JP2006269721A - Thermoelectric module and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric module that can prevent damage due to a difference in thermal expansion and can be easily manufactured, and a manufacturing method thereof.
SOLUTION: A plurality of p-type thermoelectric elements 5p and n-type thermoelectric elements 5n are arranged on a strip-shaped flexible printed circuit board 1 in the longitudinal direction, and the height direction of the p-type thermoelectric element 5n is relative to the width direction of the flexible printed circuit board 1. Are alternately mounted in a row so that they are parallel to each other. Next, a moisture-proof coating 4 is formed so as to cover the p-type thermoelectric element 5p, the n-type thermoelectric element 5n, and the thermoelectric element mounting surface of the flexible printed circuit board 1, and the flexible printed circuit board 1 on which the thermoelectric element is mounted is formed. In addition, a plurality of the heat insulating sheets 6 are bent and bent into a substantially prismatic shape. Then, heat conduction substrates 7 a and 7 b are joined to both ends of the flexible printed circuit board 1 in the width direction to form a thermoelectric module 10.
[Selection] Figure 1

Description

  The present invention relates to a thermoelectric module using the Peltier effect or Seebeck effect and a method for manufacturing the same.

  Thermoelectric modules using the Peltier effect or Seebeck effect operate silently and without vibration, and do not require maintenance. Therefore, they can be applied to various fields such as small refrigerators, temperature regulators inside semiconductor devices, and power generation devices. It is being considered.

  FIG. 4A is a cross-sectional view showing the structure of a conventional thermoelectric module, and FIG. 4B is a perspective view thereof. In FIG. 4 (a), the joining member portion such as solder is omitted, and the following drawings are also the same. In FIG. 4B, the upper substrate is omitted to make the structure inside the module easier to see. Further, regarding the distinction between the p-type and the n-type of each thermoelectric element, reference numerals “P” and “N” are attached to FIG. As shown in FIG. 4A, the conventional thermoelectric module 100 includes a lower electrode 103 and an upper electrode 104 formed on a lower substrate 101 and an upper substrate 102 made of, for example, ceramics. Are arranged such that the lower substrate 101 and the upper substrate 102 are arranged in parallel with each other, and a plurality of thermoelectric elements 105 are arranged therebetween. As shown in FIG. 4B, the p-type thermoelectric elements 105p and the n-type thermoelectric elements 105n are alternately arranged on the lower electrode 103 and the upper electrode 104, and are bonded onto a pair of adjacent lower electrodes 103. By joining the upper parts of adjacent p-type thermoelectric elements 105p and n-type thermoelectric elements 105n to one upper electrode 104 among the thermoelectric elements, a plurality of p-type thermoelectric elements 105p and n-type thermoelectric elements 105n are alternately arranged. Connected in series. Lead wires 106 are joined by solder or the like to the lower electrodes 103 to which the thermoelectric elements at both ends of the series connection body are joined.

  In this conventional thermoelectric module 100, for example, when a current is passed through the p-type thermoelectric element 105p and the n-type thermoelectric element 105n connected by the lower electrode 103 and the upper electrode 104, the current flows from the lower side of the n-type thermoelectric element 105n. It flows to the lower side of the p-type thermoelectric element 105p through the upper electrode 104. On the other hand, the energy moves in the same direction as the current in the p-type thermoelectric element 105p, and in the opposite direction to the current in the n-type thermoelectric element 105n. On the electrode 103 side, energy is released and the temperature rises (heat radiation).

  Further, a lower electrode and an upper electrode are directly formed on the lower and upper ends of the p-type thermoelectric elements and the n-type thermoelectric elements arranged alternately, respectively, and the lower electrode and the lower substrate made of ceramics are made of grease or the like. There are also thermally coupled skeleton type thermoelectric modules.

