where the second bearing portion 212 is located to the left side of the objective lens 91. Yes.

  The main body portion of the flexible substrate 3 shown in FIGS. 1 and 2 is arranged to cover the upper surface of the apparatus frame 2 below the actuator cover 7 and the upper surface cover 6 as shown in FIG. 3 is mounted with a driving IC 30 for driving the twin laser light source 4 to be described later and controlling the objective lens driving mechanism 9 and the like. In the flexible substrate 3, two end portions 31 and 32 extend from the upper surface cover 6 toward the first bearing portion 211, and a wiring pattern formed on these end portions 31 and 32 is: It is electrically connected to a signal detecting light receiving element 55 described later. Furthermore, the flexible substrate 3 also includes end portions 33 and 34 in which a wiring pattern is electrically connected to a twin laser light source 4 and a light receiving element for monitoring which will be described later.

  Here, the apparatus frame 2 includes a main frame 21 which will be described later with reference to FIGS. 6 and 7, and a metal subframe 22 which will be described later with reference to FIGS. 8 and 9. Is held by the main frame 21 in a state of being disposed inside the main frame 21.

  As shown in FIGS. 3, 4 and 5, the optical head device 1 includes a first laser beam (infrared light) having a wavelength of 650 nm and a second laser beam (outer infrared light) having a wavelength of 780 nm. Is a two-wavelength optical head device 1 capable of recording and reproducing information on a DVD-based disc and a CD-based disc using an optical device, and an AlGaInP-based laser diode emitting a first laser beam on the device frame 2 And a twin laser light source 4 that is integrally provided with an AlGaAs laser diode that emits the second laser light. Here, the first laser beam and the second laser beam are DVDs that are optical recording disks via a common optical system including a plurality of optical elements arranged in an optical path from the twin laser light source 4 toward the optical recording disk. An optical element guided to a system disk or CD system disk and constituting this optical system is also mounted on the apparatus frame 2. The return light from the optical recording disk is also guided to the common signal detection light receiving element 55 via the common optical system, and the optical element for defining the optical path for the return light and the signal detection light receiving element 55 are also provided. It is mounted on the frame 2.

  In the optical head device 1 of the present embodiment, the common optical system includes a diffraction element 51 that diffracts the first and second laser beams emitted from the twin laser light source 4 into three beams for tracking detection, and a diffraction element 51. A half mirror 52 that partially reflects the laser light separated into three beams by the collimator lens 53 that collimates the laser light from the half mirror 52, and a rising mirror 59 that raises the parallel light toward the optical recording disk. And an objective lens 91 for converging the laser beam from the rising mirror 59 onto the recording surface of the optical recording disk. Further, the common optical system is provided with astigmatism in the return lights of the first and second laser beams that have been reflected by the recording surface of the optical recording disk and then passed through the collimating lens 53 and the half mirror 52. The sensor lens 54 is also included. A front monitor light receiving element 56 is arranged on the opposite side of the half mirror 52 from the diffraction element 51.

  The objective lens 91 is configured such that the position in the tracking direction and the focusing direction is servo-controlled by the objective lens driving mechanism 9, and such an objective lens driving mechanism 9 is also mounted on the apparatus frame 2. In the present embodiment, a wire suspension type is used as the objective lens driving mechanism 9, and a known one can be used as the objective lens driving mechanism 9. A lens holder that is held, a holder support that supports the lens holder so as to be movable in a tracking direction and a focusing direction with a plurality of wires, and a yoke that is fixed to the apparatus frame 2 are provided. The objective lens drive mechanism 9 includes a magnetic drive circuit including a drive coil attached to the lens holder and a drive magnet attached to the yoke. By controlling energization of the drive coil, the lens holder Is driven in the tracking direction and the focusing direction with respect to the optical recording disk. Note that the objective lens driving mechanism 9 can also perform tilt control for adjusting the tilt of the objective lens 91 in the jitter direction.

  In the optical head device 1 configured as described above, the first and second laser beams emitted from the twin laser light source 4 are transmitted by the diffraction element 51 and then partially reflected by the partial reflection surface of the half mirror 52. The optical axis is bent 90 degrees toward the collimating lens 53. The laser light converted into parallel light by the collimator lens 53 is bent 90 degrees by the rising mirror 59 and travels toward the objective lens 91. At this time, part of the first and second laser beams emitted from the twin laser light source 4 is transmitted through the partial reflection surface of the half mirror 52 and guided to the front monitor light receiving element 56 as monitor light. The monitoring result of the front monitor light receiving element 56 is fed back to the twin laser light source 4 through the driving IC, and the intensity of the laser light emitted from the twin laser light source 4 is controlled.

