JP2006332114A - Connection substrate, semiconductor device, and method of manufacturing connection substrate - Google Patents

Abstract

An object of the present invention is to provide a connection substrate, a semiconductor device, and a method for manufacturing the connection substrate that can be miniaturized and can cope with the miniaturization of the terminal pitch of electronic components and circuit boards.
SOLUTION: A substrate body 13 in which a through hole 15 is formed, and a connection pin 17 disposed in the substrate body 13, and the connection pin is disposed in the through hole 15 and the surface direction of the substrate body 13 is provided. And a connecting portion 19A, 19B which is provided at both ends of the penetrating portion 18 and is bent so that an angle with respect to the penetrating portion 18 is substantially a right angle. .
[Selection] Figure 3

Description

  The present invention relates to a connection substrate, a semiconductor device, and a method for manufacturing the connection substrate, and more particularly to a connection substrate, a semiconductor device, and a method for manufacturing the connection substrate that electrically connect an electronic component and a circuit board.

  Conventionally, there is a connector as shown in FIG. 1 as an electrical connection between an electronic component and a circuit board such as a mother board.

  FIG. 1 is a perspective view of a connector, and FIG. 2 is a perspective view of an elastic contact. As shown in FIG. 1, the connector 100 includes a contact module 101 for connecting an electronic component and a circuit board, and a holder 102 having an opening 104 for disposing the contact module 101. Has been.

  The contact module 101 includes a module body 106 that is directly attached to the opening 104 of the holder 102 and an elastic contact 108 that is accommodated in the module body 106.

The elastic contact 108 is made of an elastic member and has a curved shape as shown in FIG. The elastic contact 108 has contact portions 109 at both ends thereof, and either one of an electronic component and a circuit board is connected to the contact portion 109 (see, for example, Patent Document 1).
JP-A-6-325810

  However, in the conventional connector 100, since the elastic contact 108 has a curved shape, the size of the contact module 101 is increased, and it is difficult to reduce the size of the contact module 101. .

  Therefore, it is difficult to reduce the arrangement pitch of the contact modules 101, and there is a problem that it is not possible to cope with the miniaturization of the terminal pitch of the electronic component and the circuit board.

  Therefore, the present invention has been made in view of the above-described problems, and can be miniaturized, and can be used for manufacturing a connection board, a semiconductor device, and a connection board that can cope with the miniaturization of terminal pitches of electronic components and circuit boards. It aims to provide a method.

  According to one aspect of the present invention, there is provided a connection board for electrically connecting an electronic component and a circuit board by a connection pin, the board having a substrate body in which a through hole is formed, and the connection pin includes: A through portion disposed in the through hole and extending in a direction orthogonal to the surface direction of the substrate body, and provided at both ends of the through portion, and bent so that an angle with respect to the through portion is substantially a right angle. And a connecting portion having a connecting portion.

  According to the present invention, the connection pins for connecting the electronic component and the circuit board are provided at the through part extending in the direction orthogonal to the surface direction of the board body, at both ends of the through part, and at the through part. The connection pin can be reduced in size by having a connection portion bent so as to be substantially perpendicular to the connection. Further, by downsizing the connection pins, it is possible to reduce the arrangement pitch of the connection pins, and it is possible to cope with the miniaturization of the terminal pitch of the electronic component and the circuit board.

  In addition, a metal layer that covers the surface of the substrate body in which the through hole is formed and that is at a ground potential is further provided, and a gap is formed between the connection portion and the metal layer. You may provide the 1st insulating material which insulates between. Thereby, it is possible to insulate between the substrate body provided with the metal layer and the connection pins.

  Furthermore, the second insulating material may be provided so as to cover the metal layers provided on both surfaces of the substrate body with the connection portion exposed. Thus, by providing the second insulating material, contact between the connection portion and the metal layer can be prevented, and a short circuit between the connection portion and the metal layer can be prevented.

