JP2006299079A - Method for manufacturing polyimide precursor molded product - Google Patents
Method for manufacturing polyimide precursor molded product Download PDFInfo
- Publication number
- JP2006299079A JP2006299079A JP2005122481A JP2005122481A JP2006299079A JP 2006299079 A JP2006299079 A JP 2006299079A JP 2005122481 A JP2005122481 A JP 2005122481A JP 2005122481 A JP2005122481 A JP 2005122481A JP 2006299079 A JP2006299079 A JP 2006299079A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- polyimide precursor
- molding
- polyimide
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000004642 Polyimide Substances 0.000 title claims abstract description 40
- 229920001721 polyimide Polymers 0.000 title claims abstract description 40
- 239000002243 precursor Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000465 moulding Methods 0.000 claims abstract description 28
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 17
- 150000002148 esters Chemical class 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 125000003118 aryl group Chemical group 0.000 claims abstract description 6
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims abstract description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical group OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002904 solvent Substances 0.000 claims description 25
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 150000001408 amides Chemical class 0.000 claims description 14
- 230000015271 coagulation Effects 0.000 claims description 11
- 238000005345 coagulation Methods 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 8
- 230000008961 swelling Effects 0.000 abstract description 8
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- -1 aromatic diamine compound Chemical class 0.000 description 19
- 239000000047 product Substances 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 16
- 239000000835 fiber Substances 0.000 description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 206010042674 Swelling Diseases 0.000 description 7
- 150000004984 aromatic diamines Chemical class 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 6
- KDISMIMTGUMORD-UHFFFAOYSA-N 1-acetylpiperidine Chemical compound CC(=O)N1CCCCC1 KDISMIMTGUMORD-UHFFFAOYSA-N 0.000 description 6
- LNWWQYYLZVZXKS-UHFFFAOYSA-N 1-pyrrolidin-1-ylethanone Chemical compound CC(=O)N1CCCC1 LNWWQYYLZVZXKS-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- CTSLXHKWHWQRSH-UHFFFAOYSA-N oxalyl chloride Chemical compound ClC(=O)C(Cl)=O CTSLXHKWHWQRSH-UHFFFAOYSA-N 0.000 description 4
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 3
- YLHUPYSUKYAIBW-UHFFFAOYSA-N 1-acetylpyrrolidin-2-one Chemical compound CC(=O)N1CCCC1=O YLHUPYSUKYAIBW-UHFFFAOYSA-N 0.000 description 3
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000001112 coagulating effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- GXMIHVHJTLPVKL-UHFFFAOYSA-N n,n,2-trimethylpropanamide Chemical compound CC(C)C(=O)N(C)C GXMIHVHJTLPVKL-UHFFFAOYSA-N 0.000 description 3
- VIJUZNJJLALGNJ-UHFFFAOYSA-N n,n-dimethylbutanamide Chemical compound CCCC(=O)N(C)C VIJUZNJJLALGNJ-UHFFFAOYSA-N 0.000 description 3
- MBHINSULENHCMF-UHFFFAOYSA-N n,n-dimethylpropanamide Chemical compound CCC(=O)N(C)C MBHINSULENHCMF-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- QUNAYECDJMFUKV-UHFFFAOYSA-N 2,5-bis(methoxycarbonyl)terephthalic acid Chemical compound COC(=O)C1=CC(C(O)=O)=C(C(=O)OC)C=C1C(O)=O QUNAYECDJMFUKV-UHFFFAOYSA-N 0.000 description 2
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- TVWGIJDWKDJFDT-UHFFFAOYSA-N dimethyl 2,5-dicarbonochloridoylbenzene-1,4-dicarboxylate Chemical compound COC(=O)C1=CC(C(Cl)=O)=C(C(=O)OC)C=C1C(Cl)=O TVWGIJDWKDJFDT-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- AOXCXILUIVQCHH-UHFFFAOYSA-N n,n,n',n'-tetramethylpropanediamide Chemical compound CN(C)C(=O)CC(=O)N(C)C AOXCXILUIVQCHH-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- YFOOEYJGMMJJLS-UHFFFAOYSA-N 1,8-diaminonaphthalene Chemical compound C1=CC(N)=C2C(N)=CC=CC2=C1 YFOOEYJGMMJJLS-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- HFZWRUODUSTPEG-UHFFFAOYSA-N 2,4-dichlorophenol Chemical compound OC1=CC=C(Cl)C=C1Cl HFZWRUODUSTPEG-UHFFFAOYSA-N 0.000 description 1
- MJAVQHPPPBDYAN-UHFFFAOYSA-N 2,6-dimethylbenzene-1,4-diamine Chemical compound CC1=CC(N)=CC(C)=C1N MJAVQHPPPBDYAN-UHFFFAOYSA-N 0.000 description 1
- RXNOYRCWKRFNIM-UHFFFAOYSA-N 2-carbonochloridoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(Cl)=O RXNOYRCWKRFNIM-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical compound C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- NDXGRHCEHPFUSU-UHFFFAOYSA-N 3-(3-aminophenyl)aniline Chemical group NC1=CC=CC(C=2C=C(N)C=CC=2)=C1 NDXGRHCEHPFUSU-UHFFFAOYSA-N 0.000 description 1
- JFEXPVDGVLNUSC-UHFFFAOYSA-N 3-(3-aminophenyl)sulfanylaniline Chemical compound NC1=CC=CC(SC=2C=C(N)C=CC=2)=C1 JFEXPVDGVLNUSC-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- DCZSXWUEHRVCMN-UHFFFAOYSA-N 3-[1-(3-aminophenyl)ethyl]aniline Chemical compound C=1C=CC(N)=CC=1C(C)C1=CC=CC(N)=C1 DCZSXWUEHRVCMN-UHFFFAOYSA-N 0.000 description 1
- DVXYMCJCMDTSQA-UHFFFAOYSA-N 3-[2-(3-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC(N)=CC=1C(C)(C)C1=CC=CC(N)=C1 DVXYMCJCMDTSQA-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- RPVLRBMZSKOQSX-UHFFFAOYSA-N 3-[4-(3-aminophenyl)sulfonylphenyl]sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=CC(=CC=2)S(=O)(=O)C=2C=C(N)C=CC=2)=C1 RPVLRBMZSKOQSX-UHFFFAOYSA-N 0.000 description 1
