JP2007005729A - Resin package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin package with high air-tightness. <P>SOLUTION: A resin package comprises a resin case 111 including recesses 115 (115a-115e), a resin cover 121 including projections 123 (123a-123e), and metal terminals 131-135 formed on surfaces of the recesses 115. Each of the projections 123 is formed approximately to each of the recess 115 and has a dimension a little larger than that of the recess 115. By pressing the projections 123 into the recesses 115, a cavity 112 is sealed. Between the resin case 111 and the resin cover 121, at least the resin cover 121 is made of a resin material satisfying a compression permanent distortion Cs 23 to 80% and Shore hardness 10 to 31. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin package for incorporating an electronic component.

  Since electronic components such as surface wave filters and semiconductors are easily affected by the influence of moisture and gas, they are usually mounted in a package. As the package, a ceramic package and a resin package are known, but the resin package is superior in terms of cost and formability.

  In addition, resin packages are roughly classified into thermosetting resin types and thermoplastic resin types. In recent years, thermoplastic resin packages are becoming mainstream. The reason for this is that injection molding using a thermoplastic resin is cheaper to manufacture, and that the thermoplastic resin is a recyclable material.

  FIG. 13 is a schematic perspective view showing a conventional resin package. As shown in FIG. 13, the resin package 1 includes a resin case 11 having a cavity 12, a resin cover 21 for covering the cavity 12, and metal terminals 31 to 35 integrated with the resin case 11. The resin case 11 and the resin cover 21 are made of a resin material containing a thermoplastic resin, and the metal terminals 31 to 35 are integrated with the resin case 11 by insert injection molding.

  However, in insert injection molding, when the thermoplastic resin is cooled and solidified, the thermoplastic resin shrinks in volume, and a gap is likely to occur at the interface between the resin and the metal. That is, in the resin package 1, a gap is easily generated at the interface between the resin case 11 and the metal terminals 31 to 35. In addition, as shown in FIG. 13, when the metal terminals 31 to 35 penetrate the resin case 11 and the periphery of the metal terminals 31 to 35 is covered with resin, the resin case 11 and the metal terminals 31 to 35 are Since the area of the interface is large, gaps are more likely to occur. Thus, when insert injection molding was used, there was a problem that the airtightness of a resin package fell.

In response to this, Patent Document 1 proposes that a heat-foamable foam material is disposed between the resin case and the metal terminal, and the heat-foamable material is foamed after insert molding to fill the gap. Patent Document 2 proposes that the surface of a metal terminal is treated with a triazine thiol compound to improve the adhesion between the resin case and the metal terminal.
Japanese Patent Laid-Open No. 10-15985 (FIG. 1, paragraph number 0009, claim 1) JP 2000-52487 A (Claims 1 and 2)

  However, as disclosed in Patent Document 1, when a heating foam is disposed between the resin case and the metal, gas and moisture are easily transmitted through the heating foam, so that the hermeticity of the package is deteriorated. was there.

  Further, as in Patent Document 2, when the surface of the metal terminal is treated with a triazine thiol compound, the triazine thiol compound is hydrophilic, so moisture is easily drawn into the interface between the resin case and the metal terminal. There was a problem that the airtightness was lowered.

  The object of the present invention is to solve the above-described problems, and to provide a resin package having high airtightness.

  A resin package according to the present invention is a resin package having a structure in which a resin cover is placed on a resin case having a cavity, and has a cavity and a recess formed by removing a part of a cavity side wall that defines the cavity. A resin case, a cover main body for covering the opening of the cavity, a convex portion formed on the cover main body, having a shape approximating the shape of the concave portion, and having a size slightly larger than the size of the concave portion; And a metal terminal formed on the surface of the recess and drawn out of the resin case through the recess, and at least the resin cover of the resin case and the resin cover is compression permanent. It is made of a resin material satisfying a strain Cs of 23 to 80% and a Shore hardness of 10 to 31.

