JP2007019271A - Wiring board and manufacturing method thereof - Google Patents

Abstract

Provided is a wiring board in which unevenness in height of protruding electrodes formed on a conductor wiring is reduced in a state where a plurality of wiring groups in which the wiring intervals of the plurality of conductor wirings are different from each other are formed.
An insulating base material, a plurality of conductor wirings 2a and 2b provided in alignment on the insulating base material, and protruding electrodes 3a and 3c formed by plating on the respective conductor wirings are provided. The protruding electrode is formed across a region on the insulating base on both sides of the conductor wiring across the longitudinal direction of the conductor wiring, and the cross-sectional shape in the width direction of the conductor wiring of the protruding electrode is higher in the center than on both sides. The plurality of conductor wirings form a plurality of wiring groups A and B in which the wiring intervals of the conductor wiring are different from each other in the region including the tip portion where the protruding electrode is formed, and the wiring of the conductor wiring at the tip portion where the protruding electrode is formed The width is set corresponding to the width of the wiring interval, and the wiring width Wa in the wiring group A having the larger wiring interval is narrower than the wiring width Wb in the wiring group B having the smaller wiring interval.
[Selection] Figure 1

Description

  The present invention relates to a wiring board having a configuration in which a conductor wiring is provided on a flexible insulating base material, such as a tape carrier board, and a protruding electrode for connection is formed on the conductor wiring, and a manufacturing method thereof. .

  COF (Chip On Film) is known as a type of package module using a tape carrier substrate. The COF has a structure in which a semiconductor element is mounted on a tape carrier substrate and the mounting portion is protected by sealing with a resin. A tape carrier substrate used for COF is composed of an insulating film base material and a large number of conductor wirings formed on the surface thereof. Generally, polyimide is used as the film substrate, and copper is used as the conductor wiring. If necessary, a metal plating film and a solder resist layer which is an insulating resin are formed on the conductor wiring. The conductor wiring on the tape carrier substrate and the electrode pad of the semiconductor element are connected via the protruding electrode. Patent Document 1 discloses a tape carrier substrate in which this protruding electrode is previously formed on a conductor wiring.

  The structure of the tape carrier substrate described in Patent Document 1 will be described with reference to FIG. FIG. 5A is a perspective view showing a part of the tape carrier substrate. A plurality of conductor wirings 2 are arranged on the film substrate 1, and protruding electrodes 3 a and 3 b are formed on each conductor wiring 2. The planar shape of the protruding electrodes 3 a and 3 b extends across the conductor wiring 2 and the regions on both sides of the conductor wiring 2. FIG. 5B is a cross-sectional view in the direction crossing the conductor wiring 2 at the positions of the protruding electrodes 3a and 3b in FIG. The cross-sectional shape of the protruding electrodes 3a and 3b in the width direction of the conductor wiring 2 is a medium-high shape that is joined to the upper surface and both side surfaces of the conductor wiring 2 and whose central portion is higher than both sides. Further, the protruding electrodes 3 a and 3 b are formed so as to be in contact with the surface of the film base 1 at both sides of the conductor wiring 2.

  By forming the protruding electrodes 3a and 3b as described above, the protruding electrodes 3a and 3b are held on the conductor wiring 2 with a practically sufficient strength. That is, since the protruding electrodes 3a and 3b are bonded not only to the upper surface of the conductor wiring 2, but also to both side surfaces, sufficient stability can be obtained against the force applied in the lateral direction.

  Further, since the upper surfaces of the protruding electrodes 3a and 3b are not flat but medium and high, it is suitable for connection to the electrode pad of the semiconductor element. That is, even if there is a misalignment between the protruding electrodes 3a and 3b and the electrode pads, the protruding electrodes 3a and 3b are less likely to be connected to the adjacent inappropriate electrode pads as compared with the case where the upper surface is flat. Further, when connecting to the electrode pad, the oxide film formed on the surface of the electrode pad can be easily crushed by the convex upper surfaces of the protruding electrodes 3a and 3b, and the interior not oxidized and good electrical property can be obtained. A connection is obtained.

