JP2007034186A - Drawing method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect a reference mark previously provided on a drawing target, correct image data based on detection position information of the reference mark, and draw an image on the drawing target based on the corrected image data In such a drawing method, the reference mark is detected more appropriately and easily without lowering the work efficiency and increasing the cost, and more appropriate correction is performed.
SOLUTION: A part of a plurality of reference marks 12b provided in advance on a drawing target is automatically selected, the selected part of the reference marks 12b is detected, and the reference mark 12b is detected. Detection position information indicating the position of the image is acquired, the position of the drawing position information 12c indicating the arrangement of the image is corrected based on the acquired detection position information, and the image data is converted based on the corrected drawing position information 12c. Make corrections.
[Selection] Figure 6

Description

  The present invention relates to a drawing method and apparatus for drawing an image by arranging it on a drawing target.

  Conventionally, various exposure apparatuses using photolithographic techniques have been proposed as apparatuses for drawing a predetermined wiring pattern on a printed wiring board substrate.

  As an exposure apparatus as described above, for example, a light beam is scanned in a main scanning direction and a sub scanning direction on a substrate coated with a photoresist, and the light beam is modulated based on image data representing a wiring pattern. Thus, there has been proposed an exposure apparatus for forming a wiring pattern.

  Here, the wiring pattern of the printed wiring board formed by the exposure apparatus as described above tends to increase in definition. For example, when forming a multilayer printed wiring board, the wiring pattern of each layer Must be aligned with high accuracy.

  In order to perform the alignment as described above, the wiring pattern of each layer is exposed to a preset position with respect to the substrate. However, when forming a multilayer printed wiring board, the substrate is subjected to a pressing process in which the layers are bonded to each other. Since heat may be applied and the substrate may be deformed by the heat, if the wiring pattern of each layer is exposed at a preset position as described above, the drawing position shift of the wiring pattern of each layer occurs, and each layer There is a possibility that it is difficult to align the wiring pattern with high accuracy.

  Therefore, for example, a hole is provided in the substrate of each layer on the basis of preset reference mark position information, the position of this hole is detected during exposure, and the detected position information of the detected hole and the reference mark position are detected. By obtaining the amount of deformation of the board based on the information and correcting the layout of the wiring pattern according to the amount of deformation, highly accurate alignment can be performed without being affected by the deformation of the board as described above. An exposure apparatus has been proposed (see, for example, Patent Document 1).

JP 2000-122303 A

  As described above, since it is necessary to detect the position of the hole at the time of exposure, it is desired to realize a method for efficiently performing this detection process.

  Further, when correcting the arrangement of the wiring pattern as described above, for example, as shown in FIG. 11, images are sequentially taken on the substrate 2 provided with the holes 1 by the CCD camera 3 moving in the direction of the arrow. As a result, the detection position information of the hole 1 is acquired. However, since the field of view of the CCD camera 3 is narrower than that of the substrate, it is necessary to correct the wiring pattern by one movement in the direction of the arrow depending on the position of the camera In some cases, it is not possible to image the correct hole 1.

  If the CCD camera 3 is moved many times in order to capture the hole 1 necessary for correction, the production efficiency is lowered, and if the number of the CCD cameras 3 is increased, the apparatus becomes large. In addition, the cost increases.

  Further, it takes a certain amount of time to process the image signal imaged by the CCD camera 3, and the imaging interval by the CCD camera 3 is restricted by this processing time and the like. May not be able to match.

  In view of the circumstances described above, an object of the present invention is to provide a drawing method and apparatus capable of detecting a reference mark (for example, a hole) more appropriately and simply. Another object of the present invention is to provide a drawing method and apparatus capable of performing image correction based on the detected position information of the reference mark.

  The drawing method of the present invention is a drawing method for drawing an image on a drawing target based on image data, selecting a part of the plurality of reference marks provided in advance on the drawing target, and selecting the selected reference mark. To detect a part of the reference marks and obtain detection position information indicating the position of the reference marks, and draw an image corrected based on the obtained detection position information and image data on the drawing target. It is characterized by.

  In the drawing method of the present invention, the image data may be corrected by a correction method according to the number of the acquired detected position information.

  In addition, when the number of the acquired detection position information is two, at least one of shift correction, rotation correction, and magnification correction is performed on the image data, and the number of the acquired detection position information is three. In the case described above, free deformation correction may be performed on the image data.