  According to another aspect of the present invention, the substrate body has conductivity and is provided with a through hole, and the through portion is disposed in the through hole and extends in a direction perpendicular to the surface direction of the substrate body. And a connecting pin that is provided at both ends of the penetrating portion and is bent so that an angle with respect to the penetrating portion is substantially a right angle, and the conductive substrate body and the penetrating portion are insulated from each other And a substrate body preparation step of preparing the substrate body, comprising: a first insulating material that is electrically connected to the electronic component and the circuit board by the connection pins. A connection pin disposing step of disposing a connection pin in which the connection portion is not bent in the through hole so that the connection portion protrudes from both sides of the substrate body; and between the through portion and the substrate body The first insulating material A connecting substrate comprising: a first insulating material forming step to be formed; and a connecting portion bending step of bending the connecting portion so as to form a gap between the connecting portion and the substrate body. A manufacturing method is provided.

  According to the present invention, it is possible to form a connection pin that can be miniaturized, and to provide the connection pin on the board body with a narrow arrangement pitch to cope with the miniaturization of the terminal pitch of the electronic component and the circuit board.

  Further, a second insulating material is formed between the connecting pin arranging step and the connecting portion bending step so as to cover both surfaces of the conductive substrate body with the connecting portion exposed. Two insulating material forming steps may be further provided.

  By providing such a second insulating material forming step, contact between the conductive substrate body and the connection portion can be prevented, and a short circuit between the connection portion and the metal layer can be prevented.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the board | substrate for a connection which can be reduced in size and can respond to refinement | miniaturization of the terminal pitch of an electronic component and a circuit board, a semiconductor device, and a connection board can be provided.

Next, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 3 is a cross-sectional view of the semiconductor device according to the first embodiment of the present invention. In FIG. 3, X and X directions indicate the surface direction of the substrate body 13, and Y and Y directions indicate directions orthogonal to the X and X directions, respectively.

  As shown in FIG. 3, the semiconductor device 10 includes a connection substrate 11 and a semiconductor element 12 that is an electronic component, and the semiconductor element 12 is electrically connected to the connection substrate 11 via solder bumps 25. Connected configuration.

  The connection substrate 11 includes a substrate body 13, connection pins 17, and a first insulating material 21. The substrate body 13 includes a base material 14 having a plurality of through holes 15 and a metal layer 16. The base material 14 is plate-shaped. As a material of the base material 14, for example, an epoxy resin can be used. Moreover, the thickness M1 of the base material 14 can be 2 mm-3 mm, for example.

  FIG. 4 is an enlarged plan view of a connection substrate in a portion where connection pins are provided. In FIG. 4, the illustration of the metal layer 16 is omitted for convenience of explanation.

  As shown in FIG. 4, the through hole 15 has a quadrangular shape and is formed so as to penetrate the base material 14. The through hole 15 is for arranging the connection pin 17. The widths W1 and W2 of the through holes 15 can be set to 0.7 mm, for example. The arrangement pitch of the through holes 15 can be set to 1 mm, for example.

  The metal layer 16 is provided so as to cover the surface of the base material 14 on which the plurality of through holes 15 are formed. The metal layer 16 has a ground potential. The metal layer 16 can be formed by, for example, a plating method.

  FIG. 5 is a perspective view of the connection pin. Next, the connection pin 17 will be described with reference to FIGS. 3 and 5.

The connection pin 17 is provided at the penetrating portion 18 and at the end of the penetrating portion 18 and in a predetermined direction so that the angles θ ₁ and θ ₂ with respect to the penetrating portion 18 are substantially perpendicular (in the case of the present embodiment, FIG. 3 (right side of 3) and connection portions 19A and 19B. The connection pin 17 can be formed by, for example, bending both ends of a thin plate-like conductive member. As a material of the connection pin 17, for example, a metal such as Cu or Cu alloy can be used. The thickness M2 of the connection pin 17 can be set to, for example, 0, 125 mm. Further, the width W3 of the connection pin 17 can be set to 0.35 mm, for example.

