JP2007035800A - Circuit board shield plate and recording apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shield plate capable of easily conducting a shield plate and a ground pattern of a circuit board when a shield plate is arranged on an opposite surface of a circuit board on which a ground pattern is formed.
A shield plate 4 includes two substrate bypass grounding portions 221. The substrate bypass grounding portion 221 includes a single-sided panel substrate 6b having a pattern forming surface 12 having a ground pattern 9 formed on the substrate surface only on one surface. The shield plate 4 is fixed by making contact with the ground pattern 9 by detouring from the non-pattern-formed surface 13 of the single-sided panel substrate 6b.
As a result, the shield plate 4 and the ground pattern 9 can be reliably connected to each other, and the influence of noise on the single-sided panel substrate 6 can be reduced, and malfunction due to potential level variations can be reduced. . In addition, the assembly process can be simplified, leading to an improvement in productivity.
[Selection] Figure 5

Description

The present invention relates to a structure of a shield plate that shields a circuit board of an electronic device and a recording apparatus including the shield plate.

  2. Description of the Related Art Conventionally, many electronic devices including a plurality of circuit boards such as a control board for controlling electronic devices are used. The control board of such an electronic device may intrude static electricity from the outside, and the static electricity becomes noise, and there is no denying the possibility of adversely affecting the circuit operation on the control board. Also, radiation noise generated from electronic components on other circuit boards may adversely affect circuit operations on the control board. In addition, the noise flowing in the control board has an upper limit value according to the standard, and it is necessary to satisfy the standard. For this reason, there is also an electronic device in which a shield plate is provided so as to cover the control board and the shield plate is grounded, whereby noise due to static electricity entering the control board is emitted by the shield plate (see Patent Document 1).

Japanese Patent Laid-Open No. 06-115217

  In the electronic device described above, a shield plate is provided to reduce noise caused by static electricity and radiation noise generated from electronic components on other circuit boards, and the ground pattern on the control board and the shield plate are made conductive. However, a single-sided circuit board may be used as a control board for controlling the operation panel. When this single-sided circuit board is used as a control board for a carbon contact type button, the ground pattern of the single-sided circuit board is A shield plate will be arranged on the opposite side to the formed surface. For this reason, when the shield plate is fixed using screws or the like and indirectly connected to the ground pattern of the single-sided circuit board, a gap is easily formed between the ground pattern and the shield plate. Since the grounding is not stable, there is a possibility that the potential level varies and malfunctions.

  In addition, there was a connection member such as a copper wire between the shield plate and the ground pattern of the single-sided circuit board to make it conductive, but a grounding part for the connection member was newly provided on the shield plate and the single-sided circuit board. There is also a problem that the circuit becomes complicated and the productivity is lowered. Furthermore, it is difficult to install depending on the structure of the grounding portion, and there is also a problem that productivity is lowered.

  The present invention has been made in view of various problems as described above, and an object of the present invention is to provide a shield plate that can be directly connected to a ground pattern of a single-sided circuit board, and a recording apparatus including the shield plate. There is to do.

  In order to achieve the above object, the shield plate of the present invention is a shield plate that is arranged to be opposed to a substrate base member surface corresponding to the other surface of a single-sided circuit board having a pattern surface in which at least a ground pattern is formed on only one surface and shields it. In this case, a grounding member is provided for detouring from the substrate base member surface side to the pattern surface side and grounding the ground pattern.

  Thereby, the shield plate of this invention can conduct | electrically_connect a shield plate and the ground pattern of a single-sided circuit board directly, even when it is necessary to arrange | position a shield plate in the board | substrate base member surface side of a single-sided circuit board. Therefore, there is no gap between the shield plate and the ground pattern of the single-sided circuit board, and it is possible to prevent the ground pattern and the shield plate from being stably grounded and the potential level to vary and cause an operation failure. Furthermore, since the grounding member for grounding the ground pattern of the single-sided circuit board is provided on the shield plate, there is no need to provide other members such as a connecting member and a grounding part, and the production man-hours and parts costs are reduced. It is also possible to improve productivity.