  On the other hand, the return light from the optical recording disk returns to the objective lens 91 and the rising mirror 59 in reverse, and is emitted toward the sensor lens 54 via the collimator lens 53 and the half mirror 52. After the aberration is applied, the light enters the signal detecting light receiving element 55 and is detected by the signal detecting light receiving element 55. The return light detected by the signal detection light receiving element 55 includes three beams obtained by diffracting the first and second laser beams by the diffraction element 51. For example, of the three beams, the 0th order light The signal is reproduced by the main beam consisting of the above, and the tracking error signal and the focusing error signal of the objective lens 91 are detected using the detection result of the sub beam consisting of ± first-order diffracted light. Based on the detection results of the tracking error signal and the focused error signal detected in this way, the driving IC controls the objective lens driving mechanism 9.

  As described above, in this embodiment, since the recording and reproduction are performed by the common objective lens 91 using the first laser beam and the second laser beam, the objective lens 91 has a diffraction grating formed by concentric grooves and steps. Two-wavelength lenses are used. For this reason, according to the present embodiment, even if the objective lens 91 is shared, an optical recording disk having a recording layer with a different thickness of the surface protective layer for both the first laser beam and the second laser beam. Can respond.

  Here, for the first laser beam, the magnification of the optical system is preferably 6 or more, and for the second laser beam, the magnification of the optical system is preferably 4.5 or 4.8. However, in this embodiment, since the twin laser light source 4 is used, the optical system is completely common between the first laser beam and the second laser beam, and the magnification cannot be made different. For this reason, when the twin laser light source 4 is used, the optical system magnification has been set to 6 in the prior art with priority given to the DVD disk, which is far from the optimum design for the CD disk. However, in the present embodiment, the magnification of the optical system is lowered and the magnification of the optical system is set to about 5.1 within a range that satisfies the characteristics at the time of recording and reproduction on a DVD-type disc. For this reason, the optical head device 1 of this embodiment has a design suitable for both DVD-type discs and CD-type discs.

[Detailed description of each member]
FIG. 6 is a perspective view of a main frame used in an optical head device to which the present invention is applied. 7A to 7E are a plan view, a bottom view, a left side view, a right side view, and a MM sectional view of the main frame shown in FIG. 6, respectively. 8A and 8B are a perspective view when the subframe used in the optical head device to which the present invention is applied is viewed obliquely from above and a perspective view when viewed obliquely from below. 9A to 9E are a plan view, a bottom view, a front view, a left side view, and a right side view, respectively, of the subframe shown in FIG. FIG. 10 is a perspective view of an actuator cover used in the optical head device to which the present invention is applied. 11A to 11D are a plan view, a bottom view, a right side view, and a front view, respectively, of the actuator cover shown in FIG.

(Configuration of device frame 2)
In the optical head device 1 of the present embodiment, the device frame 2 is composed of a main frame 21 made of a resin frame-shaped component shown in FIGS. 6 and 7, and a metal sub-frame 22 shown in FIGS. As shown in FIGS. 2 to 4, the subframe 22 is held by the mainframe 21 in a state of being arranged in the subframe mounting area 210 inside the mainframe 21. As shown in FIGS. 6 and 7, a first bearing portion 211 and a second bearing portion 212 are formed on the main frame 21. The subframe 22 shown in FIGS. 8 and 9 is, for example, a zinc alloy die-cast product. As shown in FIG. 3, the subframe 22 is mounted on the main frame 21 and the inside of the apparatus frame 2 is subframe. 22 is divided into a first optical element installation section in which 22 is arranged and a second optical element installation section in which the subframe 22 is not arranged.

  That is, in this embodiment, the twin laser light source 4, the diffraction element 51, the half mirror 52, the collimating lens 53, the sensor lens 54, the signal detection light receiving element 55, and the monitor light receiving element 56 are mounted on the subframe 22. It is mounted on the main frame 21. On the other hand, the raising mirror 59 is directly mounted on the main frame 21. The objective lens driving mechanism 9 for driving the objective lens 91 is mounted on the main frame 21 by fixing the yoke to the main frame 21.

