JP2006120888A - Manufacturing method of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component capable of forming a fine pitch conductor pattern efficiently and at low cost.
A method for manufacturing an electronic component according to the present invention includes a first step (a) of disposing a coating film 160 on a substrate 120, and a step of partially removing the coating film 160 to provide an opening 160a. 2 steps (
b), a third step (c) of applying a fluid 172 containing conductive fine particles to the coating film 160 and the opening 160a and filling the opening 160a; and curing the fluid 172 to form the conductor 174. A fourth step (d) to be formed, a fifth step (e) to be removed from the coating film 160 on the substrate 120,
It is characterized by comprising.
[Selection] Figure 1

Description

The present invention relates to a method of manufacturing an electronic component, and more particularly to a conductor pattern forming technique suitable for manufacturing a circuit board, an electro-optical device, and the like.

Conventionally, as a method of manufacturing a circuit board, a method of patterning a substrate with copper foil by etching or the like, a method of forming a conductor pattern on a substrate by plating or the like, and transferring a conductor foil constituting a wiring pattern onto the substrate Alternatively, laminating methods are known, but in these methods, plating treatment, etching treatment, photolithography (photolithograp)
hy) process is required, which increases the number of processes and complicates the process, increasing the manufacturing cost, and waste liquid treatment for reasons such as containing heavy metals in the waste liquid generated in the manufacturing process. There is a problem that it is difficult to cause environmental pollution. Further, the above-described method has a problem that it is extremely difficult to form a fine wiring pattern having a formation pitch of several tens of μm or less.

In order to solve these problems, an inkjet circuit board manufacturing method has been devised that can simplify the wiring pattern manufacturing process and does not require a large-scale manufacturing facility. For example, Patent Document 1 discloses that a large number of banks are formed on a substrate, droplets containing conductive fine particles are ejected from an ink jet head, and landed in grooves formed between the banks. A method of forming a wiring pattern by drying the liquid droplets and sintering conductive particles is described. According to this method, even when the groove between the banks is narrower than the diameter of the droplet, the spread of the droplet can be regulated by the bank, so that a wiring pattern having a fine line width can be formed with high accuracy.
JP 2003-317945 A

However, in the inkjet method manufacturing method disclosed in Patent Document 1, it is necessary not only to form a fine bank pattern with high accuracy, but also to impart water repellency to the bank so that the droplets do not spread. Since there are many restrictions in the manufacturing process, there is a problem that the manufacturing cost cannot be reduced sufficiently.

In addition, since a wiring pattern is formed by discharging droplets containing conductive fine particles from an inkjet head to a portion corresponding to each wiring, it is difficult to form the wiring pattern efficiently, and the manufacturing efficiency is increased. Therefore, it is necessary to simultaneously eject a large number of droplets from a large number of inkjet heads with high accuracy, which may increase the apparatus cost and the maintenance cost.

Therefore, the present invention solves the above problems, and an object of the present invention is to provide a method of manufacturing an electronic component capable of forming a fine pitch conductor pattern efficiently and at low cost.

The electronic component manufacturing method of the first invention includes a first step of disposing a coating film on a substrate, a second step of partially removing the coating film to provide an opening, and conductive fine particles. A third step of applying a fluid material to the coating film and the opening and filling the opening; a fourth step of curing the fluid material to form a conductor; and applying the coating film to the substrate And a fifth step of removing from the top.

According to the present invention, the coating film disposed on the substrate is partially removed to provide an opening, and a fluid containing conductive fine particles is applied to the coating film and the opening so that the opening is formed. A conductor pattern corresponding to the opening of the coating film can be formed by filling the fluid material and then forming the conductor by curing the fluid material and then removing the coating film from the substrate. At this time, since the fluid containing conductive particles is filled in the opening of the coating film by coating the coating film and the opening in the third step, high processing accuracy is achieved even when a fine conductor pattern is formed. And can be easily carried out without using high-cost or expensive equipment such as that required for plating, etching, or droplet ejection with an inkjet head. The manufacturing cost can be greatly reduced. In addition, even if the fluidized material or its cured product remains on the coating film in the third step as described above, the fluidizing material or conductor on the coating film is also removed when the coating film is removed in the fifth step. Since they are removed at the same time, it is possible to reliably prevent a short circuit of the conductor pattern, and to prevent the occurrence of defective parts even when the conductor pattern is formed with a fine pitch.