  Next, with reference to FIG. 6, the manufacturing method of the tape carrier board of the said structure described in patent document 1 is demonstrated. 6 (a1) to 6 (f1) show manufacturing steps for forming protruding electrodes on the tape carrier substrate, and are plan views of the semiconductor element mounting portion. 6 (a2) to (f2) are enlarged sectional views of FIGS. 6 (a1) to (f1), respectively. Each cross-sectional view shows a cross section at a position corresponding to XX in FIG.

  First, as shown in FIG. 6 (a1), a film substrate 1 on which a plurality of conductor wirings 2 are formed on the surface is prepared. A photoresist 4 is formed on the entire surface of the film substrate 1 as shown in FIG. Next, as shown in FIG. 3 (c1), an exposure mask 5 for forming protruding electrodes is opposed to the upper portion of the photoresist 4 formed on the film substrate 1. The light transmission region 5 a of the exposure mask 5 has a long hole shape that is continuous across the plurality of conductor wirings 2 in the alignment direction of the plurality of conductor wirings 2.

  By exposing and developing through the light transmission region 5a of the exposure mask 5, a long hole pattern 4a across the conductor wiring 2 is opened in the photoresist 4 as shown in FIG. 6 (d1). Thereby, a part of the conductor wiring 2 is exposed in the long hole pattern 4a. Next, the exposed portion of the conductor wiring 2 is subjected to metal plating through the long hole pattern 4a of the photoresist 4 to form the protruding electrode 3 as shown in FIG. 6 (e1). Next, if the photoresist 4 is removed, as shown in FIG. 6 (f1), the tape carrier substrate 6 in which the protruding electrodes 3 are formed on the conductor wiring 2 is obtained.

  In this manner, by exposing the exposed portion of the conductor wiring 2 through the long hole pattern 4a formed in the photoresist 4, the protruding electrode 3 having the shape as shown in FIG. Can be formed. This is because not only the upper surface of the conductor wiring 2 but also the side surfaces are exposed in the step of FIG. 6E1, and plating is formed over the entire exposed surface of the conductor wiring 2.

  Incidentally, the tape carrier substrate is used for mounting a display panel driving semiconductor element such as a liquid crystal panel, for example. The electrode pad on the semiconductor element is connected to each conductor wiring on the tape carrier substrate through the protruding electrode. The wiring density in the semiconductor element is largely different between the input side and the output side, and therefore the interval between the electrode pads on the semiconductor element is not necessarily uniform. Accordingly, the intervals between the conductor wirings on the tape carrier substrate must be arranged in a wide range. In addition, there may be a case where the distance between the conductor wirings needs to be wide depending on the situation of the connection destination even at the opposite end of each conductor wiring on the side where the semiconductor element is mounted.

  In this way, when forming a plurality of wiring groups having different wiring intervals in the region including at least the tip portion where the protruding electrode is formed, the conductor wiring on the tape carrier substrate is shown in FIGS. 5 (a) and 5 (b). It turns out that the problem shown is caused. In the wiring group B shown in FIGS. 5A and 5B, the wiring interval is wider than that of the wiring group A. In this case, as shown in FIG. 5B, the protruding electrode 3 b on the conductor wiring 2 of the wiring group B is formed higher than the protruding electrode 3 a of the conductor wiring 2 of the wiring group A. Thus, if the heights of the protruding electrodes 3a and 3b are not uniform, there is a possibility that a defect occurs in the connection between the electrode pad and the protruding electrode when the semiconductor element is mounted.

On the other hand, Patent Document 2 describes a method for eliminating unevenness of the heights of plating bumps formed in a large number of blind vias provided on an insulating substrate for connecting each layer of a multilayer wiring board. Yes. Plating bumps are formed through blind vias on a conductive thin film formed on one surface of an insulating substrate. However, when the arrangement of a large number of blind vias is dense, uneven plating bumps occur. Therefore, the unevenness of the height of the plating bump is reduced by making the via diameter different depending on the arrangement position of the blind via.
JP 2004-327936 A JP 2001-237511 A

  However, conventionally, there are few prior examples of the structure of a wiring board of a type in which protruding electrodes are formed on conductor wiring, and the above-described variation in height is eliminated for protruding electrodes provided on a plurality of conductor wirings. Was not considered. The method described in Patent Document 2 cannot be said to be a technique that can be applied to the wiring board as described above because the structure of the object on which the protruding electrode is formed is completely different.

