JP2006261684A - Electronic component storage container - Google Patents

Abstract

In an electronic component storage container composed of an insulating base and a metal lid, a problem of reliability of hermetic sealing has been induced.
An insulating base for mounting an electronic component on an upper surface, and a glass sealing material having a softening and melting temperature of 350 ° C. or lower are bonded to the upper surface of the insulating base and bonded to the insulating base. An electronic component storage container including a metal lid 2 that hermetically accommodates an electronic component 3 in a space between the metal lid 2 and the glass sealing material 6, one or more of titanium, zirconium, and hafnium An active metal brazing material layer 7 containing is formed.
[Selection] Figure 1

Description

  The present invention relates to an electronic component storage container for hermetically sealing and storing electronic components such as semiconductor elements and piezoelectric vibrators, and more particularly to an electronic component storage container for sealing using glass as a sealing material. .

  2. Description of the Related Art Conventionally, an electronic component storage container for storing electronic components such as a semiconductor element including a semiconductor integrated circuit element or a piezoelectric vibrator such as a quartz crystal resonator or a surface acoustic wave element is, for example, an aluminum oxide sintered body. An insulation having a plurality of metallized wiring layers made of an electrically insulating material and made of a refractory metal such as tungsten or molybdenum led from the periphery to the bottom surface of the mounting portion for mounting an electronic component at a substantially central portion of the top surface. It is comprised from the base | substrate and the cover body which has a recessed part for accommodating an electronic component in the approximate center part of the surface facing it.

  When the electronic component is, for example, a piezoelectric vibrator, one end of the piezoelectric vibrator is bonded and fixed to the mounting portion of the insulating base via a conductive resin made of a conductive epoxy resin or the like, and each electrode of the piezoelectric vibrator is attached. After electrically connecting to the metallized wiring layer, a lid is bonded to the upper surface of the insulating base via a sealing material made of low-melting glass, and a piezoelectric vibrator is placed inside the container consisting of the insulating base and the lid. It becomes an electronic device as a final product by accommodating it in an airtight manner.

  In addition, as a sealing material which joins a cover body to an insulation base, lead oxide 56-66 mass%, boron oxide 4-14 mass%, silicon oxide 1-6 mass%, zinc oxide 0.5-3 mass%, and oxidation, for example Lead glass in which 10 to 20% by mass of a cordierite compound is added as a filler to a glass component containing 0.5 to 5% by mass of bismuth is used.

  However, in this conventional electronic component storage container, ceramics such as an aluminum oxide sintered body that forms an insulating base and a lid, and the insulating base and the lid are joined, and the electronic component is hermetically sealed inside. Any glass sealing material is easy to transmit electromagnetic waves, so when mounted together with other electronic components on an external electric circuit board, etc., there is a problem that mutual interference of electromagnetic waves occurs between adjacent electronic components, causing malfunction of the electronic components Had a point.

  In addition, when the lid is made of a metal material that is difficult to transmit electromagnetic waves, the lead-based glass sealant that hermetically seals the electronic components inside has a large dielectric constant of 12 or more. Has a large electrostatic capacity, and has a problem of impairing the characteristics of the electronic component.

  Furthermore, in this conventional container for storing electronic components, the softening and melting temperature of the glass sealing material for bonding the lid to the insulating base is as high as about 400 ° C. Since heat resistance has decreased with higher integration, etc., the insulating base and the lid are joined via a sealing material, and the electronic components are hermetically sealed inside the insulating container consisting of the insulating base and the lid. When housed, the heat that melts the sealing material acts on the electronic components housed therein, causing deterioration in the characteristics of the electronic components, and the electronic device cannot be operated normally. .

  In recent years, with the growing global environmental protection movement, lead oxide has been designated as an environmentally hazardous substance. For example, when an electronic device containing lead oxide is disposed of outdoors and left exposed to wind and rain, Therefore, there is a demand for the development of a sealing material that does not use lead oxide, which can dissolve and contaminate the environment and is harmful to the human body.

  In order to solve such problems, low melting point glass containing silver phosphate glass or tin phosphate glass and containing no lead oxide as a main component has been studied.

  In addition, with the recent popularization of portable electronic devices, the demand for smaller and thinner electronic component storage containers is increasing day by day, and electronic component storage containers that are sealed using glass are also becoming smaller.・ Insulating base with a recess for mounting electronic components on the upper surface for the purpose of reducing the thickness and bonded to the upper surface of the insulating base, and the electronic components are hermetically accommodated in a space between the insulating base and the glass sealing material. An electronic component storage container has been devised that includes a lid made of a flat metal material.

