JP2006278750A - Tape peeling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a peeling device for a masking tape that can prevent a substrate from electrostatically being charged when the masking tape is peeled off the substrate. <P>SOLUTION: The peeling device peels the masking tape sticking on the substrate. A peeling means peels the masking tape off the substrate. An electrostatic discharging means discharges ionized gas toward the place where the masking tape separates from the substrate. Consequently, the substrate and masking tape which are electrostatically charged can be discharged. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a tape peeling apparatus, and more particularly, to a tape peeling apparatus used for masking a coating applied to a substrate.

Conventionally, in a processing step of applying a coating liquid to a substrate, a masking tape is sometimes used so that the coating liquid does not adhere to a substrate region that does not require coating. Specifically, the coating process is performed after a masking tape is attached to a substrate area that does not require coating. Then, after the coating process is completed, the masking tape is peeled off. As a method of peeling the masking tape, it is conceivable that the masking tape is peeled by holding one end of the masking tape by a peeling device in addition to a method of peeling the masking tape by a human hand. In addition, a method is considered in which a resin solution is applied to a substrate on which a masking tape is attached, the resin solution is cured, and then the masking tape is peeled off together with the resin solution (for example, see Patent Document 1).
JP 2000-42921 A

  Here, when the masking tape having adhesive force is peeled from the substrate, peeling charging occurs between the substrate and the masking tape, and the substrate and the masking tape may be charged. If the substrate is charged, in the worst case, the device on the substrate may be destroyed. Moreover, there is a possibility that particles are adsorbed on the substrate due to the substrate being charged. For example, if the applied material that has adhered to the masking tape during drying is dried and solidified, it may fall from the masking tape and adhere to the substrate when the masking tape is peeled off. When such particles adhere to the substrate, the quality of the substrate is degraded.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a tape peeling apparatus that can prevent the substrate from being charged when the tape is peeled from the substrate.

  The present invention employs the following configuration in order to solve the above problems. That is, the first invention is a peeling apparatus for peeling a tape attached to a substrate, and releases ionized gas toward a position where the tape is separated from the substrate and a peeling means for peeling the tape from the substrate. First neutralizing means.

  In the second invention, the peeling device may further include a housing having an opening. At this time, a peeling means makes a part protrude from an opening part, and peels a tape from a board | substrate. The first static elimination means is disposed in the housing and emits ionized gas toward the opening.

  Moreover, in 3rd invention, the peeling apparatus may be further provided with the supply means which is attached in a housing | casing and accommodates the peeling tape in the wound state, and supplies the said peeling tape. At this time, a peeling means collect | recovers tapes from a board | substrate by adhere | attaching and collect | recovering the peeling tape supplied from a supply means to a tape.

  In the fourth aspect of the invention, the peeling apparatus may further include a second static elimination unit that discharges ionized gas to the substrate outside the housing. In the fifth invention, the substrate may be a glass substrate. In the sixth invention, at least one of an organic EL material and a hole transport material may be applied to the substrate.

  According to the first aspect of the invention, since the ionized gas is released at a place where peeling electrification occurs between the tape and the substrate, charging of the tape and the substrate can be prevented.

  Further, according to the second invention, the place where peeling electrification occurs between the tape and the substrate, that is, the atmosphere near the opening can be used as the ionized gas, so that the tape and the substrate can be effectively prevented from being charged. it can.

  According to the third invention, even if the release tape is charged when the release tape is supplied from the wound portion, the release tape can be neutralized by the first static elimination means. Therefore, even when the tape is peeled off using the peeling tape, charging of the tape and the substrate can be prevented.

  In addition, according to the fourth invention, since the substrate can be neutralized before or after the peeling process is performed, the substrate can be more reliably prevented from being charged.

  Further, according to the fifth aspect of the present invention, it is possible to remove static electricity even on a substrate that is easily charged, such as a glass substrate.

  According to the sixth aspect of the invention, even when a conductive tape cannot be used, the tape and the substrate can be neutralized.

  1A to 1C are diagrams showing a masking tape peeling apparatus according to an embodiment of the present invention. 1A is a top view of the peeling device, FIG. 1B is a side view of the peeling device, and FIG. 1C is a front view of the peeling device. The peeling apparatus shown in FIGS. 1A to 1C attaches a masking tape to a substrate before applying a coating liquid and peels the masking tape from a substrate after application.