  Further, a plurality of reference marks may be provided irregularly on the drawing target.

  In addition, a plurality of reference marks are arranged on the drawing target in a state inconsistent with the detection condition of the detection position information acquisition unit that detects the reference mark and acquires the detection position information indicating the position of the reference mark. You may make it provide.

  In addition, the selection may be performed based on a detection condition of a detection position information acquisition unit that detects a reference mark and acquires detection position information indicating the position of the reference mark.

  Further, drawing target image data representing a drawing target provided with a reference mark may be acquired, and the selection may be performed using the acquired drawing target image data.

  Further, drawing position information indicating the arrangement of the image on the drawing target may be acquired based on the detected position information, and the image data may be corrected based on the acquired drawing position information.

  The drawing apparatus of the present invention is a drawing apparatus that draws an image on a drawing target based on image data, and a reference mark selection that selects a part of the plurality of reference marks provided in advance on the drawing target. Detection position information acquisition means for detecting a part of the reference marks selected by the reference mark selection means and acquiring detection position information indicating the position of the reference mark, and detection acquired by the detection position information acquisition means The image processing apparatus includes a drawing unit that draws an image corrected on the basis of position information and image data on a drawing target.

  In the drawing apparatus of the present invention, the drawing means can correct the image data by a correction method according to the number of detected position information acquired by the detected position information acquiring means.

  Further, when the number of the detected position information acquired is two, the drawing means performs at least one of shift correction, rotation correction, and magnification correction on the image data, and the acquired detection is performed. When the number of pieces of position information is three or more, free deformation correction can be performed on the image data.

  Also, a plurality of reference marks can be arranged irregularly on the drawing target.

  Further, a plurality of reference marks can be arranged and provided on the drawing target in a state inconsistent with the detection conditions of the detection position information acquisition unit.

  Further, the reference mark selection means can perform the selection based on the detection condition of the detection position information acquisition means.

  Further, the image processing apparatus further includes a drawing target image data acquisition unit that acquires drawing target image data representing a drawing target provided with a reference mark, and the reference mark selection unit includes the drawing target image acquired by the drawing target image data acquisition unit. The selection may be performed using data.

  The image processing apparatus further includes a drawing position information acquiring unit that acquires drawing position information indicating an arrangement of the image on the drawing target based on the detected position information, and the drawing unit is acquired by the drawing position information acquiring unit. The image data can be corrected based on the information.

  Further, “correcting image data with a correction method according to the number of detected position information” means that correction is performed with a more complicated correction method as the number of detected position information is larger. Note that a more complicated correction method refers to a correction method with a higher degree of freedom in image layout (including shape).

  The “detection condition of the detection position information acquisition unit” refers to a condition constrained by the configuration or performance of the detection position information acquisition unit. For example, the arrangement and detection of the detection position information acquisition unit with respect to the drawing target There are conditions such as the time required for the position information acquisition means to acquire the detected position information of the reference mark.

  Further, the “arrangement in a state inconsistent with the detection condition of the detection position information acquisition unit” means that the arrangement is performed without being restricted by the detection condition.

  According to the drawing method and apparatus of the present invention, a part of a plurality of reference marks provided in advance on a drawing target is selected, the selected part of the reference marks is detected, and the reference mark is selected. The detection position information indicating the position of the image is acquired, and an image corrected based on the acquired detection position information and image data is drawn on the drawing target, so that the reference mark can be detected more appropriately and easily. And can draw an image.

  Hereinafter, an exposure apparatus using an embodiment of the drawing method and apparatus of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of the exposure apparatus. The exposure apparatus is an apparatus that exposes one or a plurality of wiring patterns on a single substrate, and is an apparatus that exposes wiring patterns of each layer of a multilayer printed wiring board. The exposure apparatus is characterized by a method for correcting the exposure position of each wiring pattern. First, a schematic configuration of the exposure apparatus will be described.

  As shown in FIG. 1, the exposure apparatus 10 includes a flat moving stage 14 that holds the substrate 12 by adsorbing the substrate 12 to the surface. Two guides 20 extending along the stage moving direction are installed on the upper surface of the thick plate-like installation table 18 supported by the four legs 16. The moving stage 14 is supported by the guide 20 so as to be reciprocally movable.

