JP2007096065A - Method and device for removing anisotropic conductive material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for removing an anisotropic conductive material that can easily and securely remove a residue of the anisotropic conductive material in a short time without using an organic solvent. <P>SOLUTION: The device for removing the anisotropic conductive material 1 includes a removing member 4 made of fiber which can be soaked in liquid in a cloth state, a nozzle 8 which supplies water-based liquid L to the removing member 4 to damp the removing member 4 with the liquid, and a heating tool 7 which is made to abut against the end of the residue 3 across the removing member 4 in the damped state to heat it. In the method for removing the anisotropic conductive material, the removing member 4 formed of the fiber in the cloth state is soaked in the water-based liquid L, and the removing member 4 in the damped state is made to abut against the end of the residue 3 across the heating tool 7 which is heated to peel the residue 4 off a circuit board 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention removes the residue of the anisotropic conductive material remaining on the circuit board after removing the electronic component when repairing the mounting board in which the electronic part is connected to the circuit board via the anisotropic conductive material. The present invention relates to an anisotropic conductive material removing method and an anisotropic conductive material removing apparatus suitable for the above.

  2. Description of the Related Art Conventionally, a technique for performing electrical connection between electronic components using an anisotropic conductive material is known. For example, mounting of a chip component that connects an electrode of a circuit board and an electrode of a chip component made into a chip such as a semiconductor, LED, resistor, capacitor, etc. An anisotropic conductive material is used for effective connection.

  Specifically, COG (Chip On Glass) mounting for directly connecting a chip component such as a semiconductor chip (drive driver) to a panel as a circuit board in various optical panels such as a liquid crystal panel, an EL panel, and a plasma panel, Electrical connection between a connection terminal as an electrode of the circuit board and a connection terminal as an electrode of a flexible wiring board as various circuit boards such as TCP (Tape Carrier Package), FPC (Flexible Printed Circuit), and COF (Cip On Film) For example, anisotropic conductive materials are often used. Also in flexible wiring boards such as COF, anisotropic conductive materials are frequently used when chip components are mounted on a circuit board.

  An anisotropic conductive film (ACF: Anisotropic Conductive Film) is generally used as the anisotropic conductive material, and an anisotropic conductive paste is used as required for the design concept. Such an anisotropic conductive material is composed of an adhesive having insulating properties and conductive particles, and examples of the adhesive include a thermosetting resin and an ultraviolet curable resin. Examples of the conductive particles used for the anisotropic conductive material include metal particles such as nickel and copper, or particles obtained by coating a resin bead with a metal such as nickel and gold. In the anisotropic conductive material, conductive particles are dispersed in an insulating adhesive, conductive in the thickness direction (connection direction), and insulative in the surface direction (horizontal direction). The connection by the anisotropic conductive material is basically thermocompression bonding, in which the conductive particles share the function of electrical connection, and the adhesive functions to maintain the pressure contact state.

  By the way, when a display defect occurs in an optical panel or the like after the chip component or the flexible wiring board is connected to the optical panel, it is necessary to replace (repair) the chip component or the flexible wiring board. In this repair, after removing the chip component and the flexible wiring board from the optical panel and remaining on the optical panel, the cured anisotropic conductive material is removed, and a new anisotropic conductive material is used again. Chip components and flexible wiring boards are mounted.

  The removal of the anisotropic conductive material that removes the residue of the anisotropic conductive material at the time of repair is performed by, for example, applying an organic solvent to the residue to swell and soften the residue, and then softening. The residue is scraped off with a cotton swab or spatula (see, for example, Patent Document 1).

JP-A-10-153789

  However, in the conventional anisotropic conductive material removal method, it takes time to swell the residue of the anisotropic conductive material with the organic solvent, and when the time is short, the swelling becomes insufficient, and when the time is long, the organic solvent is volatilized. Then, there is a problem that it is difficult to manage the time required for the residue to swell.

  In addition, when the removal operation is performed in a state where the swelling of the residue is insufficient, there is a problem that there is a high risk of damaging other members, for example, connection terminals formed on the circuit board.

  In addition, there is a problem that the organic solvent spreads outside the repair portion and adheres to, for example, a polarizing film in a liquid crystal panel, a semiconductor chip, an anisotropic conductive material other than the repair portion, and the like.

  Furthermore, the use of organic solvents necessitates management of waste liquid treatment so as not to cause environmental pollution.

