JP2006261221A - Electronic circuit and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit that can connect a circuit board and a heat radiating plate in a stable state, and can suitably suppress backlash and inclination at the time of mounting a thermoelectric conversion part and the like, and an electronic device including the electronic circuit.
An electronic circuit includes a thermoelectric converter that cools an electronic component (an object to be cooled) that is a heat source, a circuit board that is electrically connected to the electronic component and the thermoelectric converter, and A heat dissipating plate 6 that is disposed facing the circuit board 5 and is connected to the thermoelectric conversion unit 3 to dissipate heat from the thermoelectric conversion unit 3 to the outside, and a space 7 is formed between the heat dissipating plate 6 and the circuit board 5. And a support member 8 that supports the heat sink 6 and the circuit board 5 substantially in parallel.
[Selection] Figure 1

Description

  The present invention relates to an electronic circuit including a thermoelectric conversion unit and an electronic apparatus including the electronic circuit.

Conventionally, in order to cool a cooling object such as an electronic component that obtains electric power from a circuit board, a method of cooling by arranging a thermoelectric conversion unit has been proposed (for example, see Patent Documents 1 and 2).
An example of an electronic circuit 101 having such a thermoelectric conversion unit 100 is shown in FIG. The thermoelectric conversion unit 100 is connected to the heat radiating plate 102 and radiates the heat of the cooling object 103 to the outside through the heat radiating plate 102.

  In this electronic circuit 101, a heat sink 102 whose surface other than a portion where the thermoelectric conversion unit 100 is mounted is covered with an insulating sheet 104 and a circuit board 106 on which an electronic component 105 is mounted face each other, and the heat sink 102 and After the end of the circuit board 106 is fastened with screws 107, the thermoelectric conversion unit 100 is electrically wired to the circuit board 106 and assembled.

  However, in the conventional electronic circuit, when the size of the electronic component 105 mounted on the surface of the circuit board 106 facing the heat sink 102 is not uniform, when the heat sink 102 and the circuit board 106 are fastened, The electronic component 105 </ b> A that protrudes most from the circuit board 106 toward the heat sink 102 comes into contact with the heat sink 102. If the circuit board 106 and the heat sink 102 are screwed together in this state, the circuit board 106 is inclined with respect to the heat sink 102 with the electronic component 105A as a fulcrum as shown in FIG.

Here, when the thermoelectric conversion unit 100 mounted on the circuit board 106 and the lead wire (including the bonding gold wire 109 and the flip chip solder portion) 108 of the cooling target 103 are mounted, as shown in FIG. In addition, from the state where the tip of the capillary 110 is in contact with the gold wire 109 to the thermoelectric terminal electrode 111, the capillary 110 is moved to contact with the circuit board 106 as shown in FIG. 108 is generated. Therefore, when an inclination occurs, a load is generated on the lead wire 108 that is a connection portion between the lead wire 108, the thermoelectric terminal electrode 111, and the circuit board 106, which may cause a crack, disconnection, or the like.
JP-A-7-153997 JP-A-9-55459

  The present invention has been made in view of the above circumstances, and is an electronic device in which a circuit board and a heat sink are connected in a stable state, and rattling and inclination can be suitably suppressed when mounting a thermoelectric conversion unit or the like. It is an object to provide a circuit and an electronic device including the circuit.

The present invention employs the following means in order to solve the above problems.
An electronic circuit according to the present invention is arranged to face a thermoelectric conversion unit that cools a cooling target, a circuit board that is electrically connected to the cooling target and the thermoelectric conversion unit, and the circuit board, A heat sink that is connected to the thermoelectric converter and radiates heat from the thermoelectric converter to the outside, and a space is formed between the heat sink and the circuit board so that the heat sink and the circuit board are substantially parallel to each other. And a supporting member for supporting.

  This electronic circuit is supported by a wiring board exposed on the surface of the circuit board facing the heat sink or a space formed between the heat sink and the circuit board by a support member even when electronic components are mounted. Therefore, the air layer in the space functions as an electrical insulating layer, and the insulation between the circuit board wiring pattern or electronic component and the heat sink can be maintained. In addition, since the heat sink and the circuit board are maintained substantially parallel by supporting the circuit board and the heat sink with the support member, the circuit board can be stably placed on the heat sink. It is possible to suitably suppress backlash and inclination during mounting.