  However, in this electronic component storage container, it is possible to reduce the thickness of the electronic component storage container while maintaining the bending strength of the electronic component storage container by reducing the thickness of the lid. As the sealing width decreases, the stress per unit area applied to the sealing portion increases, and the bonding strength between the lid made of a flat metal material and the glass sealing material is insufficient. The problem of reliability of the hermetic seal such as the hermetic seal is broken is induced.

  The present invention has been devised in view of the above problems, and its purpose is to effectively prevent electromagnetic waves from acting on the electronic components to be collected inside the container, and to seal the electronic components inside the container in an airtight manner. An object of the present invention is to provide an electronic component storage container capable of operating electronic components normally and stably over a long period of time without causing deterioration of the characteristics thereof.

  An electronic component storage container according to the present invention is bonded to an insulating base for mounting an electronic component on an upper surface, and a glass sealing material having a softening and melting temperature of 350 ° C. or lower to the upper surface of the insulating base. Between the metal lid and the glass sealing material, one or more of titanium, zirconium, and hafnium between the metal lid and the glass sealing material. An active metal brazing material layer containing is formed.

  The electronic component storage container of the present invention is preferably characterized in that an active metal oxide layer is formed between the glass sealing material and the active metal brazing material layer.

  According to the electronic component storage container of the present invention, the active metal brazing material layer containing one or more of titanium, zirconium, and hafnium is formed between the metal lid and the glass sealing material. A dense oxide layer of the active metal is formed on the joint surface between the material layer and the glass sealing material, and the active metal brazing material layer and the glass sealing material are firmly bonded, and the shear strength per unit area is high. As a result, it becomes possible to firmly bond the metal lid and the glass sealing material via the active metal brazing material layer, and to achieve a small and thin electronic component storage container with extremely high hermetic reliability. be able to.

  Further, according to the electronic component storage container of the present invention, since the lid of the container is made of metal, external noise due to electromagnetic waves can be effectively prevented from entering the container through the lid, and as a result Thus, mutual interference of electromagnetic waves between adjacent electronic components is difficult to occur, and the electronic components inside the container can be operated normally and stably over a long period of time.

  Next, the electronic component storage container of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage container according to the present invention. In this figure, the electronic component is a piezoelectric vibrator such as a crystal resonator, and the electronic component storage container is a piezoelectric. An example in the case of a vibrator housing container is shown. In FIG. 1, reference numeral 1 denotes an insulating base, and 2 denotes a metal lid, and a container 4 for housing the piezoelectric vibrator 3 is mainly constituted by the insulating base 1 and the metal lid 2.

  The insulating base 1 has a substantially rectangular shape with a concave portion 1a on the top surface, and a mounting portion for mounting the piezoelectric vibrator 3 is provided on the bottom surface of the concave portion 1a. The adhesive resin J is used for adhesive fixing.

  The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a silicon carbide sintered body. In the case of a sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. Slurry is formed into a sheet by using a conventionally known sheet forming method such as a doctor blade method or a calender roll method to obtain a ceramic green sheet (ceramic green sheet), and thereafter, appropriate punching processing is performed on the ceramic green sheet. It is manufactured by laminating a plurality of sheets and firing them at a high temperature of about 1600 ° C.

  A plurality of metallized wiring layers 5 are deposited on the insulating substrate 1 from the vicinity of the mounting portion of the recess 1a to the lower surface. Each electrode of the piezoelectric vibrator 3 is electrically connected to a portion located in the vicinity of the mounting portion of the metallized wiring layer 5 via a conductive resin J made of a conductive epoxy resin or the like, and the insulating substrate 1 A wiring conductor (not shown) of an external electric circuit is attached to a portion led out on the lower surface of the wire through a brazing material such as solder.

  The metallized wiring layer 5 is made of a metal paste obtained by adding an appropriate organic solvent / solvent / plasticizer to a high melting point metal powder such as tungsten / molybdenum / manganese. Is applied in advance to a ceramic green sheet to be the insulating substrate 1 and fired at the same time as the ceramic green sheet to form a predetermined pattern from the upper surface to the lower surface of the insulating substrate 1. Further, when the metallized wiring layer 5 is coated with a metal having good conductivity, corrosion resistance, and good wettability with a brazing material such as nickel and gold on the exposed surface to a thickness of 1 to 20 μm by plating, The oxidative corrosion of the metallized wiring layer 5 can be effectively prevented, and the connection between the metallized wiring layer 5 and the piezoelectric vibrator 3 by the conductive resin J and the brazing between the metallized wiring layer 5 and the external electrode are extremely strengthened. be able to.

