JP2006228960A - Laminate-chip transformer, laminate-chip coil and electronic circuit unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and thin laminate-chip transformer requiring no substrate in a state of a unit, a laminate-chip coil and an electronic circuit unit. <P>SOLUTION: The laminate-chip transformer 10 formed by laminating a magnetic sheet having a conductive pattern is encapsulated in a module 14. A DC-DC converter control IC 15 and a capacitor 16 which are connected to the wiring pattern 12 of an electrode pattern are mounted on a surface 11c equivalent to the side surface of the module 14, and electric components 17a, 17b and 17c connected to the wiring pattern 12 of an electrode pattern and lead lands 18a, 18b are arranged on the other side surface 11d of the module 14. An external lead wire 19 is connected to the lead lands 18a, 18b by soldering or the like. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multilayer chip transformer, a multilayer chip coil, and an electronic circuit unit, and more particularly to a multilayer chip transformer, a multilayer chip coil, and an electronic circuit unit that can be mounted on a thin electronic device.

  Conventionally, a multilayer chip transformer, particularly a thin multilayer chip transformer, has been used in various electronic devices.

  For example, a multilayer chip in which a plurality of magnetic sheets formed with a conductive pattern are formed into a coil in which one end of a lower conductive pattern is conductively connected through a through hole formed at the other end of the upper conductive pattern. A transformer is known (see, for example, Patent Document 1).

  Various techniques for mounting a circuit board on the upper surface (lower surface) of an oscillation transformer (coil) have been proposed. When a flash light emitting device is to be mounted on a portable phone, it is required to reduce the unit height of the flash light emitting device by reducing the height of the unit.

  For example, a technique for efficiently mounting a component by mounting the component on the lower surface of the transformer and arranging the component in the gap between the transformer and the substrate is known (for example, see Patent Document 2).

Furthermore, a technique is also known in which an insulating layer is provided on the upper surface of a transformer, a substrate is disposed thereon, and components are mounted (see, for example, Patent Document 3 and Patent Document 4).
JP-A-8-64420 Japanese Patent Laid-Open No. 11-135854 Japanese Patent Laid-Open No. 5-138228 JP-A-5-198445

  However, the multilayer chip transformer described in Patent Document 1 described above is used by mounting the chip transformer on a substrate, and other mounting components cannot be attached to the upper surface or the lower surface.

  In the techniques described in Patent Documents 2 to 4, since the components are mounted only on the upper surface or the lower surface of the transformer, the height as a unit is dominated by the highest circuit component to be mounted, which is useless. A lot of space is generated, resulting in a large unit. In addition, since the transformer has only a function as a transformer, a substrate for mounting other components is required on the transformer. In addition, the mounting space is limited, for example, a space is required between adjacent mounting parts.

  Accordingly, an object of the present invention is to provide a small and thin multilayer chip transformer, multilayer chip coil, and electronic circuit unit that do not require a substrate in the state of the unit.

  That is, the invention according to claim 1 is an electrode pattern for mounting an electronic component on a side surface of the laminated chip type transformer in a laminated chip type transformer formed by laminating magnetic sheets having a conductor pattern. It is characterized by having.

  According to a second aspect of the present invention, in the first aspect of the present invention, the electrode pattern and a conductor pattern provided on the magnetic sheet are further connected to a side surface of the multilayer chip transformer. And a conductive pattern including a conductive pattern.

  According to a third aspect of the present invention, in the second aspect of the present invention, a conductor for connecting conductor patterns provided on different side surfaces of the multilayer chip transformer on the magnetic sheet. A pattern is provided.

  The invention according to claim 4 is the invention according to claim 2, further comprising a conductor pattern on the upper or lower surface of the multilayer chip transformer, and a conductor pattern provided on the upper or lower surface; A conductive pattern for connecting the conductive pattern provided on the side surface is provided on the magnetic material sheet.

  The invention according to claim 5 is the invention according to claim 1, further comprising conductive patterns on the upper and lower surfaces of the multilayer chip transformer, and electrically connecting the conductive patterns on the upper and lower surfaces. It is characterized by having a through hole.

  According to a sixth aspect of the present invention, in the first aspect of the present invention, a conductive pattern for connecting a wiring material is further provided on a side surface of the multilayer chip transformer.

  The invention described in claim 7 is the invention described in claim 6, wherein the wiring member is a lead wire.

  The invention according to claim 8 is the invention according to claim 6, wherein the wiring member is a flexible substrate.

  The invention according to claim 9 is the invention according to claim 1, further comprising a conductive pattern for mounting a connector for connecting a wiring material on a side surface of the multilayer chip transformer. Features.

  The invention according to claim 10 is a laminated chip type transformer formed by laminating magnetic sheets having a conductor pattern, and an electrode pattern for mounting an electronic component on a side surface of the laminated chip type transformer, A laminated chip type transformer having a conductive pattern for connecting the electrode pattern and the conductive pattern provided on the magnetic sheet, and an electronic component mounted on the side surface of the laminated chip transformer, It is characterized by comprising.