  The through portion 18 is disposed in the through hole 15 via the insulating material 21, and extends in a direction orthogonal to the surface direction (X, X direction) of the substrate body 13. The through portion 18 is for electrically connecting the connection portion 19A and the connection portion 19B.

  The connecting portion 19A is provided at the end of the penetrating portion 18 located on the upper surface 14A side of the base material 14. A gap E <b> 1 is formed between the connection portion 19 </ b> A and the metal layer 16. The connecting portion 19A is for mounting the semiconductor element 12. The size of the gap E1 between the connection portion 19A and the metal layer 16 can be set to 0.1 mm, for example. Further, the length L1 of the connecting portion 19A can be set to 0.5 mm, for example.

  The connecting portion 19B is provided at the end of the penetrating portion 18 located on the lower surface 14B side of the base material 14. A gap E <b> 2 is formed between the connection portion 19 </ b> B and the metal layer 16. A circuit board such as a mother board (not shown) is connected to the connection portion 19B. The size of the gap E2 between the connection portion 19B and the substrate body 13 can be set to 0.1 mm, for example. Further, the length L2 of the connecting portion 19B can be set to 0.5 mm, for example.

  The connection pins 17 are mounted on the board body 13 by, for example, providing a groove portion for engagement in the board body 13 corresponding to the penetrating portion 18, and using the first insulating material 21 having an engaging projection on the penetrating portion 18. The connecting pin 17 provided with the first insulating material 21 is inserted, and the groove portion of the substrate body 13 and the protrusion of the first insulating material 21 are engaged with each other.

  As described above, the connection pin 17 has a very simple configuration in which both ends of a thin plate-like conductive member are bent, and the through portion 18 is not a curved shape. Is possible. Thereby, the connection pins 17 can be provided in the board body 13 with a narrow arrangement pitch, and the connection board 11 can be made compatible with the miniaturization of the terminal pitch of the electronic component and the circuit board.

  The first insulating material 21 is for insulating between the connection pins 17 and the substrate body 13, and is provided between the substrate body 13 corresponding to the through hole 15 and the through portion 18. For example, an epoxy resin can be used as the first insulating material 21.

  The semiconductor element 12 has a connection pad 23 (terminal) that is electrically connected to the connection substrate 11. The connection pad 23 is connected to the connection portion 19 </ b> A by the solder bump 25. As a material of the solder bump 25, for example, Sn—Pb solder, Zn—Ag—Cu solder or the like can be used.

  According to the present embodiment, the connection pin 17 can be miniaturized by adopting a very simple configuration in which both ends of the thin plate-like conductive member are bent. Further, by reducing the size of the connection pins 17, it is possible to provide the connection pins 17 with a narrow arrangement pitch on the board body 13, and the connection board 11 is made compatible with the miniaturization of the terminal pitch of the electronic component and the circuit board. be able to.

  In the present embodiment, the case where the metal layer 16 having the ground potential is provided on the substrate body 13 has been described as an example. However, the substrate body 13 itself is a metal plate such as Cu or Cu alloy, and the ground electrode is used. It is good. The present invention is also applicable to a substrate body that does not have the metal layer 16. In this case, the first insulating material 21 is not necessary.

  6 to 10 are diagrams showing manufacturing steps of the connection substrate according to the present embodiment. 6 to 10, the same components as those of the connection substrate 11 described in FIG.

  With reference to FIGS. 6-10, the manufacturing method of the board | substrate 11 for a connection of this Embodiment is demonstrated. First, as shown in FIG. 6, a plurality of through holes 15 are formed in the base material 14. The through hole 15 can be formed by, for example, a laser or a drill. In addition, for example, by injection molding using a mold corresponding to the shape of the base material 14 in which the through hole 15 is formed, resin is introduced into the mold to form the base material 14 in which the through hole 15 is formed. May be. The shape of the through hole 15 can be a square shape, for example. The arrangement pitch of the through holes 15 can be set to 1 mm, for example.