  The present invention provides a wiring board in which unevenness of heights of protruding electrodes formed on a conductor wiring is reduced in a state where a plurality of wiring groups in which wiring intervals of the plurality of conductor wirings are different from each other are formed. With the goal.

  The basic configuration common to the wiring board of the present invention is an insulating base material, a plurality of conductor wirings arranged in alignment on the insulating base material, and protruding electrodes formed by plating on the respective conductor wirings The protruding electrode is formed across a region on the insulating substrate on both sides of the conductor wiring across the longitudinal direction of the conductor wiring, and the sectional shape of the protruding electrode in the width direction of the conductor wiring is The center is higher than both sides.

  In the wiring board of the first configuration of the present invention, the plurality of conductor wirings form a plurality of wiring groups in which wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed, The wiring width of the conductor wiring at the tip portion where the protruding electrode is formed is set corresponding to the width of the wiring interval, and the wiring width in the wiring group with the wider wiring interval is the one with the narrower wiring interval. The wiring group is narrower than the wiring width.

  In the wiring board of the second configuration of the present invention, the plurality of conductor wirings form a plurality of wiring groups in which wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed, The area where the protruding electrode is in contact with the upper surface of the conductor wiring is characterized in that the wiring group with the larger wiring interval is larger than the wiring group with the smaller wiring interval.

  In the wiring board of the third configuration of the present invention, the plurality of conductor wirings form a plurality of wiring groups in which wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed, A wiring group with a wider wiring interval is formed by a plurality of sub-wiring groups each including a plurality of the conductor wirings, and the intervals between the conductor wirings belonging to the same sub-wiring group are different from each other. It is characterized by being narrower than the interval provided between the sub-wiring groups.

  The basic configuration common to the method for manufacturing a wiring board of the present invention includes a step of arranging a plurality of conductor wirings on an insulating base material, and a photo on the surface of the insulating base material on which the conductor wiring is provided. Forming a resist; forming an opening in the photoresist that extends across the conductor wiring to a region on both sides of the conductor wiring; and exposing a part of the conductor wiring in the opening; And a step of performing metal plating on the exposed part of the conductor wiring by electrolytic plating to form a protruding electrode.

  The wiring board manufacturing method of the first configuration of the present invention is formed by arranging the conductor wiring divided into a plurality of wiring groups having different wiring intervals in a region including a tip portion where the protruding electrode is to be formed, The wiring width of the conductor wiring in the region where the protruding electrode is to be formed corresponds to the width of the wiring space, and the wiring width in the wiring group with the larger wiring space is set to the wiring with the narrower wiring space. It is characterized by being narrower than the wiring width in the group.

  In the method for manufacturing a wiring board according to the second configuration of the present invention, the conductor wiring is formed in an arrangement divided into a plurality of wiring groups having different wiring intervals in a region including a tip portion where the protruding electrode is to be formed, In the step of forming the opening in the photoresist and exposing a part of the conductor wiring, the upper surface area of each conductor wiring exposed in the opening is set as the wiring group with a larger wiring interval. It is characterized in that it is larger than the wiring group with a narrower wiring interval.

  In the wiring board manufacturing method of the third configuration of the present invention, the conductor wiring is formed by an arrangement in which wiring intervals in a region including a tip portion where the protruding electrode is to be formed are divided into a plurality of wiring groups different from each other. The wiring group having the wider wiring interval is formed by a plurality of sub wiring groups each including a plurality of the conductor wirings, and the interval between the conductor wirings belonging to the same sub wiring group is set to be adjacent to each other. It is characterized in that it is narrower than the distance provided between the sub-wiring group.

  According to the said structure, the difference in the current density resulting from the width of wiring spacing is canceled out with respect to the current flowing through the conductor wiring in order to perform the electrolytic plating for forming the protruding electrode. As a result, unevenness in the height of the formed protruding electrodes is reduced.

