JP2006120975A - Electronic component mounting apparatus and holding tool - Google Patents

Abstract

In an electronic component mounting apparatus for mounting electronic components on a circuit board with high density using ultrasonic vibration, ultrasonic vibration can be efficiently performed without bringing a holding surface of a holding tool into contact with the mounted electronic component. In addition to being transmitted to the electronic component to be mounted, it is possible to accurately obtain the position of the electronic component held by the holding tool.
An electronic component 91 is mounted on a circuit board by holding the electronic component 91 on a holding surface 353 of the holding tool and pressing the electronic component 91 through the holding tool while applying ultrasonic vibration to the electronic component 91. In the electronic component mounting apparatus, the holding surface 353 has a square shape with chamfered corners. As a result, it is possible to prevent the corner of the holding surface 353 from being erroneously detected as the corner of the electronic component when an image of the electronic component is acquired while maintaining the rigidity of the tip of the holding tool high. The position can be determined accurately.
[Selection] FIG. A

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board using ultrasonic vibration, and a holding tool used in the electronic component mounting apparatus.

  Conventionally, metal bonding by ultrasonic vibration has been used in the field of bonding electronic components to circuit boards. For example, a bump bump is formed on an electrode of a semiconductor chip, and the bump and the electrode of the circuit board are brought into contact with each other, and then the ultrasonic vibration is applied from the semiconductor chip side to bond the bump and the electrode of the circuit board. .

On the other hand, Patent Document 1 discloses a technique for performing inner lead bonding for joining a semiconductor chip and an inner lead of a tape carrier using ultrasonic vibration. In the bonding tool of Patent Document 1, in order to increase the rigidity of the tool tip and efficiently transmit ultrasonic vibration to the inner lead while accommodating the narrow pitch of the inner lead, the cross section of the tool tip is in the main ultrasonic vibration direction. It has a long shape. Also, a technique to reduce the width of the tip while maintaining rigidity by removing the part including the side perpendicular to the main ultrasonic vibration direction from the tip of the tool so that the tip of the tool does not destroy other parts of the semiconductor chip. Is also mentioned.
JP-A-11-145204

  By the way, in recent years, parts of various devices are manufactured by mounting bare chips of electronic parts with high density. The electronic component is held by suction with a tool, mounted on a circuit board, and mounted by applying ultrasonic vibration through the tool. When electronic components are mounted at high density, it is necessary to prevent the tool from coming into contact with the mounted electronic component, and the tip of the tool is extremely small. As a result, as in the case of Patent Document 1, it is important to efficiently transmit ultrasonic vibrations to the tool tip.

  Here, in order to make the tool as rigid as possible and prevent the tool from coming into contact with the mounted electronic component, the size of the surface that holds the electronic component at the tip of the tool (hereinafter referred to as “holding surface”) and It is preferable that the shape is the same as the electronic component and the same shape. However, if the holding surface has a rectangular shape similar to that of the electronic component, there is a high possibility that the holding position of the electronic component at the tool tip is erroneously detected.

  For example, when detecting the position of the electronic component, the electronic component held by the tool is imaged from below, and a shape indicating a pair of corners (corners) positioned diagonally is extracted from the acquired image. . And the center of an electronic component is calculated | required from a pair of corners. However, when the holding surface of the tool is rectangular, if the holding surface is larger than the electronic component or the electronic component is held in a state of protruding from the holding surface, the corner of the holding surface is erroneously taken as the corner of the electronic component from the acquired image. As a result, the position of the electronic component is erroneously detected.

  The present invention has been made in view of the above problems, and in an electronic component mounting apparatus that mounts an electronic component on a circuit board using ultrasonic vibration, the ultrasonic vibration is efficiently maintained while maintaining the rigidity of the holding portion high. An object of the present invention is to obtain an accurate position by preventing erroneous detection of the position of the electronic component while giving it to the electronic component.

