JP2006231628A - Processing method of ceramic green sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing method of a ceramic green sheet capable of shortening the processing time of the ceramic green sheet and capable of enhancing processing precision. <P>SOLUTION: The processing method of the ceramic green sheet S is constituted so as to form a plurality of through-holes to the ceramic green sheet S provided in a movable manner and comprises a laser beam diameter contracting process for passing the laser beam L1 oscillated from a laser beam source 12 through a laser diameter contracting means 14 to contract the diameter of the laser beam L1, a laser beam spectrum forming process for allowing the base beam L1 contracted in its diameter by the laser diameter contracting means 14 to enter a laser beam spectroscope means 18 at an incident angle of almost 90° to form a spectrum comprising a plurality of laser beam groups 12 and a laser beam irradiation process for allowing a 0-order beam in the laser beam groups 12 spectrally diffracted by the laser beam spectral diffraction means 18 to enter a laser condensing means 20 at an incident angle of almost 90° to condense the same and irradiating the ceramic green sheet S with the condensed laser beam L2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for processing a ceramic green sheet used for manufacturing a multilayer ceramic electronic component, and more particularly, a plurality of through holes (for example, holes for causing a via hole or a through hole to function in the ceramic green sheet). The present invention relates to a method for processing a ceramic green sheet for forming a film.

  As shown in FIG. 6, as a conventional ceramic green sheet S processing apparatus 100, a supporting means configured to support the ceramic green sheet S and to move the ceramic green sheet S in a predetermined direction ( (XY table) 102, laser light source 104, and a plurality of shapes corresponding to the shapes of through holes (not shown) to be formed in the ceramic green sheet S through the laser beam L 1 emitted from the laser light source 104. The diffraction grating 106 that splits the laser beam L2 of the laser beam, the galvano scan mirror 108 that passes through the diffraction grating 106 and reflects the split laser beam L2 at a predetermined reflection angle, and the galvano scan mirror 108 reflects the laser beam L2 at a predetermined reflection angle. Condensing lens 110 for individually condensing the laser beam L2 And the laser beam L2 condensed through the condenser lens 110 is known to be irradiated on the ceramic green sheet S on the XY table 102 (described below). Patent Document 1). Further, the processing apparatus 100 moves a laser light source driving unit 112 that drives the laser light source 104, a galvano scan mirror driving unit 114 that changes the reflection angle of the galvano scan mirror 108, and an XY table 102 in a predetermined direction. And a table driving means 116 for moving the ceramic green sheet S supported thereon in a predetermined direction.

According to the processing apparatus 100, the laser beam L1 emitted from the laser light source 104 passes through the diffraction grating 106 and is split into a plurality of laser beams L2. The split laser beam L2 is reflected by the galvano scan mirror 108, condensed by the condenser lens 110, and irradiated onto the ceramic green sheet S. Thereby, a predetermined through-hole is simultaneously formed in the ceramic green sheet S.
JP 2000-288760 A

However, in the above-described conventional processing apparatus, the laser beam incident on the ceramic green sheet is positioned by reflecting the laser beam dispersed by the diffraction grating with a galvano scan mirror at a predetermined reflection angle. At this time, the laser beam is split to have the shape of a laser beam group having a predetermined positional relationship. When such a laser beam group scans and positions on the condenser lens by reflection of the galvano scan mirror, the central axis of the laser beam group is incident obliquely on the condenser lens at the periphery of the scanning area, The positional relationship of the laser beam group projected on the condenser lens is broken from the original shape. As a result, the positional relationship of the laser beam group when entering the ceramic green sheet is partially distorted, and there is a problem that the incident position accuracy of the laser beam with respect to the ceramic green sheet is deteriorated.
Further, in the above-described conventional processing apparatus, after performing processing within a range that can be positioned by reflection by the galvano scan mirror, the XY table is moved, and the unprocessed portion of the ceramic green sheet supported thereon is galvanically scanned. Processing is performed sequentially by moving to an area that can be processed by mirror reflection. However, since the ceramic green sheet cannot be processed when the XY table is moved, the processing speed is increased by the time for moving the XY table. There is a problem that decreases.
In other words, in a conventional apparatus using a galvano scan mirror, first, a ceramic green sheet is placed at a predetermined position, a laser beam irradiation position is determined by the galvano scan mirror, and processing is performed in a predetermined region of the ceramic green sheet. To implement. Next, after the processing is completed, the laser beam irradiation is stopped, the XY table is driven, the unprocessed area of the ceramic green sheet is moved to a position where processing can be performed by the galvano scan mirror, and the XY table is temporarily stopped. . After that, processing is performed again in the unprocessed area with the galvano scan mirror. In this way, processing by the galvano scan mirror and movement of the XY table are performed in two steps.