  The peeling device includes a table 1, a table moving mechanism 2, a first rail 3, a pasting unit 4, a peeling unit 5, a unit moving mechanism 6, a second rail 7, a support member 8, a first static elimination device 91, and a second static elimination device. 92. The periphery of the peeling device is surrounded by an outer wall 90 so that dust and particles do not adhere to the device itself and the substrate. A substrate to be masked and peeled off is placed on the upper surface (mounting surface) of the table 1. The mounting surface of the table 1 is parallel to the XY plane. The lower surface of the table 1 is fixed to the upper portion of the table moving mechanism 2. The table moving mechanism 2 is installed on the first rail 3 extending in the X-axis direction and can slide along the first rail 3. Thereby, the table moving mechanism 2 can translate the table 1 in the X-axis direction. The table moving mechanism 2 can rotate around the Z axis that is the center of the table 1, and can rotate the table 1 around the Z axis. Here, the state where the table 1 is located at the end on the X axis negative direction side is defined as an initial state.

  On the other hand, the support member 8 supports the two second rails 7 above the movable region of the table 1. Each second rail 7 is supported in a direction extending in the Y-axis direction. Two sets of one support member 8 and two second rails 7 are provided. The unit moving mechanism 6 is connected to four (two sets) of the second rails 7 so as to be slidable along the second rails 7. Thereby, the unit moving mechanism 6 can move in parallel in the Y-axis direction. The pasting unit 4 and the peeling unit 5 are fixed to the unit moving mechanism 6. 1A to 1C, the sticking unit 4 is fixed to the unit moving mechanism 6 on the Y axis negative direction side, and the peeling unit 5 is fixed to the unit moving mechanism 6 on the Y axis positive direction side. The sticking unit 4 and the peeling unit 5 are arranged at a position where the lower surface thereof is higher than the upper surface of the table 1 (position in the positive direction with respect to the Z axis). As described above, the unit moving mechanism 6 can move the pasting unit 4 and the peeling unit 5 in the Y-axis direction above the movable area of the table 1.

  The first and second static elimination devices 91 and 92 are ionizers that release ionized gas (air or the like). The 1st and 2nd static elimination apparatus 91 and 92 should just have a function which produces | generates ionized gas. Each static elimination apparatus 91 and 92 has an air outlet, and ionized gas is discharge | released from the air outlet in the predetermined direction. The first static elimination device 91 is fixed to the support member 8 on the X axis negative direction side. The first static elimination device 91 is arranged in a direction to discharge ionized gas toward the table 1 located at a predetermined position until reaching the position directly below the support member 8 on the X axis negative direction side. The second static elimination device 92 is fixed to the outer wall 90. The second static elimination device 92 is arranged in such a direction as to discharge ionized gas toward the table 1 when the table 1 is located at the end on the X axis positive direction side.

  FIG. 2 is a diagram schematically showing the internal configuration of the sticking unit 4, and is a view as viewed in the Y-axis positive direction in FIG. 1A. As shown in FIG. 2, the pasting unit 4 includes a housing 10, a supply reel 11, a collection reel 12, guide rollers 13 to 15, a movable roller 16, an adjustment roller 17, a tape separation member 18, an air cylinder 19, and a movable member 20. , The cutting unit 21, and the third static elimination device 93. The pasting unit 4 is for pasting the masking tape 24 on the substrate.

  In the housing 10 shown in FIG. 2, the supply reel 11, the recovery reel 12, the guide rollers 13 to 15, and the adjustment roller 17 are supported by the housing 10 on the rotation shaft. The masking tape 24 is wound around the supply reel 11 and stored. In this embodiment, the supply reel 11 is stored in a state where the masking tape 24 is attached to the base tape 25 to form a single tape. That is, the tape wound around the supply reel 11 has a two-layer structure of the masking tape 24 and the base tape 25. The tape wound around the supply reel 11 is wound around the collection reel 12 through the guide rollers 13 to 15, the tip portion of the tape separating member 18, and the adjustment roller 17 in this order.

  In FIG. 2, the tape separating member 18 is disposed in the vicinity of the opening 26 formed on the lower surface of the housing 10. The cutting part 21 has a cutting blade 22 for cutting the masking tape 24 and is disposed between the guide roller 15 and the tip portion of the tape separating member 18. The movable roller 16 is disposed in the vicinity of the tip portion of the tape separating member 18. The movable member 20 supports the rotating shaft of the movable roller 16 at one end thereof. The other end of the movable member 20 is connected to an air cylinder 19 that performs an expansion / contraction operation. A fulcrum 23 of the movable member 20 is fixed to the housing 10, and the movable member 20 is supported to be rotatable around the fulcrum 23. By these air cylinder 19 and movable member 20, the movable roller 16 can be moved in the vertical direction according to the expansion and contraction of the air cylinder 19 (more precisely, it can be moved on an arc centered on the fulcrum 23) ( (See arrows shown in FIG. 2). The movable roller 16 can move to a position protruding downward from the lower surface of the housing 10.

