JP2006270930A - Mobile device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mobile device wherein the heat inside the cabinet thereof is efficiently dissipated outside the cabinet. <P>SOLUTION: A first cabinet 12 and a second cabinet 14 are connected together via a movable portion 20 in this mobile device 10. This mobile device can be in at least two states i.e. states wherein the first cabinet and the second cabinet are opened and closed, respectively. A heat-dissipating board 16, integrally formed with circuit elements, is formed in the exposed location of the first cabinet 12; and in a state with the first cabinet and the second cabinet closed, the exposed surface of the heat-dissipating board is covered with the second cabinet. The heat, produced by the circuit elements, is conducted to the heat-dissipating board 16 and is dissipated from the exposed surface 36 to the outside of the first cabinet 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mobile device, and more particularly, to a mobile device including a first housing and a second housing which are connected so as to be opened and closed.

  In recent years, electronic devices such as mobile phones have become increasingly high-performance and high-functional, and accordingly, power consumption of electronic components used inside the device tends to increase. Particularly, a high-performance LSI or the like that performs advanced image processing consumes a large amount of power and generates a large amount of heat. However, since it affects the characteristics of a display device such as an LCD, a sufficient heat dissipation measure is required.

  Conventionally, heat dissipation measures using electronic heat sinks and fans have been adopted as heat dissipation measures for electronic devices, but portable devices are strongly demanded for miniaturization, so there are space restrictions and sufficient heat dissipation structures There was a problem that it was difficult to take.

In Patent Document 1, as a heat dissipation structure for a portable communication terminal in which it is difficult to install a cooling device, a heat dissipation structure in which a heat dissipation portion extending outside the housing is provided on the surface of an electronic component mounted inside the housing. Has been proposed.
JP 2001-230578 A

  However, in the heat dissipation structure of Patent Document 1, since it is necessary to consider radiant heat, there is a restriction on the component arrangement. Further, since the extending portion extends from the electronic component to the heat radiating portion, there is a limit to downsizing the housing. Furthermore, there is a problem that heat is caused to flow back into the casing due to radiant heat from the extended portion, and heat dissipation efficiency is poor.

  Therefore, an object of the present invention is to provide a portable device that efficiently dissipates heat inside the housing to the outside of the housing.

  In order to solve the above problems, a mobile device according to an aspect of the present invention includes a first housing and a second housing, in which a first housing and a second housing are connected via a movable portion. Is a portable device that can take at least two states, an open state and a closed state, wherein the heat dissipation board is exposed from the first housing, and the first housing and the second housing are provided. When the body is closed, the exposed surface of the heat dissipation board is covered with the second casing.

  According to this aspect, the heat generated in the first housing is transmitted to the heat radiating board and radiated from the exposed surface of the heat radiating board. Since the exposed surface of the heat dissipation board is exposed to the outside of the first housing, heat is not trapped inside the first housing, and the heat is efficiently radiated to the outside of the first housing. be able to.

  Further, when the portable device is closed, the exposed surface of the heat dissipation board is covered with the second casing, so that the human body is not directly touched, for example, the first device with the portable device in the pocket of clothes. There is no worry of causing low-temperature burns even if the circuit elements in the housing are operated.

  ADVANTAGE OF THE INVENTION According to this invention, the portable apparatus which thermally radiates the heat | fever inside a housing | casing to the exterior of a housing | casing can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram showing a configuration of a portable device according to the first embodiment of the present invention. As shown in FIG. 1, the mobile device 10 has a structure in which a first housing 12 and a second housing 14 are connected by a movable portion 20. The first casing 12 and the second casing 14 are rotatable about the movable portion 20 as an axis. The state in which the first housing 12 and the second housing 14 are overlapped is called a closed state of the mobile device 10, and the state in which the first housing 12 and the second housing 14 are not overlapped is called a state in which the mobile device 10 is opened. The portable device 10 may take a closed state and an open state by sliding the first housing 12 and the second housing 14. At this time, the movable unit 20 constitutes a slide mechanism.

