JP2006279480A - Laminated filter and laminated filter array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated filter and a laminated filter array that can suppress variation in attenuation characteristic when mounted on an external substrate. <P>SOLUTION: The laminated filter F1 includes a laminate having a coil part constituted by laminating an insulator where a conductor pattern is formed, a capacitor part including 1st and 2nd capacitors constituted by laminating insulators where capacitor electrodes are formed, a 1st terminal electrode which electrically connects one end of a coil L1 and the 1st capacitor electrode and is arranged on the laminate, a 2nd terminal electrode which electrically connects the other end of the coil and a 2nd capacitor electrode and is arranged on the laminate, a 3rd terminal electrode which electrically connects with the other 1st capacitor electrode and is arranged on the laminate, a 4th terminal electrode which electrically connects with the other 2nd capacitor electrode and is arranged on the laminate, and a conductor pattern which electrically connects the 3rd terminal electrode and 4th terminal electrode. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a multilayer filter and a multilayer filter array.

  As the multilayer filter, the first and second coils are configured by stacking a coil portion including a coil configured by stacking a plurality of insulators on which conductor patterns are formed, and a plurality of insulators on which capacitor electrodes are formed. A capacitor part including two capacitors is known (for example, see Patent Document 1).

  Patent Document 1 discloses a first terminal electrode arranged in a laminate so as to electrically connect one end of a coil and one capacitor electrode constituting a first capacitor, the other end of the coil, and a second capacitor. The second terminal electrode arranged in the laminate so as to be electrically connected to one capacitor electrode constituting the capacitor and the laminate arranged so as to be electrically connected to the other capacitor electrode constituting the first capacitor There is disclosed a multilayer filter further comprising a third terminal electrode formed and a fourth terminal electrode disposed in the multilayer body so as to be electrically connected to the other capacitor electrode constituting the second capacitor. In this multilayer filter, the first and second terminal electrodes function as input / output terminal electrodes, and the third and fourth terminal electrodes function as ground terminal electrodes.

In the multilayer filter including the first to fourth terminal electrodes described above, since the third terminal electrode and the fourth terminal electrode are arranged for each capacitor, the third and fourth terminal electrode sides functioning as ground terminal electrodes Residual inductance generated in the capacitor is reduced, and the impedance is also reduced. Therefore, the high frequency noise signal easily flows from the third and fourth terminal electrodes to the outside of the filter through the first and second capacitors, and the noise removal effect in the high frequency region is excellent.
Japanese Patent No. 2819923

  Usually, the third and fourth terminal electrodes of the multilayer filter described in Patent Document 1, that is, the ground terminal electrode, are mechanically and electrically connected to the ground pattern of the external substrate on which the multilayer filter is mounted by soldering or the like. Connected to. The ground pattern of the external substrate has a line length, a shape, etc., between the ground pattern to which the third terminal electrode is connected and the ground pattern to which the fourth terminal electrode is connected due to restrictions on the pattern design of the substrate. May be formed differently. If the line length or shape of the ground pattern to which each terminal electrode is connected is different, the inductance component of each ground pattern is different for each ground pattern. For this reason, due to the difference in the inductance component of each ground pattern, the resonance frequency at which an attenuation peak is obtained changes, and the attenuation characteristics of the multilayer filter when mounted on the external substrate change.

  The present invention has been made to solve the above problems, and provides a multilayer filter and a multilayer filter array capable of suppressing a change in attenuation characteristics when mounted on an external substrate. For the purpose.

  The multilayer filter according to the present invention is configured by laminating a coil portion including a coil configured by stacking a plurality of insulators formed with a conductor pattern and a plurality of insulators formed with a capacitor electrode. A multilayer body having a capacitor portion including a first capacitor and a second capacitor; and a first capacitor disposed in the multilayer body so as to electrically connect one end of the coil and one capacitor electrode constituting the first capacitor. 1 terminal electrode, 2nd terminal electrode arrange | positioned in a laminated body so that the other end of a coil, and one capacitor electrode which comprises a 2nd capacitor | condenser may be electrically connected, and the other capacitor | condenser which comprises a 1st capacitor | condenser A third terminal electrode arranged in the laminate so as to be electrically connected to the electrode; and a third terminal electrode arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting the second capacitor. A fourth terminal electrode, characterized in that it comprises a connecting part having a conductive pattern for connecting the third terminal electrode and the fourth terminal electrodes electrically, the.

  In the multilayer filter according to the present invention, the third terminal electrode and the fourth terminal electrode are electrically connected by the conductor pattern of the connecting portion. When the third terminal electrode and the fourth terminal electrode are connected to the corresponding ground pattern, the third terminal electrode and the fourth terminal electrode are electrically connected to each ground pattern through the conductor pattern of the connection portion. It will be. Therefore, even if the inductance components of the ground patterns are different, the resonance frequency at which the attenuation peak is obtained does not change, and the change in the attenuation characteristics of the multilayer filter when mounted on the external substrate is suppressed. be able to.

  In the present invention, the inductance component of the conductor pattern of the connecting portion is the inductance component of the ground pattern (the inductance component of the ground pattern to which the third terminal electrode is connected and the fourth terminal electrode are viewed from the multilayer filter). Connected to the inductance component of the ground pattern to be connected). As a result, the inductance component between the conductor pattern of the connection portion and the ground pattern becomes smaller than the inductance component of the ground pattern, and the attenuation peak at the resonance frequency can be increased, that is, the attenuation rate can be increased.

  In the multilayer filter according to the present invention, it is preferable that the connecting portion is disposed at a central portion in the stacking direction of the multilayer body. When the connection portion is arranged in this way, even when any two surfaces facing in the stacking direction are opposed to the external substrate and mounted on the external substrate, the distance relationship between the external substrate and the connection portion hardly changes. . That is, even if the surface facing the external substrate when mounting is any one of the two surfaces, the electrical path length from the connection portion to the ground pattern of the external substrate is difficult to change, and the conductor of the connection portion The inductance component from the pattern to the ground pattern on the external board is also difficult to change. Thereby, it is possible to suppress a change in the attenuation characteristic of the multilayer filter regardless of the surface facing the external substrate when mounting.

  In the multilayer filter according to the present invention, it is preferable that the connection portion is disposed between the coil portion and the capacitor portion. By arranging the connection portions in this way, even when mounting on the external substrate with any of the two surfaces facing in the stacking direction facing the external substrate, the distance relationship between the external substrate and the connection portion changes. hard. That is, even if the surface facing the external substrate when mounting is any one of the two surfaces, the electrical path length from the conductor pattern of the connecting portion to the ground pattern of the external substrate is unlikely to change, and the connection The inductance component from the ground to the ground pattern of the external board is also difficult to change. Thereby, it is possible to suppress a change in the attenuation characteristic of the multilayer filter regardless of the surface facing the external substrate when mounting.

