JP2006208329A - Vertical coil spring probe - Google Patents

Abstract

[Purpose] A thin probe that can reliably ensure contact load and can withstand hundreds of thousands of uses.
[Configuration] Lower probe pin 200 in contact with the conductive pad, guide tube 300 connected to the connection portion 230 of the pin 200, upper probe pin 100 connected to the conductive pattern, and guide shaft portion of the pin 100 A compression coil spring 400 into which 130 is inserted is provided, and the distal end of the guide shaft portion 130 is inserted into the guide tube 300. The pin 200 has a lower probe pin contact portion 210 that contacts the conductive pad, a lower probe pin flange portion 220 that is thicker than the contact portion 210 following the contact portion 210, and a flange portion 220 that follows the flange portion 220. The thin connecting portion 230 is formed of a conductive material, and the pin 100 is connected to the upper probe pin connecting portion 110 connected to the conductive pattern, and the upper probe pin collar portion thicker than the connecting portion 110 is connected to the connecting portion 110. 120 and a guide shaft portion 130 that is thinner than the same flange portion 120 following the same flange portion 120 are formed of a conductive material, and the spring 400 is interposed between the same flange portion 120 and the same flange portion 220. .
[Selection] Figure 1

Description

  The present invention relates to a vertical coil spring probe used when measuring various electrical characteristics of an object to be measured such as a semiconductor integrated circuit.

  Conventionally, as a probe card using this type of compression coil spring, as shown in FIG. 15, a compression coil spring 710 is housed in a cylindrical body 700, and openings 701 and 702 are provided at both upper and lower ends of the cylindrical body 700. There is one in which the upper probe pin 720 and the lower probe pin 730 are brought into contact with the compression coil spring 710 through the openings 701 and 702, respectively. As described above, as a type in which the spring is built in the cylindrical body, JP-A No. 2004-340867, JP-A No. 2004-279141, JP-A No. 2004-138582, JP-A No. 10-253660, JP-A No. Hei 9 -1787872.

  In addition, there is a type in which a through hole perpendicular to the substrate is opened without using a cylinder and a spring is built in the through hole. For example, JP-T-2004-530870.

  Further, as shown in FIG. 16, there is a type in which the upper probe pin 720 and the lower probe pin 730 are connected via a spring 710 without providing a cylindrical body.

JP 2004-340867 A JP 2004-279141 A JP 2004-138582 A Japanese Patent Laid-Open No. 10-253660 JP-A-9-178772 JP-T-2004-530870

  However, in recent years, there is a tendency to manufacture more semiconductor integrated circuits from one wafer, a tendency that the interval between the conductive pads of the semiconductor integrated circuit is narrower, and the conductive pads provided in one semiconductor integrated circuit. There is a tendency to increase the number, and simultaneously, electrical specific measurement of a plurality of semiconductor integrated circuits is required.

  In order to cope with such a tendency, it is necessary to make the probe constituting the probe unit thin. However, as described in FIG. 15 and Patent Documents 1 to 5, the type in which the spring is built in the cylinder has a large overall thickness, which is required for the measurement of the required narrow pitch semiconductor integrated circuit. Cannot be used.

  Then, although the type which does not use a cylinder was invented, the thing of the type which opens a through-hole in a board | substrate among these, for example, what was described in Japanese translations of PCT publication No. 2004-530870 is actually unrealizable. . This is because it is technically difficult to open a through hole having a diameter of 100 μm on a substrate having a thickness of several mm. Moreover, although the through holes must be opened at intervals of 150 μm, it is actually difficult to open the through holes at such a narrow pitch.

  Then, there is a problem in the following points as to whether the type in which the upper and lower probe pins are connected to the upper and lower ends of the spring without using the cylindrical body as shown in FIG. That is, as shown in FIG. 16B, when overdrive (OD) is applied, the spring is distorted and displaced in the lateral direction (outside), which causes a problem of contact with the spring of the adjacent probe. . Note that, as shown in FIG. 15B, in the case where the spring 710 is incorporated in the cylindrical body 700, the displacement of the spring 710 is limited by the cylindrical body 700, so that such a problem does not occur.