  Hereinafter, the structure of each component used in the optical head device 1 will be described in detail. First, the main frame 21 shown in FIGS. 6 and 7 is provided with a first bearing portion 211 and a second bearing portion 212 at both ends, and inside the main frame 21, the center in the length direction is provided. A subframe mounting region 210 is formed at a position that is biased toward the first bearing portion 211.

  In the main frame 21, two portions sandwiching the subframe mounting area 210 on both sides are a first subframe connection area 213 and a second subframe connection area 214 each having positioning protrusions 218 and 219 for the subframe 22. The first sub-frame connection region 213 is formed as a portion that bends and extends from the end of the oblique side portion of the adjacent end region 215 on the side where the first bearing portion 211 is located. On the other hand, the second sub-frame connection region 214 is formed at a portion where the end portion of the end region 215 switches to an arcuate curved portion.

  Here, both the first sub-frame connection region 213 and the second sub-frame connection region 214 are thinner than the end region 215 and lower than the end region 215. Therefore, in the main frame 21, the upper surfaces of the boundary regions 216 and 217 between the first subframe connection region 213 and the end region 215, and the boundary region 216 between the second subframe connection region 214 and the end region 215, A step corresponding to the difference in thickness is formed on the upper surface of 217. In this embodiment, the upper surfaces of the two boundary regions 216 and 217 are both the first subframe from the end region 215 side. The tapered surface gradually decreases in thickness toward the connecting region 213 side and the second subframe connecting region 214 side.

  In addition, the first sub-frame connection region 213 has a larger overall width than the end region 215 and is wider. In the second subframe connection region 214, the region close to the end region 215 is as wide as the first subframe connection region 213.

  As shown in FIGS. 8 and 9, the sub-frame 22 has a substantially rectangular planar shape, and the upper surface is formed flat as a whole, while the lower surface side has ribs and unevenness for positioning each optical element. Is formed. Further, in the sub-frame 22, a thin plate-like first connecting plate portion 221 and a second connecting plate portion 222 extend from the upper surface side toward the left and right sides. Here, an elongated hole 223 into which the positioning projection 218 of the main frame 21 is fitted is formed as a through hole in the first connecting plate portion 221, and a positioning projection 219 of the main frame 21 is formed in the second connecting plate portion 222. A round hole 224 to be fitted is formed as a through hole.

  Accordingly, as shown in FIGS. 1 to 4, when the subframe 22 is mounted on the main frame 21, the first connecting plate is disposed with the subframe 22 disposed in the subframe mounting area 210 of the mainframe 21. The portion 221 is overlapped with the first subframe connection region 213 of the main frame 21, and the second connection plate portion 222 is overlapped with the second subframe connection region 214 of the main frame 21. As a result, the positioning protrusions 218 and 219 of the main frame 21 are fitted into the long holes 223 of the first connecting plate portion 221 and the round holes 224 of the second connecting plate portion 222, respectively, and the sub frame 22 is positioned. In this state, the outer end portion of the first sub-frame connection region 213 and the outer end portion of the second sub-frame connection region 214 are the end edge of the first connection plate portion 221 and the second connection plate portion 222. The first sub-frame connection region 213 and the second sub-frame connection region 214, and the end edges of the first connection plate portion 221 and the second connection plate portion 222. Steps 228 and 229 are formed from the edge. Accordingly, if a UV curable adhesive is applied to the step portions 228 and 229 and then the adhesive is solidified by UV irradiation, the first sub-frame connection region 213 and the second sub-frame connection region 214 have the first. The connecting plate portion 221 and the second connecting plate portion 222 are bonded and fixed. At this time, the adhesive also enters the gap between the first subframe connection region 213 and the first connection plate portion 221 and the gap between the second subframe connection region 214 and the second connection plate portion 222. Therefore, the first sub-frame connection region 213 and the second sub-frame connection region 214, and the first connection plate portion 221 and the second connection plate portion 222 are in a surface-bonded state.

(Mounting structure of various optical elements on the subframe 22)
3 to 5, the half mirror 52 is bonded and fixed to the center region of the subframe 22, and the diffraction element 51 is mounted on the side of the mounting position of the half mirror 52. Here, the diffraction element 51 is fixed by a leaf spring 510.