  According to an eleventh aspect of the present invention, in the invention according to the tenth aspect, the multilayer chip transformer is a step-up transformer for charging a main capacitor for a flash light emitting device of a photographing apparatus, and the electronic component is A peripheral circuit of the flash light emitting device.

  The invention according to claim 12 is a laminated chip type coil formed by laminating magnetic sheets having a conductor pattern, and has an electrode pattern for mounting an electronic component on a side surface of the laminated chip type coil. It is characterized by that.

  According to a thirteenth aspect of the present invention, in the twelfth aspect of the present invention, the electrode pattern and a conductor pattern provided on the magnetic sheet are further connected to the side surface of the multilayer chip type coil. And a conductive pattern including a conductive pattern.

  The invention described in claim 14 is the conductor according to the invention described in claim 13, further comprising connecting conductor patterns provided on different side surfaces of the multilayer chip coil on the magnetic sheet. A pattern is provided.

  The invention according to claim 15 is the invention according to claim 13, further comprising a conductor pattern on the upper surface or the lower surface of the multilayer chip type coil, and a conductor pattern provided on the upper surface or the lower surface; A conductive pattern for connecting the conductive pattern provided on the side surface is provided on the magnetic material sheet.

  According to a sixteenth aspect of the invention, in the twelfth aspect of the invention, the laminated chip type coil further includes conductive patterns on the upper and lower surfaces, and the conductive patterns on the upper and lower surfaces are electrically connected. It is characterized by having a through hole.

  The invention described in claim 17 is the invention described in claim 12, further comprising a conductive pattern for connecting a wiring material on a side surface of the multilayer chip type coil.

  The invention described in claim 18 is the invention described in claim 17, characterized in that the wiring member is a lead wire.

  The invention according to claim 19 is the invention according to claim 17, wherein the wiring member is a flexible substrate.

  The invention according to claim 20 is the invention according to claim 12, further comprising a conductive pattern for mounting a connector for connecting a wiring material on a side surface of the multilayer chip type coil. Features.

  The invention according to claim 21 is a laminated chip type coil formed by laminating magnetic sheets having a conductor pattern, and an electrode pattern for mounting an electronic component on a side surface of the laminated chip type coil, A laminated chip type coil having a conductive pattern for connecting the electrode pattern and the conductive pattern provided on the magnetic sheet, and an electronic component mounted on the side surface of the laminated chip type coil, It is characterized by comprising.

  According to the present invention, a substrate can be made unnecessary in the state of a unit. Alternatively, even if a substrate is used, the area of the substrate can be reduced. Furthermore, a small and thin laminated chip type transformer, a laminated chip type coil, and an electronic circuit unit can be provided.

  According to the first and tenth aspects of the present invention, an electronic component can be mounted on the side surface of the multilayer chip transformer, so that a small and thin electric circuit unit can be formed.

  According to the second aspect of the present invention, since components related to the transformer can be mounted on the side surface of the multilayer chip transformer, a small and thin electric circuit unit can be formed.

  According to invention of Claim 3, an electronic component can be mounted in the side surface of a multilayer chip type | mold transformer. In addition, since conductor patterns on different side surfaces can be connected by conductor patterns provided on the magnetic sheet, conductor patterns can be efficiently arranged on a plurality of side surfaces, and these patterns can be electrically connected freely. Therefore, a small and thin electric circuit unit with high wiring density can be formed.

  According to invention of Claim 4, an electronic component can be mounted in the side surface of a laminated chip type | mold transformer. Moreover, since the conductor pattern for connecting the conductor pattern provided on the upper surface or the lower surface and the conductor pattern provided on the side surface is provided on the magnetic sheet, the conductor pattern is efficiently provided on the upper surface, the lower surface, or the side surface. Since these patterns can be freely and electrically connected, a small and thin electric circuit unit with high wiring density can be formed.

  According to the fifth aspect of the present invention, an electronic component can be mounted on the side surface of the multilayer chip transformer. Also, since the conductor pattern provided on the upper surface and the through hole for connecting the conductor pattern provided on the lower surface are provided, the conductor pattern can be efficiently arranged on the upper surface and the lower surface, and these Since the patterns can be electrically connected freely, a small and thin electric circuit unit with high wiring density can be formed.

  According to the invention described in claim 6, the electronic component can be mounted on the side surface of the laminated chip transformer, and the wiring material of the signal line that is input to or output from the electric circuit unit using the transformer is provided. Since it can be directly connected to the side surface of the transformer, the input / output signal line can be directly drawn out without using a substrate or the like. Therefore, it is possible to efficiently perform signal connection with an external circuit without routing extra signals.

  According to the invention described in claim 7, since the input / output signal line can be directly drawn to the outside by the lead wire without going through the substrate or the like, the external circuit can be efficiently connected with no extra signal routing. Signal connection between the two.

  According to the invention described in claim 8, since the input / output signal line can be directly drawn out to the outside by the signal line of the flexible substrate without going through the substrate or the like, it is efficiently performed without routing extra signals. Signal connection with an external circuit can be made.

