JP2007060112A - Mounting structure for solid-state imaging element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow smooth movement of a spacer on which an adhesive is applied without changes in the regulated registration for improved adhesion. <P>SOLUTION: A spacer 32 is interimposed in the gap between a color separation prism 18 and a solid-state imaging element unit 20. The abutting surface between the emission end of the color separation prism 18 and the spacer 32, and that between the solid-state imaging element unit 20 and the spacer 32, are bonded by using a UV cured adhesive. Each of bonding surfaces 32a and 32b of the spacer 32 is formed into an obscure glass surface. Thus, adhesion between the bonding surfaces is reduced with the UV-curing adhesive in-between, and the spacer 32 is moved smoothly along the gap between the solid-state imaging element unit 20 and the color separation prism 18 that is adjusted for registration. Bonding area is enlarged, while the size of spacer 32 is not increased. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting structure for a solid-state imaging device, and more particularly to a technique for mounting a solid-state imaging device at an emission end of a color separation prism.

  Conventionally, subject light incident through a photographing lens is decomposed into a red (R) component, a green (G) component, and a blue (B) component by a color separation prism, and these are received by three solid-state imaging devices such as a CCD. Imaging apparatuses such as a color television camera and a video camera that can be led to a surface and can take out image signals for each color of R, G, and B are known.

  The three solid-state imaging devices are subjected to registration adjustment with respect to the color separation prism, and are then bonded and fixed with a spacer interposed in the gap between the emission end of the color separation prism and the solid-state imaging device.

  In Patent Document 1, an inclined surface is formed at the exit end of the color separation prism, and a wedge-shaped spacer is disposed in a gap formed between the exit end of the color separation prism and the solid-state imaging device. Thus, a technique for attaching a solid-state imaging device to a color separation prism is disclosed.

In Patent Document 2, an inclined surface is formed at the edge of the solid-state image sensor on the joint surface side, and a wedge-shaped spacer is provided in the gap formed between the emission end of the color separation prism and the solid-state image sensor. A technique for attaching a solid-state imaging device to a color separation prism by arranging and bonding is disclosed.
No. 5-37588 Japanese Utility Model Publication No. 1-105282

By the way, the spacer disposed in the gap between the emission end of the color separation prism and the solid-state image sensor is
In order to facilitate removal of dirt on the adhesive surface, the adhesive surface is a polished surface. Therefore, when inserting the spacer to which the adhesive is applied into the gap between the color separation prism and the solid-state imaging device, the adhesive surfaces are brought into close contact with each other, causing slippage. There has been a problem that the thickness cannot be made uniform, and as a result, the registration changes.

  In addition, when a spacer with a pre-applied adhesive is interposed between the color separation prism and the solid-state image sensor to perform registration adjustment and force adjustment of the solid-state image sensor, there is a large resistance to the movement of the spacer. As a result, the thickness of the adhesive varies, and there is a problem in that the balance of shrinkage force during the curing of the adhesive is lost, resulting in a change in registration.

  Furthermore, when using a photo-curing adhesive that is cured by ultraviolet rays as an adhesive, when the ultraviolet rays are irradiated from the side of the spacer, the ultraviolet rays are regularly reflected by the polished surface of the spacer, and the ultraviolet rays are uniformly applied to the adhesive. Is not irradiated, the curing speed is partially different, and there is a problem that the adjusted registration is changed.

  Furthermore, since a small spacer is used so as not to make the color separation prism and the like unnecessarily large, there is a problem that the adhesion area becomes small and the adhesion force becomes weak. If the adhesive strength is weak, when a load is applied to the flexible printed wiring connected to the foot of the solid-state image sensor or an impact, a peeling force greater than the adhesive force occurs, and the solid-state image sensor peels off from the color separation prism. There was a problem.

  The present invention has been made in view of such circumstances, the spacer applied with the adhesive can be moved well, the adjusted registration is not changed, and the size of the spacer is reduced. It is an object of the present invention to provide a mounting structure for a solid-state imaging device capable of improving the adhesive force without being changed.

