JP2007004046A - Non-contact IC label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a label from being illicitly reused while reducing the probability that antennas are unnecessarily disconnected. <P>SOLUTION: The antennas 12 are formed on one surface of a base substrate 14 and an IC chip 11 capable of writing and reading information in a non-contact state via the antennas 12 is loaded on the base substrate 14 so as to be connected to the antennas 112 via a contact point 13. Further, the adhesive 20 is applied in a stripe form to the surface formed with the antennas 12 of the base substrate 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type IC label capable of writing and reading information in a non-contact state.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and management of the product or the like using this label is also performed.

  In information management using such a card or label, a non-contact type IC card or a non-contact type in which an IC chip capable of writing and reading information in a non-contact state on the card or label is mounted. Type IC labels are rapidly spreading due to their excellent convenience.

  7A and 7B are diagrams showing a configuration example of a general non-contact type IC label, where FIG. 7A is a diagram showing an internal structure, and FIG. 7B is a cross-sectional view taken along line AA ′ shown in FIG. .

  As shown in FIG. 7, in this configuration example, an antenna 412 made of a coiled conductive material and a contact 413 made of a conductive material are formed on one surface of a base substrate 414 made of paper or the like. An IC chip 411 capable of writing and reading information from the outside in a non-contact state via the antenna 412 is mounted, and an adhesive 420 is applied to the entire surface of the base substrate 414 where the antenna 412 is formed. The release paper 440 is detachably pasted by the adhesive 420. The contact 413 is formed at both ends of the coiled antenna 412, and the IC chip 411 is bonded onto the base substrate 414 with a conductive adhesive (not shown) so that the IC chip 411 is connected to the contact 413. Thus, a circuit including the antenna 412, the contact 413, and the IC chip 411 is formed.

  In the non-contact type IC label 401 configured as described above, the release paper 440 is peeled off and attached to an adherend such as an article with an adhesive 420, and an information writing / reading device (externally provided) ( (Not shown), a current flows to the antenna 412 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 411 via the contact 413. Information is written to the IC chip 411 from the information writing / reading device, and information written to the IC chip 411 is read by the information writing / reading device.

  Here, the non-contact type IC label 401 as described above may be used as a sealed label for the purpose of preventing counterfeiting of products. In that case, the non-contact type IC label 401 is used by being attached to an adherend such as an article. Later, it is necessary to prevent unauthorized reuse.

Therefore, a release agent was applied to a part of a region where the antenna of the base substrate is formed, and an antenna was formed by applying a conductive paste thereon, and then the antenna of the base substrate was formed. A pressure-sensitive adhesive is applied to the entire surface, whereby when the non-contact IC label is peeled off from the adherend after being attached to the adherend, the release agent among the antennas formed on the base substrate The part formed in the area where the coating is not applied is peeled off from the adherend, and the part formed in the area where the release agent is applied is peeled off from the base substrate and left on the adherend together with the adhesive. Technology has been considered (for example, see Patent Document 1). In the non-contact type IC label configured in this way, when peeled from the adherend after being attached to the adherend, the release agent is not applied among the antennas formed on the base substrate. Since the part formed in the area peels off from the adherend, and the part formed in the area where the release agent is applied peels off from the base substrate and remains on the adherend together with the adhesive, the antenna is disconnected. Thus, it can be prevented from functioning as a non-contact type IC label and illegally reused.
JP 2000-105807 A

  However, in a non-contact type IC label as described in Patent Document 1, a release agent is applied to a part of a region of the base substrate where an antenna is formed, and a conductive paste is applied thereon. When the antenna is formed by the above-described method, and part of the antenna is easily peeled from the base substrate, the antenna is peeled off from the adherend with a certain force so that the adhesive does not peel from the base substrate. May peel off from the adherend together with the base substrate, and the antenna may not be disconnected. In particular, when a pressure-sensitive adhesive having a strong cohesive force is used, the pressure-sensitive adhesive itself is difficult to break, which makes it difficult to disconnect the antenna.

  In addition, since it is necessary to apply a release agent to a part of the region of the base substrate where the antenna is formed, there is a problem that it takes cost and time.

