JP2006304110A - Temperature compensated crystal oscillation module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature compensated crystal oscillation module capable of suppressing deformation of adhesives due to practical use and producing a highly stable oscillation frequency. <P>SOLUTION: A quartz resonator 32 applied with adhesives and a thermistor 33 are mounted on a ceramic substrate 31, and a resin substrate 36 is joined to the ceramic substrate 31. Then, a packaging electrode 34 is provided on the bottom surface of the resin substrate 36. Moreover, the resin substrate 36 is formed in a plurality of layers, and a connection electrode 40b is provided on at least one gap between layers. A circuit electrode on a top surface of the ceramic substrate 31 is connected to the packaging electrode 34 of the resin substrate 36 so as to separate thermally through a connection electrode 40a, the connection electrode 40b, and a connection electrode 40c. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a crystal oscillation module that performs temperature compensation of a crystal resonator using a thermistor.

  Conventionally, a temperature-compensated crystal oscillation module that performs temperature compensation of an oscillation frequency by arranging a crystal resonator and a thermistor circuit including a thermistor having a negative characteristic on a single substrate has been used. In the case of this temperature-compensated crystal oscillation module, an alumina ceramic having a high thermal conductivity is used as a substrate or a case. In general, the crystal unit is provided in a ceramic case, and is fixed inside the ceramic case with a conductive adhesive. In some cases, an adhesive is used to fix the crystal resonator package (see Patent Document 1). Thus, a crystal oscillation module is provided in which the responsiveness of a thermistor circuit to temperature changes is enhanced.

FIG. 1 shows a configuration example of a temperature compensated crystal oscillation module (hereinafter referred to as TCXO) using a general thermistor circuit. A crystal resonator 2, a thermistor 3, a transistor 6, and the like contained in a ceramic case are disposed on a ceramic substrate 1, and the temperature-compensated crystal oscillation module 5 itself is mounted on the opposite side of the ceramic substrate 1 component mounting surface. A mounting electrode 4 is provided. Such a temperature-compensated crystal oscillation module 5 is conventionally used as a reference signal source for a mobile phone terminal.
JP 2001-177345 A

  By the way, in the case of a reference signal source such as a mobile phone base station that requires higher performance than that of a mobile phone terminal, for example, in the case of a reference signal source such as a mobile phone base station, A reference signal source that is small in aging and high in stability is required. Therefore, not a TCXO but a thermostat crystal oscillation module (hereinafter referred to as OCXO) is used as a reference signal source. This OCXO is a signal source that is relatively stable not only with respect to temperature changes but also with respect to changes over time and changes over time because the crystal oscillation circuit is always maintained at a constant temperature by a thermostatic chamber.

  However, this OCXO is more expensive than TCXO. Therefore, when an inexpensive TCXO is used instead of an expensive OCXO as a reference signal source such as a base station, it is possible to perform temperature compensation with higher performance by adjusting the thermistor circuit. However, the change in the oscillating frequency with time and the change over time cannot be suppressed, and the required performance as the reference signal source of the base station cannot be satisfied.

  The problem that the oscillation frequency of the TCXO changes with time and changes with time is that reflow heat is transmitted to the adhesive in the TCXO in the reflow process of mounting the TCXO on the mounting substrate. In other words, due to the high thermal conductivity of the ceramic, reflow heat is transmitted to the adhesive and thermal deformation of the adhesive occurs. When the adhesive is deformed in this manner, the deformation is gradually released according to the practical use thereafter, and the adhesive is restored to the original shape. As a result, the oscillation frequency is changed due to the deformation at the time of restoration.

  Accordingly, an object of the present invention is to solve this problem and to provide a temperature compensated crystal oscillation module with high oscillation frequency stability. That is, it is an object of the present invention to provide a temperature-compensated crystal oscillation module that suppresses deformation of an adhesive that is practically used.

  In order to solve the above-described problems, the present invention mounts a quartz crystal resonator with an adhesive and a thermistor on a ceramic substrate, bonds the resin substrate to the ceramic substrate, and does not contact the ceramic substrate of the resin substrate. A configuration in which mounting electrodes are provided on the surface is a desirable mode. As this crystal oscillator, a crystal piece may be fixed in a ceramic case with a conductive adhesive, or a crystal piece may be fixed directly on a ceramic substrate with a conductive adhesive.