  Therefore, an object of the present invention is to provide a method for processing a ceramic green sheet that can shorten the processing time of the ceramic green sheet by improving the processing speed and can improve the processing accuracy.

  The invention according to claim 1 is a method of processing a ceramic green sheet for forming a plurality of through holes in a movable ceramic green sheet, wherein the laser beam oscillated from a laser light source is laser-contracted. A laser beam diameter reducing step for reducing the diameter by passing through the diameter means, and a laser beam reduced by the laser diameter reducing means is incident on the laser spectroscopic means at an incident angle of about 90 degrees to form a plurality of laser beam groups. The laser beam spectroscopic step for performing the spectroscopic analysis, and the zero-order light in the laser beam group split by the laser spectroscopic means is incident on the laser condensing means at an incident angle of approximately 90 degrees to be condensed. And a laser beam irradiation step for irradiating the ceramic green sheet.

According to the first aspect of the present invention, in the laser beam diameter reducing step, the laser beam oscillated from the laser light source is passed through the laser diameter reducing means and is reduced in diameter. In the laser beam spectroscopic step, the laser beam reduced in diameter by the laser diameter reducing means is incident on the laser spectroscopic means at an incident angle of approximately 90 degrees and is split into a plurality of laser beam groups. In the laser beam irradiation step, the zero-order light in the laser beam group dispersed by the laser spectroscopic means is incident on the laser condensing means at an incident angle of approximately 90 degrees and is condensed. Irradiation on ceramic green sheet. Thereby, the ceramic green sheet is processed.
Here, since the incident angle of the laser beam reduced in diameter by the laser reducing means to the laser spectroscopic means is approximately 90 degrees, the spectral pattern of the laser beam dispersed by the laser spectroscopic means is recorded in the laser spectroscopic means in advance. It is possible to make a similar figure without distortion. Further, since the zero-order light in the laser beam group is incident on the laser condensing unit at an angle of approximately 90 degrees, no distortion occurs even if the laser beam group dispersed by the laser spectroscopic unit is incident on the laser condensing unit. Thereby, it can prevent that the shape of the laser beam irradiated to a ceramic green sheet collapse | crumbles, and can improve a processing precision.
Further, since the laser beam is oscillated from the laser light source according to the position of the ceramic green sheet by the control means, the ceramic green sheet can be processed continuously without stopping the oscillation of the laser beam from the laser light source. As a result, the processing speed can be improved and the processing time can be shortened.
In the present specification, “0th-order light” means a laser beam that travels straight without being diffracted by the laser spectroscopic means among the laser beams incident on the laser spectroscopic means. Also, the “incident angle” refers to the incident surface of the laser spectroscopic means or the laser condensing means among the laser beams incident on the laser spectroscopic means or the laser condensing means. Means the angle of incidence.

  According to a second aspect of the present invention, in the method for processing a ceramic green sheet according to the first aspect, the angle of the optical axis of the laser beam by the optical axis changing means provided upstream or downstream of the optical path of the laser spectroscopic means. It is characterized by changing.

