JP2006231584A - Liquid jet head - Google Patents

Abstract

A liquid ejecting head advantageous for high-density mounting and downsizing is provided.
A head body 1 that ejects ink in a pressure generation chamber 19 from a nozzle opening 15 on a nozzle surface, and disposed on the opposite side of the nozzle surface of the head body 1 to generate pressure in the pressure generation chamber 19 And an opening 35 through which the flexible circuit board 22 for inputting the drive signal to the piezoelectric vibrator 14 is inserted in the head substrate 33. By providing the contact point 36 with the flexible circuit board 22 on the inner side surface of the opening 35, it is possible to ensure conduction without bending the flexible circuit board 22, so that it is not necessary to secure a bending width, and the height is increased accordingly. Density mounting and downsizing are possible.
[Selection] Figure 1

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid supplied from a liquid cartridge or the like as droplets, and a liquid ejecting head, and relates to a liquid ejecting head advantageous for high-density mounting and downsizing. .

  In an ink jet recording apparatus, which is a typical example of a liquid ejecting apparatus, an ink jet recording head (liquid ejecting apparatus) having pressure generating means for pressurizing a pressure generating chamber and a nozzle opening for ejecting pressurized ink as ink droplets. Head) is mounted on a carriage.

  As shown in FIG. 7, the recording head includes a nozzle plate 50 having a plurality of nozzle openings 51, a flow path forming substrate 54 in which spaces for forming a pressure generation chamber 52 and an ink storage chamber 53 are formed, It has a flow path unit 57 that is laminated and joined with a diaphragm 56 that seals the other surface. The flow path unit 57 is fixed to a head case 59 in which the piezoelectric vibrator 58 is accommodated, generates pressure in the pressure generating chamber 52 by the deformation stress of the vibration plate 56 by the piezoelectric vibrator 58, and ink droplets from the nozzle opening 51. It is comprised so that may be injected.

In the recording head, a head substrate 60 for outputting a drive signal to be input to the piezoelectric vibrator 58 is disposed on the side opposite to the nozzle surface of the head case 59. The head substrate 60 and the piezoelectric vibrator 58 are electrically connected by a flexible circuit board 61. In the recording head, a slit-like opening 62 is formed in the head substrate 60, and a flexible circuit board 61 is inserted into the opening 62 to bend the tip, and a conductive pattern (not shown) formed on the substrate surface. For example, soldering is performed. In the figure, reference numeral 63 denotes an ink supply pipe 63 that receives ink to be introduced into the ink storage chamber 53 from an ink supply unit (not shown), and passes through an exposed hole 64 formed in the head substrate 60 and is located above the head substrate 60. It is supposed to be exposed.
JP-A-5-338159

  However, in the recording head, a slit-like opening 62 is formed in the head substrate 60, the flexible circuit board 61 is inserted into the opening 62, the tip is bent, and soldered to the substrate surface. Thus, since the front end portion of the flexible circuit board 61 is bent at a predetermined width, it is necessary to provide a certain bending width (bending allowance). If this bending width is too small, the elastic reaction force of the flexible circuit board 61 will increase and the soldering will be removed, and if it is forced to bend, the flexible circuit board 61 will be damaged. Limits arise. Further, the distance d between the exposure hole 64 for exposing the ink supply pipe 63 and the opening 62 cannot be made very small, and there is a limit to the high-density mounting of the head. In the recording head disclosed in Patent Document 1, the flexible circuit board 61 is penetrated through the head substrate and soldered. However, it is necessary to connect the penetrated substrate surface and the flexible circuit board with solder. For this reason, soldering is essential, and there is a problem in terms of the working environment.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid ejecting head that is advantageous for high-density mounting and downsizing.

  In order to solve the above-described problems, a liquid jet head according to the present invention includes a head body that ejects liquid in a pressure generation chamber from a nozzle opening of a nozzle surface, and the pressure generator that is disposed on the opposite side of the nozzle surface of the head body. A head substrate for outputting a drive signal input to a pressure generating means for generating pressure in the chamber, and a contact point with a flexible circuit board for inputting the drive signal to the pressure generating means is provided on a side surface of the head substrate. It is the gist.