  In addition, the adhesive force to the base substrate of the portion formed in the region where the release agent is applied in the antenna is unnecessarily weakened, so that the antenna formed in the region where the release agent is applied in the manufacturing process. There is a problem that a part of the substrate is peeled off from the base substrate and the antenna is likely to be disconnected.

  The present invention has been made in view of the problems of the conventional techniques as described above, and prevents illegal reuse while reducing the possibility of unnecessary disconnection of the antenna. An object of the present invention is to provide a non-contact type IC label that can be used.

In order to achieve the above object, the present invention provides:
An IC chip having a conductive pattern formed on one surface of the base substrate and capable of writing and reading information in a non-contact state via the conductive pattern is formed on the conductive pattern of the base substrate. In a non-contact type IC label that is mounted at a position where information can be written and read through in a non-contact state, and an adhesive layer is laminated on one surface of the base substrate.
The pressure-sensitive adhesive layer is composed of a first pressure-sensitive adhesive applied to the base substrate so as to face only a part of the conductive pattern.

  In this invention comprised as mentioned above, when it peels from a to-be-adhered body after sticking to a to-be-adhered body by the 1st adhesive provided to one surface of a base base material, it is 1st adhesion The agent is peeled from the adherend with such a force that the agent is peeled from the adherend and the base substrate is not broken. Then, the area | region where the 1st adhesive of the base base material is not provided will be separated from a to-be-adhered body, and will peel from an to-be-adhered body with the force required for that. Thereafter, again, the area of the base substrate to which the first adhesive is applied is applied with a force such that the first adhesive peels from the adherend and the base substrate does not break. It will peel off from the body.

  Thus, when it peels from a to-be-adhered body after sticking to a to-be-adhered body, the force that a 1st adhesive peels from an to-be-adhered body, and a base base material does not fracture | rupture, and a base The base substrate must be peeled from the adherend while properly using the force required to separate the first adhesive from the adherend, thereby breaking the base substrate. If it has a structure that is easy to do, there is a high possibility that the base substrate will break due to the difference between the two forces, and when the base substrate breaks, the conductive pattern breaks and becomes a non-contact type IC label. It can be disabled.

In addition, the adhesive layer is
The first adhesive;
It comprises an adhesive force different from the adhesive force of the first adhesive, and is composed of a second adhesive applied to a region of the base substrate where the first adhesive is not applied. It is characterized by that.

  When it is set as such a structure, when it peels from a to-be-adhered body after sticking to an to-be-adhered body by the 1st and 2nd adhesive provided to one surface of a base base material, it is 1st adhesion The agent is peeled from the adherend with such a force that the agent is peeled from the adherend and the base substrate is not broken. Then, the region of the base substrate to which the second pressure-sensitive adhesive is applied is peeled off from the adherend, so that the second pressure-sensitive adhesive is peeled off from the adherend, and the base group It peels from the adherend with such a force that the material does not break. Thereafter, again, the area of the base substrate to which the first adhesive is applied is applied with a force such that the first adhesive peels from the adherend and the base substrate does not break. It will peel off from the body. Here, the first pressure-sensitive adhesive and the second pressure-sensitive adhesive are different in adhesive force from each other. Therefore, the force to peel the first pressure-sensitive adhesive from the adherend and the second pressure-sensitive adhesive are attached. Therefore, when the first adhesive is peeled off from the adherend, and the base group is peeled off from the adherend after being attached to the adherend, It must be peeled off from the adherend while properly using a force that does not break the material and a force that does not break the base substrate so that the second adhesive is peeled off from the adherend, As a result, if the base substrate has a structure that is easy to break, there is a high possibility that the base substrate will break due to the difference between the two forces, and if the base substrate breaks, the conductive pattern will break. Can be prevented from functioning as a non-contact type IC label.

  The second pressure-sensitive adhesive is composed of a plurality of pressure-sensitive adhesives having different adhesive forces, and the plurality of pressure-sensitive adhesives are applied to different regions.