  The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, the holding portion holding the electronic component, and pressing the electronic component held by the holding portion toward the circuit board Based on an output from the imaging unit, an ultrasonic transducer that applies ultrasonic vibration to the electronic component via the holding unit, an imaging unit that images the electronic component held by the holding unit, And a calculation unit for determining the position of the electronic component with respect to the holding unit, wherein the holding unit is a holding unit main body, and the tip surface is a holding surface that sucks and holds the electronic component while protruding from the holding unit main body. The holding surface has a shape obtained by removing at least one pair of corners in a diagonal direction from a rectangle.

  The invention according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the holding surface has a shape in which all corners are removed from the rectangle.

  A third aspect of the present invention is the electronic component mounting apparatus according to the first aspect, wherein the holding surface has a shape obtained by removing only a pair of square corners, and the ultrasonic vibration By the child, the holding surface vibrates in a diagonal direction connecting another pair of corners of the square.

  A fourth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to third aspects, wherein the length of each side of the removed portion at the removed corner of the rectangle is the imaging unit. Therefore, it exceeds twice the minimum distance that can be discriminated on the holding surface and is 1/3 or less of the length of each side.

  The invention according to claim 5 is the electronic component mounting apparatus according to any one of claims 1 to 4, wherein the electronic component is a bare chip.

  A sixth aspect of the present invention is the electronic component mounting apparatus according to any one of the first to fifth aspects, wherein the holding surface is moved by pressing the tip while vibrating by the ultrasonic vibrator. A polishing unit for polishing is further provided.

  The invention according to claim 7 is a holding tool for sucking and holding the electronic component in an electronic component mounting apparatus for mounting the electronic component on the circuit board using ultrasonic vibration, and the mounting portion attached to the holding unit body And a tip portion protruding from the mounting portion and having a tip surface as a holding surface for sucking and holding electronic components, and the holding surface has a shape obtained by removing at least one pair of diagonal corners from a rectangle. is there.

  The invention according to claim 8 is the holding tool according to claim 7, wherein the holding surface has a shape obtained by removing all corners from a rectangle.

  According to the present invention, it is possible to efficiently transmit ultrasonic vibration to an electronic component to be mounted without bringing the holding surface into contact with the mounted electronic component, and it is possible to accurately obtain the position of the electronic component. .

  In the inventions of claims 2 and 8, the symmetry of the holding surface can be easily obtained, and in the invention of claim 3, the rigidity of the tip can be further improved.

  FIG. 1 is a front view showing an electronic component mounting apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a plan view of the electronic component mounting apparatus 1. The electronic component mounting apparatus 1 is a so-called flip chip mounting apparatus that performs mounting of an electronic component on a circuit board 9 such as a printed circuit board and bonding (that is, mounting) of an electrode at the same time after inverting the fine electronic component. It is.

  The electronic component mounting apparatus 1 includes a board holding unit 2 that holds a circuit board 9, and a circuit board held by the board holding unit 2 above the board holding unit 2 (on the (+ Z) side in FIG. 1). 9, a mounting mechanism 3 for mounting electronic components is provided. On the (−X) side of the substrate holding unit 2, a component supply unit 4 for supplying electronic components to the mounting mechanism 3 is provided. In addition, between the board holding unit 2 and the component supply unit 4, an imaging unit 5 that images the electronic component supplied to the mounting mechanism 3 by the component supply unit 4, a component recovery mechanism 61 that collects the electronic component, and 62 is provided, and on the (+ X) side of the circuit board 9, a polishing unit 7 for polishing the tip of the component holding unit 33 of the mounting mechanism 3 is provided. In the electronic component mounting apparatus 1, these mechanisms are controlled by the control unit 8 so that the electronic component is mounted on the circuit board 9.

  The substrate holding unit 2 includes a stage 21 that holds the circuit board 9 and a stage moving mechanism 22 that moves the stage 21 in the Y direction in FIG. The polishing unit 7 is attached to the (+ X) side of the stage 21 and moves in the Y direction integrally with the stage 21 by the stage moving mechanism 22. The polishing unit 7 includes a sheet-like polishing member 71 having a flat and horizontal polishing surface 711, and a polishing member holding unit 72 that holds the polishing member 71.