  Furthermore, a certain level of contact pressure (about 5 g or more) with respect to the conductive pads of the semiconductor integrated circuit is required, but this contact pressure cannot be secured, for example, with a spring using a piano wire with a wire diameter of 20 μm. In addition, overdrive is applied to the coil spring probe during measurement, but it cannot withstand tens of thousands of measurements, and the coil spring is deformed.

  The present invention was devised in view of the above circumstances, and even with a thinner vertical coil spring probe, a contact load can be reliably ensured and it can withstand use on the order of several hundred thousand times. The purpose is a vertical coil spring probe.

  The vertical coil spring probe according to the present invention is connected to the lower probe pin that contacts the conductive pad of the object to be measured, the guide tube connected to the connection portion at the upper end of the lower probe pin, and the conductive pattern of the probe card. And a compression coil spring into which a guide shaft portion of the upper probe pin is inserted, and a tip end of the guide shaft portion inserted into the compression coil spring is inserted into the guide tube.

  The lower probe pin has a lower probe pin contact portion that contacts the conductive pad, a lower probe pin contact portion that is thicker than the lower probe pin contact portion, and a lower probe pin contact portion that follows the lower probe pin contact portion. The upper probe pin connected to the conductive pattern is integrally formed of a conductive material with a connecting portion thinner than the lower probe pin flange, following the side probe pin flange. The connection part, the upper probe pin connection part, the upper probe pin flange part thicker than the upper probe pin connection part, and the guide pin part thinner than the upper probe pin flange part are conductive. The compression coil spring is interposed between the upper probe pin flange and the lower probe pin flange.

  The guide tube may be formed by winding a wire.

  Further, the distance between the tip of the guide shaft portion of the upper probe pin and the connection portion of the lower probe pin when no external force is applied is set larger than the overdrive amount.

  The compression coil spring is formed by winding a conductive wire.

  Alternatively, the compression coil spring is obtained by winding a conductive plate material.

  The compression coil spring is connected to the upper end of the guide tube.

  Another vertical coil spring probe according to the present invention is in contact with a conductive pad of a measurement object, and is connected to a lower probe pin having a bottomed cylindrical guide formed at the upper end and a conductive pattern of a probe card. An upper probe pin and a compression coil spring into which a guide shaft portion of the upper probe pin is inserted are provided, and a distal end of the guide shaft portion inserted into the compression coil spring is inserted into the guide portion.

  The lower probe pin is electrically conductive with a lower probe pin contact portion that contacts the conductive pad, and a bottomed cylindrical guide portion that is thicker than the lower probe pin contact portion, following the lower probe pin contact portion. The upper probe pin is connected to the conductive pattern, and the upper probe pin is connected to the conductive pattern, and the upper probe pin is thicker than the upper probe pin connection. A flange and a guide shaft that is narrower than the upper probe pin flange are integrally formed from a conductive material following the upper probe pin flange, and the compression coil spring includes the upper probe pin It is interposed between the collar portion and the upper end of the guide portion.

  In the vertical coil spring probe according to the present invention, since the guide shaft portion, which is a part of the upper probe pin, is inserted into the compression coil spring, the compression coil spring can be displaced outward even when overdrive is applied. Absent. For this reason, contact does not occur between adjacent vertical coil spring probes without using a conventional cylindrical body. The required narrow pitch can also be accommodated.

  When a compression coil spring wound with a conductive plate is used, a higher contact pressure, for example, a contact pressure of about 6 g can be obtained when an overdrive of 300 μm is applied as shown in FIG. it can. This makes it possible to measure various electrical characteristics of the semiconductor integrated circuit more accurately.