  As described above, in the present invention, the first adhesive applied to the base substrate so that the adhesive layer laminated on one surface of the base substrate faces only a part of the conductive pattern. Therefore, when peeled off from the adherend after being attached to the adherend, the first adhesive is peeled off from the adherend and the base substrate does not break. And the area of the base substrate to which the first adhesive is not applied must be peeled off from the adherend while properly using the force necessary to separate it from the adherend. If the material has a structure that is easy to break, there is a high possibility that the base substrate will break due to the difference between the two forces, and if the base substrate breaks, the conductive pattern will break and the non-contact type Can be disabled as an IC label .

  In addition, the first pressure-sensitive adhesive applied to the base substrate so that the pressure-sensitive adhesive layer laminated on one side of the base substrate faces only a part of the conductive pattern, and the first pressure-sensitive adhesive In what consists of the 2nd adhesive provided to the area | region where the 1st adhesive of the base substrate is not provided, and having an adhesive strength different from the adhesive strength, it is affixed to the adherend. In the case of peeling from the adherend after being attached, the second pressure-sensitive adhesive is removed from the adherend with a force so that the first pressure-sensitive adhesive peels from the adherend and the base substrate does not break. It must be peeled off from the adherend while properly using a force that does not break the base substrate so that it can be peeled off. The base material is more likely to break due to the difference between the two forces. If the wood is broken, it can be conductive pattern is not allowed to function as a non-contact type IC label disconnected.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a view showing a first embodiment of a non-contact type IC label of the present invention, (a) is a view showing a structure of a sticking surface to an adherend, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 1, a coiled antenna 12 and a contact 13 serving as a conductive pattern are formed on one surface of a base substrate 14 made of paper, and from the outside via the antenna 12. The IC chip 11 capable of writing and reading information in a non-contact state is mounted, and the first adhesive 20 is applied in a striped manner to the surface of the base substrate 14 on which the antenna 12 is formed. Thus, the pressure-sensitive adhesive layer is laminated, and the release paper 40 is detachably attached to the surface of the pressure-sensitive adhesive 20 opposite to the base substrate 14. Thus, the adhesive 20 is applied on the base substrate 14 so as to face only a part of the antenna 12 and the contact 13. The conductive pattern is formed by the antenna 12 and the contact 13, and the contact 13 is formed at both ends of the coiled antenna 12, and a conductive adhesive (not shown) is connected to the contact 13. ), The IC chip 11 is adhered onto the base substrate 14, thereby forming a circuit including the antenna 12, the contact 13, and the IC chip 11. That is, the IC chip 11 is mounted at a position where information can be written and read out in a non-contact state via the antenna 12 and the contact 13 of the base substrate 14. The pressure-sensitive adhesive 20 is applied to the base substrate 14 by applying it on the base substrate 14 or attaching a double-sided tape to the base substrate 14.

  In the non-contact type IC label 1 configured as described above, the release paper 40 is peeled off and attached to an adherend such as an article by the adhesive 20, and an information writing / reading device (externally provided) ( (Not shown) causes a current to flow through the antenna 12 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 11 via the contact 13, so that in a non-contact state, Information is written to the IC chip 11 from the information writing / reading device, and information written to the IC chip 11 is read by the information writing / reading device.

  Below, an effect | action when the non-contact type IC label 1 mentioned above is peeled from the state affixed on adherends, such as articles | goods, is demonstrated.

  FIG. 2 is a diagram illustrating a state where the non-contact type IC label 1 illustrated in FIG. 1 is peeled off from a state where the non-contact type IC label 1 is attached to an article or the like. FIG. FIG. 4B is a diagram illustrating a state immediately before the non-contact type IC label 1 is broken, and FIGS. 5C and 5D are diagrams illustrating a state in which the non-contact type IC label 1 is broken.

  In order to peel off the non-contact type IC label 1 attached to the article 50 from the article 50, when the interface between the non-contact type IC label 1 and the article 50 is peeled, first, the adhesive 20 is attached to the base substrate 14. In this state, the non-contact type IC label 1 is peeled off from the article 50 (FIG. 2 (a)). At this time, the non-contact type IC label 1 is peeled from the article 50 with such a force that the adhesive 20 is peeled from the article 50 and the base substrate 14 is not broken.