  In the shield plate of the present invention, the grounding member is formed in a shape bent in an approximately L shape from the end of the plate. Thus, in the shield plate of the present invention, the grounding member is formed at a substantially right angle from the end of the plate toward the ground pattern surface of the single-sided circuit board. Therefore, since the ground member does not require a space for detouring to the single-sided circuit board, it is possible to use the shield plate even for the single-sided circuit board used in a narrow portion where there is no space.

  Further, in the shield plate of the present invention, the grounding member has a contact portion that contacts the ground pattern, and the single-sided circuit board is inserted substantially parallel to the contact portion, whereby the contact portion and the It is characterized by contacting the ground pattern. As a result, the shield plate of the present invention can be attached to the single-sided circuit board by sliding substantially parallel to the single-sided circuit board, so that the fixing position of the shield plate and the single-sided circuit board is positioned. This makes it easy to reliably contact the ground pattern with the contact portion. Furthermore, the shield plate can be easily assembled, and productivity can be improved.

  In the shield plate of the present invention, the ground member also serves as a fixing member for fixing to the single-sided circuit board. Thereby, the shield plate of this invention will be in the aspect fixed to a single-sided circuit board by a grounding member. Therefore, there is no need to provide a fixing member for fixing the shield plate, which leads to a reduction in component costs. Furthermore, when an external force or the like is applied to the shield plate, it is possible to maintain electrical connection between the ground member and the ground pattern of the single-sided circuit board.

  In order to achieve the above object, the recording apparatus of the present invention has a single-sided circuit board and includes the above-described shield plates. As a result, it is possible to provide a recording apparatus including a shield plate that exhibits the above-described effects.

  One of the embodiments will be described with reference to FIGS. The embodiments described below do not limit the invention according to the claims, and all the combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. Absent. First, the configuration of the recording apparatus according to the present embodiment will be described with reference to FIG.

  FIG. 1 is a perspective view of a recording apparatus according to an embodiment of the present invention as viewed from the front. The recording apparatus shown in FIG. 1 has functions such as a printer, a scanner, and a copy, and is a so-called multifunction device. An operation panel 2 is shown on the upper front side of the multifunction device main body 1. Further, an operation panel display device 3 is disposed at the center of the operation panel 2. Next, details of the operation panel 2 will be described with reference to FIGS.

  FIG. 2 is a perspective view of the operation panel 2 disposed in the multifunction machine main body 1 as viewed from the front, and FIG. 3 is a perspective view of the operation panel 2 as viewed from below. As shown in FIG. 2, the operation panel 2 includes a frame 10 serving as a base member, and the operation panel display device 3 described above is provided at the center of the frame 10. Operation buttons 26 are provided on both the left and right sides of the operation panel display device 3. The operation button 26 is formed of a plastic, and the multifunction device main body 1 can be operated by pressing the operation button 26.

  Further, as shown in FIG. 3, the operation panel 2 has an operation panel display device rotation shaft hole 15 at the center of the frame 10, and the operation panel display device 3 includes the operation panel display device rotation shaft hole. 15 is a mode in which a rotation shaft (not shown) provided in the operation panel display device 3 is arranged in a mode. Thereby, the operation panel display device 3 can be rotated to the near side as viewed from FIG. 2 around the rotation axis, and the angle of the operation panel display device 3 can be changed. Yes. In response to the operation of the operation button 26, an operation screen is displayed on the operation panel display device 3. Further, a panel substrate 6 is fixed to the lower part of the operation panel 2 in a state where it is shielded by a shield plate 4 including a characteristic portion of the present embodiment. A shield grounding member 5 is provided at the lower right side of the operation panel 2 in the figure. Next, a state where the shield plate 4 including the characteristic part of the present embodiment and the panel substrate 6 are removed from the operation panel 2 will be described with reference to FIG.

