JP2007035337A - Insulating polymer material composition and insulator - Google Patents
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Abstract
Description
本発明は、絶縁性高分子材料組成物および碍子に関するものであって、例えば筐体内に遮断器や断路器等の開閉機器を備えた高電圧機器の絶縁構成に用いられるものである。 The present invention relates to an insulating polymer material composition and an insulator, and is used, for example, in an insulating configuration of a high-voltage device including a switchgear such as a circuit breaker or a disconnector in a housing.
例えば筐体内に遮断器や断路器等の開閉機器を備えた電圧機器(高電圧機器等)の絶縁構成(例えば、絶縁性を要する部位)に適用(例えば、屋外に直接暴露して適用)される材料として、石油由来の熱硬化性樹脂(石油を出発物質とした樹脂;エポキシ樹脂等)を主成分とした高分子材料を硬化して成る組成物、例えば高分子材料を注型して成る組成物により構成された製品(モールド注型品;以下、高分子製品と称する)が、従来から広く知られている。 For example, it is applied to insulation configurations (for example, parts that require insulation) of voltage equipment (high voltage equipment, etc.) equipped with switchgear such as circuit breakers and disconnectors in the housing (for example, directly exposed to the outdoors) A composition obtained by curing a polymer material mainly composed of petroleum-derived thermosetting resin (resin using petroleum as a starting material; epoxy resin, etc.), for example, a polymer material is cast. A product (mold cast product; hereinafter referred to as a polymer product) composed of the composition has been widely known.
社会の高度化・集中化に伴って高電圧機器等の大容量化,小型化や高い信頼性(例えば、機械的物性(絶縁破壊電界特性等),電気的物性)等が強く要求されると共に、前記の高分子製品に対しても種々の特性の向上が要求されてきた。 Along with the sophistication and concentration of society, there is a strong demand for high-voltage equipment, etc. with increased capacity, downsizing, and high reliability (for example, mechanical properties (such as dielectric breakdown electric field characteristics) and electrical properties). There have been demands for improvements in various properties of the polymer products.
一般的には、高分子材料の主成分として例えばガラス転移点(以下、Tgと称する)100℃以上の耐熱性エポキシ樹脂や比較的に機械的物性(強度等)の高いビスフェノールA型のエポキシ樹脂を用いた高分子製品が知られているが、前記の高分子製品を処分(例えば、寿命,故障等の理由で処分)する場合を考慮して、生分解性を有する高分子材料から成る高分子製品の開発が試みられている(例えば、特許文献1)。
なお、種々の技術分野において、植物由来の高分子材料を硬化して成る組成物を適用(例えば印刷配線ボードに適用)する試みが行われ(例えば、特許文献2)、例えば室温雰囲気下で使用した場合には十分な機械的物性が得られることが知られているが、その組成物はアルデヒド類を硬化剤として用いたものであり、高温雰囲気下では機械的物性が低くなるため高電圧機器には適用されていなかった。
前記のように、高分子材料の主成分としてガラス転移点(以下、Tgと称する)100℃以上の耐熱性エポキシ樹脂等を用いて成る高分子製品は、硬く脆弱であり、温度変化が激しい環境下で使用した場合にはクラックが発生し易い恐れがある。このため、例えば高分子材料の主成分として固形エポキシ樹脂(例えば、金属導体を用いた耐クラック性試験の結果が−30℃以下のもの)を用いたり、該高分子材料に多量の充填材を添加して耐クラック性等を向上させる試みが行われているが、その高分子材料の粘度が著しく高くなってしまい、例えば注型作業等において十分なポットライフ(工業的な作業に必要な最低限の時間)を確保できず、作業性が悪化する恐れがある。 As described above, a polymer product using a heat-resistant epoxy resin having a glass transition point (hereinafter referred to as Tg) of 100 ° C. or higher as a main component of the polymer material is hard and fragile, and has a severe temperature change. If used underneath, there is a risk of cracking. For this reason, for example, a solid epoxy resin (for example, a result of a crack resistance test using a metal conductor of −30 ° C. or lower) is used as the main component of the polymer material, or a large amount of filler is added to the polymer material. Attempts have been made to improve the crack resistance and the like by adding it, but the viscosity of the polymer material becomes extremely high. For example, the pot life (minimum required for industrial work) Time), and workability may be deteriorated.