  FIG. 1 is a schematic partial sectional view of a vertical coil spring probe according to a first embodiment of the present invention, and FIG. 2 is a schematic disassembly of the vertical coil spring probe according to the first embodiment of the present invention. FIGS. 3 and 3 are schematic partial cross-sectional views of the vertical coil spring probe according to the first embodiment of the present invention before and after overdrive, and FIG. 4 shows the first embodiment of the present invention. FIG. 5 is a schematic partial sectional view of a probe unit using such a vertical coil spring probe, FIG. 5 is a schematic partial sectional view of a vertical coil spring probe according to a second embodiment of the present invention, and FIG. FIG. 7 is a schematic exploded view of a vertical coil spring probe according to a second embodiment of the invention, and FIG. 7 is a schematic view of the vertical coil spring probe according to the second embodiment of the present invention before and after overdrive. FIG. 8 is a schematic partial sectional view after a bar drive, FIG. 8 is a schematic partial sectional view of a probe unit using a vertical coil spring probe according to the second embodiment of the present invention, and FIG. FIG. 10 is a schematic partial cross-sectional view of a vertical coil spring probe according to a third embodiment, FIG. 10 is a schematic exploded view of a vertical coil spring probe according to a third embodiment of the present invention, and FIG. FIG. 12 is a schematic partial cross-sectional view of the vertical coil spring probe according to the third embodiment before and after overdrive, and FIG. 12 shows the vertical coil spring probe according to the fourth embodiment of the present invention. 13 is a schematic partial cross-sectional view, FIG. 13 is a schematic exploded view of a vertical coil spring probe according to a fourth embodiment of the present invention, and FIG. 14 is a vertical coil according to a second embodiment of the present invention. It is a graph comparing the contact load to the conductive pads of the probe unit and the conventional probe unit using a spring probe.

  The vertical coil spring probe A according to the first embodiment of the present invention includes a lower probe pin 200 that contacts a conductive pad 810 of a semiconductor integrated circuit 800 that is a measurement object, and an upper end of the lower probe pin 200. A guide tube 300 connected to the connection portion 230 of the probe card 900, an upper probe pin 100 connected to the conductive pattern 910 of the probe card 900, and a compression coil spring 400 into which the guide shaft portion 130 of the upper probe pin 100 is inserted. The tip of the guide shaft portion 130 inserted into the compression coil spring 400 is inserted into the guide tube 300.

  The upper probe pin 100 is made of a conductive material such as tungsten. As shown in FIG. 2 and the like, the upper probe pin 100 is formed in a shape in which three portions are arranged in a line in the axial direction. That is, the upper probe pin 100 is thicker than the upper probe pin connection part 110 following the upper probe pin connection part 110 that contacts the conductive pattern 610 of the intermediate substrate 600 constituting the probe card and the upper probe pin connection part 110. The upper probe pin flange 120 is set, and the guide shaft 130 is set narrower than the upper probe pin flange 120 following the upper probe pin flange 120.

  Following the upper probe pin connection portion 110, an upper probe pin flange portion 120 corresponding to an intermediate portion of the upper probe pin 100 is formed in a cylindrical shape. In addition, the upper probe pin flange 120 is set to be thicker than the upper probe pin connecting portion 110, thicker than the inner diameter of the compression coil spring 400 described later, and the same diameter as the outer diameter of the compression coil spring 400. Therefore, the upper probe pin flange 120 does not enter the inside of the compression coil spring 400.

  The guide shaft portion 130 following the upper probe pin flange 120 is set to be thinner than the upper probe pin flange 120 and smaller than the inner diameter of a compression coil spring 400 described later. Therefore, the guide shaft portion 130 is inserted inside the compression coil spring 400. The guide shaft portion 130 is set to have a free length, that is, longer than the compression coil spring 400 in a state where no external force is applied. Therefore, when the guide shaft portion 130 is inserted into the compression coil spring 400, the tip of the guide shaft portion 130 protrudes from the compression coil spring 400.

  On the other hand, the lower probe pin 200 is made of a conductive material such as tungsten. As shown in FIG. 2 and the like, the lower probe pin 200 is formed in a shape in which three portions are arranged in a line in the axial direction. That is, the lower probe pin 200 follows the lower probe pin contact portion 210 whose tip is sharpened so as to contact the conductive pad 810 of the semiconductor integrated circuit 800, and the lower probe pin connection portion 210. A lower probe pin flange portion 220 that is thicker than the probe pin contact portion 210, and a connection portion 230 that is thinner than the lower probe pin flange portion 120 subsequent to the lower probe pin flange portion 220.

  The lower probe pin contact portion 210 of the lower probe pin 200 has a sharpened tip, and is set to a shape followed by a cylindrical shape. In FIG. 1 and FIG. 2 and the like, the lower probe pin contact portion 210 shows a sharpened tip, but a conductive pad such as a semiconductor integrated circuit or a light-emitting diode chip, which is the object to be measured. Various selections can be made according to the shape.

  As the shape of the lower probe pin contact portion 210, for example, the tip is rounded in a round shape, the tip is formed with four protrusions, the tip is sharpened in a cone shape, the tip is three Protrusions formed, 3 protuberances closely formed at the tip, tip formed in a triangular pyramid shape, tip rounded in a hemispherical shape, cup shaped with the tip recessed There are some that have a flat tip.