  A U-shaped gate 22 is provided at the center of the installation base 18 so as to straddle the movement path of the stage 14. Each end of the U-shaped gate 22 is fixed to both side surfaces of the installation base 18. A scanner 24 is provided on one side of the gate 22, and the front and rear ends of the substrate 12 and positions of a plurality of circular reference marks 12 a provided in advance on the substrate 12 are provided on the other side. Two cameras 26 are provided for detecting the above. The camera 26 is supported by the gate 22 so as to be movable in the X direction.

  Here, the reference mark 12a in the substrate 12 is, for example, a hole formed on the substrate 12 based on preset reference mark position information. In addition to the holes, lands, vias, and etching marks may be used. Further, as the reference mark 12a, a predetermined pattern such as a part of a circuit pattern exposed on the substrate 12 may be used.

  The scanner 24 and the camera 26 are respectively attached to the gate 22 and fixedly arranged above the moving path of the stage 14. The scanner 24 and the camera 26 are connected to a controller (described later) that controls them.

  As shown in FIGS. 2 and 3B, the scanner 24 includes ten exposure heads 30 (30A to 30J) arranged in a substantially matrix of 2 rows and 5 columns.

  Each exposure head 30 is provided with a digital micromirror device (DMD) 36, which is a spatial light modulation element (SLM) for spatially modulating the incident light beam, as shown in FIG. Are attached such that the pixel column direction forms a predetermined inclination angle θ with the scanning direction. Therefore, the exposure area 32 by each exposure head 30 is a rectangular area inclined with respect to the scanning direction. As the stage 14 moves, a strip-shaped exposed region 34 is formed on the substrate 12 for each exposure head 30.

  The DMD 36 provided in each of the exposure heads 30 is on / off controlled in units of micromirrors, and the substrate 12 is exposed to a dot pattern (black / white) corresponding to the micromirrors of the DMD 36. As shown in FIG. 4, the above-described band-shaped exposed region 34 is formed by two-dimensionally arranged dots.

  The two-dimensional dot pattern is inclined with respect to the scanning direction, so that dots arranged in the scanning direction pass between dots arranged in the direction intersecting the scanning direction. Can be planned.

  Note that there may be a dot that is not used due to variations in the adjustment of the tilt angle. For example, in FIG. 4, the hatched dot is a dot that is not used, and the micromirror in the DMD 36 corresponding to this dot is always in the OFF state. Become.

  Further, as shown in FIGS. 3A and 3B, the exposure heads of the respective rows arranged in a line so that each of the strip-shaped exposed areas 34 partially overlaps the adjacent exposed areas 34. Each of 30 is arranged with a predetermined interval (natural number times the long side of the exposure area, 1 time in this embodiment) shifted in the arrangement direction. For this reason, for example, the portion that cannot be exposed between the exposure area 32A located on the leftmost side of the first row and the exposure area 32C located on the right side of the exposure area 32A is the exposure area located on the leftmost side of the second row. It is exposed by 32B. Similarly, the portion that cannot be exposed between the exposure area 32B and the exposure area 32D located on the right side of the exposure area 32B is exposed by the exposure area 32C.

  Next, the electrical configuration of the exposure apparatus 10 will be described.

  As shown in FIG. 5, the exposure apparatus 10 receives exposure image data in a vector data format representing a wiring pattern to be exposed, which is output from a data creation apparatus 40 having a CAM (Computer Aided Manufacturing) station. A detection position indicating the position of the reference mark 12a based on the raster conversion processing unit 50 that converts the exposure image data in the data format into the raster data (bitmap data) format and the captured image of the reference mark 12a captured by the camera 26. A detection position information acquisition unit 52 that acquires information, a drawing position correction unit 54 that corrects drawing position information indicating the layout of the wiring pattern to be exposed based on the detection position information acquired by the detection position information acquisition unit 52, and The exposure image data is corrected based on the drawing position information corrected by the drawing position correction unit 54. An image data correction unit 56 that generates corrected exposure image data, and a drawing control unit that controls the exposure head 30 to be exposed by the exposure head 30 based on the corrected exposure image data converted by the image data correction unit 56. 58 and a controller 70 for controlling the entire exposure apparatus.

