JP2007065600A - Combined laser equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of a combined laser device that combines and outputs laser beams emitted from a plurality of semiconductor laser elements, to be long-term reliable, and to be configured at low cost.
SOLUTION: A plurality of semiconductor laser elements LD1-4, four lenses 11-14 for collimating and condensing laser beams B1-4 emitted from the plurality of semiconductor laser elements LD1-4, respectively, and each laser A regular quadrangular pyramid optical member 20 having reflecting surfaces that reflect the beams B1 to B4 as side surfaces 21 to 24, respectively, and a multi-piece in which an incident end face 31 is disposed at the condensing position of the laser beam reflected by the optical member 20. Mode optical fiber 33, semiconductor laser elements LD 1 to LD 4, optical fiber 33, optical member 20, and lenses 11 to 14, and laser beams B 1 to 4 emitted from respective semiconductor lasers LD 1 to 4 are optical members 20. The laser beams incident on the different side surfaces 21 to 24 are arranged at positions where the laser beams incident on the different side surfaces 21 to 24 are reflected and condensed on the incident end surface 31 of the optical fiber 33, respectively.
[Selection] Figure 1

Description

  The present invention relates to a multiplex laser device, and more particularly to a multiplex laser device that multiplexes laser beams emitted from a plurality of semiconductor lasers using an optical fiber.

  Conventionally, wavelength conversion lasers, excimer lasers, and Ar lasers that convert infrared light emitted from semiconductor laser-excited solid-state lasers into third harmonics in the ultraviolet region have been put to practical use as devices that generate ultraviolet laser beams. It is provided.

  A light source that emits a laser beam having such a wavelength is used as an exposure light source in an exposure apparatus that exposes a photosensitive material having sensitivity in a predetermined wavelength region (hereinafter referred to as “ultraviolet region”) including an ultraviolet region of 350 to 420 nm. It is also considered to apply. In this case, the light source for exposure is naturally required to have a sufficient output for exposing the photosensitive material.

  However, the excimer laser has a problem that the apparatus is large, and the cost and maintenance cost are high.

  In addition, a wavelength conversion laser that converts infrared light into the third harmonic in the ultraviolet region has extremely low wavelength conversion efficiency, so that it is extremely difficult to obtain a high output. At present, a solid laser medium is excited with a 30 W semiconductor laser to oscillate a 10 W fundamental wave (wavelength 1064 nm), which is converted into a 3 W second harmonic (wavelength 532 nm), and the sum frequency of both of them. The current practical level is to obtain a third harmonic of 1 W (wavelength 355 nm). In this case, the electro-optical efficiency of the semiconductor laser is about 50%, and the conversion efficiency to ultraviolet light is very low, about 1.7%. Such a wavelength conversion laser is considerably expensive because it uses an expensive optical wavelength conversion element.

  In addition, the Ar laser has a problem that the electro-optical efficiency is very low as 0.005% and the lifetime is as short as about 1000 hours.

  As a low-cost and long-life laser apparatus that can solve these problems and obtain a high output, a combined laser apparatus that combines and outputs laser beams from a plurality of semiconductor laser elements has been proposed. For example, Patent Document 1 proposes a multiplexing laser device that condenses and multiplexes laser beams from a plurality of semiconductor lasers arranged one-dimensionally on an optical fiber. In Patent Document 2, a plurality of semiconductor lasers are arranged two-dimensionally, specifically, circumferentially, and the light from the plurality of semiconductor lasers is collected on one optical fiber and combined. A combined laser device has been proposed.

