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JP2007095629A - Terminal mounting structure and mounting method - Google Patents

Terminal mounting structure and mounting method Download PDF

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Publication number
JP2007095629A
JP2007095629A JP2005286742A JP2005286742A JP2007095629A JP 2007095629 A JP2007095629 A JP 2007095629A JP 2005286742 A JP2005286742 A JP 2005286742A JP 2005286742 A JP2005286742 A JP 2005286742A JP 2007095629 A JP2007095629 A JP 2007095629A
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terminal
substrate
piece
terminal holding
conductive
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Katsuya Suzuki
勝也 鈴木
Takahito Tashiro
貴人 田代
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Yazaki Corp
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Yazaki Corp
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Abstract

【課題】自動車用のジャンクションブロックなどの端子部品において、端子のアライメントを向上させ、基板のスルーホール部の剥離を防止し、端子と基板との導通不良を回避する。
【解決手段】端子１の端子保持片１２を基板２の端子保持孔２２に圧入する。その後、端子１の２個の導通片１３を基板２の２個の導通孔２３に挿通して回路導体２４にはんだ付けする。すると、端子保持片１２の圧入により、端子１が基板２に仮固定されるとともに、導通片１３のはんだ付けにより、端子１と基板２とが確実に導通すると同時に、端子１が基板２に本固定される。また、端子１は、基板２に３点支持されるので、１点支持や２点支持の場合と比べて基板２上に安定して自立することができる。
【選択図】図１In a terminal part such as a junction block for automobiles, alignment of the terminal is improved, peeling of a through-hole portion of the substrate is prevented, and poor conduction between the terminal and the substrate is avoided.
A terminal holding piece 12 of a terminal 1 is press-fitted into a terminal holding hole 22 of a substrate 2. Thereafter, the two conductive pieces 13 of the terminal 1 are inserted into the two conductive holes 23 of the substrate 2 and soldered to the circuit conductor 24. Then, the terminal 1 is temporarily fixed to the substrate 2 by the press-fitting of the terminal holding piece 12, and the terminal 1 and the substrate 2 are surely connected to each other by the soldering of the conductive piece 13. Fixed. In addition, since the terminal 1 is supported at three points on the substrate 2, it can stand on the substrate 2 more stably than in the case of one-point support or two-point support.
[Selection] Figure 1

Description

本発明は、特に自動車用のジャンクションブロック、リレーブロックなどの端子部品に適用するに好適な、端子の取付構造および取付方法に関するものである。   The present invention relates to a terminal mounting structure and a mounting method particularly suitable for application to terminal parts such as a junction block and a relay block for automobiles.

図６は従来の端子の取付方法の第１例における一工程を示す斜視図、図７は従来の端子の取付方法の第１例における次の工程を示す斜視図、図８は従来の端子の取付方法の第２例における一工程を示す斜視図、図９は従来の端子の取付方法の第２例における次の工程を示す斜視図、図１０は従来の端子の取付方法の第３例における一工程を示す斜視図、図１１は従来の端子の取付方法の第３例における次の工程を示す斜視図、図１２は図１１の縦断面図である。   6 is a perspective view showing one process in the first example of the conventional terminal mounting method, FIG. 7 is a perspective view showing the next process in the first example of the conventional terminal mounting method, and FIG. 8 is a perspective view of the conventional terminal. FIG. 9 is a perspective view showing the next step in the second example of the conventional terminal mounting method, and FIG. 10 is a third example of the conventional terminal mounting method. FIG. 11 is a perspective view showing one process, FIG. 11 is a perspective view showing the next process in a third example of a conventional terminal mounting method, and FIG. 12 is a longitudinal sectional view of FIG.

この種の端子部品を組み付ける際には、基板に端子を取り付ける作業が必要となる。   When assembling this type of terminal component, it is necessary to attach the terminal to the substrate.