  In order to achieve the above object, an invention according to claim 1 is directed to an emission end of a color separation prism that separates subject light from a photographing lens into a plurality of wavelength band components, and a solid-state imaging device or an element seat that holds a solid-state imaging device. An inclined surface is formed on at least one peripheral portion of the surface facing the emission end of the lens, and the cross section is wedge-shaped in a gap formed between the emission end of the color separation prism and the solid-state imaging device or element seat In a mounting structure of a solid-state imaging device in which a transparent spacer is loaded and the abutting surface between the emitting end and the spacer and the abutting surface between the solid-state imaging device or the element seat and the spacer are bonded with a photocurable adhesive , At least one of the adhesion surfaces of the emission end of the color separation prism and the spacer, and at least one of the adhesion surfaces of the solid-state imaging device or the element seat and the spacer are fine. It is characterized in that it has a surface having irregularities.

  That is, the present invention provides at least one adhesion surface of the adhesion surface between the emission end of the color separation prism and the spacer, and at least one adhesion surface of the adhesion surface between the solid-state imaging device or the element seat and the spacer. Each is characterized by having a surface with fine irregularities.

  Thus, by making at least one adhesive surface a surface having fine irregularities, the adhesion force between the adhesive surfaces on which the photo-curing adhesive is interposed is reduced, and the color separation prism and solid-state imaging whose registration is adjusted. The spacer can be moved smoothly along the gap with the element or element seat. In addition, since a large resistance force is not generated in the movement of the spacer, the thickness of the photocurable adhesive is made uniform as a result, and the registration can be prevented from changing when the photocurable adhesive is cured.

  Further, the surface area of the adhesive surface is increased by the surface having fine irregularities, and the adhesive force can be improved without enlarging the spacer itself.

  According to a second aspect of the present invention, in the solid-state imaging device mounting structure according to the first aspect, at least two adhesion surfaces of the spacer are formed as surfaces having fine irregularities. As a result, when the light curable adhesive is cured by irradiating light from the side of the spacer, the light is not regularly reflected on the adhesive surface of the spacer (that is, irregularly reflected), and the light curable adhesive is The amount of light to be irradiated is made uniform, and the change in registration when the adhesive is cured is reduced.

  According to a third aspect of the present invention, in the mounting structure for a solid-state imaging device according to the first or second aspect, the surface having the fine irregularities is a frosted glass surface.

  According to the present invention, at least one bonding surface of the bonding surface between the emission end of the color separation prism and the spacer, and at least one bonding surface of the bonding surface between the solid-state imaging device or the element seat and the spacer. Since each of the surfaces has fine irregularities, the spacer to which the photo-curing adhesive is applied can be moved smoothly along the gap between the color separation prism adjusted for registration and the solid-state imaging device or element seat. It is possible to improve the adhesion without changing the adjusted registration and without changing the size of the spacer.

  A preferred embodiment of a mounting structure for a solid-state imaging device according to the present invention will be described below in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic view showing an example of an apparatus for attaching a solid-state imaging device to a color separation prism.

  As shown in FIG. 1, a bracket 12 is erected on the base plate 11 of the mounting adjustment jig 10. The bracket 12 has a front panel 13, a lens mount 14, and a color separation prism holding frame 15. The lens mount 14 is mounted with a photographing lens 16, and a color separation prism 18 is attached to the color separation prism holding frame 15 via a mounting plate 17.

  As shown in FIG. 3, the color separation prism 18 separates subject light incident through the photographing lens 16 into an R component, a G component, and a B component, and divides them into three solid-state image sensor units 20 (20R, 20G, 20B). The three solid-state image pickup device units 20 (20R, 20G, 20B) are fixed to the respective emission ends of the color separation prism 18 after registration adjustment.

  That is, the three solid-state image pickup device units 20 are held so as to be adjustable by a holder 22 movably provided on the base plate 11 of the mounting adjustment jig 10 (Note that in FIG. Only one solid-state image sensor unit 20 is illustrated). The three solid-state imaging device units 20 are electrically connected to a controller 28 including an image processing circuit via a connector 24 and a flexible printed wiring board 26. Based on the R, G, and B image signals input from the three solid-state image sensor units 20, the controller 28 selects one of the R, G, and B image signals, or R, G, and B. An image signal obtained by combining any two or three of the image signals is generated and output to the monitor device 30.