Moreover, the electronic circuit which concerns on this invention is the said electronic circuit, Comprising: The said supporting member is a convex part formed protruding from the said heat sink, It is characterized by the above-mentioned.
This electronic circuit can support the circuit board by forming a space having a height corresponding to the protruding height of the convex part between the heat sink and the circuit board by connecting the convex part and the circuit board. it can.
Moreover, even if the shape of the cooling object is changed by the electronic member to be mounted, it can be coped with by changing the shape of the convex portion of the heat sink, and the processing cost associated with the change can be minimized. .

The electronic circuit according to the present invention is the electronic circuit, wherein the convex portion is arranged at an end portion of the heat radiating plate.
In this electronic circuit, since the convex portion is arranged at the end of the heat sink, a space can be formed in the central portion of the heat sink and the circuit board. Therefore, a thermoelectric conversion part and other electronic components can be mounted in the center part.

Moreover, the electronic circuit according to the present invention is the electronic circuit, wherein the heat radiating plate and the circuit board are connected by the convex portion.
This electronic circuit can suppress the formation of a heat conduction path between the circuit board and the heat radiating plate except for the convex portion. Therefore, by arranging the cooling countermeasures in the center of the heat sink, the temperature of the heat sink can be lowered at the end of the heat sink compared to the center, and the heat flows back from the heat sink to the circuit board. Can be suitably suppressed.

Moreover, the electronic circuit according to the present invention is the electronic circuit, and includes an exterior casing connected to the heat radiating plate.
Since this electronic circuit includes an exterior casing connected to the heat sink, heat absorbed by the heat sink can be stored in the exterior casing and can be exhausted through the exterior casing.

The electronic circuit according to the present invention is the electronic circuit, further comprising a fastening member that connects the heat radiating plate and the exterior casing.
In this electronic circuit, since the heat dissipation plate and the outer casing are connected by the fastening member, the fastening member can serve as a heat transfer path to reliably transfer heat between the heat dissipation plate and the outer casing.

  The electronic circuit according to the present invention is the electronic circuit, wherein the object to be cooled is a chip body, a box-shaped package that houses the chip body, and a connection terminal that protrudes outward from the package. And a hole into which the connection terminal can be inserted is formed in a part of the heat radiating plate.

  When mounting an object to be cooled and a thermoelectric conversion unit, this electronic circuit has a chip body and a package arranged outside the heat sink, and the connection terminals are passed through the heat sink to face the heat sink of the circuit board. Can be electrically connected. Therefore, the heat dissipation direction of the chip body and the heat dissipation plate can be matched, and the heat dissipation efficiency can be improved. Further, the entire electronic circuit can be miniaturized by mounting the connection terminal through the heat sink.

An electronic apparatus according to the present invention includes the electronic circuit according to the present invention.
Since this electronic device includes the electronic circuit according to the present invention, it is possible to reliably cool the object to be cooled, reduce troubles during mounting, shorten the working time, and reduce the manufacturing cost. Can do.

  According to the present invention, it is possible to reduce problems during mounting due to the inclination and backlash of the circuit board. In addition, since it is not necessary to provide an insulating layer on the heat sink, the number of parts can be reduced.

A first embodiment according to the present invention will be described with reference to FIGS.
A digital camera or mobile phone (electronic device) (not shown) according to the present embodiment includes an electronic circuit 1 shown in FIGS. 1 and 2, a housing (not shown) that houses the electronic circuit 1, and a housing inside the housing. A power supply unit (not shown) that is arranged and supplies power to the electronic circuit 1 and a control unit (not shown) that is arranged inside the casing and comprehensively controls these components.

The electronic circuit 1 includes a thermoelectric conversion unit 3 that cools an electronic component (an object to be cooled) 2 that is a heat source, a circuit board 5 to which the electronic component 2 and the thermoelectric conversion unit 3 are electrically connected, A heat dissipating plate 6 that is arranged oppositely and is connected to the thermoelectric conversion unit 3 to dissipate heat of the thermoelectric conversion unit 3 to the outside, and a space 7 is formed between the heat dissipating plate 6 and the circuit board 5 to form the heat dissipating plate 6. And a support member 8 for supporting the circuit board 5 substantially in parallel.
The electronic component 2 is electrically connected to the circuit board 5 via the electronic component lead wire 10.

The thermoelectric conversion unit 3 includes a Peltier element 13 having a cooling surface 11 and a heat dissipation surface 12.
The Peltier element 13 includes a pair of electrically insulating substrates 15 and 16 such as alumina and aluminum nitride, and a p-type thermoelectric material 17 and an n-type thermoelectric material 18 alternately disposed between the pair of substrates 15 and 16. Have. The p-type thermoelectric material 17 and the n-type thermoelectric material 18 are PN-connected by an electrode (not shown) and are electrically connected in series.