また、前記のビスフェノールA型のエポキシ樹脂は、機械的物性が高い特性を有することから工業製品として広く使用されているが、そのビスフェノールA自体は環境ホルモンとして有害性を有するものとみなされ、環境性の観点から懸念され始めている。高分子製品のように硬化された組成物中であれば、その組成物中からビスフェノールAが漏出することは殆どなく有害性はないとの報告もあるが、極めて微量(例えば、ppmレベル、またはそれ以下の量)であっても有害性を有する物質であることから、たとえ前記のように組成物中であっても該組成物中に未反応のビスフェノールA(低分子量成分)が存在する場合には、そのビスフェノールAが気中に漏洩してしまう可能性があり、懸念されている。 The bisphenol A type epoxy resin is widely used as an industrial product because of its high mechanical properties. However, the bisphenol A itself is considered to be harmful as an environmental hormone, It is beginning to be a concern from the point of view of sex. In a cured composition such as a polymer product, there is a report that bisphenol A rarely leaks out from the composition and is not harmful, but a very small amount (for example, ppm level, or Even if it is in the composition as described above, unreacted bisphenol A (low molecular weight component) is present in the composition. There is a concern that the bisphenol A may leak into the air.
例えば、高分子製品の製造施設において、ビスフェノールA型エポキシ樹脂と種々の添加剤等とを合成する工程や、その合成工程後の高分子材料を注型する工程等の限定された環境下では、高濃度のビスフェノールA雰囲気下になる恐れがある。たとえ前記製造設備の各工程において完全無人化(高分子製品の製造ラインの無人化)を図っても、それら各工程において換気設備(使用環境における空気を浄化するための設備)を要することとなるため(すなわち、従来では想定しなかった換気設備を要するため)、その製品コストの増加を招く恐れがある。 For example, in a polymer product manufacturing facility, in a limited environment such as a step of synthesizing a bisphenol A type epoxy resin and various additives, a step of casting a polymer material after the synthesis step, etc. There is a risk of a high concentration bisphenol A atmosphere. Even if each process of the production equipment is completely unmanned (the production line for polymer products is unmanned), ventilation equipment (equipment for purifying air in the use environment) is required in each process. For this reason (that is, a ventilation facility that was not assumed in the past is required), the product cost may increase.
前記の高分子製品を処分(例えば、寿命,故障等の理由で処分)する場合については、種々の処理方法を適用することが可能であるが、それぞれ以下に示す問題点がある。 In the case of disposing of the above-mentioned polymer product (for example, disposing for reasons such as lifetime or failure), various treatment methods can be applied, but each has the following problems.
石油由来の物質(例えば、エポキシ樹脂等)を主成分とする高分子材料から成る高分子製品の場合、焼却処理する方法を適用すると種々の有害物質や二酸化炭素を大量に排出し、環境汚染,地球温暖化等の問題を引き起こす恐れがある点で懸念されていた。一方、前記の高分子製品を単に埋立て処理する方法を適用することもできるが、その埋立て処理に係る最終処分場は年々減少している傾向である。この最終処分場の残余年数に関して、旧・厚生省では平成20年頃と試算している。また、旧・経済企画庁では、前記の旧・厚生省の試算に基づいて、平成20年頃に廃棄物処理費用が高騰し、経済成長率が押し下げられると予測している。 In the case of polymer products made of polymer materials mainly composed of petroleum-derived substances (for example, epoxy resins, etc.), applying the method of incineration will emit a large amount of various harmful substances and carbon dioxide, resulting in environmental pollution, There was concern about the possibility of causing problems such as global warming. On the other hand, a method of simply landfilling the polymer product can be applied, but the final disposal sites related to the landfill process tend to decrease year by year. The remaining years of this final disposal site are estimated around 2008 by the former Ministry of Health. In addition, the former Economic Planning Agency predicts that the cost of waste disposal will rise around 2008, and the economic growth rate will be pushed down, based on the previous calculations by the former Ministry of Health and Welfare.
なお、前記の高分子製品を回収し再利用(リサイクル)する試みもあるが、その再利用方法は確立されておらず殆ど行われていない。例外的に、品質が比較的均一な部材(高分子製品に用いられているPEケーブル被覆部材)のみを回収しサーマルエネルギーとして利用されているが、このサーマルエネルギーは燃焼処理工程を要するため、前記のように環境汚染,地球温暖化等の問題を招く恐れがある。 In addition, there is an attempt to collect and reuse (recycle) the polymer product, but the reuse method has not been established and is hardly performed. Exceptionally, only members with relatively uniform quality (PE cable covering members used in polymer products) are recovered and used as thermal energy. However, since this thermal energy requires a combustion treatment step, Like this, there is a risk of causing problems such as environmental pollution and global warming.