  FIG. 4 is an exploded perspective view showing a state where the shield plate 4 and the panel substrate 6 are removed from the operation panel 2. As shown in FIG. 4, substrate operation pads 16 are provided in the frame 10 on both the left and right sides of the panel display device 3. The board operation pad 16 is formed by attaching the operation buttons 26 shown in FIG. 2 to a rubber plate (not shown). The substrate operation pad 16 has a plurality of contacts 17 according to the contact position with the operation button 26, and these contacts 17 are made of carbon in this embodiment. The contact 17 is in contact with a pad contact portion (not shown) provided on the panel substrate 6 and can transmit to the panel substrate 6 which button of the operation buttons 26 has been pressed.

  Further, as described above, the operation panel 2 protrudes in the shape of a trapezoid at the center of the frame 10 in order to incorporate the operation panel display device 3 at the center of the frame 10 of the operation panel 2. And because of this trapezoidal protrusion, it is impossible to place other components in the center of the frame 10. Therefore, in the operation panel 2, the operation board operation pad 16 is divided into two and arranged on the left and right according to the operation buttons 26 provided on both the left and right. Next, the panel substrate 6 shielded by the shield plate 4 including the characteristic part of the present embodiment will be described.

  As shown in FIG. 4, the panel substrate 6 is roughly constituted by a double-sided panel substrate 6 a, a single-sided panel substrate 6 b, and a cable 7, and the double-sided panel substrate 6 a is arranged on the left side of the operation panel display device 3. The single-sided panel board 6b is disposed on the right side of the operation panel display device 3 in the figure and is electrically connected to each other by a cable 7 in this state. The panel substrate 6 is composed of two substrates because the operation panel display device 3 is disposed at the center of the frame 10 to which the panel substrate 6 is attached, and therefore the substrate is disposed at the center of the frame 10. It is because it cannot be done.

  The double-sided panel substrate 6a is a circuit board having a pattern forming surface 12 (pattern surface) having a ground pattern 9 formed on the substrate surface on both sides, and the single-sided panel substrate 6b has a ground pattern 9 formed on the substrate surface. The circuit board having the pattern forming surface 12 only on one side. Therefore, as for the single-sided panel board | substrate 6b, the back surface of the pattern formation surface 12 is the pattern non-formation surface 13 (board | substrate basic member surface) in which the ground pattern 9 is not formed. The pattern forming surface 12 of the single-sided panel substrate 6 b faces the substrate operation pad 16.

  In addition, although the lead component is used for the electronic component mounted on the double-sided panel substrate 6a, the lead component is not used for the electronic component mounted on the single-sided panel substrate 6b, and all the above electronic components are surface-mounted. Uses parts of the form. As a result, the space on the panel substrate 6 is reduced as much as possible. Next, the shield plate 4 including the characteristic part of the present invention will be described.

  As shown in FIG. 4, the shield plate 4 is a shield member that shields the panel substrate 6 of the operation panel 2 formed by pressing a thin metal plate. The shield plate 4 has a concave shape at the center, and has three contact portions 22a in contact with the double-sided panel substrate 6a on the left side when viewed from the front of the figure, and a single-sided panel substrate on the right side when viewed from the front of FIG. Two contact portions 22b that come into contact with 6b are provided, and a grounding member fixing hole 52 is formed in the vicinity of the contact portion 22b. Then, two substrate bypass grounding portions 221 that are characteristic portions of the present embodiment are provided on the side where the contact portion 22b is formed, and the plate grounding member 5 is disposed below the contact portion 22b in this aspect. It is a fixed aspect.

  The contact portion 22a is a substantially L-shaped member and has a hole for passing a screw or the like. The contact portion 22a is a fixing portion for contacting the pattern forming surface 12 on the side not contacting the substrate operation pad 16 of the double-sided panel substrate 6a to fix the shield plate 4 to the double-sided panel substrate 6a. It has a function as a conduction part with the ground pattern 9 of the panel board | substrate 6a. The noise generated on the double-sided panel substrate 6a is conducted from the ground pattern to the shield plate 4 via the contact portion 22a.