  In the multilayer filter according to the present invention, it is preferable that the shape of the conductor pattern included in the connection portion is a linear shape or a meander shape. By doing in this way, the conductor pattern which has a desired inductance component can be formed easily. For example, it is possible to form a conductor pattern having an inductance component equal to or greater than the inductance component of the ground pattern of the external substrate connected to the third terminal electrode and the fourth terminal electrode. In this case, since the conductor pattern of the connection portion is connected in parallel with the ground pattern, the inductance component between the conductor pattern of the connection portion and the ground pattern is further reduced, and the attenuation factor can be further increased.

  The multilayer filter array of the present invention includes a coil part including N coils (an integer of N ≧ 2) configured by laminating a plurality of insulators each having a conductor pattern, and a plurality of capacitor electrodes. And a capacitor unit including N first capacitors and N second capacitors respectively corresponding to N coils, and one end of each coil and each of the coils. N first terminal electrodes arranged in the laminate so as to electrically connect one capacitor electrode constituting each first capacitor corresponding to the coil, the other end of each coil, and each coil N second terminal electrodes respectively arranged in the laminate so as to electrically connect one capacitor electrode constituting each corresponding second capacitor, and the other capacitor constituting each first capacitor A third terminal electrode arranged in the laminate so as to be electrically connected to each of the poles, and a fourth terminal arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting each second capacitor. A terminal electrode; and a connection portion having a conductor pattern that electrically connects the third terminal electrode and the fourth terminal electrode.

  In the multilayer filter array according to the present invention, the third terminal electrode and the fourth terminal electrode are electrically connected by the conductor pattern of the connecting portion. When the third terminal electrode and the fourth terminal electrode are connected to the corresponding ground pattern, the third terminal electrode and the fourth terminal electrode are electrically connected to each ground pattern through the conductor pattern of the connection portion. It will be. Therefore, even if the inductance component of each ground pattern is different, the resonance frequency at which the attenuation peak is obtained does not change, and the change in the attenuation characteristics of the multilayer filter array when mounted on an external substrate is suppressed. can do.

  In the present invention, the inductance component of the conductor pattern of the connecting portion is the inductance component of the ground pattern (the inductance component of the ground pattern to which the third terminal electrode is connected and the fourth terminal electrode, as viewed from the multilayer filter array). In parallel with the inductance component of the ground pattern to be connected. As a result, the inductance component between the conductor pattern of the connection portion and the ground pattern becomes smaller than the inductance component of the ground pattern, and the attenuation peak at the resonance frequency can be increased, that is, the attenuation rate can be increased.

  According to the present invention, it is possible to provide a multilayer filter and a multilayer filter array capable of suppressing a change in attenuation characteristics when mounted on an external substrate.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted. In the description, the terms “upper” and “lower” may be used, which correspond to the vertical direction of each figure.

(First embodiment)
FIG. 1 is a perspective view showing the multilayer filter according to the first embodiment. FIG. 2 is an exploded perspective view showing the multilayer filter according to the first embodiment. FIG. 3 is a diagram for explaining an equivalent circuit of the multilayer filter according to the first embodiment. The multilayer filter F1 according to the first embodiment is a surface mount multilayer filter.

  As shown in FIG. 1, the multilayer filter F <b> 1 is similar to the element 1 (laminated body) and the pair of input / output terminal electrodes 3 and 5 (first and second terminal electrodes) formed on the element 1. A pair of ground terminal electrodes 7 (third and fourth terminal electrodes) formed on the element 1. One of the pair of input / output terminal electrodes 3 and 5 functions as an input terminal electrode, and the other functions as an output terminal electrode. The two ground terminal electrodes 7 are respectively connected to the ground pattern of an external substrate (not shown) on which the multilayer filter F1 is mounted.

  As shown in FIG. 2, the multilayer filter F1 includes a coil portion 10 including a coil L1, a connection portion 20 including a conductor pattern 23, and a capacitor portion 30 including first and second capacitors C1 and C2. is doing. By laminating the coil part 10, the connection part 20, and the capacitor part 30, the substantially rectangular parallelepiped element 1 is configured. The connection unit 20 is located between the coil unit 10 and the capacitor unit 20.

  The element 1 has a pair of end faces opposed to the longitudinal direction of the element 1, a pair of side faces opposed to the stacking direction of the element 1, and a pair of side faces opposed to the longitudinal direction and a direction perpendicular to the stacking direction. Yes. The input / output terminal electrode 3 is formed so as to cover the entire surface of one end face, and further, a part thereof wraps around each side face. The input / output terminal electrode 5 is formed so as to cover the entire surface of the other end surface, and a part of which further wraps around each side surface. Each ground terminal electrode 7 extends in a strip shape in the stacking direction of the elements 1 and is formed so that both end portions thereof wrap around a pair of side surfaces facing in the stacking direction. One of the pair of side surfaces facing the stacking direction of the element 1 is a surface facing the external substrate when the multilayer filter F1 is mounted on the external substrate.

  The coil portion 10 including the coil L1 is configured by laminating a plurality (six layers in this embodiment) of insulators 11 to 16 on which conductor patterns 17a to 17f are formed. In the actual multilayer filter F1, the plurality of insulators 11 to 16 are integrated to such an extent that the boundaries between the insulators 11 to 16 cannot be visually recognized. The insulators 11 to 16 are configured by firing a nonmagnetic green sheet.

  The conductor pattern 17a corresponds to approximately ½ turn of the coil L1 and extends in a substantially L shape on the insulator 11, and includes a lead-out portion 18a at one end thereof. The lead-out portion 18a is drawn out to the edge of the insulator 11, and is exposed on the end surface of the insulator 11 (side surface of the element 1). The lead-out portion 18a is located at one end of the coil L1. A through-hole conductor 19a penetrating the insulator 11 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 17a in the insulator 11. The through-hole conductor 19a is electrically connected to the conductor pattern 17a.

  The conductor pattern 17b corresponds to approximately 3/4 turns of the coil L1, and extends in a substantially C shape on the insulator 12. One end of the conductor pattern 17b is positioned corresponding to the through-hole conductor 19a, and is electrically connected to the through-hole conductor 19a in a state where the insulator 11 and the insulator 12 are laminated. A through-hole conductor 19b penetrating the insulator 12 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 17b in the insulator 12. The through-hole conductor 19b is electrically connected to the conductor pattern 17b.