Here, an insulator or a substrate having an insulating layer on the surface is used as the substrate. The main constituent material of the substrate is not particularly limited, and examples thereof include glass, polyimide resin, acrylic resin, phenoxy resin, polyester resin, and styrene maleic acid resin. Moreover, as said coating film, the resin film which consists of a polyimide resin, an acrylic resin, etc., a dry film resist, etc. are mentioned, for example.

The fluidizing material containing conductive fine particles is usually a dispersion in which conductive fine particles are dispersed in a dispersion medium. Any dispersion medium may be used as long as it does not cause the conductive fine particles to aggregate, and examples thereof include water, hydrocarbon compounds, alcohols, and ether compounds. The conductive fine particles include, for example, metal fine particles containing gold, silver, copper, palladium, nickel, etc., conductive polymers,
Examples include superconductor fine particles. The fluidity of the fluidizing material may be any suitable for the specific method of the third step.

In the present invention, preferably, in the first step, the coating film is detachably attached to the substrate, and in the fifth step, the coating film is peeled off from the substrate. This
Since the removal of the coating film can be performed by peeling, the production efficiency can be improved, and at the same time, the manufacturing equipment is simple and the waste liquid treatment is not necessary, so that the manufacturing cost can be further reduced.

The method for manufacturing an electronic component of the second invention includes a first step of disposing a coating film on a substrate, a second step of partially removing the coating film to provide an opening, and conductive fine particles. A third step of applying a fluid material to the coating film and the opening and filling the opening, a fourth step of curing the fluid material to form a conductor, and existing on the coating film And a fifth step of removing the fluidizing material or the conductor.

According to this invention, the coating film disposed on the substrate is partially removed to provide an opening, and a fluid material containing conductive fine particles is applied to the coating film and the opening to fill the opening. Then, after forming the conductor by curing the fluid material, the conductor pattern corresponding to the opening of the coating film can be formed by removing the fluid material or the conductor existing on the coating film.
At this time, the fluid containing the conductive particles is filled in the opening by coating the coating film and the opening, so that high processing accuracy is not required even when a fine conductor pattern is formed. The manufacturing cost can be greatly reduced because it can be easily carried out without using high cost equipment or expensive equipment that is necessary when performing etching processing or discharging droplets with an inkjet head. it can. In addition, even if the fluid material or conductor remains on the coating film in the third step as described above, the fluid material or conductor on the coating film is removed in the fifth step, so that the conductor pattern is short-circuited. And the like, and even when the conductor pattern is formed with a fine pitch, the occurrence of defective parts can be prevented. Furthermore, in the present invention, since the coating film can remain between the conductor patterns even if the fifth step is performed, by forming the coating film with an insulator, there is no need to separately form an insulating layer. Also, it becomes possible to ensure insulation between conductor patterns.

In the present invention, in the fifth step, it is preferable that the fluidized material or the conductor existing on the coating film is removed by laser light irradiation. According to this, the influence on the conductor pattern is reduced as compared with the case where the fluidized material or the conductor existing on the coating film is removed by mechanical means, and it is easy even for a fine pattern. It becomes possible to respond. Note that as the removal method used in the fifth step, dry etching, plasma treatment, or the like can be used in addition to laser light irradiation. In addition, this 5th process may be implemented with respect to a fluid material between a 3rd process and a 4th process, and may be performed with respect to a conductor after a 4th process.

In the first invention and the second invention, it is preferable that in the second step, the opening is formed in the coating film by laser light irradiation. In the second step of each of the above inventions, the opening is formed in the coating film by irradiation with laser light, so that the manufacturing cost is higher than that of expensive equipment such as a photolithography step or etching treatment or a method requiring waste liquid treatment. Can be remarkably reduced, and at the same time, it is possible to easily cope with fine pattern formation.