  That is, in the liquid jet head according to the present invention, since the contact with the flexible circuit board for inputting the drive signal to the pressure generating means is provided on the side surface of the head substrate, the flexible circuit board is brought into contact with the contact on the side surface of the head substrate. Therefore, it is not necessary to bend and solder the flexible circuit board as in the prior art. For this reason, it is not necessary to ensure the bending width of the tip of the flexible circuit board, and the head itself can be miniaturized and high-density mounting can be achieved.

  In the liquid ejecting head according to the aspect of the invention, when the opening for inserting the flexible circuit board is provided in the head substrate and the contact with the flexible circuit board is provided on the inner surface of the opening, Since the flexible circuit board has only to be brought into contact with the contacts on the inner surface, it is not necessary to secure the bending width of the tip of the flexible circuit board, and the head itself can be reduced in size and can be mounted with high density. In addition, since the electrical connection between the flexible circuit board and the substrate is ensured on the inner side surface of the opening formed in the head substrate, the position of the contact can be arranged by the arrangement of the opening. For this reason, the flexible circuit board is not forcibly routed, and the size and arrangement of the substrate are not restricted, and the degree of freedom in design is increased.

  In the liquid ejecting head according to the aspect of the invention, when a pressing member that presses the flexible circuit board against the contact on the inner surface of the head substrate is provided in the opening, the pressing circuit can press the flexible circuit board against the contact. For example, conduction is ensured without using solder, and the flexible circuit board is fixed to the contacts, improving the working environment and ensuring reliability.

  In the liquid ejecting head according to the aspect of the invention, the liquid ejecting head includes a liquid supply unit that supplies liquid to the head main body, and a seal member that seals between the head main body and the liquid supply unit, and the pressing member is provided on the seal member. In this case, by making the seal member and the pressing member the same component, it is possible to obtain a head that is advantageous for high-density mounting and miniaturization without using solder and without increasing the number of components and assembly work.

  In the liquid jet head of the present invention, the head substrate has a conductive coating layer formed over the circuit pattern on the substrate surface and the side surface facing the flexible circuit board, and the conductive coating layer constitutes a contact point. A contact can be easily formed only by forming a conductive coating layer over the circuit pattern on the substrate surface and the side surface.

In the liquid jet head of the present invention, when the head substrate and the head main body are bonded and fixed, the reliability of the joint between the flexible circuit board and the contact is obtained by bonding and fixing the head substrate and the head main body. Can be improved.
Further, in this case, when an adhesive layer is formed on the periphery of the head substrate, the liquid in the head body does not travel to the head substrate, thereby preventing damage to the head substrate.

  Next, embodiments of the present invention will be described in detail.

  1 to 4 are views showing an example of the structure of an ink jet recording head to which the present invention is applied. 1 is an exploded perspective view showing the overall structure of the recording head, FIG. 2 is a longitudinal sectional view of the recording head, FIG. 3 is a view of the recording head viewed from the head substrate side, and FIG. FIG.

  As shown in FIGS. 1 and 2, the recording head is arranged on the opposite side of the head body 1 that ejects the liquid in the pressure generating chamber 19 from the nozzle openings 15 on the nozzle surface and the nozzle surface of the head body 1. And a head substrate 33 for outputting a drive signal inputted to the piezoelectric vibrator (pressure generating means) 14 for generating pressure in the pressure generating chamber 19. The head main body 1 is supplied with ink ejected from the ink supply unit 45. In FIG. 1, the nozzle surface on which the nozzle openings 15 are formed is shown on the top, and in FIG. 2, the nozzle surface is shown on the bottom.

  The head body 1 includes a head case 16 in which the piezoelectric vibrator 14 is accommodated, and a flow path unit 26 that is fixed to a unit fixing surface of the head case 16 with an adhesive or the like.