- YJRWUTMEGNLLNV-UHFFFAOYSA-N 3-[6-(3-aminophenoxy)pyridin-2-yl]oxyaniline Chemical compound NC1=CC=CC(OC=2N=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 YJRWUTMEGNLLNV-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- HSBOCPVKJMBWTF-UHFFFAOYSA-N 4-[1-(4-aminophenyl)ethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)C1=CC=C(N)C=C1 HSBOCPVKJMBWTF-UHFFFAOYSA-N 0.000 description 1
- FDTGYANHAMAOCF-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=C(C)C=2)=C1 FDTGYANHAMAOCF-UHFFFAOYSA-N 0.000 description 1
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- FALSKAFGDLHVDW-UHFFFAOYSA-N 4-[4-(4-aminophenyl)sulfonylphenyl]sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(S(=O)(=O)C=2C=CC(N)=CC=2)C=C1 FALSKAFGDLHVDW-UHFFFAOYSA-N 0.000 description 1
- MUDNCBUJHBRRME-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dibromophenyl]butan-2-yl]-2,6-dibromophenoxy]aniline Chemical compound C=1C(Br)=C(OC=2C=CC(N)=CC=2)C(Br)=CC=1C(C)(CC)C(C=C1Br)=CC(Br)=C1OC1=CC=C(N)C=C1 MUDNCBUJHBRRME-UHFFFAOYSA-N 0.000 description 1
- UCGUBZDRPKFHQJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]butan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound C=1C(C)=C(OC=2C=CC(N)=CC=2)C(C)=CC=1C(C)(CC)C(C=C1C)=CC(C)=C1OC1=CC=C(N)C=C1 UCGUBZDRPKFHQJ-UHFFFAOYSA-N 0.000 description 1
- SCPMRYRMHUNXQD-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=C(C)C=2)=CC(C)=C1OC1=CC=C(N)C=C1 SCPMRYRMHUNXQD-UHFFFAOYSA-N 0.000 description 1
- QFKVSICCVWBSGV-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-chlorophenyl]propan-2-yl]-2-chlorophenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C(Cl)=CC=1C(C)(C)C(C=C1Cl)=CC=C1OC1=CC=C(N)C=C1 QFKVSICCVWBSGV-UHFFFAOYSA-N 0.000 description 1
- URSHIKLCCZNPFO-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-methylphenoxy]aniline Chemical compound CC1=CC(C(C=2C=C(C)C(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=CC=C1OC1=CC=C(N)C=C1 URSHIKLCCZNPFO-UHFFFAOYSA-N 0.000 description 1
- BVDPIHNAIJHQJK-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]butan-2-yl]-2-methylphenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C(C)=CC=1C(C)(CC)C(C=C1C)=CC=C1OC1=CC=C(N)C=C1 BVDPIHNAIJHQJK-UHFFFAOYSA-N 0.000 description 1
- ALFOPRUBEYLKCR-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]propan-2-yl]-2-methylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=CC=2)=CC=C1OC1=CC=C(N)C=C1 ALFOPRUBEYLKCR-UHFFFAOYSA-N 0.000 description 1
- UXBSLADVESNJEO-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(CC)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 UXBSLADVESNJEO-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- NAUSGUYYKKTJTC-UHFFFAOYSA-N 4-[4-[[4-(4-aminophenoxy)-3,5-dimethylphenyl]methyl]-2,6-dimethylphenoxy]aniline Chemical compound C=1C(C)=C(OC=2C=CC(N)=CC=2)C(C)=CC=1CC(C=C1C)=CC(C)=C1OC1=CC=C(N)C=C1 NAUSGUYYKKTJTC-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- YLZGEUWNNPEHBA-UHFFFAOYSA-N anthracene-1,8-diamine Chemical compound C1=CC(N)=C2C=C3C(N)=CC=CC3=CC2=C1 YLZGEUWNNPEHBA-UHFFFAOYSA-N 0.000 description 1
- UXOSWMZHKZFJHD-UHFFFAOYSA-N anthracene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC3=CC(N)=CC=C3C=C21 UXOSWMZHKZFJHD-UHFFFAOYSA-N 0.000 description 1
- SFUOZMCEWREBJE-UHFFFAOYSA-N anthracene-2,7-diamine Chemical compound C1=CC(N)=CC2=CC3=CC(N)=CC=C3C=C21 SFUOZMCEWREBJE-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- GSEZYWGNEACOIW-UHFFFAOYSA-N bis(2-aminophenyl)methanone Chemical compound NC1=CC=CC=C1C(=O)C1=CC=CC=C1N GSEZYWGNEACOIW-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- GUVUOGQBMYCBQP-UHFFFAOYSA-N dmpu Chemical compound CN1CCCN(C)C1=O GUVUOGQBMYCBQP-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- ROZPNEGZBIUWBX-UHFFFAOYSA-N n-[bis(diethylamino)phosphoryl]-n-ethylethanamine Chemical compound CCN(CC)P(=O)(N(CC)CC)N(CC)CC ROZPNEGZBIUWBX-UHFFFAOYSA-N 0.000 description 1
- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 description 1
- HBJPJUGOYJOSLR-UHFFFAOYSA-N naphthalene-2,7-diamine Chemical compound C1=CC(N)=CC2=CC(N)=CC=C21 HBJPJUGOYJOSLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- MIROPXUFDXCYLG-UHFFFAOYSA-N pyridine-2,5-diamine Chemical compound NC1=CC=C(N)N=C1 MIROPXUFDXCYLG-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- ABYXFACYSGVHCW-UHFFFAOYSA-N pyridine-3,5-diamine Chemical compound NC1=CN=CC(N)=C1 ABYXFACYSGVHCW-UHFFFAOYSA-N 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
本発明は、耐熱性及び力学的性質の優れたポリイミド成形体を製造するために有用なポリイミド前駆体成形物の製造方法に関する。 The present invention relates to a method for producing a polyimide precursor molded article useful for producing a polyimide molded article having excellent heat resistance and mechanical properties.
ポリイミドはその高い耐熱性や機械的物性から幅広く開発が成されている。とりわけ全芳香族ポリイミドはその剛直構造から特に高い耐熱性や機械的物性を発揮することが期待されている。
しかしながら、全芳香族ポリイミドは不融不溶であることから、ポリイミドの状態での成形加工が困難である。
Polyimide has been widely developed due to its high heat resistance and mechanical properties. In particular, wholly aromatic polyimides are expected to exhibit particularly high heat resistance and mechanical properties due to their rigid structure.
However, since the wholly aromatic polyimide is infusible and insoluble, it is difficult to mold it in the polyimide state.