  By adopting such an embodiment, even if the thermistor circuit and the crystal unit are provided on a ceramic substrate having high heat transfer characteristics, the reflow heat can be thermally conducted by providing the mounting electrode on the resin substrate. Direct transmission from a large ceramic substrate to the adhesive can be prevented.

  And since reflow heat is transmitted through the resin substrate with small heat conduction, in the reflow soldering of this module, the thermal deformation due to the reflow heat of the adhesive can be reduced. For this reason, it is possible to provide a temperature-compensated crystal oscillation module that is small in deformation and has high stability in which the shape and the oscillation frequency hardly change with time and change with time in practical use.

  In order to solve the above problems, the present invention provides a resin substrate as a plurality of layers, an inner layer electrode is provided between at least one layer, and a circuit electrode provided on the ceramic substrate and a mounting electrode on the resin substrate are heated. A configuration in which the electrodes are connected via inner layer electrodes so as to be spaced apart from each other is a desirable mode.

  In order to achieve such an aspect, the connection between the thermistor circuit or crystal resonator on the ceramic substrate and the mounting electrode is thermally separated by the connection electrode, and the crystal resonator or thermistor on the module from the mounting electrode, Transmission of reflow heat through the connection wiring to the adhesive can be suppressed. In addition, as such a structure, a configuration in which connection electrodes and mounting electrodes are arranged in a stepped shape is suitable for the implementation of the present invention. In addition, the connection electrodes may have a meandering shape or a large area. The structure to form is also suitable.

  In order to solve the above problems, the present invention provides a connection electrode disposed on a surface of the resin substrate to be bonded to the ceramic substrate, and an extraction electrode extracted from the connection electrode and the mounting electrode, respectively. And a through hole disposed in the resin substrate, wherein the extraction electrode drawn out from the connection electrode and the extraction electrode drawn out from the mounting electrode are electrically connected through the through hole. It is an aspect. In this case, the through hole may or may not be filled with a conductor in the through hole.

  Since it is set as such an aspect, the unnecessary adhesion | attachment of the solder on a through hole can be suppressed. Usually, when solder adheres to the through hole, the adhesion of the solder becomes stress and the reliability of conduction of the through hole is lowered. However, by using the above aspect, it is possible to prevent a decrease in reliability of the through-hole portion. In addition, when the electrodes are connected via the extraction electrodes in this way, the heat transfer of the reflow heat via the connection wiring can be further suppressed. If the extraction electrode is protected with an insulating film or the like, unnecessary adhesion of solder can be further suppressed.

  As described in detail above, the present invention relates to prevention of deformation of the adhesive, and the effects exhibited by the present invention are as follows.

1) According to the present invention, it is possible to suppress the reflow heat from being transmitted to the adhesive through the ceramic substrate, and a highly stable temperature-compensated crystal oscillation module that hardly undergoes aging and aging in practical use. Can provide.

2) According to the present invention, it is possible to suppress the reflow heat from being transferred to the adhesive via the connection wiring from the mounting electrode, and there is almost no change over time / aging in practical use. Type crystal oscillation module can be provided.

3) According to the present invention, since the through hole is connected to the electrode via the lead electrode from the electrode, the reliability of the connection by the through hole can be improved, and further, between the electrodes via the through hole and the lead electrode, Because it is connected, it is possible to suppress the reflow heat from being transmitted to the adhesive via this through hole and the extraction electrode, and there is almost no change over time / aging in practical use. Can provide modules.

  Next, the first embodiment of the present invention will be described in detail. As shown in FIG. 2A, in this embodiment, the temperature-compensated crystal oscillation module 15 is joined to a substantially hexahedral ceramic substrate 11 and a resin substrate 16 having the same shape.

  Then, an adhesive is used for fixing the thermistor 13 and the crystal resonator 12 containing the ceramic case on the ceramic substrate 11 and fixing the crystal piece inside the crystal resonator 12. A transistor 17 is also provided on the ceramic substrate 11, and a wiring pattern for connecting the thermistor 13, the crystal resonator 12, the transistor 17, and the like is provided. The thermistor 13 and the crystal resonator 12 constitute a temperature compensation type oscillator.