  The lower probe pin flange portion 220 following the lower probe pin contact portion 210 is set to be thicker than the inner diameter of the guide tube 300 described later and the same diameter as the outer diameter of the guide tube 300.

  Further, the connecting portion 230 following the lower probe pin flange 220 is set to have the same diameter as the lower probe pin contact portion 210 and slightly smaller than the inner diameter of the guide tube 300. For this reason, it can be connected to the connecting portion 230 in a state in which the guide tube 300 is fitted.

  On the other hand, the compression coil spring 400 is formed by winding a wire having a diameter of 45 μm. The compression coil spring 400 is constituted by winding a conductive wire such as spring stainless steel, a spring piano wire, an amorphous alloy, or the like. The compression coil spring 400 has an outer diameter of 200 μm and an inner diameter of 110 μm.

  The free length of the compression coil spring 400 is set shorter than the guide shaft portion 130.

  The guide tube 300 is made of a conductive material such as stainless steel. The guide tube 300 is connected to the lower probe pin 200 at the connecting portion 230. The length of the guide tube 300 is such that when the vertical coil spring probe A is used, the guide shaft portion 130 of the upper probe pin 100 and the connection portion 230 of the lower probe pin 200 when no external force is applied. Is set to have a distance larger than the overdrive amount (OD amount).

Next, the assembly of the vertical coil spring probe A composed of these components will be described.
First, the guide shaft portion 130 of the upper probe pin 100 is inserted from the upper end of the compression coil spring 400. In this state, the distal end of the guide shaft portion 130 protrudes from the lower end of the compression coil spring 400.
Further, the guide tube 300 is connected to the connection portion 230 of the lower probe pin 200.
Then, the tip of the guide shaft portion 130 is inserted into the guide tube 300. Then, the lower end of the compression coil spring 400 comes into contact with the upper end of the guide tube 300 in a state where the tip of the guide shaft portion 130 is inserted into the guide tube 300.
Thus, the vertical coil spring probe A is obtained.

  As shown in FIG. 4, the probe unit using the vertical coil spring probe A configured in this way has a casing 500 that houses the vertical coil spring probe A.

  The casing 500 includes an upper guide plate 510 having an upper opening 511 in which the upper probe pin flange 120 of the upper probe pin 100 of the vertical coil spring probe is located, and a lower probe pin contact portion of the lower probe pin 200. 210 includes a lower guide plate 520 having a lower opening 511 through which 210 passes, and a spacer 530 that forms a predetermined space between the upper guide plate 510 and the lower guide plate 520, and the upper opening 511. And the lower opening 521 are arranged at the same X and Y coordinates.

  The upper guide plate 510 is a flat plate made of an insulating material, and the thickness dimension thereof is set larger than the length dimension of the upper probe pin flange 120 of the upper probe pin 100. The upper guide plate 510 has a plurality of upper openings 511 corresponding to the arrangement of the conductive pads 810 of the semiconductor integrated circuit 800 that is the object to be measured. The upper opening 511 is set to be slightly larger than the outer diameter of the upper probe pin flange 120.

  The lower guide plate 520 is a flat plate made of an insulating material, and the thickness dimension thereof is set smaller than the length dimension of the lower probe pin contact portion 210 of the lower probe pin 200. . The lower guide plate 520 has a plurality of lower openings 521 corresponding to the arrangement of the conductive pads 810 of the semiconductor integrated circuit 800 that is the object to be measured. The lower opening 521 is set to be slightly larger than the outer diameter of the lower probe pin contact portion 210 and smaller than the outer diameter of the lower probe pin flange portion 220.

  A spacer 530 made of an insulating material is interposed between the upper guide plate 510 and the lower guide plate 520. The spacer 530 is for forming a predetermined space between the upper guide plate 510 and the lower guide plate 520, and is provided at a position avoiding the upper opening 511 and the lower opening 521.

  The upper opening 511 of the upper guide plate 510 and the lower opening 521 of the lower guide plate 520 are all opened corresponding to the arrangement of the conductive pads 810 of the semiconductor integrated circuit 800 that is the object to be measured. It is arranged at the Y coordinate.