  In the wiring board according to the first configuration of the present invention, the conductor wiring belonging to the wiring group having the wider wiring interval is configured such that the wiring width at the tip portion where the protruding electrode is formed is narrower than the wiring width in other regions. It can be.

  In the wiring board of the second configuration of the present invention, the conductor wiring has a length of the protruding electrode in the wiring direction in which the wiring group with the larger wiring interval is compared with the wiring group with the smaller wiring interval. It can be set as the structure currently formed long.

  In the method for manufacturing a wiring board according to the first configuration of the present invention, the conductor wiring in the wiring group having the larger wiring interval is narrower than the wiring width in the other area. Can be formed.

  In the method for manufacturing a wiring board according to the second configuration of the present invention, the length of the opening of the photoresist in the wiring direction of the conductor wiring is set to be smaller in the wiring group having the larger wiring interval. It can be made longer than the wiring group.

  Hereinafter, a tape carrier substrate which is a wiring substrate in an embodiment of the present invention will be described with reference to the drawings. The basic structure of the tape carrier substrate in each embodiment is the same as that of the above-described conventional example, and the same elements are denoted by the same reference numerals to simplify the description.

(Embodiment 1)
With reference to FIG. 1, the structure of the tape carrier substrate in the first exemplary embodiment will be described. FIG. 1A is a perspective view showing a part of a tape carrier substrate, and FIG. 1B is a cross-sectional view.

  As shown in FIG. 1, a plurality of conductor wirings 2a and 2b are arranged on the insulating film substrate 1, and the protruding electrodes 3a and 2b are respectively provided at the ends of the conductor wirings 2a and 2b. 3c is formed by electrolytic plating. Similar to the conventional example, the protruding electrodes 3a and 3c are formed across regions on the film substrate 1 on both sides of the conductor wirings 2a and 2b across the longitudinal direction of the conductor wirings 2a and 2b. The cross-sectional shape in the width direction of the conductor wirings 2a and 2b of the protruding electrodes 3a and 3c is higher in the center than on both sides.

  The conductor wiring 2a forms a wiring group A having a narrow wiring interval, and the conductor wiring 2b forms a wiring group B having a wiring spacing wider than the conductor wiring 2a. The wiring width Wb of the conductor wiring 2b in the wiring group B with the larger wiring spacing is narrower than the wiring width Wa of the conductor wiring 2a in the wiring group A with the smaller wiring spacing. That is, the wiring widths Wa and Wb of the conductor wirings 2a and 2b at the tip portions where the protruding electrodes 3a and 3c are formed are set corresponding to the width of the wiring interval as described above. By setting the wiring widths Wa and Wb in this way, the difference in height between the protruding electrodes 3a and 3c formed by electrolytic plating is reduced. The reason is as follows.

  The protruding electrodes 3a and 3c are formed by the same manufacturing method as in the conventional example shown in FIG. At this time, since the wiring width Wb is narrower than the wiring width Wa, the difference between the current values flowing through the conductor wirings 2a and 2b for performing electroplating is reduced. That is, the current density flowing through the conductor wiring 2b in the wiring group with the larger wiring interval is larger than the conductor wiring 2a in the wiring group with the smaller wiring interval, but the wiring width Wb is narrower than the wiring width Wa. This cancels out the difference due to the current density, and the current values flowing through the conductor wirings 2a and 2b are close to each other. As a result, the difference in height between the formed protruding electrodes 3a and 3c is reduced, and it is possible to suppress the occurrence of a poor connection state via the protruding electrodes 3a and 3c during mounting.

  As the film substrate 1, polyimide which is a general material can be used. Depending on other conditions, an insulating film material such as PET or PEI may be used. The conductor wirings 2a and 2b are usually formed using copper in a thickness range of 3 to 20 μm. If necessary, an epoxy adhesive may be interposed between the film substrate 1 and the conductor wirings 2a and 2b.

  The thickness of the protruding electrodes 3a and 3c is usually in the range of 3 to 20 μm. As a material of the protruding electrodes 3a and 3c, for example, copper can be used. When copper is used, it is desirable to perform metal plating on the protruding electrodes 3a and 3c and the conductor wirings 2a and 2b.