  Then, the area | region where the adhesive 20 of the base base material 14 is not provided leaves | separates from the article | item 50 next. At this time, the non-contact type IC label 1 is pulled in a direction away from the article 50 with a force necessary to separate the area of the base substrate 14 to which the adhesive 20 is not applied from the article 50 ( FIG. 2 (b)).

  Thereafter, the region of the base substrate 14 to which the adhesive 20 is applied is peeled off from the article 50. At this time, the force for peeling the non-contact type IC label 1 from the article 50 is applied to the base 50. The adhesive 20 is peeled from the article 50 and the base substrate 14 does not break from the force necessary to separate the area where the adhesive 20 of the substrate 14 is not applied from the article 50. Unless the force is changed, when the non-contact type IC label 1 is to be peeled off from the article 50, the base substrate 14 is broken, and the antenna 12 formed on the base substrate 14 is also disconnected. (FIGS. 2C and 2D). In this state, since the antenna 12 for writing and reading information in a non-contact state with respect to the IC chip 11 is disconnected, it becomes impossible to write and read information to and from the IC chip 11. . Further, since the base substrate 14 is broken, the non-contact type IC label 1 cannot be attached to the article 50 again.

(Second Embodiment)
FIG. 3 is a view showing a second embodiment of the non-contact type IC label of the present invention, wherein (a) is a view showing a structure of a sticking surface to an adherend, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 3, a coiled antenna 112 and a contact 113 serving as a conductive pattern are formed on one surface of a base substrate 114 made of paper, and from the outside via the antenna 112. The IC chip 111 capable of writing and reading the information in a non-contact state is mounted, and the first adhesive 120a is applied in a stripe pattern on the surface of the base substrate 114 where the antenna 112 is formed. In addition, the adhesive layer is laminated by applying the second adhesive 120b to the entire surface of the region where the adhesive 120a is not applied, and the adhesive 120a, 120b has a surface opposite to the base substrate 114. Is configured such that the release paper 140 is detachably attached. Thus, the adhesives 120a and 120b are applied on the base substrate 114 so as to face only a part of the antenna 112 and the contact 113, respectively. The conductive pattern is formed by the antenna 112 and the contact 113, and the contact 113 is formed at both ends of the coiled antenna 112. A conductive adhesive (not shown) is connected to the contact 113 so that the IC chip 111 is connected. The IC chip 111 is adhered onto the base substrate 114 by the above-described method, whereby a circuit including the antenna 112, the contact 113, and the IC chip 111 is formed. That is, the IC chip 111 is mounted at a position where information can be written and read out in a non-contact state via the antenna 112 and the contact 113 of the base substrate 114. Further, the adhesives 120a and 120b have different adhesive strengths, and the adhesive strength of the adhesive 120a is stronger than the adhesive strength of the adhesive 120b. In addition, the adhesives 120a and 120b are applied to the base substrate 114 by being applied onto the base substrate 114 or by attaching a double-sided tape to the base substrate 114.

  In the non-contact type IC label 101 configured as described above, the release paper 140 is peeled off and attached to an adherend such as an article by the adhesives 120a and 120b, and information writing / reading provided outside is provided. By bringing the device close to the device (not shown), a current flows to the antenna 112 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 111 via the contact 113, thereby being in a non-contact state. The information writing / reading device writes information to the IC chip 111, or the information written to the IC chip 111 is read by the information writing / reading device.

  Below, the effect | action in case it peels from the state which the non-contact-type IC label 101 mentioned above was affixed on adherends, such as an article | item, is demonstrated.

  FIG. 4 is a diagram showing a state where the non-contact type IC label 101 shown in FIG. 3 is peeled off from a state where the non-contact type IC label 101 is affixed to an article or the like, and (a) shows that the non-contact type IC label 101 starts to be peeled off. FIG. 4B is a diagram illustrating a state immediately before the non-contact type IC label 101 is broken, and FIGS. 5C and 5D are diagrams illustrating a state in which the non-contact type IC label 101 is broken.