  When measuring various electrical characteristics of the semiconductor integrated circuit 800 using the probe card configured as described above, the lower probe pin contact portion 210 of the lower probe pin 200 is brought into contact with the conductive pad 810 of the semiconductor integrated circuit 800. Then, overdrive (OD) is added (see FIG. 3B). The guide tube 300 constituting the vertical coil spring probe A has a length between the guide shaft portion 130 of the upper probe pin 100 and the connection portion 230 of the lower probe pin 200 when no external force is applied. Since the distance is set to be larger than the overdrive amount, the upper probe pin 100 and the lower probe pin 200 are in contact with each other even when overdrive is applied, as shown in FIG. There is no.

  In addition, since the guide shaft portion 130 of the upper probe pin 100 is inserted inside the compression coil spring 400, the compression tile spring 400 may be distorted and displaced outward as in the conventional case due to overdrive. Absent. For this reason, even if the distance between the adjacent vertical coil spring probes A is reduced, the adjacent vertical coil spring probes A do not contact each other when overdrive is applied.

As a modification of the above-described vertical coil spring probe A, a vertical coil spring probe B according to a second embodiment of the present invention will be described with reference to FIGS. The vertical coil spring probe B uses the same components as the vertical coil spring probe A described above for the upper probe pin 100 and the lower probe pin 200 among the components.
The vertical coil spring probe B is different from the vertical coil spring probe A in that the shape of the compression coil spring 400B and the compression coil spring 400B and the guide tube 300B are integrally formed.

  The guide tube 300B itself is connected to the connecting portion 230 of the lower probe pin 200 in the same manner as the vertical coil spring probe A described above. However, a compression coil spring 400B is continuously provided from the upper end of the guide tube 300B. That is, the guide tube 300B integrated with the compression coil spring 400B can be formed by rounding a vertically long strip-shaped metal plate member, in which elongated strip-shaped members are connected in an obliquely upward direction from the upper end, into a cylindrical shape. it can.

  For example, when a flat stainless steel wire having a width of 36 μm and a thickness of 20 μm is configured as a compression coil spring 400B having a coil diameter of 95 μm and a length of 5.0 mm, as shown in FIG. Even when the amount of overdrive is the same, it is possible to obtain a larger load than the one using a compression coil spring formed by winding (a conventional one).

  As described above, the vertical coil spring probe B in which the guide tube 300B and the compression coil spring 400B are integrated is connected to the connection portion 230 of the lower probe pin 200 at the lower end of the guide tube 300B, and then the upper probe pin 100 is connected. It can be simply configured by inserting the guide shaft portion 130 from above the compression coil spring 400B.

  Further, as shown in FIG. 7B, for example, the lower end of the guide shaft portion 130 of the upper probe pin 100 and the lower probe of the upper probe pin 100 in the state where the overdrive is applied as shown in FIG. The point that the upper end of the connection part 230 of the pin 200 is not in contact is the same as that of the vertical coil spring probe A described above.

  Further, as shown in FIG. 8, the probe unit using the vertical coil spring probe B configured as described above has a basic configuration, that is, a casing 500 including an upper guide plate 510, a lower guide plate 520, and a spacer 530. The upper probe pin flange 120 of the upper probe pin 100 is located in the upper opening 511 opened in the upper guide plate 510 and the lower opening 521 opened in the lower guide plate 520 The configuration in which the upper probe pin contact portion 210 of the lower probe pin 200 is located is the same as that of the probe unit using the vertical coil spring probe A described above.

As a modification of the above-described vertical coil spring probe A, a vertical coil spring probe C according to a third embodiment of the present invention will be described with reference to FIGS.
This vertical coil spring probe C uses the same components as the above-described vertical coil spring probe A for the upper probe pin 100 and the compression coil spring 400 among the components.
The vertical coil spring probe C is different from the vertical coil spring probe A in that a lower probe pin and a guide tube are integrally formed to form a guide portion 240C formed at the upper end of the lower probe pin 200C. Is a point.

  In the lower probe pin 200C in the vertical coil spring probe C, a bottomed cylindrical guide portion 240C is formed at the upper end. That is, the lower probe pin 200C includes a lower probe pin contact portion 210C whose tip is sharpened so as to contact the conductive pad 810 of the semiconductor integrated circuit 800, and an upper end from the upper end of the lower probe pin contact portion 210C. A bottomed cylindrical guide portion 240C extending toward the bottom is integrally formed.