  The third static elimination device 93 is an ionizer that emits ionized gas, like the first and second static elimination devices 91 and 92. The third static elimination device 93 is fixed inside the housing 10. The third static elimination device 93 is arranged in a direction in which ionized gas (ionized gas) is discharged toward the opening 26. In FIG. 2, it arrange | positions in the direction which discharge | releases gas to a X-axis positive direction. Although not shown, a controller for instructing the ion amount and the air amount of the third static elimination device 93 may be attached in the housing 10. In addition, a sensor for measuring the ion concentration around the third static elimination device 93 may be attached.

  FIG. 3 is a diagram schematically showing the internal configuration of the peeling unit 5, and is a view as seen in the Y-axis positive direction in FIG. As shown in FIG. 3, the peeling unit 5 includes a housing 30, a supply reel 31, a recovery reel 32, guide rollers 33 to 35, an adjustment roller 36, a movable roller 37, an air cylinder 38, a movable member 39, and a fourth. A static eliminator 94 is provided. The peeling unit 5 peels the masking tape attached to the substrate.

  In the housing 30 shown in FIG. 3, the recovery reel 32, the supply reel 31, the guide rollers 33 to 35, and the adjustment roller 36 are supported by the housing 30 on the rotation shaft. The peeling tape 41 is wound around the supply reel 31 and stored. The peeling tape 41 is used for peeling the masking tape 24 from the substrate by adhering its adhesive surface to the masking tape 24 attached to the substrate. The width of the peeling tape 41 is wider than the width of the masking tape 24 so that the masking tape 24 can be completely covered. Further, unlike the above-described masking tape 24, the peeling tape 41 has a single-layer configuration that is not attached to another tape. The peeling tape 41 is wound around the collection reel 32 through the guide rollers 33 and 34, the movable roller 37, the guide roller 35, and the adjustment roller 36 in this order.

  The movable roller 37 is disposed in the vicinity of the opening 42 formed on the lower surface of the housing 30. The peeling tape 41 is guided by the movable roller 37 so that the adhesive surface faces the direction of the masking tape. The movable member 39 supports the rotating shaft of the movable roller 37 at one end thereof. The other end of the movable member 39 is connected to an air cylinder 38 that performs an expansion / contraction operation. A fulcrum 40 of the movable member 39 is fixed to the housing 30, and the movable member 39 is supported to be rotatable about the fulcrum 40. With these air cylinder 38 and movable member 39, the movable roller 37 can be moved in the vertical direction according to the expansion and contraction of the air cylinder 38 (more precisely, it can be moved on an arc centered on the fulcrum 40) ( (See arrows shown in FIG. 3). The movable roller 37 can move to a position protruding downward from the lower surface of the housing 30.

  The fourth static elimination device 94 is an ionizer that emits ionized gas, like the first and second static elimination devices 91 and 92. The fourth static eliminating device 94 is fixed inside the housing 30. The fourth static eliminator 94 is disposed in a direction in which the ionized gas is discharged toward the opening 42. In FIG. 3, it arrange | positions in the direction which discharge | releases gas to a X-axis positive direction. Although not shown, a controller for instructing the ion amount and the air amount of the fourth static elimination device 94 may be attached in the housing 30. In addition, a sensor for measuring the ion concentration around the fourth static elimination device 94 may be attached.

  In FIG. 3, if the peeling tape 41 is stretched in the entire section from the supply reel 31 to the collection reel 32, an extra force is applied to the peeling tape 41 by the movable roller 37 moving in the vertical direction. It may be added or the release tape 41 may sag. Therefore, in another embodiment, the peeling unit 5 is a mechanism that adjusts the length of the peeling tape 41 supplied from the supply reel 31 (the part of the peeling tape 41 that is not wound around the supply reel 31 and the collection reel 32). May be further provided. Specifically, the guide rollers 33 to 35 or the adjustment roller 36 may be moved according to the tension applied to the peeling tape 41 (in other words, according to the movement of the movable roller 37). Thereby, the length of the part of the peeling tape 41 that is not wound around the supply reel 31 and the collection reel 32 can be made constant, and an extra force is applied to the peeling tape 41 or the peeling tape 41 is slackened. This can be prevented.