  According to the ninth aspect of the present invention, the electronic component can be mounted on the side surface of the multilayer chip transformer, and the wiring material of the signal line that is input to or output from the electric circuit unit using the transformer Since it can be connected via a connector mounted on the side surface of the transformer, the above input / output signal lines can be directly pulled out without using a substrate or the like. Further, time-consuming work such as soldering can be omitted when connecting the wiring material to the transformer, and the reliability of the connecting portion can be enhanced.

  According to the eleventh aspect of the present invention, the peripheral circuit of the flash light emitting device of the photographing device can be formed as a compact electric circuit module in a small and thin shape.

  According to the invention described in claims 12 and 21, since the electronic component can be mounted on the side surface of the multilayer chip type coil, a small and thin electric circuit unit can be formed.

  According to the thirteenth and thirty-fourth aspects of the present invention, since components related to the coil can be mounted on the side surface of the multilayer chip type coil, a small and thin electric circuit unit can be formed.

  According to invention of Claim 14, an electronic component can be mounted in the side surface of a multilayer chip type coil. In addition, since conductor patterns on different side surfaces can be connected by conductor patterns provided on the magnetic sheet, conductor patterns can be efficiently arranged on a plurality of side surfaces, and these patterns can be electrically connected freely. Therefore, a small and thin electric circuit unit with high wiring density can be formed.

  According to the fifteenth aspect of the present invention, an electronic component can be mounted on the side surface of the multilayer chip type coil. Moreover, since the conductor pattern for connecting the conductor pattern provided on the upper surface or the lower surface and the conductor pattern provided on the side surface is provided on the magnetic sheet, the conductor pattern is efficiently provided on the upper surface, the lower surface, or the side surface. Since these patterns can be freely and electrically connected, a small and thin electric circuit unit with high wiring density can be formed.

  According to invention of Claim 16, an electronic component can be mounted in the side surface of a multilayer chip type coil. Also, since the conductor pattern provided on the upper surface and the through hole for connecting the conductor pattern provided on the lower surface are provided, the conductor pattern can be efficiently arranged on the upper surface and the lower surface, and these Since the patterns can be electrically connected freely, a small and thin electric circuit unit with high wiring density can be formed.

  According to the invention described in claim 17, the electronic component can be mounted on the side surface of the laminated chip type coil, and the wiring material of the signal line that is input to or output from the electric circuit unit using the coil is provided. Since it can be directly connected to the side surface of the transformer, the input / output signal line can be directly drawn out without using a substrate or the like. Therefore, it is possible to efficiently perform signal connection with an external circuit without routing extra signals.

  According to the invention described in claim 18, since the input / output signal line can be directly drawn out to the outside by the lead wire without going through the substrate or the like, the external circuit can be efficiently connected with no extra signal routing. Signal connection between the two.

  According to the nineteenth aspect of the present invention, the input / output signal line can be directly drawn out to the outside by the signal line of the flexible substrate without going through the substrate or the like, so that it is efficiently performed without routing extra signals. Signal connection with an external circuit can be made.

  According to the twentieth aspect, the electronic component can be mounted on the side surface of the multilayer chip type coil, and the wiring material of the signal line that is input to or output from the electric circuit unit using the coil Since the connection can be made via the connector mounted on the side surface of the coil, the input / output signal line can be directly drawn out without going through the substrate or the like. In addition, time-consuming work such as soldering when connecting the wiring member to the coil can be omitted, and the reliability of the connecting portion can be enhanced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is an external perspective view showing the configuration of the first embodiment of the multilayer chip transformer according to the present invention.

  In FIG. 1, a laminated chip transformer (hereinafter simply referred to as a transformer) 10 is applied to a DC / DC converter for a power supply circuit, and an upper surface of a module 14 including the transformer 10. A plurality of wiring patterns 12 and transformer terminals 13a and 13b are provided on 11a. The wiring pattern 12 has six surfaces 11a, 11b (bottom surface), 11c, 11d, 11e (surface opposite to 11c), 11f (11d) constituting the module 14 as second to fourth conductor patterns. It is formed across at least two of the opposing surfaces.

  For example, a DC / DC converter control IC 15 and a capacitor 16 connected to the wiring pattern 12 (electrode pattern) are mounted on the surface 11 c corresponding to the side surface of the module 14. The other side surface 11d of the module 14 is provided with electrical components 17a, 17b, 17c connected to the wiring pattern (electrode pattern) 12, and lead lands 18a, 18b. An external lead wire 19 is connected to the lead lands 18a and 18b by soldering or the like.

  Components such as the capacitor 16 and the electrical components 17a, 17b, and 17c that are high in height are mounted on the side surfaces 11c to 11f of the module 14. As a result, the height of the module 14 can be kept low, and a useless space around a high-height component can be reduced.

  The surfaces 11a to 11f of the module 14 are formed by plating a conductor and then connecting the wiring pattern 12 and connecting lands such as transformer terminals 13a and 13b and lead lands 18a and 18b by screen printing or the like. A mask is formed on the conductive pattern portion. Then, the conductor pattern portion is formed by removing the portion of the conductor where the mask is not formed by etching.