  The conductive resin J is made of, for example, a conductive epoxy resin, and the piezoelectric vibrator 3 is placed on the mounting portion of the insulating base 1 via the conductive resin J. Thereafter, the conductive resin J is thermally cured. By performing the treatment and thermosetting, the piezoelectric vibrator 3 is bonded and fixed to the insulating substrate 1.

  Further, a metal lid 2 is bonded to the upper surface of the insulating base 1 via a glass sealing material 6, whereby the piezoelectric vibrator 3 is hermetically sealed inside the container 4 composed of the insulating base 1 and the metal lid 2. Be contained.

  The metal lid 2 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and a conventionally well-known metal such as a rolling method or a punching method on an ingot such as an iron-nickel-cobalt alloy. It is formed into a predetermined shape by applying a processing method.

  The metal lid 2 has an active metal brazing material layer 7 containing at least one of titanium, zirconium, and hafnium formed on at least a joint surface with the glass sealing material 6. The stopper 6 is firmly bonded via the active metal oxide layer of the active metal brazing material layer 7. This is important in the present invention.

  According to the electronic component storage container of the present invention, the metal lid 2 has the active metal brazing material layer 7 containing one or more of titanium, zirconium, and hafnium formed on the joint surface with the glass sealing material 6. A dense oxide layer of active metal is formed on the bonding surface between the active metal brazing material layer 7 and the glass sealing material 6, and the active metal brazing material layer 7 and the glass sealing material 6 are firmly bonded to each other. Both the shear strength per area becomes large, and as a result, the metal lid 2 and the glass sealing material 6 can be firmly bonded through the active metal brazing material layer 7, and the airtight reliability is extremely high. It can be a small and thin electronic component storage container.

  The formation of the active metal brazing material layer 7 on the metal lid 2 is performed by the method described below. First, a paste-like brazing material containing one or more active metals of titanium, zirconium, and hafnium is bonded to the glass sealing material 6 of the metal lid 2 by a screen printing method, a calendar roll method, or the like. Print and apply to thickness. Next, after drying the paste-like brazing material containing the active metal applied by printing, the active metal brazing material having a layer thickness of about 55 μm is heated at a temperature of about 800 ° C. for 60 minutes in a heat treatment furnace in a reducing atmosphere. Layer 7 is formed. At that time, an active metal hydride layer having a thickness of about 3 μm is formed on the surface of the active metal brazing material layer 7.

  In addition, the glass sealing material 6 is deposited on the metal lid 2 on the active metal hydride layer of the active metal brazing material layer 7 deposited on the metal lid 2 with silver-phosphoric acid-based glass and organic. A paste-like glass material prepared with a resin binder is printed and applied in the same way as the brazing material by screen printing or calender roll method, and heated for about 10 minutes at a temperature of about 350 ° C in a heat treatment furnace in an oxidizing atmosphere. Is formed. At this time, the active metal hydride layer and the glass component react to form a dense oxide layer of the active metal between the active metal brazing material layer 7 and the glass sealing material 6. The brazing material layer 7 and the glass sealing material 6 can be firmly bonded.

  Such a bonding sealing between the insulating base 1 and the metal lid 2 is performed by the active metal brazing material in which the glass sealing material 6 is formed on at least the bonding surface of the metal lid 2 with the glass sealing material 6 as described above. A bonding area between the layer 7 and the insulating substrate 1 is previously applied by adopting a conventionally known screen printing method or the like, and this is fired at the softening melting temperature and oxidizing atmosphere of the glass sealing material 6 to insulate the insulating substrate 1. Then, the piezoelectric vibrator 3 is bonded and fixed to the mounting portion of the insulating base 1 via the conductive resin J, and the metal is attached to the joint surface of the insulating base 1. The lid 2 is placed so that the joint surfaces thereof are overlapped, and then fired at the softening and melting temperature of the glass sealing material 6, so that the metal lid 2 is self-weighted.