  Further, the resin package according to the present invention is characterized in that the cavity is sealed by press-fitting the convex part into the concave part and welding the cavity side wall and the cover body at the interface. .

  In the cavity, an electronic component can be mounted so as to be electrically connected to the metal terminal.

  Of the resin case and the resin cover, at least the resin cover is preferably made of a material containing a liquid crystalline thermoplastic elastomer.

  A resin package according to the present invention is a resin package having a structure in which a resin case having a cavity is covered on a resin substrate, and has a main surface, and a protrusion formed by projecting a part of the peripheral edge of the main surface. A resin substrate having a portion, a first cavity, a part of the first cavity side wall defining the first cavity is removed, and has a shape approximating the shape of the convex portion, A resin case having a recess having a dimension slightly smaller than the dimension of the protrusion, and a metal terminal formed on the surface of the protrusion and drawn out of the resin substrate through the protrusion. In the resin case, at least the resin substrate is made of a resin material satisfying compression set Cs of 23 to 80% and Shore hardness of 10 to 31.

  Further, in the resin package according to the present invention, a second cavity side wall is formed on a peripheral edge of the one main surface of the resin substrate so that a second cavity is formed in the resin substrate, and the convex portion A part of the second cavity side wall is formed to protrude.

  In the resin package according to the present invention, the convex portion is press-fitted into the concave portion, and the portion of the first cavity side wall except the concave portion and the resin substrate are welded at the interface, whereby the cavity is sealed. It is characterized by being stopped.

  In the cavity, an electronic component can be mounted so as to be electrically connected to the metal terminal.

  It is preferable that at least the resin substrate of the resin substrate and the resin case is made of a material containing a liquid crystalline thermoplastic elastomer.

  In the resin package according to the present invention, the resin case and the resin cover are provided with concave and convex fitting portions, and the size of the convex portion is slightly larger than the size of the concave portion. When the convex portion is press-fitted into the concave portion, a repulsive force acts on the interface between the concave portion and the convex portion, so that a so-called “packing” effect is generated and the adhesion is increased.

  Further, when the metal terminal is exposed at the interface between the concave portion and the convex portion, and the metal terminal is formed on the concave portion surface, the convex portion and the metal terminal are brought into pressure contact with each other. A repulsive force acts on the interface with the terminal, and the adhesion becomes high. Furthermore, the adhesion between the metal terminal and the resin case is enhanced by pressing the metal terminal.

  That is, in the resin package according to the present invention, the airtightness of the resin package can be improved by giving the shape of the resin case and the resin cover.

(Embodiment 1)
FIG. 1 is a schematic perspective view showing an example of a resin package according to the present invention. FIG. 1A shows a resin case 111, and FIG. 1B shows a resin cover 121 to be put on the resin case 111. FIG.

  As shown in FIG. 1A, the resin case 111 has a cavity 112 and has a bath-like shape. Further, by removing a part of the cavity side wall 113 that divides the cavity 112, a cavity step 114 and recesses 115 (115a to 115e) are formed.

  As shown in FIG. 1B, the resin cover 121 includes a plate-like cover main body 122 having an area sufficient to cover the opening of the cavity 112, and convex portions 123 (123a to 123a-123) formed on the cover main body 122. 123e).

  As shown in FIG. 1A, the metal terminals 131 to 135 are respectively formed on the recess 115, and are drawn out of the resin case 111 through the recess 115. The metal terminals 131 to 135 have end portions 131 a to 135 a exposed on the inner surface of the cavity 112. Each of the metal terminals 131 and 135 is a capacitor forming terminal, and forms a capacitor between the end 131a and the end 132a and between the end 134a and the end 135a. The metal terminals 132 and 134 are input / output terminals, respectively, and the end portions 132a and 134a are wire bonding bonding portions. The metal terminal 133 is a grounding terminal, and the end portion 133 a is a ground electrode formed on the bottom surface of the cavity 112.