  The conductive pattern portion (wiring pattern 12) between the adjacent surfaces is electrically connected by the wiring pattern 12 on the adjacent surface formed by the above-described plating. Further, as will be described in detail later, the conductive pattern portions between the non-adjacent surfaces are made conductive by the conductive pattern portion formed in the inner layer as the transformer 10 in the module 14.

  FIG. 2 is a diagram showing the internal structure of the module 14 described above.

  In FIG. 2, the module 14 is actually formed by laminating a plurality of layers of magnetic sheets. The transformer windings 20 constituting the transformer 10 inside the module 14 are formed as conductor patterns (first conductor patterns) 20a on several layers 10a inside, for example. These constitute the transformer winding 20 by continuously connecting conductor patterns 20a formed in several layers.

  The module 14 is also provided with a wiring pattern 21a for electrically connecting the upper surface and the lower surface thereof with a through hole. Similarly, for example, a wiring pattern 21b in which the upper surface and the side surface are electrically connected by a through hole and a wiring pattern, a wiring pattern 21c in which the side surfaces are electrically connected, and the like are provided.

  That is, these wiring patterns 21 a to 21 c are formed in a layer in the module 14 together with the transformer winding 20.

  FIG. 3 is a diagram showing an example of the structure of the multilayer chip transformer in the first embodiment.

  In FIG. 3, the magnetic sheets 25 a and 25 b are composed of sheets without a coil conductor pattern for forming the lower and upper yokes for guiding the magnetic flux of the transformer 10. In FIG. 3, the magnetic sheets 25a and 25b are shown as being formed by one sheet, but in actuality, the sheets are laminated in such a number that a necessary magnetic path cross-sectional area can be obtained. It has a configuration.

  In the magnetic sheets 26a to 26k constituting the inner layer sandwiched between the magnetic sheets 25a and 25b, through holes and conductor patterns are formed in the respective sheets.

The through hole is formed by drilling or punching with a mold. The conductor pattern is formed by screen printing.

  In FIG. 3, a magnetic sheet (second layer) 26a on which conductor patterns 28a and 29a are formed is laminated on the magnetic sheet (first layer) 25a which is the lowermost layer. The conductor patterns 28a and 29a are formed in parallel with each other on opposite sides of the magnetic sheet, and are formed by screen printing.

  Note that conductor patterns 28b to 28k, 29b to 29i, 30a to 30c and 31, 32, which will be described later, are also formed on the respective magnetic sheets 25b and 26a to 26k by screen printing.

One end portion 28 ₁ of the conductor pattern 28a is connected to a conductor pattern or terminal (not shown) provided on the side surface of the module 14 containing the transformer 10 as the starting end of the coil on the primary winding side. Further, the other end of the conductor pattern 28a, the through holes 28 ₂ to connect the conductor pattern 28b of the third layer to be described later is formed. Similarly, one end of the conductor pattern 29a is connected to a conductor pattern or terminal (not shown) provided on the side surface of the module 14 as the starting end of the coil on the secondary winding side. At the other end of the conductor pattern 29a, a through hole 29 ₂ is formed for connection to a third layer conductor pattern 29b described later.

  On the magnetic sheet (second layer) 26a, a magnetic sheet (third layer) 26b on which conductor patterns 28b and 29b are formed is laminated. The conductor patterns 28b and 29b are formed in parallel to the opposite sides of the magnetic sheet, and are formed in directions rotated 90 ° clockwise with respect to the conductor patterns 28a and 29a of the second layer 26a. Yes.

  In FIG. 3, the conductor patterns 28a, 28e, 28i and the conductor patterns 29a, 29e, 29i are formed in parallel to each other on opposite sides of the respective magnetic sheets, and the conductor patterns 28b, 28f. 28j and the conductor patterns 29b and 29f are respectively formed in the directions rotated 90 ° clockwise sequentially with respect to the conductor patterns 28a, 28e and 28i and the conductor patterns 29a and 29e formed in the next lower layer, respectively. Shall be.

One end of the conductor pattern 28b of the third layer through-hole 28 _3, the through-hole 28 ₄ is formed at the other end. Similarly, a through hole 29 ₃ is formed at one end of the conductor pattern 29b of the third layer, and a through hole 29 ₄ is formed at the other end. Then, with the through holes 28 ₃ are through holes 28 ₂ to connect the second layer conductor pattern 28a, likewise through holes 29 ₂ of the through-holes 29 ₃ and the second layer conductor pattern 29a is connected. As a result, the second-layer conductor pattern 28a and the third-layer conductor pattern 28b, and the conductor pattern 29a and the conductor pattern 29b are electrically connected to each other.

  Thereafter, similarly, the fourth to ninth magnetic sheets 26c to 26h are sequentially stacked and connected in the same manner.

A through hole 28 ₁₇ is formed at one end of the tenth-layer conductor pattern 28 i, and a through hole 28 ₁₈ is formed at the other end. On the other hand, a through hole 29 ₁₇ is formed at one end of the conductor pattern 29i of the tenth layer, and the other end (end portion 29 ₁₈ ) is provided on the side surface of the transformer as a terminal end of the secondary winding side coil. Conductor patterns or terminals that are not connected are connected. The through hole 28 ₁₇ is connected to the through hole 28 _{16 of} the ninth layer conductor pattern 28h. Similarly, the through hole 29 ₁₇ is connected to the through hole 29 _{16 of} the ninth layer conductor pattern 29h. In this way, the secondary winding of the transformer 10 is configured.