  The controller 70 is connected to a stage moving mechanism 60 that moves the moving stage 14 in the stage moving direction and a camera moving mechanism 28 that moves the camera 26 in the X direction. The controller 70 includes a reference mark selection unit 70a that selects a reference mark 12a used to correct the drawing position information based on preset reference mark position information. The controller 70 controls the camera moving mechanism 28 so as to move the camera 26 to a position where the reference mark 12a selected by the reference mark selection unit 70a can be imaged.

  Next, the operation of the exposure apparatus 10 will be described with reference to FIG.

  First, the data creation device 40 creates exposure image data in a vector data format representing the entire image pattern including a plurality of wiring patterns to be exposed on the substrate 12. Then, the exposure image data is input to the raster conversion processing unit 50. In the raster conversion processing unit 50, the raster data is converted into the raster data and input to the image data correction unit 56. The image data correction unit 56 receives the input raster data. Temporary exposure image data is stored.

  On the other hand, the substrate 14 to be exposed is placed on the moving stage 14, and the reference mark position information of the reference mark 12a provided on the placed substrate 14 is set in the controller 70 by a predetermined input means. . The reference mark position information is a design value indicating the position information of the reference mark 12a on the standard substrate 12 that is not deformed or distorted, and is determined in advance when the reference mark 12a is provided on the substrate 12. Value. The reference mark position information may be acquired by measuring the position of the reference mark 12a provided on the substrate 12. In the present embodiment, the reference mark 12a is a hole. However, a part of a pattern such as a land formed on the substrate 12 or a printed mark may be used as the reference mark 12a.

  Then, the reference mark position information corresponding to the reference mark 12 a to be imaged by the camera 26 is selected by the reference mark selection unit 70 a of the controller 70.

  More specifically, for example, the reference mark position information 12b set in the controller 70 is arranged as shown in FIG. 6, and the width in the X direction of the imaging range imaged by the camera 26 is shown in FIG. When the width W is as shown, the reference mark 12a to be imaged is selected so that more reference marks 12a can be imaged by the two cameras 26.

  That is, when the reference mark position information 12b is arranged as shown in FIG. 6, the reference mark position information 12b within the imaging range A1 and the imaging range A3 is selected, and the imaging range A1 and the imaging range are selected. The position information of the camera 26 in the X direction corresponding to A3 is acquired.

  Then, a control signal is output from the controller 70 to the camera moving mechanism 28 so that the camera 26 is placed at the position indicated by the camera position information acquired as described above, and the camera moving mechanism 28 is based on the control signal. The two cameras 26 are moved, and the cameras 26 are arranged at the position of the camera position information.

  Next, a control signal is output from the controller 70 to the stage moving mechanism 60, and the stage moving mechanism 60 moves the moving stage 14 from the position shown in FIG. Then, the stage is moved to a stage moving direction at a desired speed. Here, the upstream side means the side where the scanner 24 is installed with respect to the gate 22, and the downstream side means the side where the camera 26 is installed with respect to the gate 22.

  Then, when the substrate 12 on the moving stage 14 moving as described above passes under the plurality of cameras 26, the substrate 12 is imaged by these cameras 26, and image data representing the captured images is detected position information. Input to the acquisition unit 52. The detection position information acquisition unit 52 detects the position of the reference mark 12a of the substrate 12 placed on the stage 14 based on the input image data, and acquires detection position information.

  More specifically, the detection position information acquisition unit 52 receives position information about the stage movement direction of the moving stage 14 and position information about the X direction of the camera 26, and the detection position information acquisition unit 52 Based on the position information of the stage 14, the position information of the camera 26, and the position of the image of the reference mark 12a in the captured image captured by the camera 12, the detected position information indicating the actual position of the reference mark 12a on the substrate 12 To get.

  The position information of the moving stage 14 is detected by a linear encoder (not shown) and input to the detected position information acquisition unit 52, and the position information of the camera 26 is input from the controller 70 to the detected position information acquisition unit 52. The

  Further, the position of the image of the reference mark 12a in the captured image captured by the camera 26 is detected, for example, by extracting a circular image.

  The detection position information of the reference mark 12a is specifically acquired as a coordinate value. The coordinate system is the same coordinate system as the reference mark position information coordinate system and the drawing position information coordinate system. To do.

  Then, the detection position information acquired by the detection position information acquisition unit 52 as described above and the reference mark position information 12 b set in the controller 70 are input to the drawing position correction unit 54.