一方、生分解性を有する高分子材料から成る高分子製品の場合は、例えば温度100℃以上の雰囲気下で使用すると溶融してしまう恐れがある。また、生物由来の架橋組成物から成る高分子製品の場合は、アルデヒド類を硬化物として用いるため、常温程度の温度雰囲気下(例えば、印刷配線ボードにおける温度環境)では高い機械的物性を有するものの、高温雰囲気下(例えば、高電圧機器等の使用環境)では十分な機械的物性が得られない恐れがある。 On the other hand, in the case of a polymer product made of a biodegradable polymer material, there is a risk of melting when used in an atmosphere at a temperature of 100 ° C. or higher. In the case of polymer products composed of biologically derived cross-linked compositions, aldehydes are used as cured products, and therefore have high mechanical properties under a normal temperature atmosphere (for example, a temperature environment in a printed wiring board). In a high temperature atmosphere (for example, an environment where a high voltage device or the like is used), sufficient mechanical properties may not be obtained.
以上示したようなことから、高分子製品の特性(機械的物性,電気的特性等)を良好に維持すると共に、その高分子製品の処分に係る諸問題の改善が求められている。 As described above, there is a demand for improving the various problems associated with the disposal of the polymer product while maintaining good properties (mechanical properties, electrical properties, etc.) of the polymer product.
本発明は、前記課題に基づいて成されたものであり、作業性を悪化させることなく、高電圧機器等の高分子製品において良好な機械的物性,電気的物性を付与できると共に、十分な生分解性を有し環境性に優れた絶縁性高分子材料組成物および碍子を提供することにある。 The present invention has been made on the basis of the above-mentioned problems, and can impart good mechanical and electrical properties to polymer products such as high-voltage equipment without deteriorating workability. An object of the present invention is to provide an insulating polymer material composition and an insulator that have degradability and excellent environmental properties.
本発明は、前記の課題の解決を図るためのものであって、請求項1記載の発明は、電圧機器の絶縁構成に用いられるものであって、エポキシ化亜麻仁油,フェノール樹脂を含んだ混練物から成り、前記の混練物を熱処理により三次元架橋したことを特徴とする。 The present invention is intended to solve the above-described problems, and the invention according to claim 1 is used for an insulation structure of a voltage device, and includes kneading containing epoxidized linseed oil and a phenol resin. The kneaded material is three-dimensionally cross-linked by heat treatment.
請求項2記載の発明は、請求項1記載の発明において、前記の混練物はイミダゾール類を含んだことを特徴とする。 The invention described in claim 2 is the invention described in claim 1, characterized in that the kneaded material contains imidazoles.
請求項3記載の発明は、請求項1または2記載の発明において、前記のフェノール樹脂は、前記のエポキシ化亜麻仁油100phrに対し40〜80phr用いたことを特徴とする。 A third aspect of the invention is characterized in that, in the first or second aspect of the invention, the phenol resin is used in an amount of 40 to 80 phr with respect to 100 phr of the epoxidized linseed oil.
請求項4記載の発明は、請求項1乃至3記載の発明のいずれかの絶縁性高分子材料組成物と金属インサートとから成る碍子であることを特徴とする。 The invention described in claim 4 is an insulator comprising the insulating polymer material composition according to any one of claims 1 to 3 and a metal insert.
請求項1記載の発明では、例えば多量の充填剤等(例えば従来の高分子製品のように大量の充填剤等)を用いなくとも、各材料の混練物が熱処理によって三次元架橋される。 In the invention described in claim 1, for example, the kneaded material of each material is three-dimensionally cross-linked by heat treatment without using a large amount of filler or the like (for example, a large amount of filler or the like like conventional polymer products).
請求項2記載の発明では、イミダゾール類がフェノール樹脂における硬化の起点となる。 In the invention of claim 2, imidazoles are the starting point for curing in the phenolic resin.
請求項4記載の発明では、絶縁性高分子材料組成物の線膨張率と金属インサートの線膨張率との差が小さくなる(例えば従来の高分子製品等と比較して小さくなる)。 In the invention according to claim 4, the difference between the linear expansion coefficient of the insulating polymer material composition and the linear expansion coefficient of the metal insert is small (for example, smaller than that of a conventional polymer product).
以上、本発明によれば、作業性を悪化させることなく(例えば、十分なポットライフを確保)、高電圧機器等の高分子製品として良好な機械的物性,電気的物性が得られると共に、十分な生分解性(例えば、土中に埋立て処理した場合の生分解性)を有し地球環境保全に貢献することが可能となる。 As described above, according to the present invention, good mechanical properties and electrical properties can be obtained as a polymer product such as a high-voltage device without deteriorating workability (for example, ensuring sufficient pot life) and sufficient. It has a high biodegradability (for example, biodegradability when landfilled in soil) and can contribute to global environmental conservation.
以下、本発明の実施の形態における絶縁性高分子材料組成物を詳細に説明する。 Hereinafter, the insulating polymer material composition in the embodiment of the present invention will be described in detail.