A through hole 28 ₁₉ is formed at one end of the eleventh layer conductor pattern 28j, and a through hole 28 ₂₀ is formed at the other end. The through hole 28 ₁₉ is connected to the through hole 28 _{18 of} the tenth layer conductor pattern 28i.

Further, a through hole 28 ₂₁ is formed at one end of the conductor pattern 28k of the twelfth layer, and the other end (end portion 28 ₂₂ ) is provided on the side surface of the module 14 as an end of the coil on the primary winding side. Conductor patterns or terminals that are not connected are connected. The through hole 28 ₂₁ is connected to the through hole 28 _{20 of} the eleventh layer conductor pattern 28j. In this way, the primary winding of the transformer 10 is configured.

On the twelfth layer magnetic material sheet 26k, a magnetic material sheet (13th layer) 25b, which is the uppermost layer for forming the upper yoke for guiding the magnetic flux of the transformer 10, is further laminated. In addition, a conductor pattern 30b which is not related to the primary winding and the secondary winding of the coil described above is formed on the magnetic sheet 25b of the thirteenth layer. The conductor pattern 30b has a through hole 30 ₅ at one end and a through hole 30 _{6 at the} other end.

The through hole 30 ₅ is formed in the ninth layer through the through holes 30 ₄ , 30 ₃ , and 30 ₂ formed in the 12th, 11th, and 10th magnetic sheets 26k, 26j, and 26i, respectively. and is connected to the through-hole 30 ₁ formed in the magnetic sheet 26h. Then, the through hole 30 _1, the other end is formed at one end of the conductor pattern 30a which is connected to the wiring pattern or terminals formed on the side surfaces of the module 14 (not shown).

On the other hand, the through hole 30 ₆ is connected to the through hole 30 ₈ formed in the eleventh layer magnetic sheet 26j via the through hole 30 ₇ formed in the twelfth layer magnetic sheet 26k. . The through hole 30 ₈ is formed at one end of a conductor pattern 30c connected to a wiring pattern or terminal (not shown) formed on the side surface of the module 14 at the other end.

  Thus, the transformer 10 can be configured.

  Thus, according to the multilayer chip transformer according to the present embodiment, a wiring pattern unrelated to the primary winding and secondary winding for the coil is formed together with the primary winding and secondary winding of the coil. ing. Thereby, it is possible to cope with the case where it is difficult to handle the wiring pattern on the surface of the transformer.

  Although not shown in the configuration example of FIG. 3, it is possible to electrically connect the upper surface and the lower surface of the transformer by penetrating the uppermost layer and the lowermost magnetic sheet with a through hole. Of course.

  In the above-described embodiment, the conductor pattern serving as the winding is configured to rotate 90 ° clockwise. However, the present invention is not limited to this, and may be counterclockwise, or electrical at an angle other than 90 °. It only has to be connected to.

  Furthermore, in the above-described configuration, the transformer turns ratio is close to 1: 1, but is not limited to this. For example, it is easy to configure a winding ratio other than 1: 1 by forming one of the windings from the second layer to the entire twelfth layer and forming the other winding in a part of the layers. It becomes possible.

  Further, the winding ratio per layer may be changed so that the winding ratio of the entire transformer is other than 1: 1.

  FIG. 4 shows a modification of the first embodiment.

  For example, as shown in FIG. 4B, when the ratio of the primary winding to the secondary winding is set to 1: 8, the configuration may be configured as shown in FIG. In this case, the magnetic sheet on which the conductor pattern is formed is composed of six layers 26a to 26f. In FIG. 4A, each layer is actually stacked, but is illustrated in a planar arrangement for the sake of simplicity.

  The second-layer magnetic sheet 26a, which is the lowermost layer in which the transformer windings are formed, is formed with a primary winding conductor pattern 35a and a secondary winding conductor pattern 36a as shown in the figure. The third-layer magnetic sheet 26b is formed with a primary winding conductor pattern 35b and a secondary winding conductor pattern 36b as shown in the figure.

  Similarly, conductor patterns 35c to 35f of the primary winding and conductor patterns 36c to 36f of the secondary winding are respectively formed on the third to seventh magnetic sheets 26c to 26f as shown in the drawing. . And, through holes are formed at both ends of each conductor pattern except for the start and end portions of the winding, so that the through holes formed in the conductor patterns of adjacent layers are electrically connected to each other. Thus, each winding is configured.

  In this case, four layers of the second layer 26a to the fifth layer 26d have one cycle, and the primary winding has one turn and the secondary winding has eight turns. Therefore, the winding ratio of this transformer is 1: 8. Note that the winding ratio of the transformer can be easily changed by changing the number of turns per layer.

  Here, the conductor pattern for the primary winding is formed thicker than the conductor pattern for the secondary winding, but this takes into account the amount of current.