  The conductor pattern 17c corresponds to approximately 3/4 turn of the coil L1, and extends in a substantially U shape on the insulator 13. One end of the conductor pattern 17c is located corresponding to the through-hole conductor 19b, and is electrically connected to the through-hole conductor 19b in a state where the insulator 12 and the insulator 13 are laminated. A through-hole conductor 19c that penetrates the insulator 13 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 17c in the insulator 13. The through-hole conductor 19c is electrically connected to the conductor pattern 17c.

  The conductor pattern 17d corresponds to approximately 3/4 turn of the coil L1, and extends in a substantially C shape on the insulator. One end of the conductor pattern 17d is positioned corresponding to the through-hole conductor 19c, and is electrically connected to the through-hole conductor 19c in a state where the insulator 13 and the insulator 14 are laminated. A through-hole conductor 19d penetrating the insulator 14 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 17d in the insulator 14. The through-hole conductor 19d is electrically connected to the conductor pattern 17d.

  The conductor pattern 17e corresponds to approximately 3/4 turns of the coil L1, and extends in a substantially U shape on the insulator 15. One end of the conductor pattern 17e is positioned corresponding to the through-hole conductor 19d, and is electrically connected to the through-hole conductor 19d in a state where the insulator 14 and the insulator 15 are laminated. A through-hole conductor 19e penetrating the insulator 15 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 17e in the insulator 15. The through-hole conductor 19e is electrically connected to the conductor pattern 17e.

  The conductor pattern 17f extends on the insulator 16, and one end of the conductor pattern 17f is positioned corresponding to the through-hole conductor 19e. The insulator 15 and the insulator 16 are stacked on the through-hole conductor 19e. Electrically connected. The conductor pattern 17f includes a lead-out portion 18b at the other end. The lead-out portion 18b is drawn out to the edge of the insulator 16, and is exposed on the end surface of the insulator 16 (side surface of the element 1). The lead-out portion 18b is located at the other end of the coil L1.

  As described above, the conductor patterns 17a to 17f are electrically connected to each other via the through-hole conductors 19a to 19e, thereby forming the coil L1. One end of the coil L1, that is, the lead-out portion 18a of the conductor pattern 17a is electrically connected to the input / output terminal electrode 3. The other end of the coil L1, that is, the lead-out portion 18b of the conductor pattern 17f is electrically connected to the input / output terminal electrode 5.

  In the capacitor unit 30 including the first capacitor C1 and the second capacitor C2, a plurality of (in this embodiment, four layers) insulators 31 to 34 on which the first and second capacitor electrodes 35 to 38 are formed are stacked. It is constituted by. In the present embodiment, the first capacitor electrodes 35 and 37 are signal electrodes (so-called hot electrodes), and the second capacitor electrodes 36 and 38 are ground electrodes (so-called ground electrodes). In the actual multilayer filter F1, the plurality of insulators 31 to 34 are integrated to such an extent that the boundary between the insulators 31 to 34 cannot be visually recognized. The insulators 31 to 34 are configured by firing a nonmagnetic green sheet.

  The first capacitor electrode 35 is located on the insulator 31 disposed at the uppermost part of the capacitor unit 30. The first capacitor electrode 35 is formed on the insulator 31 by printing a substantially rectangular pattern that is offset from the center in the longitudinal direction to one side. The first capacitor electrode 35 includes a lead-out portion 35a. The lead-out portion 35a is exposed at the end face of the insulator 31 that forms the end face of the element 1 from which the lead-out portion 18a is exposed.

  The second capacitor electrode 36 is located on the insulator 32 stacked below the insulator 31. The second capacitor electrode 36 is formed by printing a pattern having the same shape so as to overlap the first capacitor electrode 35. The second capacitor electrode 36 includes a lead-out portion 36a. The lead-out portion 36a is exposed at the end surface of the insulator 32 forming one side surface adjacent to the side surface of the element 1 from which the lead-out portion 35a is exposed. The first capacitor electrode 35, the second capacitor electrode 36, and the insulator 31 located between the first capacitor electrode 35 and the second capacitor electrode 36 constitute the first capacitor C1.

  The first capacitor electrode 37 is located on the insulator 33 laminated under the insulator 32. The first capacitor electrode 37 is formed on the insulator 33 by printing a substantially rectangular pattern that is offset from the center in the longitudinal direction to the other side. The first capacitor electrode 37 includes a lead-out portion 37a. The lead-out portion 37a is exposed at the end face of the insulator 33 that forms the end face of the element 1 from which the lead-out portion 18b is exposed.

  The second capacitor electrode 38 is located on the insulator 34 laminated below the insulator 33. The second capacitor electrode 38 is formed by printing a pattern having the same shape so as to overlap the first capacitor electrode 37. The second capacitor electrode 38 includes a lead-out portion 38a. The lead-out portion 38a is exposed at the end surface of the insulator 34 that forms one side surface adjacent to the side surface of the element 1 from which the lead-out portion 37a is exposed. The first capacitor electrode 37, the second capacitor electrode 38, and the insulator 33 located between the first capacitor electrode 37 and the second capacitor electrode 38 constitute the second capacitor C2.

  The first capacitor electrode 35 is electrically connected to the input / output terminal electrode 3 via the lead-out portion 35a. Thereby, the 1st capacitor electrode 35 will be electrically connected to one end (leading part 18a of conductor pattern 17a) of coil L1. The second capacitor electrode 36 is electrically connected to one ground terminal electrode 7 through the lead-out portion 36a.

  The first capacitor electrode 37 is electrically connected to the input / output terminal electrode 5 through the lead-out portion 37a. Thereby, the first capacitor electrode 37 is electrically connected to the other end of the coil L1 (the lead-out portion 18b of the conductor pattern 17f). The second capacitor electrode 38 is electrically connected to the other ground terminal electrode 7 through the lead-out portion 38a.

  The connecting portion 20 is constituted by an insulator 21 on which a meander-shaped conductor pattern 23 is formed. The connecting portion 20 is disposed at the central portion in the stacking direction of the elements 1. In the actual multilayer filter F1, the plurality of insulators 16, 21, and 31 are integrated so that the boundary between the insulators 16, 21, and 31 cannot be visually recognized. The insulator 21 is configured by firing a nonmagnetic green sheet.

  The conductor pattern 23 has an inductance component and constitutes the coil L2. One end of the conductor pattern 23 is exposed at the end surface of the insulator 21 that forms the side surface of the element 1 where the lead-out portion 38a of the second capacitor electrode 38 is exposed. The other end of the conductor pattern 23 is exposed at the end surface of the insulator 21 that forms the side surface of the element 1 where the lead-out portion 36a of the second capacitor electrode 36 is exposed, that is, the end surface opposite to the end surface where one end of the conductor pattern 23 is exposed. is doing.