本実施の形態は、例えば高分子製品の絶縁性を要する部位に適用される絶縁性高分子材料組成物において、エポキシ樹脂等の石油由来の高分子材料を用いる替わりに、天然由来であって三次元架橋する高分子材料(すなわち、天然材料を基材(出発物質)とする高分子材料)を用いるものである。 In this embodiment, for example, in an insulating polymer material composition applied to a portion of a polymer product that requires insulation, instead of using a petroleum-derived polymer material such as an epoxy resin, it is naturally derived and is tertiary. A polymer material that is originally crosslinked (that is, a polymer material having a natural material as a base material (starting material)) is used.
すなわち、前記のような高分子材料であれば、作業性を悪化させることなく十分良好な電気的物性,機械的物性が得られ高電圧機器に適用できると共に、その高分子材料自体はカーボンニュートラルであるため、該高分子材料から成る組成物(高分子製品等)を焼却処理しても、有害物質(例えば、環境ホルモン等)や二酸化炭素等の排出を防止または抑制でき、例えば土中に埋めた場合には生分解できることに着目したものである。天然由来の高分子材料から成る組成物において、印刷配線ボードに適用した例は知られているが、高電圧機器等の高分子製品に適用した例はなかった。 That is, if the polymer material is as described above, sufficiently good electrical properties and mechanical properties can be obtained without deteriorating workability, and it can be applied to a high voltage device, and the polymer material itself is carbon neutral. Therefore, even if a composition made of the polymer material (polymer product, etc.) is incinerated, it can prevent or control the emission of harmful substances (eg, environmental hormones) and carbon dioxide, and it can be buried in the soil, for example. In this case, the focus is on biodegradability. In the composition composed of a naturally derived polymer material, an example applied to a printed wiring board is known, but there was no example applied to a polymer product such as a high voltage device.
具体的には、前記のように天然由来であって三次元架橋する高分子材料としてエポキシ化亜麻仁油を用いたものである。従来、エポキシ化亜麻仁油は、例えばエポキシ化大豆油と同様に塩化ビニル樹脂における安定剤として広く使用されてきたが、一般的な工業用エポキシ樹脂と比較すると反応性が乏しく硬化に長時間を要し、Tg特性や機械的物性が低いことから、高電圧機器の高分子製品として適用および検討されることはなかった。 Specifically, as described above, epoxidized linseed oil is used as a polymer material that is naturally derived and three-dimensionally cross-linked. Conventionally, epoxidized linseed oil has been widely used as a stabilizer in vinyl chloride resin, for example, as with epoxidized soybean oil, but has low reactivity and requires a long time for curing compared to general industrial epoxy resin. However, since it has low Tg characteristics and mechanical properties, it has not been applied and studied as a polymer product for high voltage equipment.
本実施の形態では、エポキシ化亜麻仁油を硬化させて成る絶縁性高分子材料組成物において、硬化剤としてフェノール樹脂等の熱硬化性樹脂を用い(エポキシ化亜麻仁油に添加し)前記の硬化を図ることによりTgが向上し、絶縁性高分子材料組成物の絶縁性が高められ、既存の工業用エポキシ樹脂製品よりも良好な特性が得られる(例えば、絶縁破壊電界特性が良好である)ことを見出したものである。 In this embodiment, in an insulating polymer material composition obtained by curing epoxidized linseed oil, a thermosetting resin such as a phenol resin is used as a curing agent (added to epoxidized linseed oil) to perform the above-described curing. As a result, Tg is improved, the insulation property of the insulating polymer material composition is improved, and better characteristics than the existing industrial epoxy resin products can be obtained (for example, the dielectric breakdown electric field characteristics are good). Is found.
前記のフェノール樹脂等の熱硬化性樹脂は、例えば、まずエポキシ化亜麻仁油のオキシラン濃度によりエポキシ当量を算出し、そのエポキシ当量に基づいた化学量論量(例えば、化学量論比に対して0.5〜2.0)を添加する。また、前記熱硬化性樹脂における硬化の起点(硬化促進剤の役割)として、イミダゾール類を用いても良い。 The thermosetting resin such as the phenol resin, for example, first calculates the epoxy equivalent based on the oxirane concentration of the epoxidized linseed oil, and the stoichiometric amount based on the epoxy equivalent (for example, 0 to the stoichiometric ratio). 0.5-2.0). Moreover, you may use imidazole as a starting point (role of a hardening accelerator) in the said thermosetting resin.
