JP2007035689A - Manufacturing method of electronic component built-in substrate - Google Patents

Abstract

A method for manufacturing an electronic component built-in substrate capable of efficiently producing a plurality of electronic component built-in substrates at once is provided.
A first insulating layer including at least an uncured thermosetting resin and a second insulating layer including at least an uncured thermosetting resin laminated on an upper surface of the first insulating layer. And a first metal foil laminated on the upper surface of the second insulating layer, and a first metal foil laminated at least on the surface of the substrate on which the electronic component is not mounted. 3 and the second metal foil laminated on the upper surface of the third insulating layer are collectively heated and pressed to produce an electronic component built-in substrate.
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing an electronic component built-in substrate in which electronic components are embedded.

  Conventionally, this type of electronic component built-in substrate has a configuration as shown in FIGS.

  7 and 8 show a conventional method for manufacturing an electronic component built-in substrate.

  First, as shown in FIG. 7 (a), a double-sided through-hole printed wiring board 7 in which electronic component elements such as a chip capacitor 2, a resistor chip 3 or a power transistor chip 4 are attached and disposed on an electrically insulating substrate 1 with solder 6 is provided. prepare. Next, a thermosetting resin-impregnated laminated material 10 is laminated on both sides of the double-sided through-hole printed wiring board 7, and a metal foil 9 is further laminated on the outermost surface of the laminated material 10, thereby obtaining a structure as shown in FIG. .

  After that, the structure is sandwiched by a backing plate, inserted into a press, heated and pressurized, an electronic component element is embedded in the cured electric insulating layer 11 of the laminated material 10, and a metal foil 9 is bonded at the same time, as shown in FIG. Thus, a double-sided metal foil-clad laminate with electronic component elements embedded in the inner layer is obtained.

  Next, after the metal foil circuit 12 having a predetermined pattern is formed from the double-sided metal foil-clad laminate by photographic printing or screen printing, the purpose is to conduct the terminal electrode circuit 5 of the built-in electronic component element and the metal foil circuit 12. The printed wiring board which has an electronic component element in an inner layer is obtained by providing the through-hole 13 which forms an electrical conductor, ie, the through-hole plating layer 14 of FIG.7 (d).

  FIG. 8 shows another conventional method for manufacturing an electronic component built-in substrate. 8 (a) and 8 (b), a multilayer wiring substrate 701 formed by laminating glass epoxy substrates 702, 703, 704, 705, and 706 is subjected to photo on one main surface of glass epoxy substrates 704 and 705. Conductive patterns 716, 717, 718, 719, and 720 are formed by an etching method.

  Next, the glass epoxy substrate 703 is provided with through holes 733 penetrating in the respective thickness directions, and the glass epoxy substrate 704 is provided with through holes 734 and 735 penetrating in the respective thickness directions. .

  Next, chip capacitors 724 and 725 are fixed between the conductive patterns 716 and 717 and the conductive patterns 718 and 719, and a chip resistor 726 is fixed between the conductive patterns 719 and 720 with solder. Next, after the glass epoxy substrates 702 to 706 are overlapped via an adhesive layer (not shown), a laminated structure 709 is formed by heating and pressing.

  Next, through holes 736, 737, 738 penetrating from one main surface of the laminated structure 709 to the other are formed, and the entire inner surface of the through holes 736-738 is formed by a method such as electroless plating with a material such as copper. Plating layers 739, 740, and 741 are formed, and conductive patterns 713 to 715 are obtained.

  Next, on one main surface of the laminated structure 709, circuit patterns 742, 743, and 744 are formed by a photo-etching method so as to be electrically connected to the conductive patterns 713, 714, and 715, respectively. A substrate 701 is obtained.

As prior art document information related to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.
JP 54-104564 A Japanese Patent Laid-Open No. 2-74099

  However, in the manufacturing method of the electronic component built-in substrate as described above, the front and back surfaces of the double-sided copper-clad laminate including the electronic components as shown in FIG. In the structure provided with the through hole, when forming the plating layer inside the through hole for connecting the through hole, a power supply line for plating is required in advance. There has been a problem that a space for forming an extra wiring pattern has to be secured.