  The first housing 12 is provided with a display unit 18 for displaying information such as characters and images, and a speaker unit 24, and a heat dissipation board 16 of a circuit device 30 described later is exposed on the surface of the first housing 12. Provided. The second housing 14 is provided with an operation unit 22 such as operation buttons and a microphone unit 26. The closed state of the first housing 12 and the second housing 14 described above is a state in which the operation unit 22 cannot be operated, and the open state is a state in which the operation unit 22 can be operated. .

  FIG. 2 is a cross-sectional view of a state in which the portable device according to the first embodiment is opened. For convenience, only the first housing 12 is shown in cross section. The display unit 18 and the circuit device 30 are electrically connected via the printed circuit board 28. The display unit may be an LCD and may include a backlight.

  FIG. 3 is a cross-sectional view showing the configuration of the circuit device. The circuit device 30 is integrally formed by forming the circuit unit 40 on the heat dissipation substrate 16. The circuit unit 40 includes a circuit element 32, an insulating layer 38 that covers the circuit element 32, and solder 34. The circuit element 32 includes an active element and a passive element. The insulating layer 38 includes conductive regions that electrically connect the circuit elements 32 and between the circuit elements 32 and the solder 34. The heat dissipation substrate 16 may be a metal member having excellent thermal conductivity, such as copper or aluminum.

  The circuit device 30 is electrically connected to the printed circuit board 28 via solder 34 provided on the opposite surface of the heat dissipation board 16. The circuit unit 40 may be a semiconductor circuit that performs image processing such as encoding and decoding.

  As shown in FIG. 2, the surface of the heat dissipation substrate 16 of the circuit device 30 opposite to the surface on which the circuit unit 40 is formed is exposed to the outside of the first housing 12. A surface exposed to the outside of the first housing 12 is referred to as an exposed surface 36. The exposed surface 36 of the heat dissipation substrate 16 may be subjected to surface polishing so that the boundary with the first housing 12 is not conspicuous. Further, the exposed surface 36 of the heat dissipation substrate 16 may be subjected to a surface treatment such as painting so that the boundary with the first housing 12 is not conspicuous. In addition, as surface treatments, such as coating, the method of providing the coating film of about 2-15 micrometers by spray-coating acrylic resin on the exposed surface 36 of the thermal radiation board | substrate 16, for example is used.

  FIG. 4 is a diagram illustrating the heat dissipation action of the circuit device. In FIG. 4, arrows indicate the heat flow. The heat generated in the circuit element 32 is transmitted to the heat radiating board 16 and radiated from the exposed surface 36 of the heat radiating board 16.

  Since the exposed surface 36 of the heat dissipation board 16 is exposed to the outside of the first housing 12, heat does not accumulate inside the first housing 12, and the first housing 12 can be efficiently processed. Can dissipate heat to the outside. In addition, since the circuit unit 40 and the heat dissipation board 16 are directly connected, the heat dissipation efficiency is better than when the extension portion is provided, and the portable device 10 is effective for downsizing.

  The above heat dissipation action can suppress a temperature rise around the circuit device 30, so that other electronic components can be provided in the vicinity of the circuit device 30 even when the amount of heat generated by the circuit element 32 is large.

  The heat dissipation substrate 16 may be provided in the vicinity of the display unit 18. When the circuit unit 40 is a semiconductor circuit for image processing, the wiring board can be shortened by providing the heat dissipating substrate 16 in the vicinity of the display unit 18, and high-speed and high-definition moving image display is possible.

  The heat dissipation substrate 16 may be provided in the vicinity of the movable portion 20. In this case, even if the portable device 10 is pressed against the face in a call state, there is an effect that a space is generated between the exposed surface 36 and the face because the movable part 20 exists, and the heat is not felt.

  In recent years, mobile terminals are increasingly used in a manner that music and image information can be downloaded to the mobile terminal and enjoyed. In such a case, since the semiconductor circuit generates heat even during downloading, it is desirable to provide a heat radiating portion at a position where it does not touch the human body from the viewpoint of preventing low temperature burns.