  In the subframe 22, the twin laser light source 4 is disposed on the side of the position where the diffraction element 51 is mounted. Here, the twin laser light source 4 is not a can type in which the laser chip 41 is housed in a cylindrical case, but a frame type laser in which the submount 43 on which the laser chip 41 is mounted is mounted on the upper surface of the radiation fin 44. It is a light source, and both ends of the radiation fins 44 are fixed to the subframe 22 with an adhesive. In the frame type laser light source, the resin portion 45 is molded so as to surround the submount 43 on which the laser chip 41 is mounted with respect to the radiation fin 44.

  Here, the twin laser light source 4 is arranged with the upper surface on which the laser chip 41 is mounted facing the upper surface of the optical head device 1, and the upper surface of the radiation fin 44 abuts on the step 226 of the subframe 22, Positioning has been performed. That is, in the twin laser light source 4, burrs may occur on the upper surface of the resin portion 45, but in this embodiment, since the upper surface of the radiating fin 44 is in contact with the step 226 of the subframe 22, Even if such burrs are generated, the heat radiating fins 44 can be accurately arranged at predetermined positions in a predetermined posture.

  Further, in the sub-frame 22, a planar E-type metal component 12 is bonded and fixed to the front position of the twin laser light source 4, and the central projection 122 among the three projections 121, 122, 123 of the metal component 12. Is in contact with a position corresponding to the back surface side of the portion on which the laser chip 41 and the submount 43 are mounted on the lower surface of the radiating fin 44.

  In the twin laser light source 4 mounted on the subframe 22 in this way, the lead pins 42 extending rearward are mounted on the light source mounting board 40 by soldering, and the end portions of the lead pins 42 are extended from the light source mounting board 40. Three lead wires 11 connected by solder extend. Further, one end of the ground wiring 111 is connected to the ground pattern of the light source mounting substrate 40 by soldering, and the other end of the ground wiring 111 is fixed to the subframe 22 by screws.

  Here, one end of each of the three lead wires 11 is connected to the lead pin 42 on the light source mounting substrate 40 and is electrically connected to the twin laser light source 4, while the other end is an end of the flexible substrate 3. The part 33 is connected by solder.

  In addition, in the subframe 22, the heat radiating sheet 17 is stuck on the upper surface of the region where the twin laser light source 4 is mounted.

  Further, in the sub-frame 22, a protrusion 226 having an opening is formed at the end of the main frame 21 on the side where the first bearing portion 211 is located. A support substrate 57 that supports the light receiving element 55 for use is bonded and fixed. Here, the support substrate 57 supports the signal detecting light receiving element 55 at the center in the length direction. The left and right ends 571 and 572 of the support substrate 57 are bent so as to sandwich the protrusion 226 from both sides, and are fixed to the protrusion 226 with an adhesive. Since such a configuration is adopted, in this embodiment, a large support substrate 57 can be used even when the space for arranging the signal detection light receiving elements 55 is small. Therefore, since the support substrate 57 has high heat dissipation and a large heat capacity, it is possible to prevent the temperature rise of the signal detecting light receiving element 55 due to the heat generation of the twin laser light source 4 and the like. Further, when the environmental temperature changes after the support substrate 57 is bonded, the position and posture of the signal detection light-receiving element 55 can be maintained even when an imbalance occurs in the degree of contraction or expansion between the left and right adhesives. It does not fluctuate greatly. A sensor lens 54 having a cylindrical outer shape is disposed inside the protrusion 226.

  Furthermore, a substantially U-shaped groove-shaped opening is formed at the other end of the sub-frame 22, and a collimator lens 53 is fixed to this opening.

  Furthermore, in the subframe 22, behind the half mirror 52, a monitor light receiving element 56 to which the end of the flexible substrate 3 is connected is mounted.

(Configuration of actuator cover 7)
As shown in FIGS. 10 and 11, the actuator cover 7 is obtained by processing a single metal plate into a predetermined shape. As can be seen from a comparison between FIGS. 2 and 3, the driving IC 30 is formed on the flexible substrate 3. A trapezoidal first upper plate portion 71 covering the mounted region, and a U-shaped first upper plate portion 71 extending from the first upper plate portion 71 toward the objective lens driving mechanism 9 and covering the left and right wires. Two upper plate portions 72, a fixed plate portion 73 fixed to the device frame 2 with a screw at the tip of the second upper plate portion 72, and the device frame from the outer peripheral edge of the first upper plate portion 71. The two claw portions 74 and 75 extending to the lower surface side of the device frame 2 through the two side surfaces, and the device passing between the two claw portions 74 and 75 from the outer peripheral edge of the first upper plate portion 71. A side plate portion 76 extending to the lower side of the frame 2 and the side plate portion 76. Bent at its lower portion and a lower plate portion 77 which covers the lower surface of the device frame 2. Here, the boundary portion between the first upper plate portion 71 and the second upper plate portion 72 is formed as a stepped portion by pressing, and the boundary portion between the second upper plate portion 72 and the fixed plate portion 73 is also pressed. It is formed as a stepped part by processing. The actuator cover 7 configured as described above is arranged on the device frame 2 so that the first upper plate portion 71 overlaps the back surface side of the area where the driving IC 30 is mounted on the flexible substrate 3 via the heat dissipation sheet 18. It is attached.