  Further, of the pair of substrates 15 and 16, the surface of one substrate 15 is the cooling surface 11, and the surface of the other substrate 16 is the heat dissipation surface 12. A thermoelectric terminal electrode 20 is formed on the other substrate 16 of the Peltier element 13. A thermoelectric lead wire 21 that is electrically connected to the circuit board 5 is connected to the thermoelectric terminal electrode 20. The direction of electrons flowing in the p-type thermoelectric material 17 and the n-type thermoelectric material 18 is controlled by a control unit (not shown) so that power is supplied from a power supply unit (not shown) to cool one substrate 15 side. .

  The Peltier element 13 has a cooling surface 11 and a heat radiating surface 12 bonded to the electronic component 2 and the heat radiating plate 6, respectively, with heat conductive grease such as silicon gel, silver paste, adhesive, or the like. Thereby, the cooling surface 11 and the heat radiating surface 12 are surely in surface contact with the electronic component 2 and the heat radiating plate 6.

The circuit board 5 is formed in a rectangular plate shape, and various electronic members are mounted on both surfaces. On one surface 5a on which the electronic component 2 is mounted, for example, a small capacitor 22, a resistor 23, a connector 25, and the like. The electronic member is mounted. In addition, on the other surface 5 b facing the heat sink 6, for example, electronic members such as a large capacitor 26, a resistor 23, and an arithmetic circuit 27 are mounted.
A central hole 5 </ b> A through which the thermoelectric conversion part 3 can pass when the circuit board 5 and the heat radiating plate 6 are connected is formed in the central portion of the circuit board 5. In addition, through holes 5 </ b> B into which screws 30 to be described later can be inserted are formed at the ends near the four corners of the circuit board 5.

The heat radiating plate 6 has a larger surface area than the surface area of the heat radiating surface 12 of the Peltier element 13, and is formed in a rectangular plate shape with the same size as the circuit board 5.
At the center of one surface 6a of the heat sink 6 facing the circuit board 5, a base 6A for placing the Peltier element 13 is formed so as to protrude from the one surface 6a of the heat sink 6. The heat dissipation surface 12 of the Peltier element 13 is connected.
The other surface 6 b of the heat radiating plate 6 is a surface that radiates the heat of the electronic component 2 exhausted by the Peltier element 13 to the outside.

  At the end portion near one of the four corners of one surface 6a of the heat radiating plate 6 that faces the through hole 5B of the circuit board 5, a convex portion 28 is provided so as to protrude higher than the base portion 6A from the one surface 6a. Is arranged as a support member 8. Even if the circuit board 5 and the heat sink 6 are connected, the height of each convex portion 28 is such that the most protruding member among the electronic members such as the large capacitor 26 mounted on the other surface 5b of the circuit board 5 radiates heat. In order not to contact the plate 6, they are adjusted to substantially the same height.

Each convex portion 28 is formed with a female screw portion 28 </ b> A penetrating from the front end surface 28 a facing the circuit board 5 toward the inside.
The heat sink 6 and the circuit board 5 are screwed and connected via a screw (fastening member) 30 inserted through the through hole 5B and the female screw portion 28A.
The screw 30 is formed to have a length that further protrudes from the other surface 6b of the heat radiating plate 6 so that the heat radiating plate 6 can be further attached to a heat sink (not shown).

Next, a method for manufacturing the electronic circuit 1 according to the present embodiment, and functions and effects will be described.
First, as shown in FIG. 3, the electronic component 2 is placed on the cooling surface 11 of the Peltier element 13, and the heat dissipation surface 12 of the Peltier element 13 is placed on the base 6 </ b> A of the heat dissipation plate 6. Each of them is bonded and fixed with heat conductive grease such as silicon gel, silver paste, or adhesive.

Subsequently, while the respective through holes 5B and the respective convex portions 28 are opposed to each other, although not shown in FIG. 4, a circuit board in which various electronic members are mounted on the one surface 5a and the other surface 5b. The other surface 5 b of 5 is opposed to one surface 6 a of the heat sink 6. Then, the screw 30 is inserted into and screwed into the through hole 5B.
At this time, the electronic component 2 and the thermoelectric conversion unit 3 are disposed in the central hole 5A of the circuit board 5, and the circuit board 5 and the heat radiating plate 6 are supported substantially in parallel by the convex portion 28. A space 7 is formed between the heat radiating plate 6.