  FIG. 2 is a schematic perspective view showing a state where the electronic component 141 is mounted in the cavity 112 of the resin case 111. As shown in FIG. 2, the electronic component 141 includes a component main body 142 and terminal electrodes 143 formed on both ends of the upper surface of the component main body 142. The terminal electrode 143 is electrically connected to the end portions 132 a and 134 a of the metal terminals 132 and 134 through the wire 144. Although not shown, a grounding electrode is formed on the back surface of the component main body 142, and the grounding electrode is electrically connected to the end portion 133 a of the metal terminal 133 via the conductive adhesive 145. Yes. Further, a space necessary for connecting the wire 144 is formed by the staircase portion 114.

  FIG. 3 is a schematic perspective view showing the resin package 101 in which the resin case 111 is covered with the resin cover 121 in a state where the electronic component 141 is mounted.

  4 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 4, a ground electrode 146 is formed on the back surface of the component main body 142 of the electronic component 141, and the ground electrode 146 is connected to the end portion 133 a of the metal terminal 133 via the conductive adhesive 145. Electrically connected.

  In the present embodiment, the convex portion 123 of the resin cover 121 has a rectangular parallelepiped shape that approximates the shape of the concave portion 115 of the resin case 111, and has a size that is slightly larger than the size of the concave portion 115. Therefore, when the convex portion 123 is press-fitted into the concave portion 115, a repulsive force can be applied to the interface between the convex portion 123 and the concave portion 115, and the convex portion 123 and the concave portion 115 can be brought into close contact with each other. In addition, a repulsive force acts on the interface between the metal terminals 131 to 135 formed on the surface of the concave portion 115 and the convex portion 123, and the adhesion between the convex portion 123 and the metal terminals 131 to 135 is also improved. Furthermore, when the convex part 123 presses the metal terminals 131 to 135, the adhesion between the resin case 111 and the metal terminals 131 to 135 is also improved.

  Here, “slightly large size” means that the convex portion 123 can be press-fitted into the concave portion 115 at a pressure of about 0.01 to 10 MPa, and the convex portion 123 is not concave even if the resin package 101 is inverted after the press-fitting. It means a dimension that does not fall out of Specifically, the width of the convex portion 123 is preferably designed to be 101 to 120% of the width of the concave portion 115. In addition, the width here means the dimension in the longitudinal direction of the resin package 101. Moreover, it is preferable that the length of the convex part 123 is designed to be 101 to 120% of the length of the concave part 115. In addition, the length here means the dimension in the height direction of the resin package 201.

  Further, “approximate” does not necessarily mean a similar shape. That is, it is not always necessary that both the width and length of the convex portion 123 are slightly larger.

  FIG. 5 is a partial side view showing a modification of the resin package 101. As shown in FIG. 5, the widths of the concave portion 115 and the convex portion 123 may gradually increase in the length direction. In this case, the convex portion 123 once fitted into the concave portion 115 is difficult to come off.

  When the convex portion 123 is press-fitted into the concave portion 115, in order to seal the cavity 112, the upper surface of the cavity side wall 113 and the main surface of the cover main body 122 (excluding the convex portion 123) need to be in contact with each other. When the length dimension of the convex portion 123 is slightly increased, it is only necessary to bring the upper surface of the cavity side wall 113 (particularly between the concave portions 115) into contact with the main surface of the cover body 122 by increasing the applied pressure. Further, a repulsive force may be applied to the interface between the upper surface of the cavity side wall 113 and the main surface of the cover main body 122 by further applying pressure. In this case, the repulsive force that acts on the interface between the upper surface of the cavity side wall 113 and the main surface of the cover main body 122 is smaller than the repulsive force that acts on the interface between the convex portion 123 and the concave portion 115.