  FIG. 5 is a cross-sectional view of the portable device according to the first embodiment in a closed state. For convenience, only the first housing 12 is shown in cross section. When the circuit element 32 is operated with the portable device 10 closed, the heat generated in the circuit element 32 is conducted to the heat dissipation substrate 16 and is radiated to the outside of the first housing 12.

  As shown in FIG. 5, when the portable device 10 is closed, the exposed surface 36 of the heat dissipation board 16 is covered with the second housing 14, so that it does not touch the human body directly. Even if the circuit element 32 is operated while the portable device 10 is inserted, there is no fear of causing low temperature burns.

  FIG. 6 is a cross-sectional view showing a configuration of a modified example of the circuit device. The circuit device 50 is configured integrally by forming a circuit portion 58 on the heat dissipation substrate 54. The circuit unit 58 includes an insulating layer 56, a circuit element 52, and an electrode 60. The circuit element 52 includes an active element and a passive element. The insulating layer 56 includes a conductive region that electrically connects the circuit elements 52 and the circuit elements 52 and the electrodes 60.

  The insulating layer 56 may be made of a material to which a thermally conductive filler is added in order to increase the heat dissipation efficiency of the circuit element 52. The heat dissipation substrate 54 may be a metal member having excellent thermal conductivity such as copper or aluminum. The circuit device 50 is electrically connected to the printed board via the electrode 60.

  In the portable device 10 shown in FIG. 2, even when the circuit device 30 is replaced with the circuit device 50 shown in FIG. 6, the heat generated in the circuit element 52 is conducted from the insulating layer 56 to the heat dissipation substrate 54, and the first It is possible to dissipate heat to the outside of the housing 12.

(Second Embodiment)
FIG. 7 is a diagram showing a configuration of a portable device according to the second embodiment of the present invention. As illustrated in FIG. 7, the mobile device 10 according to the second embodiment includes a first casing 12 having a display unit 18 and a speaker unit 24, a second casing having an operation unit 22 and a microphone unit 26. 14 is a so-called foldable portable device connected by a hinge-type movable unit 20. The first casing 12 and the second casing 14 are rotatable about the movable portion 20 as an axis. The state in which the first housing 12 and the second housing 14 are folded and overlapped via the movable unit 20 is referred to as a closed state of the mobile device 10, and the state in which the mobile device 10 is not overlaid is the It is called open state.

  The hinge-type movable unit 20 includes a protrusion 64 and a hinge support piece 66. The protruding portion 64 has a quadrangular prism shape, and protrudes in a substantially vertical direction with respect to the microphone portion surface 14a from one end of the microphone portion surface 14a on which the operation portion 22 and the microphone portion 26 are provided. The protrusion 64 is provided integrally with the second housing 14. The hinge support piece 66 protrudes from the lower end surface 12a of the first casing in the longitudinal direction of the first casing 12, and is positioned so as to sandwich both side surfaces of the protruding portion 64. The hinge support piece 66 is provided integrally with the first housing 12, and constitutes the movable portion 20 by being rotatably engaged with the protruding portion 64. The thickness of the protrusion 64 in the direction perpendicular to the microphone surface 14a is substantially the same as the thickness of the first housing 12, and the operation of the protrusion 64 when the portable device 10 is closed. The side surface 64a on the part 22 side is covered with the lower end surface 12a of the first housing.

  The protruding portion 64 may be formed such that the side surface 64a of the protruding portion has a predetermined inclination angle with respect to the microphone portion surface 14a. Furthermore, the protruding portion 64 may be formed so that the side surface 64 a of the protruding portion is substantially parallel to the speaker portion surface 12 b of the first housing 12 when the portable device 10 is in an open state. In this case, the lower end surface 12a of the first housing is formed so as to engage with the side surface 64a of the inclined projecting portion, and when the mobile device 10 is closed, the side surface 64a of the projecting portion is the first side surface 64a. The lower end surface 12a of the casing is covered.

  The portable device 10 according to the second embodiment is characterized in that the heat dissipation substrate 16 is exposed from the side surface 64a of the protruding portion on the operation unit 22 side.