  2B, mounting electrodes 14 are provided at the four corners of the bottom surface of the resin substrate 16, and connection electrodes 20a are formed at the four corners of the top surface so as to face the mounting electrodes 14. As shown in FIG. Yes. The extraction electrode 51a is extracted from the connection electrode 20a, the extraction electrode 51b is extracted from the mounting electrode 14, and a through hole 52 is provided between the extraction electrode 51a and the extraction electrode 51b. The connection electrode 20a on the upper surface of the resin substrate 16 and the mounting electrode 14 on the lower surface of the resin substrate 16 are made conductive by connection wiring such as the through hole 52, the extraction electrode 51a, and the extraction electrode 51b.

Further, connection electrodes 20b are provided at the four corners of the bottom surface of the ceramic substrate 11, and the above-described resin substrate 16 that conducts the connection electrodes 20b and the thermistor 13, the crystal resonator 12, the transistor 17 and the like on the ceramic substrate 11 are connected. Connection wirings (not shown) such as through holes and lead electrodes having substantially the same configuration as the connection wirings in FIG.
Then, the temperature compensation type crystal oscillation module 15 is configured by joining the connection electrode 20a and the joining electrode 20b by brazing, soldering, a conductive adhesive or the like.

  In order to join the ceramic substrate 11 and the resin substrate 16 and provide the mounting electrode 14 on the bottom surface of the resin substrate 16, the temperature compensated crystal oscillation module 15 is placed on the mounting substrate. Even when reflow soldering is performed, heat from the mounting electrode 14 is not directly transmitted to the ceramic substrate 11 having high thermal conductivity, but is transmitted through the resin substrate 16 having low thermal conductivity. It is possible to suppress the thermal deformation of the adhesive used for bonding the child 12 and the like and fixing the crystal piece inside the crystal resonator 12.

  As a result, the change in the oscillation frequency of the temperature-compensated crystal oscillation module, which has been caused by gradually releasing the thermal deformation of the adhesive, can be suppressed, and the temperature-compensated crystal oscillation module 15 having high stability can be provided.

  Further, since the through hole is connected to the electrode via the lead electrode from the electrode, the solder does not adhere to the through hole portion, and the connection reliability can be further improved. Furthermore, since the electrodes are connected through the through hole and the extraction electrode, it is possible to further suppress the reflow heat from being transmitted through the connection wiring.

  The connection wiring passing through the resin substrate 16 between the connection electrode 20a and the mounting electrode 14 is not particularly limited to the configuration shown in the present embodiment. It is more preferable to devise the shape so that heat is not easily transmitted through the extraction electrode and the through hole.

  Further, the shape of the resin substrate 16 itself is not limited to the substantially hexahedron shown in the present embodiment and is in contact with the entire surface of the ceramic substrate 11, so that the connection electrodes 20 a and 20 b do not directly contact the mounting electrode 14. Any shape may be used as long as the shape is not particularly limited.

  Further, the shape of each of the connection electrodes 20a and 20b and the mounting electrode 14 is not limited to the rectangular shape shown in the drawing, as long as each electrode is surely connected to other connection wirings. Good. Also, the number of them is not limited to four, and the design specifications can be followed.

  Further, the crystal resonator 12, the thermistor 13, the crystal piece inside the crystal resonator 12, etc. may not all be fixed by an adhesive, and a part may be fixed by soldering or the like. In that case, after soldering, it is more preferable to perform an aging process for applying heat to the module to remove the thermal deformation of the adhesive.

  Next, the second embodiment will be described in detail. In the configuration of the present embodiment shown in FIG. 3A, the temperature compensated crystal oscillation module 25 is configured by joining a substantially hexahedral ceramic substrate 21 and a resin substrate 26 having a size larger than the ceramic substrate 21. Yes.

  An adhesive is used for fixing the thermistor 23 and the crystal resonator 22 containing the ceramic case to the upper surface of the ceramic substrate 21 and fixing the crystal piece inside the crystal resonator 22. A transistor 18 is also provided on the ceramic substrate 21, and a wiring pattern for connecting the thermistor 23, the crystal resonator 22, the transistor 18, and the like is provided. Although not shown, a printing resistor constituting a thermistor circuit is provided on a part of the bottom surface of the ceramic substrate 21. Furthermore, connection electrodes 30 c are provided at the four corners of the bottom surface of the ceramic substrate 21. Further, connection wiring (such as a through hole and a lead electrode) having substantially the same configuration as that of the first embodiment in which the wiring pattern such as the thermistor 23, the crystal resonator 22 and the transistor 18 on the ceramic substrate 21 and the connection electrode 30c are conducted. (Not shown) is provided from the top surface to the bottom surface of the ceramic substrate 21.