  According to the second aspect of the present invention, the angle of the optical axis of the laser beam is changed by the optical axis changing means, so that the incident angle of the laser beam to the laser spectroscopic means or the laser condensing means is approximately 90 degrees. . As described above, since the angle of the optical axis of the laser beam can be freely changed by the optical axis changing means, the laser spectral means or the laser condensing means of the laser beam regardless of the positional relationship of each component of the processing apparatus. The incident angle to can always be approximately 90 degrees.

  According to a third aspect of the present invention, in the method for processing a ceramic green sheet according to the first or second aspect, the laser spectroscopic unit is arranged so that a plurality of dispersed laser beams are arranged in a predetermined direction. The laser beam is dispersed.

  According to the third aspect of the present invention, the dispersed laser beam groups are arranged in a straight line along a predetermined direction, so that the pitch between the laser beams can be easily changed. As a result, through holes with various pitches can be formed on the ceramic green sheet.

  According to a fourth aspect of the present invention, in the method for processing a ceramic green sheet according to any one of the first to third aspects, the laser spectroscopic means is movably provided, and the position of the laser spectroscopic means is adjusted. It is adjusted by means.

  According to the fourth aspect of the invention, the position of the laser spectroscopic means is adjusted by the position adjusting means so that the distance between the laser spectroscopic means and the ceramic green sheet is always constant corresponding to the variation in the height of the ceramic green sheets. Since the height position is adjusted, it is possible to prevent the pitch of the dispersed laser beam group from changing (pitch shift). In addition, by adjusting the height position of the laser spectroscopic means, the spectral pitch of the laser beam group can be adjusted according to the processing object, and it can correspond to various processing pitches of the through holes formed in the ceramic green sheet. be able to.

According to a fifth aspect of the present invention, in the ceramic green sheet processing method according to any one of the first to fourth aspects, the laser beam is a CO ₂ laser.

According to the fifth aspect of the present invention, when the laser beam is a CO ₂ laser, the processing speed can be improved even when the spectral number of the laser beam in the laser spectroscopic means is increased.

  According to the present invention, the processing time of the ceramic green sheet can be shortened by improving the processing speed, and the processing accuracy can be improved.

  Next, a ceramic green sheet processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the processing apparatus 10 for the ceramic green sheet S of the present embodiment includes a laser light source 12 that oscillates a laser beam L1 that is, for example, a CO ₂ laser. In the vicinity of the laser light source 12, a small diameter mask (laser diameter reducing means) 14 for reducing the diameter of the laser beam L1 is disposed. A reflection mirror (optical axis changing means) 16 is disposed in the vicinity of the small diameter mask 14. The reflection angle of the reflection mirror 16 is adjusted by reflection angle adjusting means (not shown). The reflection mirror 16 is arranged so that the zero-order light in the laser beam L2 split by a diffraction grating (laser spectroscopic means) 18 described later is incident on a condenser lens 20 described later at an incident angle of approximately 90 degrees. . A diffraction grating (laser spectroscopic means) 18 is disposed below the reflection mirror 16. The diffraction grating 18 is set to split the laser beam L1 so that the split laser beam L2 is arranged in a straight line along a predetermined direction. In other words, a group of laser beams dispersed by the diffraction grating 18 by one laser beam irradiation is arranged in a straight line. A condensing lens (laser condensing means) 20 that condenses the dispersed laser beam L2 and irradiates it onto the ceramic green sheet S is parallel to the diffraction grating 18 below the diffraction grating 18. Has been placed.

  An XY table 22 is disposed below the condenser lens 20. A ceramic green sheet S is placed on the upper surface of the XY table 22. In the vicinity of the XY table 22, an XY table driving unit 24 for moving the XY table 22 in a predetermined direction is disposed.