本実施の形態は、例えば作業性の向上(例えば、作業時間の短縮等),成形性,Tg特性,機械的・物理的物性(例えば、硬度,弾性率,線膨張率,熱伝導率等),電気的物性等の改善を図る目的で、前記のエポキシ化亜麻仁油,熱硬化性樹脂等をマトリックス(例えば、後述の実施例ではエポキシ化亜麻仁油,フェノール樹脂,イミダゾール)として用いる他に、種々の添加剤(例えば、充填剤,カップリング剤(例えば、マトリックスと充填剤とを化学的に結合するためのもの))を適宜用いることができる。 In the present embodiment, for example, workability is improved (for example, work time is shortened), formability, Tg characteristics, mechanical / physical properties (for example, hardness, elastic modulus, linear expansion coefficient, thermal conductivity, etc.) In addition to using the epoxidized linseed oil, thermosetting resin, etc. as a matrix (for example, epoxidized linseed oil, phenolic resin, imidazole in the examples described later) for the purpose of improving electrical properties, etc. These additives (for example, fillers and coupling agents (for example, for chemically bonding the matrix and the filler)) can be used as appropriate.
例えば、本実施の形態の絶縁性高分子材料組成物を碍子に適用する場合、該絶縁性高分子材料組成物には、該マトリックスの物性を改善する目的で、シリカ粉末,アルミナ粉末,ドロマイト粉末,グラファイト粉末等の充填剤が用いられる。該碍子は、前記の絶縁性高分子材料組成物中に金属インサートを埋め込んだ構成が一般的に知られている。 For example, when the insulating polymer material composition of the present embodiment is applied to an insulator, the insulating polymer material composition includes silica powder, alumina powder, and dolomite powder for the purpose of improving the physical properties of the matrix. A filler such as graphite powder is used. The insulator is generally known to have a structure in which a metal insert is embedded in the insulating polymer material composition.
前記のような碍子の場合、絶縁性高分子材料組成物の線膨張率と金属インサートの線膨張率との差が大きいと、それら両者の間には該碍子の使用環境に応じた大きさの熱応力が発生し、クラック等が発生する可能性がある。そのため、例えば前記の充填剤の使用する場合、該充填剤の種類,添加量,粒径,粒度分布等においては、前記の線膨張率の差が大きくならないように、目的とする高分子製品の形状,金属インサートの材質,形状等を考慮して適宜設定することが好ましい。 In the case of the insulator as described above, if there is a large difference between the linear expansion coefficient of the insulating polymer material composition and the linear expansion coefficient of the metal insert, there is a size corresponding to the use environment of the insulator between them. Thermal stress is generated, and cracks and the like may occur. Therefore, for example, when using the above-mentioned filler, in order to prevent the difference in the linear expansion coefficient from increasing in the type, amount of addition, particle size, particle size distribution, etc. of the filler, It is preferable to set appropriately considering the shape, the material of the metal insert, the shape and the like.
この具体例として、前記のシリカ粉末を充填剤として50vol%程度を目処に用いることが挙げられる。また、粒径がナノメートルオーダの充填剤(いわゆるナノ粒子と称される充填剤)を用いた場合には、表面積効果(例えば、樹脂(本実施の形態ではエポキシ化亜麻仁油等)に対する充填剤の接点(表面積)が多くなることによる効果)により、一般的な粒径(例えば、マイクロミリオーダ)の充填剤を用いた場合よりも少量(例えば、約1/10以下の添加量)にて、マトリックスの物性改善を図ることが可能となる。 As a specific example, about 50 vol% is used as a target with the silica powder as a filler. Further, when a filler having a particle size on the order of nanometers (a so-called nanoparticle filler) is used, a filler for a surface area effect (for example, a resin (epoxidized linseed oil or the like in the present embodiment)). (Effects of increasing the contact point (surface area)) in a smaller amount (for example, an addition amount of about 1/10 or less) than when a filler having a general particle size (for example, micro milliorder) is used. It is possible to improve the physical properties of the matrix.
なお、前記のような充填剤を適宜使用することが好ましいが、該充填剤によるマトリックスの物性改善という観点においては、汎用の充填剤(例えば、一般的な粒径の充填剤)をエポキシ化植物油,ポリフェノールに添加する場合と同様である。また、カップリング剤においても、前記の充填剤と同様に適宜使用することが好ましいが、例えばマトリックスと充填剤とを化学的に結合させるという観点においては、汎用のカップリング剤を用いる場合と同様である。 In addition, although it is preferable to use the filler as described above as appropriate, from the viewpoint of improving the physical properties of the matrix by the filler, a general-purpose filler (for example, a filler having a general particle size) is epoxidized vegetable oil. This is the same as when added to polyphenol. Also, in the coupling agent, it is preferable to use the same as in the case of the above-mentioned filler. However, for example, from the viewpoint of chemically bonding the matrix and the filler, the same as in the case of using a general-purpose coupling agent. It is.