  In order to peel off the non-contact type IC label 101 attached to the article 150 from the article 150, when the interface between the non-contact type IC label 101 and the article 150 is peeled off, first, the adhesive 120a is attached to the base substrate 114. In this state, the non-contact type IC label 101 is peeled off from the article 150 (FIG. 4A). At this time, the non-contact type IC label 101 is peeled from the article 150 with such a force that the adhesive 120a is peeled from the article 150 and the base substrate 114 is not broken.

  Then, the area | region to which the adhesive 120b of the base base material 114 was provided is peeled from the articles | goods 150 next. At this time, the non-contact type IC label 101 is peeled from the article 150 with such a force that the adhesive 120b is peeled off from the article 150 and the base substrate 114 is not broken (FIG. 4B). )).

  Thereafter, the region of the base substrate 114 to which the adhesive 120a is applied is peeled off from the article 150. At this time, the adhesives 120a and 120b have different adhesive forces from each other. The force for peeling the adhesive 120a from the article 150 and the force for peeling the adhesive 120b from the article 150 are different from each other. Therefore, the force for peeling the non-contact type IC label 101 from the article 150 is changed to the pressure-sensitive adhesive. The force is changed so that 120b is peeled off from the article 150 and the base substrate 114 is not broken, and the force is changed so that the adhesive 120a is peeled off from the article 150 and the base substrate 114 is not broken. Otherwise, when the non-contact type IC label 101 is to be peeled off from the article 150, the base substrate 114 breaks, Antenna 112 formed on the over scan substrate 114 is to be disconnected (Fig. 4 (c), (d)). In this state, the antenna 112 for performing writing and reading of information in a non-contact state with respect to the IC chip 111 is disconnected, so that writing and reading of information with respect to the IC chip 111 is impossible. . Further, since the base substrate 114 is broken, the non-contact type IC label 101 cannot be attached to the article 150 again.

(Third embodiment)
FIGS. 5A and 5B are diagrams showing a third embodiment of the non-contact type IC label of the present invention, wherein FIG. 5A is a diagram showing a structure of a sticking surface to an adherend, and FIG. It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 5, a coiled antenna 212 and a contact point 213 to be a conductive pattern are formed on one surface of a base substrate 214 made of paper, and from the outside through the antenna 212. The IC chip 211 capable of writing and reading the information in a non-contact state is mounted, and the first adhesive 220a is applied in a stripe pattern on the surface of the base substrate 214 on which the antenna 212 is formed. In addition, the adhesive layer is laminated by applying the second adhesive 220b to a part of the region where the adhesive 220a is not applied, and the surface of the adhesive 220a, 220b opposite to the base substrate 214 is laminated. The release paper 240 is configured to be peeled and pasted. As a result, the adhesives 220a and 220b are respectively applied on the base substrate 214 so as to face only part of the antenna 212 and the contact 213, and the antenna 212 of the base substrate 214 is formed. On the applied surface, there is a region to which neither of the adhesives 220a and 220b is applied between the region to which the adhesive 220a is applied and the region to which the adhesive 220b is applied. Note that a conductive pattern is formed by the antenna 212 and the contact 213, the contact 213 is formed at both ends of the coiled antenna 212, and a conductive adhesive (not shown) is connected to the contact 213 so that the IC chip 211 is connected. ), The IC chip 211 is adhered onto the base substrate 214, whereby a circuit including the antenna 212, the contact 213, and the IC chip 211 is formed. That is, the IC chip 211 is mounted at a position where information can be written and read out in a non-contact state via the antenna 212 and the contact 213 of the base substrate 214. Further, the adhesives 220a and 220b have different adhesive strengths, and the adhesive strength of the adhesive 220a is stronger than the adhesive strength of the adhesive 220b. In addition, the adhesives 220a and 220b are applied to the base substrate 214 by being applied on the base substrate 214 or by sticking a double-sided tape to the base substrate 214.