そこでこの問題を回避するために、当該ポリイミドの前駆体の段階での成形加工、すなわちジアミン成分と酸無水物との反応生成物であるポリアミド酸の状態で成形または配向操作を行った後、イミド化してポリイミド成形体を得る方法が行なわれている。しかし、ポリアミド酸は一般に極めて加水分解しやすく、成形時及び熱イミド化時にその分子量が低下するという問題を有している。 Therefore, in order to avoid this problem, after performing molding or orientation operation in the state of polyamic acid which is a reaction product of a diamine component and an acid anhydride, molding is performed at the polyimide precursor stage. There is a method of obtaining a polyimide molded body by converting. However, polyamic acid is generally very easily hydrolyzed and has a problem that its molecular weight is lowered during molding and thermal imidization.
この問題点を解決すべく、ポリイミド前駆体としてポリアミド酸エステルを用いてポリイミド繊維、またはフィルムの検討が行われている。例えばポリアミック酸エステル、hexamethylphosphoric triamideとベンゼンからなるポリマー溶液をメタノールにて凝固後、延伸させてポリアミック酸エステル繊維を得ることが記載されている(非特許文献1)。しかし、ポリマー溶液を調整するのに使用する溶媒が人体に有害であることや、凝固するためにアルコールを使用していることから煩雑な設備が必要であり、工業的に簡易的なプロセスでポリイミド前駆体成形物を製造する方法が切望されていた。 In order to solve this problem, studies have been made on polyimide fibers or films using a polyamic acid ester as a polyimide precursor. For example, it is described that a polymer solution composed of polyamic acid ester, hexethylphosphoric triamide and benzene is solidified with methanol and then stretched to obtain polyamic acid ester fibers (Non-patent Document 1). However, the solvent used to prepare the polymer solution is harmful to the human body, and because alcohol is used to solidify, complicated equipment is required. A method for producing a precursor molding has been desired.
本発明の主たる目的は、上述の如き先行技術の問題点を解決し、分子量の低下を抑制可能で成形物の物性、構造に悪影響を及ぼすことなく、高度に配向したポリイミド繊維またはフィルム等の前駆体成形物の製造方法を提供することにある。 The main object of the present invention is to solve the problems of the prior art as described above, and suppress precursors such as highly oriented polyimide fibers or films that can suppress the decrease in molecular weight without adversely affecting the physical properties and structure of the molded product. It is providing the manufacturing method of a body molding.
本発明者は、上記の目的を達成するために鋭意検討を重ねた結果、凝固後の成形物にアミド系溶媒と水との混合液からなる膨潤剤を使用して膨潤処理を行い、続いて延伸処理をすることで簡便なプロセスで所望の成形物が得られることを発見し、本発明を導き出したものである。 As a result of intensive studies to achieve the above object, the present inventor performed a swelling treatment using a swelling agent composed of a mixed solution of an amide solvent and water on the molded product after solidification, and subsequently It has been discovered that a desired molded product can be obtained by a simple process by stretching, and the present invention has been derived.
すなわち、本発明は以下のとおりである。
1.下記式(I)
(R1は、炭素数が1から18の脂肪族アルコール残基、炭素数が7から18の芳香族アルコール残基、および炭素数が6から18の脂環族アルコール残基より選ばれ、同一または異なっていてもよい。Ar1は、以下のいずれかにより表される2価の芳香族基である。)
で表される繰り返し単位を主成分とするポリアミック酸エステルを含有する成形用ドープを成形し、得られた成形物を凝固液中に浸漬して凝固物を得た後、該凝固物を膨潤剤に浸漬し、次いで延伸することを特徴とするポリイミド前駆体成形物の製造方法。
2.凝固液が、水とアミド系溶媒とからなる混合液であり、混合液における水の含有量が50重量%以上であることを特徴とする上記に記載のポリイミド前駆体成形物の製造方法。
3.アミド系溶媒が、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド及びN,Nジメチルホルムアミドからなる群から選択される少なくとも1種であることを特徴とする上記に記載のポリイミド前駆体成形物の製造方法。
4.上記のいずれかの方法により得られるポリイミド前駆体成形物。
5.上記のいずれかの方法により得られたポリイミド前駆体成形物を熱処理することを特徴とするポリイミド成形物の製造方法。
6.上記の方法により得られるポリイミド成形物、である。
That is, the present invention is as follows.
1. Formula (I)
(R 1 is selected from an aliphatic alcohol residue having 1 to 18 carbon atoms, an aromatic alcohol residue having 7 to 18 carbon atoms, and an alicyclic alcohol residue having 6 to 18 carbon atoms. Ar 1 is a divalent aromatic group represented by any of the following:
After forming a molding dope containing a polyamic acid ester whose main component is a repeating unit represented by the formula, the obtained molding is immersed in a coagulation liquid to obtain a coagulation, and then the coagulation is swollen. A method for producing a polyimide precursor molded product, wherein the polyimide precursor molded product is dipped in, and then stretched.
2. The method for producing a polyimide precursor molded product as described above, wherein the coagulation liquid is a mixed liquid composed of water and an amide solvent, and the content of water in the mixed liquid is 50% by weight or more.
3. The polyimide precursor molding as described above, wherein the amide solvent is at least one selected from the group consisting of N-methyl-2-pyrrolidone, N, N-dimethylacetamide and N, N dimethylformamide Manufacturing method.
4). A polyimide precursor molded product obtained by any of the above methods.
5. A method for producing a polyimide molded product, comprising heat-treating a polyimide precursor molded product obtained by any one of the above methods.
6). It is the polyimide molding obtained by said method.
本発明により、高度に配向したポリイミド前駆体成形物を得ることができる。
また、本発明で得られるポリイミド前駆体成形物を熱処理することにより、分子量低下が抑制され、高度に配向したポリイミド成形物を得ることができる。
According to the present invention, a highly oriented polyimide precursor molding can be obtained.
Moreover, the polyimide precursor molding obtained by this invention is heat-processed, molecular weight fall is suppressed and the highly oriented polyimide molding can be obtained.
上記(I)式の繰り返し単位からなるポリマーは、(a)芳香族ジアミン化合物と(b)下記式
で表される酸塩化物とを用いて溶液重合を行うことにより製造される。
The polymer comprising the repeating unit of the above formula (I) is composed of (a) an aromatic diamine compound and (b) the following formula:
It is manufactured by performing solution polymerization using the acid chloride represented by these.