  The flow path unit 26 supplies the nozzle plate 10 in which nozzle openings 15 for ejecting ink are formed in a row, a row of pressure generation chambers 19 communicating with the nozzle openings 15, and the pressure generation chambers 19. A flow path forming substrate 11 in which a flow path space including an ink storage chamber 17 that stores ink is formed, and a vibration plate that is bonded to one surface of the flow path forming substrate 11 and seals the flow path space including the pressure generation chamber 19. (Elastic plate) 12 is laminated.

  The nozzle plate 10 is provided with a plurality of nozzle openings 15 to form a nozzle array 25. In this example, two nozzle arrays 25 are formed to eject different types of ink. In this example, the nozzle plate 10 is formed of a stainless steel plate.

  The flow path forming substrate 11 is provided with a pressure generation chamber 19 that communicates with the nozzle openings 15. A common ink storage chamber 17 that communicates with each pressure generation chamber 19 via the ink supply path 18 and stores ink to be supplied to each pressure generation chamber 19 is arranged along the row of the pressure generation chambers 19. It is formed to be arranged.

  The nozzle row 25 is provided in a direction perpendicular to the paper surface in FIG. In this example, two nozzle rows 25 are provided, and two rows of pressure generating chambers 19 are provided so as to correspond to the nozzle rows 25. The rows of the pressure generating chambers 19 are arranged so as to face each other in two rows, and one common ink storage chamber 17 is arranged on each side corresponding to each row of the pressure generating chambers 19. . In this example, the flow path forming substrate 11 is formed by etching a Si single crystal substrate.

  The diaphragm 12 is made of a polyphenylene sulfide film, and is formed by laminating island portions 13 made of stainless steel.

  The nozzle plate 10 is stacked on one surface of the flow path forming substrate 11, and the flow path unit 26 is configured by stacking the diaphragm 12 on the other surface so that the island portion 13 is disposed outside.

  On the other hand, the head case 16 is formed by injection-molding a thermosetting resin or a thermoplastic resin, and the diaphragm 12 is deformed in an accommodation space 21 penetrating vertically in accordance with the pressure generating chambers 19. A piezoelectric vibrator 14 for generating pressure is accommodated in the pressure generating chamber 19.

  The piezoelectric vibrator 14 is a piezoelectric vibrator 14 in a longitudinal vibration mode, and the rear end side is fixed to the fixed plate 20, and the rod-like piezoelectric vibrators 14 form a row. The piezoelectric vibrator 14 is fixed to the fixed plate 20 in a row, and a flexible circuit board 22 is joined to the row of the piezoelectric vibrator 14 to constitute a vibrator unit 30.

  The vibrator units 30 are arranged at a constant pitch so that the piezoelectric vibrators 14 protrude in a rod shape toward the nozzle plate 10 from one end of the fixed plate 20 located on the nozzle plate 10 side. Further, in this example, two vibrator units 30 are provided corresponding to each of the rows of pressure generating chambers 19 arranged to face each other in a pair of two rows in the flow path unit 26. In this example, the fixing plate 20 is made of a metal plate such as aluminum.

  The head case 16 is formed with two housing spaces 21 for housing the vibrator unit 30 described above. The housing space 21 opens to the side opposite to the fixing surface of the flow path unit 26 of the head case 16, and the tip of the row of the piezoelectric vibrators 14 is arranged on the fixing surface of the flow path unit 26. The slit 32 for making it contact | abut to the 12 island parts 13 is formed.

  The front end surface of the piezoelectric vibrator 14 is fixed to the island portion 13 of the vibration plate 12 with the vibration plate 12 side of the flow path unit 26 bonded to the unit fixing surface of the head case 16 with an adhesive. The head body 1 is configured by the fixing plate 20 being bonded and fixed to the head case 16.