  Furthermore, conventionally, a thermoelectric module using a resin-made flexible substrate as an upper substrate and / or a lower substrate has also been proposed (see Patent Document 1). FIG. 5 is a perspective view showing the structure of the thermoelectric module described in Patent Document 1. FIG. As shown in FIG. 5, in the thermoelectric module 110 described in Patent Document 1, an alumina plate, an aluminum plate that has been anodized by anodization, or a disc-shaped insulating substrate 111 made of a resin-made flexible substrate is used. A plurality of thin plate-like lower electrodes 113 are arranged by a heat-resistant adhesive, and a pair of p-type thermoelectric elements 115p and n-type thermoelectric elements 115n are joined to each lower electrode 113 by solder. Yes. Further, a thin plate-like upper electrode 114 is joined to the upper ends of the p-type thermoelectric element 115p and the n-type thermoelectric element 115n disposed on the adjacent lower electrode 113 via solder, and this upper electrode A plurality of p-type thermoelectric elements 115 p and n-type thermoelectric elements 115 n are alternately connected in series by 114 and the lower electrode 113. Further, a disc-shaped insulating substrate 112 made of an alumina plate, an anodized aluminum plate or a resin-made flexible substrate is bonded onto the upper electrode 114 with a heat-resistant adhesive.

JP-A-11-307828

  However, the conventional techniques described above have the following problems. Since the conventional thermoelectric module having the structure shown in FIGS. 4A and 4B uses a hard substrate made of ceramics or the like, the stress is caused by a difference in thermal expansion caused by a temperature difference between the heat absorption side and the heat dissipation side. When it is generated and repeatedly used, there is a problem that breakage and peeling of the joint portion occur. Further, since the ceramic substrate is expensive, there is a problem that the manufacturing cost is high.

  Furthermore, although the skeleton-type thermoelectric module is less likely to break and peel than the thermoelectric module having the structure shown in FIGS. 4A and 4B, the upper electrode and the lower electrode are respectively provided at the upper end and the lower end of the thermoelectric element. Since it forms directly, there exists a problem that the number of manufacturing processes increases. In addition, there is a problem that the element is damaged during the electrode formation and the yield is lowered.

  Furthermore, in the thermoelectric module described in Patent Document 1 shown in FIG. 5, when an upper plate and a lower substrate are alumina plates or anodized aluminum plates by anodization, FIGS. Similar to the thermoelectric module shown in b), there is a problem that breakage due to a difference in thermal expansion and peeling of the joint portion occur. This problem can be prevented by using a resin-made flexible substrate, but even in that case, a thin plate-like upper electrode and lower electrode must be bonded to the upper and lower ends of the thermoelectric element, respectively. Like the skeleton type thermoelectric module, there is a problem that the number of manufacturing steps increases and the yield decreases.

  This invention is made | formed in view of this problem, Comprising: It aims at providing the thermoelectric module which can prevent the damage by a thermal expansion difference, and can be manufactured easily, and its manufacturing method.

  The thermoelectric module according to the first invention of the present application includes a plurality of thermoelectric elements, a flexible substrate having an electrode and an external connection terminal for electrically connecting the thermoelectric elements, and one and other ends of the thermoelectric elements. And a first heat conducting substrate and a second heat conducting substrate arranged so as to contact each other.

  In the present invention, since the substrate for mounting the thermoelectric element and the substrate for heat conduction are provided separately, the current supply and heat conduction are separate systems, and can be stabilized against misalignment due to thermal expansion. The reliability can be improved as compared with the conventional thermoelectric module. In addition, since the thermoelectric element mounting substrate is a flexible substrate, the stress generated by the difference in thermal expansion can be relieved, so that the occurrence of breakage due to repeated use can be prevented. Furthermore, since the electrode and the external connection terminal are provided on the flexible substrate, and it is not necessary to directly form the electrode on the thermoelectric element or to join the thin plate-like electrode, the skeleton type and the thermoelectric device described in Patent Document 1 are used. Compared to modules, the manufacturing process can be simplified.

  The first and second heat conduction substrates are, for example, flexible insulating heat conduction sheets. Thereby, the stress which generate | occur | produces by a thermal expansion difference can be relieve | moderated more, and reliability improves further.

  The thermoelectric elements are bonded on the flexible board in a state where adjacent thermoelectric elements are arranged in a row so that the thermoelectric elements are parallel to each other, and the flexible board is connected between the thermoelectric element bonding portions. The region may be bent one or more times, or the flexible substrate may be wound along the arrangement direction of the thermoelectric elements. Thereby, it can be set as a solid module with an electrode.

  Furthermore, you may have the heat insulating material which heat-insulates between the said thermoelectric elements. Thereby, the heat insulation characteristic between elements can be equalized at the time of bending or winding.

  Furthermore, a notch can be provided in a region between the thermoelectric element joints of the flexible substrate. Thereby, the stress which generate | occur | produces by a thermal expansion difference can be relieve | moderated more, and reliability improves further.