  One end of the conductor pattern 23 is electrically connected to the other ground terminal electrode 7 to which the second capacitor electrode 38 is electrically connected. The other end of the conductor pattern 23 is electrically connected to one ground terminal electrode 7 to which the second capacitor electrode 36 is electrically connected. Thus, the pair of ground terminal electrodes 7 are electrically connected by the conductor pattern 23. Therefore, the coil L1 constituted by the conductor patterns 17a to 17f and the coil L2 constituted by the conductor pattern 23 are connected in parallel via the first capacitor C1 and the second capacitor C2.

  Insulators 41 and 42 are laminated on the coil unit 10 and the capacitor unit 30, respectively. The insulator 41 functions as a protective layer for the coil unit 10 and the capacitor unit 30 and is stacked in order to adjust the dimensions of the element 1 in the stacking direction. In the first embodiment, one insulator is stacked above and below the element 1, but a plurality of insulators may be provided.

  In the multilayer filter F1 configured as described above, as shown in FIG. 3, the coil L1 and the first and second capacitors C1 and C2 constitute a π-type circuit.

  Next, a manufacturing method of the multilayer filter F1 will be described.

First, a non-magnetic green sheet that forms the insulators 11 to 16, 21, 41, and 42 and a dielectric green sheet that forms the insulators 31 to 34 are prepared. As the non-magnetic green sheet, for example, a slurry obtained by applying slurry using a mixed powder of Fe ₂ O ₃ , ZnO and CuO as a raw material by a doctor blade method can be used. The thickness of the nonmagnetic green sheet is, for example, about 20 μm. As the dielectric green sheet, for example, a slurry obtained by applying a slurry using a mixed powder of TiO ₂ , CuO and NiO as a raw material on a film by a doctor blade method can be used. The thickness of the dielectric green sheet is, for example, about 40 μm.

  Next, through holes are formed by laser processing or the like at predetermined positions of the nonmagnetic green sheets that constitute the insulators 11 to 15, that is, positions where the through hole electrodes 19 a to 19 e are to be formed.

  Next, conductor patterns corresponding to the conductor patterns 17a to 17f are formed on the nonmagnetic green sheets constituting the insulators 11 to 16, respectively. Also, a conductor pattern corresponding to the conductor pattern 23 is formed on the non-magnetic green sheet that constitutes the insulator 21. In addition, conductor patterns corresponding to the first and second capacitor electrodes 35 to 38 are formed on the dielectric green sheets that constitute the insulators 31 to 34. Each conductor pattern is formed, for example, by screen-printing a conductor paste (conductor material) mainly composed of silver or nickel and then drying. Each through hole is filled with a conductor paste when each conductor pattern is formed.

  Next, the green sheets are sequentially laminated and pressure-bonded, cut into chips, and then fired at a predetermined temperature (for example, 800 to 900 degrees). Thereby, the element 1 is formed. For example, the element 1 has a longitudinal length of 2.0 mm, a width of 1.25 mm, and a height of 0.5 mm after completion. The conductor patterns 17a to 17f and the conductor pattern 23 after firing have a width of about 80 μm and a thickness of about 14 μm. The thickness of the first and second capacitor electrodes 35 to 38 is about 4 μm.

  Next, input / output terminal electrodes 3 and 5 and a ground terminal electrode 7 are formed on the element 1. Thereby, the multilayer filter F1 is formed. The input / output terminal electrodes 3 and 5 and the ground terminal electrode 7 are transferred to a predetermined temperature (for example, 680 to 740) after transferring an electrode paste mainly composed of silver, copper or nickel to the outer surface of the element 1 obtained as described above. It is formed by baking at about 0 ° C. and further electroplating. For electroplating, Cu and Ni and Sn, Ni and Sn, Ni and Au, Ni and Pd and Au, Ni and Pd and Ag, Ni and Ag, or the like can be used.

  Note that the thermal contraction rate of the nonmagnetic green sheet and the dielectric are between the nonmagnetic green sheet that constitutes the insulator 21 and the dielectric green sheet that constitutes the insulator 31. One or more non-magnetic green sheets having a thermal contraction rate approximately in the middle of the thermal contraction rate of the green sheets may be laminated.

  As described above, according to the first embodiment, the pair of ground terminal electrodes 7 are electrically connected by the conductor pattern 23 of the connection portion 20. When one ground terminal electrode 7 and the other ground terminal electrode 7 are connected to the corresponding ground pattern, the one ground terminal electrode 7 and the other ground terminal electrode 7 are respectively connected through the conductor pattern 23 of the connecting portion 20. It is electrically connected to the ground pattern. Therefore, even if the inductance component of each ground pattern is different, the resonance frequency at which the attenuation peak is obtained does not change, and the change in the attenuation characteristic of the multilayer filter F1 when mounted on the external substrate is suppressed. can do.

  Further, in the first embodiment, the inductance component of the conductor pattern 23 of the connection portion 20 is the inductance component of the ground pattern (the ground pattern to which one of the ground terminal electrodes 7 is connected) as viewed from the multilayer filter F1. (The sum of the inductance component and the inductance component of the ground pattern to which the other ground terminal electrode 7 is connected). Thereby, the inductance component of the conductor pattern 23 of the connection part 20 and a ground pattern becomes smaller than the inductance component of a ground pattern, and the attenuation | damping peak in a resonant frequency can be enlarged, ie, an attenuation factor can be enlarged.

  In the first embodiment, the connection portion 20 is disposed at the central portion in the stacking direction of the elements 1. As a result, even when any of the two surfaces facing in the stacking direction is opposed to the external substrate and mounted on the external substrate, the distance relationship between the external substrate and the connection portion 20 (conductor pattern 23) is unlikely to change. That is, even if the surface facing the external substrate when mounting is any one of the two surfaces, the electrical path length from the connection portion 20 to the ground pattern of the external substrate is unlikely to change, and the connection portion 20 The inductance component from the ground pattern to the external board is also difficult to change. Thereby, it is possible to suppress the change in the attenuation characteristic of the multilayer filter F1 regardless of the surface facing the external substrate when mounting.

  In the first embodiment, the connection portion 20 is disposed between the coil portion 10 and the capacitor portion 30. By arranging the connection portion 20 in this way, as described above, it is possible to suppress the change in the attenuation characteristic of the multilayer filter F1 regardless of the surface facing the external substrate when mounting.