On the other hand, in a blue / ultraviolet short wavelength laser device or a high-power laser device, deposits such as organic substances are deposited on the surface of the optical component in a state where the optical power density is high, and the transmittance of the optical component is reduced. Or the problem that phenomena, such as destruction, are easy to occur is known. The deposits on the laser beam incident end face of this optical component are due to the dust collection effect of the dust in the air, and the deposits and deposits resulting from the chemical reaction of the organic substances volatile in or around the air with the laser beam. Etc. are known. This problem is considered to be particularly remarkable in a combined laser device having a large output.
JP 2004-77779 A JP 2003-347647 A

  In the devices of Patent Document 1 and Patent Document 2, a plurality of semiconductor lasers, an optical fiber tip, and an optical system for condensing the laser beam on the optical fiber are arranged in a relatively large package hermetically sealed. Thus, the adhesion of contaminants can be effectively suppressed, but such a hermetically sealed package is often a custom-made product, which may increase the cost.

  Therefore, in order to obtain a structure that does not include a large hermetically sealed package that is expensive, for example, in the apparatus of Patent Document 2, a configuration in which semiconductor laser elements individually mounted on a CAN package are used and arranged circumferentially It can also be considered. However, for example, when four CAN packages having an outer diameter of 5.6 mm are arranged circumferentially, a collimating lens having a diameter φ of about 8 mm is required to increase the coupling efficiency. At this time, the diameter of the four beam bundles from the four semiconductor lasers is 20 mm. When condensing this collimated laser beam on a fiber with NA (aperture) = 0.2, it is necessary to use a condensing lens with a focal length of 50 mm. Therefore, the size as a laser device tends to increase. As described above, the module becomes large in size, and as a result, there is a possibility that it is not possible to achieve a sufficient cost reduction.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a low-cost multiplexing laser device that is small in size and high in output.

The multiplexing laser device of the present invention includes a plurality of semiconductor lasers,
One multimode optical fiber;
An optical member having a pyramidal reflective surface;
In the semiconductor laser, the optical fiber, and the optical member, laser beams emitted from the plurality of semiconductor lasers are incident on different side surfaces of the optical member, and a plurality of laser beams incident from the different side surfaces are incident on the side surfaces. It is arranged at a position where it is reflected and condensed on the incident end face of the optical fiber.

  The optical member having a pyramidal reflecting surface is a prism member whose side surface is constituted by a mirror, or a prism having a pyramidal concave portion and the side surface of the pyramidal shape being a reflecting surface. Etc.

  It is desirable that the plurality of semiconductor laser elements be arranged in individually hermetically sealed packages.

In addition, the multiplexing laser device of the present invention includes a transparent member disposed so as to contact the incident end face of the optical fiber, and a plurality of laser beams are condensed on the incident end face of the optical fiber via the transparent member. It is desirable that the optical power density of the laser beam on the incident surface of the transparent member on which the laser beam is incident be 10 W / mm ² or less.

  Further, at this time, a housing having a light exit window that includes the optical member is provided, a transparent member is disposed so as to cover the light exit window, and an optical fiber is attached to the housing outside the housing. On the other hand, it is desirable to be detachable.

  Alternatively, the multiplexing laser device of the present invention includes a housing having a light exit window that contains an optical member, and a transparent member disposed so as to cover the light exit window, and the optical fiber is provided outside the housing. Are arranged so that the incident end face comes into contact with the transparent member, and a plurality of laser beams are condensed on the incident end face of the optical fiber through the transparent member, and the optical fiber and the transparent member are attached to the casing. On the other hand, it is desirable to be detachable.

  The multiplexing laser device of the present invention includes an optical member made of a mirror or prism having a pyramidal reflecting surface, reflects the optical path of the laser beam from the semiconductor laser element, and focuses it on the incident end face of the optical fiber. Therefore, by turning back the optical path of the laser beam instead of being linear, a condensing lens with a short focal length can be used, and as a result, the entire apparatus can be miniaturized.

  The plurality of semiconductor laser elements can be individually arranged in a hermetically sealed package, and it is not necessary to cover the entire apparatus with a large hermetic package, and the cost can be suppressed because an expensive hermetic package is not used. . A commercially available inexpensive CAN package can be used as a package for hermetically sealing individual semiconductor lasers.