[Method for Manufacturing Optical Head Device 1]
When assembling the optical head device 1 configured as described above, first, as shown in FIG. 5, the twin laser light source 4, the diffraction element 51, the half mirror 52, the sensor lens 54, and the collimating lens are formed with respect to the subframe 22. 53 is installed. At this stage, the signal detection light-receiving element 55 and the monitor light-receiving element 56 are not mounted on the subframe 22. The diffraction element 51 and the sensor lens 54 are only temporarily fixed by leaf springs 510 and 540, respectively.

  At this stage, the flexible substrate 3 is also not connected, but in this embodiment, the lead wire 11 is connected to the twin laser light source 4. For this reason, power is supplied from the lead wire 11, for example, the first laser chip for DVD in the twin laser light source 4 is turned on, and the first laser light emitted from the collimating lens 53 is observed. Then, the position on the optical axis of the twin laser light source 4 is adjusted so that the light emitted from the collimating lens 53 becomes collimated light. At that time, the position perpendicular to the optical axis of the twin laser light source 4 is also adjusted. Next, the second laser chip for CD is turned on, the first laser light emitted from the collimator lens 53 is observed, and the angular position of the twin laser light source 4 and the position of the diffraction element 51 are adjusted. Thereafter, the twin laser light source 4 is fixed with an adhesive.

  Further, the first laser light and the second laser light are emitted from the twin laser light source 4 while the signal generating light receiving element is held by a robot or the like, and the light emitted from the collimating lens 53 is emitted from the optical recording disk. The position of the signal generating light receiving element 55 and the sensor lens 54 is adjusted so that the reflected light forms a spot at a predetermined position of the signal detecting light receiving element 55. After such position adjustment, the signal detecting light receiving element 55 and the sensor lens 54 are bonded and fixed to the subframe 22.

  After performing such adjustment on the subframe 22, as shown in FIG. 4, the subframe 22 is mounted on the main frame 21 on which the raising mirror 59 is mounted. At this stage, the objective lens driving mechanism 9 is not mounted on the main frame 21.

  When the subframe 22 is mounted on the main frame 21, the first connecting plate portion 221 and the second connecting plate portion 222 of the subframe 22 are respectively connected to the first subframe connecting portion of the main frame 21. The positioning projections 218 and 219 of the main frame 21 are overlapped with the long holes 223 and the round holes 224 formed in the first and second connecting plate portions 221 and 222, respectively. Align so that fits. Further, the first laser chip 41 of the twin laser light source 4 is turned on, the emitted light from the rising mirror 59 is observed, and the inclination of the subframe 22 is adjusted.

  After performing such adjustment work, in the first sub-frame connection region 213 and the second sub-frame connection region 214, the edge of the first connection plate portion 221 and the edge of the second connection plate portion 222 After the UV curable adhesive is applied to the step portions 228 and 229 formed by the step, the adhesive is solidified by UV irradiation, and the first sub-frame connection region 213 and the second sub-frame connection region 214 have the first The connecting plate part 221 and the second connecting plate part 222 are bonded and fixed. At this time, the adhesive also enters the gap between the first subframe connection region 213 and the first connection plate portion 221 and the gap between the second subframe connection region 214 and the second connection plate portion 222. Therefore, the first sub-frame connection region 213 and the second sub-frame connection region 214, and the first connection plate portion 221 and the second connection plate portion 222 are in a surface-bonded state.

  Next, as shown in FIG. 3, the objective lens driving mechanism 9 is mounted on the main frame 21. In addition, the flexible substrate 3 on which the driving IC 30 is mounted is mounted. The end portions 31, 32, 33, and 34 of the flexible substrate 3 are connected to the wiring substrate 550 on which the signal detection light-receiving element 55 is mounted, the lead wire 11 electrically connected to the twin laser light source 4, and the monitor light-receiving element. 56.