従来、この方法としては、プレスフィットによる技術（以下、公知技術１という。）が提案されていた（例えば、特許文献１参照）。これは、図６に示すように、端子１に２個の圧入片１１を形成するとともに、基板２に２個の端子孔２１を形成しておき、図７に示すように、端子１の圧入片１１を基板２の端子孔２１に圧入することにより、圧入片１１に固定保持と導通の両機能を発揮させるものである。   Conventionally, as this method, a technique based on press-fit (hereinafter referred to as publicly known technique 1) has been proposed (see, for example, Patent Document 1). As shown in FIG. 6, two press-fitting pieces 11 are formed in the terminal 1 and two terminal holes 21 are formed in the substrate 2, and the terminal 1 is press-fitted as shown in FIG. By press-fitting the piece 11 into the terminal hole 21 of the substrate 2, the press-fitting piece 11 exhibits both functions of fixing and holding.

また、これとは別の方法として、別部品を併用する技術（以下、公知技術２という。）がいくつか提案されていた（例えば、特許文献２、３参照）。例えば、図８に示すように、端子１をクランク状に折り曲げた後、図９に示すように、この端子１を端子台３に載置し、この状態で端子１を端子台３ごと基板（図示せず）に搭載する方法がある。或いはまた、図１０〜１２に示すように、コネクタキャビティー５に複数個の端子１を貫通させて装着し、これらの端子１をコネクタキャビティー５ごと基板（図示せず）に搭載する方法もある。
特開２００５−１７４６１４号公報 特開平６−２８３２２１号公報 特開平５−１８２７３８号公報 Further, as a method different from this, several techniques (hereinafter referred to as known technique 2) using other parts in combination have been proposed (see, for example, Patent Documents 2 and 3). For example, as shown in FIG. 8, after the terminal 1 is bent into a crank shape, the terminal 1 is placed on the terminal block 3 as shown in FIG. There is a method of mounting on (not shown). Alternatively, as shown in FIGS. 10 to 12, there is a method of mounting a plurality of terminals 1 through the connector cavity 5 and mounting these terminals 1 together with the connector cavity 5 on a substrate (not shown). is there.
JP 2005-174614 A JP-A-6-283221 JP-A-5-182738

しかし、公知技術１では、端子１の圧入片１１で圧入と導通を同時に行うことから、端子１のアライメント不良や、基板２のスルーホール部の剥離、端子１と基板２との導通不良が生じやすい。   However, in the known technique 1, since the press-fitting and conduction are performed simultaneously with the press-fitting piece 11 of the terminal 1, alignment failure of the terminal 1, peeling of the through hole portion of the substrate 2, and conduction failure between the terminal 1 and the substrate 2 occur. Cheap.

また、公知技術２では、端子台３、コネクタキャビティー５などの別部品を併用するため、部品点数が増加し、製造コストが高騰する。しかも、この別部品は、はんだ（半田）付け時に適切な材料を要するため、材質が限定されることから、製造コストがますます高騰する。   Further, in the known technique 2, since other parts such as the terminal block 3 and the connector cavity 5 are used in combination, the number of parts increases and the manufacturing cost increases. In addition, since this separate part requires an appropriate material for soldering, the material is limited, so that the manufacturing cost is further increased.

本発明は、こうした不都合を解消することが可能な、端子の取付構造および取付方法を提供することを目的とする。   An object of this invention is to provide the attachment structure and attachment method of a terminal which can eliminate such inconvenience.

