JP2006308351A - Electronic component inspection method and electronic component inspection system using the same - Google Patents

Abstract

An electronic component inspection method for increasing the degree of freedom in product inspection and reducing the cost required for the inspection, and an electronic component inspection system using the same.
A step of sequentially imaging a plurality of electronic components mounted on a carrier tape at regular intervals;
A step of storing the image data of the plurality of electronic components captured on a recording medium, a step of displaying the image data of the plurality of electronic components stored on the recording medium on a display device, and the display on the display device A step of recording and saving inspection result data including symbols for identifying individual electronic components in which defects are detected by visually observing individual images of a plurality of electronic components, and based on the inspection result data recorded and stored, And searching for an electronic component in which a defect is detected from a plurality of electronic components mounted on the carrier tape.
[Selection] Figure 8

Description

  The present invention relates to an electronic component inspection method and an electronic component inspection system using the same. In particular, the present invention relates to an inspection method for inspecting scratches and dirt on an electronic component held on a carrier tape before shipment, and an electronic component inspection system using this method as a final process of assembling and manufacturing the electronic component.

  As an electronic component, for example, in order to ensure electrical performance and quality in a connector assembly manufacturing process, automation for inspecting dimension measurement, lead bending, and the like using a photographed image has been put into practical use from an early stage.

  For example, Patent Document 1 discloses an invention of an inspection device for a film carrier tape for mounting electronic components as schematically shown in FIG. As shown in FIG. 1, the inspection apparatus includes an unwinding unit 200 for unwinding a film carrier tape (hereinafter simply referred to as “carrier tape”) 100 as shown in FIG. 2 on which electronic components to be inspected are mounted. Have.

  The carrier tape 100 is unwound at the timing of the sprocket hole 101 of the carrier tape 100 from the unwinding portion 200. With respect to each piece 102 on the unwound carrier tape 100, the image processing unit 201 images each imaging region 103 and performs image processing.

  By the image processing in the image processing unit 201, the wiring pattern defect of each piece of the carrier tape 100 is detected and the size of the defective part is calculated. Next, with respect to the defect detected by the image processing unit 201, the defect confirmation unit 203 discriminates between an intrinsic defect and a pseudo defect. The defect marking unit 204 applies a defect mark to the defective piece based on the defect signal determined by the defect confirmation unit 203, and the carrier tape 100 that has been inspected is wound up by the winding unit 205.

  The conveyance control unit 206 controls conveyance of the carrier tape 100 based on communication data from the image processing unit 201, the defect confirmation unit 203, and the defect marking unit 2044. In this way, it is possible to automate the inspection of electronic components using the photographed image.

  However, in the appearance inspection of the final product such as dirt and scratches, it has been difficult to apply automatic inspection as described in Patent Document 1. In other words, the final product held on the carrier tape stored on a reel or the like was visually inspected one by one using a stereomicroscope.

  The conventional method for visual inspection will be further described with reference to the drawings. FIG. 3 is a flowchart of a processing procedure of a conventional method for performing an appearance inspection. As shown in FIG. 4, an electronic component is assembled and manufactured by the component assembling apparatus 1 (step S1), and the electronic component is mounted on each frame of the carrier tape 100. The carrier tape 100 is placed on the reel 2 (FIG. 4). It is wound up (step S2).

  Here, as the carrier tape 100, for example, the one shown in FIG. 5 is used. In FIG. 5, the carrier tape 100 is formed of a transparent body and includes a plurality of containers 110 along the tape length at regular intervals. Sprocket holes 101 for unwinding and winding from the reels on both sides or one side of the carrier tape 100 are formed.

  Electronic parts assembled and manufactured in each of the containers 110 are accommodated by an automatic machine. In the case of small parts, the electronic parts are accommodated in the container 110 by suction from a hole (not shown) opened in the bottom surface of the container 110 in the automatic machine. After the electronic component is accommodated in the container 110, a transparent film 111 serving as a lid is placed.

  FIG. 6 shows a schematic view (FIG. 6A) and a cross-sectional view (FIG. 6B) of the carrier tape 100 in a state where the electronic component 10 is accommodated in each container 110 as seen from above. The electronic component 10 accommodated in the container 110 has a lead terminal 11, a fixed terminal 12, and the like.