  Further, in the electronic component built-in substrate as shown in FIG. 8, a method is used in which a through-hole penetrating the front and rear surfaces is formed after the electronic component is embedded, and then through-hole connection is performed by plating and then the front and rear surfaces are patterned. Therefore, the metal foil on the front and back surfaces that exist immediately after forming the laminated structure can be used as the power supply line for plating, and the metal foil on the front and back surfaces can be processed into a desired pattern after plating. Therefore, there is an advantage that an unnecessary wiring pattern is not formed in the completed module, but the insulating layer which is the built-in layer used in the process of incorporating the electronic component is a glass epoxy substrate after curing. When the glass epoxy substrates are later laminated, an adhesive layer is used to laminate the glass epoxy substrates. Layer, only a material necessary for adhesion between the glass epoxy substrate, does not say to fill the resin component of the adhesive layer in the space of the glass epoxy substrate formed to internal electronic components. Therefore, even after the completion of the electronic component built-in substrate, the space around the built-in electronic component remains at the boundary with the glass epoxy substrate.

  Therefore, since the built-in electronic components are mounted using solder, when another electronic component is mounted on the electronic component built-in board to form a desired module, the other electronic component is mounted by soldering. In the heating conditions necessary for this, the solder used in the built-in electronic components also remelts and easily flows out into the space around the electronic components, causing a short circuit defect. It was.

  Moreover, in this type of electronic component built-in board, the built-in component is solder-mounted, but the wiring layer to be solder-mounted has only a metal foil pattern made of copper foil, etc. In this case, there is a problem in that the solder may be transmitted through the metal foil in addition to the desired electrode and the solder may spread and cause mounting defects.

  An object of the present invention is to solve the above-mentioned conventional problems and to provide a method of manufacturing an electronic component built-in substrate excellent in connection reliability and mass productivity.

  In order to solve the above problems, the present invention provides a substrate, at least one or more electronic components mounted on the substrate, and a space that is stacked on the upper surface of the substrate and that is larger than the outer dimensions of the electronic components. A first insulating layer containing at least an uncured thermosetting resin, and a second insulating layer containing at least an uncured thermosetting resin laminated on the upper surface of the first insulating layer; A first metal foil laminated on an upper surface of the second insulating layer; and a third metal foil including at least an uncured thermosetting resin laminated on a surface side of the substrate on which the electronic component is not mounted. Forming a laminated board with built-in electronic components by collectively heating and pressing an insulating layer and a second metal foil laminated on the upper surface of the third insulating layer; and at a desired position of the laminated board A step of forming a through hole, and through the through hole A step of electrically connecting the substrate, the first metal foil and the second metal foil, and processing the first metal foil and the second metal foil into a desired shape to form a wiring pattern And a method of manufacturing an electronic component built-in substrate comprising a forming step and a step of forming a solder resist having a desired shape on the first metal foil and the second metal foil on which the wiring pattern is formed. Since the multilayer substrate with the wiring pattern formed is used as the input substrate for the process, it is possible to inspect the multilayer wiring substrate part before mounting the built-in electronic component, and mount the electronic component even on the defective substrate part Thus, it is possible to avoid useless use of electronic components and to inspect the state even after the electronic components are mounted. In addition, the metal foil on the front and back surfaces that exist when the electronic component built-in laminate is formed can be used as a power supply line for plating, and the metal foil on the front and back surfaces can be processed into a desired pattern after plating. Therefore, there is an effect that an unnecessary wiring pattern is not formed in the completed module.