  In the present embodiment, the cavity side wall 113 and the cover main body 122 are welded at the interface. That is, the upper surface of the cavity side wall 113 and the main surface of the cover main body 122 (excluding the convex portion 123) are welded. Since both the cavity side wall 113 and the cover main body 122 are made of resin, sufficient adhesion can be obtained by welding. When the interface between the cavity side wall and the cover main body 122 is welded, for example, it can be welded with ultrasonic frictional heat sandwiched between ultrasonic vibration plates. Further, heat welding may be performed using a heat source such as a soldering iron or a laser.

  Note that the interface between the upper surface of the cavity side wall 113 and the main surface of the cover main body 122 may disappear due to the welding. Further, when a repulsive force is applied to the interface between the upper surface of the cavity side wall 113 and the main surface of the cover main body 122, the repelling force is eliminated by welding.

  The material constituting the resin case 111 and the resin cover 121 preferably contains an injection-moldable thermoplastic resin. Examples of the thermoplastic resin that can be used include polypropylene, polyethylene, liquid crystal polymer, polyphenylene sulfide, syndiotactic polystyrene, polyethylene terephthalate, and polystyrene.

  Further, at least the resin cover 121 of the resin case 111 and the resin cover 121 is preferably made of a material containing a flexible resin or a rubber elastic resin so that the convex portion 123 can be easily pressed into the concave portion 115. Further, it is more preferable that both the resin case 111 and the resin cover 121 are made of a material containing a flexible resin or a resin having rubber elasticity.

  Specifically, at least the resin cover 121 of the resin case 111 and the resin cover 121 is made of a resin material that satisfies the compression set Cs of 23 to 80% and the Shore hardness of 10 to 31. The resin case 111 and the resin cover 121 are preferably made of a resin material that satisfies compression set Cs of 23 to 80% and Shore hardness of 10 to 31. Within this numerical range, the convex portion 123 can be easily press-fitted into the concave portion 115, and the airtightness of the package can be sufficiently enhanced.

  In addition, liquid crystalline thermoplastic elastomers are particularly preferable among flexible resins and rubber elastic resins. A general liquid crystal polymer is a liquid crystal segment having a strong cohesive force called a hard segment that is physically cross-linked, and exhibits a rigid property in a temperature range usually used (for example, −40 to 120 ° C.). In contrast, liquid crystalline thermoplastic elastomers are physically cross-linked with hard segments and soft segments with relatively low cohesive strength mixed together, and are flexible in the normal temperature range. Indicates. Further, the liquid crystalline thermoplastic elastomer has heat resistance sufficient to prevent plastic deformation even at a solder reflow temperature, and has a low gas permeability.

  Examples of the constituent material of the hard segment constituting the liquid crystalline thermoplastic elastomer include aromatic crystalline polyester and aromatic crystalline polyamide. Examples of the constituent material of the soft segment include long-chain polyols such as polyether diol and polyester diol. Examples of the polyether diol include diol poly (oxytetramethylene) glycol (PTMG) and poly (oxypropylene) glycol. Examples of the polyester diol include poly (ethylene adipate) glycol and poly (butylene-1,4 adipate) glycol.

  In the liquid crystalline thermoplastic elastomer, the ratio of the hard segment to the entire liquid crystal segment is preferably 2.5 to 20 mol%, and the ratio of the soft segment is preferably 80 to 97.5 mol%. Within this range, flexibility and gas permeability suitable for the package can be obtained.

  Further, the resin constituting the resin case 111 and the resin cover 121 may contain an inorganic filler such as glass fiber and ceramic powder, and an additive such as an antioxidant, to the extent that the airtightness of the package is not significantly impaired.

  The resin case 111 and the resin cover 121 are preferably manufactured by injection molding. Moreover, it is preferable that the resin case 111 and the metal terminals 131-135 are integrated by insert injection molding. Insert molding is preferably performed at a heat treatment temperature of 200 to 350 ° C. and a pressure of 5 to 100 MPa.

  In insert injection molding, a gap is likely to be generated at the interface between the resin and the metal. However, in the present embodiment, the metal terminals 131 to 135 are exposed in the recess 105, and therefore the metal terminals 131 to 135 and the resin case 111 are exposed. The contact area between the metal terminals 131 to 135 and the resin case 111 is less likely to form a gap during injection molding.