  FIG. 7 illustrates a conventional component inspection method that is performed to perform an appearance inspection of the electronic component 10 accommodated in the container 110 of the carrier tape 100 as shown in FIG. 6, select defective products, and replace them with non-defective products. It is a figure to do.

Accommodates one reel 2 ₁ wound carrier tape 100 which is wound, the carrier tape 100 is pulled out therefrom, is winding accommodated in the other of the reel 2 _2. Since the shape of the connector as an electronic component is small, for example, about 5 mm ² , the inspector 20 uses the high-magnification stereomicroscope 21 to inspect the appearance of the electronic component 10 between the reels 2 ₁ and 2 _2. (FIG. 3: Step S3).

Next, in the appearance inspection, when it is determined that the electronic component 10 is scratched, dirty, or dusty on the appearance, the inspector 20 replaces it with a good electronic component 10 (step S4). The product is shipped (step S5).
JP 2005-5619 A

  In the conventional electronic component inspection method as described above, the appearance inspection using a microscope is performed, the defective product is selected, and the non-defective product is replaced. That is, while looking at the product with a microscope, the product was sent with both hands and the product reel was wound up. When a defective product was found, a paper tape or the like was affixed to the defective part as a mark, and the contents were clearly specified with magic or the like as necessary. Further, in the visual inspection using such a conventional microscope, since the carrier tape 100 runs with an inspection time of 0.5 to 1 second per piece, there is a problem that some people are drunk and not suitable for the inspection. .

  Furthermore, in the case of electronic parts such as connectors that have a large production volume, the total inspection of the visual inspection by the microscope 21 requires a lot of manpower. For this reason, in the total man-hours until product shipment, the ratio of time and cost in the inspection work must be increased.

  Accordingly, it is an object of the present invention to provide an electronic component inspection method and an electronic component inspection system using the same that solve such disadvantages, increase the degree of freedom in product inspection, and reduce the cost required for the inspection.

  The basic aspect of the electronic component inspection method that achieves the above-described object of the present invention includes a step of sequentially imaging a plurality of electronic components placed on a holding member, and image data of the plurality of captured electronic components. A step of storing in a recording medium; a step of displaying image data of a plurality of electronic components stored in the recording medium on a display device; and a visual observation of individual images of the plurality of electronic components displayed on the display device. Recording and storing inspection result data including a symbol for identifying an individual electronic component in which a defect has been detected, and a plurality of electronic components placed on the holding member based on the recorded and stored inspection result data. And a step of searching for an electronic component in which a defect is detected.

  According to a first aspect of the electronic component inspection method for achieving the above-described object of the present invention, a step of sequentially imaging a plurality of electronic components mounted on a carrier tape at regular intervals, and a step of A step of storing image data on a recording medium, a step of displaying image data of a plurality of electronic components stored on the recording medium on a display device, and an individual image of the plurality of electronic components displayed on the display device. A step of recording and storing inspection result data including symbols for identifying individual electronic components in which defects are detected by visual observation, and a plurality of electronic devices mounted on the carrier tape based on the inspection result data stored and stored And a step of searching for an electronic component in which a defect is detected from the component.

  According to a second aspect of the electronic component inspection method for achieving the above-mentioned object of the present invention, a step of sequentially imaging a plurality of electronic components mounted on a carrier tape at a first location; Storing the image data of the electronic component on the recording medium, and displaying the image data of the plurality of electronic components stored on the recording medium on the display device at the second location; and A step of recording and storing inspection result data including symbols for identifying individual electronic components in which defects are detected by visually observing individual images of the plurality of displayed electronic components; and further, the first location Performing a step of searching for an electronic component in which a defect is detected from a plurality of electronic components mounted on the carrier tape, based on the inspection result data recorded and stored. And butterflies.

  According to a third aspect of the electronic component inspection method for achieving the above-mentioned object of the present invention, in the second aspect, the step executed in the second place divides the plurality of electronic components into a predetermined number. It is characterized by being executed in parallel.

  According to a fourth aspect of the electronic component inspection method for achieving the object of the present invention, in the first or second aspect, the carrier tape is wound around a reel and accommodates the plurality of electronic components at the predetermined interval. The symbol for individually identifying the plurality of electronic components is a lot number of the corresponding electronic component.