  Next, the operation of the peeling apparatus will be described by taking as an example the case where the peeling apparatus configured as described above is used in a manufacturing process of an organic EL (Electro Luminescence) display device. When manufacturing an organic EL display device, a coating liquid such as a hole transport material or an organic EL material is applied to a substrate (glass substrate). Here, in order to prevent the coating liquid from being applied to a substrate area that does not require application, a step of applying a masking tape to the substrate (applying step) is performed. Next, the process (application process) of apply | coating a coating liquid with respect to the board | substrate with which the masking tape was affixed is performed. Furthermore, the process (peeling process) of peeling a masking tape from the board | substrate which the application process was completed is performed. The peeling device is used in the pasting step and the peeling step.

  The outline of the manufacturing process of the organic EL display device will be described with reference to FIGS. 4A to 4C. FIG. 4A is a diagram illustrating a substrate on which a pasting process has been performed. In the attaching step in the present embodiment, the peeling device attaches two masking tapes 24 to the substrate 50. As shown in FIG. 4A, one masking tape 24 is attached in parallel to the one side at a position away from one side by a predetermined length from one side of the substantially square substrate 50. The other masking tape is affixed in parallel to the opposing side at a position away from the side facing the one side by a predetermined length. A specific operation of the peeling apparatus when the masking tape 24 is attached to the substrate will be described later (see FIGS. 6A to 6C). The substrate on which the pasting process is completed is transported to a coating apparatus (not shown) and subjected to the coating process.

  FIG. 4B is a diagram illustrating the substrate subjected to the coating process. A hatched area 51 surrounded by a dotted line in FIG. 4B indicates an area where the coating liquid is applied. In the application step, as shown in FIG. 4B, the application liquid is applied to the substrate 50 on which the masking tape 24 is attached. As a coating method, for example, a method of discharging the coating liquid from the nozzle toward the substrate 50 can be considered. In FIG. 4B, the coating liquid is applied in stripes in a direction perpendicular to the masking tape 24 (up and down direction in FIG. 4B). In the coating process, for the purpose of preventing the coating liquid from flowing when the substrate 50 is transported, a process (preheating process) for heating the substrate 50 may be performed during or immediately after coating. The coating liquid applied to the substrate 50 is cured by this preheating treatment or natural drying. Therefore, when the masking tape 24 is peeled off, there is a possibility that the coated material is peeled off from the masking tape 24 and adheres to the substrate 50. The substrate 50 on which the coating process has been completed is transported to a peeling apparatus and subjected to a peeling process.

  FIG. 4C is a diagram illustrating the substrate that has been subjected to a peeling process. Regions 52 to 54 indicated by diagonal lines in FIG. 4C indicate substrate regions to which the coating liquid has been applied. In the peeling step, the masking tape 24 is peeled off from the substrate 50 after the coating liquid is applied by a peeling device. The specific operation of the peeling apparatus when peeling the masking tape 24 from the substrate will be described later (see FIGS. 7A to 7D). As shown in FIG. 4C, since the substrate region between the region 52 and the region 53 is a region where the masking tape 24 has been attached, the coating liquid is not attached. Similarly to the substrate region between the region 52 and the region 53, the coating liquid does not adhere to the substrate region between the region 53 and the region 54 as well. In the present embodiment, by using the masking tape as described above, it is possible to prevent the coating liquid from adhering to the substrate area that does not require coating. 4C is an area used as a single organic EL display device, and an area outside the alternate long and short dash line area 55 is cut and discarded.

  When manufacturing the organic EL display device, a coating liquid such as a hole transport material or red, green, and blue organic EL materials is applied to the substrate 50. FIG. 5 is a diagram showing a manufacturing process of the organic EL display device. Specifically, after forming a bank (wall) on the upper surface of the substrate P, a sticking process and a peeling process are performed for each coating liquid coating process using a tape peeling device (see FIG. 5). . For example, when a red organic EL material is applied to the substrate P, the masking tape 24 is attached before the application process, and the masking tape 24 is peeled off after the application process, and a baking process is performed. And also about the organic EL material of another color, the sticking process, the application | coating process, the peeling process, and the baking process are performed similarly to the case of a red organic EL material.