  Then, an adjustment chart (not shown) is photographed, and the positions and angles of the three solid-state imaging device units 20 are adjusted so that the R image, the G image, and the B image are in focus based on the R, G, and B image signals. In addition, in order to prevent color misregistration (pixel misregistration) of the three R, G, and B images, the R and B solid-state image sensor units 20R and 20B are based on the G solid-state image sensor unit 20G. Adjust the position and angle.

  FIG. 2 shows the adjustment direction and angle of the solid-state image sensor unit 20, and the solid-state image sensor unit 20 held by the holder 22 is moved in the three-axis directions (X, Y, Z) by a six-axis adjuster (not shown). The position and the angles (Rx, Ry, Rz) around the three axes are adjusted.

  After performing the registration adjustment as described above, a pair of upper and lower spacers 32 each coated with a photo-curing adhesive is loaded into the gap between the emission end of the color separation prism 18 and the solid-state imaging device unit 20. Then, the solid-state imaging device unit 20 is fixed to the emission end of the color separation prism 18.

  In FIG. 3, the color separation prism 18 is composed of a first prism 18a, a second prism 18b, and a third prism 18c, and between the first prism 18a and the second prism 18b. An air gap 19 is provided, and the second prism 18b and the third prism 18c are joined at the contact surface.

  The solid-state imaging device units 20B, 20R, and 20G are bonded to the emission ends of the first prism 18a, the second prism 18b, and the third prism 18c through spacers 32, respectively.

  Next, a mounting structure of the solid-state image sensor will be described.

  4A and 4B are attachment process diagrams of the solid-state imaging device, and show a cross section taken along line AA in FIG.

  As described with reference to FIG. 1, registration adjustment of the solid-state imaging device unit 20 is performed using the attachment adjustment jig 10 or the like (FIG. 4A). Here, the solid-state image sensor unit 20 includes a solid-state image sensor 20a and an element seat 20b that holds the solid-state image sensor 20a. The solid-state image sensor 20a is bonded and fixed to the element seat 20b. .

  An inclined surface 21 is formed on the upper and lower peripheral portions of the surface of the element seat 20b of the solid-state imaging device unit 20 that faces the emission end of the color separation prism 18. That is, the reason why the solid-state imaging device 20a is held by the element seat 20b is to provide the device seat 20b (solid-state imaging device unit 20) with the inclined surface 21 instead of the solid-state imaging device 20a having no inclined surface at the periphery. . Therefore, when using a solid-state image sensor having an inclined surface at the peripheral edge, the solid-state image sensor does not have to be held by the element seat.

  On the other hand, the spacer 32 is made of a transparent member (glass in this embodiment) made of glass or close to the thermal expansion coefficient of glass, and the output end of the color separation prism 18 after registration adjustment and the element seat of the solid-state image sensor unit 20. The cross section is formed in a wedge shape so as to match the gap with the inclined surface 21 of 20b.

  Further, as shown in FIG. 5, the spacer 32 has fine irregularities formed on the surface (six surfaces in this embodiment). In this embodiment, the surface having the fine irregularities is a polished glass surface. The polished glass-like surface can be formed by grinding using a tool obtained by solidifying diamond powder with an adhesive. In addition, when using a spacer whose surface is mirror-finished, the surface should be polished and formed into a glass-like surface by a method (sand blasting method) or the like in which silica sand or gold sand is blown against the surface with compressed air. Can do.

  Further, in FIG. 5, 32 a is an adhesive surface that is bonded to the emission end of the color separation prism 18, and 32 b is an adhesive surface that is bonded to the inclined surface 21 of the element seat 20 b of the solid-state imaging element unit 20. , 32c are surfaces on which UV light is incident when the photocurable adhesive (ultraviolet (UV) curable adhesive) applied to the adhesive surfaces 32a, 32b of the spacer 32 is cured.

  After the surface of the spacer 32 is cleaned by ultrasonic cleaning or the like, a UV curable adhesive is applied to the bonding surfaces 32a and 32b. It has been found that even if the surface of the spacer 32 is a polished glass surface, the surface can be cleaned by ultrasonic cleaning or the like to obtain a clean surface with sufficient adhesive strength.

  As shown in FIG. 4A, the spacers 32 coated with the UV curable adhesive are inclined formed on the emission end of the color separation prism 18 after registration adjustment and the element seat 20b of the solid-state image sensor unit 20. It is inserted into the gap with the surface 21.