  In this manner, the thermistor 23, the crystal resonator 22, and the printing resistance constitute a temperature compensation type oscillator.

  As shown in FIG. 3B, the resin substrate 26 is provided with a hole 29 for processing the printing resistance on the bottom surface of the ceramic substrate 21. The hole 29 has a cross shape. Further, connection electrodes 30a are provided at the four corners of the upper surface of the resin substrate 26 to be bonded to the ceramic substrate 21, and connection electrodes 30b are also provided at the four corners at the bottom surface to be bonded to the resin lid plate 28 described later. A connection wiring (not shown) such as a through hole and a lead electrode having substantially the same configuration as that of the first embodiment for conducting the connection electrode 30a and the connection electrode 30b is formed from the top surface of the resin substrate 26 to the bottom surface. Up to.

  Further, in order to close the hole 29, a resin cover plate 28 that covers the entire surface of the hole 29 and the resin substrate 26 is joined to the resin substrate 26. Then, connection electrodes 30d are formed at the four corners of the upper surface of the resin lid plate 28, and mounting electrodes 24 are formed at the four corners of the bottom surface. Furthermore, a connection wiring (not shown) such as a through-hole and a lead-out electrode, which conducts the connection electrode 30d and the mounting electrode 24, has a configuration substantially the same as that of the resin substrate of the first embodiment and is a resin cover plate. 28 is provided from the top surface to the bottom surface.

  Further, a metal cover 27 for enclosing the ceramic substrate 21, the thermistor 23, the crystal resonator 22 and the like is provided on the upper surface of the resin substrate 26.

  Then, the connecting electrode 30a and the joining electrode 30c are joined by brazing, soldering, or a conductive adhesive, and the connecting electrode 30b and the joining electrode 30d are joined by the same method, and the resin substrate 26 is joined. The temperature-compensated crystal oscillation module 25 is configured by adhering the metal cover 27 to the top by soldering or a conductive adhesive.

  With such a configuration, even when the temperature-compensated crystal oscillation module 25 is placed on the mounting substrate and reflow soldered, heat from the mounting electrode 24 is directly transmitted to the ceramic substrate 21 having high thermal conductivity. However, since the heat is transmitted through the resin substrate 26 having a small heat conductivity, it is possible to suppress the heat from being transmitted to the adhesive on the upper surface of the ceramic substrate 21.

  Further, the connection electrode 30 c is formed on the bottom surface of the ceramic substrate 21, the connection electrode 30 a is formed on the top surface of the resin substrate 26, the connection electrode 30 b is formed on the bottom surface of the resin substrate 26, and the top surface of the resin lid plate 28 is formed. A connection electrode 30 d is formed on the bottom surface of the resin lid plate 28, and a mounting electrode 24 is formed on the bottom surface of the resin lid plate 28. In this way, since the mounting electrode 24 and the wiring pattern on the ceramic substrate 21 are connected via the plurality of connection electrodes, heat is transmitted through the connection wiring, and heat is transferred to the adhesive on the upper surface of the ceramic substrate 21. Can be suppressed.

  As a result, the thermal deformation of the adhesive used for bonding the thermistor 23 and the crystal resonator 22 can be suppressed, and the oscillation frequency of the temperature-compensated crystal oscillation module in which the thermal deformation of the adhesive has been gradually released in the past. The temperature-compensated crystal oscillation module having the same effect as the first embodiment and having high stability can be provided.

  Furthermore, in the present embodiment, the printing resistance of the thermistor circuit is arranged on the bottom surface of the ceramic substrate 21, and the hole 29 for processing the printing resistance of the bottom surface of the ceramic substrate 21 is provided in the resin substrate 26. The printing resistance on the bottom surface of 21 can be trimmed. Thus, after the crystal resonator 22 and the thermistor 23 are mounted on the ceramic substrate 21, the oscillation frequency of the temperature compensated crystal oscillation module 25 can be adjusted by trimming the printing resistance.

  Further, since the resin lid plate 28 for closing the hole 29 is joined to the resin substrate 26, the hole 29 can be closed. As a result, it is possible to provide a temperature-compensated crystal oscillation module with higher stability without exposing the printing resistance.