  An electronic component inspection system that achieves the above-described object of the present invention includes, as a first aspect, a first system that assembles an electronic component, and a defect in the assembled electronic component that is independent of the first system. A second system for inspecting, and a third system for replacing an electronic component in which a defect has been detected by the second system with a non-defective product, wherein the first system carries a plurality of assembled electronic components as a carrier Mounted on a tape in the order of lot numbers, images the plurality of electronic components in order of the lot numbers, stores image data of the plurality of imaged electronic components in a recording medium, and the second system stores data on the recording medium. Display the stored image data of multiple electronic components on the display screen to enable visual observation for detection of defects, and to detect defects detected by visual observation. A number for identifying a certain electronic component is recorded and stored, and the third system detects a defect from a plurality of electronic components mounted on the carrier tape based on the number for identifying the defective electronic component recorded and stored. It is possible to search for detected electronic components and replace them with non-defective products.

  According to a second aspect of the electronic component inspection system that achieves the above-described object of the present invention, in the first aspect, the second system is independent from the first system. It is performed by arranging the second system.

  The program executed in the electronic component inspection system that achieves the above-described problems of the present invention causes image data to be read from a drive device of a recording medium that records individual images of a plurality of electronic components mounted on a carrier tape, and A plurality of thumbnail images included in the read image data are sequentially displayed on the display device, and an enlarged electronic component corresponding to the thumbnail image displayed on a predetermined one of the plurality of thumbnail images displayed on the display device is displayed. An image corresponding to the defect information input to the display device corresponding to the defect information input as a result of visual observation of the image displayed together with the thumbnail image and displayed on the display device. The lot number of the part is displayed.

  The features of the present invention will become more apparent from the following description of embodiments according to the drawings.

  According to the present invention, since visual observation is performed on the display screen, there is no difficulty in inspection by an operator. Further, it is easy to move the image data obtained by imaging the electronic component, and the inspection place is not limited to the place where the component assembling apparatus is placed. Thus, a favorable selection of inspection costs for the location and the worker is possible.

  Embodiments of the present invention will be described below with reference to the drawings. The embodiment is for understanding the present invention, and the technical scope of the present invention is not limited thereto.

  FIG. 8 is a flowchart for explaining the procedure of the electronic component inspection method according to the present invention. 9A and 9B are diagrams for explaining an electronic component inspection system according to the present invention.

  In FIG. 8, the procedure of the electronic component inspection method includes an imaging step P1, an inspection step P2, and a component replacement step P3 following the manufacturing step P0, and particularly has an aspect of the present invention in the imaging step P1 and the inspection step P2.

  The manufacturing process P0 is an existing method in which electronic components are assembled and manufactured by a component assembling apparatus (step S11), and the manufactured electronic components are mounted on a carrier tape at regular intervals and wound in a reel shape (step S11). S12).

  Next, the electronic components mounted on the carrier tape wound in a reel shape are respectively imaged in the imaging process P1 (step S13), and the captured image data is stored (step S14).

FIG. 9A is a diagram illustrating an imaging process P1 in the electronic component inspection system. In Figure 9A, the carrier tape 100 is wound from the reel 2 ₁ unwound is unwound and wound on the take-up reel 2 ₂ opposite in synchronism with the imaging speed.

Imaging cameras 30 and 30 ₁ are disposed between the unwinding reel 2 ₁ and the take-up reel 2 ₂ . Imaging camera 30 ₁ is provided when photographing the electronic component mounted on the carrier tape 100 front and rear surfaces at the same time.

Photographed image data of the electronic component taken by the imaging camera 30, 30 ₁ is stored is transmitted to the computer 31. Here, there are various methods for storing photographed image data.

For example, the imaging camera 30, 30 _1, to obtain an image of the microscope screen equal to or greater than the high resolution can be realized high image quality using a color camera and a macro lens megapixel.

Considering the capacity of the captured image data, assuming a typical electronic component, for example, a component with a size of 5 mm ² , the number of products per reel is around 4,000, so the data of a normal megapixel camera is a bit. When saved in the map format, the storage capacity is about 10 gigabytes and the recording medium to be saved is limited.