まず、請求項１に係る端子の取付構造の発明では、端子保持片および導通片を別個に備えた端子が基板に取り付けられた、端子の取付構造であって、前記端子保持片が前記基板の端子保持孔に圧入され、前記導通片が前記基板の導通孔に挿通されて回路導体にはんだ付けされていることを特徴とする。
また、請求項２に係る端子の取付構造の発明では、前記端子保持片および前記導通片は、一直線上に並設され、前記導通片は、前記端子保持片の両側にそれぞれ形成されていることを特徴とする。
また、請求項３に係る端子の取付構造の発明では、前記端子保持片および前記導通片は、一直線上に並設され、前記端子保持片は、前記導通片の両側にそれぞれ形成されていることを特徴とする。
また、請求項４に係る端子の取付方法の発明では、端子保持片および導通片が別個に設けられた端子を基板に取り付ける、端子の取付方法であって、前記端子保持片を前記基板の端子保持孔に圧入する端子保持工程と、前記導通片を前記基板の導通孔に挿通する導通片挿通工程と、前記導通片を前記基板の回路導体にはんだ付けする導通工程とが含まれることを特徴とする。 First, the invention of the terminal mounting structure according to claim 1 is a terminal mounting structure in which a terminal separately provided with a terminal holding piece and a conducting piece is attached to a board, wherein the terminal holding piece is provided on the board. It is press-fitted into a terminal holding hole, and the conductive piece is inserted into a conductive hole of the substrate and soldered to a circuit conductor.
Moreover, in the invention of the terminal mounting structure according to claim 2, the terminal holding piece and the conducting piece are arranged in a straight line, and the conducting piece is formed on both sides of the terminal holding piece, respectively. It is characterized by.
Moreover, in the invention of the terminal mounting structure according to claim 3, the terminal holding piece and the conducting piece are arranged in a straight line, and the terminal holding piece is formed on both sides of the conducting piece, respectively. It is characterized by.
The terminal mounting method according to claim 4 is a terminal mounting method in which a terminal provided with a terminal holding piece and a conducting piece is attached to a board, wherein the terminal holding piece is a terminal of the board. A terminal holding step of press-fitting into the holding hole; a conductive piece insertion step of inserting the conductive piece into the conductive hole of the substrate; and a conductive step of soldering the conductive piece to a circuit conductor of the substrate. And

本発明によれば、端子の端子保持片の圧入により、端子が基板に仮固定されるとともに、端子の導通片のはんだ付けにより、端子と基板とが確実に導通すると同時に、端子が基板に本固定される。   According to the present invention, the terminal is temporarily fixed to the board by press-fitting the terminal holding piece of the terminal, and the terminal and the board are reliably conducted by soldering the conductive piece of the terminal. Fixed.

その結果、端子のアライメントを向上させ、基板のスルーホール部の剥離を防止し、端子と基板との導通不良を回避することができる。また、端子台、コネクタキャビティーなどの別部品を用いる必要がないので、部品点数の増加を抑制し、製造コストを削減することができる。   As a result, the alignment of the terminals can be improved, the peeling of the through-hole portion of the substrate can be prevented, and the conduction failure between the terminal and the substrate can be avoided. Moreover, since it is not necessary to use separate parts such as a terminal block and a connector cavity, an increase in the number of parts can be suppressed and manufacturing costs can be reduced.

以下、本発明の実施形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

＜第１の実施形態＞
図１は本発明に係る端子の取付方法の第１の実施形態における一工程を示す斜視図、図２は本発明に係る端子の取付方法の第１の実施形態における次の工程を示す斜視図である。 <First Embodiment>
FIG. 1 is a perspective view showing one step in the first embodiment of the terminal mounting method according to the present invention, and FIG. 2 is a perspective view showing the next step in the first embodiment of the terminal mounting method according to the present invention. It is.

端子１は、図１に示すように、矩形平板状の端子本体１５を有しており、端子本体１５には、１個の端子保持片１２および２個の導通片１３が一直線上に交互に並設されている。ここで、端子保持片１２は端子本体１５の下部中央に下向きに突設されている。また、２個の導通片１３は、端子保持片１２の両側に位置するように端子本体１５の下部両端に下向きに突設されている。   As shown in FIG. 1, the terminal 1 has a rectangular flat terminal body 15, and one terminal holding piece 12 and two conducting pieces 13 are alternately arranged on the terminal body 15 in a straight line. It is installed side by side. Here, the terminal holding piece 12 protrudes downward at the center of the lower portion of the terminal body 15. Further, the two conductive pieces 13 are provided so as to protrude downward at both lower ends of the terminal body 15 so as to be positioned on both sides of the terminal holding piece 12.

一方、基板２は、図１に示すように、矩形平板状の基板本体２５を有している。基板本体２５には、円形の端子保持孔２２が貫通して形成されているとともに、この端子保持孔２２の両側にそれぞれ円形の導通孔２３が貫通して形成されている。ここで、１個の端子保持孔２２および２個の導通孔２３は、端子１の端子保持片１２および導通片１３に対向する形で一直線上に交互に並設されている。また、基板本体２５の下面には、回路導体２４が印刷されている。   On the other hand, the substrate 2 has a rectangular plate-like substrate body 25 as shown in FIG. A circular terminal holding hole 22 is formed through the substrate body 25, and circular conduction holes 23 are formed through both sides of the terminal holding hole 22. Here, the one terminal holding hole 22 and the two conduction holes 23 are alternately arranged in a straight line so as to face the terminal holding pieces 12 and the conduction pieces 13 of the terminal 1. A circuit conductor 24 is printed on the lower surface of the substrate body 25.