The laser beam may be any laser beam that can penetrate the peritoneum and form an opening. For example, an excimer laser or a carbon dioxide laser (CO ₂ laser) is preferably used. Further, as the laser light irradiation mode, a method of scanning the laser light spot along the opening pattern may be used, or batch irradiation (pattern irradiation) is performed through a mask pattern corresponding to the opening formation pattern. The method may be used.

In this case, in the second step, it is desirable that the surface of the substrate exposed by forming the opening in the coating film is roughened by irradiation with the laser beam. According to this, the surface of the substrate exposed inside the opening is roughened by the irradiation of the laser beam, whereby the adhesion of the conductor pattern formed in the opening to the substrate can be enhanced. In particular, when removing the coating film by peeling in the fifth step of the first invention, it is possible to prevent at least a part of the conductor pattern from being peeled off together with the coating film. The roughening treatment of the substrate surface by the laser light irradiation can be carried out as it is after the opening is formed, so that the manufacturing cost is hardly affected.

In the first invention and the second invention, it is preferable that in the third step, screen printing using the coating film as a screen is performed. Although various application modes of the fluidizing material are conceivable, by using screen printing using a coating film as a screen, the equipment cost can be suppressed, and the fluidizing material can be quickly and easily filled into the opening. Further, since the fluidizing material is pushed into the opening by a squeegee or the like, a high-density conductor pattern can be formed, and adhesion to the substrate and reduction of electrical resistance can be achieved.

In the first and second aspects of the invention, it is preferable that the substrate is immersed in the fluidizing material in the third step. By immersing the substrate in the fluidized material as the fluidized material application mode, the equipment cost can be suppressed, and the fluidized material can be filled in the opening portion quickly and easily.

Next, an embodiment of a method for manufacturing an electronic component according to the present invention will be described in detail with reference to the accompanying drawings. In each embodiment described below, a circuit board (for example, a flexible wiring board)
As an example, the electronic component according to the present invention is not limited to the circuit board, but is a liquid crystal panel in which a wiring pattern is formed on a glass substrate, or a ceramic having a conductor pattern on a ceramic substrate. The present invention can be widely applied as a method for manufacturing various electronic components, such as ceramic electronic components such as capacitors.

[First embodiment]
FIG. 1 is a schematic longitudinal cross-sectional view schematically showing sequentially the first step (a) to the sixth step (f) of the first embodiment according to the present invention. This embodiment is a method for manufacturing a circuit board having a conductor pattern on a substrate. First, as shown in FIG. 1A, a coating film 160 is disposed on the surface of the substrate 120 in the first step. The Specifically, the coating film 160 is attached on the substrate 120. This step can be easily performed by using a known laminator or the like.

Here, the substrate 120 only needs to have an insulating surface, and an insulating substrate or a substrate having an insulating layer on the surface can be used. For example, what was comprised with insulating resin like glass, ceramics, an acrylic resin, or a polyimide resin can be used.
The substrate 120 may be a flexible flexible substrate or a solid substrate.

As the coating film 160, for example, a resin film made of an acrylic resin, a polyimide resin, or the like can be used. The thickness of the coating film 160 is preferably substantially equal to or greater than the thickness of a conductor pattern described later. The thickness of the conductor pattern varies depending on the width of the conductor pattern and the electrical resistivity. For example, when a wiring pattern formed with a pitch of about 30 μm is provided, it is generally about 3 to 10 μm. This coating film 160 is attached to the substrate 120 in a peelable state. For example, it is fixed on the substrate 120 via the adhesive layer 140 as in the illustrated example. In this case, it is preferable to use a coating film 160 in which an adhesive layer 140 is provided on one side in advance. Further, instead of using the adhesive layer 140, the substrate 120 and the coating film 16 are used.
You may stick 0 directly by methods, such as heat welding. Even in this case, it is desirable to make the coating film 160 mechanically peelable.