  In the non-contact type IC label 201 configured as described above, the release paper 240 is peeled off and attached to an adherend such as an article by the adhesives 220a and 220b, and information writing / reading provided outside is provided. By bringing the device close to the device (not shown), a current flows through the antenna 212 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 2111 via the contact 213, thereby causing a non-contact state. The information writing / reading device writes information to the IC chip 211, or the information written to the IC chip 211 is read by the information writing / reading device.

  Also in the non-contact type IC label 201 described above, when the non-contact type IC label 201 is peeled off from the adherend after being attached to the adherend such as an article, the pressure-sensitive adhesive is used to peel off the non-contact type IC label 201 from the adherend. When the non-contact type IC label 201 is to be peeled off from the adherend unless it is appropriately changed in the region to which 220a is applied, the region to which the adhesive 220b is applied, and the region to which the adhesives 220a and 220b are not applied. In addition, the base substrate 214 is broken and, at the same time, the antenna 212 formed on the base substrate 214 is disconnected, whereby unauthorized use can be prevented.

  In the second and third embodiments described above, the first adhesive 120a, 220a has been described as an example when the adhesive strength of the first adhesive 120a, 220a is stronger than the second adhesive 120b, 220b, As long as the adhesive strength of the first adhesives 120a and 220a and the adhesive strength of the second adhesives 120b and 220b are different from each other, the strength thereof may be opposite to that described above. That is, it is conceivable that the adhesive applied to the end portions of the base substrates 114 and 214 has a weaker adhesive force.

  Moreover, in 2nd and 3rd embodiment mentioned above, although two types of adhesives from which adhesive force mutually differs are used, the some adhesive from which adhesives mutually differ is used as 2nd adhesive. It is also conceivable to apply these to different regions of the base substrate and thereby apply three or more types of adhesives having different adhesive forces to the base substrate.

(Fourth embodiment)
6A and 6B are diagrams showing a fourth embodiment of the non-contact type IC label of the present invention, in which FIG. 6A is a diagram showing a structure of a sticking surface to an adherend, and FIG. It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 6, a booster antenna 315 that is a coiled conductive pattern is formed on one surface of a base substrate 314 made of paper, and an antenna 312 is provided. And an IC chip 311 that performs writing and reading of information from the outside in a non-contact state via the booster antenna 315, and further, a first adhesive is provided on the surface of the base substrate 314 on which the booster antenna 315 is formed. The adhesive layer is laminated by applying 320 in a striped pattern, and a release paper 340 is detachably attached to the surface of the adhesive 320 opposite to the base substrate 314. Thereby, the adhesive 320 is provided on the base substrate 314 so as to face only a part of the booster antenna 315. Further, the adhesive 320 is applied to the base substrate 314 by applying the adhesive 320 on the base substrate 314 or attaching a double-sided tape to the base substrate 314.

  In the non-contact type IC label 301 configured as described above, the release paper 340 is peeled off and attached to an adherend such as an article with an adhesive 320, and an information writing / reading device (externally provided) ( (Not shown), electromagnetic induction occurs between the antenna 312 provided on the IC chip 311 and the antenna on the information writing / reading device side, so that the information written in the IC chip 311 is Information is read by the information writing / reading device in a non-contact state, or information is written to the IC chip 311 from the information writing / reading device in a non-contact state. Here, the sharpness Q indicating the ease of reception in the IC chip 311 is determined by the inductance, capacitance, and resistance component of the antenna 312. Therefore, for example, when the conductor diameter of the antenna 312 is increased, the sharpness Q is increased, thereby extending the communicable distance of the IC chip 311. In this embodiment, since the booster antenna 315 is formed on the base substrate 314, the booster antenna 315 and the antenna 312 are electromagnetically coupled, thereby increasing the apparent conductor diameter of the antenna 312 and sharpening it. Degree Q increases. Therefore, in this embodiment, since the IC chip 311 is mounted at a position where information can be written and read out in a non-contact state via the booster antenna 315 of the base substrate 314, the antenna 312 and the booster are mounted. Information is written and read through the antenna 315.