  As described above, according to the present invention, since the multilayer substrate on which the wiring pattern has been formed is used as the input substrate for the process, it is possible to inspect the multilayer wiring substrate portion before mounting the built-in electronic component, It is possible to avoid useless use of electronic components such as mounting the electronic components up to the defective substrate portion, and to inspect the state even after the electronic components are mounted. In addition, the metal foil on the front and back surfaces that exist when the electronic component built-in laminate is formed can be used as a power supply line for plating, and the metal foil on the front and back surfaces can be processed into a desired pattern after plating. Therefore, an unnecessary wiring pattern is not formed in the completed module, and the wiring capacity of the wiring pattern on the surface layer portion of the electronic component built-in substrate can be dramatically improved. Further, by forming a solder resist in advance before mounting the electronic component on the surface side of the multilayer wiring board on which the electronic component is mounted, it becomes possible to use solder to connect the built-in electronic component. Furthermore, it is possible to completely fill the thermosetting resin in the space for incorporating the electronic components, and obtain an efficient number in the case of manufacturing a plurality of substrates with built-in electronic components collectively. It becomes possible.

(Embodiment 1)
Hereinafter, the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a manufacturing process of an electronic component built-in substrate according to Embodiment 1 of the present invention.

  In FIG. 1A, a wiring board 101 is a multilayer wiring board in which an electrode 102 on the front surface, an inner layer wiring pattern 104, an inner via 103, and an electrode 105 as a wiring pattern are formed on the back surface.

  The electrodes 102 and 105 and the wiring pattern 104 are made of a material having electrical conductivity, for example, a Cu (copper) foil or a conductive resin composition. In the present invention, Cu foil is used.

  The inner via 103 is made of a thermosetting conductive material such as a conductive resin composition in which metal particles and a thermosetting resin are mixed. As the metal particles, Au (gold), Ag (silver), Cu, or the like can be used. Au, Ag, or Cu is preferable because of its high conductivity, and Cu is particularly preferable because of its high conductivity, low migration, and low cost. As the thermosetting resin, for example, an epoxy resin, a phenol resin, or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance.

  Next, as shown in FIG. 1B, electronic components 108 a and 108 b are mounted using solder 109 at predetermined positions on the wiring board 101. The electronic components 108a and 108b include, for example, active components that are semiconductor elements such as transistors, ICs, and LSIs, and passive components that are surface-mounted components such as resistors, capacitors, inductors, vibrators, and filters.

  The solder 109 may be a Pb—Sn (lead-tin) -based eutectic solder, a Pb-free solder (eg, Sn—Ag—Cu (tin-silver-copper), Ag—Sn (silver-tin), Sn—Zn). A (tin-zinc) system can be used, but in any case, since the melting point is 230 ° C. or lower, even a non-heat-resistant component can be used.

  At this time, it is important to form the solder resist 106 on the surface side on which the electronic components 108a and 108b on the wiring substrate 101 are mounted. In addition to the electrode 102, the mounting surfaces of the electronic components 108a and 108b of the wiring board 101 are formed with a large number of wiring patterns that connect the electrodes. Usually, this wiring pattern is also formed of the same material as the electrode 102. Is also formed using Cu foil. Therefore, when the electronic components 108a and 108b are mounted using the solder 109, the solder 109 is not limited to the electrode 102 without any ingenuity, but easily spreads to the wiring pattern and spreads out to the wiring pattern. This causes a connection failure 108b.

  As a countermeasure, the solder resist 106 having an opening corresponding to the electrode 102 is formed on the surface of the wiring board 101 where the electronic components 108a and 108b are mounted, thereby preventing the solder 109 from flowing out to the wiring pattern. It becomes possible to do.

  In addition, since the wiring board 101 on which the wiring pattern has been formed is used as the input board for the process, it is possible to inspect the quality of the wiring board 101 before mounting the built-in electronic components 108a and 108b. It is possible to avoid useless use of electronic components such as mounting the electronic components 108a and 108b, and to inspect the state even after the electronic components 108a and 108b are mounted.

  Note that flux cleaning after mounting the electronic components 108a and 108b is one of the most important items in satisfying the reliability of the electronic component built-in substrate.

  Next, as shown in FIG. 1C, the first insulating layer 120 and the second insulation are formed on the surface of the wiring board 101 on which the electronic components 108a and 108b have been mounted. The layer 122 and the first metal foil 123 are overlaid at a desired position, and the third insulating layer 131 and the second metal foil 132 are overlaid on the surface of the wiring board 101 where the electronic components 108a and 108b are not mounted. Thereafter, heating and pressurization are performed by a press machine (not shown).