  Therefore, there is a need for an anisotropic conductive material removal method and an anisotropic conductive material removal apparatus that can remove the residue of an anisotropic conductive material easily and reliably in a short time without using an organic solvent. Yes.

  The present invention has been made in view of the above points, and an anisotropic conductive material capable of easily and reliably removing a residue of an anisotropic conductive material in a short time without using an organic solvent. An object of the present invention is to provide a removal method and an anisotropic conductive material removal apparatus.

  In order to achieve the above-described object, the anisotropic conductive material removing method according to the present invention is characterized in that the electronic component is repaired when the mounting substrate in which the electronic component is connected to the circuit board via the anisotropic conductive material. In the anisotropic conductive material removing method of removing the anisotropic conductive material remaining on the circuit board, and then immersing the aqueous liquid in the removal member formed in a cloth shape with fibers, the infiltration state The removal member is brought into contact with an end portion of the residue via a heated heating jig to peel the residue from the circuit board.

  Here, the aqueous liquid means water alone or a mixed solution of water and a surfactant (the main solvent is water, preferably 90% or more is water).

  Moreover, as a kind of surfactant to mix, although cationic type, anionic type, and nonionic type | system | group can be employ | adopted, in order to reduce the influence on other members, a nonionic type surfactant is preferable.

  In the anisotropic conductive material removing method of the present invention, it is preferable that the removing member is formed in an elongated shape that can travel.

  In addition, the anisotropic conductive material removing apparatus according to the present invention is characterized in that the electronic component is removed at the time of repair of the mounting board in which the electronic component is connected to the circuit board via the anisotropic conductive material, and then the circuit In an anisotropic conductive material removing apparatus for removing a residue of anisotropic conductive material remaining on a substrate, a removal member formed in a cloth shape with fibers capable of dipping liquid, and the removal member infiltrated with liquid A nozzle for supplying an aqueous liquid to the removal member to obtain a state, and a heatable heating jig that comes into contact with the end of the residue via the removal member in the infiltrated state It is in.

  In the anisotropic conductive material removing apparatus of the present invention, it is preferable that the removing member is formed in a long shape that can travel.

  According to the anisotropic conductive material removing method and the anisotropic conductive material removing apparatus according to the present invention, the anisotropic conductive material residue from the circuit board can be easily and reliably removed in a short time without using an organic solvent. There are extremely excellent effects such as removal. Moreover, according to the anisotropic conductive material removal apparatus of this invention, there exists an outstanding effect that the anisotropic conductive material removal method which concerns on this invention can be implemented reliably and easily.

  The present invention will be described below with reference to embodiments shown in the drawings.

  FIG. 1 is a schematic view showing a main part in a removed state of an embodiment of an anisotropic conductive material removing apparatus used in an anisotropic conductive material removing method according to the present invention.

  As shown in FIG. 1, the anisotropic conductive material removing apparatus 1 according to the present embodiment includes a removing member 4 disposed above a residue 3 of anisotropic conductive material remaining on a circuit board 2. Yes. The removing member 4 is formed in a cloth shape with fibers that can be dipped in liquid, for example, polyester fibers. The removal member 4 is formed in a long shape and is wound between a pair of rotatable reels 5 and 6. One of the reels 5 and 6 shown on the right side in FIG. 1 is a delivery reel 5 that feeds out the removing member 4, and the other one shown on the left side in FIG. 1 is a take-up reel 6 that winds up the removing member 4. Further, in the removed state shown in FIG. 1, each reel 5 and 6 has a predetermined mechanism by a traveling mechanism (not shown) driven based on a control command from a control unit having a CPU, a memory and the like for controlling the operation of each unit. As shown by the arrow A, the removal member 4 is formed to be able to travel from the delivery reel 5 toward the take-up reel 6 at a timing and at a predetermined speed.

  A heating jig 7 is disposed above the travel path of the removal member 4. The heating jig 7 is arranged such that a tip 7 a that can be heated to about 200 ° C. faces the traveling path of the removal member 4 from above. Further, the heating jig 7 is formed so as to be movable in the vertical and horizontal directions by a robot or moving means (not shown). In the removed state shown in FIG. It is configured to abut against the end of the residue 3 via the removing member 4 and then to move horizontally to the left as indicated by an arrow B in FIG.

  In addition, what is necessary is just to set the heating temperature of the front-end | tip part 7a of the heating jig 7 according to a composition, a characteristic, etc. of an anisotropic electrically-conductive material.