  FIG. 8 is a cross-sectional view of a state in which the portable device according to the second embodiment is closed. In FIG. 8, for the sake of convenience, only the second housing 14 is shown in cross section. As shown in FIG. 8, the circuit device 30 is provided inside the protrusion 64. The configuration of the circuit device 30 may be the same as the circuit device shown in FIG. 3 or FIG. The circuit device 30 is electrically connected to the printed circuit board 28 via the flexible cable 62.

  The circuit device 30 is provided such that the surface of the heat dissipation substrate 16 opposite to the surface on which the circuit portion 40 is formed is exposed to the outside from the side surface 64a of the protruding portion. A surface exposed to the outside of the heat dissipation substrate 16 is referred to as an exposed surface 36. The exposed surface 36 may be subjected to a surface treatment as in the first embodiment.

  In the portable device 10 according to the second embodiment, since the heat dissipation substrate 16 is exposed to the outside from the side surface 64a of the protruding portion, heat is not trapped inside the second housing 14 and is efficient. The heat generated in the circuit unit 40 can be radiated. Since the circuit device 30 is provided at a position separated from the printed circuit board 28, the influence on other electronic components mounted on the printed circuit board 28 is reduced even when the amount of heat generated by the circuit device 30 is large. Can do.

  Further, when the portable device 10 is in a closed state, the exposed surface 36 of the heat dissipation board 16 is covered with the lower end surface 12a of the first housing, so that the heat dissipation board 16 does not directly touch the human body and causes low temperature burns. The possibility can be reduced.

(Third embodiment)
FIG. 9 is a cross-sectional view of a portable device according to the third embodiment of the present invention. The portable device 10 shown in FIG. 9 is a foldable portable device as shown in FIG. 7, and FIG. 9 shows a state in which the portable device 10 is closed. In FIG. 9, only the first housing 12 is shown in cross section for convenience.

  As shown in FIG. 9, the portable device 10 according to the third embodiment is shown in FIG. 8 in that the circuit device 30 is provided so that the heat dissipation substrate 16 is exposed from the lower end surface 12 a of the first housing. This is different from the portable device according to the second embodiment.

  In the portable device 10 according to the third embodiment, since the heat dissipation substrate 16 is exposed to the outside from the lower end surface 12a of the first casing, heat does not accumulate inside the first casing 12. The heat generated in the circuit unit 40 can be efficiently radiated. Since the circuit device 30 is provided at a position separated from the printed circuit board 28, even if the amount of heat generated by the circuit device 30 is large, the circuit device 30 is affected on electronic components such as the display unit 18 mounted on the printed circuit board 28. Can be reduced.

  Further, when the portable device 10 is in a closed state, the exposed surface 36 of the heat radiating board 16 is covered with the side surface 64a of the protruding portion, so that the heat radiating board 16 does not directly touch the human body and reduces the possibility of causing low-temperature burns. can do.

(Fourth embodiment)
FIG. 10 is a cross-sectional view of a portable device according to the fourth embodiment of the present invention. In FIG. 10, for the sake of convenience, only the first housing 12 is shown in cross section. As shown in FIG. 10, the portable device 10 according to the fourth embodiment includes a first casing 12 having a display unit 18 and a speaker unit 24, a second casing having an operation unit 22 and a microphone unit 26. 14 is a so-called slide-type portable device connected via a slide-type movable unit (not shown). The first housing 12 and the second housing 14 can slide in directions substantially parallel to each other. The first housing 12 and the second housing 14 overlap each other, and the speaker unit rear surface 12c opposite to the speaker unit surface 12b on which the speaker unit 24 of the first housing 12 is provided is the second housing 14. The state covered with the microphone part surface 14a provided with the microphone part is referred to as a state where the portable device 10 is closed. A state in which the first housing 12 and the second housing 14 do not overlap is referred to as a state in which the mobile device 10 is opened. FIG. 10 shows a state where the mobile device 10 is opened.

  In the mobile device 10 according to the fourth embodiment, the circuit device 30 is provided so that the heat dissipation substrate 16 is exposed from the speaker unit rear surface 12c. The configuration of the circuit device 30 may be the same as the circuit device shown in FIG. 3 or FIG. The circuit device 30 is electrically connected to electronic components such as the display unit 18 via the printed circuit board 28. A surface exposed to the outside of the heat dissipation substrate 16 is referred to as an exposed surface 36. The exposed surface 36 may be subjected to a surface treatment as in the first embodiment.