  The 1st insulating layer 120, the 2nd insulating layer 122, and the 3rd insulating layer 131 are comprised with the prepreg which impregnated the thermosetting resin of the uncured state to the woven fabric or the nonwoven fabric. As the prepreg, a glass epoxy prepreg in which a glass cloth is impregnated with a thermosetting epoxy resin, a BT resin prepreg in which a glass cloth is impregnated with a thermosetting bismaleidotriamide resin, and a thermosetting epoxy resin in an aramid nonwoven fabric It is possible to use an aramid prepreg impregnated with, but various materials can be used as long as the structure is obtained by impregnating a thermosetting resin into a woven fabric or a non-woven fabric. In addition to a structure in which a woven fabric or a non-woven fabric is impregnated with a thermosetting resin, it is also possible to use a mixture of an inorganic filler such as silicon dioxide or alumina and a thermosetting resin.

  Note that the first insulating layer 120, the second insulating layer 122, and the third insulating layer 131 are preferably made of materials having the same composition in order to prevent warpage or deformation of the substrate.

  A space 121 is formed in the first insulating layer 120 so as not to contact the electronic components 108a and 108b. Even when a plurality of electronic components 108a and 108b as shown in FIG. 1C are mounted, this space 121 is a single space that surrounds the entire mounting area. By doing so, the processing of the space 121 can be simplified, so that the manufacturing process can be simplified.

  In addition, the first insulating layer 120 is formed to be thicker than the electronic components 108a and 108b so that the electronic components 108a and 108b are not pressurized when the second insulating layer 122 contacts the electronic components 108a and 108b. There is a need.

  On the other hand, it is difficult to avoid an increase in cost because it is a custom-made product to make the first insulating layer 120 thick, and it is not suitable for mass production. Therefore, a desired thickness is ensured for the first insulating layer 120 by using a plurality of prepregs having a general thickness (for example, 100 μm) that are normally used when manufacturing a wiring board.

  The prepreg is a mixed sheet of a woven or non-woven fabric and an uncured thermosetting resin, or a mixture of an inorganic filler and a thermosetting resin. This prepreg is softened from the prepreg by heating and pressurizing. The thermosetting resin that has flowed out flows out and is always thinner than the initial thickness after heating and pressurization. For this reason, if the thickness reduction is designed in advance, it is possible to prevent the second insulating layer 122 from coming into contact with the electronic components 108a and 108b even after lamination.

  Furthermore, by using a plurality of prepregs, it is possible to sufficiently secure the amount of thermosetting resin that flows out of the prepreg during heating and pressurization, so when there are a plurality of electronic components 108a and 108b. The gap in the space 121 that can be formed can be filled with the thermosetting resin 124 as shown in FIG.

  Next, after a through hole 151 is formed at a desired position of the electronic component built-in laminate, a plating layer 152 is formed in the through hole 151 (FIG. 1D). The plating layer 152 is formed for the purpose of electrically connecting the first metal foil 123, the second metal foil 132, and the inner wiring pattern 104 of the wiring substrate 101.

  The plating layer 152 formed in the through-hole 151 usually requires a film thickness of about 20 to 30 μm in order to ensure connection reliability. In order to obtain this film thickness by plating, it is necessary to use an electroplating method. Therefore, a power supply line is inevitably required up to the vicinity of the through hole 151. In the first embodiment, since the first metal foil 123 and the second metal foil 132 are present on the entire front and back surfaces of the electronic component built-in laminated plate 140, it is easy to use both as power supply lines. It is possible to form a plating film by electroplating in the through hole 151.

  As the plating film, any metal that can be formed by an electroplating method such as Cu, Ag, Ni, Sn, or Au can be used. In particular, Cu is most preferable in terms of pattern processability and cost by later etching.

  Next, as shown in FIG. 1E, a plating film 152 is formed in the through-hole 151, and after patterning the first metal foil 123 and the second metal foil 132 into a desired shape, the electrode 161, Solder resists 163 and 164 having an opening pattern corresponding to 162 are formed to obtain the electronic component built-in substrate 100.