  Furthermore, a moisture-proof film may be formed on the flexible substrate so as to cover the thermoelectric element. Thereby, high reliability is obtained.

  In the method for manufacturing a thermoelectric module according to the second invention of the present application, a plurality of thermoelectric elements are arranged in a line on a flexible substrate having electrodes and external connection terminals so that adjacent thermoelectric elements are parallel to each other. A step of bonding the electrode and the thermoelectric element, a step of bending the flexible substrate one or more times in a region between the thermoelectric element joints, and a first contact with one end of the thermoelectric element. And a step of disposing a second heat conducting substrate so as to be in contact with the other end of the thermoelectric element.

  In the present invention, since a plurality of thermoelectric elements are arranged in a row on a flexible substrate, high-speed mounting can be performed by a mounting machine. In addition, since the substrate for mounting the thermoelectric element and the substrate for heat conduction are separated, and the substrate for mounting the thermoelectric element is a flexible substrate, the stress generated by the difference in thermal expansion can be relieved, and the reliability A high thermoelectric module can be manufactured. Furthermore, since the electrode and the external connection terminal are provided on the flexible substrate, and it is not necessary to form the electrode directly on the thermoelectric element or to join the thin plate electrode, the number of manufacturing steps is small. Furthermore, since the size of the module can be adjusted according to the number of times of folding or the location of the folding, it can be applied to various thermoelectric modules. As a result, a highly reliable thermoelectric module can be easily manufactured.

  In the method of manufacturing a thermoelectric module according to the third invention of the present application, a plurality of thermoelectric elements are arranged in a line on a flexible substrate having electrodes and external connection terminals so that adjacent thermoelectric elements are parallel to each other. A step of bonding the electrode and the thermoelectric element, a step of winding the flexible substrate along an arrangement direction of the thermoelectric element, and a first heat so as to contact one end of the thermoelectric element Disposing a conductive substrate and disposing a second heat conductive substrate in contact with the other end of the thermoelectric element.

  In the present invention, since a plurality of thermoelectric elements are arranged in a row on a flexible substrate, high-speed mounting by a mounting machine is possible. In addition, since the substrate for mounting the thermoelectric element is different from the substrate for heat conduction, and the substrate for mounting the thermoelectric element is a flexible substrate, the stress generated by the difference in thermal expansion can be relieved, and the thermoelectric element with high reliability can be relaxed. A module is obtained. Further, since the electrodes and the external connection terminals are provided on the flexible substrate, the number of steps can be reduced as compared with the conventional thermoelectric module. Furthermore, since the size of the module can be adjusted by changing the number of windings, it can be applied to various thermoelectric modules.

  According to the present invention, since the thermoelectric element mounting substrate and the heat conducting substrate are separated, and the thermoelectric element mounting substrate is a flexible substrate, the stress generated by the difference in thermal expansion can be relieved, and the thermoelectric element can be relaxed. The reliability of the module can be improved. Further, since the electrode and the external connection terminal are provided on the flexible substrate, it can be easily modularized.

  Hereinafter, a thermoelectric module according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings. Fig.1 (a) is a side view which shows the structure of the thermoelectric module of this embodiment, (b) is sectional drawing by the AA line shown to (a). As shown in FIGS. 1A and 1B, a thermoelectric module 10 according to this embodiment includes a plurality of p-type thermoelectric elements 5p and n-type on a strip-shaped flexible printed circuit board 1 along its longitudinal direction. The thermoelectric elements 5n are alternately mounted in a line, and the p-type thermoelectric elements 5p, the n-type thermoelectric elements 5n, and the thermoelectric element mounting surface of the flexible printed circuit board 1 are covered with silicon rubber or the like. A moisture-proof coating 4 is formed. Then, the flexible printed circuit board 1 on which the plurality of thermoelectric elements are mounted is bent substantially one or more times in a region between the thermoelectric element joint portions with the heat insulating sheet 6 interposed therebetween, and has a substantially prismatic shape. Furthermore, heat conduction substrates 7a and 7b made of a flexible insulating heat conductive sheet are respectively provided at both ends in the height direction of the thermoelectric module 10 having a substantially prismatic shape, that is, both ends in the width direction of the flexible printed circuit board 1. It is joined.