  The head case 16 is formed with an ink supply pipe 24 that receives ink supplied from the ink supply unit 45 so as to protrude on the side opposite to the unit fixing surface. The ink supply pipe 24 communicates with the ink storage chamber 17, and receives ink supplied from the ink supply unit 45 for ejection and supplies the ink to the ink storage chamber 17. Therefore, in this example, two ink supply pipes 24 are provided corresponding to the number of ink storage chambers 17 provided corresponding to the rows of pressure generation chambers 19.

  On the other hand, the head substrate 33 is disposed on the side opposite to the nozzle surface of the head body 1 and is placed on the surface opposite to the unit fixing surface of the head case 16.

  In this example, the head substrate 33 is obtained by laminating a copper foil on the surface of a printed board material obtained by laminating a glass fiber fabric and impregnating and solidifying a resin, and the circuit pattern 39 is formed by etching the copper foil. A formed printed circuit board is used.

  The head substrate 33 has two exposure holes 34 for exposing the ink supply tube 24 formed in the head case 16 of the head body 1 to the upper side of the head substrate 33 so that the ink can be supplied. Is provided.

  Further, the head substrate 33 has openings 35 that are joined to the rows of piezoelectric vibrators 14 provided corresponding to the nozzle rows 25 and into which the flexible circuit boards 22 for inputting drive signals to the piezoelectric vibrators 14 are inserted. Is formed. The openings 35 are formed in an elongated rectangular shape along the rows of the piezoelectric vibrators 14. A contact point 36 with the flexible circuit board 22 is provided on the inner side surface (inner side surface) of the opening 35.

  In this example, corresponding to the two nozzle rows 25, the two rows of pressure generating chambers 19 are arranged so as to face each other, and the pressure generating chambers 19 are arranged on both sides of the two rows of pressure generating chambers 19 respectively. Ink storage chambers 17 corresponding to these columns are provided. Accordingly, the rows of the piezoelectric vibrators 14 are arranged so as to correspond to the rows of the pressure generation chambers 19, the fixing plate 20 is positioned outside the row of the pressure generation chambers 19, and the flexible circuit board 22 is arranged in the pressure generation chamber 19. It is arranged inside the row.

  Since the exposed surface of the copper pattern of the flexible circuit board 22 exists on the surface where the flexible circuit board 22 is bonded to the piezoelectric vibrator 14, the opening 35 is arranged on the inner side of the row of the piezoelectric vibrators 14. The contact 36 is formed in the opening 35 on the surface facing the exposed copper pattern surface of the flexible circuit board 22. In this example, it is an inner surface located outside.

  As shown in FIG. 4, a conductive coating layer 36 is formed on the contact 36 across the circuit pattern 39 formed on the substrate surface and the side surface of the flexible circuit board 22 facing the copper pattern. Constitutes the contact 36.

  Specifically, various types can be applied as the conductive coating layer 36. For example, the conductive coating layer 36 is formed by applying a conductive paint, applying a conductive adhesive, forming a plating layer, or performing vapor deposition, sputtering, or the like to form the contact 36. it can. The circuit patterns 39 and the contacts 36 are formed in a number corresponding to each piezoelectric vibrator 14 so that one circuit pattern 39 and the contacts 36 correspond to one piezoelectric vibrator 14.

  When the conductive coating layer 36 is formed with a conductive adhesive, continuity can be ensured by bonding the flexible circuit board 22, so that workability is remarkably improved and reliability is also improved. Further, when the conductive coating layer 36 is formed of a plating layer, the contact rigidity is increased and the reliability is improved.

  A pressing member 37 that presses the flexible circuit board 22 against the contact 36 is provided in the opening 35 with the flexible circuit board 22 facing the contact 36 on the inner surface of the opening 35. The pressing member 37 is formed in a substantially wedge shape whose tip is slightly narrowed, and is formed of an elastic member such as an elastomer or rubber. Then, the flexible circuit board 22 is brought into contact with the contact 36 on the inner surface of the opening 35 to ensure conduction, and is pushed into the opening 35 from the upper surface of the head substrate 33 to press the flexible circuit board 22 toward the contact 36. The continuity between the flexible circuit board 22 and the contact 36 is ensured, and the flexible circuit board 22 is prevented from being detached from the contact 36.