  Also, considering the daily production volume, a huge amount of recording media is used, which is not preferable from the viewpoint of cost reduction. Therefore, in order to maintain sufficient quality as the inspection image quality and obtain compressed image data, the image is saved by trimming unnecessary portions of the shooting screen and compressing JPEG data by 50 to 80%.

  As a result, each part image can be reduced to about 20 to 30 kilobytes, and a photographed image and its thumbnail (simple image list) are stored on a recording medium 33 such as a single recordable compact disc (CD-R). Even so, it is possible to record and store more than 8,000 images for two reels.

  When the captured image data of the imaging process P1 is stored (step S14), a part identification number is assigned and stored for each screen used for image inspection and product replacement work performed in the next inspection process.

  The above-described image shooting (step S13) and image data storage (step S14) processes are executed by a predetermined program.

  FIG. 9B is a configuration example when a personal computer (PC) is used as the computer 31.

  In FIG. 9B, the imaging process P1 is executed by the CPU 310 executing the program installed in the hard disk 312.

  The captured image data captured by the imaging camera 30 is buffer-stored in the main memory 314 through the interface I / F.

  The captured image data buffered in the main memory 314 is given a thumbnail and a screen number corresponding to the shooting order by the program. The captured image data is subjected to predetermined trimming and image adjustment, and updated and written in the main memory 314.

  When a predetermined number of images subjected to image processing are temporarily buffered in the main memory 314 in the above example with respect to the photographed image data, the drive device 311 stores the recording medium 33 as one file. For example, writing is performed on a CD-R. Instead of CD-R, any recording medium such as DVD (Digital Versatile Disc), MO (Magnetic Optical Disc), HDD, etc. can be used. Therefore, the following description will be made simply as the recording medium 33.

  Similarly, the one file can be stored in the hard disk 312 together with recording on the recording medium 33 or in place of recording on the recording medium 33.

  Next, returning to the flow of FIG. 8, the process of the inspection process P2 is performed. Here, as a feature of the present invention, the processing of the inspection process P2 can be executed at a remote place regardless of whether it is in Japan or overseas, for the place where the execution up to the imaging process P1 is performed. That is, the equipment for executing the inspection process P2 may be an equipment capable of displaying the captured image data stored on the recording medium 33 or the hard disk 312. Therefore, an area where the inspection process P2 can be executed at a low cost is selected. be able to.

  FIG. 10A shows an example in which the place (inspection place) 101 where the inspection process P <b> 2 is performed is placed at a place different from the part assembly factory 100.

  The photographed image data is sent from the component assembly factory 100 to the inspection laboratory 101 (A). Here, as a method of sending the photographed image data to the inspection laboratory 101, when the photographed image data is stored in the recording medium 33, the recording medium 33 itself is sent to the inspection laboratory 101 by mail or the like. When the photographed image data is stored in the hard disk 312, the data itself can be sent to the laboratory 101 side by communication means such as the Internet.

  FIG. 11 is a block diagram illustrating a configuration example of the computer 40 that executes the inspection of defective products using the image data from the component assembly factory 100. The configuration is basically the same as that of the personal computer 31 placed in the assembly factory 100 shown in FIG. 9B.

  When the recording medium 33 is sent to the inspection laboratory 101 by mail or the like, the photographed image data is read by the drive device 401 and the photographed image data read by the CPU 400 is temporarily stored in the main memory 404. Further, when photographed image data is received through the modem 403 by communication means such as the Internet, the CPU 400 temporarily stores it in the main memory 404 as well.

  A program for controlling the execution of the inspection process P2 according to the present invention is installed in the hard disk 402. This program is executed and controlled by the CPU 400, and the processing steps S15 to S18 of the inspection process P2 are executed.

  The image data temporarily stored in the main memory 404 is read and displayed on the display device 41. Here, the configuration example of the screen displayed on the display device 41 can be understood from the example shown in FIG.

  In the screen displayed on the display device 41 shown in FIG. 12, a thumbnail image display area 50, an enlarged display area 51 for displaying one enlarged image of the thumbnail image, and an enlarged image of the display area 51 are visually observed by an inspector. , A defect information display area 52 for displaying information such as the identification number of the electronic component where the defect is found and the type of the defect.