  At this time, the metal foils 123 and 132 on the front and back surfaces that exist when the electronic component built-in laminate 100 is formed are used as power supply lines for the plating layer 152, and after the plating is finished, the metal foils 123 and 132 on the front and back surfaces are formed in a desired pattern. Therefore, an unnecessary wiring pattern is not formed in the completed electronic component built-in substrate 100.

  2A and 2B, the electronic components 208a and 208b and the metal cap 210 are mounted on the surface layer to form an electronic component built-in module 200 using the electronic component built-in substrate 100, as shown in FIGS. be able to.

  Here, in the present invention, the solder 109 for mounting the electronic components 108a and 108b, the solder 209 for mounting the embedded electronic components 208a and 208b on the surface pattern later, and the electronic component built-in substrate 100 are mother boards (see FIG. Solder for mounting to (not shown) may be the same material or different materials. However, in consideration of recent environmental problems, it is preferable to use Pb-free solder.

  As described above, according to the first embodiment, since the multilayer substrate on which the wiring pattern has been formed is used as the input substrate for the process, the multilayer wiring substrate portion is inspected before and after the built-in electronic components are mounted. This makes it possible to avoid useless use of electronic components such as mounting electronic components even on defective board portions, and to inspect the state even after the electronic components are mounted. In addition, the metal foil on the front and back surfaces that exist when the electronic component built-in laminate is formed can be used as a power supply line for plating, and the metal foil on the front and back surfaces can be processed into a desired pattern after plating. Therefore, an unnecessary wiring pattern is not formed in the completed module. Further, by forming a solder resist in advance before mounting the electronic component on the surface side of the multilayer wiring board on which the electronic component is mounted, it becomes possible to use solder to connect the built-in electronic component.

(Embodiment 2)
Hereinafter, the second embodiment of the present invention will be described with reference to the drawings.

  FIG. 3 shows a cross section of the manufacturing process of the electronic component built-in substrate according to the second embodiment of the present invention. In addition, about the same structure as Embodiment 1, the same number is provided and description is abbreviate | omitted.

  As shown in FIGS. 3A to 3C, as in the first embodiment, the first insulating layer 120 and the second insulating layer 120 in which the space 121 is formed on the wiring substrate 101 on which the electronic components 108a and 108b are mounted. The insulating layer 122 and the metal foil 123, and the third insulating layer 131 and the second metal foil 132 are overlapped at desired positions, and are integrated by heating and pressing.

  At this time, as shown in FIG. 3C, a through hole 134 is formed in a desired position in the third insulating layer 131 in advance, and the conductive resin material 133 is filled in the through hole 134. ing. The conductive resin material 133 is made of, for example, a thermosetting conductive material such as a conductive resin composition in which metal particles and a thermosetting resin are mixed. As the metal particles, Au, Ag, Cu, or the like can be used. Au, Ag, or Cu is preferable because of its high conductivity, and Cu is particularly preferable because of its high conductivity, low migration, and low cost. As the thermosetting resin, for example, an epoxy resin, a phenol resin, or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance.

  Thereafter, as shown in FIGS. 3D and 3E, the electronic component built-in substrate 180 is formed in the same manner as in the first embodiment.

  As described above, according to the second embodiment, by forming the inner via in the third insulating layer, it is possible to dramatically improve the wiring capacity of the wiring pattern of the surface layer portion of the electronic component built-in substrate. Is possible. Further, the formation of the inner via has an excellent effect that it can be simultaneously formed by one press when forming the electronic component built-in laminate.

(Embodiment 3)
In the following, Embodiment 3 of the present invention will be described with reference to the drawings.

  4 and 5 show cross sections of manufacturing steps of the electronic component built-in substrate according to the third embodiment of the present invention. In addition, about the same structure as Embodiment 1, the same number is provided and description is abbreviate | omitted.

  As shown in FIGS. 4A to 4D, as in the first embodiment, the first insulating layer 120 and the second insulating layer 120 in which the space 121 is formed on the wiring substrate 101 on which the electronic components 108a and 108b are mounted. The insulating layer 122 and the metal foil 123, and the third insulating layer 131 and the second metal foil 132 are overlapped at desired positions, and are integrated by heating and pressing.