  In the electronic component storage container of the present invention, the glass sealing material 6 for joining the insulating base 1 and the metal lid 2 is composed of 30 to 40% by mass of phosphorus pentoxide, 37 to 50% by mass of tin monoxide, 16-45 mass by external addition of cordierite compound as filler to glass component containing 5-15 mass% sodium oxide, 1-6 mass% zinc oxide, 1-4 mass% aluminum oxide and 1-3 mass% silicon oxide %, The glass softening point can be lowered to 350 ° C. or lower, and the insulating base 1 and the metal lid 2 are joined together through the glass sealing material 6, so that the insulating base 1 and the metal are bonded. When the piezoelectric vibrator 3 is hermetically accommodated in the container 4 including the lid 2, the characteristics of the piezoelectric vibrator 3 are maintained even when heat for melting the glass sealing material 6 acts on the piezoelectric vibrator 3 accommodated therein. As a result, the piezoelectric vibrator 3 is not deteriorated. Normal over the period, and it is possible to stably operate.

  In addition, the glass component of the glass sealing material 6 has a tendency that it becomes difficult to hermetically seal the container 4 at a low temperature when the amount of phosphorus pentoxide is less than 30% by mass, because the softening and melting temperature of the glass becomes high. On the other hand, when it exceeds 40% by mass, the chemical resistance of the glass tends to be lowered, and the reliability of hermetic sealing of the container 4 tends to be greatly lowered. Accordingly, the phosphorus pentoxide is preferably in the range of 30 to 40% by mass.

  Further, if the amount of tin monoxide is less than 37% by mass, the softening and melting temperature of the glass tends to be high, and it tends to be difficult to hermetically seal the container 4 at a low temperature, whereas it exceeds 50% by mass. And the chemical resistance of the glass sealing material 6 falls, and there exists a tendency for the reliability of the airtight sealing of the container 4 to fall significantly. Therefore, it is preferable that tin monoxide is in the range of 37 to 50% by mass.

  Further, if the amount of sodium oxide is less than 5% by mass, the softening and melting temperature of the glass tends to be high, and hermetic sealing of the container 4 at a low temperature tends to be difficult. There is a tendency that the chemical resistance of the glass is lowered, and the reliability of the hermetic sealing of the container 4 is greatly lowered. Accordingly, sodium oxide is preferably in the range of 5 to 15% by weight.

  Further, if the zinc oxide is less than 1% by mass, the chemical resistance of the glass tends to be lowered, and the reliability of hermetic sealing of the container 4 tends to be greatly reduced. Crystallization advances and hermetic sealing of the container 4 at a low temperature tends to be difficult. Therefore, the amount of zinc oxide is preferably in the range of 1 to 6% by mass.

  On the other hand, if the amount of aluminum oxide is less than 1% by mass, the moisture resistance of the glass decreases, and the reliability of hermetic sealing of the container 4 via the glass sealing material 6 tends to decrease. If it exceeds mass%, the softening and melting temperature of the glass tends to be high, and hermetic sealing of the container 4 at a low temperature tends to be difficult. Accordingly, the aluminum oxide is preferably in the range of 1 to 4% by mass.

  Further, if the amount of silicon oxide is less than 1% by mass, the thermal expansion coefficient of the glass sealing material 6 is increased, which is significantly different from the thermal expansion coefficients of the insulating base 1 and the lid 2, and the container 4 is hermetically sealed. The reliability of stopping tends to be greatly reduced. On the other hand, when it exceeds 3 mass%, the softening and melting temperature of the glass tends to be high, and hermetic sealing of the container 4 at a low temperature tends to be difficult. Accordingly, silicon oxide is preferably in the range of 1 to 3% by mass.

  Further, if the amount of the cordierite compound is less than 16% by mass, the strength of the glass sealing material 6 tends to be lowered, and the reliability of hermetic sealing of the container 4 tends to be greatly reduced. When it exceeds, the fluidity | liquidity in the low temperature of the glass sealing material 6 will fall, and there exists a tendency for the reliability of the airtight sealing of the container 4 to fall. Therefore, the cordierite compound is preferably in the range of 16 to 45% by mass.

  In addition, since the glass sealing material 6 consists of a glass component and a filler and is excellent in moisture resistance, even if moisture contained in the atmosphere attempts to enter the inside of the container 4 through the glass sealing material 6 As a result, the surface electrode of the piezoelectric vibrator 3 accommodated in the container 4 is hardly oxidized and corroded, and the piezoelectric vibrator 3 can be operated normally.

  Moreover, in this invention, since the glass sealing material 6 does not contain lead oxide, it does not give load to global environment.

  Furthermore, according to the electronic component storage container of the present invention, since the insulating base 1 and the metal lid 2 are joined together by the glass sealing material 6, the piezoelectric vibrator 3 confiscated inside transmits the electromagnetic waves. As a result, external noise due to electromagnetic waves can be effectively prevented from entering through the metal lid 2, and the piezoelectric vibrator 3 inside the container 4 is kept normal for a long time. And can be operated stably.