  The portable device 10 according to the fourth embodiment is efficient because the heat dissipation substrate 16 is exposed to the outside of the first housing 12, so that heat does not accumulate inside the first housing 12. The heat generated in the circuit unit 40 can be dissipated. Since the heat dissipation action can suppress the temperature rise around the circuit device 30, even when the heat generation amount of the circuit device 30 is large, electronic components such as the display unit 18 can be provided in the vicinity of the circuit device 30. It is possible to reduce the size of the portable device 10.

  Further, when the portable device 10 is in a closed state, the exposed surface 36 of the heat dissipation board 16 is covered with the microphone part surface 14a of the second housing 14, so that the heat dissipation board 16 does not directly touch the human body and the low temperature burns. Can reduce the possibility of causing.

  Furthermore, in the portable device 10 according to the fourth embodiment, the heat dissipation board 16 is exposed on the speaker unit back surface 12c opposite to the speaker unit surface 12b on which the speaker unit 24 is provided. There is an effect that it is hard to feel heat even if it is pressed against the face.

(Fifth embodiment)
FIG. 11 is a cross-sectional view of a portable device according to the fifth embodiment of the present invention. In FIG. 11, for the sake of convenience, only the second housing 14 is shown in cross section. The mobile device 10 according to the fifth embodiment is also a slide-type mobile device, similar to the mobile device according to the fourth embodiment shown in FIG. As shown in FIG. 11, the portable device 10 according to the fifth embodiment is characterized in that the circuit device 30 is provided so that the heat dissipation substrate 16 is exposed from the microphone surface 14 a of the second housing 14. This is different from the portable device according to the embodiment.

  In the portable device 10 according to the fifth embodiment, since the heat dissipation substrate 16 is exposed to the outside of the second housing 14, heat is not trapped inside the second housing 14 and is efficient. The heat generated in the circuit unit 40 can be dissipated. This heat dissipation action can suppress the temperature rise around the circuit device 30, so that even when the heat generation amount of the circuit device 30 is large, other electronic components can be provided near the circuit device 30, and This is effective for downsizing the device 10.

  In addition, when the portable device 10 is in the closed state, the exposed surface 36 of the heat dissipation board 16 is covered with the speaker unit back surface 12c of the first housing 12, so that the heat dissipation board 16 does not directly touch the human body and is low in temperature. The possibility of causing burns can be reduced.

  Furthermore, in the portable device 10 according to the fifth embodiment, even if the portable device 10 is pressed against the face in a call state, the thickness of the first housing 12 causes the gap between the exposed surface 36 of the heat dissipation board 16 and the face. There is an effect that space is created and it is difficult to feel the heat.

(Sixth embodiment)
FIG. 12 is a diagram showing a portable device according to the sixth embodiment of the present invention. In FIG. 12, some of the components inside the housing are indicated by broken lines. As shown in FIG. 12, the mobile device 10 according to the sixth embodiment is a stick-type mobile device, and the first housing 12 including the speaker unit 24 and the display unit 18 includes the operation unit 22 and the microphone. The structure is housed in the second housing 14 having the portion 26. The first casing 12 and the second casing 14 are connected to each other via a sliding movable unit (not shown), and the first casing 12 and the second casing 14 are substantially parallel to each other. Can slide into. The state in which the first housing 12 is housed in the second housing 14 is referred to as a state in which the portable device 10 is closed, and the state in which the mobile device 10 is not housed is referred to as an open state. FIG. 12 shows a state where the mobile device 10 is opened.

  As shown in FIG. 12, a circuit device 30 is provided in the first housing 12 of the mobile device 10. The configuration of the circuit device 30 may be the same as the circuit device shown in FIG. 3 or FIG. The display unit 18 and the circuit device 30 are electrically connected via a printed board (not shown).