Next, as shown in FIG. 1B, in the second step, an opening 160a having a shape corresponding to the wiring pattern is formed in the coating film 160 by irradiating the laser beam 162. Here, the laser beam 162 may have any energy that can perforate the coating film 160. In this case, for example, an excimer laser or a carbon dioxide laser can be used as the laser light source. As an irradiation mode of the laser light 162, the laser light may be scanned along the opening formation pattern, or the laser light 162 is irradiated through a mask having an opening pattern corresponding to the opening formation pattern. May be.

In the second step, after the opening 160a is formed in the coating film 160, the surface of the substrate 120 is roughened by continuously irradiating the surface of the substrate 120 exposed through the opening 160a with the laser beam 162. It is desirable to face. Thereby, as described later, when a conductor described later is formed in the opening 160a of the coating film 160, adhesion between the substrate 120 and the conductor can be improved.

Next, as shown in FIG.1 (c), in the 3rd process, the fluidized material 17 containing electroconductive fine particles 17 is shown.
2 is filled into the opening 160 a of the coating film 160. Specifically, the fluidizing material 172 is applied onto the coating film 160 and the opening 160a, and the fluidizing material 172 is applied to the opening 1 by the squeegee 170.
Press fit into 60a. That is, in this step, screen printing using the coating film 160 as a screen is performed.

Here, the fluidizing material 172 containing conductive fine particles contains gold, silver, copper, palladium, nickel, or the like in a dispersion medium (solvent) such as water, a hydrocarbon compound, an alcohol, or an ether compound. It is a fluid in which conductive fine particles such as metal fine particles, conductive polymer, and superconductor fine particles are uniformly dispersed. The conductive fine particles are preferably nanoparticles having a particle size of about 1 to 100 nm in order to form a conductor pattern with high density and low electrical resistance. For example, “Perfect Gold” (trade name) from Vacuum Metallurgical Co., Ltd. is used as a fluid containing gold particles, and “Perfect Silver” is used as a fluid containing silver particles.
(Product name).

The concentration of the conductive particles of the fluidizing material 172 and the fluidity or viscosity of the fluidizing material 172 take into consideration the electrical resistivity of the conductor pattern to be formed, the adhesion to the substrate, the filling property to the opening 160a during printing, and the like. Set as appropriate. The squeegee 170 is preferably made of an elastically deformable material such as synthetic resin or synthetic rubber. In the second step, the squeegee 170 is used to improve the filling property of the fluid material 172 into the opening 160a and reduce the remaining amount of the fluid material 172 on the surface of the coating film 160. Although it is preferable, not only the squeegee 170 but also various filling devices capable of screen printing such as a printing roller can be used.

Next, as shown in FIG. 1D, in the fourth step, the fluidizing material 172 filled in the opening 160a of the coating film 160 is cured. The hardening process of the fluidizing material 172 may be a simple drying process for volatilizing the solvent, but is preferably a sintering process for forming a sintered body of the conductive fine particles. This firing temperature is, for example, about 1 when metal conductive fine particles are used.
It is performed for several minutes to several tens of minutes at a temperature of about 50 to 300 ° C. As a result, a conductor 174 having conductivity is formed.

Next, as shown in FIG. 1E, the coating film 160 is removed from the substrate 120 in the fifth step. In this embodiment, the coating film 160 is mechanically peeled from the substrate 120. At this time, the stress required to separate the conductor 174 in the opening 160a and the conductor 174 on the coating film 160 is smaller than the adhesion force between the conductor 174 in the opening 160a and the substrate 120. As a result, the conductor 174 existing on the coating film 160 together with the coating film 160 is removed at once,
Only the conductor 174 formed in the opening 160 a remains on the substrate 120. A conductor pattern 180 is constituted by the conductor 174 remaining on the substrate 120.