  The head substrate 33 and the head body 1 are bonded and fixed by an adhesive layer 38. The adhesive layer 38 is annularly applied along the outer peripheral portions of the head substrate 33 and the head case 16. The head case 16 and the head substrate 33 are bonded and fixed, and the head case 16 and the head substrate 33 are fixed. Is sealed to prevent ink from entering. The adhesive layer 38 is not particularly limited as long as it can bond and seal the head case 16 and the head substrate 33. For example, a silicone-based adhesive can be suitably used. .

  The head body 1 is attached to the ink supply unit 45 in a state where the head substrate 33 is placed on the side opposite to the nozzle surface. The ink supply unit 45 supplies ink of an ink cartridge (not shown) to the head main body 1, and a flow path 44 for supplying ink of the ink cartridge to the head main body 1 is formed on the lower surface. The flow path 44 is for introducing ink into the ink supply pipe 24 of the head body 1, and the lower end opening of the flow path 44 is the opening of the ink supply pipe 24 exposed above from the exposed hole 34 of the head substrate 33. It is supposed to match.

  A seal member 40 is provided between the lower end opening of the flow path 44 of the ink supply unit 45 and the upper opening of the ink supply pipe 24 of the head body 1 to seal between the openings. The seal member 40 is formed in a plate shape, abuts the lower end opening of the flow path 44 of the ink supply unit 45 on the upper surface to seal the opening, and the upper surface opens the upper opening of the ink supply tube 24 of the head body 1. A seal portion 42 made of an elastic member that abuts and seals the opening, and a communication port 43 that communicates the lower end opening of the flow path 44 and the upper opening of the ink supply pipe 24 in the donut-shaped seal portion 42. Is provided.

  In the recording head configured as described above, the drive signal generated by a drive circuit (not shown) mounted on the head substrate 33 is input to the piezoelectric vibrator 14 via the flexible circuit board 22 so that the piezoelectric vibrator 14 is elongated. Stretched in the direction. The expansion and contraction of the piezoelectric vibrator 14 causes the island portion 13 of the diaphragm 12 to vibrate to change the pressure in the pressure generation chamber 19 so that the ink in the pressure generation chamber 19 is ejected as ink droplets from the nozzle openings 15. It has become. In the figure, reference numeral 27 denotes a head cover.

  The recording head is attached to a carriage that reciprocates in the paper width direction of the recording paper, and ejects ink droplets onto the recording paper while moving the carriage to print images and characters on the recording paper in a dot matrix. Yes.

  With such a configuration, the recording head of the present invention only needs to bend and solder the flexible circuit board 22 as in the prior art because the flexible circuit board 22 only needs to be brought into contact with the contact 36 on the side surface of the head substrate 33. Disappears. For this reason, it is not necessary to ensure the bending width of the front end portion of the flexible circuit board 22, and the head itself can be reduced in size and can be mounted with high density.

  Further, an opening 35 for inserting the flexible circuit board 22 is provided in the head substrate 33, and a contact 36 with the flexible circuit board 22 is provided on the inner surface of the opening 35. Since the flexible circuit board 22 has only to be brought into contact with the contact 36 on the inner surface, the head itself can be miniaturized and can be mounted with high density. Further, since the electrical connection between the flexible circuit board 22 and the substrate is ensured on the inner surface of the opening 35 formed in the head substrate 33, the position of the contact 36 can be arranged by the arrangement of the opening 35, and the flexible circuit board 22 is forcibly arranged. There is no need for routing and restrictions on the size and arrangement of the substrate, and the degree of freedom in design increases.