  The mounting mechanism 3 includes a mounting head 31 and a mounting head moving mechanism 32 that moves the mounting head 31 in the X direction. The mounting head 31 includes a component holding unit 33 that holds electronic components by suction. The mounting head 31 is provided with a lifting mechanism 34 that lifts and lowers the component holding portion 33.

  FIG. 3 is an enlarged view showing the vicinity of the component holding portion 33. In the component holding unit 33, a holding tool 331 for sucking and holding electronic components is inserted and fixed in the holding unit main body 332, and an ultrasonic vibrator 333 that is an oscillating unit that applies ultrasonic vibration is provided in the holding unit main body 332. It is attached. The holder main body 332 is attached to the shaft 335 via the block 334, and the component holder 33 moves relative to the circuit board 9 and the polishing surface 711 by moving the shaft 335 in the Z direction by the lifting mechanism 34 (see FIG. 1). Move up and down relatively.

  FIG. 4 is an enlarged view showing the vicinity of the holding tool 331. The holding tool 331 includes an attachment portion 351 attached to the holding portion main body 332 and a tip portion 352 protruding from the attachment portion 35. When the attachment portion 351 is attached to the holding portion main body 332, the distal end portion 352 protrudes downward from the holding portion main body 332 in a columnar shape. The front end surface of the front end portion 352 is a holding surface 353 that sucks and holds electronic components, and a suction path 354 for vacuum suction is formed at the center of the holding tool 331. The suction path 354 is connected to the vacuum generator via the holding part main body 332, the shaft 335, a valve, and the like, and the other end of the suction path 354 communicates with a suction port 355 formed in the holding surface 353. Then, the electronic component is sucked and held on the holding surface 353 by performing suction from the suction port 355. The suction path 354 is also connected to a supply source of compressed air, and air can be blown from the suction port 355. In addition, the width | variety of the front-end | tip of the holding | maintenance tool 331 is about 0.3-0.5 mm, for example, and although very minute with respect to the holding | maintenance part main body 332, it has drawn large in FIG.3 and FIG.4. Note that the shape of the holding tool 331 may be appropriately changed. For example, the attachment portion 351 may be attached to the side surface of the holding portion main body 332.

  As shown in FIGS. 1 and 2, the component supply unit 4 includes a component placement unit 41 that places electronic components at predetermined positions, a supply head 42 that takes out and holds electronic components from the component placement unit 41, and a supply head 42. A supply head moving mechanism 43 that moves in the X direction and a rotation mechanism 44 that rotates and slightly raises and lowers the supply head 42 are provided. The component placement unit 41 includes a component tray 411 on which a large number of electronic components are placed, a stage 412 that holds the component tray 411, and a tray moving mechanism 413 that moves the component tray 411 together with the stage 412 in the X direction and the Y direction. Prepare.

  The supply head 42 includes a supply collet 421 (see FIG. 1) that supplies the electronic component held by suction to the component holding unit 33 of the mounting head 31. The supply collet 421 sucks and holds the electronic component by performing suction from a suction port formed at the tip.

  In the component supply unit 4, a large number of electronic components to be mounted on the circuit board 9 are surfaces on the side on which the electrode portions to be bonded to the circuit board 9 are formed (the lower surface in a state after mounting, hereinafter “ It is placed on the component tray 411 with the “joining surface” facing the (+ Z) side (that is, in the direction opposite to the direction of mounting on the circuit board 9). In the present embodiment, the electrode part of the electronic component is a protruding bump formed of gold (Au) on the electrode pattern. However, depending on the mounting method or the electronic component to be mounted, the electrode part may be a plating bump or the like. Or the electrode pattern itself. Further, the bumps may be provided on the electrodes of the circuit board 9 instead of being provided on the electrode pattern of the electronic component.