  On the other hand, the detection position information and the reference mark position information are set in the drawing position correction unit 54 as described above, and the drawing position information indicating the arrangement position of the wiring pattern to be exposed on the substrate 12 is a predetermined input. It is set in the controller 70 by means.

  The drawing position information 12c is set, for example, as indicating each vertex of a rectangular range where the wiring pattern is exposed as shown by white circles in FIG. 6, but is not limited to this, and the wiring pattern is exposed. Any form may be adopted as long as it indicates the arrangement. The drawing position information 12 c set as described above is also input to the drawing position correction unit 54.

  Here, for example, the correction of the wiring pattern arrangement when the reference mark position information 12b and the drawing position information 12c input to the drawing position correction unit 54 as described above have an arrangement relationship as shown in FIG. A method will be described.

  When correcting the layout of the wiring pattern, first, the reference mark position information 12b arranged within a predetermined range from the preset wiring pattern arrangement position is selected.

  Here, for example, the drawing position information 12c indicating the arrangement of the wiring pattern is arranged as shown in FIG. 6, and the rectangular exposure range having the four drawing position information 12c as vertices is corrected. When two reference mark position information 12b is selected and correction is performed using the two selected reference mark position information 12b and the detected position information of two reference marks 12a corresponding to the reference mark position information 12b. explain.

  Specifically, for example, the position of the detected position information 12d is in a positional relationship as shown in FIG. 7A with respect to the position of the reference mark position information 12b input to the drawing position correcting unit 54, and X When the direction is shifted by x1, the X direction shift information for shifting the four drawing position information 12c by x1 in the X direction is acquired.

  Further, for example, the position of the detected position information 12d is in a positional relationship as shown in FIG. 7B with respect to the position of the reference mark position information 12b, and y1 in the stage moving direction (hereinafter referred to as “Y direction”). In the case where only the shift is performed, the Y direction shift information for shifting the four drawing position information 12c by y1 in the Y direction is acquired.

  Further, the position of the detected position information 12d is in a positional relationship as shown in FIG. 7C with respect to the position of the reference mark position information 12b, and 2 with respect to the straight line connecting the two reference mark position information 12b. When the straight line connecting the two detection position information 12d is inclined by θ, rotation information for rotating the four drawing position information 12c by the angle θ is acquired.

  Further, the position of the detection position information 12d is in a positional relationship as shown in FIG. 7D with respect to the position of the reference mark position information 12b, and the position, the detection position information 12d, Are the same positions, and when only the position of the detected position information relative to the position of the other reference mark position information 12 is shifted by y2 in the Y direction, the detected position shifted among the four drawing position information 12c Information that shifts by y2 in the Y direction is acquired only for the drawing position information 12c that is close to the information 12d. That is, expansion / contraction information for expanding the exposure range determined by the drawing position information 12c by y2 in the Y direction is acquired.

  In the description of FIGS. 7A to 7D, the case of acquiring the X direction shift information, the Y direction shift information, the rotation information, and the expansion / contraction information has been described. However, the reference mark position information 12b and the detected position information are described. If the positional relationship with 12d is a combination of these, correction information corresponding to the combination may be acquired for each drawing position information.

  In the correction, the relative positional relationship between the reference mark position information 12b and the drawing position information 12c is the same as the relative positional relationship between the detected position information 12d and the corrected drawing position information 12c. However, as long as the correction method maintains the relative positional relationship as described above, any calculation method may be adopted as the calculation method.

  Then, the correction information acquired for each drawing position information 12c as described above is output to the image data correction unit 56.

  Then, the image data correction unit 56 performs a correction process on the exposure image data corresponding to each drawing position information 12c based on the correction information about the drawing position information. Specifically, when the correction information is X-direction shift information, a shift process in the X direction is performed on the exposure image data. When the correction information is Y-direction shift information, the shift in the Y direction is performed. When the process is performed on the exposure image data and the correction information is rotation information, the X rotation process is performed on the exposure image data. When the correction information is expansion / contraction information, scaling according to the expansion / contraction information is performed. Processing is performed on the exposure image data. In the present embodiment, the exposure image data is corrected based on the correction information of the drawing position information. However, the relative position relationship between the reference mark position information 12b and the exposure image, and the detected position information 12d. Based on this, the exposure image data representing the exposure image may be directly corrected without using the drawing position information 12c.