  Here, since the adhesion surfaces 32a and 32b of the spacer 32 are formed as polished glass surfaces, the spacer 32 smoothly follows the gap between the color separation prism 18 and the solid-state image sensor unit 20 that have been registered. The thickness of the UV curable adhesive can be made uniform. The UV curable adhesive preferably has a low viscosity so that the spacer 32 can move smoothly.

  Next, as shown in FIG. 4B, after the spacer 32 is loaded into the gap, UV light is irradiated from the side surface (side surface) 32c of the spacer 32 to cure the UV curable adhesive.

  Since the adhesion surfaces 32a and 32b of the spacer 32 are polished glass surfaces, the UV light incident from the side surface 32c is not regularly reflected by the adhesion surfaces 32a and 32b (that is, irregularly reflected), and the UV light is incident on the UV. The curable adhesive is evenly irradiated. Further, since the side surface 32c on which the UV light is incident is also a polished glass surface, the incident light is also diffused and uniformly irradiated onto the UV curable adhesive.

  In order to completely cure the UV curable adhesive, the solid-state image sensor unit 20 fixed to the color separation prism 18 may be removed from the mounting adjustment jig 10 and additionally irradiated with UV light at another place. . This is to increase the operating rate of the expensive mounting adjustment jig 10 or the like.

  Finally, by using the gap formed by the pair of spacers 32, the emission end face of the color separation prism 18 and the imaging surface of the solid-state imaging device unit 20 are cleaned. Seal with sealing material.

  In this embodiment, the six surfaces of the spacer 32 are polished glass surfaces. However, the present invention is not limited to this, and only two surfaces of the bonding surfaces 32a and 32b may be polished glass surfaces. In addition, in the case of a solid-state imaging device provided with an emitting end face (adhesive surface thereof) of the color separation prism 18 or an inclined surface 21 formed on the element seat 20b of the solid-state imaging element unit 20 (a solid-state imaging device not provided with an element seat) The inclined surface of the peripheral edge of the image sensor may be polished to be a glass-like surface.

  Furthermore, in this embodiment, the inclined surface is formed on the solid-state imaging device or the element seat side. However, the present invention is not limited to this, and an inclined surface may be formed on the peripheral edge on the emission end surface side of the color separation prism. .

FIG. 1 is a schematic view showing an example of an apparatus for attaching a solid-state imaging device to a color separation prism. FIG. 2 is a perspective view of the solid-state image sensor used to explain the adjustment direction and angle of the solid-state image sensor. FIG. 3 is a plan view showing the mounting structure of the solid-state imaging device according to the present invention. 4A and 4B are attachment process diagrams of the solid-state imaging device, and are cross-sectional views taken along line AA in FIG. FIG. 5 is a perspective view of a spacer according to the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Mounting adjustment jig, 18 ... Color separation prism, 20, 20R, 20G, 20B ... Solid-state image sensor unit, 20a ... Solid-state image sensor, 20b ... Element seat, 21 ... Inclined surface, 32 ... Spacer, 32a, 32b ... Adhesive surface

Claims (3)

An exit end of a color separation prism that separates subject light from the taking lens into a plurality of wavelength band components;
An inclined surface is formed on at least one peripheral portion of the solid imaging element or a surface of the element seat holding the solid imaging element facing the emitting end, and the emitting end of the color separation prism and the solid imaging element or element seat A transparent spacer having a wedge-shaped cross section is loaded in the gap formed between the two, and the contact surface between the emitting end and the spacer, and the contact surface between the solid-state imaging device or the element seat and the spacer are photocured. In the mounting structure of the solid-state image sensor bonded with an adhesive,
The at least one adhesive surface of the adhesive end surface of the color separation prism and the spacer and the adhesive surface of at least one of the adhesive surface of the solid-state imaging device or the element seat and the spacer have fine irregularities, respectively. A mounting structure for a solid-state imaging device, characterized in that the surface has a surface.   2. The mounting structure for a solid-state imaging device according to claim 1, wherein at least two adhesion surfaces of the spacer are surfaces having fine irregularities. 3. The mounting structure for a solid-state imaging device according to claim 1, wherein the surface having fine irregularities is a polished glass surface.

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