  Next, the blind via 181 is processed at desired positions of the second metal foil 132 and the third insulating layer 131 until the electrode 105 of the wiring board 101 is reached. The blind via 181 can be processed by router processing, laser processing, drill processing, or the like. Laser processing is particularly preferable in terms of processing speed.

  Next, as shown in FIGS. 5A and 5B, after forming a through hole 151 that penetrates the first metal foil 123 and the second metal foil 132 as in the first embodiment, the through hole is formed. A plating film 152 is formed in 151. At this time, the plating film 152 is also formed on the blind via 181 portion, and the second metal foil 132 and the electrode 105 are electrically connected.

  Thereafter, the first metal foil 123 and the second metal foil 132 are formed in a wiring pattern having a desired shape, and then solder resists 163 and 164 are formed to form the electronic component built-in substrate 190.

  As described above, according to the third embodiment, by forming the blind via in the third insulating layer, the wiring capacity of the wiring pattern of the surface layer portion of the electronic component built-in substrate can be dramatically improved. Is possible. Furthermore, the electrical continuity in the blind via has an excellent effect that it can be performed collectively when the plated layer in the through hole is formed.

(Embodiment 4)
Hereinafter, the fourth embodiment of the present invention will be described with reference to the drawings.

  FIG. 6 shows a cross section of the manufacturing process of the electronic component built-in substrate according to the fourth embodiment of the present invention. In addition, about the same structure as Embodiment 1, 2, 3, the same number is provided and description is abbreviate | omitted.

As shown in FIG. 6A, a collective substrate 201 in which a plurality of patterns are arranged in a matrix is used as a multilayer wiring board, and one side of the plane of the space 121 formed in the first insulating layer 120 is formed. Assume that the length is b ₁ and the length of the other side is b ₂ .

  FIG. 6B shows a cross-sectional view taken along the line AA in FIG. 6A, and the first insulating layer 120 is arranged at a desired position on the collective substrate 201 as shown in the figure.

Next, as illustrated in FIG. 6C, the second insulating layer 122 and the first metal foil 123 are disposed on the first insulating layer 120. At this time, the thickness of the first insulating layer 120 before heating and pressing is set to h ₁ , and the thickness of the second insulating layer 122 before heating and pressing is set to h _2. Let v be the total volume of the electronic components 108 (a) to (i) disposed inside.

Next, as shown in FIG. 6D, the thickness of the first insulating layer 120 after heating and pressing is h ₁ ′, the thickness of the second insulating layer 122 after heating and pressing is h ₂ ′, In this case, the first insulating layer 120 and the second insulating layer 122 are compressed from h ₁ to h ₁ ′ and h ₂ to h ₂ ′, respectively. The thermosetting resin oozes out from the second insulating layer 122 into the space 121. Accordingly, the volume of the thermosetting resin 124 necessary for completely filling the thermosetting resin 124 in the space 121 is such that the electronic components 108 (a) to (i) exist in the space 121. Since the remaining volume obtained by subtracting the volume of the electronic components 108 (a) to (i) from the volume of 121 is required, the amount is supplied from the first insulating layer 120 and the second insulating layer 122. . That is, as shown in FIG. 6A, when the length of one side surrounding the space 121 is a ₁ and the length of the other side is a ₂ ,
(B ₁ b ₂ h ₁ '-v) = a ₁ a ₂ (h ₁ + h ₂ -h ₁ ' -h ₂ ')
When a1 and a2 are set in a range satisfying the following relational expression, the thermosetting resin 124 oozes out from the first insulating layer 120 and the second insulating layer 122 into the space 121, and the electronic component 108 It becomes possible to completely fill the space 121 including (a) to (i).