  The flexible printed circuit board 1 in the thermoelectric module 10 of this embodiment is a thermoelectric module mounting board, and is made of a conductive material such as copper on one surface of a flexible resin tape 2 made of an insulating resin such as polyimide. Conductor layers 3 a and 3 b are formed along the edges in the width direction of the resin tape 2. Also, plating layers 8a and 8b made of Ni alloy, Sn, Sn alloy, or the like are formed on the upper end and lower end of the p-type thermoelectric element 5p and the n-type thermoelectric element 5n, respectively. The n-type thermoelectric elements 5n are arranged so that their height directions are parallel to the width direction of the flexible printed circuit board 1, and the plating layers 8a and 8b are joined to the conductor layers 3a and 3b by solder, respectively. .

  Further, at least the conductive layer 3a or the conductive layer 3b at the end in the width direction of the flexible printed circuit board 1 is formed in a region between the p-type thermoelectric element 5p and the n-type thermoelectric element 5n. Cutout portions extending in the width direction along the longitudinal direction of the substrate 1 are alternately provided. Specifically, one n-type thermoelectric element 5n and another n-type thermoelectric element n are arranged on both sides of one p-type thermoelectric element 5p, and one p-type thermoelectric element 5p and one n-type thermoelectric element are arranged. When a notch is formed from one end to the other end in the region between the elements 5n, there is a gap between one p-type thermoelectric element 5p and another n-type thermoelectric element 5n. A notch is formed from the other end toward the one end. As a result, the conductor layer 3a on the upper end side of each thermoelectric element becomes the upper electrode and the lower end type conductor layer 3b becomes the lower electrode. By these conductor layers 3a and 3b, a plurality of p-type thermoelectric elements 5p and N-type thermoelectric elements 5n are alternately connected in series. The conductor layers 3a and 3b to which the thermoelectric elements at both ends of the series connection body are joined serve as power supply terminals, and the lead wires are joined by solder or the like.

  Furthermore, the heat conducting substrates 7a and 7b are formed with grooves into which the end portions of the flexible printed circuit board 1 are inserted on the surfaces, respectively, and the plating layers 8a and p of the p-type thermoelectric element 5p and the n-type thermoelectric element 5n It arrange | positions so that 8b may be contacted. The heat conductive substrates 7a and 7b are sponge-like, and the end portions of the flexible printed circuit board 1 are pushed into the heat conductive substrates 7a and 7b, whereby the heat conductive substrates 7a and 7b and the p-type thermoelectric elements 5p and n When the plating layers 8a and 8b of the mold thermoelectric element 5n can be brought into contact with each other, the grooves may not be formed on the surfaces of the heat conducting substrates 7a and 7b.

  In this thermoelectric module 10, for example, when a current is passed through the p-type thermoelectric element 5p and the n-type thermoelectric element 5n connected by the conductor layers 3a and 3b, the current flows from the lower side of the p-type thermoelectric element 5p to the conductor layer. It flows to the lower side of the n-type thermoelectric element 5n through 3a. On the other hand, the energy moves in the same direction as the current in the p-type thermoelectric element 5p and in the opposite direction to the current in the n-type thermoelectric element 5n, so that the energy is released and the temperature rises (heat radiation) on the heat conduction substrate 7a side. On the heat conduction substrate 7b side, the energy is insufficient and the temperature drops (heat absorption).

  In the thermoelectric module 10 of this embodiment, since the strip-shaped flexible printed circuit board 1 is used as the thermoelectric element mounting substrate, a standard chip-shaped thermoelectric element can be mounted at high speed by a mounting machine. Further, since the size of the module can be easily adjusted by changing the place where the flexible printed circuit board 1 after the thermoelectric element is mounted, the module can be applied to various modules. Furthermore, since the moisture-proof coating 4 is formed so as to cover each thermoelectric element after mounting the thermoelectric element on the flexible printed circuit board 1, the reliability of each thermoelectric element can be improved. Furthermore, since both the thermoelectric element mounting substrate and the heat conducting substrate are flexible substrates, the stress caused by the difference in thermal expansion during operation can be absorbed by these substrates and the occurrence of breakage can be prevented. Thereby, reliability can be improved rather than the conventional thermoelectric module which uses a ceramic substrate. Furthermore, this thermoelectric module can be easily manufactured because it is not necessary to form an electrode directly on the thermoelectric element or to join a thin plate-like electrode, and to suppress the occurrence of defects in the manufacturing process. be able to.

