JP2006278468A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

Provided is a mounting apparatus capable of efficiently mounting chips on a substrate in a zigzag manner.
An electronic component mounting apparatus for selectively mounting a plurality of electronic components on a substrate in either a matrix or a zigzag state, comprising: a chip supply unit; and a chip supplied from the supply unit A mounting tool 7 to be mounted on the substrate and a control device 9 for controlling the mounting position of the chip on the substrate by the mounting tool 7 are provided. The control device 9 inputs column information for setting the chip mounting information in the column direction of the substrate. A mounting information based on information from the column information input unit 27 and the row information input unit 28, the row information input unit 28 for setting the mounting information of the electronic component in the row direction intersecting the column direction of the board And an information processing unit 26 for driving and positioning 7 to mount the electronic component at a predetermined position on the substrate.
[Selection] Figure 2

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component such as a semiconductor chip on a substrate such as a lead frame.

  When mounting a semiconductor chip (hereinafter referred to as a chip) as an electronic component on a substrate such as a lead frame, a large number of chips are mounted in a matrix on the substrate, and each chip on the substrate is sealed after resin sealing after mounting. It has been practiced to punch out the provided portions into substrate pieces and use each substrate piece in an electronic device such as an IC card.

  The shape of the substrate to be punched, that is, the shape of the substrate piece, may be required to be different, for example, a quadrangular shape such as a rectangle or a square or an L shape other than a quadrangle, depending on the electronic device used.

  When a rectangular shape is required as the shape of the substrate piece, if the chips are mounted in a matrix at predetermined intervals on the substrate, waste generated on the substrate can be reduced and a plurality of substrate pieces can be punched from the substrate. is there. However, when the shape of the substrate piece is, for example, L-shaped, the chip is not arranged in a matrix but in a staggered manner in order to increase the effective use area of the substrate, that is, to reduce waste generated in the substrate. May be required to be implemented.

  Conventionally, a mounting apparatus for mounting chips described above mounts the chips on the substrate only with information in the column direction. When mounting chips on a substrate in a matrix, the number of chips mounted in each column is the same as the number of chips in each column and the mounting position of each chip in the direction intersecting the column direction, so only the information in the column direction By moving the mounting tool along the direction intersecting with the above row direction of the board, that is, only one type of mounting data is required. It was possible to mount the chip.

  However, when the chips 4 are mounted in a staggered manner on the substrate 1 as shown in FIG. 4, among the six columns P1 to P6, three columns P1, P3, and P5 on which the three chips 4 are mounted. The information in the column direction differs between the three columns P2, P4, and P6 on which the two chips 4 are mounted.

  Therefore, first, the three chips 4 are mounted at predetermined intervals in the row direction on the three columns P1, P3, and P5 on which the three chips 4 are mounted. Next, the substrate is again put into the transfer device, and two chips 4 are mounted on the three rows P2, P4, and P6 on which the two chips 4 are mounted, and the three chips 4 are mounted on the rows P1, P3, and P5. The chip 4 and the chip 4 are mounted with a predetermined displacement in the row direction. That is, as shown in FIG. 4, the chips 4 are mounted in a staggered manner on the substrate 1 by putting the substrate into the transfer device twice.

  However, when the chips 4 are mounted on the substrate 1 in a zigzag manner as described above using only the information in the column direction, chip mounting on the three columns P1, P3, and P5 on which the three chips 4 are mounted, and 2 The mounting of the chip 4 on the three columns P2, P4, and P6 on which one chip 4 is mounted must be performed separately. That is, the information on the columns P1, P3, and P5 on which the three chips 4 are mounted differs from the information on the columns P2, P4, and P6 on which the two chips are mounted. Had to be divided into times.

  When the mounting of the chip 4 on the substrate 1 is divided into two times, first, the chip 4 is mounted with the mounting data of the three columns P1, P3, and P5 on which the three chips 4 are mounted, and then the mounting data is switched to 2 The chip 4 is mounted with the mounting data of the three columns P2, P4, and P6 on which the two chips 4 are mounted. For this reason, the switching time when the chips 4 are mounted on the substrate 1 in a zigzag manner and the tact time due to twice loading the substrate may be increased, leading to a decrease in productivity.

  An object of the present invention is to provide an electronic component mounting apparatus and mounting method that enable mounting electronic components on a substrate in a staggered manner without causing a reduction in productivity.