本発明で使用される(a)芳香族ジアミン化合物としては、
上記パラ配向性芳香族ジアミンと異なる芳香族ジアミン成分としては、例えばm−フェニレンジアミン、1,4−ジアミノナフタレン、1,8−ジアミノナフタレン、、2,7−ジアミノナフタレン、2,6−ジアミノアントラセン、2,7−ジアミノアントラセン、1,8−ジアミノアントラセン、2,4−ジアミノトルエン、2,5−ジアミノ(m−キシレン)、2,5−ジアミノピリジン、2,6−ジアミノピリジン、3,5−ジアミノピリジン、2,4−ジアミノトルエンベンジジン、3,3’−ジアミノビフェニル、3,3’−ジクロロベンジジン、3,3’−ジメチルベンジジン、3,3’−ジメトキシベンジジン、2,2’−ジアミノベンゾフェノン、4,4’−ジアミノベンゾフェノン、3,3’−ジアミノジフェニルエーテル、4,4’−ジアミノジフェニルエーテル、3,4’−ジアミノジフェニルエーテル、3,3’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、3,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルスルホン、3,3’−ジアミノジフェニルスルフィド、3,4’−ジアミノジフェニルスルフィド、4,4’−ジアミノジフェニルスルフィド、4,4’−ジアミノジフェニルチオエーテル、4,4’−ジアミノ−3,3’,5,5’−テトラメチルジフェニルエーテル、4,4’−ジアミノ−3,3’,5,5’−テトラエチルジフェニルエーテル、4,4’−ジアミノ−3,3’,5,5’−テトラメチルジフェニルメタン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,3−ビス(4−アミノフェノキシ)ベンゼン、1,4−ビス(3−アミノフェノキシ)ベンゼン、1,4−ビス(4−アミノフェノキシ)ベンゼン、2,6−ビス(3−アミノフェノキシ)ピリジン、1,4−ビス(3−アミノフェニルスルホニル)ベンゼン、1,4−ビス(4−アミノフェニルスルホニル)ベンゼン、1,4−ビス(3−アミノフェニルチオエーテル)ベンゼン、1,4−ビス(4−アミノフェニルチオエーテル)ベンゼン、4,4’−ビス(3−アミノフェノキシ)ジフェニルスルホン、4,4’−ビス(4−アミノフェノキシ)ジフェニルスルホン、ビス(4−アミノフェニル)アミンビス(4−アミノフェニル)−N−メチルアミンビス(4−アミノフェニル)−N−フェニルアミンビス(4−アミノフェニル)ホスフィンオキシド、1,1−ビス(3−アミノフェニル)エタン、1,1−ビス(4−アミノフェニル)エタン、2,2−ビス(3−アミノフェニル)プロパン、2,2−ビス(4−アミノフェニル)プロパン、2,2−ビス(4−アミノ−3,5−ジメチルフェニル)プロパン、4,4’−ビス(4−アミノフェノキシ)ビフェニル、ビス[4−(3−アミノフェノキシ)フェニル]スルホン、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、ビス[4−(4−アミノフェノキシ)フェニル]エーテル、ビス[4−(4−アミノフェノキシ)フェニル]メタン、ビス[3−メチル−4−(4−アミノフェノキシ)フェニル]メタン、ビス[3−クロロ−4−(4−アミノフェノキシ)フェニル]メタン、ビス[3,5−ジメチル−4−(4−アミノフェノキシ)フェニル]メタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,1−ビス[3−メチル−4−(4−アミノフェノキシ)フェニル]エタン、1,1−ビス[3−クロロ−4−(4−アミノフェノキシ)フェニル]エタン、1,1−ビス[3,5−ジメチル−4−(4−アミノフェノキシ)フェニル]エタン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[3−メチル−4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[3−クロロ−4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[3,5−ジメチル−4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、2,2−ビス[3−メチル−4−(4−アミノフェノキシ)フェニル]ブタン、2,2−ビス[3,5−ジメチル−4−(4−アミノフェノキシ)フェニル]ブタン、2,2−ビス[3,5−ジブロモ−4−(4−アミノフェノキシ)フェニル]ブタン、1,1,1,3,3,3−ヘキサフルオロ−2,2−ビス(4−アミノフェニル)プロパン、1,1,1,3,3,3−ヘキサフルオロ−2,2−ビス[3−メチル−4−(4−アミノフェノキシ)フェニル]プロパン等およびそれらのハロゲン原子あるいはアルキル基による芳香核置換体が挙げられる。 Examples of the aromatic diamine component different from the para-oriented aromatic diamine include m-phenylenediamine, 1,4-diaminonaphthalene, 1,8-diaminonaphthalene, 2,7-diaminonaphthalene, and 2,6-diaminoanthracene. 2,7-diaminoanthracene, 1,8-diaminoanthracene, 2,4-diaminotoluene, 2,5-diamino (m-xylene), 2,5-diaminopyridine, 2,6-diaminopyridine, 3,5 -Diaminopyridine, 2,4-diaminotoluenebenzidine, 3,3'-diaminobiphenyl, 3,3'-dichlorobenzidine, 3,3'-dimethylbenzidine, 3,3'-dimethoxybenzidine, 2,2'-diamino Benzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminodiphenyl amine 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylsulfone 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfide, 3,4′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl thioether, 4,4 ′ -Diamino-3,3 ', 5,5'-tetramethyldiphenyl ether, 4,4'-diamino-3,3', 5,5'-tetraethyldiphenyl ether, 4,4'-diamino-3,3 ', 5 , 5'-tetramethyldiphenylmethane, 1,3-bis (3-amino Enoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 2,6-bis (3 -Aminophenoxy) pyridine, 1,4-bis (3-aminophenylsulfonyl) benzene, 1,4-bis (4-aminophenylsulfonyl) benzene, 1,4-bis (3-aminophenylthioether) benzene, 1, 4-bis (4-aminophenylthioether) benzene, 4,4′-bis (3-aminophenoxy) diphenylsulfone, 4,4′-bis (4-aminophenoxy) diphenylsulfone, bis (4-aminophenyl) aminebis (4-Aminophenyl) -N-methylamine bis (4-aminophenyl) -N-phenylamine bis (4-aminophenyl) phosphine oxide, 1,1-bis (3-aminophenyl) ethane, 1,1-bis (4-aminophenyl) ethane, 2,2-bis (3-aminophenyl) propane, 2, 2-bis (4-aminophenyl) propane, 2,2-bis (4-amino-3,5-dimethylphenyl) propane, 4,4′-bis (4-aminophenoxy) biphenyl, bis [4- (3 -Aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] methane, Bis [3-methyl-4- (4-aminophenoxy) phenyl] methane, bis [3-chloro-4- (4-aminophenoxy) phenyl] methane Bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl] methane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3-methyl-4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3-chloro-4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [3,5-dimethyl-4- (4-amino) Phenoxy) phenyl] ethane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane, 2,2- Bis [3-chloro-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4 Aminophenoxy) phenyl] butane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] butane, 2,2-bis [3,5-dimethyl-4- (4-aminophenoxy) phenyl ] Butane, 2,2-bis [3,5-dibromo-4- (4-aminophenoxy) phenyl] butane, 1,1,1,3,3,3-hexafluoro-2,2-bis (4- Aminophenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane and the like and their halogen atoms or alkyl groups Aromatic nucleus substitution product by
ジアミン成分は、パラ配向性芳香族ジアミン単独からなるかあるいはパラ配向性芳香族ジアミンおよび上記の如きそれと異なる芳香族ジアミンとの組合せからなる。後者の組合せの場合、パラ配向性芳香族ジアミンは、全ジアミン成分に基づき、80モル%を超える割合、好ましくは90モル%を超える割合すなわちそれと異なる芳香族ジアミンが20モル%未満、好ましくは10モル%未満からなる。 The diamine component consists of a para-oriented aromatic diamine alone or a combination of a para-oriented aromatic diamine and a different aromatic diamine as described above. In the latter combination, the para-oriented aromatic diamine is based on the total diamine component in a proportion of more than 80 mol%, preferably more than 90 mol%, ie less than 20 mol%, preferably 10 It consists of less than mol%.