In this state, wire bonding is performed on the electronic component 2 and the Peltier element 13, and the electronic circuit 1 is obtained by being electrically mounted on the circuit board 5 while forming the electronic component lead wire 10 and the thermoelectric lead wire 21.
The electronic circuit 1 obtained in this way is further incorporated to obtain a digital camera or mobile phone (not shown).

According to this electronic circuit 1, even if the wiring pattern is exposed on the other surface 5b of the circuit board 5 facing the heat sink 6 or the above-described various electronic members are mounted, the heat sink 6 and the circuit The circuit board 5 can be supported in a state where the space 7 corresponding to the protruding height of the convex portion 28 is formed between the heat sink 6 and the circuit board 5 by the convex portion 28, which is the support member 8. it can.
Accordingly, since the air layer in the space 7 functions as an electrical insulating layer, the electrical insulation state between the wiring pattern of the circuit board 5 or the electronic member and the heat radiating plate 6 is maintained without using an insulating sheet or the like. be able to.

  Moreover, since the heat sink 6 and the circuit board 5 are maintained substantially parallel so that an electronic member does not contact with the heat sink 6 by supporting the circuit board 5 and the heat sink 6 with each convex part 28, heat dissipation. The circuit board 5 can be placed on the board 6 in a stable state, and rattling and inclination during mounting can be suitably suppressed.

  Accordingly, it is possible to reduce problems at the time of mounting such as wire bonding work due to the inclination or backlash of the circuit board 5. Further, it is not necessary to provide an insulating sheet or the like on the heat radiating plate 6, and therefore an adhesive for fixing the electronic member protruding to the heat radiating plate 6 is not necessary, thereby reducing the number of parts of the entire electronic circuit. be able to.

Further, since the convex portions 28 are arranged at the end portions near the four corners of the heat sink 6, the space 7 can be formed in the center portion of the heat sink 6 and the circuit board 5. Therefore, the thermoelectric conversion part 3 and other electronic members can be mounted in the center part, and the inclination of the circuit board 5 and the heat sink 6 can be suppressed more suitably.
Further, it is possible to limit the contact portion between the circuit board 5 and the heat radiating plate 6 only to each convex portion 28, and to prevent other heat conduction paths from being formed, and maintain high-performance heat transfer by the thermoelectric conversion portion 3. However, it is possible to suitably suppress the backflow of heat from the heat sink 6 to the circuit board 5.

  In addition, the digital camera or mobile phone equipped with the electronic circuit 1 can reliably cool the electronic component 2 and can reduce troubles when mounting the electronic member to shorten the working time, thereby reducing the manufacturing cost. can do.

Next, a second embodiment will be described with reference to FIGS.
In addition, the same code | symbol is attached | subjected to the component similar to 1st Embodiment mentioned above, and description is abbreviate | omitted.
The difference between the second embodiment and the first embodiment is that an electronic component 41 mounted on the electronic circuit 40 according to this embodiment includes a CCD (chip body) 42 and a box-shaped package that houses the CCD 42. 43 and a lead frame (connecting terminal) 45 projecting outward from the package 43, which is a DIP (Dual Inline Package) type.

The package 43 has a bottom plate 43A on which the CCD 42 is placed and is formed to be hermetically sealed. A part of the bottom plate 43A is made of a material having high thermal conductivity such as copper.
The lead frame 45 protrudes outward in the normal direction from the bottom plate 43A side of the side surface 43B of the package 43, and the leading end side is refracted to the bottom plate 43A side. Wires from the CCD 42 are connected to the lead frame 45, and the leading end of the lead frame 45 is electrically connected to the circuit board 46 by, for example, solder.

  For example, three lead frames 45 are projected from the side surface 43B of the package 43, and each length is longer than the thickness of the heat radiating plate 47, and a slit 47A described later is inserted. Thus, the lengths of the heat sink 47 and the package 43 are substantially the same so that they do not contact each other.

The heat sink 47 is provided with the base 6A according to the first embodiment. Instead, a slit (hole) 47A through which the lead frame 45 can be inserted is formed at the center of the heat sink 47. .
In the Peltier element 13, the heat radiating surface 12 is connected to the other surface 47b of the heat radiating plate 47, and the electronic component 41 is mounted on the other surface 46b of the circuit board 46 with the heat radiating plate 47 interposed therebetween.
In the circuit board 46, the central hole 5A according to the first embodiment is not formed, but is formed in a flat plate shape.