  Next, the operation of the peeling apparatus will be described in detail. First, operation | movement of the peeling apparatus in a sticking process is demonstrated. In the pasting step, first, the substrate is placed on the table 1 before the operation of the peeling device is started. Although details will be described later, the masking tape 24 is attached in parallel with the X-axis direction. Therefore, the direction of the substrate on the table 1 is adjusted by the rotation operation of the table moving mechanism 2 so that the direction in which the masking tape 24 is applied becomes a desired direction. In the initial state, the table 1 is disposed outside the two support members 8, for example, as shown in FIG. 1A. The sticking unit 4 in the initial state is moved and arranged by the unit moving mechanism 6 in a position that becomes a space immediately above the table 1 when the table 1 is positioned between the two support members 8.

  From the initial state shown above, first, the first and second static elimination devices 91 and 92 start to operate. That is, the 1st and 2nd static elimination apparatuses 91 and 92 produce | generate ionized gas, and discharge | release it from an air outlet. It should be noted that the amount of ions and gas flow emitted from the static eliminators 91 and 92 are set in advance by the operator before the operation of each static eliminator. Next, the movement of the table 1 is started. That is, the table 1 moves in a direction approaching the sticking unit 4 (X-axis positive direction in FIG. 1A). Here, in the initial state, the gas from the first static elimination device 91 is released to the substrate 50 on the table 1. Thereby, the atmosphere around the substrate 50 becomes an ionized gas, so that the substrate 50 can be discharged. Further, since the table 1 is moved, the gas can be discharged evenly to the substrate 50 on the table 1, so that the entire region of the substrate 50 can be surely discharged. As described above, in the present embodiment, since the substrate transported to the peeling device can be neutralized before the sticking process, even if the transported substrate is charged, the neutralization is effectively performed. Can do.

  After the movement of the table 1 is started, the third static elimination device 93 further starts to operate. That is, the 3rd static elimination apparatus 93 produces | generates ionized gas, and discharge | releases it from an air outlet. The amount of ions released from the third static elimination device 93 and the amount of gas flow are set in advance by the operator before the operation of the third static elimination device 93. Next, the tape feeding operation is started. That is, the supply reel 11, the recovery reel 12, and the adjustment roller 17 of the sticking unit 4 start to rotate. As a result, the tape is supplied from the supply reel 11, and the tape is wound around the recovery reel 12 and recovered. The tape feeding speed by the supply reel 11, the recovery reel 12, and the adjustment roller 17 is set to be equal to the moving speed of the table 1.

  Here, when the tape is supplied from the supply reel 11, the tape is charged when the tape is peeled off from the portion wound around the supply reel 11. However, since the gas from the third static elimination device 93 is released to the tape in the vicinity of the opening 26 of the housing 10, the tape can be neutralized. Further, since the atmosphere in the vicinity of the opening 26 becomes ionized gas, the substrate 50 to which the tape is attached can be neutralized.

  6A, 6B, and 6C are views showing a state in the vicinity of the opening of the housing 10 during the operation of the pasting process. 6A to 6C, the casing 10, the air cylinder 19, and the movable member 20 are not shown for the purpose of making the drawings easy to see. When the table 1 reaches a predetermined position directly below the sticking unit 4, the cutting unit 21 cuts the masking tape 24 (FIG. 6A). Specifically, the cutting unit 21 cuts the masking tape 24 by causing the cutting blade 22 to protrude toward the masking tape 24 and biting into the masking tape 24. Here, the tape sent from the guide roller 15 to the tape separating member 18 is composed of two layers of a masking tape 24 and a base tape 25. The cutting blade 22 is adjusted to bite to a thickness that cuts only the masking tape 24 of the masking tape 24 and the base tape 25. Therefore, although the masking tape 24 is cut by the cutting part 21, the base tape 25 is not cut.

  When the tape is further fed after the masking tape 24 is cut by the cutting portion 21, the cutting position of the masking tape 24 reaches the tip portion of the tape separating member 18. Since the base tape 25 is bent at an acute angle at the tip portion of the tape separating member 18, the masking tape 24 is peeled from the base tape 25. As a result, the masking tape 24 protrudes downward from the tip portion. The movable roller 16 moves downward (Z-axis negative direction) by the expansion and contraction of the air cylinder 19 at the timing when the masking tape 24 protrudes downward from the tip portion (FIG. 6B). The movable roller 16 moves to the vicinity of the upper surface of the substrate 50 to bring the tip of the masking tape 24 into contact with the substrate 50. As a result, the tip of the masking tape 24 is attached to the substrate 50. When the masking tape 24 is brought into contact with the substrate 50, the movable roller 16 moves upward and returns to the original position.