  The thumbnail image in the display area 50 is shifted leftward at the speed of the required inspection time for one electronic component, and a new thumbnail is displayed. In the enlarged display area 51, an enlarged image of the thumbnail corresponding to the electronic component 10 to be inspected is displayed (step S15).

  Normally, each time a new thumbnail is displayed, a new enlarged image is displayed in the enlarged display area 51 correspondingly. In FIG. 12, the container 110 and the electronic component 10 housed in the container 110 are displayed in the enlarged display area 51.

  The inspector 20 visually observes the enlarged image displayed on the display device 41 and determines the presence or absence of a defect (step S16). If it is determined that there is a defect, an identification number for identifying the defective product is registered in the defect information display area 52 as a mark (step S17).

In FIG. 12, the identification number 50 ₁ of the parts are displayed below the thumbnail display of the corresponding parts. Further, by sliding the slide bar 50 _2, thumbnail display is moved, by instructing any thumbnail enlarged image corresponding to the enlarged image display area 51 is displayed.

  13A and 13B show examples of enlarged images when it is determined that there is a defect. In the example shown in FIG. 13A, it is observed that a thread-like foreign material (55) is attached to the upper left. Moreover, in the example shown to FIG. 13B, it is observed that the metal scrap (56) has adhered to the upper right. In addition, FIG. 12, FIG. 13A, and FIG. 13B are the display images which imaged the front and back of the same electronic component.

Regarding the defects (defective products) observed in this way, the mark registration of the defective products displayed in the defect information display area 52 is performed as follows. Each thumbnail corresponding to the enlarged image has a unique identification number 50 ₁ . Therefore, the inspector gives an instruction on the thumbnail image corresponding to the electronic component of the enlarged image displayed with a mouse or the like (not shown), and also inputs the defect type identification information. As a result, the corresponding identification numbers 50 ₁ are sequentially displayed in the defect information display area 52.

At this time, information indicating that there is a defect and identification information of the type of the defect are registered in the captured image data of the electronic component temporarily stored in the main memory 404 corresponding to the identification number 50 ₁ .

  When the inspection is completed in this way, the inspection result data is stored in the recording medium 33 or the hard disk 402 (step S18).

  The stored inspection result data is returned to the component assembly factory 100 as inspected data (see FIGS. 10A and 10B). The method for returning the inspected data to the component assembly factory 100 is performed in the same manner as the method in which the image data is first sent from the component assembly factory 100 to the inspection laboratory 101.

  Next, based on the inspection result data returned to the parts assembly factory 100, the replacement defective product is exchanged using the carrier tape take-up device (step S19), and the series of operations is completed. That is, as shown in FIGS. 7 and 9A, the carrier tape take-up device is configured to take up the carrier tape unwound from one reel to the other reel, and is registered in the defect information display area 52. The winding operation is controlled to stop at the identification number position of the thumbnail in which the defect is pointed out. Therefore, the worker replaces the defective electronic component at the stopped position with an electronic component having no defect, and completes the replacement work by restarting the winding.

  As described above, according to the present invention, since the captured image data can be easily moved, the inspection process P2 can be easily separated from the component assembly process P0. Therefore, it is possible to construct an inspection system for inspecting parts by visual inspection at an economically preferable inspection place.

  Here, in the description of the above-described embodiment, the description has been made mainly on performing the inspection process P2 at a place different from other processes. However, the application of the present invention is not limited to such a case. The visual inspection process is performed in units of 0.5 to 1 second per part. Therefore, as described above, approximately 4,000 images per reel, and therefore, 4,000 electronic component images are accommodated. As a result, the visual inspection for one reel takes 0.5 to 1 hour.

FIG. 10B shows an embodiment configuration that can shorten the inspection time. Parts assembly plant 100 a plurality of n laboratories 101 ₁ of the same photographic image data A from 101 ₂ sends the parallel · · · 101 _n. At this time, the inspection object is divided into a plurality of n inspection places 101 ₁ , 101 ₂ ,... 101 _n , and the inspection process P2 is performed only for the divided ranges placed at the respective inspection places. Execute. As a result, the inspection time can be reduced to a few minutes at the inspection laboratory.

  In the above description, a connector is taken as an example of an electronic component. However, the application of the present invention is not limited to this, and the present invention can also be applied to general electronic components.

