JP2006100594A - Component mounting method and component mounting apparatus - Google Patents

Abstract

The present invention detects and avoids in advance the possibility of interference with a component mounted on a substrate, which occurs due to replacement of a supply component.
In a component mounting apparatus having a mounting head for holding and transporting a component and mounting the component on a board, a component mounting method for determining the order in which the components are mounted, the height information of the component being obtained. A height information acquisition step S504 acquired before the mounting head transports the component, and a mounting order determination step S506 for determining a component mounting order based on the component height information acquired in the height information acquisition step; To solve.
[Selection] Figure 7

Description

  The present invention relates to a component mounting apparatus for mounting a component such as an electronic component on a substrate such as a printed wiring board.

  In recent years, electronic devices have been miniaturized and enhanced in functionality. Accordingly, electronic components used in electronic devices have also been miniaturized, and these small electronic components have been mounted on a printed circuit board at high density. It is becoming.

  In order to industrially mount electronic components on a substrate, a component mounting apparatus is used. The component mounting apparatus is an apparatus that includes a component supply unit that holds and supplies various types of electronic components, and a mounting unit that holds, conveys, and mounts the electronic components supplied from the component supply unit on a substrate. is there.

  In addition, the component supply unit includes a plurality of component supply means that hold a large number of the same parts in a horizontal row. By providing a plurality of the component supply means, various types of electronic components can be used as the mounting means. It is possible to supply.

  In the present specification and claims, “same part” or “same electronic part” means a part having the same function, for example, the same electrical characteristics and the same external shape. Use as meaning. The “functionally identical component” or “functionally identical electronic component” means a component having the same function, and is used to include components having different external shapes, particularly, component heights.

  In such a component mounting apparatus, as the electronic components mounted on the substrate are reduced in size and increased in density, the electronic components are held more than the diameter of the suction nozzle for holding the component suction provided in the mounting means. When an electronic component having a high height is already mounted around the electronic component Y, the electronic component Y already mounted on the substrate P interferes with the suction nozzle 1001 as shown in FIG. There is a possibility that X cannot be mounted or a mounting failure occurs.

In view of this, the invention described in Patent Document 1 below takes an image of the electronic component suction state and the height of the electronic component held by the mounting means for mounting on the substrate with a camera during transportation of the electronic component. Check and analyze the positional relationship with the electronic components already mounted on the board, and if it is determined that interference will occur when mounting the electronic components currently being transported, mounting the components held by the mounting means By canceling, the inability to install and troubles due to interference are avoided.
JP 2003-243898 A

  However, when it is determined that the apparatus described in Patent Document 1 interferes when mounting an electronic component, the mounting is simply stopped, and the root cause of the interference is not removed. That is, this conventional apparatus detects the occurrence of a defect such as component interference after the component is adsorbed to the mounting means, that is, after the mounting of the component is started, and the stage before the mounting means adsorbs the component. In other words, it is not intended to detect and prevent the possibility of a problem occurring before the start of component mounting.

  In general, the interference based on the height of the component can be avoided by examining the height of the component in advance and mounting the component in order from the component having the lowest height. However, when electronic parts having the same function are purchased from a plurality of manufacturers, or when production lots of electronic parts are different, the heights of the electronic parts having the same function may be different. If electronic components with the same function are exchanged under such circumstances, the interference will occur due to the difference in the mounting order based on the height of the electronic components investigated in advance and the actual height of the electronic components to be mounted. become.

  In this case, the invention described in Patent Document 1 simply gives a warning that interference will occur and stops the operation, and does not lead to a fundamental solution. In addition, investigating the height of electronic components by each time the electronic components are replaced increases the possibility of human error, and even if the height of the electronic components is measured accurately, the mounting order of the electronic components It is not easy to change the operation at the operation site, and there is a problem that the operation must be stopped while the installation order is changed.

  The present invention has been made in view of the above problems, and even if there is a possibility that interference may occur based on the height of a component, the possibility of interference is grasped in advance, and a situation in which interference does not occur. An object is to provide a component mounting method and a component mounting apparatus that can be realized.

  In order to achieve the above object, a component mounting method according to the present invention determines the order of mounting components in a component mounting apparatus having mounting means for holding and transporting the components and mounting the components on a board. In the component mounting method, the height information of the component acquired in the height information acquisition step, the height information acquisition step of acquiring the height information of the component before the mounting means transports the component to the mounting position of the board, and the height of the component acquired in the height information acquisition step A mounting order determining step for determining a mounting order of components based on the height information.

  As a result, the height information of the parts is acquired before the parts are transferred onto the board, and the mounting order is determined based on the height information. Therefore, the possibility of interference based on the height of the parts is determined before mounting the parts. It is possible to detect and remove the root cause of such interference.

  The height information acquisition step may further include acquiring height information of a component when the mounting unit contacts the component.

  Thereby, since the height of the component actually mounted can be measured, it is possible to surely grasp the height.