  A laser light source drive control means (control means) 26 for controlling the oscillation of the laser beam L1 from the laser light source 12 is disposed in the vicinity of the laser light source 12. The laser light source drive control means 26 is connected to an XY table position measuring means 28 for measuring the position of the XY table 22. Further, a diffraction grating position adjusting mechanism (position adjusting means) 30 for adjusting the position of the diffraction grating 18 is disposed in the vicinity of the diffraction grating 18. The distance between the diffraction grating 18 and the condenser lens 20 (or ceramic green sheet S) can be changed by the diffraction grating position adjusting mechanism 30.

  As the ceramic green sheet S, a material obtained by adding a binder to ferrite or a material obtained by adding a binder to glass, dielectric or the like and molding the carrier film on a carrier film by a doctor blade method or the like is used.

  Next, the processing method of the ceramic green sheet S using the processing apparatus 10 of the ceramic green sheet S of this embodiment is demonstrated.

As shown in FIGS. 1 and 2, the laser beam L <b> 1 oscillated from the laser light source 12 passes through the small diameter mask 14 and is reduced in diameter. The laser beam L1 reduced in diameter by the small diameter mask 14 is reflected by the reflection mirror 16. The laser beam L1 reflected by the reflecting mirror 16 passes through the diffraction grating 18 and is split into a plurality of laser beams L2. The laser beam L2 split by the diffraction grating 18 is irradiated onto the ceramic green sheet S while being condensed by the condenser lens 20. As a result, a predetermined number (the same as the spectral number) of through holes (via holes) 32 are formed in the ceramic green sheet S.
After the predetermined number of through holes 32 are formed in the ceramic green sheet S, the XY table 22 is moved by the XY table driving means 24, and the laser beam L2 is irradiated to the next processing position of the ceramic green sheet S. Thus, the ceramic green sheet S is moved. Thereafter, through holes 32 are formed in the ceramic green sheet S in the same manner.

  Here, since the laser beam L1 that has passed through the small-diameter mask 14 is reflected by the reflecting mirror 16 and is incident on the diffraction grating 18 at an incident angle of approximately 90 degrees, the spectrum of the laser beam L2 that has been dispersed by the diffraction grating 18 The figure is not distorted with respect to the design figure recorded in advance on the diffraction grating 18 and can be made similar. Further, since the 0th-order light in the laser beam L2 reflected by the reflecting mirror 16 and dispersed by the diffraction grating 18 is incident on the condenser lens 20 at an incident angle of approximately 90 degrees, the laser beam L2 dispersed by the diffraction grating 18 is incident. Even if the light enters the condenser lens 20, the spectrally divided laser beam L2 is not distorted. Thereby, the processing precision of the through-hole 32 formed in the ceramic green sheet S can be improved.

  Further, after the predetermined number of through holes 32 are formed in the ceramic green sheet S, the position of the XY table 22 is measured by the XY table position measuring means 28, and an appropriate value is obtained by the laser light source drive control means 26 based on the measurement result. The oscillation timing of the laser beam L1 is calculated. Based on this oscillation timing, the laser light source 12 is controlled by the laser light source drive control means 26, and the laser beam L1 is oscillated. At this time, the XY table 22 is moved by the XY table driving means 24 so that the oscillated laser beam L2 is irradiated to the next processing position of the ceramic green sheet S. Thus, the ceramic green sheet S can be processed continuously because the oscillation timing of the laser beam L1 is adjusted while the XY table 22 is moved. As a result, the processing speed of the ceramic green sheet S can be improved and the processing time can be shortened.