  Then, the corrected exposure image data is calculated as described above, and the moving stage 14 is moved from the downstream position shown in FIG. 1 to the upstream side at a desired speed.

  Then, when the tip of the substrate 12 is detected by the camera 26, exposure is started. Specifically, the corrected exposure image data calculated as described above is output to the drawing control unit 58, and the drawing control unit 58 outputs each exposure head 30 of the scanner 24 based on the input corrected exposure image data. The exposure head 30 turns on / off the micromirrors of the DMD 36 based on the control signal to expose the wiring pattern on the substrate 12 according to the corrected exposure image data.

  As the moving stage 14 moves, a control signal is sequentially output to each exposure head 30 to perform exposure. When the rear end of the substrate 12 is detected by the camera 12, the exposure ends.

  Next, in the above description, the drawing position information indicating the arrangement of the exposure pattern and the reference mark position information have a positional relationship as shown in FIG. 6, for example, and are selected by the reference mark selection unit 70a, and the wiring pattern Although there has been described a method for correcting a wiring pattern when there are two reference marks 12a within a predetermined range from the arrangement position of the wiring pattern, for example, the reference mark selecting unit 70a selects the wiring pattern and When there are three or more reference marks 12a within a predetermined range from the exposure position of the pattern for one wiring pattern, the drawing position correcting unit 54, as described above, the X direction shift information, the Y direction shift information, Instead of acquiring rotation information and expansion / contraction information, free deformation information is acquired, and the image data correction unit 56 is based on the free deformation information. Te, subjected to free transform process on the exposure image data of each wiring pattern.

  Specifically, for example, when the drawing position information 12c, the reference mark position information 12b, and the detected position information 12d are in a positional relationship as shown in FIG. The position of each drawing position information 12c after correction is free based on the positional relationship between the drawing position information 12c and the three reference mark position information 12 and the deviation between the three reference mark position information and the detected position information 12d. Deformation information is acquired. As a method for acquiring the above-mentioned free deformation processing information, for example, curved surface interpolation using the least square method or Hardy multi-variable two-dimensional interpolation can be used. Triangulation interpolation (linear, quadratic spline, cubic spline) can also be used. Here, the free deformation correction may be directly applied to the exposure image data without using the drawing position information 12.

  Then, exposure image data subjected to free deformation processing is acquired based on the free deformation information acquired as described above, and exposure is performed based on the corrected exposure image data in the same manner as described above.

  As the free deformation process of the exposure image data, for example, the drawing position information 12c before the free deformation process is arranged as shown in FIG. 9A, and the drawing position information 12c after the free deformation process is shown in FIG. In the case of the arrangement shown in B), the coordinates of P (x, y) before deformation corresponding to the coordinates of the predetermined position P ′ (x ′, y ′) after deformation are calculated, and the P The pixel value of P ′ (x ′, y ′) can be obtained by interpolating the pixel values of the peripheral pixels of (x, y). Note that white circles in FIG. 9 indicate the drawing position information.

Specifically, the coordinate value of P (x, y) is calculated by calculating the following expression, and the peripheral pixels P (x−1, y−1) to P (x + 1, P) of P (x, y) are calculated. By interpolating using the pixel value of y + 1), the pixel value of P ′ (x ′, y ′) can be obtained. When the peripheral pixel is a binary image, the pixel value of the peripheral pixel with the shortest distance can be set as the pixel value of P ′ (x ′, y ′).

  The correction method corresponding to the number of detected position information may be selected for each drawing position of each exposure image, or may be uniformly performed on the entire substrate or the same product.

  When a large number of drawing position information is set for the exposure image data as shown in FIG. 10, the exposure image data is divided into a large number of triangles as shown in FIG. By performing the above, a free deformation process as shown in FIG. 10B can be performed.

  Even when the free deformation process is directly performed on the exposure image data based on the detected position information without using the drawing position information 12c, the same calculation as described above may be performed. In that case, a white circle shown in FIG. 9B may be considered as the detection position information.

  According to the exposure apparatus, a part of the reference marks 12a among the reference marks 12a is selected, the selected part of the reference marks 12a is detected, and the detected position information indicating the position of the part of the reference marks 12a. Is selected, and a correction method corresponding to the acquired number of detected position information is selected, and the drawing position information 12c is corrected using the selected correction method. It is possible to detect an appropriate reference mark 12a by correcting the image arrangement without incurring an increase in cost, and to perform more appropriate correction corresponding to the detected position information.