  However, since the thermosetting resin 124 that has once oozed into one space 121 from the first insulating resin 120 and the second insulating resin 122 cannot ooze into another space 121, it is set at a1 and a2. The ranges corresponding to the adjacent spaces 121 should not overlap each other. If they are set so as to overlap each other, the above relational expression is not satisfied, and the volume of the thermosetting resin 124 filled in the space 121 becomes insufficient. Therefore, the range set by a1 and a2 must satisfy the following relational expression.

a ₁ a ₂ ≧ (b ₁ b ₂ h ₁ ′ −v) / (h ₁ + h ₂ −h ₁ ′ −h ₂ ′)
As a matter of course, it is also important to determine the arrangement of the space 121 so that the ranges set by the adjacent a1 and a2 do not overlap each other.

  As described above, according to the fourth embodiment, the thermosetting resin can be completely filled in the space for incorporating the electronic components, and a plurality of substrates with built-in electronic components can be integrated. Thus, it is possible to obtain an efficient number in the case of manufacturing.

  The present invention makes it possible to produce a substrate with built-in electronic components with as few steps as possible, and also to efficiently produce a plurality of substrates with built-in electronic components at a time, so that the cost can be reduced. This is useful for a method of manufacturing an electronic component-embedded substrate in which electronic components are embedded.

Manufacturing process sectional drawing of the electronic component built-in substrate in Embodiment 1 of this invention Sectional drawing of the electronic component built-in module in Embodiment 1 of this invention Manufacturing process sectional drawing of the electronic component built-in substrate in Embodiment 2 of this invention Manufacturing process sectional drawing of the electronic component built-in substrate in Embodiment 3 of this invention Manufacturing process sectional drawing of the electronic component built-in substrate in Embodiment 3 of this invention Sectional drawing of the electronic component built-in module in Embodiment 4 of this invention Cross-sectional view of the manufacturing process of a conventional substrate with built-in electronic components Cross-sectional view of the manufacturing process of a conventional substrate with built-in electronic components

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Electronic component built-in substrate 101 Wiring board 102 Electrode 103 Inner via 104 Inner layer wiring pattern 105 Electrode 106 Solder resist 108a Electronic component 108b Electronic component 109 Solder 120 First insulating layer 121 Space 122 Second insulating layer 123 First metal foil 124 Thermosetting resin 131 Third insulating layer 132 Second metal foil 140 Laminate board with built-in electronic component 151 Through hole 152 Plating layer 161, 162 Electrode 163, 164 Solder resist

Claims (18)