  The imaging unit 5 is on a movement path of the mounting head 31 (particularly, the component holding unit 33) by the mounting head moving mechanism 32 and does not interfere with the movement of the mounting head 31 (in the present embodiment, directly below the movement path). The electronic component that is provided and held by the component holding unit 33 is imaged from the (−Z) side. The component collection mechanism 61 provided between the substrate holding unit 2 and the imaging unit 5 is also arranged on the movement path of the mounting head 31 (particularly, the component holding unit 33) and at a position that does not interfere with the movement of the mounting head 31. The electronic components held by the component holding unit 33 are collected as necessary. Also, the component collection mechanism 62 attached to the (+ X) side of the stage 412 is moved in the X direction and the Y direction integrally with the stage 412 by the tray moving mechanism 413, and the electronic component held by the supply collet 421 as necessary. To collect.

  When an electronic component is mounted on the circuit board 9 by the electronic component mounting apparatus 1, first, a component tray 411 on which a large number of electronic components are placed with the bonding surface facing the (+ Z) side is previously shown in FIG. Is moved by the tray moving mechanism 413 below the supply head 42 located on the (−X) side, and the joint surface of the electronic component is sucked and held by the supply collet 421. Next, the supply head 42 moves in the (+ X) direction by the supply head moving mechanism 43 while being reversed, and is positioned at a position indicated by a two-dot chain line in FIG. At this time, the supply collet 421 and the component holding part 33 of the mounting head 31 face each other.

  Subsequently, the component holding unit 33 is slightly lowered by the elevating mechanism 34, the upper surface of the electronic component is sucked and sucked by the component holding unit 33, and suction by the supply collet 421 is stopped, and the component holding unit 33 is moved from the supply collet 421. The electronic component is received and sucked and held by the holding surface 353 (see FIG. 4). When the supply of the electronic component is completed, the component holding unit 33 is slightly raised by the lifting mechanism 34, and the supply head 42 is retracted to the original position. In parallel with the retraction of the supply head 42, the mounting head 31 moves right above the imaging unit 5, and the electronic component held on the holding surface 353 of the component holding unit 33 is imaged by the imaging unit 5.

  Image data that is output from the imaging unit 5 is sent to the control unit 8, and the control unit 8 extracts a pair of diagonals of the electronic component from the image, and calculates the position (and orientation, the same applies hereinafter) of the electronic component by calculation. Desired. In the mounting mechanism 3, the mounting head 31 is controlled based on the detected position of the electronic component, and the component holding portion 33 rotates around the axis extending in the Z direction to correct the posture of the electronic component. If the control unit 8 determines that the posture or mounting position of the electronic component cannot be corrected (that is, a suction error has occurred), the mounting operation of the electronic component is stopped and mounted. The head 31 moves above the component collection mechanism 61, and the electronic component separated from the component holding unit 33 by air blow or the like from the component holding unit 33 is collected by the component collection mechanism 61.

  Subsequently, the mounting head 31 is moved in the (+ X) direction from the delivery position indicated by the two-dot chain line in FIG. 1 by the mounting head moving mechanism 32, and is positioned above the planned mounting position of the electronic component on the circuit board 9. To do. The component holding portion 33 is lowered toward the circuit board 9 so that the electrode portion formed on the bonding surface contacts the electrode on the circuit board 9, and the electronic component is held by the board holding portion 2 by the lifting mechanism 34. It is pressed against the circuit board 9. In this state, an ultrasonic vibration having an amplitude of about 1 μm is applied to the component holding unit 33 by the ultrasonic transducer 333 via the component holding unit 33, so that the electronic component is electrically bonded to the circuit board 9. Then, joining (that is, mounting) is performed simultaneously with the mounting of the electronic component.

  When the mounting of the electronic component is completed, the component holding portion 33 that has stopped sucking is lifted away from the electronic component by the elevating mechanism 34, and then it is confirmed whether or not the holding surface 353 needs to be polished. The holding surface 353 is polished in order to remove components of the substrate of the electronic component adhered to the holding surface 353. When it is determined that the polishing is necessary, the component holding unit 33 moves above the polishing unit 7, and vibration is applied by the ultrasonic vibrator 333 while the holding surface 353 is pressed by the polishing member 71. Thus, the holding surface 353 is polished.