Next, a method for manufacturing the electronic circuit 40 according to the present embodiment, and functions and effects will be described.
First, the heat radiating surface 12 of the Peltier element 13 is placed on the other surface 47b of the heat radiating plate 47 and bonded and fixed with the above-described heat conductive grease such as silicon gel, silver paste, or adhesive.

Next, as in the first embodiment, the through holes 5B and the convex portions 28 are opposed to each other, and the other surface 46b of the circuit board 46 is opposed to the one surface 47a of the heat sink 47. Then, the screw 30 is inserted into and screwed into the through hole 5B.
At this time, a space 7 is formed between the circuit board 46 and the heat radiating plate 47. And the circuit board 46 and the heat sink 47 are supported substantially in parallel by the convex portion 28.

  In this state, wire bonding work is performed on the Peltier element 13. That is, as shown in FIG. 7, a thermoelectric lead wire 21 electrically connects the other substrate 16 of the Peltier element 13 and a wiring pattern (not shown) formed on the other surface 46b of the circuit substrate 46. To do. At this time, the thermoelectric lead 21 is suspended so as to be inserted into the slit 47 </ b> A of the heat radiating plate 47.

Subsequently, the attachment work of the electronic component 41 in which the CCD 42 is connected in advance to the bottom plate 43A of the package 43 is performed.
First, the lead frame 45 of the electronic component 41 is inserted into the slit 47A of the heat radiating plate 47 from the other surface 47b side of the heat radiating plate 47, and the tip of the lead frame 45 is brought into contact with the other surface 46b of the circuit board 46. At the same time, the bottom plate 43 </ b> A of the package 43 is brought into contact with the cooling surface 11 of the Peltier element 13.

  For example, the tip of the lead frame 45 is soldered to the circuit board 46, and the bottom plate 43A of the package 43 and the cooling surface 11 of the Peltier element 13 are bonded to the above-described heat conductive grease such as silicon gel, silver paste, or adhesive. Adhering and fixing with each other.

Thereafter, the electronic component lead wire 10 and the thermoelectric lead wire 21 are formed and mounted on the circuit board 46 to obtain the electronic circuit 40 in which other electronic members are arranged together.
The electronic circuit 40 thus obtained is further incorporated to obtain a digital camera or mobile phone (not shown).

According to the electronic circuit 40, the same operations and effects as those of the first embodiment can be achieved.
Particularly, in the electronic component 41 according to the present embodiment, the lead frame 45 is inserted into the slit 47A and connected to the circuit board 46. Therefore, by setting the length of the lead frame 45 to be equal to or greater than the thickness of the heat radiating plate 47, the CCD 42 and the package 43 are connected to the other side of the heat radiating plate 47 when the electronic component 41 and the thermoelectric conversion unit 3 are mounted on the circuit board 46. The lead frame 45 can be passed through the heat radiating plate 47 and electrically connected to the other surface 46 b of the circuit board 46 facing the heat radiating plate 47.

As a result, the heat dissipation direction of the CCD 42 and the heat dissipation plate 47 can be matched, and the heat dissipation efficiency can be improved. Further, the entire electronic circuit can be reduced in size by passing the lead frame 45 through the heat sink 47 and mounting it on the circuit board 46.
Further, since the CCD 42 and the circuit board 46 are made conductive through the lead frame 45, a sufficient space for inserting the thermoelectric lead wire 21 and the electronic component lead wire 10 can be secured, and the mutual contact can be ensured. It can suppress suitably.

Next, a third embodiment will be described with reference to FIG.
In addition, the same code | symbol is attached | subjected to the component similar to other embodiment mentioned above, and description is abbreviate | omitted.
The difference between the third embodiment and the second embodiment is that the electronic circuit 50 according to the present embodiment includes an outer casing 51 connected to the heat sink 47, and the heat sink 47 and the outer casing 51 Is connected by a screw 30.

The outer casing 51 is formed with a space 51A for accommodating therein an electronic circuit body 52 having substantially the same configuration as the electronic circuit 40 according to the second embodiment, and has a high thermal conductivity, for example, an aluminum die. Consists of a cast.
A female screw portion 28 </ b> A connected to the screw 30 is formed in the exterior housing 51. A lens 53 is disposed on the surface where the outer casing 51 and the electronic component 41 face each other.