Finally, as shown in FIG. 1 (f), in the sixth step, the wiring portion 180a, which is a part of the conductor pattern 180 formed on the substrate 120, is covered with an insulator 176 such as an insulating resist, The terminal portion 180b is covered with a surface film 178 made of a conductor such as gold by plating or the like. As a result, the wiring portion 180a of the wiring pattern 180 is obtained.
In this case, short circuit between adjacent wirings is prevented, and good electrical contact property with respect to other electronic components (semiconductor IC, other circuit board, liquid crystal panel, etc.) can be realized in the terminal portion 180b. In addition, this 6th process is suitably implemented as needed, and is not limited to said aspect, Moreover, it is not necessary to provide 6th process itself.

As described above, in the method of manufacturing an electronic component according to the present embodiment, since the opening 160a is formed in the coating film 160 by the laser beam 162 after the coating film 160 is fixed on the substrate 120, photolithography is performed. Unlike the patterning method using the technique, many processes are not required, and the waste liquid treatment is unnecessary, so that the manufacturing cost can be greatly reduced. Moreover, the formation of the openings 160a by the laser light 162 can sufficiently cope with a fine pitch of about several μm, and the accuracy of the shape of the openings can be easily increased. Therefore, it is possible to easily cope with the miniaturization of the conductor pattern 180 and to increase the accuracy of the conductor pattern 180.

In this embodiment, the fluidizing material 172 containing conductive fine particles is coated with the coating film 160 and the opening 1.
Since the opening 160a is filled by application to 60a, the opening 160a
Even if the formation pattern is fine, high accuracy is not required and it is not necessary to use an expensive apparatus. Therefore, the conductor pattern 180 can be formed easily and in a short time at low cost. In particular, the fluidizing material 172 is formed by the screen printing using the coating film 160 as a screen.
By filling in a, the fluidizing material 172 can be filled reliably and with high density, so that the pattern accuracy of the conductor pattern 180 can be increased and the electrical resistance of the conductor pattern 180 is reduced. It becomes possible.

Furthermore, in this embodiment, after the conductor 174 is formed, the conductor 174 existing on the coating film 160 is removed by peeling the coating film 160 from the substrate 120 in the fifth step.
Can be removed together with the coating film 160, so that the conductor pattern 180 can be completed easily and quickly.

[Second Embodiment]
Next, with reference to FIG. 2, the manufacturing method of the electronic component of 2nd Embodiment which concerns on this invention is demonstrated.
FIG. 2 is a schematic vertical cross-sectional view schematically showing sequentially the first step (a) to the sixth step (f) of the second embodiment according to the present invention. In the present embodiment, the same parts as those in the first embodiment are only shown to that effect, and the description thereof is omitted.

In this embodiment, the coating film 260 used in the first step shown in FIG. 2A is made of a photosensitive material, and the opening 260a is formed in the coating film 260 by a photolithography method in the second step. Here, when the coating film 260 is formed of a dry film resist in the first step, the coating film 260 is adhered (specifically, thermocompression bonding) in the same manner as in the first embodiment.
Is fixed on the substrate. However, the liquid resist may be applied onto the substrate 120 by spin coating or the like. In the second step of this embodiment, FIG.
As shown in b), the coating film 260 is exposed through an exposure mask 242 corresponding to the conductor pattern (wiring pattern), and then developed to form an opening 260a.

Here, the coating film 260 is a resist made of a photosensitive polymer, and may be a positive resist in which a portion irradiated with light dissolves and disappears after development, or a negative resist in which a portion irradiated with light remains after development. A mold resist may be used.

In the third, fifth and sixth steps of the second embodiment, the coating film 160 is 260.
Except for the point replaced with, it can be implemented in the same manner as in the first embodiment.

In the fourth step of the present embodiment, the substrate 1 on which the conductor 174 is formed as shown in FIG.
The coating film 260 is removed by performing dry etching on the surface of 20. For example, the coating film 260 is preferentially removed as compared with the conductor 724 by using reactive dry etching, so that the conductor 174 in the opening 260a is left without a mask and the coating film 2 is left.
60 can be removed together with the conductor 174 on the coating film 260. Of course, the coating film 260 may be selectively removed using a mask.