  As the metal constituting the metal terminals 131 to 135, for example, copper, gold, silver, phosphor bronze, or the like can be used. Further, these metals may be subjected to plating such as solder plating. In addition, as the electronic component 141, for example, a passive component such as a SAW element or an active component such as a semiconductor can be used. Further, instead of the conductive adhesive 145, solder may be used.

  In the present embodiment, the recesses 105 are formed according to the number of the metal terminals 131 to 135. For example, the cavity side walls 113 between the recesses 105 are removed to form one recess 105, which is fitted with the recess 105. It is also possible to deform the convex portion 123 so as to match.

(Embodiment 2)
FIG. 6 is a schematic perspective view showing another example of the resin package according to the present invention. FIG. 6A shows a resin substrate 251, and FIG. 6B shows a resin case 261 that should be put on the resin substrate 251.

  As shown in FIG. 6A, the resin substrate 251 has one main surface 252 and a convex portion 253 (253a to 253e) formed by protruding a part of the peripheral edge of the one main surface 252. Further, the metal terminals 231 to 235 are respectively formed on the convex portion 253 and are drawn out of the resin substrate 251 through the convex portion 253. The metal terminals 231 to 235 have end portions 231a to 235 exposed on the side opposite to the drawing direction. The function of each metal terminal is the same as in the first embodiment, and a description thereof is omitted.

  As shown in FIG. 6B, the resin case 261 has a cavity 262 and has a bath-like shape. Further, by removing a part of the cavity side wall 263 that defines the cavity 262, a wire space 264 and a recess 265 (265a to 265e) are formed. The wire space 264 is formed to secure a space for wire bonding at the end portions 131a to 135e of the metal terminals 131 to 135 when the resin case 261 is put on the resin substrate 251. It is formed one step lower than H.265. In FIG. 6B, in order to make the wire space 264 easier to see, a part of the cavity side wall 263 is crushed for convenience. In FIG. 6B, only the wire space 264 associated with the recess 265d is shown, and the other wire spaces are not shown.

  FIG. 7 is a schematic perspective view showing a resin package 201 in which a resin case 261 is covered and sealed with an electronic component mounted on the resin substrate 251. Although not shown, the electronic component is mounted in the same manner as in the first embodiment.

  8 is a cross-sectional view taken along line BB in FIG. As shown in FIG. 8, a ground electrode 246 is formed on the back surface of the component main body 242 of the electronic component 241, and the ground electrode 246 is connected to the end portion 233 a of the metal terminal 233 via the conductive adhesive 245. Electrically connected.

  In the present embodiment, the concave portion 265 of the resin case 261 has a rectangular parallelepiped shape that approximates the shape of the convex portion 253 of the resin substrate 251, and has a size slightly smaller than the size of the convex portion 253. Therefore, when the convex portion 253 is press-fitted into the concave portion 265, a repulsive force can be applied to the interface between the convex portion 253 and the concave portion 265, and the convex portion 253 and the concave portion 265 can be brought into close contact with each other. In addition, a repulsive force acts on the interface between the metal terminals 231 to 235 and the recess 265 formed on the surface of the recess 265, and the adhesion between the recess 265 and the metal terminals 231 to 235 is improved. Furthermore, when the concave portion 265 presses the metal terminals 231 to 235, the adhesion between the resin substrate 251 and the metal terminals 231 to 235 is also improved.

  Here, “slightly small size” means that the convex portion 253 can be press-fitted into the concave portion 265 at a pressure of about 0.01 to 10 MPa, and the convex portion 253 is not concave even if the resin package 201 is inverted after the press-fitting. It means a dimension that does not fall out of In other words, the dimensions of the projections 253 are “slightly larger” than the dimensions of the recesses 265. Specifically, it is preferable to design each dimension under the same conditions as in the first embodiment.