  Next, the manufacturing method of the thermoelectric module of this embodiment is demonstrated. 2A to 2D are views showing the method of manufacturing the thermoelectric module of the present embodiment in the order of steps, FIGS. 2A to 2C are plan views, and FIG. It is sectional drawing equivalent to sectional drawing by the AA line shown to 1 (a). In FIGS. 2 (b) and 2 (c), the moisture-proof coating is omitted for the sake of clarity. First, as shown in FIG. 2A, conductor layers 3a and 3b made of a conductive material such as copper are formed on one surface of a resin tape 2 made of an insulating resin such as polyimide. A flexible printed circuit board 1 formed along an edge in the direction is prepared.

  Next, as shown in FIG. 2B, a plurality of p-type thermoelectric elements 5 p and n-type thermoelectric elements 5 n are placed on the flexible printed circuit board 1 while being spaced apart along the longitudinal direction of the flexible printed circuit board 1. The thermoelectric elements are mounted on the flexible printed circuit board 1 via solder, alternately arranged in a line. Specifically, the solder layers are formed on the conductor layers 3a and 3b, and the plated layers 8a and 8b made of Ni alloy, Sn, Sn alloy or the like formed on the upper and lower ends of each thermoelectric element are respectively conductor layers. After arranging each thermoelectric element so that the height direction of each thermoelectric element and the width direction of the resin tape are parallel to each other so as to be arranged on 3a and 3b, the plating layers 8a and 8b are reflowed. Are joined to the conductor layers 3a and 3b, respectively. A thickness of, for example, 10 to 100 μm is applied to the surface of the flexible printed circuit board 1 on which the thermoelectric element is mounted by applying or spraying a moisture-proof material made of, for example, silicon rubber or the like, and performing a drying treatment as necessary. About, the moisture-proof film which covers the p-type thermoelectric element 5p, the n-type thermoelectric element 5n, and the thermoelectric element mounting surface of the flexible printed circuit board 1 is formed.

  Next, as shown in FIG. 2 (c), for example, by a punching press or the like, a region where the p-type thermoelectric element 5p is mounted on the flexible printed circuit board 1 and a region where the n-type thermoelectric element 5n is mounted. U-shaped notches extending in the width direction from the edge of the flexible printed circuit board 1 are alternately formed in the area between them along the longitudinal direction of the flexible printed circuit board 1. By forming such a notch, the conductor layers 3a and 3b are divided, and the plurality of p-type thermoelectric elements 5p and n-type thermoelectric elements 5n are divided into the plurality of conductor layers 3a and 3b. In addition to being able to connect in series alternately, thermal stress is more easily escaped when the module is operated.

  Next, the flexible printed circuit board 1 is cut and separated for each predetermined number of thermoelectric elements. And as shown in FIG.2 (d), in order to ensure the curvature radius of the grade which does not damage the flexible printed circuit board 1, especially the conductor layers 3a and 3b, a thermoelectric element is mounted in between. The formed flexible printed circuit board 1 is bent into a substantially prismatic shape. Thereafter, the heat conductive substrates 7a and 7b made of a flexible insulating heat conductive sheet are disposed at both ends in the width direction of the flexible printed circuit board 1, respectively, and the end of the flexible printed circuit board 1 is inserted into a groove formed on the surface thereof. Then, the plating layers 8a and 8b are brought into contact with the heat conducting substrates 7a and 7b, respectively. Then, the heat conductive substrates 7a and 7b and the plating layers 8a and 8b are joined together with a heat conductive adhesive such as an epoxy resin containing a metal filler, for example, and the thermoelectric module shown in FIGS. 10 is assumed. Note that the heat conduction substrates 7a and 7b may be fixed by sandwiching the heat conduction substrates 7a and 7b and the plating layers 8a and 8b with a rigid plate material such as a copper plate.

  In the thermoelectric module 10 of the present embodiment, the flexible printed circuit board 1 on which the thermoelectric element is mounted is bent into a substantially prismatic shape, but the present invention is not limited to this, and various shapes can be used. it can. Next, a thermoelectric module according to a modification of the present embodiment will be described. FIG. 3 is a cross-sectional view showing the structure of the thermoelectric module of this modification, and corresponds to a cross-sectional view taken along line AA shown in FIG. In FIG. 3, the same components as those of the thermoelectric module 10 shown in FIGS. 1A and 1B are denoted by the same reference numerals, and detailed description thereof is omitted. As shown in FIG. 3, the thermoelectric module 20 of the present modification is obtained by winding the flexible printed circuit board 1 on which the thermoelectric element is mounted in a spiral shape together with the heat insulating sheet 16 into a cylindrical shape. As in the thermoelectric module 10 shown in FIGS. 1 (a) and 1 (b), the heat conducting substrate made of a flexible insulating heat conducting sheet is provided at both ends of the flexible printed circuit board 1 in the width direction. (Not shown) are joined. Thereby, since the stress with respect to the flexible printed circuit board 1 is equalize | homogenized, reliability improves further. The other configurations and effects of the thermoelectric module 20 of the present modification are the same as those of the thermoelectric module 10 of the above-described embodiment.