  Further, in the first embodiment, the shape of the conductor pattern 23 included in the connecting portion 20 is a meander shape. Thereby, the conductor pattern 23 which has a desired inductance component can be formed easily. For example, it is possible to form a conductor pattern having an inductance component equal to or greater than the inductance component of the ground pattern of the external substrate connected to the pair of ground terminal electrodes 7. In this case, since the connection portion 20 is connected in parallel with the ground pattern, the inductance component between the connection portion 20 and the ground pattern can be further reduced, and the attenuation factor can be further increased.

  By the way, as shown in FIG. 3, the input / output terminal electrodes 3 and 5 have residual inductance components L3 and L4, respectively. The pair of ground terminal electrodes 7 also have residual inductance components L5 and L6, respectively, and the residual inductance components L5 and L6 are generally about 0.1 nH. Therefore, the inductance component of the conductor pattern 23 of the connection portion 20 is preferably 0.1 nH or more. If the inductance component of the conductor pattern 23 is 0.1 nH or more, it is difficult to be affected by the residual inductance components L5 and L6 of the ground terminal electrode 7.

  Moreover, it is preferable that the inductance component of the conductor pattern 23 of the connection part 20 is 2.0 nH or less. This is because when the inductance component of the conductor pattern 23 exceeds 2.0 nH, the filter L1, the first capacitor C1, and the second capacitor C2 are likely to affect the attenuation characteristics of the filter. The inductance component of the conductor pattern 23 can be set to 0.6 nH, for example.

  Here, according to the first embodiment, the fact that the change of the attenuation characteristic can be suppressed and the attenuation peak at the resonance frequency can be increased will be specifically shown by examples and comparative examples. In the example and the comparative example, the insertion loss characteristic is obtained.

  In the example, a multilayer filter having the same configuration as that of the multilayer filter F1 of the first embodiment was used. In the comparative example, a multilayer filter having the same configuration as the multilayer filter F1 described above is used except that the connection portion 20 is not provided. An equivalent circuit of the multilayer filter of the comparative example is shown in FIG. Both the multilayer filters of the example and the comparative example are designed so that the cut-off frequency is 100 MHz.

  First, an external substrate having different inductance components of the ground pattern connected to the pair of ground terminal electrodes was prepared, and the multilayer filter according to the example and the comparative example was mounted on the external substrate, and the change of the attenuation characteristic was confirmed. . As a result, in the multilayer filter according to the example, the resonance frequency at which the attenuation peak on the high frequency side in the attenuation characteristic was obtained fluctuated in the range of 20 to 30 MHz. On the other hand, in the multilayer filter according to the comparative example, the resonance frequency at which the attenuation peak on the high frequency side in the attenuation characteristic is obtained fluctuated in the range of 100 to 200 MHz. As described above, the variation in the resonance frequency at which the attenuation peak is obtained is smaller in the embodiment than in the comparative example. From the above, the effectiveness of the present embodiment was confirmed.

  Next, FIG. 5 shows the measurement results of the insertion loss characteristics in the state where the multilayer filters of the example and the comparative example are mounted on the same external substrate. The solid line IL1 indicates the insertion loss characteristic of the multilayer filter of the example, and the broken line IL2 indicates the insertion loss characteristic of the multilayer filter of the comparative example. As can be seen from FIG. 5, the insertion loss characteristic of the multilayer filter of the example has a larger attenuation factor than the insertion loss characteristic of the multilayer filter of the comparative example. Further, the attenuation band, for example, the frequency band holding −30 dB attenuation is 540 to 2500 MHz in the multilayer filter of the embodiment, whereas it is 590 to 2500 MHz in the multilayer filter of the comparative example. The frequency band of the filter is wide. From the above, the effectiveness of the present embodiment was confirmed.

(Second Embodiment)
FIG. 6 is a perspective view showing the multilayer filter array according to the second embodiment. FIG. 7 is an exploded perspective view showing the multilayer filter array according to the second embodiment. FIG. 8 is a diagram for explaining an equivalent circuit of the multilayer filter array according to the second embodiment. The multilayer filter array F2 according to the second embodiment is a surface mount multilayer filter array.

  As shown in FIG. 6, the multilayer filter array F <b> 2 is a pair of substantially rectangular parallelepiped elements 2 (laminates) and a plurality (four in the second embodiment) formed on the elements 2. Input / output terminal electrodes 3 and 5 (first and second terminal electrodes) and a pair of ground terminal electrodes 7 (third and fourth terminal electrodes) formed on the element 2. One of the four pairs of input / output terminal electrodes 3 and 5 functions as an input terminal electrode, and the other functions as an output terminal electrode. The two ground terminal electrodes 7 are connected to ground patterns on an external substrate (not shown) on which the multilayer filter array F2 is mounted.

  The element 2 has a pair of end faces opposed to the longitudinal direction of the element 2, a pair of side faces opposed to the stacking direction of the element 1, and a pair of side faces opposed to the longitudinal direction and the direction perpendicular to the stacking direction. Yes. One ground terminal electrode 7 is formed on one end face, and the other ground terminal electrode 7 is formed on the other end face. The input / output terminal electrodes 3 and 5 are formed so as to be arranged on a pair of side surfaces facing each other mainly in the longitudinal direction and the direction perpendicular to the stacking direction. The pair of ground terminal electrodes and the input / output terminal electrodes 3 and 5 are formed so as to extend in a strip shape in the stacking direction of the element 2 and further have both end portions thereof wrap around a pair of side surfaces facing the stacking direction. . One of the pair of side surfaces facing the stacking direction of the element 2 is a surface facing the external substrate when the multilayer filter array F2 is mounted on the external substrate.

  As shown in FIG. 7, the multilayer filter array F <b> 2 includes a plurality (four in the second embodiment) of coil portions 50 including the coil L <b> 1 and a plurality of connection portions 20 including the conductor pattern 23 ( The second embodiment includes four capacitor units 80 including first and second capacitors C1 and C2. By laminating the coil part 50, the connection part 20, and the capacitor part 80, the substantially rectangular parallelepiped element 2 is configured. The connection unit 20 is located between the coil unit 50 and the capacitor unit 80.

  The coil portion 50 including the coil L1 includes a plurality (eight layers in this embodiment) of insulators 51 to 58 in which a plurality of (four in the second embodiment) conductor patterns 61 to 68 are formed. It is comprised by doing.