  In the exposure apparatus of the above embodiment, the reference mark selection unit 70a automatically selects the reference mark 12a to be imaged so that more reference marks 12a are imaged. For example, the reference mark 12a that is within a predetermined range from the exposure range of the preset wiring pattern may be sequentially selected in order from the shortest distance between the exposure range and the reference mark 12a. . The predetermined range is a range that is narrower than the entire substrate and is an appropriate range for correcting the arrangement of the wiring pattern in accordance with the deformation of the substrate. Further, the distance between the exposure range and the reference mark 12a may be, for example, the distance between the center of gravity position of the exposure range and the reference mark 12a.

  Further, instead of automatically selecting the reference mark 12a to be imaged as described above, for example, the operator may select the reference mark 12a to be imaged by a predetermined input means. That is, the reference mark 12a may be selected according to an operation input by the operator. At this time, the operator may select the reference mark 12a to be imaged from the reference marks 12a automatically extracted by the apparatus. Conversely, the reference mark 12a to be imaged may be automatically selected from the area designated by the operator.

  Further, the reference mark 12a at a position corresponding to the imaging timing of the camera 26 may be selected with respect to the stage moving direction. In this case, the reference mark 12a to be imaged may be automatically selected based on the moving speed of the moving stage 14 and the imaging timing of the camera 26, or the operator may use a predetermined input means as described above. The reference mark 12a to be imaged may be selected.

  Alternatively, the reference mark 12a that falls within the field of view of the camera 26 whose position is arbitrarily determined may be selected. As described above, when the position corresponding to the imaging conditions such as the imaging timing and the field of view of the camera 26 is selected from the plurality of reference marks 12a, the degree of freedom of the position where the reference mark 12a is provided increases. Become. For example, marks that are irregularly arranged when viewed from the camera 26 (for example, marks provided for purposes other than alignment), or those that are regularly arranged on the substrate in terms of appearance, have regularity depending on the imaging conditions of the camera. Even if the mark is inconsistent with the imaging conditions of the camera, such as a mark determined without considering the above, a part of the mark can be easily adopted as the reference mark 12a. When the reference mark 12a is information included in exposure image data in a vector data format such as a land, the optimum reference mark 12a may be selected by scanning the reference mark 12a from the exposure image data. .

  Even when the drawing position information 12c is not provided, the method of the present embodiment for selecting the optimum reference mark 12a from the plurality of reference marks 12a can be applied. Also in this case, since the arrangement of the lower layer pattern of the multilayer substrate is known through the detection position information of the reference mark 12a, the upper layer pattern is matched with the lower layer pattern by forming the upper layer pattern so as to be corrected accordingly. be able to.

  In the exposure apparatus of the above embodiment, the exposure image data is corrected based on the detected position information of the reference mark 12a to generate corrected exposure image data. There is no need to generate data. For example, exposure image data before correction is stored in a memory, an address of the memory is designated based on the detected position information, read out, and exposed, thereby correcting the exposure image subjected to correction. You may make it expose on a board | substrate.

  In the exposure apparatus of the above-described embodiment, each drawing position information 12c is set in advance. However, it is not always necessary to set each drawing position information 12c in the apparatus. Only a function indicating a relative positional relationship between the mark position information 12b and the drawing position information 12c is set in the apparatus in advance, and the corrected drawing position information is calculated by substituting the detected position information into the function. It may be. Further, a function indicating the relationship between the reference mark position information 12b and the drawing position information 12c is set, the function itself is corrected based on the detected position information, and the reference mark position information 12b is substituted into the corrected function. Thus, the corrected drawing position information 12c may be calculated.

  The drawing method and apparatus of the present invention can be used not only in the exposure apparatus as described above but also in, for example, an ink jet printer or an ink jet printing method. In other words, the image layout correction method of the present invention can also be applied to an apparatus that performs drawing by using dots of ejected droplets.

  The substrate 12 may be a substrate for a display device, a filter, or the like.