(Second Embodiment)
5 and 6 show a second embodiment of the present invention, which shows a module configuration of a power boosting circuit using a coil. FIG. 5 is a circuit configuration diagram of the power boosting circuit, FIG. 6A is an external perspective view showing a module configuration of the power boosting circuit, and FIG. 5B is an external perspective view seen from the opposite side of FIG.

  In FIG. 5, an input terminal VIN and a ground terminal GND are connected to the input side of the coil L1 via a capacitor C1. On the other hand, an output terminal VOUT and a ground terminal GND are connected to the output side of the coil L1 through a diode D1. A control signal terminal SIG is connected to the gate of the transistor Q1.

  Since this power boosting circuit is well known, the description of its operation is omitted, and the configuration of the module will be described below.

  6A and 6B, an input terminal L1a and an output terminal L1b of the coil L1 are provided on the upper surface of the module 39 including the coil L1. These terminals L1a and L1b are connected to respective components mounted on the side portions other than the upper surface and the lower surface of the module 39 through the wiring pattern 46, respectively. In this case, the components mounted on the side surface portions are capacitors C1, C2, diode D1, transistor Q1, and lead lands 40a to 40e to which various leads described later are connected. Further, the wiring pattern 46 is formed on all the surfaces of the module 39 and across two or more surfaces.

  That is, the input terminal L1a is provided with the wiring pattern 46 so that the lead land 40a to which the VIN lead 41 is connected and the capacitor C1 are connected. A wiring pattern 46 is provided at the other end of the capacitor C1 so that a lead land 40b to which the GND lead 42 is connected is connected.

  On the other hand, a wiring pattern 46 is provided at the output terminal L1b so that a capacitor C2, a lead land 40d to which the diode D1 and further the VOUT lead 44 are connected are connected. The lead land 40d is also provided with a wiring pattern 46 so that a lead land 40e to which the GND lead 45 is connected via the capacitor C2 is connected. Further, the lead land 40e is provided with a wiring pattern 46 so that the source of the transistor Q1 and the lead land 40b are connected.

  The internal structure of the coil L1 is the same as that of the transformer winding shown in FIG. 3 or FIG. In FIGS. 3 and 4, there are a primary winding and a secondary winding. A coil L1 can be constituted by only one of these windings.

  In this way, the wiring pattern 46 is formed on all the surfaces of the module 39, and a high component such as a capacitor is mounted on the side surface of the module 39, so that a wasteful volume around the high component is reduced. Can be reduced. Furthermore, since the components around the coil are modularized and the leads are connected to the lead lands on the side surfaces of the module, a substrate is not required.

  In the second embodiment, the lead land is provided on the side surface of the module and the lead is connected for use. However, the present invention is not limited to this.

  For example, as shown in FIG. 7, connection may be made using a flexible substrate. That is, solder patterns 48a and 48b may be provided on the side surfaces of the module 47, and the connection patterns 49a and 49b of the flexible substrate 49 may be connected to the patterns 48a and 48b by soldering.

(Third embodiment)
FIGS. 8 and 9 show a third embodiment of the present invention, and show an example of the configuration of a flash light emitting device of a camera, which is an imaging device to which the multilayer chip transformer of the present invention is applied. FIG. 8 is a circuit configuration diagram of the flash light emitting device, FIG. 9A is an external perspective view showing the configuration of the module of the flash light emitting device, and FIG. 8B is an external perspective view seen from the opposite side of FIG. .

  In FIG. 8, a charge terminal CHG and a ground terminal GND are connected to the primary winding side of the transformer T11 via an input terminal VIN and a charge control IC U11. On the other hand, on the secondary winding side of the transformer T11, via the diode D11, one end of the resistor R11, the anode terminal XeA of the flash light emission tube (xenon tube; Xe tube) XE11, and the plus of the main capacitor C13 for xenon tube The terminal MC + and the ground terminal GND are connected.

  The other end of the resistor R11 is connected to the cathode terminal XeK of the xenon tube XE11 and one end of the resistor R12 via a diode D12 and a capacitor C11. Further, the other end of the resistor R11 is connected to the ground terminal GND through the transistor Q11, and the ground terminal GND is connected to the capacitor C12 and the primary winding of the transformer T12. The secondary winding side of the transformer T12 is connected to the trigger terminal TRG of the xenon tube XE11. Further, a control terminal FLSON for turning on / off the xenon tube XE11 is connected to the gate of the transistor Q11. A ground terminal GND is connected to the other end of the resistor R12. The ground terminal MCGND of the main capacitor C13 is common to the ground terminal GND.

  Since the circuit of this flash light emitting device is well known, the description of its operation is omitted, and the configuration of the module will be described below.

  9 (a) and 9 (b), terminals T11a, T11b, T11c and T11d of the transformer T11 are formed on the upper surface of the module 50 including the transformer T11. These terminals T11a to T11d are connected to each component mounted on the side surface of the module via a wiring pattern 59 formed on the module surface. In this case, the parts mounted on the side surface are lead lands to which the charging control ICU 11, transistor Q 11, capacitors C 11 and C 12, diodes D 11 and D 12, resistors R 11 and R 12, and various leads described later are connected. is there.