Further, when a partial height variation of the ceramic green sheet S occurs, the distance between the diffraction grating 18 and the ceramic green sheet S changes, and the pitch of the laser beam L2 thus dispersed on the ceramic green sheet S is changed. Also changes. Here, the diffraction grating position adjusting mechanism 30 adjusts the diffraction grating 18 so that the distance between the diffraction grating 18 and the ceramic green sheet S is always constant according to the partial height variation of the ceramic green sheet S. Since the height (position) is adjusted, it is possible to prevent the pitch of the dispersed laser beam L2 from changing, and even if the partial height of the ceramic green sheet S varies, the processing accuracy decreases. Can be prevented. Further, by adjusting the height position of the diffraction grating 18, the spectral pitch of the laser beam L2 can be adjusted in accordance with the object to be processed, and the various processing pitches of the through holes 32 formed in the ceramic green sheet S can be adjusted. Can be matched.
As a method for adjusting the position of the diffraction grating 18, the variation in the partial height of the ceramic green sheet S is grasped in advance, and the distance between the diffraction grating 18 and the ceramic green sheet S is determined by the variation in height. A method of adjusting the position of the diffraction grating 18 so as not to change, or the position of the ceramic green sheet S is measured in real time by the XY table position adjusting means 24, and the diffraction grating 18 is adjusted by the diffraction grating position adjusting mechanism 30 based on this measurement data. A method of adjusting the height (position) of the lens may be used.

Further, as shown in FIG. 4, since the diffraction grating 18 performs spectroscopy so that the laser beam L2 is arranged in a straight line along a predetermined direction, the laser beam L2 in a straight line along the predetermined direction on the ceramic green sheet S. Are arranged so that the pitch between the laser beams L2 can be easily changed. As a result, the through holes 32 with various pitches can be formed on the ceramic green sheet S.
Even in this case, the XY table 22 is processed without using the diffraction grating 18 in which the laser beam L2 to be dispersed is arranged in a row while continuing the movement without stopping. Further, the XY table 22 is continuously moved, and the diffraction grating position adjusting mechanism 30 performs processing while simultaneously adjusting the height position of the diffraction grating 18. In this case, laser beams having different spectral pitches can be irradiated in accordance with the movement of the XY table 22, and the through holes 32 having different pitches are formed on the ceramic green sheet S. In this way, by using the diffraction grating 18 in which the dispersed laser beams are arranged in a straight line, various patterns with different pitches of the through holes 32 can be continuously formed without stopping the XY table 22. Can do.

  Further, if the position of the diffraction grating 18 is adjusted by the diffraction grating position adjusting mechanism 30 by grasping in advance the relationship between the position of the diffraction grating 18 and the pitch of the laser beam L2 applied to the ceramic green sheet S, the ceramic The pitch of the laser beam S2 irradiated on the green sheet S can be controlled to be a predetermined pitch. As a result, the pitch of the laser beams S irradiated on the ceramic green sheet S can be easily changed, and the pitch of the through holes 32 can be varied.

Further, by using a CO ₂ laser as the laser beam L1, the output of the laser light source 12 can be increased, and the processing speed can be improved even when the spectral number in the diffraction grating 18 is increased.

Further, the reflecting mirror 16 also serves as an optical axis changing means for changing the angle of the optical axis of the laser beam L1 (L2), so that the angle of the optical axis of the laser beam L1 (L2) can be easily changed using existing components. be able to. Thereby, the increase in a number of parts can be prevented and it can prevent that a manufacturing man-hour and manufacturing cost increase.
In particular, by changing the angle of the optical axis of the laser beam L1 (L2) using the reflection mirror 16, the laser beam L1 (L2) is approximately 90 degrees with respect to the incident surface on the diffraction grating 18 or the condenser lens 20. Compared with the case where the laser light source 12 is arranged at such a position, the degree of freedom of the installation location of each component of the processing apparatus 10 can be increased, and each of the internal spaces of the processing apparatus 10 whose size is limited can be increased. The components can be stored efficiently.

表１に示すとおり、本発明加工装置は、他の従来加工装置１及び従来加工装置２と比較して、加工位置精度、最小加工孔径、加工速度および分光数の全てにおいて、向上していることが判明した。 Next, with respect to the ceramic green sheet processing apparatus of the present invention (referred to as “the present processing apparatus” as appropriate), the conventional ceramic green in processing (position) accuracy, minimum processing hole diameter, processing speed, and diffraction grating spectral number. Sheet processing apparatus (diffractive grating + galvano scan mirror, appropriately referred to as “conventional processing apparatus 1”) and conventional ceramic green sheet processing apparatus (galvano scan mirror alone, appropriate as “conventional processing apparatus 2” ").
The results are as shown in Table 1 below.