A substrate, at least one or more electronic components mounted on the substrate, and a thermosetting resin in an at least uncured state which is laminated on the upper surface of the substrate and has a space larger than the outer dimensions of the electronic components A first insulating layer containing, a second insulating layer containing at least an uncured thermosetting resin laminated on the upper surface of the first insulating layer, and an upper surface of the second insulating layer. A first metal foil, a third insulating layer including at least an uncured thermosetting resin laminated on a surface of the substrate on which the electronic component is not mounted, and a third insulating layer. Forming a laminated board with built-in electronic components by collectively heating and pressing a second metal foil laminated on the upper surface; forming a through hole at a desired position of the laminated board; and Through the substrate, the first metal foil and the A step of electrically connecting two metal foils, a step of processing the first metal foil and the second metal foil into a desired shape to form a wiring pattern, and the step of forming the wiring pattern The manufacturing method of the electronic component built-in board | substrate provided with the process of forming the solder resist of a desired shape on the 1st metal foil and the 2nd metal foil. 2. The electronic component-embedded substrate according to claim 1, wherein the third insulating layer has a through-hole formed in a desired position in advance and is filled with an uncured conductive resin material. Production method. 2. The electronic component built-in according to claim 1, wherein a step of forming a hole in a predetermined position of the second metal foil and the third insulating layer is performed before the through-hole is formed at a desired position of the laminated plate with built-in electronic component. A method for manufacturing a substrate. The manufacturing method of the electronic component built-in substrate according to any one of claims 1 to 3, wherein the first insulating layer includes at least one of a woven fabric, a nonwoven fabric, and an inorganic filler. The method for manufacturing a substrate with built-in electronic components according to claim 1, wherein the first insulating layer includes a plurality of sheet-like insulating layers. The method for manufacturing an electronic component built-in substrate according to claim 1, wherein the second insulating layer includes at least one material selected from a woven fabric, a nonwoven fabric, and an inorganic filler. The method for manufacturing an electronic component built-in substrate according to any one of claims 1 to 3, wherein the third insulating layer includes at least one of a woven fabric, a nonwoven fabric, and an inorganic filler. The manufacturing method of the electronic component built-in substrate according to any one of claims 1 to 3, wherein a solder resist is formed in advance before mounting the electronic component on a surface side of the substrate on which the electronic component is mounted. By applying heat and pressure, a thermosetting resin is extruded from the first insulating layer and the second insulating layer, and the electronic component is completely covered with the thermosetting resin, and all the spaces of the first insulating layer are also cured. The manufacturing method of the electronic component built-in substrate as described in any one of Claims 1-3 filled with a functional resin. A multilayer wiring board in which a plurality of sections are formed in a matrix on the same board, at least one or more electronic components mounted on each section on the board, and the electronic circuit layered on the upper surface of the board A first insulating layer including at least an uncured thermosetting resin in which a space larger than an external dimension of the component is formed; and at least an uncured thermosetting resin laminated on the upper surface of the first insulating layer. The first insulating layer and the second insulating layer are thermally cured by heating and pressurizing the second insulating layer containing the first insulating layer and the first wiring layer formed on the upper surface of the second insulating layer. In the method for manufacturing an electronic component built-in substrate, in which a plurality of electronic component built-in substrates are collectively formed by leaching a conductive resin and filling the space with a thermosetting resin, the space is formed on the first insulating layer. The length of one side of the plane of space is b ₁ , the length of the other side is b ₂ , the thickness of the first insulating layer before heating and pressing is h ₁ , the thickness of the second insulating layer before heating and pressing is h ₂ , heating The thickness of the first insulating layer after pressing is h ₁ ′, the thickness of the second insulating layer after heating and pressing is h ₂ ′, and the total number of the electronic components incorporated in the space When the volume is v, a range in which the length of _one side surrounding the space is a ₁ and the length of the other side is a ₂ does not overlap with the range surrounding the adjacent space. With
a ₁ a ₂ ≧ (b ₁ b ₂ h ₁ ′ −v) / (h ₁ + h ₂ −h ₁ ′ −h ₂ ′)
The manufacturing method of the electronic component built-in board | substrate with which the said space | interval is arrange | positioned so that the relational expression shown to may be satisfied. A method for collectively manufacturing an electronic component-embedded substrate, wherein a third insulating layer and a second wiring layer are disposed on a surface side of the substrate on which the first electronic component is not mounted, and the heating and pressing step is simultaneously performed. 10. A method for producing an electronic component built-in substrate according to 10. The electronic component built-in according to claim 10 or 11, wherein the third insulating layer has a through-hole formed in a desired position in advance and is filled with an uncured conductive resin material. A method for manufacturing a substrate. 12. The electronic component according to claim 10, wherein a step of drilling a hole at a predetermined position of the second wiring layer and the third insulating layer is performed before forming the through hole at a desired position of the component built-in laminate. A method for manufacturing a built-in substrate. The method for manufacturing an electronic component built-in substrate according to claim 10, wherein the first insulating layer includes at least one material selected from a woven fabric, a nonwoven fabric, and an inorganic filler. The method for manufacturing an electronic component built-in substrate according to any one of claims 10 to 13, wherein the first insulating layer includes a plurality of sheet-like insulating layers. The method for manufacturing an electronic component built-in substrate according to claim 10, wherein the second insulating layer includes at least one material selected from a woven fabric, a nonwoven fabric, and an inorganic filler. The method for manufacturing an electronic component built-in substrate according to any one of claims 10 to 13, wherein the third insulating layer includes at least one material selected from a woven fabric, a nonwoven fabric, and an inorganic filler. The manufacturing method of the electronic component built-in substrate according to any one of claims 10 to 13, wherein a solder resist is formed in advance on the surface side of the substrate on which the electronic component is mounted before the electronic component is mounted.

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