The perspective view which shows schematic structure of the exposure apparatus using one Embodiment of the drawing method and apparatus of this invention 1 is a perspective view showing the configuration of a scanner of the exposure apparatus in FIG. (A) is a plan view showing an exposed region formed on the exposure surface of the substrate, and (B) is a plan view showing an array of exposure areas by each exposure head. The figure which shows DMD in the exposure head of the exposure apparatus of FIG. 1 is a block diagram showing the configuration of an electric control system of the exposure apparatus in FIG. The figure which shows an example of the positional relationship of a reference mark position information, drawing position information, and several wiring patterns The figure for demonstrating the correction method of the drawing position information in case the detection position information with respect to one wiring pattern is two The figure for demonstrating the correction method of the drawing position information in case the detection position information with respect to one wiring pattern is three Diagram for explaining free deformation processing Diagram for explaining free deformation processing The figure for demonstrating an example of the detection method of a reference mark

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 12 Substrate 12a Reference mark 12b Reference mark position information 12c Drawing position information 14 Moving stage 18 Installation stand 20 Guide 22 Gate 24 Scanner 26 Camera 30 Exposure head 32 Exposure area 36 DMD
52 Detection position information acquisition unit 54 Drawing position correction unit 70a Reference mark selection unit

Claims (16)

In a drawing method for drawing an image on a drawing target based on image data,
Select some of the reference marks provided in advance on the drawing target,
Detecting the selected part of the reference marks to obtain detected position information indicating the position of the reference marks,
A drawing method, wherein the image corrected based on the acquired detected position information and the image data is drawn on the drawing target.   The drawing method according to claim 1, wherein the image data is corrected by a correction method according to the number of the acquired detected position information. When the acquired number of detected position information is two, at least one of shift correction, rotation correction, and magnification correction is performed on the image data,
The drawing method according to claim 2, wherein when the number of the acquired detected position information is three or more, free deformation correction is performed on the image data.   The drawing method according to any one of claims 1 to 3, wherein the plurality of reference marks are provided irregularly on the drawing target.   The plurality of reference marks are arranged on the drawing target in a state inconsistent with a detection condition of a detection position information acquisition unit that detects the reference mark and acquires detection position information indicating the position of the reference mark. The drawing method according to claim 1, wherein the drawing method is provided.   6. The selection according to claim 1, wherein the selection is performed based on a detection condition of a detection position information acquisition unit that detects the reference mark and acquires detection position information indicating a position of the reference mark. Drawing method. Obtaining drawing object image data representing a drawing object provided with the reference mark;
The drawing method according to claim 1, wherein the selection is performed using the acquired drawing target image data. Based on the detected position information, obtain drawing position information indicating an arrangement of the image on the drawing target;
8. The drawing method according to claim 1, wherein the image data is corrected based on the acquired drawing position information. In a drawing device that draws an image on a drawing target based on image data,
A reference mark selection means for selecting a part of the plurality of reference marks provided in advance on the drawing target;
Detection position information acquisition means for detecting a part of the reference marks selected by the reference mark selection means and acquiring detection position information indicating the position of the reference marks;
A drawing apparatus comprising: drawing means for drawing on the drawing object the image corrected based on the detected position information acquired by the detected position information acquisition means and the image data.   The drawing apparatus according to claim 9, wherein the drawing unit corrects the image data by a correction method according to the number of detected position information acquired by the detected position information acquiring unit. When the drawing means has two pieces of the acquired detected position information, it performs at least one of shift correction, rotation correction, and magnification correction on the image data,
The drawing apparatus according to claim 10, wherein when the number of pieces of the acquired detected position information is three or more, the image data is subjected to free deformation correction.   The drawing apparatus according to claim 9, wherein the plurality of reference marks are provided irregularly on the drawing target.   The plurality of reference marks are provided on the drawing target in a state inconsistent with the detection condition of the detection position information acquisition unit. The drawing apparatus described.   The drawing apparatus according to claim 9, wherein the reference mark selection unit performs the selection based on a detection condition of the detection position information acquisition unit. A drawing target image data acquisition unit for acquiring drawing target image data representing a drawing target provided with the reference mark;
The drawing apparatus according to claim 9, wherein the reference mark selection unit performs the selection using the drawing target image data acquired by the drawing target image data acquisition unit. . Based on the detection position information, the image processing apparatus further comprises drawing position information acquisition means for acquiring drawing position information indicating an arrangement of the image on the drawing target,
16. The drawing apparatus according to claim 9, wherein the drawing unit corrects the image data based on the drawing position information acquired by the drawing position information acquisition unit.

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