As shown in Table 1, the machining apparatus of the present invention is improved in all of the machining position accuracy, the minimum machining hole diameter, the machining speed, and the spectral number as compared with the other conventional machining apparatuses 1 and 2. There was found.

  Next, the processing apparatus 50 for the ceramic green sheet S according to the second embodiment of the present invention will be described. In addition, about the structure which overlaps with the processing apparatus 10 of the ceramic green sheet S which concerns on 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted suitably.

  As shown in FIG. 3, the processing apparatus 50 for the ceramic green sheet S of the present embodiment arranges the diffraction grating 18 between the small diameter mask 14 and the reflection mirror 16 so as to be parallel to the small diameter mask 14, The laser beam L1 that has passed through the small-diameter mask 14 is split by passing through the diffraction grating 18, and the split laser beam L1 is reflected by the reflecting mirror 16 and is incident on the condenser lens 20. . In this case, in order to prevent a reduction in processing accuracy, the reflection mirror 16 applies the 0th-order light in the laser beam L2 split by the diffraction grating (laser spectroscopic means) 18 to the condenser lens 20 at an incident angle of approximately 90 degrees. It arrange | positions so that it may inject.

According to the processing apparatus 50 for the ceramic green sheet S of the present embodiment, the laser beam L1 oscillated from the laser light source 12 is reduced in diameter by passing through the small diameter mask 14. The laser beam L1 reduced in diameter by the small-diameter mask 14 passes through the diffraction grating 18 and is split into a plurality of laser beams L2. The laser beam L2 dispersed by the diffraction grating 18 is reflected by the reflection mirror 16. The laser beam L2 reflected by the reflecting mirror 16 is irradiated onto the ceramic green sheet S while being condensed by the condenser lens 20. Thereby, a predetermined through hole 32 is formed in the ceramic green sheet S.
Here, since the laser beam L1 is incident on the diffraction grating 18 at an incident angle of approximately 90 degrees, no distortion occurs in the arrangement of the laser beams L2 dispersed by the diffraction grating 18. Further, since the zero-order light in the laser beam L2 that has been split is incident on the condenser lens 20 at an incident angle of approximately 90 degrees, the laser beam L2 that has been split by the diffraction grating 18 is incident on the condenser lens 20. No distortion occurs. Thereby, it can prevent that the shape of the laser beam L2 irradiated to the ceramic green sheet S collapse | crumbles and can improve a processing precision.