  Next, the contact portion 22b is a substantially L-shaped member and has a hole for passing a screw or the like. The contact portion 22b is a fixing portion for fixing the shield plate 4 to the single-sided panel substrate 6b. However, unlike the contact portion 22a, the contact portion 22b is in contact with the non-pattern-formed surface 13 of the single-sided panel substrate 6b and fixes the shield plate 4 to the single-sided panel substrate 6b. There is no conduction.

  The plate grounding member 5 is a grounding member for electrically connecting the shield plate 4 and a main control board shield box 11 shown in FIG. The plate grounding member 5 includes a screwing portion 53 that comes into contact with the contact portion 22b and a penetration portion 54 that penetrates into a grounding member fixing hole 52 formed in the shield plate 4 and positions the fixing position of the plate grounding member 5. And has two parts. The plate grounding member 5 comes into contact with the contact portion 22b in a state where the grounding member fixing hole 52 penetrates the penetration portion 54, and is fixed together when the shield plate 4 is fixed to the single-sided panel substrate 6b. .

  The board bypass grounding portion 221, which is a characteristic part of the present invention, is a grounding member formed in the vicinity of a portion of the shield plate 4 that faces the single-sided panel board 6 b. The substrate bypass grounding part 221 is a substantially L-shaped member, and is configured such that the contact part 22b and the substrate bypass grounding part 221 can be locked with the single-sided panel substrate 6b interposed therebetween. And this board | substrate bypass grounding part 221 has the pattern contact part 222 (contact part) in the position which contact | abuts directly the front-end | tip part of an L-shaped member, and the ground pattern 9 of the single-sided panel board | substrate 6b. The pattern contact portion 222 is in direct contact with the ground pattern 9 formed on the pattern forming surface 12 of the single-sided panel substrate 6b, so that the ground pattern 9 and the shield plate 4 can be electrically connected.

  Although a plurality of through holes are shown in the shield plate 4, these through holes are provided for fixing the shield plate 4 to the panel substrate 6, and therefore description of each through hole is omitted. Next, the attachment method of the shield plate 4 including the characteristic part of this embodiment is demonstrated using FIG.

  FIG. 5A is a perspective view of the state in which the shield plate 4 including the characteristic part of the present embodiment is fixed to the single-sided panel substrate 6b as seen from the single-sided panel substrate 6b side, and FIG. FIG. 5 is a perspective view of a state in which a shield plate 4 including a characteristic portion of the present embodiment is fixed to a single-sided panel substrate 6b as viewed from the plate grounding member 5 side.

  As shown in FIG. 5A, in the shield plate 4 of this embodiment, the substrate bypass grounding portion 221 bypasses the single-sided panel substrate 6b, and the pattern contact portion 222 of the substrate bypass grounding portion 221 forms the pattern. The surface 12 is brought into contact with the surface 12. The contact portion 22b is in contact with the non-pattern-formed surface 13 of the single-sided panel substrate 6b. As a result, the shield plate 4 is locked to the single-sided panel substrate 6b while being sandwiched between the pattern contact portion 222 and the contact portion 22b. For this reason, the shield plate 4 cannot be fixed by simply abutting it, and is inserted into the single-sided panel substrate 6a substantially horizontally from the X direction shown in FIG. 5A. The shield plate 4 can be locked. Then, as shown in FIG. 5B, the shield plate 4 is engaged with the contact portion 22b, the single-sided panel substrate 6b, and the substrate bypass grounding portion 221 by the shield fixing screw 27 while being locked to the single-sided panel substrate 6b. Threaded and fixed. Further, in the plate grounding member 5, the screwing portion 53 comes into contact with the contact portion 22b in a state where the penetration portion 54 is inserted into the grounding member fixing hole 52, and the contact portion 22b and the single-sided panel substrate 6b are contacted by the shield fixing screw 27. The shaft is fixed together with the substrate bypass grounding part 221.