In the electronic component manufacturing method of the second embodiment described above, the opening 260a is formed on the coating film 260 by photolithography, but the conductor is etched or the conductor is formed by plating. However, since waste liquid containing heavy metals is not generated, waste liquid treatment becomes unnecessary and there is no fear of environmental pollution.

Moreover, in this 2nd Embodiment, since the thin film-shaped dry film resist is used as the coating film 260, the drying process after arrange | positioning on a board | substrate compared with the case where a liquid resist is used. Since it becomes unnecessary, the number of manufacturing steps can be reduced.

[Third embodiment]
Next, with reference to FIG. 3, the manufacturing method of the electronic component of 3rd Embodiment which concerns on this invention is demonstrated.
FIG. 3 is a schematic longitudinal sectional view schematically showing the second step (b) to the sixth step (f) of the third embodiment according to the present invention in order. Of the first to sixth steps of the third embodiment, the first step, the second step, and the fourth to sixth steps are the same as those of the first embodiment.
Those explanations are omitted. Further, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof is omitted.

In the third step of the present embodiment, as shown in FIG. 3C, a coating film 160 formed by forming an opening 160a in a fluidized material 172 containing conductive fine particles housed in a container 370 or the like. The substrate 120 provided with is immersed, and then the substrate 120 is pulled up to fill the opening 160a of the coating film 160 with the fluidizing material 172.

Here, the container 370 has a size (area and depth) enough to immerse the entire substrate 120 in the fluidizing material 172, and it is most preferable that the entire substrate 120 is immersed in the fluidizing material 172 at the same time. Although it is desirable, at least all of the opening 160a may be immersed in the fluidizing material 172 as a result. The fluidizing material 172 has a relatively high fluidity (low viscosity) so that the fluidizing material 172 is completely filled in the opening 160a even if the opening 160a is configured in a fine pattern. Preferably there is. When the opening width of the opening 160a is fine, the fluidized material 172 may be filled into the opening 160a by capillary action.

In the electronic component manufacturing method according to the third embodiment described above, the opening 160a is formed in the fluidizing material 17.
By immersing in 2, the operation of filling the fluidized material 172 into the opening 160a can be performed more quickly and efficiently. In addition, the point which does not require the apparatus which requires precision and an expensive apparatus is the same as that of 1st Embodiment.

In this embodiment, the opening 160a is formed by laser light as in the first embodiment. However, the method of forming the opening in the coating film on the substrate is not particularly limited, and the second embodiment and the second embodiment. Similarly, the opening may be formed using a photolithography method.

[Fourth embodiment]
Next, with reference to FIG. 4, the manufacturing method of the electronic component of 4th Embodiment which concerns on this invention is demonstrated.
FIG. 4 is a schematic longitudinal sectional view schematically sequentially showing the fourth step (d) to the sixth step (f) of the fourth embodiment according to the present invention. Although this 4th Embodiment has from the 1st process to the 6th process, since among these, the 1st process thru / or the 3rd process and the 6th process are the same as the 1st embodiment, respectively.
Those explanations are omitted. In addition, the same reference numerals are given to the same components as those in the first embodiment, and description thereof is omitted.

In the fourth step of the fourth embodiment, as shown in FIG. 4D, the conductor 174 present on the coating film 160 is removed by the laser light 462. As a result, a short circuit between the conductors 174 is prevented, and the conductor pattern 180 is formed on the substrate 120.

Here, the laser beam 462 may be the same as the laser beam 162 of the first embodiment, and a laser light source such as an excimer laser or a carbon dioxide gas laser can be used. Further, the laser beam 46
2 may be mainly irradiated to the conductive material 174 existing on the coating film 160, or may be irradiated to the conductive material 174 substantially uniformly over the entire region where the conductor pattern 180 is formed. . In either case, the conductor 174 on the coating film 160 is removed, and the opening 16
Only the conductor 174 filled in 0a remains. In addition, by irradiation with the laser beam 462,
Not only the conductor 174 but also a part of the coating film 160 thereunder may be removed. In this way, the conductor 174 on the coating film 160 can be reliably removed without remaining.