そして、基板２に端子１を取り付ける際には、次の手順による。   And when attaching the terminal 1 to the board | substrate 2, it follows the following procedure.

まず、図２に示すように、端子１の端子保持片１２を基板２の端子保持孔２２に圧入すると同時に、端子１の各導通片１３を基板の各導通孔２３に挿通する。   First, as shown in FIG. 2, the terminal holding piece 12 of the terminal 1 is press-fitted into the terminal holding hole 22 of the substrate 2, and at the same time, each conductive piece 13 of the terminal 1 is inserted into each conductive hole 23 of the substrate.

次に、端子１の各導通片１３を基板２の回路導体２４にはんだ付けする。すると、端子１が回路導体２４に導通した状態となる。   Next, each conductive piece 13 of the terminal 1 is soldered to the circuit conductor 24 of the substrate 2. Then, the terminal 1 is brought into conduction with the circuit conductor 24.

ここで、基板２への端子１の取付作業が終了する。   Here, the operation of attaching the terminal 1 to the board 2 is completed.

このように、端子１は端子保持片１２および導通片１３を別個に備えており、端子保持片１２の圧入により、端子１が基板２に仮固定されるとともに、導通片１３のはんだ付けにより、端子１と基板２とが確実に導通すると同時に、端子１が基板２に本固定される。   Thus, the terminal 1 is provided with the terminal holding piece 12 and the conducting piece 13 separately, and the terminal 1 is temporarily fixed to the substrate 2 by press-fitting the terminal holding piece 12, and the conducting piece 13 is soldered. At the same time as the terminal 1 and the substrate 2 are reliably connected, the terminal 1 is permanently fixed to the substrate 2.

その結果、公知技術１と異なり、端子１のアライメントを向上させ、基板２の導通孔２３のスルーホール部の剥離を防止し、端子１と基板２との導通不良を回避することができる。また、公知技術２と違って、端子台、コネクタキャビティーなどの別部品を用いる必要がないので、部品点数の増加を抑制し、製造コストを削減することができる。   As a result, unlike the known technique 1, the alignment of the terminal 1 can be improved, the peeling of the through hole portion of the conduction hole 23 of the substrate 2 can be prevented, and the conduction failure between the terminal 1 and the substrate 2 can be avoided. In addition, unlike the known technique 2, it is not necessary to use separate parts such as a terminal block and a connector cavity, so that an increase in the number of parts can be suppressed and manufacturing costs can be reduced.

また、端子１は、基板２に３点支持されるので、１点支持や２点支持の場合と比べて基板２上に安定して自立することができる。その上、端子１は２個の導通片１３を備えているため、導通片１３が１個しかない場合と比べて、導通片１３の断面積が大きくなり、大電流に対応することが可能となる。さらに、端子１は、２個の導通片１３がはんだ付けで基板２に固定されるので、端子１の挿抜方向および捩り方向の外力に対する対抗性が高い。   In addition, since the terminal 1 is supported at three points on the substrate 2, it can stand on the substrate 2 more stably than in the case of one-point support or two-point support. In addition, since the terminal 1 includes two conductive pieces 13, the cross-sectional area of the conductive piece 13 is larger than that in the case where there is only one conductive piece 13, and it is possible to cope with a large current. Become. Furthermore, since the two conducting pieces 13 are fixed to the substrate 2 by soldering, the terminal 1 is highly resistant to external forces in the insertion / extraction direction and the twisting direction of the terminal 1.

＜第２の実施形態＞
図３は本発明に係る端子の取付方法の第２の実施形態における一工程を示す斜視図、図４は本発明に係る端子の取付方法の第２の実施形態における次の工程を示す斜視図である。 <Second Embodiment>
FIG. 3 is a perspective view showing one step in the second embodiment of the terminal mounting method according to the present invention, and FIG. 4 is a perspective view showing the next step in the second embodiment of the terminal mounting method according to the present invention. It is.