  A nozzle 8 is disposed on the upstream side of the travel path of the removal member 4 relative to the position where the heating jig 7 is disposed, that is, on the delivery reel 5 side, with the tip thereof facing the removal member 4. The nozzle 8 is supplied with pure water L as an aqueous liquid, and a portion with which the tip 7a of the heating jig 7 of the removing member 4 is brought into contact based on a control command from the control unit. It is formed so that pure water L can be injected and supplied to the upstream side in the vicinity of.

  Next, the operation of the present embodiment having the above-described configuration will be described together with the anisotropic conductive material removing method of the present embodiment.

  The anisotropic conductive material removal method of this embodiment is implemented using the anisotropic conductive material removal apparatus 1 of this embodiment mentioned above.

  That is, the anisotropic conductive material removing method of this embodiment starts by placing the circuit board 2 with the residue 3 facing upward on a table (not shown) and fixing the lower surface of the circuit board 2.

  When the anisotropic conductive material removing method of the present embodiment is started, pure water L is sprayed from the nozzle 8 onto the removing member 4 to bring the removing member 4 into an infiltrated state.

  Next, the heating jig 7 whose tip 7a is heated to about 200 ° C. is lowered or moved in the direction of arrow B after being lowered, so that the wet removal member 4 is heated to the heated tip of the heating jig 7. It abuts against the end of the residue 3 via the part 7a.

  At this time, the heated pure water (moisture) is converted into water vapor and absorbed by the residue 3 from the contact portion, and penetrates into the connection interface between the residue 3 and the circuit board 2 to hydrolyze the connection interface. I guess it will destroy. In addition, the water absorbed in the residue 3 does not escape from the residue 3 unlike the organic solvent, and as a result, peeling of the connection interface can be generated in a shorter time than when the organic solvent is used. . Furthermore, since the water absorbed in the residue 3 does not escape from the residue 3, unlike the conventional configuration using an organic solvent, the water absorption time of the residue 3 may be managed, so that the time management is easy. It can be carried out. Furthermore, since the residue 3 can be removed locally according to the size of the tip 7a of the heating jig 7 by using the heating jig 7, there is an influence of heat on portions other than the repair portion. Can be prevented. Further, by using pure water L, waste liquid treatment and safety and health management for workers can be easily performed.

  Next, when the heating jig 7 is moved in the direction of arrow B, moisture is sequentially supplied to the connection interface between the residue 3 and the circuit board 2, and in the movement direction of the heating jig 7 as the heating jig 7 moves. The residue 3 is peeled off from the circuit board 2 along the line.

  At this time, the moisture present at the connection interface becomes a lubricating film when the residue 3 is peeled off from the circuit board 2 by the tip 7a of the heating jig 7, so that the residue 3 can be easily separated from the connection interface. It can be carried out.

  Further, when the heating jig 7 is moved in the direction of arrow B, the removal member 4 is interposed as a cushioning material between the tip 7a of the heating jig 7 and the circuit board 2, so that the surface of the circuit board 2, It is possible to prevent damage to terminals provided on the circuit board 2.

  Further, when the heating jig 7 is moved in the arrow B direction, the removal member 4 is wound up at a speed higher than the moving speed of the heating jig 7, so that the removed residue 3 is bitten into the weave of the removal member 4. Can be attached. As a result, the residue 3 can be attached to the removal member 4 and collected, so that the residue 3 peeled off from the circuit board 2 can be prevented from scattering around and being reattached to the circuit board 2. .

  Next, when the tip 7 a of the heating jig 7 exceeds the residue 3, the heating jig 7 is moved, the pure water L ejected from the nozzle 8 is supplied to the removing member 4, and the removing member 4 travels. It stops and the removal of the residue 3 from the circuit board 2 is completed.

  Next, when the removal of the residue 3 from the circuit board 2 is completed, the heating jig 7 returns to the standby position.

  If the removal of the residue 3 from the circuit board 2 is not completed in one stroke, the above stroke is repeated.

  Moreover, the anisotropic conductive material removal method of this embodiment can also be performed manually. In this case, for example, the cut-off removal member 4 is dipped in pure water L so as to be wet and placed on the circuit board 2 so as to include the end face of the residue 3, and the soldering iron is used with one hand. The heated tip 7a of the heating jig 7 is pressed against the end surface of the residue 3 through the removal member 4, and the removal member 4 is removed with the other hand as the residue 3 is peeled off from the circuit board 2. It is good to make it move to the same direction along the pressing direction of the front-end | tip part 7a of the heating jig 7. FIG.