  Furthermore, in the present embodiment, a metal cover 27 for enclosing the ceramic substrate 21, the thermistor 23, the crystal resonator 22 and the like is provided on the upper surface of the resin substrate 26. With this configuration, the ceramic substrate 21, the thermistor 23, the crystal resonator 22 and the like on the upper surface of the resin substrate 26 can be sealed. As a result, the ceramic substrate 21, the thermistor 23, the crystal resonator 22 and the like are not exposed, and a temperature-compensated crystal oscillation module with higher stability can be provided. In addition, when the metal cover 27 is provided, when the temperature compensated crystal oscillation module is reflow soldered, transmission of reflow heat to the adhesive due to heat radiation is further suppressed, and thermal deformation can be further suppressed. Therefore, a temperature-compensated crystal oscillation module with higher stability can be provided.

  In the present embodiment, the electrode provided on the bottom surface of the resin lid plate 28 has been described as a mounting electrode. However, such a resin lid plate 28 is not always necessary, and connection is required when the resin lid plate 28 is not provided. The electrode 30b may be used as a mounting electrode.

  Further, the shape of the resin cover plate 28 is set to cover the entire surface of the hole 29 and the resin substrate 26. However, the shape is not limited to such a shape, and any structure may be used as long as the hole 29 is sealed. It may be a shape that covers only. In this case, the connection electrode 30b can be used as the mounting electrode without providing the mounting electrode 24 on the resin lid plate 28.

  In addition, the metal cover 27 is provided on the upper surface of the resin substrate 26 so as to enclose the ceramic substrate 21, the thermistor 23, the crystal resonator 22, and the like. 26 may be formed in substantially the same shape, and a metal cover may be provided on the upper surface of the ceramic substrate 21 so as to enclose the thermistor 23, the crystal resonator 22 and the like.

  In the present embodiment, the metal cover 27, the hole 29, and the like are provided, but these are not necessarily provided.

  Further, the shape of the resin substrate 26 itself is not limited to the shape provided with the cross-shaped holes 29 shown in the present embodiment, and may be any shape as long as the ceramic substrate 21 does not contact the mounting electrode 24. The shape is not particularly limited.

  Next, the third embodiment will be described in detail. In the configuration of the present embodiment shown in FIG. 4A, the temperature-compensated crystal oscillation module 35 is configured by joining a substantially hexahedron-shaped ceramic substrate 31 and a resin substrate 36 having the same size as the ceramic substrate 31. .

  An adhesive is used to fix the thermistor 33 and the crystal resonator 32 containing the ceramic case to the upper surface of the ceramic substrate 31 and to fix the crystal piece inside the crystal resonator 32. A transistor 41 is also provided on the ceramic substrate 31, and a wiring pattern for connecting the thermistor 33, the crystal resonator 32, the transistor 41, and the like is provided. Although not shown, a printing resistor constituting a thermistor circuit is provided on a part of the bottom surface of the ceramic substrate 31. Further, connection electrodes 40 c are provided at the four corners of the bottom surface of the ceramic substrate 31. Further, connection wiring such as a through hole and a lead electrode having substantially the same configuration as that of the first embodiment for conducting the wiring pattern such as the thermistor 33, the crystal resonator 32, and the transistor 41 on the ceramic substrate 31 and the connection electrode 40c is provided. The ceramic substrate 31 is provided from the top surface to the bottom surface.

  As described above, the thermistor 33, the crystal resonator 32, and the printing resistor constitute a temperature compensation type oscillator.

  As shown in FIG. 4B, the resin substrate 36 is provided with holes 39 for processing the printing resistance on the bottom surface of the ceramic substrate 31. The hole 39 has a cross shape. Further, connection electrodes 40 a are provided at the four corners of the upper surface of the resin substrate 36 to be bonded to the ceramic substrate 31.

  The resin substrate 36 is formed by joining two resin substrates, and an electrode is provided between the two layers. The electrodes between the inner layers are used as connection electrodes 40b. The connection electrodes 40a and 40b are formed so as to be displaced from each other, and the connection electrode 40b and the mounting electrode 34 are also formed so as to be displaced from each other, so that the connection electrodes and the mounting electrodes are formed. Are arranged in a staircase pattern.

  Then, as shown in FIG. 4A, a connection wiring including a through hole 62a and a lead electrode 61a that conducts the connection electrode 40a and the connection electrode 40b is provided from the upper surface to the inner layer of the resin substrate 36. In addition, a connection wiring composed of a through hole 62b and an extraction electrode 61b that conducts the connection electrode 40b and the mounting electrode 34 is provided from the inner layer to the bottom surface of the resin substrate 36. In addition, illustration of these is abbreviate | omitted in FIG.4 (b).