  That is, the wiring pattern 59 is provided to the terminal T11a so that the lead land 51a to which the VIN lead 53 is connected is connected. The terminal T11b is provided with a wiring pattern so that lead lands 51b and 51c to which the CHG lead 53 and the GND lead 55 are connected are connected via the charging control ICU11.

  The terminal T11c is provided with an MC plus lead land 51e for the main capacitor C13 and a Xe anode lead land 51f for the xenon tube XE11 via the wiring pattern 59 via the diode D11. The terminal T11c is provided with a wiring pattern 59 and an inner conductor pattern 59a so that the terminal T12b of the transformer T12 is connected via the resistor R11 and the capacitor C12.

  Further, the capacitor C12 is provided with a wiring pattern 59 so that the Xe cathode lead land 51g, the collector of the transistor Q11, and the capacitor C11 are connected via the diode D12. The capacitor C11 is also provided with a wiring pattern so that the Xe cathode lead land 51g and the resistor R12 are connected.

  A lead land 51d to which the FLSON lead 56 is connected is provided through the wiring pattern 59 at the gate of the transistor Q11. The emitter of the transistor Q11 is provided via a wiring pattern 59 so that a lead land 51h to which the MCGND lead 58 for the main capacitor C13 is connected and a terminal T12a of the transformer T12 are connected.

  A wiring pattern 59 and an inner conductor pattern 59a are provided at the terminal T11d of the transformer T11 so that the lead land 51h is connected together with the lead land 51c.

  The trigger lead 57 is connected to the lead land T12c of the transformer T12.

  The internal structure of the transformer T11 is the same as that of the transformer winding shown in FIG. 3 or FIG.

  In this way, since the wiring pattern was formed on all the surfaces of the module and the inner layer conductor pattern was formed and used, components with high height such as capacitors were mounted on the side surface of the module. In addition, it is possible to reduce a useless volume around a part having a height.

(Fourth embodiment)
In the first to third embodiments described above, a wiring material such as a lead wire is connected to the lead land on the side surface of the module. However, the present invention is not limited to this, and a connector or the like may be attached to the side surface portion of the module to attach the wiring material.

  FIG. 10 shows the fourth embodiment of the present invention, and is an external perspective view showing an example in which a connector for a wiring material is attached to a side surface portion of a module.

  In FIG. 10, lands 61a, 61b, and 61c are provided on the side surface portion of the module 60 including the multilayer chip transformer. For example, male connectors 62 are attached to these lands 61a to 61c. On the other hand, a female connector 64 is mounted on the wiring member 63 side so as to be fitted to the connector 62. When the connector 64 is attached to the connector 62, the module 60 is electrically connected to an external device via the wiring member 63.

  In addition, the connector attached to the module 60 and the connector attached to the wiring member may be paired with each other, and the male type and the female type are not limited thereto.

  FIG. 11 is an external perspective view showing an example in which a connector for a flexible substrate is attached to the side surface of the module.

  In FIG. 11, lands 61 a to 61 c are provided on the side surface portion of the module 60 including the multilayer chip transformer. An FPC connector 66 for connecting a flexible substrate (FPC) is attached to these lands 61a to 61c. On the other hand, on the side of the flexible substrate 67 as a wiring material, a tip portion attached to the FPC connector 66 is provided as a connection portion 67a. When the flexible board 67 is attached to the connector 66, the module 60 is electrically connected to an external device via the flexible board 66.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

1 is an external perspective view showing a configuration of a first embodiment of a multilayer chip transformer according to the present invention. It is a figure which shows the internal structure of the module 14 of FIG. It is the figure which showed the structural example of the multilayer chip transformer in 1st Embodiment. It is the figure which showed the modification of 1st Embodiment. The 2nd Embodiment of this invention is shown and it is a circuit block diagram of the step-up circuit for power supplies using a coil. In the second embodiment of the present invention, a module configuration of a power boosting circuit using a coil is shown, (a) is an external perspective view showing a module configuration of the power boosting circuit, (b) is ( It is the external appearance perspective view seen from the opposite side of a). It is the figure which showed the modification of 2nd Embodiment. FIG. 10 is a circuit configuration diagram of a flash light emitting device of a camera to which a multilayer chip transformer is applied, showing a third embodiment of the present invention. In the third embodiment of the present invention, a configuration example of a flash light emitting device of a camera to which a multilayer chip transformer is applied is shown, (a) is an external perspective view showing a configuration of a module of the flash light emitting device, (B) is the external appearance perspective view seen from the opposite side of (a). The 4th Embodiment of this invention is shown and it is the external appearance perspective view which showed the example by which the connector for wiring materials was attached to the side part of the module. It is an external appearance perspective view which shows another example of the 4th Embodiment of this invention, and showed the example by which the connector for flexible substrates was attached to the side part of the module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Stack type chip transformer (transformer), 11a-11f ... Surface, 12, 21a, 21b, 21c ... Wiring pattern, 13a, 13b ... Transformer terminal, 14 ... Module, 15 ... DC / DC converter control IC, 16 ... Capacitors, 17a, 17b, 17c ... Electrical parts, 18a, 18b ... Lead land, 19 ... Lead wire, 20 ... Transformer winding, 20a ... Conductor pattern, 25a ... Magnetic sheet (first layer), 25b ... Magnetic substance Sheet (13th layer), 26a ... Magnetic material sheet (2nd layer), 26b ... Magnetic material sheet (3rd layer), 26c ... Magnetic material sheet (4th layer), 26d ... Magnetic material sheet (5th layer) , 26e ... magnetic material sheet (sixth layer), 26f ... magnetic material sheet (seventh layer), 26g ... magnetic material sheet (eighth layer), 26h ... magnetic material sheet (9th layer), 26i ... magnetic Sheet (tenth layer), 26j ... magnetic sheet (eleventh layer), 26k ... magnetic sheet (twelfth layer), 28a~28k, 29a~29i, 30a~30c, 31,32 ... conductor pattern.