また、(b)の酸塩化物は公知の方法を用いて製造することが可能である。例えば、(1)ピロメリット酸二無水物をアルコールと反応させることでピロメリット酸ジエステルを合成する。ここで用いるアルコールとしては、炭素数が1から18の脂肪族アルコール、炭素数が6から18の芳香族アルコール、または炭素数が6から18の脂環族アルコールが使用され、特に炭素数が1から12の脂肪族アルコール、炭素数が6から12の脂環族アルコールが好ましく、中でも1級または2級のアルコールが好ましい。この反応は、単にピロメリット酸二無水物をアルコール中室温〜還流温度で反応させればよい。ただしこの際水分をできるだけ少なくすることが収率を上げるのに好ましい。(2)かくして得られるピロメリット酸ジエステルにオキサリルクロライド、塩化チオニル等を加えカルボン酸を塩化物とし、再結晶により(b)を得ることができる。 Moreover, the acid chloride of (b) can be manufactured using a well-known method. For example, (1) pyromellitic diester is synthesized by reacting pyromellitic dianhydride with alcohol. As the alcohol used here, an aliphatic alcohol having 1 to 18 carbon atoms, an aromatic alcohol having 6 to 18 carbon atoms, or an alicyclic alcohol having 6 to 18 carbon atoms is used. To 12 aliphatic alcohols and alicyclic alcohols having 6 to 12 carbon atoms are preferred, and primary or secondary alcohols are particularly preferred. This reaction may be performed by simply reacting pyromellitic dianhydride in alcohol at room temperature to reflux temperature. However, at this time, it is preferable to reduce the moisture as much as possible to increase the yield. (2) Oxalyl chloride, thionyl chloride, etc. are added to the pyromellitic acid diester thus obtained to make carboxylic acid chloride, and (b) can be obtained by recrystallization.
重合を行うのに用いる溶媒については、特に限定はされないが上記の如き原料モノマー(a)、(b)を溶解し、かつそれらと実質的に非反応性であり、好ましくは固有粘度が少なくとも1.0以上、より好ましくは1.2以上のポリマーを得ることが可能なものであれば如何なる溶媒も使用できる。例えば、N,N,N′,N′−テトラメチル尿素(TMU)、N,N−ジメチルアセトアミド(DMAC)、N,N−ジエチルアセトアミド(DEAC)、N,N−ジメチルプロピオンアミド(DMPR)、N,N−ジメチルブチルアミド(NMBA)、N,N−ジメチルイソブチルアミド(NMIB)、N−メチルピロリドン−2(NMP)、N−エチルピロリドン−2(NEP)、N−メチルカプロラクタム(NMC)、N,N−ジメチルメトキシアセトアミド、N−アセチルピロリジン(NAPR)、N−アセチルピペリジン、N−メチルピペリドン−2(NMPD)、N,N′−ジメチルエチレン尿素、N,N′−ジメチルプロピレン尿素、N,N,N′,N′−テトラメチルマロンアミド、N−アセチルピロリドン等のアミド系溶媒、p−クロルフェノール、フェノール、m−クレゾール、p−クレゾール、2,4−ジクロルフェノール等のフェノール系溶媒もしくはこれらの混合物をあげることができる。 The solvent used for the polymerization is not particularly limited, but dissolves the raw material monomers (a) and (b) as described above and is substantially nonreactive with them, and preferably has an intrinsic viscosity of at least 1.0. As long as it is possible to obtain a polymer of 1.2 or more, more preferably any solvent can be used. For example, N, N, N ′, N′-tetramethylurea (TMU), N, N-dimethylacetamide (DMAC), N, N-diethylacetamide (DEAC), N, N-dimethylpropionamide (DMPR), N, N-dimethylbutyramide (NMBA), N, N-dimethylisobutyramide (NMIB), N-methylpyrrolidone-2 (NMP), N-ethylpyrrolidone-2 (NEP), N-methylcaprolactam (NMC), N, N-dimethylmethoxyacetamide, N-acetylpyrrolidine (NAPR), N-acetylpiperidine, N-methylpiperidone-2 (NMPD), N, N'-dimethylethyleneurea, N, N'-dimethylpropyleneurea, N, Amido solvents such as N, N ', N'-tetramethylmalonamide, N-acetylpyrrolidone, phenols such as p-chlorophenol, phenol, m-cresol, p-cresol, 2,4-dichlorophenol It can be mentioned system solvent or a mixture thereof.
この場合、溶解性を上げるために重合前、途中、あるいは終了時に公知の無機塩を適当量添加しても差し支えない。このような無機塩として例えば、塩化リチウム、塩化カルシウム等が挙げられる。 In this case, in order to increase the solubility, an appropriate amount of a known inorganic salt may be added before, during or at the end of polymerization. Examples of such inorganic salts include lithium chloride and calcium chloride.
ポリアミック酸エステルの製造は、前記モノマー(a)、(b)を脱水した上記の溶媒中で通常のポリアミドの溶液重合法と同様に製造することができる。この際の反応温度は80℃以下、好ましくは60℃以下とする。温度が高すぎるとイミド化反応が起こることがあるためである。また、この時の濃度はモノマー濃度として1〜20wt%程度が好ましい。 The polyamic acid ester can be produced in the same manner as in the usual solution polymerization method of polyamide in the above-mentioned solvent obtained by dehydrating the monomers (a) and (b). The reaction temperature at this time is 80 ° C. or less, preferably 60 ° C. or less. This is because an imidization reaction may occur if the temperature is too high. The concentration at this time is preferably about 1 to 20 wt% as the monomer concentration.