The present invention is an electronic component mounting apparatus for selectively mounting a plurality of electronic components on a substrate in a matrix or staggered state,
The electronic component supply unit;
A mounting tool for mounting the electronic component supplied from the supply unit on the substrate;
A control device for controlling the mounting position of the electronic component on the substrate by the mounting tool;
The control device
A column information input unit for setting mounting information of the electronic component with respect to the column direction of the substrate;
A row information input unit for setting mounting information of the electronic component with respect to a row direction intersecting with the column direction of the substrate;
Drive control means for driving and positioning the mounting tool based on information from the column information input unit and the row information input unit to mount the electronic component at a predetermined position on the board. It is in the component mounting device.

  The drive control means includes an information processing unit that processes information from the column information input unit and the row information input unit, and an output unit that outputs a drive signal for driving the mounting tool based on the processing of the information processing unit. It is preferable that it is comprised by these.

  When the electronic component is mounted on one surface of the substrate by the mounting tool, the stage tool has a stage tool that supports a portion on which the electronic component is mounted on the other surface of the substrate. It is preferable that the positioning is performed at a position corresponding to the mounting tool by the means.

The present invention is an electronic component mounting method for selectively mounting a plurality of electronic components on a substrate in a matrix or staggered state,
Setting the column direction information of the electronic components mounted on the substrate;
Setting information in the row direction of the electronic component mounted on the substrate;
And mounting the electronic component on the substrate on the basis of the information in the column direction and the row direction.

  According to this invention, the mounting tool for mounting the electronic components on the board is controlled by the information in the column direction and the information in the row direction, so that the electronic components are mounted on the board in a staggered manner. However, the electronic components can be mounted in a staggered manner if the substrates are inserted once along the direction intersecting the row direction of the substrates at a predetermined pitch.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a mounting apparatus according to an embodiment of the present invention, and this mounting apparatus includes a transport apparatus 2 that transports a substrate 1 such as a lead frame along a predetermined direction. The transport device 2 has a pair of guide rails 3 arranged in parallel at a predetermined interval, and the substrate 1 is intermittently pitched along the guide rails 3. Each time the substrate 1 is pitch-fed, it is positioned and held on the guide rail 3 by a clamper (not shown).

  When the substrate 1 is transported to the mounting position B by the transport device 2, a semiconductor chip 4 (hereinafter referred to as a chip 4) as an electronic component supplied from a component supply unit 11 described later is mounted on the mounting position B. Is done. At this mounting position B, a stage tool 5 that supports the lower surface of the substrate 1 is provided so as to be driven in the horizontal X and Y directions and the vertical Z direction by the first drive mechanism 6 shown in FIG. It has been.

  A mounting tool 7 for mounting the chip 4 on the upper surface of the substrate 1 is provided above the stage tool 5 so as to be driven in the X, Y and Z directions by the second driving mechanism 8. The stage tool 5 and the mounting tool 7 are controlled by a control device 9 as described later.

  The component supply unit 11 has a wafer stage 12 driven in the X and Y directions by a drive source (not shown). On the wafer stage 12, a semiconductor wafer 13 divided into a large number of chips 4 is held on a wafer sheet 14.

  Of the chips 4 held on the wafer sheet 14, the chip 4 at a predetermined position is pushed up by a push-up pin (not shown). The chip 4 pushed up by the push-up pin is sucked by the suction nozzle 16. The suction nozzle 16 is attached to a rotary head 18 provided in the reversing unit 17. The rotary head 18 is driven to rotate. Accordingly, the suction nozzle 16 is positioned at a position where the suction surface 16a faces downward and a position where the suction face 16a turns 180 degrees from the position and faces upward.

  The reversing unit 17 is driven along the guide rod 19. The guide rod 19 is installed horizontally from the wafer stage 12 toward the mounting position B of the transfer device 2. As a result, the suction nozzle 16 that sucks the chips 4 from the wafer sheet 14 is positioned and driven to the side of the transport device 2 with the suction surface 16a that sucks the chips 4 upward as shown by a chain line in FIG. This position is the delivery position.

  When the suction nozzle 16 is positioned at the delivery position, the mounting tool 7 is driven as indicated by a chain line in the drawing to receive the chip 4 sucked on the suction surface 16a of the suction nozzle 16. Next, the mounting tool 7 is positioned at a mounting position B above the substrate 1 as indicated by a solid line.