In addition, in the combined laser device in the ultraviolet region, there is a problem that the fiber incident end surface is contaminated because the power density at the fiber incident end surface becomes high. In the combined laser device of the present invention, the incident end surface of the optical fiber is If the transparent fiber is placed in contact with the transparent member, the optical fiber incident end face and the transparent member are in physical contact, so there is no contamination of the optical fiber incident end face, and the power density of the beam incident face of the transparent member in contact with the atmosphere. Is lower than the power density at the incident end face of the optical fiber, so that the adhesion of contaminants to the incident end face of the transparent member is suppressed, and as a result, deterioration of the apparatus can be suppressed. Moreover, if the optical power density at the incident surface on which the laser beam of the transparent member is incident is 10 W / mm ² or less, the adhesion of contaminants to the incident surface of the transparent member can be more effectively suppressed. Long life can be achieved.

  In addition, the multiplexing laser device of the present invention is configured so that the transparent member brought into contact with the incident end face of the optical fiber and the optical fiber are detachable from the housing containing the optical member. The transparent member can be easily cleaned or replaced even when contaminants adhere to and accumulate on the surface on which the laser beam is incident, or when dust or the like is present between the transparent member and the incident end surface of the optical fiber. , Device deterioration can be suppressed and the life can be extended.

  Hereinafter, it explains in detail using a drawing of an embodiment of the invention.

  First, the multiplexing laser device according to the first embodiment of the present invention will be described. FIG. 1 is a side view showing a schematic configuration thereof, and FIG. 2 is a plan view schematically showing a positional relationship between an optical member and a semiconductor laser element and a laser beam optical path.

  The combining laser device 1 of the present embodiment includes four lenses for collimating and condensing the four semiconductor laser elements LD1 to LD4 and the laser beams B1 to B4 emitted from the four semiconductor laser elements LD1 to LD4, respectively. 11 to 14, an optical member 20 of a regular quadrangular pyramid having reflecting surfaces reflecting the laser beams B1 to B4 as side surfaces 21 to 24, and an incident end face 31 at the condensing position of the laser beam reflected by the optical member 20 The multi-mode optical fiber 33 is arranged, and the four semiconductor laser elements LD1 to LD4, the optical fiber 33, the optical member 20, and the lenses 11 to 14 are emitted from the respective semiconductor lasers LD1 to LD4. The laser beams B1 to B4 are incident on different side surfaces 21 to 24 of the optical member 20, and the laser beams incident on the different side surfaces 21 to 24 are reflected and focused on the incident end surface 31 of the optical fiber 33, respectively. Each Is placed.

  The optical member 20 is a regular quadrangular pyramid-shaped member shown in FIG. 3, and its four side surfaces 21 to 24 are formed of mirrors and are reflecting surfaces that reflect incident light. The optical member 20 is disposed in the housing 15, and an emission window 16 through which a laser beam is emitted is opened at a location on the housing 15 above the vertex 25 of the optical member 20. Further, the housing 15 has a side wall made of a light transmitting member so that the laser beam from each semiconductor laser element is transmitted and enters the optical member 20.

  Each of the semiconductor laser elements LD1 to LD4 is disposed in a CAN package C1 to C4 that is filled with an inert gas and hermetically sealed after the deaeration process, and a laser beam from each semiconductor laser is transmitted to the optical member 20. It arrange | positions in the position which each injects into the four side surfaces 21-24 (refer FIG. 2).

  The lenses 11 to 14 for collimating and condensing are arranged outside the light emission windows of the CAN packages C1 to C4.

  A transparent member 30 is fixed outside the exit window 16 of the housing 15 so as to cover the window 16, and further receives a ferrule 35 attached to the tip of the optical fiber 33 so as to surround the transparent member 30. A receptacle 36 is fixed.