(Embodiment 2)
The structure of the tape carrier substrate in the second embodiment will be described with reference to FIG. FIG. 2 is a perspective view showing a part of the tape carrier substrate.

  Also in this embodiment, a wiring group A having a narrow wiring interval and a wiring group B having a wiring interval wider than the wiring group A are formed. The conductor wiring 2c belonging to the wiring group B with the larger wiring interval includes a tip end portion 2cb on which the protruding electrode 3c is formed and a main body portion 2ca. The wiring width of the distal end portion 2cb is narrower than the wiring width of the main body portion 2ca. The wiring width of the conductor wiring 2a belonging to the wiring group A with the smaller wiring interval is equal to the wiring width of the main body 2ca of the conductor wiring 2c belonging to the wiring group B.

  Accordingly, the wiring width of the tip portion 2cb where the protruding electrode 3c of the conductor wiring 2c is formed is narrower than the wiring width at the tip portion where the protruding electrode 3a of the conductor wiring 2a is formed. By narrowing the tip 2cb of the conductor wiring 2c, the difference in current value for performing electroplating for forming the protruding electrodes 3a and 3c is reduced as in the first embodiment. As a result, the difference in height between the formed protruding electrodes 3a and 3c is reduced, and it is possible to suppress the occurrence of a poor connection state via the protruding electrodes 3a and 3c during mounting.

  Moreover, since the main-body part 2ca of the conductor wiring 2c has a wiring width equivalent to that of the conductor wiring 2a, the above-described effects can be obtained while maintaining the bending strength of the tape carrier substrate.

(Embodiment 3)
The structure of the tape carrier substrate in the third embodiment will be described with reference to FIG. FIG. 3A is a plan view showing a part of the tape carrier substrate, and FIG. 3B is a cross-sectional view of the protruding electrode portion in FIG.

  In the present embodiment, the conductor wiring 2 belonging to the wiring group A having a narrow wiring interval and the conductor wiring 2 belonging to the wiring group B having a wide wiring interval have the same wiring width. On the other hand, in the present embodiment, the protruding electrode 3a formed on the conductor wiring 2 belonging to the wiring group A and the protruding electrode 3d formed on the conductor wiring 2 belonging to the wiring group B include the protruding electrodes 3a and 3d. The areas in contact with the upper surface of the conductor wiring 2 are different. That is, the area where the protruding electrode 3 d is in contact with the upper surface of the conductor wiring 2 is set to be larger than the area where the protruding electrode 3 a is in contact with the upper surface of the conductor wiring 2.

  As a specific structure, as shown in FIG. 3A, the length L2 of the protruding electrode 3d in the wiring group B in the wiring direction is longer than the length L1 of the protruding electrode 3a in the wiring group A in the wiring direction. Is set to be longer.

  By setting so that the area where the protruding electrode 3d is in contact with the upper surface of the conductor wiring 2 is larger than the area where the protruding electrode 3a is in contact with the upper surface of the conductor wiring 2, the protruding electrode 3a, The difference between the current values for performing the electroplating for forming 3d is reduced.

  That is, when forming the protruding electrodes 3a and 3d, as shown in FIGS. 6D1 and 6E1 of the conventional example, the exposed portion of the conductor wiring 2 is subjected to metal plating through a photoresist pattern. Apply. According to the present embodiment, the length in the wiring direction of the opening for forming the protruding electrode 3d is made longer than the opening for forming the protruding electrode 3a in the photoresist pattern for electrolytic plating. become. Therefore, the surface area of the conductor wiring 2 through which the current for electrolytic plating flows is wider in the conductor wiring 2 where the protruding electrode 3d is formed than in the conductor wiring 2 where the protruding electrode 3a is formed.

  Thereby, the difference in current density due to the width of the wiring interval is offset by the difference in surface area of the conductor wiring 2 through which the current flows, and each current value for applying the electroplating to form the protruding electrodes 3a and 3d. The difference becomes smaller. As a result, as shown in FIG. 3B, the unevenness of the height of the formed protruding electrodes 3a and 3d is reduced, and the occurrence of a defective connection state via the protruding electrodes 3a and 3d during mounting is suppressed. Can do.