In the fourth step, dry etching (reactive dry etching) or plasma treatment may be used instead of laser light irradiation. In reactive dry etching or plasma treatment, the conductor 174 can be easily removed by using a reactive gas such as CF ₄ .

In the electronic component manufacturing method of the fourth embodiment described above, when the conductor 174 on the coating film 160 is removed by irradiating the laser beam 462, the entire coating film 160 is peeled off from the substrate 120. Compared to the above, since there is no risk that the conductor 174 filled in the opening 160a is removed together with the coating film 160, the manufacturing yield can be increased, and a finer conductor pattern can be easily formed. it can. In this embodiment,
Since the coating film 160 remains on the substrate 120, the coating film 160 is used as the wiring pattern 180.
It can be used as (at least a part of) the inner insulation coating, and a separate insulator 176 to be coated thereafter can be dispensed with, or the coating amount can be reduced.

In addition, although the 1st process thru | or 3rd process of this 4th Embodiment are implemented similarly to 1st Embodiment, you may implement similarly to 2nd Embodiment. Moreover, you may implement the 3rd process of 4th Embodiment similarly to the 3rd process of 3rd Embodiment.

[Electronic parts]
Next, with reference to FIG. 5, a flexible substrate and a liquid crystal panel, which are examples of electronic components manufactured by the manufacturing method according to the present invention, will be described. The liquid crystal panel 500 includes a panel body 520 and a flexible substrate 540. In addition, the flexible substrate 540
Is mounted on the panel body 520 and includes a wiring pattern 540a that is conductively connected to an electrode (to be described later) of the panel body 520, and other electronic components (semiconductor IC chips) on the substrate surface.
542 is mounted. The electronic component 542 is, for example, the panel body 52.
This is a liquid crystal driver IC that drives 0.

The panel main body 520 is formed by bonding substrates 521 and 522 made of glass, plastic, or the like via a sealing material (not shown), and liquid crystal (not shown) is sealed between the substrates 521 and 522. Further, a wiring pattern 523 including a plurality of wirings having an input terminal portion on which the flexible substrate 540 is mounted is formed on the surface of the substrate 521, and each wiring in the wiring pattern 523 applies an electric field to the liquid crystal. Are electrically connected to a plurality of electrodes (not shown). Then, by applying an electric field to the liquid crystal in an appropriate manner using these electrodes, each pixel in the drive region 500A performs a predetermined optical modulation action.

The structure having the wiring pattern 523 on the substrate 521 is manufactured by any one of the manufacturing methods disclosed in the first to fourth embodiments. This makes it possible to manufacture the panel body 520 at a low cost. Even if the definition of the panel main body is high, the high-density and fine wiring pattern 523 can be reliably formed by using the manufacturing method of this embodiment.

The flexible substrate 540 is obtained by forming a wiring pattern 540a on a flexible substrate made of polyimide resin or the like, and any one of the manufacturing methods disclosed in the first to fourth embodiments. It is manufactured by. Each wiring in the wiring pattern 540a is conductively connected to an input terminal of each wiring in the wiring pattern 523. Further, in the flexible substrate 540, a portion of the wiring pattern 540 a that is conductively connected to the input terminal and a portion that is conductively connected to the electronic component 542 are the terminal portion 180.
It is configured as b, and other portions are insulatively covered as the wiring portion 180a.

The liquid crystal panel 500 corresponding to the electronic component in the present embodiment, or the panel body 520
And when manufacturing the flexible substrate 540, by applying the above manufacturing method,
The wiring patterns 523 and 540a can be formed at low cost, and the manufacturing efficiency and the yield can be improved. In addition, since it can be reliably and accurately formed even with a fine pitch, it is possible to easily cope with high definition of the liquid crystal panel 500.

As electronic components applicable to the present invention, in addition to those described above, electro-optical devices such as organic electroluminescence panels, plasma display panels, and electrophoretic display devices, and various semiconductor devices (semiconductor ICs, etc.) And ceramic electronic components.