端子１は、図３に示すように、矩形平板状の端子本体１５を有しており、端子本体１５には、２個の端子保持片１２および１個の導通片１３が一直線上に交互に並設されている。ここで、導通片１３は端子本体１５の下部中央に下向きに突設されている。また、２個の端子保持片１２は、導通片１３の両側に位置するように端子本体１５の下部両端に下向きに突設されている。   As shown in FIG. 3, the terminal 1 has a rectangular flat terminal body 15. The terminal body 15 has two terminal holding pieces 12 and one conductive piece 13 alternately in a straight line. It is installed side by side. Here, the conductive piece 13 protrudes downward from the center of the lower portion of the terminal body 15. Further, the two terminal holding pieces 12 project downward from both ends of the lower portion of the terminal body 15 so as to be positioned on both sides of the conducting piece 13.

一方、基板２は、図３に示すように、矩形平板状の基板本体２５を有している。基板本体２５には、円形の導通孔２３が貫通して形成されているとともに、この導通孔２３の両側にそれぞれ円形の端子保持孔２２が貫通して形成されている。ここで、２個の端子保持孔２２および１個の導通孔２３は、端子１の端子保持片１２および導通片１３に対向する形で一直線上に交互に並設されている。また、基板本体２５の下面には、回路導体２４が印刷されている。   On the other hand, the substrate 2 has a rectangular flat plate-like substrate body 25 as shown in FIG. A circular conduction hole 23 is formed through the substrate body 25, and circular terminal holding holes 22 are formed through both sides of the conduction hole 23. Here, the two terminal holding holes 22 and the one conduction hole 23 are alternately arranged in parallel on the straight line so as to face the terminal holding pieces 12 and the conduction pieces 13 of the terminal 1. A circuit conductor 24 is printed on the lower surface of the substrate body 25.

そして、基板２に端子１を取り付ける際には、次の手順による。   And when attaching the terminal 1 to the board | substrate 2, it follows the following procedure.

まず、図４に示すように、端子１の各端子保持片１２を基板２の各端子保持孔２２に圧入すると同時に、端子１の導通片１３を基板の導通孔２３に挿通する。   First, as shown in FIG. 4, each terminal holding piece 12 of the terminal 1 is press-fitted into each terminal holding hole 22 of the substrate 2, and at the same time, the conductive piece 13 of the terminal 1 is inserted into the conductive hole 23 of the substrate.

次に、端子１の導通片１３を基板２の回路導体２４にはんだ付けする。すると、端子１が回路導体２４に導通した状態となる。   Next, the conductive piece 13 of the terminal 1 is soldered to the circuit conductor 24 of the substrate 2. Then, the terminal 1 is brought into conduction with the circuit conductor 24.

ここで、基板２への端子１の取付作業が終了する。   Here, the operation of attaching the terminal 1 to the board 2 is completed.

このように、端子１は端子保持片１２および導通片１３を別個に備えており、端子保持片１２の圧入により、端子１が基板２に仮固定されるとともに、導通片１３のはんだ付けにより、端子１と基板２とが確実に導通すると同時に、端子１が基板２に本固定される。   Thus, the terminal 1 is provided with the terminal holding piece 12 and the conducting piece 13 separately, and the terminal 1 is temporarily fixed to the substrate 2 by press-fitting the terminal holding piece 12, and the conducting piece 13 is soldered. At the same time as the terminal 1 and the substrate 2 are reliably connected, the terminal 1 is permanently fixed to the substrate 2.

その結果、公知技術１と異なり、端子１のアライメントを向上させ、基板２の導通孔２３のスルーホール部の剥離を防止し、端子１と基板２との導通不良を回避することができる。また、公知技術２と違って、端子台、コネクタキャビティーなどの別部品を用いる必要がないので、部品点数の増加を抑制し、製造コストを削減することができる。   As a result, unlike the known technique 1, the alignment of the terminal 1 can be improved, the peeling of the through hole portion of the conduction hole 23 of the substrate 2 can be prevented, and the conduction failure between the terminal 1 and the substrate 2 can be avoided. In addition, unlike the known technique 2, it is not necessary to use separate parts such as a terminal block and a connector cavity, so that an increase in the number of parts can be suppressed and manufacturing costs can be reduced.