Claims (21)

In a laminated chip type transformer formed by laminating magnetic sheets having a conductor pattern,
A multilayer chip transformer having an electrode pattern for mounting an electronic component on a side surface of the multilayer chip transformer.   2. The conductor pattern including a conductor pattern for connecting the electrode pattern and a conductor pattern provided on the magnetic sheet on a side surface of the multilayer chip transformer. Laminated chip type transformer.   3. The multilayer chip transformer according to claim 2, further comprising a conductor pattern for connecting conductor patterns provided on different side surfaces of the multilayer chip transformer on the magnetic sheet.   Furthermore, the magnetic sheet has a conductor pattern on the upper surface or the lower surface of the multilayer chip transformer, and the conductor pattern provided on the upper surface or the lower surface is connected to the conductor pattern provided on the side surface. The laminated chip transformer according to claim 2, wherein the laminated chip transformer is provided on the top.   2. The multilayer chip according to claim 1, further comprising conductive patterns on an upper surface and a lower surface of the multilayer chip transformer, and through holes for electrically connecting the conductive patterns on the upper surface and the lower surface. Type transformer.   2. The multilayer chip transformer according to claim 1, further comprising a conductive pattern for connecting a wiring material on a side surface of the multilayer chip transformer.   The multilayer chip transformer according to claim 6, wherein the wiring material is a lead wire.   The multilayer chip transformer according to claim 6, wherein the wiring material is a flexible substrate.   2. The multilayer chip transformer according to claim 1, further comprising a conductive pattern for mounting a connector for connecting a wiring material on a side surface of the multilayer chip transformer. A laminated chip type transformer formed by laminating magnetic sheets having a conductor pattern,
A multilayer chip type comprising: an electrode pattern for mounting an electronic component on a side surface of the multilayer chip transformer; and a conductor pattern for connecting the electrode pattern and the conductor pattern provided on the magnetic sheet. With a transformer,
An electronic component mounted on the side surface of the multilayer chip transformer,
An electronic circuit unit comprising: The laminated chip transformer is a step-up transformer for charging a main capacitor for a flash light emitting device of a photographing device,
The electronic circuit unit according to claim 10, wherein the electronic component is a peripheral circuit of the flashlight emitting device. In a laminated chip coil formed by laminating magnetic sheets having a conductor pattern,
A multilayer chip type coil having an electrode pattern for mounting an electronic component on a side surface of the multilayer chip type coil.   Furthermore, it has a conductor pattern containing the conductor pattern for connecting the said electrode pattern and the conductor pattern provided on the said magnetic material sheet on the side surface of the said multilayer chip type coil. Multilayer chip type coil.   14. The multilayer chip coil according to claim 13, further comprising a conductor pattern for connecting conductor patterns provided on different side surfaces of the multilayer chip coil on the magnetic sheet.   Further, the magnetic material sheet has a conductor pattern on the upper surface or the lower surface of the multilayer chip coil, and the conductor pattern provided on the upper surface or the lower surface is connected to the conductor pattern provided on the side surface. The multilayer chip coil according to claim 13, wherein the multilayer chip coil is provided on the top.   The multilayer chip according to claim 12, further comprising conductive patterns on an upper surface and a lower surface of the multilayer chip coil, and through holes for electrically connecting the conductive patterns on the upper surface and the lower surface. Type coil.   The multilayer chip type coil according to claim 12, further comprising a conductive pattern for connecting a wiring material on a side surface of the multilayer chip type coil.   The multilayer chip coil according to claim 17, wherein the wiring member is a lead wire.   The multilayer chip coil according to claim 17, wherein the wiring member is a flexible substrate.   The multilayer chip type coil according to claim 12, further comprising a conductive pattern for mounting a connector for connecting a wiring material on a side surface of the multilayer chip type coil. A laminated chip type coil formed by laminating magnetic sheets having a conductor pattern,
A multilayer chip type comprising: an electrode pattern for mounting an electronic component on a side surface of the multilayer chip coil; and a conductor pattern for connecting the electrode pattern and the conductor pattern provided on the magnetic sheet. Coils,
An electronic component mounted on the side surface of the multilayer chip coil;
An electronic circuit unit comprising:

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