  Next, the actuator cover 7 is attached to the apparatus frame 2 with the heat dissipation sheet 18 interposed between the flexible substrate 3 and the flexible substrate 3. Further, the upper surface cover 6 is attached to the upper surface of the device frame 2, and the lower surface cover 8 is attached to the bottom surface of the device frame 2. In this way, the optical head device 1 is completed.

[Main effects of this embodiment]
As described above, in the optical head device 1 of this embodiment, the device frame 2 has a structure in which the subframe 22 made of a zinc die-cast product is bonded and fixed to the main frame 21 made of a resin-made frame-like component. Therefore, the device frame 2 has sufficient strength. In addition, since the subframe 22 has high heat transferability and the mainframe 21 is inexpensive, according to this embodiment, the cost of the apparatus frame 2 is reduced and the weight is reduced, and the heat generated by the twin laser light source 4 is reduced. The heat can be transmitted to the upper surface cover 6 and the lower surface cover 8 via 22 to be radiated.

  Further, since the connection plate portions 221 and 222 of the subframe 22 are overlapped with the subframe connection regions 213 and 214 of the main frame 21 and bonded and fixed, the portion for fixing the subframe 22 to the main frame 21 is flat. Since no space is taken in the direction, the device frame 2 and the optical head device 1 can be reduced in size.

  Here, when the connecting plate portions 221 and 222 of the sub-frame 22 are overlapped with the sub-frame connecting regions 213 and 214 of the main frame 21, the thickness dimensions of the device frame 2 and the optical head device 1 are increased. The subframe connection regions 213 and 214 are lower than the end region 215 by at least the thickness dimension of the connection plate portions 221 and 222. Therefore, a configuration in which the connection plate portions 21 and 222 of the subframe 22 are overlapped with the subframe connection regions 213 and 214 of the main frame 21 without increasing the thickness dimensions of the device frame 2 and the optical head device 1 is adopted. it can. Therefore, according to this embodiment, the device frame 2 and the optical head device 1 can be reduced in size and thickness.

  Further, when such a configuration is adopted, if a steep step is formed in the boundary regions 216 and 217 between the subframe connection regions 213 and 214 and the end region 215, the strength rapidly changes at the step, Therefore, the main frame 21 is easily broken. In the present embodiment, however, the upper surfaces of the boundary regions 216 and 217 are tapered surfaces whose thickness dimension gradually decreases from the end region 215 side toward the subframe 22 connection region, so that the subframe connection regions 213 and 214 and In the boundary regions 216 and 217 with the end region 215, the intensity continuously changes and there is no inflection point. Therefore, according to this embodiment, the main frame 21 is not broken at the boundary regions 216 and 217 between the sub-frame connection regions 213 and 214 and the end region 215.

  Further, the connection plate portions 221 and 222 of the subframe 22 are formed from the edges of the connection plate portions 221 and 222 in the subframe connection regions 213 and 214 in a state where the connection plate portions 221 and 222 of the subframe 22 are overlapped with the subframe connection regions 213 and 214 of the main frame 21. After the adhesive is applied to the stepped portions 228 and 229, the subframe 22 is fixed to the main frame 21 by solidifying, so that there is an advantage that the adhesive strength is high.

  In this embodiment, since the lead wire 11 is connected to the twin laser light source 4, the twin laser light source 4, the diffraction element 51, the half mirror 52, the sensor lens 54, and the collimator lens 53 are mounted on the subframe 22. Even when the flexible substrate 3 is not connected in this state, the twin laser light source 4 can be supplied with power from the lead wire 11, and the twin laser light source 4 can be turned on for inspection and position adjustment. it can. For this reason, the flexible substrate 3 is not damaged when performing inspection and adjustment.

  In addition, after performing inspection and position adjustment by turning on the twin laser light source 4 on the sub frame 22, the sub frame 22 is connected to the main frame 21, and then the flexible substrate 3 is connected to the lead wire 11. The flexible substrate 3 is not damaged when the sub frame 22 is connected to the main frame 21.