また、本発明ではトリアルキルシリルクロライドをポリマー高重合度化の目的で使用することも可能である。
また、ポリアミック酸エステルを製造する際、これらの(a)芳香族ジアミン化合物と(b)酸塩化物のモル比として好ましくは0.90〜1.10、より好ましくは0.95〜1.05で、用いることが好ましい。
In the present invention, it is also possible to use trialkylsilyl chloride for the purpose of increasing the degree of polymerization of the polymer.
Further, when producing the polyamic acid ester, the molar ratio of these (a) aromatic diamine compound and (b) acid chloride is preferably 0.90 to 1.10, more preferably 0.95 to 1.05. And preferably used.
ポリアミック酸エステルの末端は封止されることもできる。末端封止剤を用いて封止する場合、その末端封止剤としては、例えばフタル酸クロライドおよびその置換体、アミン成分としてはアニリンおよびその置換体が挙げられる。 The terminal of polyamic acid ester can also be sealed. In the case of sealing with an end-capping agent, examples of the end-capping agent include phthalic acid chloride and substituted products thereof, and examples of the amine component include aniline and substituted products thereof.
一般に用いられる酸塩化物とジアミンの反応においては生成する塩化水素のごとき酸を捕捉するために脂肪族や芳香族のアミン、第4級アンモニウム塩を併用できる。 In the reaction of acid chlorides and diamines that are generally used, aliphatic or aromatic amines or quaternary ammonium salts can be used in combination in order to capture the acid such as hydrogen chloride that is produced.
ポリアミック酸エステルを含有する成形用ドープを得る方法としては、重合で得られたポリマー溶液をアルコール、水といった非溶媒に投入しポリマーを単離した後、適当な溶媒に再溶解して成形に用いる方法と重合で得られたポリマーをそのまま成形に用いる方法が好ましく挙げられる。再溶解して成形用ドープを調整する場合は、ポリマーの重合に用いた上記記載の溶媒を使用することができる。 As a method for obtaining a molding dope containing a polyamic acid ester, the polymer solution obtained by polymerization is poured into a non-solvent such as alcohol or water, the polymer is isolated, and then redissolved in an appropriate solvent and used for molding. The method and the method of using the polymer obtained by superposition | polymerization as it is for a shaping | molding are mentioned preferably. When adjusting the molding dope by re-dissolving, the above-mentioned solvent used for polymer polymerization can be used.
成形用ドープにおけるポリマーの濃度としては、ポリマーの種類により好ましい濃度が異なるので特に限定はされないが、0.1重量%〜30重量%、好ましくは1重量%〜25重量%である。 The concentration of the polymer in the dope for molding is not particularly limited because the preferable concentration varies depending on the type of polymer, but is 0.1 wt% to 30 wt%, preferably 1 wt% to 25 wt%.
以上の如き成形用ドープは、成形性にすぐれ、湿式法あるいはドライジェット湿式法により繊維、フィルム、パルプ状粒子等に成形することができる。
ドライジェット湿式法とは、紡糸用口金または成形用ダイから吐出したドープを一旦気体雰囲気下を通過させた後に凝固浴中に導入する方法で、特に成形物の表面の平滑化、ドラフトの増大等に効果がある。
The molding dope as described above has excellent moldability and can be formed into a fiber, a film, a pulp-like particle or the like by a wet method or a dry jet wet method.
The dry jet wet method is a method in which a dope discharged from a spinning die or a forming die is once introduced into a coagulation bath after passing through a gas atmosphere, and in particular, the surface of a molded product is smoothed, the draft is increased, etc. Is effective.
吐出(成形)したドープを凝固液中に浸漬して、凝固物を得る。
ここで凝固液としては、アミド系溶媒と水の混合溶媒を使用することができる。アミド系溶媒としては、N,N,N′,N′−テトラメチル尿素(TMU)、N,N−ジメチルアセトアミド(DMAC)、N,N−ジエチルアセトアミド(DEAC)、N,N−ジメチルプロピオンアミド(DMPR)、N,N−ジメチルブチルアミド(NMBA)、N,N−ジメチルイソブチルアミド(NMIB)、N−メチルピロリドン−2(NMP)、N−エチルピロリドン−2(NEP)、N−メチルカプロラクタム(NMC)、N,N−ジメチルメトキシアセトアミド、N−アセチルピロリジン(NAPR)、N−アセチルピペリジン、N−メチルピペリドン−2(NMPD)、N,N′−ジメチルエチレン尿素、N,N′−ジメチルプロピレン尿素、N,N,N′,N′−テトラメチルマロンアミド、N−アセチルピロリドン等もしくはこれらの混合溶媒が挙げられる。
The discharged (molded) dope is immersed in a coagulating liquid to obtain a coagulated product.
Here, as the coagulating liquid, a mixed solvent of an amide solvent and water can be used. Amide solvents include N, N, N ', N'-tetramethylurea (TMU), N, N-dimethylacetamide (DMAC), N, N-diethylacetamide (DEAC), N, N-dimethylpropionamide (DMPR), N, N-dimethylbutyramide (NMBA), N, N-dimethylisobutyramide (NMIB), N-methylpyrrolidone-2 (NMP), N-ethylpyrrolidone-2 (NEP), N-methylcaprolactam (NMC), N, N-dimethylmethoxyacetamide, N-acetylpyrrolidine (NAPR), N-acetylpiperidine, N-methylpiperidone-2 (NMPD), N, N'-dimethylethyleneurea, N, N'-dimethylpropylene Examples thereof include urea, N, N, N ′, N′-tetramethylmalonamide, N-acetylpyrrolidone, and the like, or a mixed solvent thereof.
アミド系溶媒と水との混合比率としては、凝固液の50重量%以上が水であり、より好ましくは55重量%以上が水である。50重量%よりも少ない場合は、凝固性が十分ではなく、ハンドリングが困難となる。
ついで、得られた凝固物を膨潤剤に浸漬してから適宜の延伸倍率の下で延伸した後、乾燥することでポリイミド前駆体成形物が得られる。
As a mixing ratio of the amide solvent and water, 50% by weight or more of the coagulation liquid is water, and more preferably 55% by weight or more is water. When the amount is less than 50% by weight, the solidification property is not sufficient and handling becomes difficult.
Next, the obtained solidified product is immersed in a swelling agent, and then stretched under an appropriate stretching ratio, followed by drying to obtain a polyimide precursor molded product.