  The component mounting apparatus includes a component supply unit including a plurality of component supply units that provide the same component to the mounting unit, and the height information acquisition step further acquires component height information when the component supply unit is replaced. This may be a feature.

  Thereby, it becomes possible to grasp the height of the component at the time when the height of the component is likely to be different.

  The height information acquisition step may further be characterized in that the height of the component is calculated and acquired from the amount of movement of the mounting unit when the mounting unit moves from a predetermined position until it contacts the component.

  Thus, the height of the component can be acquired without providing a separate device for height measurement.

  The height information acquisition step may further acquire component height information from a height information storage unit provided in the component supply unit.

  Thereby, it is possible to easily obtain the height information, and it is particularly preferable to obtain the information from the IC tag because the height information can be obtained without contact.

  The component mounting method further includes a push amount control step for controlling a push amount of the component when the mounting means mounts the component on the board based on the height information of the component acquired in the height information acquiring step. It may be characterized by including.

  As a result, it is possible to avoid damage to the component and the board due to excessive pressing when the mounting device pushes the component into the substrate, and mounting failure of the component from the acquired component height information.

  In addition, the present invention can be realized not only as such a component mounting method, but also as a component mounting apparatus including elements that realize characteristic steps constituting such a component mounting method, a program including the steps, and Also, it becomes possible to obtain the same operation and effect as described above even on a recording medium such as a computer-readable CD-ROM in which the program is recorded.

  According to the present invention, it is possible to predict interference based on the height of a component that would occur if the component was mounted before mounting the component on the board.

  Furthermore, it is possible to determine the mounting order of components that do not cause the interference, and to obtain high mounting quality.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an appearance of a component mounting apparatus 10 according to the present embodiment.

  A component mounting apparatus 10 shown in FIG. 1 is a mounting apparatus that mounts a plurality of types of electronic components on a printed circuit board constituting an electronic device at a high speed, a rotary head 100 that picks up, conveys, and mounts the components, and a variety of types. A component supply unit 11 that supplies electronic components to the rotary head 100 and an XY table 15 that moves the mounted printed circuit board in the horizontal plane direction are provided.

  As shown in the upper part of FIG. 2, the rotary head 100 includes 18 mounting heads 103 as mounting means for mounting electronic components on a printed circuit board. The mounting head 103 is attached to a rotating base 101 that rotates without moving in the height direction so as to be movable in the height direction, and can hold a component by vacuum suction (not shown). 6 are provided. FIG. 2 is a perspective view schematically showing the positional relationship between the component supply unit 11 and the rotary head 100.

  As shown in the lower part of FIG. 2, the component supply unit 11 includes component supply means 111 that can sequentially supply the same components to the mounting head 103 in a horizontal row. The component supply unit 11 has a function of selecting an electronic component to be mounted by shifting the component supply unit 11 in the Z-axis direction in FIG.

  In the case of this embodiment, the component supply means 111 sequentially supplies the reel 113 around which the component tape 110 that holds a large number of the same electronic components as shown in FIG. 3 is wound and the electronic components held on the component tape 110. And a tape feeder 114 that is detachable from the component supply unit 11. That is, the component supply unit 111 corresponds to a component that provides one type of component, and the component supply unit 11 corresponds to a set of the component supply unit 111 (or further includes a storage unit that holds the set). To do.

  FIG. 4 is a diagram schematically showing the positional relationship among the rotary head 100, the component supply unit 11, and the printed circuit board P.

  As shown in the figure, the rotary shaft of the rotary head 100 does not move, and the mounting head 103 provided around the rotary shaft rotates intermittently to perform work corresponding to each position. Briefly, the mounting head 103 positioned above the suction opening 112 provided in each of the component supply means 111 (FIG. 4: position B) sucks the electronic component through the suction opening 112 and faces the position ( FIG. 4: When the mounting head 103 is positioned at the position E), the electronic component sucked on the printed circuit board P is mounted.

  The printed circuit board P, on which electronic components are to be mounted, is placed on an XY table (not shown) that can move in the horizontal plane, and the position where the electronic components are to be mounted is moved by moving the printed circuit board P. It is determined.

  FIG. 5 is a flowchart showing the operation of the mounting head 103 when attention is paid to one of the mounting heads 103 provided in the rotary head 100.

  The mounting head 103 present at the selection position (FIG. 4: position A) of the suction nozzle 102 selects the suction nozzle 102 that is suitable for the electronic component to be mounted next (S401). Next, the rotation base 101 is rotated until the mounting head 103 is positioned at the suction portion (FIG. 4: position B) (S402). At this position, the mounting head 103 sucks and holds the electronic component from the suction opening 112 of the component supply unit 111 using the suction nozzle (S403).