  Further, the moving operation of the table 1 and the tape feeding operation are continued while the movable roller 16 is moving in the vertical direction. Therefore, when the tip of the masking tape 24 is attached to the substrate 50, the masking tape 24 that is subsequently supplied is attached to the substrate 50 sequentially from the tip (FIG. 6C). On the other hand, when a tape having a predetermined length is sent after the masking tape 24 is cut, the cutting unit 21 cuts the masking tape 24 again. The predetermined length is the length of the masking tape 24 to be attached to the substrate 50. After the cutting by the cutting unit 21 is performed again, the masking tape 24 is stuck to the substrate 50 until the end by feeding the tape further. The end of the masking tape 24 may be brought into contact with the substrate 50 by moving the movable roller 16 in the vertical direction. Further, the movable roller 16 may be kept pressed against the substrate 50 via the masking tape 24 during the masking tape 24 affixing operation. With the above operation, the process of attaching one masking tape 24 to the substrate 50 is completed.

  Note that when the table 1 reaches the X axis positive direction side, the ionized gas from the second static elimination device 92 is released to the substrate 50 on the table 1. As a result, it is possible to remove static electricity from the substrate 50 after the masking tape 24 is applied.

  With the above operation, the masking tape 24 can be attached along the X-axis direction. When a plurality of masking tapes 24 are attached to the substrate, the peeling device repeats the above operation a plurality of times. The position in the X-axis direction where the tip of the masking tape 24 is attached can be set to an arbitrary position by adjusting the timing for cutting the masking tape 24. On the other hand, the position of the masking tape 24 in the Y-axis direction can be set to an arbitrary position by moving the pasting unit 4 in the Y-axis direction in advance by the unit moving mechanism 6.

  Next, operation | movement of the peeling apparatus in a peeling process is demonstrated. In the peeling step, first, the substrate 50 is placed on the table 1 before the operation of the peeling device is started. The substrate 50 is placed so that the masking tape 24 to be peeled faces in the X-axis direction. The orientation of the substrate 50 on the table 1 is adjusted by the rotation operation of the table moving mechanism 2. The initial position of the table 1 in the peeling process is an outer position between the two support members 8 as in the sticking process. Further, in the initial state, the peeling unit 5 is arranged such that the movable roller 37 is positioned on an extension line of the masking tape 24 to be peeled from the substrate 50. The peeling unit 5 is arranged so that the position of the masking tape 24 to be peeled from the substrate 50 and the position of the movable roller 37 are the same in the Y-axis direction.

  From the initial state shown above, first, the first and second static elimination devices 91 and 92 start to operate. That is, the 1st and 2nd static elimination apparatuses 91 and 92 produce | generate ionized gas, and discharge | release it from an air outlet. It should be noted that the amount of ions and gas flow emitted from the static eliminators 91 and 92 are set in advance by the operator before the operation of each static eliminator. Next, the movement of the table 1 is started. The table 1 moves in a direction approaching the peeling unit 5 (X-axis positive direction in FIG. 1A). Here, in the initial state, the gas from the first static elimination device 91 is released to the substrate 50 on the table 1. Thereby, the atmosphere around the substrate 50 becomes an ionized gas, so that the substrate 50 can be discharged. Further, since the table 1 is moved, the gas can be discharged evenly to the substrate 50 on the table 1, so that the entire region of the substrate 50 can be surely discharged. As described above, in the present embodiment, since the substrate transported to the peeling apparatus can be neutralized before the stripping process, even if the transported substrate is charged, the neutralization is effectively performed. Can do.

  After the movement of the table 1 is started, the fourth static eliminator 94 starts operating. That is, the 4th static elimination apparatus 94 produces | generates ionized gas, and discharge | releases it from an air outlet. Note that the amount of ions released from the fourth static elimination device 94 and the amount of gas flow are set in advance by the operator before the operation of the fourth static elimination device 94. Next, the feeding operation of the peeling tape 41 is started. That is, the supply reel 31, the recovery reel 32, and the adjustment roller 36 of the peeling unit 5 start to rotate. As a result, the peeling tape 41 is supplied from the supply reel 31, and the peeling tape 41 is wound around the collection reel 32 and collected. Note that the feeding speed of the peeling tape 41 by the supply reel 31, the recovery reel 32, and the adjustment roller 36 is set to be equal to the moving speed of the table 1.