  When the convex portion 253 is press-fitted into the concave portion 265, the upper surface of the cavity side wall 263 and the one main surface 252 of the resin substrate 251 need to be in contact with each other in order to seal the cavity 262. When the length dimension of the recess 265 is slightly reduced, the upper surface of the cavity side wall 263 and the one main surface 252 of the resin substrate 251 may be brought into contact with each other by increasing the applied pressure. Further, a repulsive force may be applied to the interface between the upper surface of the cavity side wall 263 and the one main surface 252 of the resin substrate 251 by further applying pressure. In this case, the repulsive force acting on the interface between the upper surface of the cavity side wall 263 and the one main surface 252 of the resin substrate 251 is smaller than the repulsive force acting on the interface between the convex portion 253 and the concave portion 265.

  Further, at least the resin substrate 251 out of the resin substrate 251 and the resin case 261 is made of a resin material that satisfies compression set Cs of 23 to 80% and Shore hardness of 10 to 31. The resin substrate 251 and the resin case 261 are preferably made of a resin material that satisfies compression set Cs of 23 to 80% and Shore hardness of 10 to 31. Within this numerical range, the convex portion 253 can be easily press-fitted into the concave portion 265, and the hermeticity of the package can be sufficiently enhanced.

  The manufacturing method of each configuration, the material that configures each configuration, and the like are the same as those in Embodiment 1, and the description thereof is omitted.

(Embodiment 3)
FIG. 9 is a schematic perspective view showing another example of the resin package according to the present invention. FIG. 9A shows a resin substrate 351, and FIG. 9B shows a resin case 361 to be covered with the resin substrate 351.

  As shown in FIG. 9A, the resin substrate 351 has one main surface 352, and a second cavity side wall 355 that partitions the second cavity 354 is formed on the peripheral portion of the one main surface 352. . Further, the resin substrate 351 has a convex portion 353 (353a to 353e) in which a part of the second cavity side wall 355 protrudes. Further, the metal terminals 331 to 335 are formed on the convex portion 353, respectively, and are drawn out to the outside of the resin substrate 351 through the convex portion 353. The metal terminals 331 to 335 have end portions 331a to 335 exposed on the side opposite to the drawing direction. The function of each metal terminal is the same as in the first embodiment, and a description thereof is omitted.

  As shown in FIG. 9B, the resin cover 361 has a first cavity 362 and has a bath-like shape. Further, by removing a part of the first cavity side wall 363 that divides the first cavity 362, a wire space 364 and a recess 365 (365a to 365e) are formed. In FIG. 9B, in order to make the wire space 364 easy to see, a part of the first cavity side wall 363 is crushed for convenience. In FIG. 9B, only the wire space 364 associated with the recess 365d is shown, and the other wire spaces are not shown.

  FIG. 10 is a schematic perspective view showing a resin package 301 in which an electronic component is mounted on a resin substrate 351 and sealed by covering the resin substrate 351 with a resin case 361. Although not shown, the electronic component is mounted in the same manner as in the first embodiment.

  11 is a cross-sectional view taken along the line CC of FIG. As shown in FIG. 11, a ground electrode 346 is formed on the back surface of the component main body 342 of the electronic component 341, and the ground electrode 346 is connected to the end portion 333 a of the metal terminal 333 via the conductive adhesive 345. Electrically connected.

  The resin package 301 in the present embodiment has the same structure as the resin package in the second embodiment except that the resin substrate 351 has the second cavity 354. In addition, a manufacturing method of each configuration, a material that configures each configuration, and the like are the same as those in Embodiment 1 or Embodiment 2, and description thereof is omitted.