  The tip portion including the incident end face 31 of the optical fiber 33 is inserted into the ferrule 35, and the ferrule 35 is attached to a connector 38 that fits into the receptacle 36. The ferrule 35 is received by the inner sleeve 36a of the receptacle 36, and the outer sleeve 36b of the receptacle 36 and the connector 38 are provided with engaging portions 36c and 38c that engage with each other.

  The connector 38 includes a spring 39 that presses the ferrule 35 against the contact surface 30a of the transparent member 30 when mated with the receptacle 36. When the connector 38 is connected to the receptacle 36, the ferrule 35 receives a predetermined pressure by the spring 39. Then, it is pressed against the transparent member 30 and is held and fixed in a pressed contact state.

  Since the receptacle 36 is fixed to the housing 15, the position of the condensing point and the inner sleeve 36a of the receptacle 36 that receives the ferrule 35 does not change, and even if the optical fiber 33 or the semiconductor laser LD is replaced. The positional accuracy between the condensing point and the incident end face 31 of the optical fiber 33 is maintained, and high efficiency coupling can be obtained.

  In the multiplexing laser device 1, laser beams B1 to B4 emitted from the semiconductor laser elements LD1 to LD4 are incident on the side surfaces 21 to 24 of the optical member 20 through the lenses 11 to 14, respectively. And the traveling direction is changed toward the optical member apex 25 side, and the light is condensed on the incident end face 31 of the optical fiber 33 arranged in contact with the transparent member 30 through the transparent member 30. The laser beam incident on the optical fiber 33 from the incident end face 31 propagates in the fiber 33, and the combined laser beam is emitted from an output end face (not shown) of the optical fiber 33.

  If each of the CAN packages C1 to C4 includes a 250 mW laser chip, the combined laser device includes four semiconductor laser elements, and thus the output is 1 W.

  As in the combined laser apparatus of the present embodiment, a condensing lens that includes an optical member 30 that reflects a laser beam and has a shorter focal length than the case of condensing linearly by folding the optical path of the laser beam is used. Thus, the optical path length can be shortened, and the apparatus can be downsized as a whole.

  As a specific example, a semiconductor laser element LD1 to LD4 having a 250 mW semiconductor laser mounted on a φ5.6 mm CAN package and hermetically sealed by electric resistance welding is used outside the light emission window of each CAN package C1 to C4. When the NA on the chip side of the arranged lenses 11 to 14 is 0.6 and the NA on the fiber side is 0.13, the distance from the lens center to the light emitting point is 3 mm, to the focal point of the lens center and the fiber incident point The distance is 13.5 mm. As described above, in the apparatus described in Patent Document 2, the focal length is 50 mm in the case of the configuration including four CAN packages of φ5.6 mm, which is much shorter.

  Since the CAN packages C1 to C4 are hermetically sealed after performing a deaeration process to remove internal volatile components, it is possible to suppress adhesion of contaminants to the end face of the semiconductor laser element. it can. In addition, since the incident end face 31 of the optical fiber 33 is pressed and fixed in contact with the transparent member 30 during use, the incident end face 31 is protected by the transparent member 30 and no contaminants adhere to it. Therefore, the device can be highly reliable over a long period of time.

  Further, a commercially available CAN package that hermetically seals the semiconductor laser element can be used. On the other hand, the casing 15 does not need to be hermetically sealed, so that the casing does not become expensive. The multiplexing laser device can be configured at low cost.

In the combined laser device 1, when the optical power density at the light beam incident surface 30 b of the transparent member 30 is set to 10 W / mm ² or less during driving, organic matter or the like on the incident surface 30 b of the transparent member 30 is driven. Since contaminants are suppressed, the life of the apparatus can be further increased.

FIG. 4 is data showing the relationship between the optical power density on the light beam incident surface 30b of the transparent member 30 and the lifetime of the laser module. Here, the lifetime is defined when the output power of the laser module reaches 60% of the initial output power. It is clear that when the power density is 10 W / mm ² , the lifetime of 18000 hours decreases as the power density increases. That is, it is considered that a lifetime of about 18000 hours or more can be obtained by setting the optical power density on the light beam incident surface of the transparent member to 10 W / mm ² or less, and a sufficient length as the lifetime of the product is achieved. be able to.