  Thus, according to the anisotropic conductive material removing method of the present embodiment, the pure water L is immersed in the removing member 4 formed in a cloth shape with fibers, and the removing member 4 in the infiltrated state is heated by the heating jig 7. Since the residue 3 is peeled off from the circuit board 2 by coming into contact with the end of the residue 3 through the tip 7a, the difference 3 can be easily and reliably removed in a short time without using an organic solvent. The residue 3 of the isotropic conductive material can be removed.

  Further, according to the anisotropic conductive material removing method of the present embodiment, since the removal member 4 is formed in a long shape that can travel, a fresh portion of the removal member 4 is always used for removing the residue 3. be able to. As a result, the residue 3 removed from the circuit board 2 can be reliably attached and collected by the removing member 4.

  In addition, according to the anisotropic conductive material removing apparatus 1 of the present embodiment, the removal member 4 formed in a cloth shape with fibers that can be dipped in liquid and the removal member 4 are infiltrated with pure water L. A nozzle 8 for supplying pure water L to the removal member 4 and a heating jig 7 having a heatable tip 7a that comes into contact with the end of the residue 3 through the removal member 4 in the infiltrated state. Since the anisotropic conductive material removing method of the present invention, that is, after removing the electronic component at the time of repairing the mounting substrate in which the electronic component is connected to the circuit board 2 via the anisotropic conductive material, In the anisotropic conductive material removing method for removing the residual anisotropic conductive material residue 3 remaining on the circuit board 2, pure water L is immersed in a removal member 4 formed in a cloth shape with fibers to remove the infiltrated state. The member 4 is attached to the end of the residue 3 through the heated tip 7a of the heating jig 7. Anisotropic conductive material removal method peeling the residue 3 by contact from the circuit board 2 can be easily carried out in a simple process. At this time, by using a long strip that can be traveled as the removing member 4, a fresh portion of the removing member 4 can always be used for removing the residue 3. As a result, the residue 3 removed from the circuit board 2 can be reliably attached and collected by the removing member 4.

  That is, according to the anisotropic conductive material removing apparatus 1 of the present embodiment, the anisotropic conductive material removing method according to the present invention can be reliably and easily performed.

  The present invention can be used for repairing various mounting substrates in which electronic components (including other circuit components) are connected to a circuit board via an anisotropic conductive material.

  In addition, this invention is not limited to embodiment mentioned above, A various change is possible as needed. For example, a small amount of nonionic surfactant may be mixed in the water supplied to the removing member 4. By adding a surfactant, moisture easily enters the connection interface, and the anisotropic conductive material can be easily peeled off.

The schematic diagram which shows the principal part in the removal state of embodiment of the anisotropic conductive material removal apparatus used for the anisotropic conductive material removal method which concerns on this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anisotropic electrically-conductive material removal apparatus 2 Circuit board 3 (Anisotropic electrically-conductive material) residue 4 Removal member 7 Heating jig 7a Tip part 8 Nozzle L Pure water

Claims (4)

When repairing a mounting board in which an electronic component is connected to a circuit board via an anisotropic conductive material, the electronic component is removed, and then the anisotropic conductive material remaining on the circuit board is removed. In the method for removing the isotropic conductive material,
An aqueous liquid is immersed in a removal member formed in a cloth shape with fibers, and the removal member in the infiltrated state is brought into contact with an end portion of the residue via a heated heating jig, and the residue is placed in the circuit board. An anisotropic conductive material removing method, wherein the anisotropic conductive material is removed from the substrate.   The anisotropic conductive material removing method according to claim 1, wherein the removing member is formed in a long shape that can travel. When repairing a mounting board in which an electronic component is connected to a circuit board via an anisotropic conductive material, the electronic component is removed, and then the anisotropic conductive material remaining on the circuit board is removed. In the anisotropic conductive material removal device,
A removal member formed in a cloth shape with fibers capable of immersing liquid, a nozzle for supplying aqueous liquid to the removal member to make the removal member infiltrated with liquid, and the infiltration state removal member An anisotropic conductive material removing apparatus comprising a heatable heating jig that comes into contact with the end of the residue. The anisotropic conductive material removing apparatus according to claim 3, wherein the removing member is formed in a long shape capable of traveling.

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