  On the insulator 51, the conductor patterns 61 are provided side by side in the longitudinal direction of the element 2 in the same shape with a predetermined interval. Each conductor pattern 61 includes a lead-out portion 78 at one end thereof. The lead-out portion 78 is drawn out to the edge of the insulator 51 and is exposed on the end surface of the insulator 51 (side surface of the element 2). The lead-out portion 78 is located at one end of the coil L1. A through-hole conductor 71 that penetrates the insulator 51 in the thickness direction is formed at a position corresponding to the other end of the conductor pattern 61 in the insulator 51. The through-hole conductor 71 is electrically connected to the conductor pattern 61. The four conductor patterns 61 are electrically insulated from each other.

  Similar to the conductor pattern 61, the conductor patterns 62 to 67 are provided side by side in the longitudinal direction of the element 2 on the corresponding insulators 52 to 57 with the same shape and a predetermined interval. The four conductor patterns 62 to 67 provided respectively in the insulators 52 to 57 are electrically insulated from each other.

  Each conductor pattern 68 is provided side by side in the longitudinal direction of the element 2 with the same shape and a predetermined interval. Each conductor pattern 68 includes a lead-out portion 79 at one end thereof. The lead-out portion 79 is drawn out to the edge of the insulator 58 and exposed at the end face of the insulator 58 (side face of the element 2). The lead-out portion 79 is located at the other end of the coil L1. The four conductor patterns 68 are electrically insulated from each other.

  Each of the conductor patterns 61 to 68 is electrically connected to each other by through-hole electrodes 71 to 77, thereby constituting each coil L1. In the present embodiment, four coils L <b> 1 are provided in the coil unit 50. One end of each coil L1, that is, the lead-out portion 78 of the conductor pattern 61 is electrically connected to the input / output terminal electrode 3, respectively. The other end of each coil L1, that is, the lead-out portion 79 of the conductor pattern 68 is electrically connected to the input / output terminal electrode 5, respectively.

  The capacitor unit 80 including the plurality of first capacitors C1 and the plurality of second capacitors C2 includes a plurality (10 layers in this embodiment) of insulators 81 to which the first and second capacitor electrodes 91 to 100 are formed. 90 is laminated. In the present embodiment, the first capacitor electrodes 92, 94, 97, and 99 are signal electrodes (hot electrodes), and the second capacitor electrodes 91, 93, 95, 96, 98, and 100 are ground electrodes (hot electrodes). Ground electrode).

  The second capacitor electrode 91 is located on the insulator 81 disposed on the uppermost part of the capacitor unit 80. The second capacitor electrode 91 is formed on the insulator 81 by printing a substantially rectangular pattern. The first capacitor electrode 91 includes a lead-out portion 91a. The lead-out portion 91a is exposed at the end surface of the insulator 81 that forms one side surface adjacent to the side surface of the element 2 where the lead-out portion 78 is exposed.

  Two first capacitor electrodes 92 are located on the insulator 82. The two second capacitor electrodes 92 are formed by printing two substantially rectangular patterns that are offset from the center in the longitudinal direction to one side. The two second capacitor electrodes 92 include a lead-out portion 92a. The lead-out portion 92a is exposed at the end face of the insulator 82 that forms the side surface of the element 2 where the lead-out portion 78 is exposed. The two second capacitor electrodes 92 are insulated from each other.

  The second capacitor electrode 93 is located on the insulator 83. The second capacitor electrode 93 has the same shape as the second capacitor electrode 91 and includes a lead-out portion 93a. Second capacitor electrode 91, first capacitor electrode 92, second capacitor electrode 93, insulator 81 positioned between second capacitor electrode 91 and first capacitor electrode 92, first capacitor electrode 92, and second capacitor electrode 92 The insulator 82 positioned between the capacitor electrodes 93 constitutes two first capacitors C1.

  Two first capacitor electrodes 94 are located on the insulator 84. The second capacitor electrode 94 has the same shape as the second capacitor electrode 92 and is formed so as to be biased from the center in the longitudinal direction to the other side.

  The second capacitor electrode 95 is located on the insulator 85. The second capacitor electrode 95 has the same shape as the second capacitor electrode 91 and includes a lead-out portion 95a. Second capacitor electrode 93, first capacitor electrode 94, second capacitor electrode 95, insulator 83 located between second capacitor electrode 93 and first capacitor electrode 94, first capacitor electrode 94 and second capacitor electrode The insulator 84 positioned between the capacitor electrode 95 constitutes two first capacitors C1.

  Similar to the configuration of the four first capacitors C1, the four second capacitors C2 include insulators 86 to 90, second capacitor electrodes 96, 98, and 100 positioned on the insulators 86, 88, and 90, and And first capacitor electrodes 97 and 99 located on the insulators 87 and 89. The second capacitor electrodes 96, 98, 100 include lead portions 96a, 98a, 100a, respectively. The lead-out portions 96a, 98a, and 100a are exposed at the side surface opposite to the side surface of the element 2 where the lead-out portions 91a, 93a, and 95a included in the second capacitor electrodes 91, 93, and 95 in the first capacitor C1 are exposed. The first capacitor electrodes 97 and 99 include lead portions 97a and 99a, respectively. The lead-out portions 97a and 99a are exposed on the side surface opposite to the side surface of the element 2 where the lead-out portions 92a and 94a included in the second capacitor electrodes 92 and 94 in the first capacitor C1 are exposed.

  The first capacitor electrodes 92 and 94 included in the first capacitor C1 are electrically connected to the input / output terminal electrode 3 through lead-out portions 92a and 94a. Thus, the first capacitor electrodes 92 and 94 are electrically connected to one end of the coil L1 (the lead-out portion 78 of the conductor pattern 61). The second capacitor electrodes 91, 93, 95 included in the first capacitor C1 are electrically connected to one ground terminal electrode 7 through the lead-out portions 91a, 93a, 95a.

  The first capacitor electrodes 97 and 99 included in the second capacitor C2 are electrically connected to the input / output terminal electrode 5 through lead-out portions 97a and 99a. As a result, the first capacitor electrodes 97 and 99 are electrically connected to the other end of the coil L1 (the lead-out portion 79 of the conductor pattern 68). The second capacitor electrodes 96, 98, 100 included in the second capacitor C2 are electrically connected to the other ground terminal electrode 7 through lead-out portions 96a, 98a, 100a.

  The connecting portion 20 is constituted by an insulator 21 on which a meander-shaped conductor pattern 23 is formed. The connecting portion 20 is disposed at the central portion in the stacking direction of the elements 2. The conductor pattern 23 has an inductance component and constitutes the coil L2. One end of the conductor pattern 23 is exposed at the end surface of the insulator 21 that forms the side surface of the element 2 where the lead-out portions 96a, 98a, 100a of the second capacitor electrodes 96, 98, 100 included in the second capacitor C2 are exposed. ing. The other end of the conductor pattern 23 is the end face of the insulator 21 forming the side face of the element 2 where the lead-out portions 91a, 93a, 95a of the second capacitor electrodes 91, 93, 95 included in the first capacitor C1 are exposed, that is, the conductor. One end of the pattern 23 is exposed at the end surface opposite to the exposed end surface.