  When the polishing of the component holding unit 33 is completed or when it is determined that the polishing is unnecessary, the mounting head 31 moves to the delivery position, and the extracted electronic component is held by the holding surface 353 of the component holding unit 33. The operation of attaching the electronic component to the circuit board 9 is repeated.

  Next, the holding tool 331 of the electronic component mounting apparatus 1 will be described in detail. FIG. 5 is a bottom view of the holding tool 331. As shown in FIGS. 4 and 5, the attachment portion 351 of the holding tool 331 has a cylindrical shape with a diameter of 1.5 to 2 mm, and the front end portion 352 has a width of 0.3 to 0.5 mm in the front-rear and left-right directions. It is a substantially rectangular parallelepiped having a length of 0.3 to 0.5 mm. The holding surface 353 which is the bottom surface of the distal end portion 352 has a shape in which all corners are removed from the square (that is, chamfered), and has a shape close to an octagon in this embodiment.

  FIG. 6 is a diagram illustrating a state in which the electronic component 91 slightly larger than the holding surface 353 is held on the holding surface 353. In FIG. 6, a pointer 92 indicating the position of the corner detected from the electronic component 91 when the image is captured by the image capturing unit 5 is shown by a bold cross. As shown in FIG. 6, normally, when detecting a rectangular object, a pair of diagonal positions are detected through image processing such as edge extraction, and the object is detected based on the diagonal positions. The position (and orientation) is determined.

  FIG. A shows a state in which the electronic component 91 is smaller than the holding surface 353, but the corner of the electronic component 91 protrudes from the (cut) corner of the holding surface 353, as shown in FIG. B shows a state in which the electronic component 91 is held out of the center of the holding surface. FIG. A and FIG. In any state of B, there is no confusing pattern near the corner of the electronic component 91, and a pair of diagonals of the electronic component 91 is appropriately detected as indicated by the pointer 92.

  FIG. A and FIG. Each B is shown in FIG. A and FIG. FIG. 8 is a diagram showing a comparative example corresponding to FIG. A and FIG. In B, the holding surface 353a is not chamfered and is square. FIG. In A, since the pair of corners of the electronic component 91 and the corner of the holding surface 353a are close to each other, two corners of the holding surface 353a are erroneously detected as the corners of the electronic component 91 as indicated by the pointer 92. Has been. FIG. In B, since one corner of the electronic component 91 and the corner of the holding surface 353a are close to each other, as shown by the pointer 92, the corner of the holding surface 353a is erroneously detected as one corner of the electronic component 91. ing.

  In contrast, FIG. A and FIG. As shown in B, since the four corners of the holding surface 353 are chamfered in the electronic component mounting apparatus 1, erroneous detection of the corners of the electronic component 91 is prevented. Note that the tip 352 is worn and shortened by repeated mounting and repeated polishing by the polishing unit 7, so that the tip 352 is preferably chamfered over substantially the entire length. Of course, when the holding tool 331 is replaced before the tip 352 is greatly worn, chamfering may be performed only in the vicinity of the holding surface 353. Even in this case, by reducing the depth of focus of the imaging unit 5, it is possible to prevent the shape of the portion closer to the mounting portion 351 than the holding surface 353 from affecting the detection of the corners of the electronic component 91.

  Next, functions and effects obtained by using the holding tool 331 having the holding surface 353 having a chamfered rectangular shape will be described.

  When an electronic component is mounted on a circuit board by the electronic component mounting apparatus 1 to produce a lighting device or a display device component, a very high-density mounting is performed. Therefore, the holding surface 353 is sized so as not to protrude too much from the electronic component so that the holding surface 353 does not contact the mounted electronic component. At this time, if the holding surface is circular, the cross-sectional area of the tip becomes small, and if ultrasonic vibration is applied in a state where a load is applied to the holding tool, the tip is bent from the base (that is, the loss is lost). The amplitude on the holding surface becomes small. Conversely, if the tip is subjected to large amplitude vibration in order to give sufficient ultrasonic vibration to the electronic component, if the tip is worn by repeated mounting and polishing of a large number of electronic components, Complicated adjustment to reduce the amplitude is required.