Next, a method for manufacturing the electronic circuit 50 according to the present embodiment, and functions and effects will be described.
First, the electronic circuit body 52 is manufactured in the same manner as the electronic circuit 40 according to the second embodiment.
Then, the electronic circuit main body 52 is inserted into the space 51A of the outer casing 51 in which the lens 53 is disposed in advance, and the screw 30 is screwed into the female screw portion 28A of the outer casing 51 to thereby dissipate the outer casing 51 and the heat sink 47. To obtain an electronic circuit 50.
The electronic circuit 50 thus obtained is further incorporated to obtain a digital camera or mobile phone (not shown).

According to this electronic circuit 50, the same operation and effect as the electronic circuit 40 according to the second embodiment can be obtained.
In particular, since the outer casing 51 is connected to the heat radiating plate 47 with the screws 30, the heat generated by the CCD 42 can be transferred from the heat radiating plate 47 to the outer casing 51 via the screws 30. Further, the alignment between the CCD 42 and the lens 53 can be easily performed.

  At this time, since the heat capacity of the outer casing 51 is larger than that of the heat radiating plate 47, the outer casing 51 functions as a heat sink. Therefore, the heat dissipation effect by the thermoelectric conversion of the Peltier element 13 can be further enhanced, and even if the CCD 42 or the like is driven for a long time, the heat can be reliably exhausted and the life can be extended.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, when the shape of the electronic component to be cooled is changed, the shape of the heat radiating plate may be changed by providing the heat radiating plate 47 with a pedestal or a slit as appropriate according to the mounting state of the circuit board. Absent.
Further, although the CCD 42 is arranged in the package 42 as the electronic component 41, the present invention is not limited to the CCD 42, and other package type electronic components may be used.

It is side surface sectional drawing which shows the electronic circuit which concerns on the 1st Embodiment of this invention. 1 is an upper plan view showing an electronic circuit according to a first embodiment of the present invention. It is explanatory drawing which shows the process in which the electronic circuit which concerns on the 1st Embodiment of this invention is manufactured. It is explanatory drawing which shows the process in which the electronic circuit which concerns on the 1st Embodiment of this invention is manufactured. It is side surface sectional drawing which shows the electronic circuit which concerns on the 2nd Embodiment of this invention. It is an upper top view which shows the electronic circuit which concerns on the 2nd Embodiment of this invention. It is explanatory drawing which shows the manufacture process of the electronic circuit which concerns on the 2nd Embodiment of this invention. It is side surface sectional drawing which shows the electronic circuit which concerns on the 3rd Embodiment of this invention. It is side surface sectional drawing which shows the conventional electronic circuit. It is explanatory drawing which shows the process in which the conventional electronic circuit is manufactured. It is explanatory drawing which shows the process in which the conventional electronic circuit is manufactured. It is explanatory drawing which shows the process in which the conventional electronic circuit is manufactured.

Explanation of symbols

1, 40, 50 Electronic circuit 2, 41 Electronic component (cooling object)
3 Thermoelectric converters 5 and 46 Circuit boards 6 and 47 Heat sink 7 Space 8 Support member 28 Projection 30 Screw (fastening member)
42 CCD (chip body)
43 Package 45 Lead frame (connection terminal)
51 Exterior housing

Claims (8)

A thermoelectric converter for cooling the object to be cooled;
A circuit board to which the object to be cooled and the thermoelectric converter are electrically connected;
A heat sink disposed opposite to the circuit board, to which the thermoelectric conversion unit is connected and dissipates heat of the thermoelectric conversion unit to the outside;
An electronic circuit comprising: a support member that forms a space between the heat sink and the circuit board and supports the heat sink and the circuit board substantially in parallel.   The electronic circuit according to claim 1, wherein the support member is a convex portion formed to protrude from the heat radiating plate.   The electronic circuit according to claim 2, wherein the convex portion is disposed at an end portion of the heat radiating plate.   The electronic circuit according to claim 3, wherein the heat radiating plate and the circuit board are connected by the convex portion.   The electronic circuit according to claim 4, further comprising an exterior housing connected to the heat sink.   The electronic circuit according to claim 5, further comprising a fastening member that connects the heat radiating plate and the exterior casing. The cooling object is a chip body,
A box-shaped package for storing the chip body;
A connection terminal protruding outward from the package,
The electronic circuit according to claim 1, wherein a hole through which the connection terminal can be inserted is formed in a part of the heat radiating plate.   An electronic apparatus comprising the electronic circuit according to claim 1.

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