  The shield plate 4 can be abutted against the double-sided panel substrate 6a and fixed by screwing, so that the double-sided panel substrate 6a and the single-sided panel substrate 6b can be attached at the time of mounting. There is no pulling through the cable 7 that electrically connects each other. Therefore, no load is applied to the connection portion between the cable 7 and the double-sided panel substrate 6a or single-sided panel substrate 6b, and the cable 7 may be disconnected when the shield plate 4 is attached to the double-sided panel substrate 6a or single-sided panel substrate 6b. It is possible to prevent.

  The shield plate 4 is attached to the lower portion of the operation panel 2 as shown in FIG. At this time, as described above, the shield plate 4 is in a state in which the central portion is recessed, so that the operation panel display device 3 incorporated in the central portion of the operation panel 2 can be avoided and attached. In this state, the cable 7 can be shielded. This is because the cable 7 may serve as an antenna against static electricity entering from the outside, which may cause noise due to static electricity to enter the double-sided panel substrate 6a and the single-sided panel substrate 6b. If noise intrudes, the detection signal output from the panel substrate 6 is adversely affected.

  Furthermore, there is a possibility that noise due to static electricity that has entered the panel substrate 6 from the outside flows to other circuit boards and causes the electronic components mounted on the other circuit boards to malfunction. In addition to the above-mentioned static noise, high-frequency noise is also generated from electronic components mounted on other circuit boards, for example, switching elements on a power supply board. 6 may also be adversely affected. This phenomenon is caused by the fact that a predetermined potential level existing between the patterns fluctuates due to the intrusion of these noises. In particular, if the potential level of the ground pattern that serves as a reference for the potential level of each pattern changes, the potential level of the other pattern also fluctuates, adversely affecting each circuit board, and the reference for electronic components attached to other circuit boards. There is also a possibility of causing a malfunction by changing the level.

  Therefore, in the shield plate 4 of this embodiment, the cable 7 is also shielded together. As a result, it is possible to prevent the cable 7 from serving as an antenna and to prevent noise from entering the double-sided panel substrate 6a and the single-sided panel substrate 6b. Next, a mechanism for releasing noise from the shield plate 4 will be described with reference to FIG.

  FIG. 6 is a diagram showing a state in which the plate grounding member 5 of the operation panel 2 is grounded to the main control board shield box 11. As shown in the figure, a main control board 14 shielded by a main control board shield box 11 is disposed under the operation panel 2, and the plate grounding member 5 is connected to the main control board shield box 11. The main control board shield box 11 and the operation panel 2 are brought into electrical contact with each other. The operation panel 2 is arranged in such a manner that a predetermined angle of inclination is given as viewed from the main control board 14, and projects forward from the main control board 14.

  The plate grounding member 5 is in contact with the upper part of the main control board shield box 11 so as to be pressed, and is pulled in the depth direction as viewed from FIG. However, the plate grounding member 5 is formed in a thin plate shape made of metal, and tries to return to the position before being pressed against the upper portion of the shield box 11 for the main control board due to the rigidity of the metal. The board shield box 11 is pressed downward. Thereby, the plate grounding member 5 is fixed to the upper part of the main control board shield box 11.

  The shield box 11 for the main control board is electrically connected to a grounding terminal (not shown) of the multi-function device main body 1 so that unnecessary noise such as static electricity entering from the outside and radiation noise generated from various electronic components is transmitted to the outside through the grounding wire. Released. As a result, the main control board 14 can reduce noise.