  Here, in the above-described embodiment, the example in which the electronic component is mounted on the carrier tape 100 has been described. However, the application of the present invention is not limited to such an embodiment.

  That is, instead of the carrier tape 100, for example, as shown in FIG. 14A, a transparent cylindrical magazine stick 100A is prepared. The magazine stick 100A is formed in a hollow shape as shown in the right sectional view of FIG. 14A, and is formed so that the electronic components 9A can be sequentially inserted and held in the hollow.

  Accordingly, the electronic component 10A inserted and held in a transparent cylindrical shape can be sequentially captured by the camera 30 as described with reference to FIG. 9A. This captured image of the electronic component 10A can be the object of the visual inspection described above.

  FIG. 14B is an example in which the electronic component 10B is held on the radial tape 100B. The radial tape 100B has a configuration in which a terminal leg of the electronic component 10B is sandwiched and held between the base tape 100a and the holding tape 100b. In this way, the radial tape 100B is normally stored in a folded state with the plurality of electronic components 10B being held at regular intervals. The sprocket hole 101 formed in the radial tape 100B is fed out when the electronic component 10B is inserted into a necessary circuit board.

  Even when the electronic component 10B is held on the radial tape 100B as described above, the electronic component 10B can be imaged by the camera 30 as described above with reference to FIG. 9A. This captured image of the electronic component 10B can be the object of the visual inspection described above. FIG. 14C is an example in which the electronic component 10C is held on the transparent tray 100C. In FIG. 14C, as shown in the cross section at the upper part and the left part, the transparent tray 100C is formed with embosses 100c so that the electronic components 10C can be held vertically and horizontally.

  Therefore, with the electronic component 10C placed on the emboss 100c, the transparent tray 100C is moved in the X and Y directions, and the individual electronic components 10C are positioned on the camera 30 as described with reference to FIG. 9A. A captured image of 10C can be obtained. This captured image of the electronic component 10 </ b> C can be the target of the visual inspection described above.

  Further, FIG. 14D shows an example in which the terminal members 10D are connected and formed in a chain at regular intervals by the same member 100D. The chain-shaped terminal member 10 </ b> D can be connected to the conductive portion 104 </ b> A of the electric wire 104 with a crimping machine (not shown). Even when the state of the chain-shaped terminal member 10D is visually inspected, the chain-shaped terminal member 10D is sent to the camera position through the sprocket hole 101 of the member 100D, and imaging can be performed. This captured image of the terminal member 10D can be the object of the visual inspection described above.

  As described above, according to the present invention, the cost and time required for the inspection process can be reduced. Further, visual inspection can be performed on the screen of the display device without using a microscope, and it is possible to reduce fatigue associated with the inspection work of the inspector. Therefore, it is possible to make an advantageous operation in the production of small parts, which greatly contributes to the industry.

It is a figure explaining the invention described in patent document 1. FIG. It is a figure explaining a film carrier tape. It is a flowchart of the process sequence of the method of performing the conventional external appearance test | inspection. It is a figure explaining the relationship between a component assembly apparatus and a reel. It is a figure explaining a carrier tape. It is the figure which looked at the carrier tape 100 of the state in which the electronic component 10 was accommodated in the container 110 from the upper surface (FIG. 6A), and the figure which shows a cross-sectional view (FIG. 6B). It is a figure explaining the conventional electronic component inspection method. It is a flowchart explaining the procedure of the electronic component inspection method according to this invention. It is a figure explaining the electronic component inspection system according to this invention. It is a structural example of the computer 31 in the electronic component inspection system according to this invention. In this example, the place (inspection place) 101 where the inspection process P2 is performed is placed at a place different from the part assembly factory 100. It is an Example structure which shortens the processing time of the test process P2. It is a block diagram of a configuration example of a computer 40 that executes inspection of defective products using image data from a component assembly factory 100. 4 is a diagram illustrating a configuration example of a screen displayed on the display device 41. FIG. FIG. 11 is a diagram (part 1) illustrating an example of an enlarged image that is determined to be defective and is displayed on the display device 41; FIG. 10B is a second diagram illustrating an example of an enlarged image that is determined to be defective and is displayed on the display device 41; It is a figure which shows the example which inserts and holds 10 A of electronic components in the transparent cylindrical magazine stick 100A. It is a figure which shows the example which hold | maintains the electronic component 10B on the radial tape 100B. It is a figure which shows the example which hold | maintains 10C of electronic components to the transparent tray 100C. It is a figure which shows the example in which the terminal member 10D was connected and formed in the chain form by the same member 100D.