A specific example for setting the optical power density on the light beam incident surface of the transparent member to 10 W / mm ² or less will be described.

It is assumed that the NA of the optical fiber is 0.22, the incident NA of the focused beam is 0.2, and the output of each semiconductor laser element is 250 mW. Here, in order to multiplex the light from the four semiconductor laser elements, the output is 1 W. Glass having a refractive index of 1.5 is used as the transparent member 30 that protects the beam incident end face of the fiber. At this time, the NA of the focused beam inside the glass is 0.127. When the thickness of the transparent member 30 that is fiber protective glass is 1 mm, the optical power density at the beam incident surface of the transparent member 30 is 10 W / mm ² . That is, under the above conditions, the light power density on the light beam incident surface of the transparent member can be 10 W / mm ² or less by setting the plate thickness of the transparent member 30 to 1 mm or more.

  Next, a multiplexing laser device according to the second embodiment of the present invention will be described. FIG. 5 is a side view showing a schematic configuration thereof, and FIG. 6 is a side view showing a configuration when the connector of the multiplexing laser apparatus shown in FIG. 5 is not attached. 5 and 6, the same elements as those in the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and differences from the first embodiment will be mainly described (the same applies hereinafter). ).

  In the multiplexing laser device 2 of the present embodiment, an opening 17 having a diameter larger than that of the emission window 16 is formed in the portion of the emission window 16 of the housing 15, and the transparent member 30 is inserted into the opening 17. Has been. The opening 17 constitutes a transparent member holding part. As shown in FIG. 6, the transparent member 30 has a size that can penetrate the inner sleeve 36 a of the receptacle 36, and is detachable from the housing 15. The transparent member 30 is a columnar glass block, and the window 16 and the holding portion 17 are both cylindrical. The diameter of the holding portion 17 is slightly larger than the diameter of the window 16, and the step portion 16a serves as a stopper to restrict the position of the transparent member 30 in the optical axis direction.

  When the connector 38 is connected to the receptacle 36, the ferrule 35 receives a predetermined pressure by the spring 39 and is pressed against the transparent member 30 and fixed in contact. At this time, the pressing by the ferrule 35 and the holding of the transparent member of the housing 10 are performed. The position of the transparent member 30 in the optical axis direction is uniquely determined by the step portion 16a of the portion 16. Therefore, even if the transparent member is not fixed to the housing, problems such as optical displacement do not occur.

  Since the transparent member 30 is detachable, when contaminants adhere to the incident surface 30b of the light beam B of the transparent member 30 after long-time driving, or the optical fiber contact surface 30a of the transparent member 30 and the optical fiber 33 When dust or the like adheres between the two, the cleaning of the transparent member 30 or the replacement of the transparent member 30 can be easily performed.

  Also in the multiplexing laser device 2 of the present embodiment, it is possible to obtain the effect of downsizing similarly to the multiplexing laser device 1 of the first embodiment, and when the transparent member 30 is contaminated, it is removed. Long-term reliability can be obtained because cleaning or replacement can be easily performed.

  Next, a combining laser device according to a third embodiment of the present invention will be described. FIG. 7 shows a side sectional view of the multiplex laser device 3 of the third embodiment. The multiplex laser device 3 of this embodiment is different from the above embodiment in that an optical member having a pyramidal reflecting surface that reflects a laser beam and changes an optical path is constituted by a prism 40.

  As shown in the perspective view of FIG. 8, the prism 40 has a shape in which a concave portion 50 having a regular quadrangular pyramid shape is provided on the bottom surface of the quadrangular prism. The laser beam incident from the outer side surfaces 41 to 44 of the quadrangular column is reflected by the surfaces 45 to 48 corresponding to the side surfaces of the quadrangular pyramid 50 and its traveling direction is changed to the upper surface 49 of the quadrangular column.