  At the same time, the stage tool 5 is driven in the upward direction to support the lower surface of the substrate 1. When the mounting tool 7 is driven in the downward direction, the chip 4 held by the mounting tool 7 is mounted on the portion of the substrate 1 supported by the stage tool 5.

  A first camera 21 that images the substrate 1 and recognizes the mounting position of the chip 4 is disposed above the mounting position B where the chip 4 is mounted on the substrate 1. A second camera 22 for recognizing the position of the chip 4 held by the suction nozzle 16 is disposed above the delivery position where the mounting tool 7 receives the chip 4 from the suction nozzle 16. A third camera 23 for recognizing the position of the chip 4 held by the mounting tool 7 is disposed below the position where the mounting tool 7 that has received the chip 4 passes.

  The imaging signals of the first to third cameras 21 to 23 are input to an image processing unit (not shown) provided in the control device 9. Then, the control device 9 accurately positions the mounting tool 7 with respect to the substrate 1 based on the coordinate signal of the chip 4 processed by the image processing unit, and causes the chip 4 to be mounted on the substrate 1. ing.

  When the chips 4 are mounted on the substrate 1 in a matrix or a staggered pattern, the control device 9 positions the mounting tool 7 and the stage tool 5 with respect to the substrate 1 in the column direction and the row direction of the substrate 1.

  That is, the control device 9 includes an information processing unit 26 as shown in FIG. A column information input unit 27 and a row information input unit 28 are connected to the information processing unit 26. Column information and row information when the chip 4 is mounted on the substrate 1 can be input to the information input units 27 and 28 by the operation unit 29.

  The information processing unit 26 to which the column information and the row information are input positions the mounting tool 7 and the stage tool 5 at the mounting position of the chip 4 on the substrate 1 based on the input information. That is, information on whether the chip 4 is mounted on the substrate 1 in a matrix or zigzag state is input to the information processing unit 26 from the operation unit 29.

A first output unit 31 and a second output unit 32 are connected to the information processing unit 26. The first output unit 31 outputs a drive signal to the first drive mechanism 6. Thereby, the stage tool 5 is driven and positioned in the X and Y directions, and then is driven upward in the Z direction to support the lower surface of the substrate 1 at a predetermined position by the upper end surface.

  The second output unit 32 outputs a drive signal to the second drive mechanism 8. As a result, the mounting tool 7 is driven and positioned in the X and Y directions, and then driven downward in the Z direction to mount the chip 4 held on the lower end surface on the upper surface of the substrate 1 at a predetermined position. The position where the chip 4 is mounted on the substrate 1 by the mounting tool 7 is the upper surface corresponding to the lower surface of the substrate 1 supported by the stage tool 5.

When the chips 4 are mounted on the substrate 1 in a matrix of 3 rows and 6 columns, the information processing unit 26 creates a data table shown in the following [Table 1] by the input from the operation unit 29. The mounting tool 7 and the stage tool 5 are sequentially positioned so that the chip 4 is mounted on the substrate 1 based on the information and the row information.

  That is, the chip 4 is mounted at the intersection of the column and row indicated by “1” in [Table 1]. For example, in the case of the P1 column located on the front end side of the substrate 1 in the conveyance direction, the stage tool 5 and the mounting tool 7 are sequentially positioned at three intersections of the P1 column and the C1, C3, and C5 rows to form a chip. 4 is implemented.

  When the mounting of the P1 row is completed, the substrate 1 is sent at a pitch corresponding to the row interval, and the mounting of the P2 row is performed. In mounting the P2 column, chips are mounted at three intersections of the P2 column and the C1, C3, and C5 rows. Hereinafter, the chip 4 is mounted at the intersection of each column and the C1, C3, and C5 rows in the order of the P3 column, the P4 column, the P5 column, and the P6 column. Thereby, the chips 4 can be mounted on the substrate 1 in a matrix of 3 rows and 6 columns 3 as shown in FIG.

  That is, the stage tool 5 and the mounting tool 7 are driven at the intersection of the column and the row indicated by “1” in the above [Table 1]. At the intersection, the mounting tool 7 is precisely positioned based on the imaging signals from the cameras 21 to 23 and the chip 4 is mounted on the substrate 1.