In addition, in the ceramic green sheet processing apparatuses 10 and 50 according to the first embodiment and the second embodiment, the reflection mirror 16 is used, but a configuration without using the reflection mirror may be used. In this case, as shown in FIG. 5, the diffraction grating 18 and the condenser lens 20 are arranged so as to be parallel to each other, and the laser beam L1 oscillated from the laser light source 12 is incident on the incident surface of the diffraction grating 18. By arranging the laser light source 12 so as to be incident at an incident angle of approximately 90 degrees, the laser beam L1 is incident on the diffraction grating 18 at an incident angle of approximately 90 degrees. No distortion occurs in the arrangement of the laser beams L2. Further, since the zero-order light in the laser beam L2 that has been split is incident on the condenser lens 20 at an incident angle of approximately 90 degrees, the laser beam L2 that has been split by the diffraction grating 18 is incident on the condenser lens 20. No distortion occurs. Thereby, it can prevent that the shape of the laser beam L2 irradiated to the ceramic green sheet S collapse | crumbles and can improve a processing precision.
The laser beam L 1 oscillated from the laser light source 12 and reduced in diameter through the small-diameter mask 14 passes through the diffraction grating 18 and is split into a plurality of laser beams L 2 and is incident on the condenser lens 20. . At this time, since there is no reflecting mirror, the diameter of the laser beam L1 that has been reduced in diameter through the small-diameter mask 14 is incident on the condenser lens 20 in a large diameter state without being further reduced. As a result, the laser beam L2 is converged to a small diameter on the ceramic green sheet S, so that the small diameter processing of the through hole 32 formed in the ceramic green sheet S can be realized. In other words, the diameter ρ of the laser beam L2 on the ceramic green sheet S is ρ = f · λ / π · ω (f: focal length of the condensing lens 20, λ: wavelength of the laser beam L2, ω: condensing. (Diameter of the laser beam L2 incident on the lens 20). For this reason, when the laser beam L2 is incident on the condenser lens 20 in a state of a large diameter (a state where ω is large), the focal length (f) of the condenser lens 20 and the wavelength (λ) of the laser beam L2 are constant. The diameter ρ of the laser beam L2 on the ceramic green sheet S is reduced, and the small diameter processing of the through hole 32 formed in the ceramic green sheet S can be realized. Furthermore, since the shape of the laser beam L2 split by the diffraction grating 18 does not have a reflecting mirror, the spectral number of the laser beam L2 can be easily increased. As a result, the number of through holes 32 that can be simultaneously formed in the ceramic green sheet S can be increased, and the processing speed of the ceramic green sheet S can be greatly improved.

It is a schematic block diagram of the processing apparatus of the ceramic green sheet which concerns on 1st Embodiment of this invention. It is a perspective view of the ceramic green sheet which formed the through-hole in the ceramic green sheet using the ceramic green sheet processing apparatus concerning a 1st embodiment of the present invention. It is a schematic block diagram of the processing apparatus of the ceramic green sheet which concerns on 2nd Embodiment of this invention. It is a top view of the ceramic green sheet in which the through-hole was formed. It is a schematic block diagram of the processing apparatus of the ceramic green sheet used as the modification of the processing apparatus of the ceramic green sheet which concerns on 1st Embodiment of this invention. It is a schematic block diagram of the conventional ceramic green sheet processing apparatus.

Explanation of symbols

10, 50 Ceramic green sheet processing apparatus 12 Laser light source 14 Small diameter mask (laser diameter reducing means)
16 Reflection mirror (optical axis changing means)
18 Diffraction grating (Laser spectroscopy means)
20 Condensing lens (laser condensing means)
26 Laser light source drive control means (control means)
30 Grating position adjustment mechanism (position adjustment means)
32 Through hole

Claims (5)

A ceramic green sheet processing method for forming a plurality of through holes in a movable ceramic green sheet,
A laser beam diameter reducing step for reducing the diameter of the laser beam emitted from the laser light source through a laser diameter reducing means;
A laser beam spectroscopic step in which the laser beam reduced in diameter by the laser diameter reducing means is incident on the laser spectroscopic means at an incident angle of approximately 90 degrees and is split into a plurality of laser beam groups;
Laser that causes the zero-order light in the laser beam group dispersed by the laser spectroscopic means to enter the laser condensing means at an incident angle of approximately 90 degrees to be condensed, and irradiates the condensed laser beam onto the ceramic green sheet. Beam irradiation process;
A method for processing a ceramic green sheet, comprising:   2. The method of processing a ceramic green sheet according to claim 1, wherein the angle of the optical axis of the laser beam is changed by an optical axis changing means provided on the upstream side or the downstream side of the optical path of the laser spectroscopic means.   3. The method of processing a ceramic green sheet according to claim 1, wherein the laser beam is split by the laser beam splitting unit so that a plurality of laser beam groups that are split are arranged in a predetermined direction. The laser spectroscopic means is movably provided,
The method of processing a ceramic green sheet according to any one of claims 1 to 3, wherein the position of the laser spectroscopic means is adjusted by a position adjusting means. The method of processing a ceramic green sheet according to any one of claims 1 to 4, wherein the laser beam is a CO ₂ laser.

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