  Further, in order to close the hole 39, a resin lid plate 38 that covers the hole 39 and has substantially the same shape as the hole 39 is provided.

  A metal cover 37 is provided on the upper surface of the ceramic substrate 31 to enclose the thermistor 33, the crystal resonator 32, and the like.

  Then, the connecting electrode 40a and the joining electrode 40c are joined by brazing, soldering, conductive adhesive or the like, and the metal cover 37 is adhered to the resin substrate 36 by soldering or conductive adhesive. The temperature-compensated crystal oscillation module 35 is configured.

  With such a configuration, even when the temperature-compensated crystal oscillation module 35 is placed on the mounting substrate and reflow soldered, heat from the mounting electrode 34 is directly transmitted to the ceramic substrate 31 having high thermal conductivity. However, since the heat is transmitted through the resin substrate 36 having a small heat conductivity, it is possible to suppress the heat from being transmitted to the adhesive on the upper surface of the ceramic substrate 31.

  Further, the mounting electrode 34 is formed on the bottom surface of the resin substrate 36, the connection electrode 40 a is formed on the top surface of the resin substrate 36, the connection electrode 40 b is formed on the middle layer of the resin substrate 36, and the bottom surface of the ceramic substrate 31 is formed. A connection electrode 40c is formed. In this way, since the mounting electrode 34 and the wiring pattern on the ceramic substrate 31 are connected via the plurality of connection electrodes, heat is transmitted through the connection wiring to the adhesive on the upper surface of the ceramic substrate 31. Can be suppressed.

  As a result, the thermal deformation of the adhesive used for bonding the thermistor 33, the crystal resonator 32, etc. can be suppressed, and the oscillation frequency of the temperature compensated crystal oscillation module in which the thermal deformation of the adhesive has been gradually released in the past. The temperature-compensated crystal oscillation module 35 having the same effect as the first embodiment and having high stability can be provided.

  Further, since the resin lid plate 38 is shaped so as to cover only the holes 39, there is no need to provide mounting electrodes on the resin lid plate 38, and a resin lid plate 38 having a simple configuration without electrodes can be used.

  In addition, since the metal cover 37 is arranged on the upper surface of the ceramic substrate 31 instead of the resin substrate 36, only the thermistor 33 and the crystal resonator 32 are enclosed, and the metal cover 37 can be reduced in size and more integrated with the module. Can be configured.

It is a figure which shows the structural example of the conventional temperature compensation type | mold crystal oscillation module. It is a figure which shows the structural example of the temperature compensation type | mold crystal oscillation module of 1st Embodiment. It is a figure which shows the structural example of the temperature compensation type | mold crystal oscillation module of 2nd Embodiment. It is a figure which shows the structural example of the temperature compensation type | mold crystal oscillation module of 3rd Embodiment.

Explanation of symbols

1, 11, 21, 31-Ceramic substrate 2, 12, 22, 32-Quartz crystal 3, 13, 23, 33-Thermistor 4, 14, 24, 34-Mounting electrode 5, 15, 25, 35-Temperature Compensation type crystal oscillation module 16, 26, 36-Resin substrate 27, 37-Metal cover 28, 38-Resin cover plate 29, 39-Hole 20, 30, 40-Connection electrode 51, 61-Lead electrode 52, 62- Through hole 6, 17, 18, 41-transistor

Claims (3)

In a temperature-compensated crystal oscillation module in which a crystal unit with an adhesive and a thermistor are mounted on a ceramic substrate,
Bonding a resin substrate to the ceramic substrate,
A temperature-compensated crystal oscillation module in which a mounting electrode is provided on a surface of the resin substrate that is not in contact with the ceramic substrate. The resin substrate includes a plurality of layers, and includes an inner layer electrode between at least one layer,
The temperature compensation type according to claim 1, wherein the wiring pattern provided on the ceramic substrate and the mounting electrode of the resin substrate are connected via the inner layer electrode so as to be thermally separated. Crystal oscillator module. A connecting electrode disposed on a surface of the resin substrate to be bonded to the ceramic substrate, a leading electrode led out from the connecting electrode and the mounting electrode, and a through hole disposed inside the resin substrate And comprising
3. The temperature-compensated crystal oscillation module according to claim 1, wherein an extraction electrode extracted from the connection electrode and an extraction electrode extracted from the mounting electrode are electrically connected through the through hole.

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