Explanation of symbols

100 Film carrier tape 101 Sprocket hole 2 ₁ , 2 ₂ reel 30, 30 ₁ Imaging camera 31 Personal computer 33 Recording medium

Claims (8)

Sequentially imaging a plurality of electronic components placed on the holding member;
Storing the captured image data of a plurality of electronic components in a recording medium;
Displaying image data of a plurality of electronic components stored in the recording medium on a display device;
Recording and storing inspection result data including symbols for identifying individual electronic components in which defects are detected by visually observing individual images of the plurality of electronic components displayed on the display device;
Searching for electronic components in which a defect is detected from a plurality of electronic components placed on the holding member based on the inspection result data stored and stored;
An electronic component inspection method comprising the steps of: Sequentially imaging multiple electronic components mounted on a carrier tape at regular intervals;
Storing the captured image data of a plurality of electronic components in a recording medium;
Displaying image data of a plurality of electronic components stored in the recording medium on a display device;
Recording and storing inspection result data including symbols for identifying individual electronic components in which defects are detected by visually observing individual images of the plurality of electronic components displayed on the display device;
Searching for electronic components in which defects are detected from a plurality of electronic components mounted on the carrier tape based on the inspection result data recorded and stored;
An electronic component inspection method comprising the steps of: In the first place,
Sequentially imaging a plurality of electronic components mounted on a carrier tape;
Storing the image data of the plurality of imaged electronic components in a recording medium,
In the second place,
Displaying image data of a plurality of electronic components stored in the recording medium on a display device;
Recording and storing inspection result data including symbols for identifying individual electronic components in which defects are detected by visually observing individual images of the plurality of electronic components displayed on the display device; and
Furthermore, in the first place,
Performing a step of searching for electronic components in which a defect is detected from a plurality of electronic components mounted on the carrier tape based on the recorded inspection result data;
Parts inspection method characterized by the above. In claim 3,
The electronic component inspection method is characterized in that the step executed at the second place is executed in parallel by dividing the plurality of electronic components into a predetermined number. In claim 2 or 3,
The carrier tape has a transparent container that is wound around a reel and accommodates the plurality of electronic components at the regular intervals.
The electronic component inspection method, wherein the symbol for individually identifying the plurality of electronic components is a lot number of the corresponding electronic component. A first system for assembling electronic components;
A second system independent of the first system and performing a defect inspection of the assembled electronic component;
A third system for replacing an electronic component in which a defect is detected by the second system with a non-defective product;
The first system mounts a plurality of assembled electronic parts on a carrier tape in the order of lot numbers, images the plurality of electronic parts in the order of lot numbers, and records image data of the plurality of electronic parts thus picked up Save to media,
The second system displays image data of a plurality of electronic components stored in the recording medium on a display screen, enables visual observation for detecting the presence or absence of defects, and further detects defects detected by visual observation. Record and store the number that identifies the electronic component with
The third system searches for an electronic component in which a defect is detected from a plurality of electronic components mounted on the carrier tape based on a number for identifying the electronic component having a defect that is recorded and stored. Electronic component inspection system characterized in that it can be replaced. In claim 6,
The electronic component inspection system, wherein the second system is independent from the first system by disposing the second system at a location remote from the first system. A program executed in an electronic component inspection system for inspecting defects of a plurality of electronic components mounted on a carrier tape,
Image data is read from a drive device of a recording medium in which individual images of a plurality of electronic components mounted on the carrier tape are recorded;
A plurality of thumbnail images included in the read image data are sequentially displayed on a display device;
An image of an enlarged electronic component corresponding to a thumbnail image displayed on a predetermined one of the plurality of thumbnail images displayed on the display device is displayed on the display device together with the thumbnail image;
A program that causes the display device to display a lot number of an electronic component corresponding to the defect information input in response to defect information input as a result of visual observation of the enlarged and displayed image.

Images