前記のカップリング剤としては、例えば樹脂(疎水基)や充填剤(親水基)に対して反応する官能基を有するものを適用できる。前記の充填剤としてシリカを用いる場合には、例えばシランカップリング剤やチタネートカップリング剤等を有効に適用することができる。 As said coupling agent, what has a functional group which reacts with resin (hydrophobic group) or a filler (hydrophilic group) is applicable, for example. When silica is used as the filler, for example, a silane coupling agent, a titanate coupling agent, or the like can be effectively applied.
[実施例]
次に、本実施の形態における絶縁性高分子材料組成物の実施例を説明する。まず、本実施例では、エポキシ化亜麻仁油(本実施例ではダイセル化学工業(株)製のエポキシ化亜麻仁油(品名;ダイマックL−500))100phrに対して、硬化剤としてフェノール樹脂(本実施例では住友ベークライト(株)製のフェノールホルムアルデヒド型ノボラック(品名;PR−HF−3))40〜80phr、硬化促進剤としてイミダゾール類(本実施例では四国化成工業(株)製の2−エチル−4−メチルイミダゾール(品名;2E4MZ))1phr、充填剤としてシリカ粉末(本実施例では龍森製のシリカ粉末(品名;MFC−4))420〜480phrを添加して混練(例えば、添加量に応じた条件で混練)し、その混練物を注型することにより24kV用の碍子(JIS C3851 EIE20A;碍子高さ255mm)の試料S1〜S5を作製した。
[Example]
Next, examples of the insulating polymer material composition in the present embodiment will be described. First, in this example, 100 phr of epoxidized linseed oil (in this example, epoxidized linseed oil (product name: Daimac L-500) manufactured by Daicel Chemical Industries, Ltd.) was used as a curing agent. In the example, phenol formaldehyde type novolak (product name; PR-HF-3) manufactured by Sumitomo Bakelite Co., Ltd., 40-80 phr, imidazoles as a curing accelerator (in this example, 2-ethyl- manufactured by Shikoku Kasei Kogyo Co., Ltd.) 4-methylimidazole (product name: 2E4MZ)) 1 phr, silica powder (silica powder (product name: MFC-4) manufactured by Tatsumori in this example) 420-480 phr as a filler is added and kneaded (for example, added amount) Kneading under the appropriate conditions) and casting the kneaded product, a 24 kV insulator (JIS C3851 EIE20A; insulator high) To prepare a sample S1~S5 of 255mm).
なお、本実施例では、まず、加温(50〜150℃に加温)されたエポキシ化亜麻仁油に対し、同じように加温(50〜150℃に加温)されたフェノール樹脂,シリカ粉末を加え、さらにイミダゾール類を加えてから十分に混合・撹拌し、得られた混練物を減圧雰囲気下で脱泡した。その後、該混練物を所定の金型(24kV用の碍子を作製するための金型)に流し込み(大気中にて流し込み)、再度減圧雰囲気下にて脱泡し150〜200℃の温度で5〜20時間加熱して硬化させることにより、各試料を作製した。 In this example, first, phenolic resin and silica powder heated in the same manner (heated to 50 to 150 ° C.) with respect to the epoxidized linseed oil heated (heated to 50 to 150 ° C.). After further adding imidazoles, the mixture was sufficiently mixed and stirred, and the resulting kneaded product was defoamed under reduced pressure. Thereafter, the kneaded product is poured into a predetermined mold (mold for producing an insulator for 24 kV) (in the air), defoamed again under a reduced pressure atmosphere, and heated at a temperature of 150 to 200 ° C. Each sample was produced by heating and curing for ~ 20 hours.
また、前記の試料S1〜S5の比較例として、前記のエポキシ化亜麻仁油100phrに対し、前記のシリカ450phr,酸無水物(本実施例では日立化成製の無水フタル酸(品名;HN2200))60phr,三級アミン(本実施例では明電ケミカル製のDMP−30(品名;L−86))1phr添加して混練し、その混練物を注型することにより、試料S1〜S5同様の碍子の試料P1を作製(試料S1〜S5と同様の条件で作製)した。さらに、ビスフェノールA型エポキシ樹脂(本実施例ではバンティコ社製のエポキシ樹脂(品名;CT200A))100phrに対し、前記のフェノール樹脂60phr,シリカ450phr,三級アミン1phr添加して混練し、その混練物を注型することにより、試料S1〜S5同様の碍子の試料P2を作製(試料S1〜S5と同様の条件で作製)した。 Further, as a comparative example of the samples S1 to S5, the silica 450 phr and acid anhydride (in this example, phthalic anhydride (product name: HN2200) manufactured by Hitachi Chemical) 60 phr with respect to 100 phr of the epoxidized linseed oil. , Tertiary amine (DMP-30 (product name: L-86) manufactured by Meiden Chemical in this example) 1 phr was added and kneaded, and the kneaded product was cast to obtain an insulator similar to samples S1 to S5. Sample P1 was manufactured (manufactured under the same conditions as Samples S1 to S5). Further, 100 phr of a bisphenol A type epoxy resin (in this example, an epoxy resin (product name: CT200A) manufactured by Bantico), 60 phr of the phenol resin, 450 phr of silica, and 1 phr of a tertiary amine were added and kneaded, and the kneaded product. Was cast to produce an insulator sample P2 similar to the samples S1 to S5 (produced under the same conditions as the samples S1 to S5).