  The circuit device 30 is provided such that the side surface of the heat dissipation substrate 16 connected to the surface on which the circuit unit 40 is formed is exposed to the outside from the side surface 12d of the first housing 12 connected to the speaker unit surface 12b. . The surface of the heat dissipation substrate 16 exposed to the outside of the first housing 12 is referred to as an exposed surface 36. The exposed surface 36 may be subjected to a surface treatment as in the first embodiment. Although FIG. 12 shows a state in which the heat dissipation substrate 16 is exposed from the side surface 12d on one side of the first housing 12, the heat dissipation substrate 16 may be exposed from the side surfaces on both sides. Further, the heat dissipation substrate 16 may be exposed from the rear surface of the speaker unit of the first housing 12.

  The portable device 10 according to the sixth embodiment is efficient because the heat dissipation substrate 16 is exposed to the outside of the first housing 12 so that heat does not accumulate inside the first housing 12. The heat generated in the circuit unit 40 can be dissipated. This heat dissipation action can suppress the temperature rise around the circuit device 30, so that even when the heat generation amount of the circuit device 30 is large, other electronic components can be provided near the circuit device 30, and This is effective for downsizing the device 10.

  In addition, when the portable device 10 is in the closed state, the exposed surface 36 of the heat dissipation board 16 is covered with the second housing 14, so that the heat dissipation board 16 does not directly touch the human body and may cause low-temperature burns. Can be reduced.

  The present invention has been described based on the embodiments. This embodiment is an exemplification, and various modifications can be made to combinations of the respective constituent elements. Those skilled in the art will appreciate that such modifications are also within the scope of the present invention.

It is a figure which shows the structure of the portable apparatus concerning the 1st Embodiment of this invention. It is sectional drawing of the state which opened the portable apparatus concerning 1st Embodiment. It is sectional drawing which shows the structure of a circuit device. It is a figure which shows the thermal radiation effect | action of a circuit apparatus. It is sectional drawing of the state which closed the portable apparatus concerning 1st Embodiment. It is sectional drawing which shows the structure of the modification of a circuit apparatus. It is a figure which shows the structure of the portable apparatus concerning the 2nd Embodiment of this invention. It is sectional drawing of the state which closed the portable apparatus concerning 2nd Embodiment. It is sectional drawing of the portable apparatus concerning the 3rd Embodiment of this invention. It is sectional drawing of the portable apparatus concerning the 4th Embodiment of this invention. It is sectional drawing of the portable apparatus concerning the 5th Embodiment of this invention. It is a figure which shows the portable apparatus concerning the 6th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Mobile device, 12 1st housing | casing, 14 2nd housing | casing, 16 Heat dissipation board, 18 Display part, 20 Movable part, 22 Operation part, 24 Speaker part, 26 Microphone part, 28 Printed circuit board, 30 Circuit apparatus, 32 circuit element, 34 solder, 36 exposed surface, 38 insulating layer, 40 circuit part, 50 circuit device, 52 circuit element, 54 heat dissipation board, 56 insulating layer, 58 circuit part, 60 electrode, 62 flexible cable, 64 projecting part, 66 Hinge support piece.

Claims (6)

The first casing and the second casing are connected via a movable portion, and the first casing and the second casing are in an open state and a closed state. A portable device capable of
A heat dissipation substrate is exposed from the first housing;
In the state which closed the said 1st housing | casing and the said 2nd housing | casing, the exposed surface of the said heat sink is covered with the said 2nd housing | casing, The portable apparatus characterized by the above-mentioned.   The portable device according to claim 1, wherein the heat dissipation substrate is formed integrally with a circuit element. The first housing includes a display unit,
The portable device according to claim 1, wherein the heat dissipation substrate is provided in the vicinity of the display unit.   The portable device according to claim 1, wherein the heat dissipation substrate is provided in the vicinity of the movable portion.   The movable part is a hinge-type movable part, and takes at least two states of an open state and a closed state by folding the first housing and the second housing. The portable device according to claim 1, wherein the portable device can be used.   The movable part is a slide-type movable part, and the first casing and the second casing slide in a direction substantially parallel to each other, so that at least two of an open state and a closed state are provided. The portable device according to claim 1, wherein the portable device can take two states.

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