  On the other hand, in the electronic component mounting apparatus 1 according to the present embodiment, since the holding surface 353 is substantially rectangular while preventing erroneous detection of the corners of the electronic component, the region of the holding surface 353 that protrudes from the electronic component is set. In addition, the cross-sectional area and rigidity of the tip 352 can be sufficiently increased. As a result, the ultrasonic vibration can be efficiently transmitted to the electronic component to be mounted without bringing the holding surface 353 into contact with the mounted electronic component, and the position (and orientation) of the electronic component can be accurately obtained. Is realized. Furthermore, by improving the rigidity of the tip 352, even if the tip 352 is worn, the ultrasonic vibration is transmitted to the electronic component with the same efficiency as before the wear, and the ultrasonic vibrator 333 can be easily adjusted. Become.

  Here, since the holding surface 353 is preferably as large as possible with respect to the electronic component, FIG. As shown to A, it is preferable that the holding surface 353 protrudes from an electronic component. On the other hand, since the removal of the corners of the holding surface 353 should be as small as possible, the length on each side of the removed portion at the removed corner (the length denoted by the symbol C in FIG. 9) is usually The length of the side (the length to which the symbol W is attached) is 1/3 or less. Further, since it is necessary to remove the corner of the holding surface 353 as clearly as possible from the corner of the electronic component, the length C on each side of the removed portion is the minimum that can be discriminated on the holding surface 353 by the imaging unit 5. It can be said that it is preferable to exceed twice the distance.

  FIG. 10 is a diagram showing another shape of the holding surface 353. The holding surface 353 shown in FIG. 10 has a shape in which only a pair of diagonal corners (upper left corner and lower right corner in FIG. 10) are removed from the square. Even with such a holding surface 353, FIGS. A, FIG. As illustrated in B, when the upper left and lower right corners of the electronic component are detected, the corners of the holding surface 353 are prevented from causing erroneous detection. Since the holding surface 353 is preferably symmetrical with respect to the direction of the ultrasonic vibration and the direction perpendicular thereto with respect to the center, in the case of the holding surface 353 in FIG. 10, ultrasonic vibration may be applied in a diagonal direction. Necessary. At this time, in order to maximize the transmission efficiency of the ultrasonic vibration, that is, the rigidity of the tip 352, the holding surface 353 is (square) by the ultrasonic vibrator 333 as indicated by an arrow 93 in FIG. It is preferable to vibrate in a diagonal direction connecting a pair of unremoved corners.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made.

  For example, in the above embodiment, the holding surface 353 is substantially square (a shape obtained by removing corners from a square), but may be substantially rectangular (a shape obtained by removing corners from a general rectangle). In this case, in order to easily obtain the symmetry of the holding surface 353 (the symmetry in the two directions of up, down, left, and right), it is preferable that all corners are removed. Note that one or three corners may be removed as long as it is permitted in ultrasonic transmission. In general terms, the holding surface 353 has a shape in which at least one pair of diagonal corners that affect electronic component detection is removed from the rectangle.

  The corners of the holding surface 353 do not need to be chamfered linearly, and may be chamfered in an arc shape as shown in FIG. 11, for example. Since removal is a fine process by actual chamfering, it is not necessary that all the chamfered portions have the same shape.

  The shape of the holding tool 331 exemplified in the above embodiment is that when a minute electronic component is mounted. When a larger electronic component or another electronic component is mounted, the holding surface 353 is formed. The width and the length of the tip 352 are changed as appropriate (for example, both are 1 mm or more).

  In addition, the holding of the electronic component by the holding tool 331 is not limited to suction suction, and may be held by electrical or magnetic suction or adhesion. The holding unit 331 may move on the polishing member 71 while polishing the ultrasonic wave using ultrasonic vibration, or the polishing member 71 may contact the holding tool 331 while vibrating.