そして、前記の各試料S1〜S5,P1,P2の機械的物性として碍子曲げ破壊時荷重(Pw0(N))を測定し、電気的物性として雷インパルス(V50(kV))を測定し、各測定結果を下記表1に示した。なお、前記の碍子曲げ破壊時荷重は、JIS−Cの3851に準拠して測定した。また、雷インパルスは、ステップ幅を5kVとした昇降法によって測定(正極が小さい値であるため正極性のみ測定)した。 Then, the load at the time of insulator bending fracture (Pw0 (N)) is measured as the mechanical properties of each of the samples S1 to S5, P1, and P2, and the lightning impulse (V50 (kV)) is measured as the electrical properties. The measurement results are shown in Table 1 below. The load at the time of the insulator bending fracture was measured in accordance with JIS-C 3851. Further, the lightning impulse was measured by a lifting method with a step width of 5 kV (only the positive polarity was measured because the positive electrode has a small value).
前記表1に示すように、各試料S1〜S5は、石油由来のビスフェノールA型エポキシ樹脂を用いた試料P2と同様に、十分(特に、試料S3においては良好)な碍子曲げ破壊時荷重,雷インパルスが測定された。また、前記の試料S3と同様にエポキシ化亜麻仁油を用い硬化剤としては酸無水物を用いた試料P1は、各試料S1〜S5と比較して、低い碍子曲げ破壊時荷重,雷インパルスが測定された。 As shown in Table 1, each of the samples S1 to S5 has a sufficient load (lightning at the time of bending bending of the insulator), as well as the sample P2 using the petroleum-derived bisphenol A type epoxy resin (especially good in the sample S3). Impulse was measured. Similarly to the sample S3, the sample P1 using epoxidized linseed oil and the acid anhydride as the curing agent has a lower load at the time of bending bending and lightning impulse compared to the samples S1 to S5. It was done.
したがって、前記の各試料S1〜S5のように、高分子材料としてエポキシ化亜麻仁油を含んだ混練物から成る絶縁性高分子材料組成物によれば、既存の石油由来のビスフェノールA型エポキシ樹脂を用いた絶縁性高分子材料組成物と同様に、高分子製品(例えば、該絶縁性高分子材料組成物と金属インサートとから成る碍子)において十分な機械的物性,電気的物性が得られることを確認できた。また、前記のエポキシ化亜麻仁油の硬化剤としてフェノール樹脂を用いることにより、該硬化剤として酸無水物等を用いた場合と比較して、高分子製品において良好な機械的物性,電気的物性が得られることを確認できた。また、硬化促進剤,充填剤として、それぞれイミダゾール類,シリカを適用できることが確認できた。 Therefore, according to the insulating polymer material composition composed of a kneaded material containing epoxidized linseed oil as the polymer material as in each of the samples S1 to S5, the existing petroleum-derived bisphenol A type epoxy resin is used. Similar to the insulating polymer material composition used, sufficient mechanical and electrical properties can be obtained in a polymer product (for example, an insulator made of the insulating polymer material composition and a metal insert). It could be confirmed. In addition, by using a phenol resin as a curing agent for the epoxidized linseed oil, compared with the case where an acid anhydride or the like is used as the curing agent, the polymer product has better mechanical and electrical properties. It was confirmed that it was obtained. Further, it was confirmed that imidazoles and silica can be applied as a curing accelerator and a filler, respectively.
以上、本発明において、記載された具体例に対してのみ詳細に説明したが、本発明の技術思想の範囲で多彩な変形および修正が可能であることは、当業者にとって明白なことであり、このような変形および修正が特許請求の範囲に属することは当然のことである。 Although the present invention has been described in detail only for the specific examples described above, it is obvious to those skilled in the art that various changes and modifications can be made within the scope of the technical idea of the present invention. Such variations and modifications are naturally within the scope of the claims.