  Next, as shown in FIG. 7, a metal layer 16 is formed so as to cover the surface of the base material 14 in which the through holes 15 are formed. The metal layer 16 is formed so as to cover the inner wall of the through hole 15. Thereby, the board | substrate main body 13 by which the connection pin 17 is arrange | positioned is manufactured (board | substrate main body preparation process). As the metal layer 16, for example, a Cu plating film formed by an electroless plating method can be used.

  Next, as shown in FIG. 8, the first insulating material 21 is formed so as to cover only the through portion 18 of the connection pin 17 (first insulating material forming step). As the connection pin 17, for example, a conductive member made of a thin plate metal can be used. Thus, by making the connecting pin 17 into a plate shape, the connecting pin 17 can be easily bent in the connecting portion bending step described later. Further, the solder bumps 25 can be easily disposed on the connection portion 19A. For example, an epoxy resin can be used as the first insulating material 21.

  Subsequently, as shown in FIG. 9, the connection pins 17 provided with the first insulating material 21 are inserted into the through holes 15 and the connection pins 17 are attached to the substrate body 13 (connection pin arrangement step). At this time, the connection portions 19 </ b> A and 19 </ b> B are protruded from the substrate body 13.

Next, as shown in FIG. 10, the connecting portions 19 </ b> A and 19 </ b> B are moved in a predetermined direction (in the present embodiment, on the right side of FIG. 10) so that the angles θ ₁ and θ ₂ with respect to the penetrating portion 18 are substantially perpendicular. The connection substrate 11 is manufactured by bending (connection portion bending step).

  At this time, a gap E1 is formed between the metal layer 16 formed on the upper surface 14A of the base material 14 and the connection portion 19A so that the metal layer 16 and the connection portion 19A do not come into contact with each other and are short-circuited. For the same reason, a gap E2 is formed between the metal layer 16 formed on the lower surface 14B of the base material 14 and the connection portion 19B. The size of the gaps E1 and E2 formed between the connection portions 19A and 19B and the metal layer 16 can be set to 0.1 mm, for example.

  According to the manufacturing method of the connection substrate of the present embodiment, the connection pins 17 that can be reduced in size can be formed, and the connection pins 17 are provided on the substrate body 13 at a narrow arrangement pitch, and the connection substrate 11 is made electronic. It is possible to cope with miniaturization of terminal pitches of components and circuit boards.

(Second Embodiment)
FIG. 11 is a cross-sectional view of the semiconductor device of the second embodiment. In FIG. 11, the same components as those of the semiconductor device 10 described in the first embodiment are denoted by the same reference numerals.

  As shown in FIG. 11, the semiconductor device 30 includes a connection substrate 31 and a semiconductor element 12, and the semiconductor element 12 is electrically connected to the connection substrate 31 through solder bumps 25. It is said that.

  The connection substrate 31 includes a substrate body 13, connection pins 17, a first insulating material 21, and second insulating materials 33 and 34. That is, the connection substrate 31 has a configuration in which the second insulating materials 33 and 34 are further provided in addition to the configuration of the connection substrate 11 described in the first embodiment.

  The second insulating material 33 is provided so as to cover the metal layer 16 formed on the upper surface 14A of the base material 14 with the connection portion 19A exposed. As the second insulating material 33, for example, an insulating sheet obtained by processing tetrafluoroethylene resin (PTFE) into a sheet shape can be used. Moreover, as the insulating sheet using the PTFE, a sheet not subjected to heat treatment is desirable. In this way, by using an insulating sheet (base material: PTFE) that has not been heat-treated, the insulating sheet is heated on the upper surface of the substrate body 13, and then the insulating sheet is heated, The adhesion between the two can be improved. The thickness M3 of the second insulating material 33 can be set to 40 μm, for example.