  The electronic component mounted by the electronic component mounting apparatus 1 is, for example, a semiconductor bare chip or a bare chip of a light emitting diode, which is a small rectangular parallelepiped device. In particular, the electronic component mounting apparatus 1 is suitable for applications in which bare chips of light emitting diodes are mounted at a high density when manufacturing parts of a lighting device or a display device. In this case, the polishing unit 7 removes the sapphire substrate adhered to the holding surface 353. Of course, the electronic component mounting apparatus 1 may be used for mounting other types of rectangular parallelepiped electronic components (for example, packaged ones).

  The present invention can be used in various electronic component mounting apparatuses that mount an electronic component on a circuit board using ultrasonic waves.

Front view of electronic component mounting device Plan view of electronic component mounting device Enlarged view of the component holder Enlarged view of the vicinity of the holding tool Bottom view of holding tool The figure which illustrates the state where the electronic component was hold | maintained at the holding surface The figure which illustrates the state where the electronic component was hold | maintained at the holding surface The figure which illustrates the state where the electronic component was hold | maintained at the holding surface The figure which shows the comparative example of the state by which the electronic component was hold | maintained at the holding surface The figure which shows the comparative example of the state by which the electronic component was hold | maintained at the holding surface Diagram showing holding surface The figure which shows the other example of a holding surface The figure which shows the further another example of a holding surface

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Imaging part 7 Polishing part 8 Control part 9 Circuit board 33 Component holding part 34 Lifting mechanism 91 Electronic component 331 Holding tool 332 Holding part main body 333 Ultrasonic vibrator 351 Mounting part 352 Tip part 353 Holding surface

Claims (8)

An electronic component mounting apparatus for mounting an electronic component on a circuit board,
A holding unit for holding electronic components;
A pressing mechanism for pressing the electronic component held by the holding unit toward the circuit board;
An ultrasonic vibrator for applying ultrasonic vibration to the electronic component via the holding unit;
An imaging unit for imaging an electronic component held by the holding unit;
A calculation unit for obtaining a position of the electronic component relative to the holding unit based on an output from the imaging unit;
With
The holding part is
A holding body,
A tip portion protruding from the holding portion main body and having a tip surface as a holding surface for holding the electronic component by suction; and
With
The electronic component mounting apparatus according to claim 1, wherein the holding surface has a shape obtained by removing at least one pair of diagonal corners from a rectangle. The electronic component mounting apparatus according to claim 1,
The electronic component mounting apparatus, wherein the holding surface has a shape obtained by removing all corners from the rectangle. The electronic component mounting apparatus according to claim 1,
The holding surface has a shape in which only one pair of corners in a square diagonal direction is removed,
The electronic component mounting apparatus according to claim 1, wherein the ultrasonic vibrator vibrates the holding surface in a diagonal direction connecting another pair of corners of the square. The electronic component mounting apparatus according to any one of claims 1 to 3,
The length of each side of the removed portion at the removed corner of the rectangle exceeds twice the minimum distance that can be discriminated on the holding surface by the imaging unit, and is 1/3 or less of the length of each side. An electronic component mounting apparatus characterized by the above. An electronic component mounting apparatus according to any one of claims 1 to 4,
The electronic component mounting apparatus, wherein the electronic component is a bare chip. An electronic component mounting apparatus according to any one of claims 1 to 5,
An electronic component mounting apparatus, further comprising: a polishing unit that polishes the holding surface by pressing the tip while vibrating by the ultrasonic transducer. A holding tool for adsorbing and holding the electronic component in an electronic component mounting apparatus that mounts the electronic component on a circuit board using ultrasonic vibration,
An attachment part attached to the holding part body;
A tip portion protruding from the mounting portion and having a tip surface as a holding surface for holding the electronic component by suction,
With
The holding tool is characterized in that the holding surface has a shape obtained by removing at least one pair of diagonal corners from a rectangle. The holding tool according to claim 7,
The holding tool has a shape in which all corners are removed from a rectangle.

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