Further, according to the electronic component storage container of the present invention, since the insulating base 1 and the metal lid 2 are joined by the glass sealing material 6 having a low dielectric constant, the container 4 has a large capacitance. In addition, even if the lid is formed of a metal material, the characteristics of the piezoelectric vibrator 3 are not impaired, and the piezoelectric vibrator 3 inside the container can be operated normally and stably over a long period of time.

  Thus, according to the electronic component storage container of the present invention, one end of the piezoelectric vibrator 3 is bonded and fixed to the mounting portion of the insulating base 1 via the conductive resin J made of conductive epoxy resin or the like. Each electrode is electrically connected to the metallized wiring layer 5, and then the metal lid 2 is bonded via the glass sealing material 6 so as to cover the mounting portion of the insulating substrate 1, and the insulating substrate 1 and the lid 2 are joined. The piezoelectric vibrator 3 is hermetically accommodated in a container 4 composed of

  To confirm the effect, the following experiment was conducted. Here, an experimental example is shown in which the main component phosphorus pentoxide, tin monoxide, and the amount of external filler added are determined. First, glass was produced by changing the mass% of each component. And in order to evaluate the airtight reliability of the container using each glass, the helium gas leak test of the sealing container after 1000 cycles of thermal shock tests was implemented. Further, in order to compare the sealing strength of the metal lid, the shear strength between the container and the metal lid was measured. As an evaluation container, an insulating substrate having a vertical dimension of 5.0 mm, a horizontal dimension of 3.2 mm, a height of 0.7 mm, and a width of the joint surface with the metal lid is 0.5 mm. Using.

(Experiment 1) Phosphorus pentoxide was changed between 25 to 45% by mass, and other components were added to prepare a total of 100% by mass (rounded off to the second decimal place). The experimental results at this time are shown in Table 1.

  From the experimental results, it was found that phosphorus pentoxide exhibits good airtightness reliability in the range of 30 to 40% by mass and high shear strength of 50 N (Newton) or more.

  Next, the following experiment was performed on tin monoxide and phosphorus pentoxide.

(Experiment 2) Phosphorus pentoxide content is in the range of 30-40% by mass, tin monoxide content is varied between 30-55% by mass, and other components are added to make a total of 100% by mass Formulated (rounded off to two decimal places). The results are shown in Table 2.

  From the experimental results, it was found that tin monoxide exhibits good airtightness reliability in the range of 37 to 50% by mass and high shear strength of 50 N (Newton) or more.

  In addition, the same kind of experiment was conducted for trace elements, and the glass sealing material was phosphorous pentoxide 30 to 40% by mass, tin monoxide 37 to 50% by mass, sodium oxide 5 to 15% by mass, and zinc oxide 1 to 6% by mass. In the case of a glass containing 1 to 4% by mass of aluminum oxide and 1 to 3% by mass of silicon oxide, it can be seen that good airtightness reliability and high shear strength of 50 N (Newton) or more can be obtained. We were able to confirm the effect.

(Experiment 3) Further, a similar experiment was conducted with the glass composition kept constant and the amount of filler added varied. The evaluation results are shown in Table 3.

  As a filler, it was found that when 16 to 45% by mass of a cordierite compound was added externally, good airtightness reliability was obtained and a high shear strength of 50 N (Newton) or more was obtained.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described example, an electronic component storage container for storing a piezoelectric vibrator is shown, but the present invention can also be applied to a semiconductor element storage container for storing a semiconductor element.

It is sectional drawing which shows an example of embodiment of the container for electronic component storage of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Recessed part 2 ... Metal lid 3 ... Electron Parts (piezoelectric vibrator)
4 ... Container 5 ... Metallized wiring layer 6 ... Glass encapsulant 7 ... ..Active metal brazing material layer

Claims (2)

An insulating substrate for mounting an electronic component on the upper surface, and a glass sealing material having a softening and melting temperature of 350 ° C. or lower are bonded to the upper surface of the insulating substrate, and the electronic component is hermetically sealed in the space between the insulating substrate An electronic component storage container comprising a metal lid accommodated in an active metal brazing material layer containing at least one of titanium, zirconium, and hafnium between the metal lid and the glass sealing material. A container for storing electronic parts. 2. The electronic component storage container according to claim 1, wherein an active metal oxide layer is formed between the glass sealing material and the active metal brazing material layer.

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