ここで、膨潤剤としては、糸状を溶解することなく膨潤可能なアミド系溶媒と水の混合溶媒を使用することができる。アミド系溶媒としては、N,N,N′,N′−テトラメチル尿素(TMU)、N,N−ジメチルアセトアミド(DMAC)、N,N−ジエチルアセトアミド(DEAC)、N,N−ジメチルプロピオンアミド(DMPR)、N,N−ジメチルブチルアミド(NMBA)、N,N−ジメチルイソブチルアミド(NMIB)、N−メチルピロリドン−2(NMP)、N−エチルピロリドン−2(NEP)、N−メチルカプロラクタム(NMC)、N,N−ジメチルメトキシアセトアミド、N−アセチルピロリジン(NAPR)、N−アセチルピペリジン、N−メチルピペリドン−2(NMPD)、N,N′−ジメチルエチレン尿素、N,N′−ジメチルプロピレン尿素、N,N,N′,N′−テトラメチルマロンアミド、N−アセチルピロリドン等もしくはこれらの混合溶媒が挙げられる。 Here, as the swelling agent, a mixed solvent of amide solvent and water that can swell without dissolving the filament can be used. Amide solvents include N, N, N ', N'-tetramethylurea (TMU), N, N-dimethylacetamide (DMAC), N, N-diethylacetamide (DEAC), N, N-dimethylpropionamide (DMPR), N, N-dimethylbutyramide (NMBA), N, N-dimethylisobutyramide (NMIB), N-methylpyrrolidone-2 (NMP), N-ethylpyrrolidone-2 (NEP), N-methylcaprolactam (NMC), N, N-dimethylmethoxyacetamide, N-acetylpyrrolidine (NAPR), N-acetylpiperidine, N-methylpiperidone-2 (NMPD), N, N'-dimethylethyleneurea, N, N'-dimethylpropylene Examples thereof include urea, N, N, N ′, N′-tetramethylmalonamide, N-acetylpyrrolidone, and the like, or a mixed solvent thereof.
アミド系溶媒と水との混合比率としては、膨潤剤の50重量%以上がアミド系溶媒であり、より好ましくは55重量%以上がアミド系溶媒である。50重量%よりも少ない場合は、膨潤効果が十分ではなく、延伸処理を行うことが困難となる。 As a mixing ratio of the amide solvent and water, 50% by weight or more of the swelling agent is an amide solvent, and more preferably 55% by weight or more is an amide solvent. When the amount is less than 50% by weight, the swelling effect is not sufficient, and it is difficult to perform the stretching treatment.
これらの1例を示すと、ポリアミック酸エステルとアミド系溶媒とからなる成形用ドープを水/N−メチル−2−ピロリドン=70/30(wt/wt)の混合溶液からなる凝固液にドライジェット湿式法により吐出し、凝固を完了させ、続いて水/N−メチル−2−ピロリドン=30/70(wt/wt)の混合溶液からなる膨潤剤に通過させて凝固糸を膨潤させる。膨潤後、延伸、水洗および乾燥することにより高度に配向したポリイミド前駆体成形物を得ることができる。 As an example of these, a forming dope comprising a polyamic acid ester and an amide solvent is dry-jetted into a coagulating liquid comprising a mixed solution of water / N-methyl-2-pyrrolidone = 70/30 (wt / wt). It is discharged by a wet method to complete coagulation, and subsequently passed through a swelling agent composed of a mixed solution of water / N-methyl-2-pyrrolidone = 30/70 (wt / wt) to swell the coagulated yarn. After swelling, a highly oriented polyimide precursor molding can be obtained by stretching, washing with water and drying.
続いて、該ポリイミド前駆体成形物を熱処理することで、高度に配向したポリイミド成形物を得ることが可能である。
熱処理する温度としては200〜600℃の範囲であり、250〜550℃の範囲が好ましい。また、熱処理の雰囲気として空気中および窒素、アルゴンといった不活性雰囲気下で行うことができる。
Subsequently, a highly oriented polyimide molded product can be obtained by heat-treating the polyimide precursor molded product.
As temperature to heat-process, it is the range of 200-600 degreeC, and the range of 250-550 degreeC is preferable. In addition, the heat treatment can be performed in air or in an inert atmosphere such as nitrogen or argon.
以下、実施例により本発明をさらに具体的に説明するが、本発明はこれらによっていささかも限定されるものではない。
固有粘度(ηinh)は、3wt%LiCl N−メチル−2−ピロリドンを用いてポリマー濃度0.5g/dlで30℃において測定した値である。
EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited at all by these.
The intrinsic viscosity (ηinh) is a value measured at 30 ° C. with a polymer concentration of 0.5 g / dl using 3 wt% LiCl N-methyl-2-pyrrolidone.
[参考例1]
無水ピロメリット酸(以下PMDAということがある)200gと脱水エタノール600mlとを混合、還流しPMDAを完全に溶解させたのち、エタノール300mlを減圧留去した。得られた反応物を冷却後、沈澱物を濾別し、酢酸エチルを用いて数回洗浄することで2,5−ジカルボメトキシテレフタル酸を得た。得られた2,5−ジカルボメトキシテレフタル酸(70g)を酢酸エチル(500ml)に分散した後、オキサリルクロライド(65g)を添加して完全に溶解するまで反応した。減圧濃縮により溶媒を除去した後、ヘキサンで再結晶して得られる酸塩化物はNMR、赤外分析の結果、2,5−ジカルボメトキシテレフタル酸塩化物であることを確認した。250℃で脱水乾燥した塩化リチウムをN−メチルピロリドン(以下NMPということがある)に3wt%溶解し、パラフェニレンジアミン1.4852gを上記溶媒100ml中に乾燥窒素気流中で溶解した。このアミン溶液を外部冷却により−10℃に保ち、トリメチルシリルクロライド(1.8ml)を添加した。さらに上述の2,5−ジカルボメトキシテレフタル酸塩化物を2.3838gおよびテレフタル酸クロライドを1.3941g添加し、重合反応1時間せしめた。更に撹拌を室温で2時間続行し重合反応を終了した。反応終了後、常温に戻し大量のイオン交換水中に投入し重合体を析出させた。得られた重合体を濾別し、更にエタノール、アセトンで洗浄後、真空乾燥した。なお、3wt%LiCl N−メチル−2−ピロリドン溶液で測定したηinhは4.3であった。
3wt%LiCl NMP溶液に上記重合体を8wt%の濃度で溶解して成形用ポリマードープを調整した。
[Reference Example 1]
200 g of pyromellitic anhydride (hereinafter sometimes referred to as PMDA) and 600 ml of dehydrated ethanol were mixed and refluxed to completely dissolve PMDA, and then 300 ml of ethanol was distilled off under reduced pressure. After cooling the resulting reaction product, the precipitate was filtered off and washed several times with ethyl acetate to obtain 2,5-dicarbomethoxyterephthalic acid. The obtained 2,5-dicarbomethoxyterephthalic acid (70 g) was dispersed in ethyl acetate (500 ml), and then reacted until oxalyl chloride (65 g) was added and completely dissolved. After removing the solvent by concentration under reduced pressure, the acid chloride obtained by recrystallization with hexane was confirmed to be 2,5-dicarbomethoxyterephthalic acid chloride as a result of NMR and infrared analysis. 3% by weight of lithium chloride dehydrated and dried at 250 ° C. was dissolved in N-methylpyrrolidone (hereinafter sometimes referred to as NMP), and 1.4852 g of paraphenylenediamine was dissolved in 100 ml of the above solvent in a dry nitrogen stream. The amine solution was kept at −10 ° C. by external cooling, and trimethylsilyl chloride (1.8 ml) was added. Further, 2.3838 g of the above-mentioned 2,5-dicarbomethoxyterephthalic acid chloride and 1.3941 g of terephthalic acid chloride were added, and the polymerization reaction was allowed to proceed for 1 hour. Further, stirring was continued at room temperature for 2 hours to complete the polymerization reaction. After completion of the reaction, the temperature was returned to room temperature and poured into a large amount of ion exchange water to precipitate a polymer. The obtained polymer was separated by filtration, further washed with ethanol and acetone, and then vacuum-dried. The ηinh measured with a 3 wt% LiCl N-methyl-2-pyrrolidone solution was 4.3.