  As described above, the second insulating material 33 is provided so as to cover the metal layer 16 formed on the upper surface 14A of the base material 14 with the connection portion 19A exposed, and thus disposed on the connection portion 19A. It is possible to prevent electrical connection between the connection portion 19A and the metal layer 16 by the solder bump 25, and it is possible to prevent a short circuit between the connection portion 19A and the metal layer 16.

  The second insulating material 34 is provided so as to cover the metal layer 16 formed on the lower surface 14B of the base material 14 with the connection portion 19B exposed. As the second insulating material 34, an insulating material similar to the second insulating material 33 can be used. The thickness M4 of the second insulating material 34 can be set to 40 μm, for example.

  Thus, by providing the second insulating material 34 that covers the metal layer 16 formed on the lower surface 14B of the base material 14 and exposes the connection portion 19B, when solder is disposed on the connection portion 19B, It is possible to prevent the connection portion 19B and the metal layer 16 from being electrically connected by solder, and to prevent a short circuit between the connection portion 19B and the metal layer 16.

  According to the present embodiment, the second insulating materials 33 and 34 are provided so as to cover the metal layer 16 formed on the both surfaces 14A and 14B of the base material 14 with the connection portions 19A and 19B exposed. Thus, the connection portions 19A and 19B and the metal layer 16 can be prevented from being short-circuited. The second insulating materials 33 and 34 may be provided only between the metal layer 16 facing the connection portions 19A and 19B and the connection portions 19A and 19B.

  12 and 13 are diagrams showing a manufacturing process of the connection substrate according to the second embodiment. 12 and 13, the same components as those of the connection substrate 31 of the present embodiment are denoted by the same reference numerals.

  Next, with reference to FIG.12 and FIG.13, the manufacturing method of the connection board | substrate 30 of 2nd Embodiment is demonstrated.

  First, the steps of FIGS. 6 to 9 (substrate preparation step, connection pin arrangement step, and first insulating material forming step) described in the first embodiment are performed to obtain the first insulating material. A connection pin 17 is disposed in the through hole 15 via 21.

  Next, as shown in FIG. 12, the 2nd insulating materials 33 and 34 made into the sheet form are prepared. As the 2nd insulating layers 33 and 34 made into the sheet form, the insulating sheet (base material: PTFE) which is not heat-processed can be used, for example.

  Subsequently, as shown in FIG. 13, the connection portion 19 </ b> A is passed through the sheet-like second insulating material 33, and the second insulating material 33 is disposed on the upper surface of the substrate body 13, and the sheet-like shape is provided. The connecting portion 19B is penetrated through the second insulating material 34, and the second insulating material 34 is disposed on the lower surface of the substrate body 13 (second insulating material forming step).

  When an insulating sheet (base material: PTFE) that is not heat-treated is used as the second insulating layers 33 and 34, the second insulating layers 33 and 34 disposed on the substrate body 13 may be heat-treated. As described above, the adhesion between the second insulating materials 33 and 34 and the substrate body 13 can be improved by heating the second insulating materials 33 and 34.

  Thereafter, the connection substrate 31 is manufactured by performing the same process (connection partial bending process) as that of FIG. 10 described in the first embodiment.

  According to the manufacturing method of the connection substrate of the present embodiment, the connection pins 17 can be provided on the substrate body 13 with a narrow arrangement pitch, and can cope with the miniaturization of the terminal pitch of the electronic component and the circuit board, The connection portions 19A, 19B and the metal layer 16 are insulated from each other, so that the connection portions 19A, 19B and the metal layer 16 can be prevented from being short-circuited.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible. The present invention can also be applied to a connection substrate having a multilayer wiring structure in which an insulating layer and a wiring pattern are sequentially laminated inside the substrate body 13.