  The operation panel 2 is attached with the shield plate 4 in the above-described configuration, and the plate grounding member 5 of the shield plate 4 is in contact with the shield box 11 of the main control board 14 as shown in FIG. And the main control board shield box 11 are made conductive. The main control board shield box 11 is electrically connected to a grounding terminal (not shown) of the multifunction machine main body 1 and emits unnecessary noise such as static electricity entering from outside and radiation noise generated from various electronic components to the outside through the grounding wire. ing. Therefore, static electricity that has entered the panel substrate 6 from the outside or radiation noise generated from electronic components mounted on other circuit boards is caused by the panel substrate 6 or the cable 7 -ground pattern 9 -substrate bypass grounding portion 221 -shield plate 4- The plate ground member 5 -the main control board shield box 11 -the ground terminal of the multi-function device main body 1 -the ground wire is discharged to the outside. Thereby, noise can be reduced. Next, the mechanism by which the potential level of the ground pattern 9 in contact with the shield plate 4 of this embodiment varies will be described with reference to FIG.

  FIG. 7 is a diagram simply showing the mechanism by which the potential level of the ground pattern varies. Here, the mechanism by which the potential level of the ground pattern serving as a reference for the potential level of each pattern varies will be described. As shown in FIG. 7, the electronic components P and Q mounted on the wiring pattern of the circuit board are connected to the ground pattern G of the circuit board through the ground terminals G1 and G2 of the electronic components P and Q at a distance. If it is, the ground pattern G has an impedance Zg corresponding to the distance between the ground terminals G1 and G2. Therefore, when the current Ia flows from the ground terminal G1 of the electronic component P to the ground pattern G, the potential of the ground pattern G varies by IaZg, and the potential level of the ground terminal G2 of the component Q also varies by this potential. . If the ground terminals of a plurality of electronic components are simply connected to the ground pattern in this way, they are easily affected by noise due to the impedance Zg of the ground pattern G. Therefore, as a countermeasure, the ground pattern G is often a solid pattern provided on the inner layer surface of the circuit board.

  However, in the case of a single-sided circuit board such as the single-sided panel board 6b used in this embodiment, the ground pattern G and other patterns are often formed in the same layer. Therefore, another pattern is formed around the electronic component mounted on the single-sided circuit board, the solid pattern of the ground pattern G is formed at a position far from the electronic component, and the electronic component cannot be directly connected to the solid pattern. . Therefore, the ground pattern G is connected to the solid pattern formed far from the electronic component. This thin pattern has an impedance corresponding to the distance from the electronic component to the solid pattern, and is easily affected by noise as described above.

  In the present embodiment, the ground pattern 9 is formed as a solid pattern in a place where no other pattern is formed. Therefore, as described above, the solid pattern is formed at a position far from the electronic component, and the solid pattern is connected to the solid pattern by a thin pattern. As described above, this thin pattern is susceptible to noise. Therefore, the operation panel 2 of the present embodiment is configured such that noise is less likely to enter the panel substrate 6 by fixing the shield plate 4 to the frame 10 so as to cover the panel substrate 6.

  By providing the various configurations described above, the shield plate 4 of the present embodiment is in a mode in which the ground pattern 9 of the single-sided panel substrate 6b and the shield plate 4 are directly conducted. Thereby, there is no need to provide a dedicated grounding member, and the ground pattern 9 and the shield plate 4 can be reliably conducted. Furthermore, since it can be directly grounded and conducted, the grounding between the ground pattern 9 and the shield plate 4 does not become unstable due to a gap or the like, and the possibility that the potential level varies and malfunctions can be reduced. Further, since the shield plate 4 is inserted by being inserted substantially in parallel, the pattern contact portion 222 and the contact portion of the ground pattern 9 can be reliably brought into contact between the single-sided panel substrate 6b and the shield plate 4. It becomes. In this manner, noise generated on the single-sided panel board 6b and radiation noise generated from other control boards and the like can be surely removed. Compared to the case of using a dedicated grounding member, the cost and the work are reduced. Excellent in terms of man-hours.