On the other hand, when the chips 4 are mounted in a staggered pattern on the substrate 1, the information processing unit 26 creates a data table shown in the following [Table 2] by input from the operation unit 29, and the column information and rows of the data table The mounting tool 7 and the stage tool 5 are sequentially positioned so that the chip 4 is mounted on the substrate 1 based on the information.

  That is, the chip 4 is mounted at the intersection of the column and row indicated by “1” in [Table 2]. For example, in the case of the P1 column located on the front end side in the conveyance direction of the substrate 1, the stage tool 5 and the mounting tool 7 are sequentially driven at three intersections of the P1 column and the C1, C3, and C5 rows to form a chip. 4 is implemented.

  When the chips are mounted on the P1 row, the substrate 1 is fed at a predetermined pitch, and the P2 row is mounted. In the case of the P2 column, a chip is mounted at two intersections of the C2 row and the C4 row. Hereinafter, in the P3 row, similarly to the P1 row, the chips 4 are mounted at three intersections, the P4 column has two intersections, the P5 column has five intersections, and the P6 column has two chips at two intersections. Thereby, the chips 4 can be mounted on the substrate 1 in a staggered manner as shown in FIG.

  As described above, the control device 9 is provided with the column information input unit 27 and the row information input unit 28, and the mounting position of the chip 4 on the substrate 1 is controlled by the column information and the row information.

  Therefore, even when the chips 4 are mounted on the substrate 1 in a staggered manner, the chip 4 is desired for each row only by transporting the substrate 1 once along the row direction of the substrate 1. Can be implemented in the arrangement state.

  Therefore, when the chips 4 are mounted in a zigzag pattern, the substrate 1 is conventionally loaded twice into the transfer device 2, but this time it is only necessary to load the substrate 1 once into the transfer device 2. It is possible to greatly reduce the tact time.

  In the above embodiment, the stage tool is driven and positioned together with the mounting tool. However, for example, if the stage tool is large enough to support the entire lower surface of the substrate 1, a drive signal from the control device is provided. Only drive the mounting tool.

  Further, the electronic component mounted on the substrate is not limited to the semiconductor chip, and may be an electronic component on another chip such as a capacitor, and the point is not limited at all.

The side view which shows schematic structure of the mounting apparatus of one embodiment of this invention. The block diagram of a control apparatus. The figure which shows the state which mounted the chip | tip on the board | substrate in matrix form. The figure which shows the state which mounted the chip | tip on the board | substrate in zigzag form.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 4 ... Chip | tip (electronic component), 5 ... Stage tool, 6 ... 1st drive mechanism, 7 ... Mounting tool, 8 ... 2nd drive mechanism, 9 ... Control apparatus, 11 ... Component supply part, 26 ... Information processing section, 27 ... Column information input section, 28 ... Row information input section, 29 ... Operation section.

Claims (4)

An electronic component mounting apparatus that selectively mounts a plurality of electronic components on a substrate in a matrix or staggered state,
The electronic component supply unit;
A mounting tool for mounting the electronic component supplied from the supply unit on the substrate;
A control device for controlling the mounting position of the electronic component on the substrate by the mounting tool;
The control device
A column information input unit for setting mounting information of the electronic component with respect to the column direction of the substrate;
A row information input unit for setting mounting information of the electronic component in a row direction intersecting the column direction of the substrate;
Drive control means for driving and positioning the mounting tool on the basis of information from the column information input unit and the row information input unit and mounting the electronic component at a predetermined position on the board. Component mounting equipment.   The drive control means includes an information processing unit that processes information from the column information input unit and the row information input unit, and an output unit that outputs a drive signal for driving the mounting tool based on the processing of the information processing unit. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus comprises:   When the electronic component is mounted on one surface of the substrate by the mounting tool, the stage tool has a stage tool that supports a portion on which the electronic component is mounted on the other surface of the substrate. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is driven and positioned by the means at a position corresponding to the mounting tool. An electronic component mounting method for selectively mounting a plurality of electronic components on a substrate in a matrix or staggered state,
Setting the column direction information of the electronic components mounted on the substrate;
Setting information in the row direction of the electronic component mounted on the substrate;
Mounting the electronic component on the substrate based on the information in the column direction and the row direction.

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