  Here, when the peeling tape 41 is supplied from the supply reel 31, the peeling tape 41 is charged when the peeling tape 41 is peeled off from the portion wound around the supply reel 11. However, since the gas from the fourth static elimination device 94 is released to the peeling tape 41 in the vicinity of the opening 26 of the housing 10, the peeling tape 41 can be discharged.

  7A, FIG. 7B, FIG. 7C, and FIG. 7D are views showing a state near the opening of the housing 30 in the peeling process. 7A to 7D, the housing 30, the air cylinder 38, and the movable member 39 are not shown for the purpose of making the drawings easy to see.

  When the table 1 is moved from the initial state, the tip of the masking tape 24 affixed to the substrate 50 reaches a position directly below the movable roller 37 (FIG. 7A), and the movable roller 37 is moved downward by the expansion and contraction of the air cylinder 38. Move in (Z-axis negative direction). As shown in FIGS. 3 and 7A and the like, the movable roller 37 has a peeling tape stretched so as to protrude toward the substrate 50. Therefore, when the movable roller 37 moves to the vicinity of the upper surface of the substrate 50, the adhesive surface of the peeling tape 41 contacts the tip of the masking tape 24 (FIG. 7B). Thereby, the peeling tape 41 and the masking tape 24 are bonded. When the peeling tape 41 is brought into contact with the masking tape 24, the movable roller 37 moves upward and returns to the original position. At this time, since the tip of the masking tape 24 is bonded to the peeling tape 41, the tip of the masking tape 24 is peeled from the substrate 50 (FIG. 7C).

  Further, the moving operation of the table 1 and the feeding operation of the peeling tape 41 are continued while the movable roller 37 is moving in the vertical direction. Accordingly, when the peeling tape 41 is bonded to the tip of the masking tape 24, the masking tape 24 is sequentially bonded from the tip to the peeling tape 41 by continuously supplying the peeling tape 41 (FIG. 7D). That is, when the movable roller 37 is rotated by the feeding operation of the peeling tape 41, the masking tape 24 comes in contact with the peeling tape 41 in order from the tip, and thus both are bonded. After that, since the movement operation of the table 1 and the feeding operation of the peeling tape 41 are continued, the masking tape 24 is bonded to the peeling tape 41 to the end and peeled from the substrate 50. The masking tape 24 bonded to the peeling tape 41 is collected inside the housing 30 by the feeding operation of the peeling tape, and is collected on the collecting reel 32 through the guide roller 35 and the adjusting roller 36. In addition, although the coating material has adhered to the upper surface of the masking tape 24, when the masking tape 24 is collect | recovered, this upper surface is covered with the peeling tape 41. FIG. Therefore, there is no possibility that the coating material adhered to the upper surface of the masking tape 24 falls and adheres to the substrate.

  Further, when the masking tape 24 is peeled off from the substrate 50 by the peeling tape 41, peeling charging occurs on the masking tape 24 and the substrate 50. However, as described above, since the atmosphere in the vicinity of the opening 42 of the peeling unit 5 is ionized gas by the fourth static elimination device 94, the masking tape 24 and the substrate 50 can be neutralized. In addition, when the table 1 reaches the X axis positive direction side, the ionized gas from the second static elimination device 92 is released to the substrate 50 on the table 1. Thereby, since the static electricity can be further removed from the substrate 50 after the masking tape 24 is peeled off, the substrate 50 can be reliably prevented from being charged.

  With the above operation, the process of peeling one masking tape 24 from the substrate 50 is completed. Note that when peeling a plurality of masking tapes 24 from the substrate 50, the peeling device repeats the above operation a plurality of times.

  As described above, according to the present embodiment, when the masking tape attached to the substrate is peeled off, the ionized gas is released toward the portion where the masking tape is peeled off. be able to. Therefore, it is possible to prevent the device on the substrate from being destroyed by charging. Further, since particles or the like can be prevented from being adsorbed to the substrate due to charging, deterioration of the substrate quality can be prevented. Furthermore, according to the present embodiment, the substrate 50 can be neutralized before and after the peeling process by the first and second neutralization devices 91 and 92, so that the substrate 50 can be more reliably prevented from being charged. Can do. Moreover, it is preferable to arrange | position each static elimination apparatus 91-94 in the position as close as possible to the area | region which should perform static elimination so that static elimination can be performed effectively with a weak air volume.