  In the thermoelectric module of the above-described embodiment and its modification, the conductor layers 3a and 3b are divided into a plurality of parts by providing a notch, but the present invention is not limited to this, and resin A plurality of conductor layers may be locally formed along the edge in the width direction of the tape 2.

(A) is a side view which shows the structure of the thermoelectric module of embodiment of this invention, (b) is sectional drawing by the AA line shown to (a). (A) thru | or (d) is a figure which shows the manufacturing method of the thermoelectric module of embodiment of this invention in the order of the process, (a) thru | or (c) is a top view, (d) is FIG. It is sectional drawing equivalent to sectional drawing by the AA line shown in FIG. It is sectional drawing which shows the structure of the thermoelectric module of the modification of embodiment of this invention, and is equivalent to sectional drawing by the AA line shown to (a). (A) is sectional drawing which shows the structure of the conventional thermoelectric module, (b) is the perspective view. It is a perspective view which shows the structure of the conventional thermoelectric module described in patent document 1. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1; Flexible printed circuit board 2; Resin sheet 3a, 3b; Conductor layer 4; Dampproof film 5n, 105n, 115n; n-type thermoelectric element 5p, 105p, 115p; p-type thermoelectric element 6, 16; Thermal insulation sheet 7a, 7b Substrate for thermal conduction 8a, 8b; plating layer 10, 20, 100, 110; thermoelectric module 101, 111; lower substrate 102, 112; upper substrate 103, 113; lower electrode 104, 114; upper electrode 106;

Claims (9)

A plurality of thermoelectric elements, a flexible substrate having an electrode and an external connection terminal for electrically connecting the thermoelectric elements, and a first electrode disposed so as to contact one end and the other end of the thermoelectric element, respectively. And a second heat conduction substrate. The thermoelectric module according to claim 1, wherein the first and second heat conducting substrates are flexible insulating heat conducting sheets. The thermoelectric elements are bonded on the flexible substrate in a state where adjacent thermoelectric elements are arranged in parallel so that the thermoelectric elements are parallel to each other, and the flexible substrate is an area between the thermoelectric element junctions. The thermoelectric module according to claim 1, wherein the thermoelectric module is bent one or more times. The thermoelectric elements are bonded onto the flexible substrate in a state where adjacent thermoelectric elements are arranged in parallel so that the thermoelectric elements are parallel to each other, and the flexible substrate extends along the arrangement direction of the thermoelectric elements. The thermoelectric module according to claim 1 or 2, wherein the thermoelectric module is wound. The thermoelectric module according to claim 3, further comprising a heat insulating material that insulates between the thermoelectric elements. The thermoelectric module according to claim 3, wherein a notch portion is provided in a region between the thermoelectric element joint portions of the flexible substrate. The thermoelectric module according to claim 1, further comprising a moisture-proof coating formed on the flexible substrate so as to cover the thermoelectric element. Arranging a plurality of thermoelectric elements in a row on a flexible substrate having electrodes and external connection terminals so that adjacent thermoelectric elements are parallel to each other, and bonding the electrodes and the thermoelectric elements; A step of bending the flexible substrate one or more times in the region between the thermoelectric element joints, and arranging a first heat conducting substrate so as to contact one end of the thermoelectric element, and And a step of disposing a second heat conducting substrate so as to contact the other end. A method for manufacturing a thermoelectric module, comprising: Arranging a plurality of thermoelectric elements in a row on a flexible substrate having electrodes and external connection terminals so that adjacent thermoelectric elements are parallel to each other, and bonding the electrodes and the thermoelectric elements; A step of winding the flexible substrate along the arrangement direction of the thermoelectric elements, and arranging a first heat conduction substrate so as to be in contact with one end of the thermoelectric elements and the other of the thermoelectric elements Disposing a second heat conducting substrate so as to be in contact with the end portion, and a method for producing a thermoelectric module.

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