  Furthermore, since the optical head device 1 according to the present embodiment also performs recording on the optical recording disk, the drive IC 30 generates a large amount of heat. For the drive IC 30, the twin laser light source 4 and the signal detection light receiving element 55 are provided. An extended portion (first upper plate portion 31) of the actuator cover 7 which is separate from the upper surface cover 6 to be covered is overlapped. For this reason, since the heat generated in the driving IC 30 is not transmitted to the top cover 6, the twin laser light source 4 and the signal detecting light receiving element 55 can be protected from the heat generated in the driving IC 30. In addition, since the actuator cover 7 faces the optical recording disk, the actuator cover 7 is cooled by the air flow generated by the rotation of the optical recording disk. Therefore, according to this embodiment, the heat generated in the driving IC 30 can be efficiently released.

It is a top view of the optical head device to which the present invention is applied. 1A to 1E are a plan view, a bottom view, a left side view, a right side view, and an O view in which the main body portion is enlarged by removing a part of the flexible substrate in the optical head device shown in FIG. It is -O sectional drawing. (A), (b) is the top view and bottom view of the state which respectively removed the upper surface cover, the lower surface cover, and the actuator cover from the main-body part of the optical head apparatus shown in FIG. (A)-(e) is the top view of the state which removed the flexible substrate and the objective lens drive device from the state shown in FIG. 3, respectively, a bottom view, a left view, a right view, and NN sectional drawing. . (A)-(c) is each the top view, bottom view, and JJ sectional drawing which extract and show a sub-frame from the state shown in FIG. It is a perspective view of the main frame used for the optical head apparatus shown in FIG. FIGS. 7A to 7E are a plan view, a bottom view, a left side view, a right side view, and a MM sectional view of the main frame shown in FIG. (A), (b) is the perspective view when the sub-frame used for the optical head apparatus shown in FIG. 1 is seen from diagonally upward, and the perspective view when seen from diagonally downward, respectively. FIGS. 9A to 9E are a plan view, a bottom view, a front view, a left side view, and a right side view, respectively, of the subframe shown in FIG. 8. FIG. 2 is a perspective view of an actuator cover used in the optical head device shown in FIG. 1. (A)-(d) is respectively the top view, bottom view, right view, and front view of an actuator cover which are shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical head apparatus 2 Apparatus frame 3 Flexible board 4 Twin laser light source 6 Upper surface cover 7 Actuator cover 8 Lower surface cover 9 Objective lens drive mechanism 11 Lead wire 12 E-type metal component 21 Main frame 22 Subframe 41 Laser chip 43 Submount 21 Main frame 51 Diffraction element 52 Half mirror 53 Collimating lens 55 Signal detection light receiving element 56 Front monitor light receiving element 59 Rising mirror 91 Objective lens 210 Subframe mounting area 213, 214 Subframe connection area 221, 222 Connection plate

Claims (4)

Light mounted on the apparatus frame includes a light emitting element, a signal detecting light receiving element, an optical path from the light emitting element to the optical recording disk, and an optical system forming an optical path from the optical recording disk to the signal detecting light receiving element. In the head device,
An optical head device, wherein a lead wire is electrically connected to a terminal of the light emitting element, and a flexible substrate is connected to the lead wire.   2. The apparatus frame according to claim 1, wherein the device frame includes a main frame having bearings formed at both ends thereof, and a plurality of optical elements connected to the main frame and constituting the light emitting element, the signal detecting light receiving element, and the optical system. An optical head device comprising: a subframe on which at least a part of the element is mounted. A light emitting element, a light receiving element for signal detection, and an optical system constituting an optical path from the light emitting element to the optical recording disk and an optical path from the optical recording disk to the signal detecting light receiving element are mounted on the apparatus frame. In the manufacturing method of the optical head device,
After electrically connecting a lead wire to the terminal of the light emitting element and before connecting a flexible substrate to the lead wire, at least the light emitting element in a state where the light emitting element is turned on by supplying power through the lead wire The method of manufacturing an optical head device is characterized in that a flexible substrate is connected to the lead wire. The apparatus frame according to claim 3, comprising a main frame having bearings formed at both ends thereof, and a sub frame connected to the main frame.
After mounting at least part of the plurality of optical elements constituting the light emitting element, the signal detecting light receiving element, and the optical system on the subframe, before connecting the subframe to the main frame, Adjust the position of at least the light emitting element in a state where the light emitting element is turned on by feeding power through a lead wire,
A method of manufacturing an optical head device, comprising: connecting the flexible substrate to the lead wire after connecting the sub frame to the main frame.

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