  Note that the scope of the present invention is not limited to the above-described embodiments, and can be applied to various other embodiments as long as they do not contradict the description of the claims. For example, in another embodiment of the present invention, the substrate bypass grounding portion 221 is an L-shaped member, but is not particularly limited thereto. For example, the substrate bypass grounding part 221 may be V-shaped or U-shaped. Further, the substrate bypass grounding portion 221 may be formed so as to be removable from the shield plate 4 or may be formed of an elastically deformable material. As a result, the shield plate 4 can be used for the single-sided panel substrate 6 housed in a case of any shape.

  In the present embodiment, the contact portion 22b of the shield pattern 4 is fixed to the panel substrate 6 with screws as fixing means. However, the present invention is not limited to this, and may be fixed by other fixing means. good. For example, a claw for fixing the single-sided panel substrate 6b may be provided on the substrate bypass grounding portion 221 and fixed by this claw. As a result, the shield plate 4 can be fixed even with respect to the single-sided panel substrate 6b in which the shield plate 4 cannot be screwed.

  In the present embodiment, as shown in FIG. 5, the number of substrate bypass grounding portions 221 is two, but the number of substrate bypass grounding portions 221 of the present embodiment is not limited to this mode. For example, one or three or more may be used. Thereby, the positioning accuracy of the pattern contact portion 222 of the shield plate 4 can be adjusted. Further, in the present embodiment, the plate grounding member 5 is in contact with the upper part of the main control board shield box 11 as shown in FIG. 3, but the present invention is not limited to this, and the main control board is not limited to this. Any portion may be used as long as it is in contact with the shield box 11 for use.

  As described above, according to the shield plate 4 (shield plate) of the present embodiment, the single-sided panel substrate provided with the pattern forming surface 12 (pattern surface) in which at least the ground pattern 9 (ground pattern) is formed only on one surface. 6 b (a single-sided circuit board) is a shield plate 4 that is disposed opposite to the non-pattern-forming surface 13 (substrate base member surface) that shields and shields from the non-pattern-forming surface 13 side to the pattern-forming surface 12 side. And a substrate bypass grounding portion 221 (grounding member) that bypasses and grounds to the ground pattern 9 is provided.

  As a result, the shield plate 4 of the present embodiment has the ground pattern 9 of the shield plate 4 and the single-sided panel substrate 6b even when the shield plate 4 needs to be disposed on the non-pattern-formed surface 13 side of the single-sided panel substrate 6b. Can be conducted directly. Therefore, there is no gap between the shield plate 4 and the ground pattern 9 of the single-sided panel substrate 6b, the ground pattern 9 and the shield plate 4 are stably grounded, the potential level varies, and the operation is poor. Can be prevented. Further, since the substrate bypass grounding portion 221 for grounding the ground pattern 9 of the single-sided panel substrate 6b is provided on the shield plate 4, there is no need to provide other members such as a connecting member and a grounding portion, and production is possible. Since man-hours and parts costs are reduced, productivity can be improved.

  Further, the shield plate 4 according to the present embodiment is characterized in that the substrate bypass grounding portion 221 is formed in a shape bent from the end of the shield plate 4 into a substantially L shape. As a result, the shield plate 4 according to the embodiment has the substrate bypass grounding portion 221 formed at a substantially right angle from the end of the shield plate 4 toward the ground pattern 4 surface of the single-sided panel substrate 6b. Therefore, since the board bypass grounding portion 221 does not require a space for bypassing to the single-sided panel board 6b, the shield plate is also used for the single-sided panel board 6b used in a narrow part having no space. 4 can be used.