(Embodiment 4)
The structure of the tape carrier substrate in the fourth embodiment will be described with reference to FIG. FIG. 4 is a plan view showing a part of the tape carrier substrate.

  In the present embodiment, the conductor wiring 2 belonging to the wiring group A having a narrow wiring interval and the conductor wiring 2 belonging to the wiring group B having a wide wiring interval have the same wiring width. On the other hand, in the present embodiment, the wiring group B with the wider wiring interval is formed by a plurality of sub wiring groups B1, B2, and B3 each including a plurality of conductor wirings 2. The distance D1 between the conductor wirings 2 belonging to the same sub wiring group B1, B2, B3 is set to be narrower than the distance D2 provided between the adjacent sub wiring groups. .

  Thereby, in each sub wiring group B1, B2, B3, the space | interval of the conductor wiring 2 can be made equivalent to the space | interval of the conductor wiring 2 which belongs to the wiring group A. FIG. Accordingly, the difference between the current values for performing the electrolytic plating for forming the protruding electrodes 3a and 3f is reduced. As a result, uneven heights of the formed protruding electrodes 3a and 3f are reduced.

  The wiring board of the present invention is useful as a tape carrier board used for COF and the like because unevenness in height of protruding electrodes formed on a large number of conductor wirings is reduced.

(A) is a perspective view which shows the tape carrier substrate in Embodiment 1 of this invention, (b) is the sectional drawing. The perspective view which shows the tape carrier board | substrate in Embodiment 2 of this invention. (A) is a top view which shows the tape carrier substrate in Embodiment 3 of this invention, (b) is the sectional drawing. The top view which shows the tape carrier substrate in Embodiment 4 of this invention (A) is a perspective view which shows the tape carrier board | substrate of a prior art example, (b) is the sectional drawing. The process of the manufacturing method of the tape carrier board | substrate of a prior art example is shown, (a1)-(f1) is a top view of the semiconductor element mounting part on a film base material in the manufacturing process which forms a protruding electrode, (a2)-( f2) are enlarged sectional views of (a1) to (f1), respectively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film base material 2, 2a, 2b Conductor wiring 3, 3a, 3b, 3c, 3d, 3f Protrusion electrode 4 Photoresist 4a Elongate pattern 5 Exposure mask 5a Light transmission area 6 Tape carrier substrate

Claims (10)