  In the above embodiment, the case where the peeling device is used when applying the organic EL material has been described as an example. However, the peeling device according to the present invention is not limited to the case where the organic EL material is applied. The present invention can also be applied to a case where a masking tape used when applying a fluorescent material of Plasma Display Panel), a resist solution, an SOG (Spin On Glass) solution, or the like to a substrate is peeled off. In addition, the present invention can be applied not only when the masking tape used as the anti-coating liquid is peeled off but also when the masking tape is peeled off for other uses.

  In addition, when using a masking tape when apply | coating the coating liquid of organic electroluminescent material or a hole transport material to a board | substrate, a conductive masking tape cannot be used. This is because if these coating solutions adhere to the masking tape, the substrate may be contaminated. Thus, even if it is a case where a conductive masking tape cannot be used, according to this invention, a masking tape and a board | substrate can be neutralized. Therefore, the present invention is particularly effective when a masking tape is used when applying a coating liquid of an organic EL material or a hole transport material to a substrate.

  In addition, in this embodiment, although the peeling method which peels a masking tape using a peeling tape was demonstrated as an example, the peeling method of a masking tape may be what kind of method. For example, even if the masking tape is peeled off by holding one end of the masking tape attached to the substrate and pulling the one end, the masking tape and the substrate are charged. Can do.

  In the above embodiment, the table is moved at a speed equal to the feeding speed of the peeling tape. However, in another embodiment, the peeling unit may be moved.

  INDUSTRIAL APPLICABILITY The present invention can be used for the purpose of preventing charging of a substrate that occurs when a masking tape is peeled from a substrate in a peeling device that peels the masking tape from the substrate.

The top view of the peeling apparatus of the masking tape which concerns on this embodiment Side view of a masking tape peeling apparatus according to this embodiment The front view of the peeling apparatus of the masking tape which concerns on this embodiment The figure which shows the internal structure of the sticking unit 4 typically. The figure which shows the internal structure of the peeling unit 5 typically. The figure which shows the board where the pasting process was given The figure which shows the board | substrate with which the coating process was given The figure which shows the board | substrate which the peeling process was performed to The figure which shows the manufacturing process of an organic electroluminescence display The figure which shows the mode of the opening part vicinity of the housing | casing 10 in a sticking process. The figure which shows the mode of the opening part vicinity of the housing | casing 10 in a sticking process. The figure which shows the mode of the opening part vicinity of the housing | casing 10 in a sticking process. The figure which shows the mode of the opening part vicinity of the housing | casing 30 in a peeling process. The figure which shows the mode of the opening part vicinity of the housing | casing 30 in a peeling process. The figure which shows the mode of the opening part vicinity of the housing | casing 30 in a peeling process. The figure which shows the mode of the opening part vicinity of the housing | casing 30 in a peeling process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Table 2 Table moving mechanism 3 1st rail 4 Sticking unit 5 Peeling unit 6 Unit moving mechanism 7 2nd rail 8 Support member 10 Housing | casing 11, 31 Supply reel 12, 32 Collecting reels 13-15, 33-35 Guide roller 16 , 37 Movable rollers 17, 36 Adjustment roller 18 Tape separating member 19, 38 Air cylinder 20, 39 Movable member 21 Cutting portion 22 Cutting blade 23, 40 Support point 90 Outer wall 91-94 Static elimination device

Claims (6)

A peeling device for peeling a tape attached to a substrate,
Peeling means for peeling the tape from the substrate;
A peeling apparatus comprising: a first charge eliminating unit that releases ionized gas toward a position where the tape is separated from the substrate. A housing having an opening;
The peeling means peels the tape from the substrate by causing a part thereof to protrude from the opening,
2. The peeling apparatus according to claim 1, wherein the first static elimination unit is disposed in the housing and releases ionized gas toward the opening. The apparatus further includes a supply unit that is attached to the housing and stores the release tape in a wound state, and supplies the release tape.
The peeling device according to claim 2, wherein the peeling unit collects the tape from the substrate by bonding and collecting the peeling tape supplied from the supply unit to the tape.   The peeling apparatus according to claim 2, further comprising a second charge removing unit that discharges ionized gas to the substrate outside the housing.   The peeling apparatus according to claim 1, wherein the substrate is a glass substrate.   The peeling apparatus according to claim 1, wherein at least one of an organic EL material and a hole transport material is applied to the substrate.

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