  Further, since the pressing member 37 that presses the flexible circuit board 22 against the contact 36 on the inner surface of the head substrate 33 is provided in the opening 35, the pressing circuit 37 can press the flexible circuit board 22 against the contact 36. For example, conduction is ensured without using solder, and the flexible circuit board 22 is fixed to the contacts, improving the working environment and ensuring reliability.

  The head substrate 33 has a conductive coating layer 36 formed over the circuit pattern 39 on the substrate surface and the side surface facing the flexible circuit board 22, and the conductive coating layer 36 constitutes a contact 36. The contact point can be easily formed only by forming the conductive coating layer 36 over the circuit pattern 39 and the side surface.

  Furthermore, since the head substrate 33 and the head main body 1 are bonded and fixed, the reliability of the joint between the flexible circuit board and the contacts is improved by bonding and fixing the head substrate 33 and the head main body 1. In addition, since the adhesive layer 38 is formed on the periphery of the head substrate 33, the ink of the head main body 1 does not travel to the head substrate 33, and the head substrate 33 is prevented from being damaged.

  FIG. 5 shows a second example of the recording head of the present invention.

  In this example, a pressing member 37 protrudes from the lower surface of an ink supply unit 45 that supplies ink to the head main body 1 and a seal member 40 that seals between the head main body 1 and the ink supply unit 45. Yes.

  In the sealing member 40, a pressing member 37 is formed of an elastic member similar to the elastic member forming the seal portion 42. Thus, since the sealing member 40 has the sealing part 42 originally formed from the elastic member, it is very convenient to integrally form the pressing member 37 formed from the same elastic member.

  The seal member 40 is formed with a confirmation window 41 when assembled along the pressing member 37. The confirmation window 41 is formed adjacent to the pressing member 37 on the side where the pressing member 37 presses the flexible circuit board 22. As a result, when the sealing member 40 is assembled while the pressing member 37 is inserted into the opening 35 with the head substrate 33 placed on the head body 1 and the flexible circuit board 22 inserted into the opening 35, the flexible circuit board 22. This makes it possible to work while confirming the state, and the workability is extremely improved.

  In this example, by making the seal member 40 and the pressing member 37 the same component, it is possible to obtain a head advantageous for high-density mounting and miniaturization without using solder without increasing the number of components and the assembly work. . Other than that, it is the same as that of the said Example, The same code | symbol is attached | subjected to the same part, and there exists an effect similar to the said Example.

  FIG. 6 shows a third example of the recording head of the present invention.

  This example corresponds to the two nozzle rows 25 and is arranged so that the rows of the two pressure generating chambers 19 face each other, as in the above-described embodiments, and the two rows of the pressure generating chambers 19 are arranged. Ink storage chambers 17 corresponding to the rows of pressure generation chambers 19 are provided on both sides of the recording medium. The rows of the piezoelectric vibrators 14 are arranged so as to correspond to the rows of the pressure generating chambers 19, the fixing plate 20 is positioned inside the rows of the pressure generating chambers 19, and the flexible circuit board 22 is arranged in the pressure generating chambers 19. It is arranged outside the row.

  Since the exposed surface of the copper pattern of the flexible circuit board 22 exists on the surface where the flexible circuit board 22 is bonded to the piezoelectric vibrator 14, the opening 35 is disposed outside the row of the piezoelectric vibrators 14. In the opening 35, the contact 36 is formed on the inner surface located inside. Other than that, it is the same as that of each said Example, The same code | symbol is attached | subjected to the same part, and there exists an effect similar to the said Example.

  In the above description, the flow path forming substrate 11 provided with two nozzle rows 25 and two ink storage chambers 17 is described. However, the present invention is not limited to this, and the nozzle rows 25 include three or more rows. The present invention can also be applied to the flow path forming substrate 11 in which three or more ink storage chambers 17 are formed or the flow path forming substrate 11 in which a plurality of ink storage chambers 17 corresponding to the plurality of nozzle rows 25 communicate with each other. In this case as well, the same effects can be obtained, and variations in the positional accuracy of the entire piezoelectric vibrator 14 can be suppressed. As a result, variations in the ejection characteristics of ink droplets can be reduced, leading to an improvement in image quality.