  The prism 40 is disposed in a housing 55 having an opening 56 at the laser beam condensing position on the upper surface 49, and the optical fiber 33 is inserted from the opening 56 of the housing 55 so that the incident end surface 31 is the upper surface of the prism 40. It is arranged to contact 49. Semiconductor laser elements LD1 to LD4, lenses 11 to 14, prism 40 and optical fiber 33 are incident end faces of optical fiber 33 through which laser beams B1 to B4 from semiconductor lasers LD1 to LD4 pass through lenses 11 to 14 and prism 40, respectively. 31 (prism upper surface 49) is arranged in a positional relationship where light is condensed.

  In the multiplexing laser device 3, laser beams B1 to B4 emitted from the semiconductor laser elements LD1 to LD4 are incident on the side surfaces 41 to 44 of the prism 40 through the lenses 11 to 14, and are formed into prismatic concave portions. , The direction of travel is changed toward the upper surface 49 side of the prism, and the light is condensed on the incident end surface 31 of the optical fiber 33 in contact with the upper surface 49 of the prism. The laser beam incident on the optical fiber 33 from the incident end face 31 propagates in the fiber 33, and the combined laser beam is emitted from an output end face (not shown) of the optical fiber 33.

  Also in this embodiment, the effect of downsizing the apparatus can be obtained as in the above embodiment, and each semiconductor laser element is disposed in the CAN package, and the incident end face 31 of the optical fiber .33 is formed of the prism 40. It is pressed against the upper surface 49 and held and fixed to prevent the contamination from adhering to the portion where the optical power density is high during driving, and long-term reliability can be obtained.

  In each of the above embodiments, an optical member having a regular quadrangular pyramid or an optical member having a concave portion having a regular quadrangular pyramid is used. However, various polygonal pyramid optical members such as a triangular pyramid and a pentagonal pyramid can be used. In the case of using an n-sided pyramid, it is possible to configure a device that combines laser beams from n semiconductor laser elements.

  A combined laser device provided with an 8-pyramid optical member will be described as a fourth embodiment of the present invention. FIG. 9 is a side view showing the schematic configuration, and FIG. 10 is a plan view schematically showing the positional relationship between the optical member and the semiconductor laser element and the laser beam optical path.

  As shown in FIG. 9 and FIG. 10, the multiplexing laser device 4 of the present embodiment includes eight semiconductor laser elements LD11 to LD18 and laser beams B11 to 18 emitted from the eight semiconductor laser elements LD11 to LD18. Eight lenses 51 to 58 for collimating and condensing, respectively, and an octagonal pyramid shaped optical member 60 having reflecting surfaces reflecting the laser beams B11 to 18 as side surfaces 61 to 68, respectively.

  The optical member 60 is an octagonal pyramid-shaped member, and its eight side surfaces 61 to 68 are formed of mirrors and are reflecting surfaces that reflect incident light.

  Each of the semiconductor laser elements LD11 to LD18 is disposed in a CAN package C11 to C18 that is filled with an inert gas and hermetically sealed after deaeration treatment, and the laser beam from each semiconductor laser is transmitted to the optical member 60. It arrange | positions in the position which each injects into eight side surfaces 61-68 (refer FIG. 10). The respective lenses 51 to 58 for collimating and condensing are arranged outside the light emission window of each of the CAN packages C11 to C18.

  Other configurations are substantially the same as those of the first embodiment.

  In this multiplexing laser device 4, laser beams B11-18 emitted from the semiconductor laser elements LD11-18 are incident on the side surfaces 61-68 of the optical member 60 through the lenses 11-18, and the side surfaces 61-68. And the traveling direction is changed toward the apex side of the optical member, and the light is condensed on the incident end face 31 of the optical fiber 33 arranged in contact with the transparent member 30 through the transparent member 30. The laser beam incident on the optical fiber 33 from the incident end face 31 propagates in the fiber 33, and the combined laser beam is emitted from an output end face (not shown) of the optical fiber 33.