  Further, in the shield plate 4 of the present embodiment, the substrate bypass grounding portion 221 has a pattern contact portion 222 (contact portion) that contacts the ground pattern 9, and the single-sided panel substrate 6 b is attached to the contact portion. The pattern contact portion 222 and the ground pattern 9 are brought into contact with each other by being inserted substantially in parallel. Thereby, since the shield plate 4 of this embodiment can be attached to the single-sided panel substrate 6b by sliding substantially parallel to the single-sided panel substrate 6b, the shield plate 4 and the above-mentioned It becomes easy to position the fixed position of the single-sided panel substrate 6b, and the ground pattern 9 and the pattern contact portion 222 can be reliably brought into contact with each other. Furthermore, the shield plate 4 can be easily assembled, and productivity can be improved.

  Further, the shield plate 4 of the present embodiment is characterized in that the substrate bypass grounding portion 221 also functions as a contact portion 22b for fixing to the single-sided panel substrate 6b. Thereby, the shield plate 4 of the present embodiment is fixed to the single-sided panel substrate 6b by the substrate bypass grounding portion 221. Therefore, there is no need to provide the contact portion 22b for fixing the shield plate 4, which leads to a reduction in component costs. In addition, the substrate bypass grounding part 221 can be reliably connected to the ground pattern 9 of the single-sided panel substrate 6b.

  In order to achieve the above object, the MFP main body 1 (electronic device) of the present embodiment has a single-sided panel substrate 6b and is provided with the shield plates 4 described above. As a result, it is possible to provide the multi-function device main body 1 (electronic device) including the shield plate 4 having the above-described effects.

  For example, a printer, a facsimile machine, a copier, etc. can be applied to any recording apparatus that uses a circuit board having a ground pattern formed on only one surface and uses a shield plate that is grounded from the other side.

1 is a perspective view of a multifunction device main body according to an embodiment of the present invention as viewed from the front. FIG. 3 is a perspective view of an operation panel arranged on the multifunction device main body as viewed from the front. It is the perspective view which looked at the operation panel from the lower part. It is a disassembled perspective view of an operation panel. It is a perspective view showing how to attach a shield plate to a panel substrate It is a perspective view for demonstrating the grounding of a shield plate and the shield box for main control boards. It is the figure which showed simply the mechanism in which the electric potential level of a ground pattern fluctuates.

Explanation of symbols

1 Main body (electronic device), 2 operation panel, 3 operation panel display device, 4 shield plate, 5 plate grounding member, 6 panel substrate, 6a double-sided panel substrate, 6b single-sided panel substrate (single-sided circuit board), 7 cable , 9 Ground pattern, 10 frame, 11 Shield box for main control board, 12 Pattern formation surface (pattern surface), 13 Pattern non-formation surface (substrate base member surface), 14 Main control board, 15 Operation panel display rotation axis Hole, 16 substrate operation pad, 17 contact 22a, 22b contact portion, 221 substrate bypass grounding portion (grounding member), 222 pattern contact portion (contacting portion), 26 operation button, 27 shield fixing screw, 52 grounding member fixing hole, 53 Screwing part, 54 Penetration part, G General circuit board ground pattern, G1 Electronic component P ground Terminal, G2 Ground terminal of electronic component Q, Ia Current flowing from the ground terminal of electronic component P to the ground pattern, P, Q Electronic component, Zg Impedance of ground pattern

Claims (5)

A shield plate that is arranged to be opposed to a substrate base member surface corresponding to the other surface of a single-sided circuit board having a pattern surface on which at least a ground pattern is formed on only one surface,
A shield plate, characterized in that a grounding member is provided for detouring from the substrate base member surface side to the pattern surface side and grounding to the ground pattern. 2. The shield plate according to claim 1, wherein the grounding member is formed in a shape bent in a substantially L shape from an end portion of the plate. The grounding member has a contact portion that contacts the ground pattern,
The shield plate according to claim 1 or 2, wherein the contact portion and the ground pattern are brought into contact with each other by inserting the single-sided circuit board substantially parallel to the contact portion. The shield plate according to any one of claims 1 to 3, wherein the grounding member also serves as a fixing member for fixing to the single-sided circuit board. A recording apparatus for recording on a recording medium, comprising the shield plate according to any one of claims 1 to 4.

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