例えば、本実施の形態では、天然由来であって三次元架橋する高分子材料としてエポキシ化亜麻仁油,硬化剤としてフェノール樹脂,硬化促進剤としてイミダゾール類,充填剤としてシリカ粉末を用い、それら各材料の混練物を注型(熱処理)して得た絶縁性高分子材料組成物の例を挙げたが、本発明の技術思想の範囲は前記の各材料の種類等(メーカ,グレード等)に限定されるものではなく、本質的にエポキシ化亜麻仁油等のエポキシ化植物油とポリフェノールとの反応(芳香環と水酸基を有する物質との反応)によるものであれば良く、種々の材料適用することが可能である。 For example, in this embodiment, epoxidized linseed oil is used as a polymer material that is naturally derived and three-dimensionally cross-linked, a phenol resin is used as a curing agent, imidazoles are used as a curing accelerator, and silica powder is used as a filler. An example of an insulating polymer material composition obtained by casting (heat-treating) the kneaded material was given, but the scope of the technical idea of the present invention was limited to the above-mentioned types of materials (manufacturers, grades, etc.) It can be applied to various materials as long as it is essentially a reaction between an epoxidized vegetable oil such as epoxidized linseed oil and a polyphenol (a reaction between an aromatic ring and a substance having a hydroxyl group). It is.
また、前記の注型(熱処理)における混練物の硬化は、目的とする絶縁性高分子材料組成物の物性に適合させるための工程の一つであって、その硬化温度・時間においては該目的(例えば、目的とする高分子製品)や使用材料に応じて適宜設定(例えば、実施例以外の硬化温度・時間に設定)することが可能である。実施例では、大気中で注型する製法の例を挙げたが、例えば成形サイクル等を考慮して、減圧雰囲気下での注型(例えば、脱泡工程を省略できる注型),トランスファー成形,射出成形等を適用することも可能である。 The curing of the kneaded material in the casting (heat treatment) is one of the steps for adapting to the physical properties of the target insulating polymer material composition. It can be appropriately set (for example, set to a curing temperature / time other than the example) depending on (for example, the target polymer product) and the material used. In the examples, an example of a manufacturing method in which casting is performed in the air has been given. For example, in consideration of a molding cycle, casting in a reduced-pressure atmosphere (for example, casting in which the defoaming step can be omitted), transfer molding, It is also possible to apply injection molding or the like.
さらに、各材料の配合量においても、本実施の形態では100phrのエポキシ化亜麻仁油に対しフェノール樹脂40〜80phr,イミダゾール類1phr,シリカ粉末420〜480phr用いた24kV用の碍子の例を挙げたが、それら各材料の配合量は目的とする高分子製品の機械的物性,電気的物性等に応じて適宜変更することが可能である。 Furthermore, in the blending amount of each material, in the present embodiment, an example of a 24 kV insulator using phenol resin 40 to 80 phr, imidazoles 1 phr, and silica powder 420 to 480 phr with respect to 100 phr epoxidized linseed oil is given. The blending amounts of these materials can be appropriately changed according to the mechanical properties, electrical properties, etc. of the target polymer product.
さらにまた、例えば絶縁性高分子材料組成物を作製する際の作業性(例えば、各材料の混練時の作業性),反応性,生産性,安全性等を高める目的で、本実施の形態では挙げてない各種添加剤を目的とする高分子製品に応じて適宜添加した場合においても、該実施例と同様の作用効果が得られることは明らかである。 Furthermore, in the present embodiment, for the purpose of improving workability (for example, workability at the time of kneading of each material), reactivity, productivity, safety, etc. when producing an insulating polymer material composition, Even when various additives not listed are appropriately added according to the intended polymer product, it is apparent that the same effects as those of the examples can be obtained.
Claims (4)
エポキシ化亜麻仁油,フェノール樹脂を含んだ混練物から成り、
前記の混練物を熱処理により三次元架橋したことを特徴とする絶縁性高分子材料組成物。 Used for the insulation structure of voltage equipment,
It consists of a kneaded product containing epoxidized linseed oil and phenolic resin,
An insulating polymer material composition, wherein the kneaded material is three-dimensionally crosslinked by heat treatment.
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| JP2008257978A (en) * | 2007-04-04 | 2008-10-23 | Meidensha Corp | Insulating composition for high voltage equipment |
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| JP2009099333A (en) * | 2007-10-16 | 2009-05-07 | Meidensha Corp | Insulating composition for high-voltage device |
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| JP2009256499A (en) * | 2008-04-18 | 2009-11-05 | Meidensha Corp | Insulating polymer material composition |
| JP2010061879A (en) * | 2008-09-02 | 2010-03-18 | Meidensha Corp | Insulating polymeric material composition |
| EP2330600A4 (en) * | 2008-09-02 | 2012-03-07 | Meidensha Electric Mfg Co Ltd | Insulating polymer material composition |
| JP2016166350A (en) * | 2015-03-04 | 2016-09-15 | 株式会社東光高岳 | Epoxy resin composition and insulative molding |
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