FIG. 6 is a schematic perspective view showing an electronic device on which an electronic component manufactured by the manufacturing method according to the present invention is mounted. The electronic device (mobile phone) 1000 includes an operation unit 1001 and a display unit 10.
02, and a circuit board 1100 is arranged inside the display portion 1002. The liquid crystal panel 500 is mounted on the circuit board 1100, and the drive region (display region) 500 </ b> A of the liquid crystal panel 500 is visible from the surface of the display unit 1002. The electronic device 1000 is not limited to the illustrated mobile phone, but may be a portable information terminal, an electronic watch,
Various electronic devices such as a television device and a monitor device can be given.

Note that the present invention is not limited to the illustrated examples described above, and various modifications can be made without departing from the scope of the present invention.

The schematic longitudinal cross-sectional view which shows typically the 1st process (a) thru | or 6th process (f) of 1st Embodiment sequentially. The schematic longitudinal cross-sectional view which shows typically the 1st process (a) thru | or 6th process (f) of 2nd Embodiment sequentially. The schematic longitudinal cross-sectional view which shows typically the 2nd process (b) thru | or 6th process (f) of 3rd Embodiment sequentially. The schematic longitudinal cross-sectional view which shows typically the 4th process (d) thru | or 6th process (f) of 4th Embodiment sequentially. The schematic perspective view which shows the external appearance of the liquid crystal panel which is an example of the electronic component manufactured by each embodiment. The schematic perspective view which shows the external appearance of an example of the electronic device carrying the electronic component manufactured by each embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 120 ... Board | substrate, 140 ... Adhesive layer, 160, 260 ... Coating film, 160a, 260a ... Opening part, 162, 462 ... Laser beam, 170 ... Squeegee, 172 ... Fluidizing material, 174 ... Conductor, 1
76 ... Insulator, 178 ... Surface film, 180 ... Conductor pattern, 180a ... Wiring part, 180b ...
Terminal part, 370 ... Container, 500 ... Liquid crystal panel, 500A ... Driving region, 520 ... Panel body, 523, 540a ... Wiring pattern, 540 ... Flexible substrate, 542 ... Electronic component, 1
000 ... electronic device, 1001 ... operation unit, 1002 ... display unit, 1100 ... circuit board

Claims (8)

A first step of disposing a coating film on the substrate;
A second step of partially removing the coating film and providing an opening;
A third step of applying a fluid material containing conductive fine particles to the coating film and the opening and filling the opening;
A fourth step of curing the fluidizing material to form a conductor;
A fifth step of removing the coating film from the substrate;
The manufacturing method of the electronic component characterized by comprising. In the first step, the coating film is detachably attached to the substrate,
The method for manufacturing an electronic component according to claim 1, wherein in the fifth step, the coating film is peeled off from the substrate. A first step of disposing a coating film on the substrate;
A second step of partially removing the coating film and providing an opening;
A third step of applying a fluid containing conductive fine particles to the coating film and the opening and filling the opening;
A fourth step of curing the fluidizing material to form a conductor;
A fifth step of removing the fluidizing material or the conductor present on the coating film;
The manufacturing method of the electronic component characterized by comprising. 4. The method of manufacturing an electronic component according to claim 3, wherein in the fifth step, the fluidizing material or the conductor existing on the coating film is removed by laser light irradiation. 5. 5. The method of manufacturing an electronic component according to claim 1, wherein, in the second step, the opening is formed in the coating film by laser light irradiation. 6. 6. The electronic component according to claim 5, wherein, in the second step, the surface of the substrate exposed by forming the opening in the coating film is roughened by irradiation with the laser beam. Manufacturing method. The method for manufacturing an electronic component according to claim 1, wherein in the third step, screen printing is performed using the coating film as a screen. The method of manufacturing an electronic component according to any one of claims 1 to 6, wherein in the third step, the substrate is immersed in the fluidizing material.

Images