また、端子１は、基板２に３点支持されるので、１点支持や２点支持の場合と比べて基板２上に安定して自立することができる。その上、端子１は２個の端子保持片１２を備えており、しかも、これらの端子保持片１２が導通片１３の両側に位置しているため、端子保持片１２が１個しかない場合と比べて、導通片１３のはんだ付けまでの仮保持力が強い。   In addition, since the terminal 1 is supported at three points on the substrate 2, it can stand on the substrate 2 more stably than in the case of one-point support or two-point support. In addition, since the terminal 1 includes two terminal holding pieces 12 and these terminal holding pieces 12 are located on both sides of the conducting piece 13, there is only one terminal holding piece 12. In comparison, the temporary holding force until the conductive piece 13 is soldered is strong.

＜第３の実施形態＞
図５は本発明に係る端子の取付方法の第３の実施形態における一工程を示す斜視図である。 <Third Embodiment>
FIG. 5 is a perspective view showing one step in the third embodiment of the terminal mounting method according to the present invention.

端子１は、図５に示すように、矩形平板状の端子本体１５を有しており、端子本体１５には、端子保持片１２および導通片１３が並んで下向きに突設されている。   As shown in FIG. 5, the terminal 1 has a rectangular flat terminal body 15, and the terminal body 15 is provided with a terminal holding piece 12 and a conductive piece 13 side by side and projecting downward.

一方、基板２は、図５に示すように、矩形平板状の基板本体２５を有している。基板本体２５には、円形の端子保持孔２２および円形の導通孔２３が、それぞれ端子１の端子保持片１２および導通片１３に対向する形で貫通して形成されている。また、基板本体２５の下面には、回路導体２４が印刷されている。   On the other hand, the substrate 2 has a rectangular plate-like substrate body 25 as shown in FIG. A circular terminal holding hole 22 and a circular conducting hole 23 are formed in the substrate body 25 so as to penetrate the terminal holding piece 12 and the conducting piece 13 of the terminal 1, respectively. A circuit conductor 24 is printed on the lower surface of the substrate body 25.

そして、基板２に端子１を取り付ける際には、次の手順による。   And when attaching the terminal 1 to the board | substrate 2, it follows the following procedure.

まず、端子１の端子保持片１２を基板２の端子保持孔２２に圧入すると同時に、端子１の導通片１３を基板の導通孔２３に挿通する。   First, the terminal holding piece 12 of the terminal 1 is press-fitted into the terminal holding hole 22 of the substrate 2, and at the same time, the conducting piece 13 of the terminal 1 is inserted into the conducting hole 23 of the substrate.

次に、端子１の導通片１３を基板２の回路導体２４にはんだ付けする。すると、端子１が回路導体２４に導通した状態となる。   Next, the conductive piece 13 of the terminal 1 is soldered to the circuit conductor 24 of the substrate 2. Then, the terminal 1 is brought into conduction with the circuit conductor 24.

ここで、基板２への端子１の取付作業が終了する。   Here, the operation of attaching the terminal 1 to the board 2 is completed.

このように、端子１は端子保持片１２および導通片１３を別個に備えており、端子保持片１２の圧入により、端子１が基板２に仮固定されるとともに、導通片１３のはんだ付けにより、端子１と基板２とが確実に導通すると同時に、端子１が基板２に本固定される。   Thus, the terminal 1 is provided with the terminal holding piece 12 and the conducting piece 13 separately, and the terminal 1 is temporarily fixed to the substrate 2 by press-fitting the terminal holding piece 12, and the conducting piece 13 is soldered. At the same time as the terminal 1 and the substrate 2 are reliably connected, the terminal 1 is permanently fixed to the substrate 2.

その結果、公知技術１と異なり、端子１のアライメントを向上させ、基板２の導通孔２３のスルーホール部の剥離を防止し、端子１と基板２との導通不良を回避することができる。また、公知技術２と違って、端子台、コネクタキャビティーなどの別部品を用いる必要がないので、部品点数の増加を抑制し、製造コストを削減することができる。   As a result, unlike the known technique 1, the alignment of the terminal 1 can be improved, the peeling of the through hole portion of the conduction hole 23 of the substrate 2 can be prevented, and the conduction failure between the terminal 1 and the substrate 2 can be avoided. In addition, unlike the known technique 2, it is not necessary to use separate parts such as a terminal block and a connector cavity, so that an increase in the number of parts can be suppressed and manufacturing costs can be reduced.