  The inner diameter of the guide portion 240C is larger than the outer diameter of the guide shaft portion 130 so that the guide shaft portion 130 of the upper probe pin 100 can be inserted, so that the compression coil spring 400 does not enter. It is set smaller than the diameter.

  In the vertical coil spring probe C, after the guide shaft portion 130 of the upper probe pin 100 is inserted into the compression coil spring 400, the guide shaft portion 130 protruding from the lower end of the compression coil spring 400 is inserted into the guide portion 2470C. In addition, the lower end of the compression coil spring 400 is brought into contact with the upper end of the guide portion 240C.

  Further, as shown in FIG. 11B, for example, the lower end of the guide shaft portion 130 of the upper probe pin 100 and the lower probe in the state where the overdrive is applied, as shown in FIG. The pin 200 (specifically, the bottom portion of the guide portion 240C constituting a part of the lower probe pin 200) is not in contact with the pin 200 in the same manner as the vertical coil spring probe A described above.

  Further, the probe unit using the vertical coil spring probe C configured as described above also has a basic configuration, that is, a casing including an upper guide plate, a lower guide plate, and a spacer, and the upper guide plate. The upper probe pin flange 120 of the upper probe pin 100 is located in the upper opening opened in the upper guide pin, and the upper probe pin contact portion 210 of the lower probe pin 200 is located in the lower opening opened in the lower guide plate. The configuration is the same as that of the probe unit using the vertical coil spring probe A described above.

Next, as a modification of the above-described vertical coil spring probe A, a vertical coil spring probe D according to a fourth embodiment of the present invention will be described with reference to FIGS.
The vertical coil spring probe D uses the same components as the vertical coil spring probe A described above for the upper probe pin 100, the lower probe pin 200, and the compression coil spring 400 among the components.
The vertical coil spring probe D is different from the vertical coil spring probe A in the configuration of the guide tube 300D.

  The guide tube 300D itself is connected to the connecting portion 230 of the lower probe pin 200 in the same manner as the vertical coil spring probe A described above. However, the guide tube 300D is not a simple pipe like the guide tube 300 in the vertical coil spring probe A, but is formed by winding a wire rod into a substantially tubular shape.

  In addition, the lower end and lower side of the guide shaft portion 130 of the upper probe pin 100 with other points, that is, the point where the tip of the guide shaft portion 130 of the upper probe pin is inserted into the guide tube 300D and overdrive are added. The point that the upper end of the connection part 230 of the probe pin 200 is not in contact is the same as that of the vertical coil spring probe A described above.

  As shown in FIG. 12 and the like, the guide tube 300D has no gap between the wound wires. With such a configuration, there is no possibility of being distorted and displaced in the lateral direction (outside), and therefore, there is no possibility of contacting with a constituent member of the adjacent vertical coil spring probe.

  If a slight gap is provided between the wires constituting the guide tube 300D, the wire is deformed when overdrive is applied together with the compression coil spring 400. For this reason, there is an effect similar to that in which the compression coil spring 400 is strengthened, that is, an effect that the contact pressure at the time of overdrive can be increased.

  Further, the probe unit using the vertical coil spring probe D configured as described above also has a basic configuration, that is, a casing including an upper guide plate, a lower guide plate and a spacer, and the upper guide plate. The upper probe pin flange 120 of the upper probe pin 100 is located in the upper opening opened in the upper guide pin, and the upper probe pin contact portion 210 of the lower probe pin 200 is located in the lower opening opened in the lower guide plate. The configuration is the same as that of the probe unit using the vertical coil spring probe A described above.