  A resin package of the type shown in Embodiment 1 was produced and airtightness was evaluated. However, in this example, the structure shown in FIG. 12 was used. As shown in FIG. 12, the resin package 401 includes a resin case 411 and a resin cover 421. The resin case 411 has a recess 415 formed by removing a part of the cavity side wall 413 of the cavity 412, and the resin cover 421 has a protrusion 422 that fits into the recess 415. The metal terminal 431 is formed on the bottom surface of the cavity 412, and is drawn out from the inside of the cavity 412 to the outside of the resin case 411 through the recess 415. The width of the metal terminal 431 is the same as the width of the recess 415.

  First, a resin material shown in Table 1 below as a material used for a resin case and a resin cover, and a copper foil patterned as a metal terminal were prepared. In addition, the resin material simple substance shown in Table 1 was used without adding an additive etc. to the resin material.

  The compression set Cs of each resin material was measured by a test method defined in JIS-K6262. The Shore hardness was measured by a test method (using a spring type D durometer) defined in JIS-K6253.

  When measuring the compression set Cs, a cylindrical shaped body having a diameter of 20 mm and a height of 10 mm made from each resin material is compressed by sandwiching the upper and lower sides with a metal plate and the metal plate is screwed. Put in the oven. The test conditions were a temperature of 70 ° C., a humidity of 25%, and 24 hours.

  Next, a metal terminal is set in a mold of an injection molding machine (manufactured by FANUC Co., Ltd.), and each pelletized resin material is injected into the mold under the conditions of an injection speed of 100 mm / s and a pressure of 20 MPa. A case was molded. In addition, using the same injection molding machine, the pelletized resin materials were poured into a mold under the conditions of an injection speed of 100 mm / s and a pressure of 20 MPa to mold a resin cover. The cylinder temperature at the time of injection molding was set to 350 ° C. for samples 1 to 4, 230 ° C. for samples 5 and 7, and 200 ° C. for samples 6 and 8. Then, a resin case and a resin cover made of the same resin material were taken as a set, and samples 1 to 8 of the resin package shown in Table 1 were obtained.

  The dimensions of the resin case were 15 mm × 10 mm × 5 mm, the dimensions of the cavity were 12 mm × 7 mm × 4 mm, the width of the recess was 4 mm, and the length was 4 mm. The dimensions of the resin cover (excluding the convex portion) were 15 mm × 10 mm × 1 mm, the width of the convex portion was 4.5 mm, and the length was 4.3 mm. Moreover, the dimension of the metal terminal was 4 mm x 10 mm x 0.1 mm.

  Next, for each sample, the convex portion of the resin cover was press-fitted into the concave portion of the resin case under the condition of 1 MPa. Further, the interface between the upper surface of the cavity side wall of the resin case and the main surface of the resin cover was heated at the same temperature as in the injection molding, and the resin case and the resin cover were thermally welded.

  A gross leak test was performed on each sample with the cavity sealed as described above in order to evaluate hermeticity. The gross leak test is a test method in which a sample is immersed in a fluorine-based solvent (trade name: Fluorinert FC-40, manufactured by Sumitomo 3M Co., Ltd.) heated to 135 ° C., and bubbles generated from the sample are confirmed. is there. The results are shown in Table 1. The gross leak test performed here is indicated as “gross leak (normal)” in Table 1.

  Furthermore, each sample in which the cavity was separately sealed was prepared, each sample was allowed to stand for 1000 hours under conditions of a temperature of 85 ° C. and a humidity of 85%, dried at room temperature for 24 hours, and then a gross leak test was performed. The results are shown in Table 1. The gross leak test performed here is indicated as “gross leak (after being left in the humidity)” in Table 1.

  As can be seen from Table 1, no bubbles were observed in any of the gross leak tests for Samples 1 to 4 satisfying compression set Cs of 23 to 80% and Shore hardness of 10 to 31. On the other hand, with respect to Samples 5 to 8, bubbles were confirmed in a normal gross leak test or a gross leak test after being left in the humidity.