また、端子１は、基板２に２点支持されるので、１点支持の場合と比べて基板２上に安定して自立することができる。   In addition, since the terminal 1 is supported at two points on the substrate 2, it can stand on the substrate 2 more stably than in the case of one-point support.

本発明は、自動車、電車、航空機、製造プラント、電化製品、ＯＡ機器など各種の産業分野に広く適用することができる。   The present invention can be widely applied to various industrial fields such as automobiles, trains, aircraft, manufacturing plants, electrical appliances, and OA equipment.

本発明に係る端子の取付方法の第１の実施形態における一工程を示す斜視図である。It is a perspective view which shows one process in 1st Embodiment of the attachment method of the terminal which concerns on this invention. 本発明に係る端子の取付方法の第１の実施形態における次の工程を示す斜視図である。It is a perspective view which shows the next process in 1st Embodiment of the attachment method of the terminal which concerns on this invention. 本発明に係る端子の取付方法の第２の実施形態における一工程を示す斜視図である。It is a perspective view which shows 1 process in 2nd Embodiment of the attachment method of the terminal which concerns on this invention. 本発明に係る端子の取付方法の第２の実施形態における次の工程を示す斜視図である。It is a perspective view which shows the next process in 2nd Embodiment of the attachment method of the terminal which concerns on this invention. 本発明に係る端子の取付方法の第３の実施形態における一工程を示す斜視図である。It is a perspective view which shows one process in 3rd Embodiment of the attachment method of the terminal which concerns on this invention. 従来の端子の取付方法の第１例における一工程を示す斜視図である。It is a perspective view which shows 1 process in the 1st example of the attachment method of the conventional terminal. 従来の端子の取付方法の第１例における次の工程を示す斜視図である。It is a perspective view which shows the next process in the 1st example of the attachment method of the conventional terminal. 従来の端子の取付方法の第２例における一工程を示す斜視図である。It is a perspective view which shows one process in the 2nd example of the attachment method of the conventional terminal. 従来の端子の取付方法の第２例における次の工程を示す斜視図である。It is a perspective view which shows the next process in the 2nd example of the attachment method of the conventional terminal. 従来の端子の取付方法の第３例における一工程を示す斜視図である。It is a perspective view which shows one process in the 3rd example of the attachment method of the conventional terminal. 従来の端子の取付方法の第３例における次の工程を示す斜視図である。It is a perspective view which shows the next process in the 3rd example of the attachment method of the conventional terminal. 図１１の縦断面図である。It is a longitudinal cross-sectional view of FIG.

符号の説明Explanation of symbols

１……端子
２……基板
１２……端子保持片
１３……導通片
１５……端子本体
２２……端子保持孔
２３……導通孔
２４……回路導体
２５……基板本体 DESCRIPTION OF SYMBOLS 1 ... Terminal 2 ... Board 12 ... Terminal holding piece 13 ... Conductive piece 15 ... Terminal body 22 ... Terminal holding hole 23 ... Conducting hole 24 ... Circuit conductor 25 ... Board body

Claims (4)