  One end of the conductor pattern 23 is electrically connected to one ground terminal electrode 7 to which the second capacitor electrodes 96, 98, 100 are electrically connected. The other end of the conductor pattern 23 is electrically connected to the other ground terminal electrode 7 to which the second capacitor electrodes 91, 93, 95 are electrically connected. Thus, the pair of ground terminal electrodes 7 are electrically connected by the conductor pattern 23. Therefore, the coil L1 constituted by the conductor patterns 61 to 68 and the coil L2 constituted by the conductor pattern 23 are connected in parallel via the first capacitor C1 and the second capacitor C2.

  Insulators 41 and 42 are laminated on the coil unit 50 and the capacitor unit 80 to form the element 2. The element 2 has, for example, a length in the longitudinal direction after completion of 3.2 mm, a width of 1.6 mm, and a height of 0.8 mm. The conductor patterns 61 to 68 constituting the coil L1 after firing have a width of about 60 μm and a thickness of about 11 μm. The conductor pattern 23 constituting the coil L2 has a width of about 80 μm and a thickness of about 14 μm. The thickness of each of the first and second capacitor electrodes 91 to 100 is about 4 μm.

  In the multilayer filter array F2 having the above-described configuration, as shown in FIG. 8, four sets of π-type circuits are configured by the four coils L1 and the four first and second capacitors C1 and C2, respectively. is doing. The multilayer filter array F2 is designed so that the cut-off frequency is about 100 MHz.

  In the second embodiment, the pair of ground terminal electrodes 7 are electrically connected by the conductor pattern 23 of the connection portion 20. When one ground terminal electrode 7 and the other ground terminal electrode 7 are connected to the corresponding ground pattern, the one ground terminal electrode 7 and the other ground terminal electrode 7 are respectively connected through the conductor pattern 23 of the connecting portion 20. It is electrically connected to the ground pattern. Therefore, even if the inductance components of the respective ground patterns are different, the resonance frequency at which the attenuation peak is obtained does not change, and the change in the attenuation characteristic of the multilayer filter array F2 when mounted on the external substrate is observed. Can be suppressed.

  In the second embodiment, the inductance component included in the conductor pattern 23 of the connecting portion 20 is the inductance component included in the ground pattern as viewed from the multilayer filter array F2 (the ground pattern to which one ground terminal electrode 7 is connected). And the inductance component of the ground pattern to which the other ground terminal electrode 7 is connected). Thereby, the inductance component of the conductor pattern 23 of the connection part 20 and a ground pattern becomes smaller than the inductance component of a ground pattern, and the attenuation | damping peak in a resonant frequency can be enlarged, ie, an attenuation factor can be enlarged.

  In the second embodiment, the connection portion 20 is disposed at the central portion in the stacking direction of the elements 2. As a result, even when any of the two surfaces facing in the stacking direction is opposed to the external substrate and mounted on the external substrate, the distance relationship between the external substrate and the connection portion 20 (conductor pattern 23) is unlikely to change. That is, even if the surface facing the external substrate when mounting is any one of the two surfaces, the electrical path length from the connection portion 20 to the ground pattern of the external substrate is unlikely to change, and the connection portion 20 The inductance component from the ground pattern to the external board is also difficult to change. Thereby, it is possible to suppress the change in the attenuation characteristic of the multilayer filter array F2 regardless of the surface facing the external substrate when mounting.

  In the second embodiment, the connection unit 20 is disposed between the coil unit 50 and the capacitor unit 80. By arranging the connection portion 20 in this way, as described above, it is possible to suppress the change in the attenuation characteristic of the multilayer filter array F2 regardless of the surface facing the external substrate when mounting.

  In the second embodiment, the shape of the conductor pattern 23 included in the connection portion 20 is a meander shape. Thereby, the conductor pattern 23 which has a desired inductance component can be formed easily. For example, it is possible to form a conductor pattern having an inductance component equal to or greater than the inductance component of the ground pattern of the external substrate connected to the pair of ground terminal electrodes 7. In this case, since the connection portion 20 is connected in parallel with the ground pattern, the inductance component between the connection portion 20 and the ground pattern can be further reduced, and the attenuation factor can be further increased.

  By the way, as shown in FIG. 8, the input / output terminal electrodes 3 and 5 have residual inductance components L3 and L4, respectively. The pair of ground terminal electrodes 7 also have residual inductance components L5 and L6, respectively, and the residual inductance components L5 and L6 are generally about 0.1 nH. Therefore, the inductance component of the conductor pattern 23 of the connection portion 20 is preferably 0.1 nH or more. If the inductance component of the conductor pattern 23 is 0.1 nH or more, it is difficult to be affected by the residual inductance components L5 and L6 of the ground terminal electrode 7.

  Moreover, it is preferable that the inductance component of the conductor pattern 23 of the connection part 20 is 2.0 nH or less. This is because when the inductance component of the conductor pattern 23 exceeds 2.0 nH, the filter L1, the first capacitor C1, and the second capacitor C2 are likely to affect the attenuation characteristics of the filter. The inductance component of the conductor pattern 23 can be set to 0.6 nH, for example.

  In the first and second embodiments, the insulators 11 to 16, 31 to 34, 51 to 58, and 81 to 90 are nonmagnetic materials. As a result, the resonance frequency determined by the capacitance components of the first and second capacitors C1 and C2 and the inductance component of the coil L1 can be set on the high frequency side, and higher-band noise can be removed.

  In the first and second embodiments, a magnetic green sheet is used instead of a non-magnetic green sheet as an insulator that constitutes the insulators 11 to 16 and 51 to 58 constituting the coil L1. May be. In this case, the resonance frequency can be set on the low frequency side, and noise in a lower band can be removed. The magnetic green sheet is a slurry made of, for example, ferrite (eg, Ni—Cu—Zn ferrite, Ni—Cu—Zn—Mg ferrite, Cu—Zn ferrite, or Ni—Cu ferrite) powder as a raw material. Can be used which is formed by coating the film by a doctor blade method.