It is a schematic perspective view which shows an example of the resin package which concerns on this invention. It is a schematic perspective view which shows the state by which the electronic component was mounted in the resin case shown by Fig.1 (a). FIG. 3 is a schematic cross-sectional view showing a state where a resin cover is put on the resin case shown in FIG. 2. It is sectional drawing along the AA line of FIG. It is a partial side view which shows the modification of the resin case shown by FIG. It is a schematic perspective view which shows the other example of the resin package which concerns on this invention. FIG. 7 is a schematic cross-sectional view showing a state where a resin cover is put on after mounting an electronic component on the resin case shown in FIG. 6. It is sectional drawing along the BB line of FIG. It is a schematic perspective view which shows the other example of the resin package which concerns on this invention. FIG. 10 is a schematic cross-sectional view showing a state in which a resin cover is covered after mounting an electronic component on the resin case shown in FIG. 9. It is sectional drawing along CC line of FIG. It is a schematic perspective view which shows the resin package used in the Example. It is a schematic perspective view which shows the conventional resin package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Resin package 111 Resin case 112 Cavity 113 Cavity side wall 115 Concave part 121 Resin cover 122 Cover main body 123 Convex part 131-135 Metal terminal 141 Electronic component 201 Resin package 231-235 Metal terminal 251 Resin substrate 252 One main surface 253 Convex part 261 Resin Case 262 cavity (first cavity)
263 cavity side wall (first cavity side wall)
265 Concavity 301 Resin package 331 to 335 Metal terminal 351 Resin substrate 352 One main surface 353 Convex 354 Second cavity 355 Second cavity side wall 361 Resin case 362 First cavity 363 First cavity side wall 365 Concavity

Claims (9)

A resin package having a structure in which a resin cover is placed on a resin case having a cavity,
A resin case having a cavity and having a recess formed by removing a part of the cavity side wall defining the cavity;
A resin comprising: a cover main body for covering the opening of the cavity; and a convex portion that is formed on the cover main body, has a shape that approximates the shape of the concave portion, and has a size that is slightly larger than the size of the concave portion. A cover,
A metal terminal formed on the surface of the recess and drawn out of the resin case through the recess;
With
At least the resin cover of the resin case and the resin cover is made of a resin material satisfying compression set Cs of 23 to 80% and Shore hardness of 10 to 31.   2. The resin package according to claim 1, wherein the cavity is sealed by press-fitting the convex portion into the concave portion and welding the cavity side wall and the cover body at an interface.   The resin package according to claim 2, wherein an electronic component is mounted in the cavity so as to be electrically connected to the metal terminal.   The resin package according to any one of claims 1 to 3, wherein at least the resin cover of the resin case and the resin cover is made of a material containing a liquid crystalline thermoplastic elastomer. A resin package having a structure for covering a resin case having a cavity on a resin substrate,
A resin substrate having a main surface and a convex portion formed by protruding a part of the peripheral edge of the one main surface;
The first cavity has a first cavity, a part of the first cavity side wall that defines the first cavity is removed, has a shape that approximates the shape of the convex portion, and is slightly larger than the size of the convex portion. A resin case having a recess having a small dimension;
A metal terminal formed on the surface of the convex portion and drawn out of the resin substrate through the convex portion;
With
At least the resin substrate of the resin substrate and the resin case is made of a resin material satisfying a compression set Cs of 23 to 80% and a Shore hardness of 10 to 31.   A second cavity side wall is formed on the periphery of the one main surface of the resin substrate so that a second cavity is formed in the resin substrate, and a part of the second cavity side wall protrudes from the convex portion. The resin package according to claim 5, wherein the resin package is formed.   The convex portion is press-fitted into the concave portion, and the cavity is sealed by welding a portion of the first cavity side wall excluding the concave portion and the resin substrate at an interface. The resin package according to claim 5 or 6.   8. The resin package according to claim 7, wherein an electronic component is mounted in the cavity so as to be electrically connected to the metal terminal.   The resin package according to any one of claims 5 to 8, wherein at least the resin substrate of the resin substrate and the resin case is made of a material containing a liquid crystalline thermoplastic elastomer.

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