  Also in the non-contact type IC label 301 described above, when the non-contact type IC label 301 is peeled off from the adherend after being attached to the adherend such as an article, the pressure-sensitive adhesive is used to peel off the non-contact type IC label 301 from the adherend. If the area where 320 is applied and the area where the adhesive 320 is not applied are appropriately changed, when the non-contact type IC label 301 is to be peeled off from the adherend, the base substrate 314 is broken, At the same time, the booster antenna 315 formed on the base substrate 314 is disconnected. When the booster antenna 315 is disconnected, the communication distance changes greatly, and unauthorized use can be prevented.

  In the above-described four embodiments, the base substrate made of paper has been described as an example. However, any material other than paper can be applied as long as it is easily broken. Moreover, even if it consists of material which is hard to fracture | rupture, such as a film, it can be used as a base substrate by setting it as the structure which is easy to fracture | rupture by inserting a slit.

  Further, in the above-described four embodiments, an electromagnetic current in which information is written to and read from an IC chip when current flows through a coil-shaped antenna or a booster antenna formed on a base substrate by electromagnetic induction. Although an inductive contactless IC label has been described as an example, the present invention is an electrostatic that has two antennas formed on a base substrate so as to face each other with a predetermined interval. The present invention can be applied to any non-contact type IC label such as a coupled non-contact type IC label that cannot be written to or read from the IC chip when the antenna or contact is disconnected or has a significantly different communication distance.

  Further, in the above-described four embodiments, the adhesive is applied to the surface on which the base substrate antenna or booster antenna is formed, but what is the surface on which the base substrate antenna or booster antenna is formed? It is also conceivable that a pressure-sensitive adhesive is applied to the opposite surface in the same manner as described above, and the adhesive is attached to the article with this pressure-sensitive adhesive.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a) It is -A 'sectional drawing. It is a figure which shows the state in case the non-contact type IC label shown in FIG. 1 is peeled off from the state affixed on articles | goods etc., (a) is a figure which shows the state in which the non-contact type IC label began to peel, (b) is a diagram showing a state immediately before the non-contact type IC label is broken, and (c) and (d) are diagrams showing a state in which the non-contact type IC label is broken. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a). It is -A 'sectional drawing. FIG. 4 is a view showing a state where the non-contact type IC label shown in FIG. 3 is peeled off from a state where the non-contact type IC label is affixed to an article or the like, and (a) is a view showing a state where the non-contact type IC label has been peeled off; (b) is a diagram showing a state immediately before the non-contact type IC label is broken, and (c) and (d) are diagrams showing a state in which the non-contact type IC label is broken. It is a figure which shows 3rd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a). It is -A 'sectional drawing. It is a figure which shows 4th Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a). It is -A 'sectional drawing. It is a figure which shows one structural example of a common non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

1, 101, 201, 301 Non-contact type IC label 11, 111, 211, 311 IC chip 12, 112, 212, 312 Antenna 13, 113, 213, 313 Contact 14, 114, 214, 314 Base substrate 20, 120a , 120b, 220a, 220b, 320 Adhesive 40, 140, 240, 340 Release paper 50, 150 Article 315 Booster antenna

Claims (3)

An IC chip having a conductive pattern formed on one surface of the base substrate and capable of writing and reading information in a non-contact state via the conductive pattern is formed on the conductive pattern of the base substrate. In a non-contact type IC label that is mounted at a position where information can be written and read through in a non-contact state, and an adhesive layer is laminated on one surface of the base substrate.
The non-contact type IC label, wherein the pressure-sensitive adhesive layer is composed of a first pressure-sensitive adhesive applied to the base substrate so as to face a part of the conductive pattern. The non-contact type IC label according to claim 1,
The adhesive layer is
The first adhesive;
It comprises an adhesive force different from the adhesive force of the first adhesive, and is composed of a second adhesive applied to a region of the base substrate where the first adhesive is not applied. A non-contact type IC label characterized by the above. The non-contact type IC label according to claim 2,
The non-contact type IC label, wherein the second pressure-sensitive adhesive comprises a plurality of pressure-sensitive adhesives having different adhesive forces, and the plurality of pressure-sensitive adhesives are applied to different regions.

Images