  INDUSTRIAL APPLICABILITY According to the present invention, the present invention can be applied to a connection substrate, a semiconductor device, and a method for manufacturing a connection substrate that can be miniaturized and can cope with finer pitches of electronic components and circuit boards.

It is a perspective view of a connector. It is a perspective view of an elastic contact. 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present invention. It is the top view to which the connection board | substrate of the part in which the connection pin was provided was expanded. It is a perspective view of a connection pin. It is FIG. (The 1) which showed the manufacturing process of the board | substrate for a connection of this Embodiment. It is the figure (the 2) which showed the manufacturing process of the board | substrate for a connection of this Embodiment. It is FIG. (The 3) which showed the manufacturing process of the board | substrate for a connection of this Embodiment. It is FIG. (The 4) which showed the manufacturing process of the board | substrate for a connection of this Embodiment. It is FIG. (5) which showed the manufacturing process of the connection board | substrate of this Embodiment. It is sectional drawing of the semiconductor device of 2nd Embodiment. It is FIG. (The 1) which showed the manufacturing process of the board | substrate for a connection of this Embodiment. It is the figure (the 2) which showed the manufacturing process of the board | substrate for a connection of this Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,30 Semiconductor device 11,31 Connection board 12 Semiconductor element 13 Substrate body 14 Base material 14A Upper surface 14B Lower surface 15 Through hole 16 Metal layer 17 Connection pin 18 Through portion 19A, 19B Connection portion 21 First insulating material 23 Connection pad 25 solder bumps 33 and 34 the second insulating material E1, E2 gap L1, L2 length theta _1, theta ₂ angle M1~M4 thickness W1~W3 width

Claims (8)

A connection board for electrically connecting an electronic component and a circuit board by connection pins,
Having a substrate body in which a through hole is formed;
The connection pins are disposed in the through holes and extend in a direction perpendicular to the surface direction of the substrate body, and are provided at both ends of the through parts, and the angle with respect to the through parts is substantially a right angle. And a connecting portion bent so as to become a connecting substrate. Covering the surface of the substrate body in which the through hole is formed, and further comprising a metal layer having a ground potential,
2. The connection substrate according to claim 1, wherein a gap is formed between the connection portion and the metal layer, and a first insulating material is provided for insulating between the metal layer and the through portion. .   The connection substrate according to claim 1, wherein a second insulating material is provided between the metal layer facing the connection portion and the connection portion.   4. The connection board according to claim 3, wherein the second insulating material covers metal layers provided on both surfaces of the board body with the connection portion exposed. 5.   The connection board according to claim 1, wherein the connection pin is configured by bending a plate-shaped conductive member. A connection substrate according to any one of claims 1 to 5,
A semiconductor device comprising: a semiconductor element electrically connected to one connection portion provided on the connection substrate through solder. A substrate body having conductivity and having a through hole formed therein;
A penetrating portion disposed in the through hole and extending in a direction perpendicular to the surface direction of the substrate body, and provided at both ends of the penetrating portion, and is bent so that an angle with respect to the penetrating portion is substantially a right angle. A connecting pin having a connected portion;
A first insulating material that insulates between the conductive substrate body and the penetrating portion;
A method of manufacturing a connection board for electrically connecting an electronic component and a circuit board by the connection pins,
A substrate body preparation step of preparing the substrate body;
A connection pin disposing step of disposing a connection pin in which the connection portion is not bent in the through hole so that the connection portion protrudes from both surfaces of the substrate body;
A first insulating material forming step of forming the first insulating material between the penetrating portion and the substrate body;
A method of manufacturing a connection board, comprising: a connection part bending step of bending the connection part so that a gap is formed between the connection part and the substrate body. A second insulating material is formed between the connecting pin arranging step and the connecting portion bending step so as to cover both surfaces of the conductive substrate body with the connecting portion exposed. The method for manufacturing a connection substrate according to claim 7, further comprising an insulating material forming step.

Images