1 is a schematic partial sectional view of a vertical coil spring probe according to a first embodiment of the present invention. 1 is a schematic exploded view of a vertical coil spring probe according to a first embodiment of the present invention. It is a schematic partial sectional view of the vertical coil spring probe according to the first embodiment of the present invention before and after overdrive. 1 is a schematic partial cross-sectional view of a probe unit using a vertical coil spring probe according to a first embodiment of the present invention. FIG. 6 is a schematic partial cross-sectional view of a vertical coil spring probe according to a second embodiment of the present invention. FIG. 5 is a schematic exploded view of a vertical coil spring probe according to a second embodiment of the present invention. It is a schematic partial sectional view of the vertical coil spring probe according to the second embodiment of the present invention before and after overdrive. FIG. 5 is a schematic partial cross-sectional view of a probe unit using a vertical coil spring probe according to a second embodiment of the present invention. FIG. 6 is a schematic partial cross-sectional view of a vertical coil spring probe according to a third embodiment of the present invention. FIG. 5 is a schematic exploded view of a vertical coil spring probe according to a third embodiment of the present invention. It is a schematic partial sectional view before and after overdrive of a vertical coil spring probe according to a third embodiment of the present invention. FIG. 6 is a schematic partial cross-sectional view of a vertical coil spring probe according to a fourth embodiment of the present invention. FIG. 6 is a schematic exploded view of a vertical coil spring probe according to a fourth embodiment of the present invention. It is the graph which compared the contact load to the conductive pad of the probe unit using the vertical coil spring probe which concerns on the 2nd Embodiment of this invention, and the conventional probe unit. FIG. 6 is a schematic partial cross-sectional view of a conventional vertical coil spring probe before and after overdrive. FIG. 6 is a schematic partial cross-sectional view of a conventional vertical coil spring probe before and after overdrive.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Upper probe pin 110 Upper probe pin connection part 120 Upper probe pin collar part 130 Guide shaft part 200 Lower probe pin 210 Lower probe pin contact part 220 Lower probe pin collar part 230 Connection part 300 Guide pipe 400 Compression coil spring A Vertical coil spring probe

Claims (9)

  The lower probe pin that contacts the conductive pad of the object to be measured, the guide tube connected to the connection portion at the upper end of the lower probe pin, the upper probe pin connected to the conductive pattern of the probe card, and the upper probe pin A vertical coil spring probe comprising a compression coil spring into which a guide shaft portion is inserted, and a distal end of the guide shaft portion inserted into the compression coil spring is inserted into the guide tube.   The lower probe pin has a lower probe pin contact portion that contacts the conductive pad, a lower probe pin contact portion that is thicker than the lower probe pin contact portion, and a lower probe pin contact portion that contacts the lower probe pin contact portion. The upper probe pin connecting portion connected to the conductive pattern is integrally formed of a conductive material with a connection portion narrower than the lower probe pin flange portion following the pin flange portion. And an upper probe pin flange that is thicker than the upper probe pin connector, and a guide shaft that is continuous with the upper probe pin flange and is thinner than the upper probe pin flange. The compression coil spring is integrally formed from a material, and is interposed between the upper probe pin flange and the lower probe pin flange. Vertical coil spring probe of claim 1 wherein symptoms.   The vertical coil spring probe according to claim 1 or 2, wherein the guide tube is formed by winding a wire.   The distance between the tip of the guide shaft portion of the upper probe pin and the connection portion of the lower probe pin when no external force is applied is set to be larger than the overdrive amount. The vertical coil spring probe according to 2 or 3.   5. The vertical coil spring probe according to claim 1, wherein the compression coil spring is formed by winding a conductive wire.   5. The vertical coil spring probe according to claim 1, wherein the compression coil spring is formed by winding a conductive plate.   The vertical coil spring probe according to claim 6, wherein the compression coil spring is connected to an upper end of the guide tube.   The lower probe pin that is in contact with the conductive pad of the object to be measured and has a bottomed cylindrical guide portion formed at the upper end, the upper probe pin that is connected to the conductive pattern of the probe card, and the guide shaft portion of the upper probe pin are A vertical coil spring probe comprising: a compression coil spring to be inserted; and a distal end of a guide shaft portion inserted into the compression coil spring being inserted into the guide portion.   The lower probe pin is electrically conductive with a lower probe pin contact portion that contacts the conductive pad, and a bottomed cylindrical guide portion that is thicker than the lower probe pin contact portion, following the lower probe pin contact portion. The upper probe pin is connected to the conductive pattern, and the upper probe pin is connected to the conductive pattern, and the upper probe pin is thicker than the upper probe pin connection. A flange and a guide shaft that is narrower than the upper probe pin flange are integrally formed from a conductive material following the upper probe pin flange, and the compression coil spring includes the upper probe pin 9. The vertical coil spring probe according to claim 8, wherein the vertical coil spring probe is interposed between the flange portion and the upper end of the guide portion.