  If each of the CAN packages C11 to C18 includes a 250 mW laser chip, the combined laser apparatus includes eight semiconductor laser elements, so that the output is 2W.

In this multiplexing laser device 4, since eight laser beams B11 to B18 are condensed, the optical power density on the light beam incident surface 30b of the transparent member 30 during driving is set to 10 W / mm ² or less. The thickness of the transparent member 30 needs to be increased compared to the case of the first embodiment. As a specific example, as in the case of the first embodiment, the NA of the optical fiber is 0.22, the incident NA of the focused beam is 0.2, the output of each semiconductor laser element is 250 mW, and the beam incident end face of the fiber is As the transparent member 30 to be protected, glass having a refractive index of 1.5 is used. At this time, since eight laser beams from the 250 mW semiconductor laser element are combined, the output is 2 W. When glass with a plate thickness of 1.4 mm is used as the transparent member, the power density on the beam incident surface of the transparent member is 10 W / mm ² . That is, in the case of the above conditions, by setting the thickness of the transparent member 30 to 1.4 mm or more, the light power density on the light beam incident surface of the transparent member can be 10 W / mm ² or less, and the beam incidence of the transparent member Surface contamination can be prevented, and a laser with high temporal reliability can be realized.

Side sectional view of the combined laser device of the first embodiment The top view which shows the optical path of the combining laser apparatus of FIG. Perspective view of optical member having pyramid surface Graph showing the relationship between power density and lifetime at the light incident end face Side sectional view of the combined laser device of the second embodiment The side view which shows the connector non-mounting state of the combining laser apparatus of 2nd Embodiment Side sectional view of the combined laser device of the third embodiment Perspective view of optical member having pyramid surface Partial side sectional view of the combined laser device of the fourth embodiment The top view which shows the optical path of the combining laser apparatus of FIG.

Explanation of symbols

1, 2, 3, 4 Combined laser device
11, 12, 13, 14 Lens
15 housing
16 Exit window
17 Transparent member holder
20 Optical components
21, 22, 23, 24 Reflective surface
30 Transparent material
31 Optical fiber entrance end face
33 Optical fiber
35 Ferrule
36 Receptacle
38 connectors
39 Spring
40 Prism B1-4 Laser beam C1-4 CAN package LD1-4 Semiconductor laser device

Claims (5)

A plurality of semiconductor lasers;
One multimode optical fiber;
An optical member having a pyramidal reflective surface;
In the semiconductor laser, the optical fiber, and the optical member, laser beams emitted from the plurality of semiconductor lasers are incident on different side surfaces of the optical member, and a plurality of laser beams incident from the different side surfaces are incident on the side surfaces. A combined laser device, wherein the combined laser device is disposed at a position where the light is reflected and condensed on an incident end face of the optical fiber.   2. The combined laser device according to claim 1, wherein the plurality of semiconductor laser elements are arranged in an individually hermetically sealed package. Comprising a transparent member arranged to contact the incident end face of the optical fiber;
The plurality of laser beams are condensed on the incident end face of the optical fiber through the transparent member,
3. The combined laser device according to claim 1, wherein an optical power density of the laser beam on an incident surface of the transparent member on which the laser beam is incident is 10 W / mm ² or less. A housing having a light exit window that encloses the optical member;
The transparent member is arranged to cover the light exit window;
4. The combined laser device according to claim 3, wherein the optical fiber is detachably attached to the housing outside the housing. A housing having a light exit window containing the optical member;
A transparent member arranged to cover the light exit window,
The optical fiber is disposed outside the housing such that the incident end surface contacts the transparent member,
The plurality of laser beams are condensed on the incident end face of the optical fiber through the transparent member,
3. The combined laser device according to claim 1, wherein the optical fiber and the transparent member are detachable from the housing.

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