  The present invention is not limited to the first and second embodiments, and various modifications can be made. For example, the shape of the conductor pattern 23 of the connecting portion 20 is a meander shape in the first and second embodiments, but is not limited thereto, and may be a straight shape. FIG. 9 shows an example in which the conductor pattern 23 in the second embodiment is linear. The linear conductor pattern 23 is formed in a substantially rectangular shape, and both end portions in the longitudinal direction are drawn out to the edge portion of the insulator 21 and exposed to the end face as in the second embodiment. In FIG. 9, both end portions of the conductor pattern 23 are formed narrower than the portion between the both end portions. The width of the central portion of the conductor pattern 23 may be approximately the same as the width of both end portions.

  FIG. 10 shows an equivalent circuit of a multilayer filter F3 that is a modification of the first embodiment. In addition to the configuration of the multilayer filter F1, the multilayer filter F3 further includes first and second capacitors C3 and C4, a pair of ground electrode terminals 8, and a connection portion 25 including a conductor pattern 27. The

  The first capacitor C3 and the second capacitor C4 have the same configuration as the first capacitor C1 and the second capacitor C2, respectively. The conductor pattern 27 of the connection portion 25 has an inductance component and constitutes the coil L3. In the multilayer filter F3 having the configuration, the coil L1 and the first and second capacitors C1 and C2, as described above, form a π-type circuit, and the coil L1 and the first and second capacitors C3 and C4. A π-type circuit is configured.

  The first capacitor electrode included in the first capacitor C3 is electrically connected to the input / output terminal electrode 3. As a result, the first capacitor electrode is electrically connected to one end of the coil L1 (the lead-out portion 18a of the conductor pattern 17a). The second capacitor electrode included in the first capacitor C3 is electrically connected to one ground terminal electrode 8.

  The first capacitor electrode included in the second capacitor C4 is electrically connected to the input / output terminal electrode 5. As a result, the first capacitor electrode is electrically connected to the other end of the coil L1 (the lead-out portion 18b of the conductor pattern 17f). The second capacitor electrode included in the second capacitor C4 is electrically connected to the other ground terminal electrode 8.

  The connection part 25 is comprised with the insulator in which the conductor pattern 27 (for example, meander-shaped conductor pattern) was formed. One end of the conductor pattern 27 is electrically connected to the other ground terminal electrode 8 to which the second capacitor electrode included in the second capacitor C4 is electrically connected. The other end of the conductor pattern 27 is electrically connected to one ground terminal electrode 8 to which a second capacitor electrode included in the first capacitor C3 is electrically connected.

  Thus, the pair of ground terminal electrodes 8 are electrically connected by the conductor pattern 27. Therefore, even if the inductance components of the ground patterns connected to the respective ground terminal electrodes 8 are different, the resonance frequency at which the attenuation peak is obtained does not change, and the multilayer filter mounted on the external substrate is not changed. A change in the attenuation characteristic of F3 can be suppressed.

  In addition, the coil L3 and the coil L1 are electrically connected in parallel via the first capacitor C3 and the second capacitor C4. Thereby, the inductance component of the conductor pattern 27 of the connection part 25 and a ground pattern becomes smaller than the inductance component of a ground pattern, and the attenuation | damping peak in a resonant frequency can be enlarged, ie, an attenuation factor can be enlarged.

1 is a perspective view showing a multilayer filter according to a first embodiment. 1 is an exploded perspective view showing a multilayer filter according to a first embodiment. It is a figure for demonstrating the equivalent circuit of the multilayer filter which concerns on 1st Embodiment. It is a figure for demonstrating the equivalent circuit of the laminated filter of a comparative example. It is a diagram which shows the insertion loss characteristic of a multilayer filter. It is a perspective view which shows the multilayer filter array which concerns on 2nd Embodiment. It is a disassembled perspective view which shows the multilayer filter array which concerns on 2nd Embodiment. It is a figure for demonstrating the equivalent circuit of the multilayer filter array which concerns on 2nd Embodiment. It is a figure which shows the modification of the conductor pattern contained in the multilayer filter array which concerns on 2nd Embodiment. It is a figure for demonstrating the equivalent circuit which concerns on the modification of the multilayer filter which concerns on 1st Embodiment.

Explanation of symbols

  F1, F3 ... multilayer filter, F2 ... multilayer filter array, 1, 2 ... element, 3, 5 ... input / output terminal electrode, 7 ... ground terminal electrode, 10, 50 ... coil section, 11-16, 21, 31 34, 41, 42, 51-58, 81-90 ... insulator, 17a-17f, 61-68 ... conductor pattern, 19a-19e, 71-77 ... through-hole conductor, 18a, 18b, 35a-38a, 78 79, 91a to 100a ... leading portion, 20 ... connecting portion, 23 ... conductor pattern, 30,80 ... capacitor portion, 31,33,92,94,97,99 ... first capacitor electrode, 32,34,91, 93, 95, 96, 98, 100 ... second capacitor electrode.

Claims (5)

A coil portion including a coil configured by stacking a plurality of insulators formed with a conductor pattern, and a first capacitor and a second capacitor configured by stacking a plurality of insulators formed with a capacitor electrode are included. A laminate having a capacitor portion;
A first terminal electrode arranged in the laminate so as to electrically connect one end of the coil and one capacitor electrode constituting the first capacitor;
A second terminal electrode arranged in the laminate so as to electrically connect the other end of the coil and one capacitor electrode constituting the second capacitor;
A third terminal electrode arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting the first capacitor;
A fourth terminal electrode arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting the second capacitor;
A multilayer filter comprising: a connection portion having a conductor pattern for electrically connecting the third terminal electrode and the fourth terminal electrode.   The multilayer filter according to claim 1, wherein the connection portion is disposed at a central portion in the stacking direction of the stacked body.   The multilayer filter according to claim 1, wherein the connecting portion is disposed between the coil portion and the capacitor portion.   The multilayer filter according to any one of claims 1 to 3, wherein the shape of the conductor pattern of the connecting portion is a linear shape or a meander shape. A coil portion including N coils (an integer of N ≧ 2) configured by stacking a plurality of insulators on which conductor patterns are formed and a plurality of insulators on which capacitor electrodes are formed are stacked. A laminate having N first capacitors and N second capacitors respectively corresponding to the N coils;
N first terminal electrodes respectively disposed on the laminate so as to electrically connect one end of each coil and one capacitor electrode constituting each first capacitor corresponding to each coil; ,
N second terminal electrodes respectively disposed in the laminate so as to electrically connect the other end of each coil and one capacitor electrode constituting each second capacitor corresponding to each coil; ,
A third terminal electrode arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting each first capacitor;
A fourth terminal electrode arranged in the laminate so as to be electrically connected to the other capacitor electrode constituting each of the second capacitors;
A multilayer filter array comprising: a connection portion having a conductor pattern for electrically connecting the third terminal electrode and the fourth terminal electrode.

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