端子保持片および導通片を別個に備えた端子が基板に取り付けられた、端子の取付構造であって、
前記端子保持片が前記基板の端子保持孔に圧入され、
前記導通片が前記基板の導通孔に挿通されて回路導体にはんだ付けされていることを特徴とする、端子の取付構造。 A terminal mounting structure in which a terminal separately provided with a terminal holding piece and a conductive piece is attached to a substrate,
The terminal holding piece is press-fitted into the terminal holding hole of the substrate;
The terminal mounting structure, wherein the conductive piece is inserted into a conductive hole of the substrate and soldered to a circuit conductor. 前記端子保持片および前記導通片は、一直線上に並設され、
前記導通片は、前記端子保持片の両側にそれぞれ形成されていることを特徴とする、請求項１に記載の端子の取付構造。 The terminal holding piece and the conductive piece are arranged in a straight line,
The terminal mounting structure according to claim 1, wherein the conductive piece is formed on both sides of the terminal holding piece. 前記端子保持片および前記導通片は、一直線上に並設され、
前記端子保持片は、前記導通片の両側にそれぞれ形成されていることを特徴とする、請求項１に記載の端子の取付構造。 The terminal holding piece and the conductive piece are arranged in a straight line,
The terminal mounting structure according to claim 1, wherein the terminal holding pieces are formed on both sides of the conducting piece. 端子保持片および導通片が別個に設けられた端子を基板に取り付ける、端子の取付方法であって、
前記端子保持片を前記基板の端子保持孔に圧入する端子保持工程と、
前記導通片を前記基板の導通孔に挿通する導通片挿通工程と、
前記導通片を前記基板の回路導体にはんだ付けする導通工程と
が含まれることを特徴とする、端子の取付方法。 A terminal mounting method for mounting a terminal on which a terminal holding piece and a conductive piece are separately provided to a substrate,
A terminal holding step of press-fitting the terminal holding pieces into the terminal holding holes of the substrate;
A conduction piece insertion step of inserting the conduction piece into the conduction hole of the substrate;
And a conducting step of soldering the conducting piece to the circuit conductor of the substrate.
JP2005286742A 2005-09-30 2005-09-30 Terminal mounting structure and mounting method Abandoned JP2007095629A (en)

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Cited By (10)

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JP2007227304A (en) * 2006-02-27 2007-09-06 Sumitomo Wiring Syst Ltd Terminal mounting structure to substrate
JP2015035364A (en) * 2013-08-09 2015-02-19 古河電気工業株式会社 Conductive plate
JP5681261B1 (en) * 2013-10-31 2015-03-04 株式会社フジクラ PCB mounting terminals
CN104934738A (en) * 2014-03-20 2015-09-23 住友电装株式会社 Printed circuit board with terminal
JP2015216065A (en) * 2014-05-13 2015-12-03 アンデン株式会社 Terminal connection structure of electrical apparatus
WO2015198891A1 (en) * 2014-06-27 2015-12-30 住友電装株式会社 Terminal-equipped printed circuit board
US9570825B2 (en) 2014-11-21 2017-02-14 Yazaki Corporation Substrate terminal
US9774118B2 (en) 2014-11-21 2017-09-26 Yazaki Corporation Substrate terminal and substrate with terminal
JP2022102076A (en) * 2020-12-25 2022-07-07 日本電産サンキョー株式会社 Motor and pumping device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227304A (en) * 2006-02-27 2007-09-06 Sumitomo Wiring Syst Ltd Terminal mounting structure to substrate
JP2015035364A (en) * 2013-08-09 2015-02-19 古河電気工業株式会社 Conductive plate
JP5681261B1 (en) * 2013-10-31 2015-03-04 株式会社フジクラ PCB mounting terminals
CN104934738A (en) * 2014-03-20 2015-09-23 住友电装株式会社 Printed circuit board with terminal
JP2015185572A (en) * 2014-03-20 2015-10-22 住友電装株式会社 Terminal-having printed board
JP2015216065A (en) * 2014-05-13 2015-12-03 アンデン株式会社 Terminal connection structure of electrical apparatus
WO2015198891A1 (en) * 2014-06-27 2015-12-30 住友電装株式会社 Terminal-equipped printed circuit board
JP2016027536A (en) * 2014-06-27 2016-02-18 住友電装株式会社 PCB with terminal
CN106663886A (en) * 2014-06-27 2017-05-10 住友电装株式会社 Terminal-equipped printed circuit board
US9570825B2 (en) 2014-11-21 2017-02-14 Yazaki Corporation Substrate terminal
US9774118B2 (en) 2014-11-21 2017-09-26 Yazaki Corporation Substrate terminal and substrate with terminal
JP2022102076A (en) * 2020-12-25 2022-07-07 日本電産サンキョー株式会社 Motor and pumping device
JP7562404B2 (en) 2020-12-25 2024-10-07 ニデックインスツルメンツ株式会社 Motors and pumps
WO2024142292A1 (en) * 2022-12-27 2024-07-04 株式会社オートネットワーク技術研究所 Power supply unit

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