The polymer was dissolved in a 3 wt% LiCl NMP solution at a concentration of 8 wt% to prepare a molding polymer dope.
[実施例1]
得られた成形用ドープを口金0.3mm、吐出温度50℃で50℃の30wt%NMP水溶液に吐出して得られた凝固糸を70wt%NMP水溶液に浸漬し膨潤させた後、1.8倍に延伸した。水洗、150℃で乾燥することでポリアミック酸エステル繊維を得た。得られた繊維の繊度は18.26デシテックス、引張弾性率は25.4GPaであった。
[Example 1]
The obtained dope for molding was discharged into a 30 wt% NMP aqueous solution having a base of 0.3 mm and a discharge temperature of 50 ° C. at 50 ° C. The solidified yarn obtained was immersed in a 70 wt% NMP aqueous solution and swollen, and then 1.8 times Stretched. A polyamic acid ester fiber was obtained by washing with water and drying at 150 ° C. The fineness of the obtained fiber was 18.26 dtex, and the tensile modulus was 25.4 GPa.
さらにポリアミック酸エステル繊維を450℃で10分間熱処理することによりポリイミド繊維を作製した。得られた繊維の繊度は14.2デシテックス、引張弾性率は75.2GPaであった。 Furthermore, the polyamic acid ester fiber was heat-treated at 450 ° C. for 10 minutes to produce a polyimide fiber. The resulting fiber had a fineness of 14.2 dtex and a tensile modulus of 75.2 GPa.
[比較例1]
参考例1で得られた成形用ドープを口金0.3mm、吐出温度50℃で50℃の30wt%NMP水溶液に吐出して得られた凝固糸を延伸しようと試みたが延伸できなかった。そこで未延伸凝固糸を150℃で乾燥することでポリアミック酸エステル繊維を得た。得られた繊維の繊度は35.31デシテックス、引張弾性率は6.7GPaであった。
[Comparative Example 1]
An attempt was made to draw the coagulated yarn obtained by discharging the dope for molding obtained in Reference Example 1 into a 30 wt% NMP aqueous solution having a base of 0.3 mm and a discharge temperature of 50 ° C. at 50 ° C., but could not be drawn. Therefore, the unstretched solidified yarn was dried at 150 ° C. to obtain a polyamic acid ester fiber. The fineness of the obtained fiber was 35.31 dtex, and the tensile modulus was 6.7 GPa.
さらにポリアミック酸エステル繊維を450℃で10分間熱処理することによりポリイミド繊維を作製した。得られた繊維の繊度は25.96デシテックス、引張弾性率は13.3GPaであった。 Furthermore, the polyamic acid ester fiber was heat-treated at 450 ° C. for 10 minutes to produce a polyimide fiber. The fineness of the obtained fiber was 25.96 dtex, and the tensile modulus was 13.3 GPa.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2011115077A1 (en) * | 2010-03-15 | 2011-09-22 | 日産化学工業株式会社 | Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film |
| WO2011115076A1 (en) * | 2010-03-15 | 2011-09-22 | 日産化学工業株式会社 | Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film |
| WO2017032735A1 (en) * | 2015-08-24 | 2017-03-02 | Basf Se | Solutions of polyamide imides in n-formyl-pyrrolidine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05177689A (en) * | 1991-11-08 | 1993-07-20 | Chisso Corp | Preparation of molded item of polyimide precursor |
| JPH0649207A (en) * | 1992-07-30 | 1994-02-22 | Hitachi Ltd | Production of electronic device using polyamic acid ester |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05177689A (en) * | 1991-11-08 | 1993-07-20 | Chisso Corp | Preparation of molded item of polyimide precursor |
| JPH0649207A (en) * | 1992-07-30 | 1994-02-22 | Hitachi Ltd | Production of electronic device using polyamic acid ester |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011115077A1 (en) * | 2010-03-15 | 2011-09-22 | 日産化学工業株式会社 | Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film |
| WO2011115076A1 (en) * | 2010-03-15 | 2011-09-22 | 日産化学工業株式会社 | Liquid crystal alignment agent containing end-modified polyamic acid ester, and liquid crystal alignment film |
| CN102934011A (en) * | 2010-03-15 | 2013-02-13 | 日产化学工业株式会社 | Liquid crystal aligning agent and liquid crystal aligning film containing terminal-modified polyamic acid ester |
| JPWO2011115077A1 (en) * | 2010-03-15 | 2013-06-27 | 日産化学工業株式会社 | End-modified polyamic acid ester-containing liquid crystal aligning agent and liquid crystal aligning film |
| JPWO2011115076A1 (en) * | 2010-03-15 | 2013-06-27 | 日産化学工業株式会社 | LIQUID CRYSTAL ALIGNING AGENT CONTAINING POLYAMIC ACID ESTER WITH MODIFIED TERMINAL AND LIQUID CRYSTAL ALIGNING FILM |
| CN102934011B (en) * | 2010-03-15 | 2016-01-20 | 日产化学工业株式会社 | Comprise the aligning agent for liquid crystal to the poly amic acid ester that end is modified and liquid crystal orientation film |
| WO2017032735A1 (en) * | 2015-08-24 | 2017-03-02 | Basf Se | Solutions of polyamide imides in n-formyl-pyrrolidine |
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