An insulating substrate;
A plurality of conductor wirings arranged in alignment on the insulating substrate;
Provided with a protruding electrode formed by plating on each conductor wiring,
The protruding electrode is formed across the region on the insulating substrate on both sides of the conductor wiring across the longitudinal direction of the conductor wiring,
The cross-sectional shape in the width direction of the conductor wiring of the protruding electrode is a wiring board whose central portion is higher than both sides,
The plurality of conductor wirings form a plurality of wiring groups in which the wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed,
The wiring width of the conductor wiring at the tip portion where the protruding electrode is formed is set corresponding to the width of the wiring interval, and the wiring width in the wiring group with the wider wiring interval is narrow in the wiring interval. A wiring board characterized by being narrower than the wiring width in the other wiring group.   The wiring board according to claim 1, wherein the conductor wiring belonging to the wiring group with the wider wiring interval has a wiring width at a tip portion where the protruding electrode is formed narrower than a wiring width in another region. An insulating substrate;
A plurality of conductor wirings arranged in alignment on the insulating substrate;
Provided with a protruding electrode formed by plating on each conductor wiring,
The protruding electrode is formed across the region on the insulating substrate on both sides of the conductor wiring across the longitudinal direction of the conductor wiring,
The cross-sectional shape in the width direction of the conductor wiring of the protruding electrode is a wiring board whose central portion is higher than both sides,
The plurality of conductor wirings form a plurality of wiring groups in which the wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed,
The wiring board characterized in that the area where the protruding electrode is in contact with the upper surface of the conductor wiring is larger in the wiring group with a larger wiring interval than in the wiring group with a smaller wiring interval.   4. The wiring board according to claim 3, wherein the conductor wiring is formed such that the length of the protruding electrode in the wiring direction is longer in the wiring group having the larger wiring interval than in the wiring group having the smaller wiring interval. . An insulating substrate;
A plurality of conductor wirings arranged in alignment on the insulating substrate;
Provided with a protruding electrode formed by plating on each conductor wiring,
The protruding electrode is formed across the region on the insulating substrate on both sides of the conductor wiring across the longitudinal direction of the conductor wiring,
The cross-sectional shape in the width direction of the conductor wiring of the protruding electrode is a wiring board whose central portion is higher than both sides,
The plurality of conductor wirings form a plurality of wiring groups in which the wiring intervals of the conductor wirings are different from each other in a region including a tip portion where the protruding electrodes are formed,
The wiring group having the wider wiring interval is formed by a plurality of sub wiring groups each including a plurality of the conductor wirings, and the intervals between the conductor wirings belonging to the same sub wiring group are adjacent to each other. A wiring board characterized by being narrower than an interval provided between the sub-wiring group. A step of arranging a plurality of conductor wirings on an insulating base material; and
Forming a photoresist on the surface of the insulating substrate provided with the conductor wiring;
Forming an opening in the photoresist that extends across the conductor wiring to the regions on both sides of the conductor wiring, and exposing a part of the conductor wiring in the opening;
In the method of manufacturing a wiring board, comprising a step of forming a protruding electrode by performing metal plating on the part of the exposed conductor wiring by electrolytic plating,
The conductor wiring is formed by an arrangement divided into a plurality of wiring groups having different wiring intervals in a region including a tip portion where the protruding electrode is to be formed,
The wiring width of the conductor wiring in the region where the protruding electrode is to be formed corresponds to the width of the wiring space, and the wiring width in the wiring group with the larger wiring space is set to the wiring with the narrower wiring space. A method for manufacturing a wiring board, wherein the wiring board is narrower than the wiring width in the group.   7. The method of manufacturing a wiring board according to claim 6, wherein the conductor wiring in the wiring group with the wider wiring interval is formed so that a wiring width in a region where the protruding electrode is formed is narrower than a wiring width in another region. . A step of arranging a plurality of conductor wirings on an insulating base material; and
Forming a photoresist on the surface of the insulating substrate provided with the conductor wiring;
Forming an opening in the photoresist that extends across the conductor wiring to the regions on both sides of the conductor wiring, and exposing a part of the conductor wiring in the opening;
In the method of manufacturing a wiring board, comprising a step of forming a protruding electrode by performing metal plating on the part of the exposed conductor wiring by electrolytic plating,
The conductor wiring is formed by an arrangement divided into a plurality of wiring groups having different wiring intervals in a region including a tip portion where the protruding electrode is to be formed,
In the step of forming the opening in the photoresist and exposing a part of the conductor wiring, the upper surface area of each conductor wiring exposed in the opening is set as the wiring group with a larger wiring interval. A method of manufacturing a wiring board, wherein the wiring board is larger than a wiring group having a smaller wiring interval.   9. The wiring board according to claim 8, wherein the length of the opening portion of the photoresist in the wiring direction of the conductor wiring is made longer in the wiring group having a larger wiring interval than in the wiring group having a smaller wiring interval. Production method. A step of arranging a plurality of conductor wirings on an insulating base material; and
Forming a photoresist on the surface of the insulating substrate provided with the conductor wiring;
Forming an opening in the photoresist that extends across the conductor wiring to the regions on both sides of the conductor wiring, and exposing a part of the conductor wiring in the opening;
In the method of manufacturing a wiring board, comprising a step of forming a protruding electrode by performing metal plating on the part of the exposed conductor wiring by electrolytic plating,
The conductor wiring is formed by an arrangement divided into a plurality of wiring groups having different wiring intervals in a region including a tip portion where the protruding electrode is to be formed,
The wiring group having the wider wiring interval is formed by a plurality of sub wiring groups each including a plurality of the conductor wirings, and the interval between the conductor wirings belonging to the same sub wiring group is set to be adjacent to each other. A method of manufacturing a wiring board, wherein the distance is narrower than a distance provided between the sub-wiring group.

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