  In the above embodiments, the recording head including the piezoelectric vibrator 14 in the longitudinal vibration mode has been described. However, the present invention is not limited to this, and the present invention is applied to a recording head including the piezoelectric vibrator in the bending vibration mode. In addition, the pressure generating means can be applied not to a piezoelectric vibrator but to a bubble jet (registered trademark) type recording head that generates bubbles by heating a liquid in a pressure generating chamber.

  The present invention can be applied to a liquid ejecting apparatus, and a typical example thereof is an ink jet recording apparatus provided with an ink jet recording head for image recording. As other liquid ejecting apparatuses, for example, an apparatus having a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material (conductive paste) used for forming an electrode such as an organic EL display, a surface emitting display (FED), etc. ) An apparatus equipped with an ejection head, an apparatus equipped with a bioorganic matter ejection head used for biochip manufacturing, an apparatus equipped with a sample ejection head as a precision pipette, and the like.

FIG. 3 is an exploded perspective view illustrating an example of a recording head to which the present invention is applied. It is sectional drawing which shows the said recording head. It is the figure which looked at the said recording head from the head substrate side. It is a principal part expansion perspective view which shows the said head substrate. It is sectional drawing which shows the 2nd example of the recording head to which this invention is applied. It is sectional drawing which shows the 3rd example of the recording head to which this invention is applied. It is a figure which shows the conventional recording head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Head main body, 10 Nozzle plate, 11 Flow path formation board | substrate, 12 Diaphragm, 13 Island part, 14 Piezoelectric vibrator, 15 Nozzle opening, 16 Head case, 17 Ink storage chamber, 18 Ink supply path, 19 Pressure generation chamber, 20 fixed plate, 21 accommodating space, 22 flexible circuit board, 24 ink supply tube, 25 nozzle array, 26 flow path unit, 27 head cover, 30 transducer unit, 32 slit, 33 head substrate, 34 exposure hole, 35 opening, 36 Contact point (conductive covering layer), 37 pressing member, 38 adhesive layer, 39 circuit pattern, 40 sealing member, 41 confirmation window, 42 sealing portion, 43 communication port, 44 flow path, 45 ink supply unit, 50 nozzle plate, 51 Nozzle opening, 52 pressure generation chamber, 53 ink storage chamber, 54 flow path forming substrate, 56 Diaphragm, 57 Flow path unit, 58 Piezoelectric vibrator, 59 Head case, 60 Head substrate, 61 Flexible circuit board, 62 Opening, 63 Ink supply pipe, 64 Exposed hole

Claims (6)

A head main body that ejects liquid in the pressure generating chamber from the nozzle opening of the nozzle surface, and a drive signal that is disposed on the opposite side of the nozzle surface of the head main body and that is input to pressure generating means that generates pressure in the pressure generating chamber And a head substrate for outputting
A liquid ejecting head, wherein a contact point with a flexible circuit board for inputting a driving signal to a pressure generating means is provided on a side surface of the head substrate.   The liquid jet head according to claim 1, wherein an opening for inserting the flexible circuit board is provided in the head substrate, and a contact point with the flexible circuit board is provided on an inner surface of the opening.   The liquid ejecting head according to claim 2, wherein a pressing member that presses the flexible circuit board against a contact on an inner surface of the head substrate is provided in the opening.   The liquid ejection according to claim 3, further comprising: a liquid supply unit that supplies liquid to the head main body; and a seal member that seals between the head main body and the liquid supply unit, and the pressing member is provided on the seal member. head.   5. The head substrate has a conductive coating layer formed over a circuit pattern on the substrate surface and a side surface facing the flexible circuit board, and the conductive coating layer constitutes a contact point. Liquid jet head.   The liquid ejecting head according to claim 1, wherein the head substrate and the head main body are bonded and fixed.

Images