  Next, the rotation base 101 is rotated until the mounting head 103 is positioned at the recognition unit (FIG. 4: position C) (S404). Then, an image of the electronic component sucked and conveyed by the camera provided at this position is captured and analyzed to recognize the sucked state of the electronic component (S405). The recognition of the suction state is to detect the amount of two-dimensional deviation between the center of the electronic component and the center of the suction nozzle and the amount of rotational deviation of the component. Recognition process is not possible). If it is determined that there is a problem in the sucked state such as a missing electronic component (S406: Y), the sucked component is discarded (S410). On the other hand, if it is determined that there is no malfunction (S406: N), the electronic component is corrected in the θ direction based on the rotational deviation detected earlier at the position D shown in FIG. 4 (S407). The two-dimensional deviation amount is corrected by finely adjusting the position of the printed board using the XY table 15. Next, the rotation base 101 is rotated until the mounting head 103 is positioned at the mounting portion (FIG. 4: position E) (S408). Then, the mounting head 103 is moved downward according to the height of the electronic component on which the mounting head 103 is mounted, and the electronic component is pushed into and mounted on the printed circuit board P (S409).

FIG. 6 is a block diagram showing the configuration of the component mounting apparatus 10 according to the present embodiment.
As shown in the figure, the component mounting apparatus 10 includes the rotary head 100 and the component supply unit 11 described above, a height information acquisition unit 12 as a height information acquisition unit, and a mounting order as a mounting order determination unit. The control part of the determination part 13 and the pressing amount control part 14 as a pressing amount control means is provided.

  The height information acquisition unit 12 calculates and analyzes a signal acquired when the mounting head 103 picks up an electronic component from the component supply unit 111 and has a function of acquiring information on the height of the electronic component. It is. A specific method for acquiring the signal will be described later.

  The mounting order determination unit 13 acquires the height information of the parts obtained by the height information acquisition unit 12, and compares the height information of other types of electronic components set in advance with the height information. It is a processing unit that controls the movement of the component supply unit 11 so as to be mounted on the printed circuit board in order from the lowest electronic component.

  The pushing amount control unit 14 acquires the height information of the component obtained by the height information obtaining unit 12, and controls the pushing amount (movement amount) of the mounting head 103 when mounting the electronic component on the printed circuit board. It is a processing unit.

  As a result, even when the electronic component is replaced with an electronic component having the same function and a different height, it is possible to avoid damage to the substrate and the electronic component due to excessive pressing of the electronic component and mounting failure due to insufficient pressing.

  Next, when the supply of all the electronic components that have been held is completed (for example, the supply has been terminated due to a component being cut off), the component supply means 111 is removed, and a new component supply means 111 that holds electronic components with the same function is attached. The operation of the component mounting apparatus 10 will be described.

  FIG. 7 is a flowchart showing the operation of the component mounting apparatus 10 based on the replacement of the component supply means 111.

  When the component mounting apparatus 10 recognizes the replacement of the component supply unit 111 (S501: Y), the component supply unit 11 is moved so that the newly installed component supply unit 111 is positioned at the suction unit (FIG. 4: position B). (S502).

  Next, the mounting head 103 in which the suction nozzle 102 that matches the electronic component held in the newly attached component supply means 111 is selected is moved to the suction position (FIG. 4: position B) (S503).

  Next, the mounting head 103 is moved downward to measure the height of the electronic component (S504). Details of the height measurement will be described later. If the height of the electronic component measured here is outside the allowable range (S505: Y), the mounting order determination unit 13 changes the mounting order, that is, the component supply means that holds the electronic component having a low height. The movement of the component supply unit 11 is changed so as to be located at the suction position (FIG. 4: position B) in order from 111 (S506). A specific example of changing the mounting order will be described later.

  FIG. 8 is a diagram schematically showing the state of height measurement of the electronic component. The figure is a diagram for explaining each function, and is different from the actual shape, size, and arrangement.

  As shown in the figure, the electronic component X is placed on a reference portion 601 (corresponding to a surface existing in the suction opening 112 of the component supply means 111).

  On the other hand, the mounting head 103 equipped with the suction nozzle 102 is connected to a constant distance portion 602 having a constant distance from the reference portion 601 and an elastic body 603 such as a coil spring or rubber, and can move freely in the vertical direction. . Further, the mounting head 103 includes a flow meter 104 as contact detection means for measuring the flow rate of air passing through the suction nozzle 102.

  Next, in order to measure the height of the electronic component X, first, the mounting head 103 in a suckable state is moved downward. At this time, in a state where the suction nozzle 102 is not sucking the electronic component X (FIG. 8A), since the air flows from the opening end of the suction nozzle 102, the flow meter 104 shows a flow rate value equal to or higher than the threshold value. When the mounting head 103 is further moved downward and the suction nozzle 102 sucks the electronic component X (FIG. 8B), the flow of air into the suction nozzle 102 is blocked, so the flow meter 104 is below the threshold value, A flow rate of 0 is indicated. At this time, it is detected that the suction nozzle 102 (or mounting head 103) has come into contact with the electronic component.

  The height information acquisition unit 12 moves the mounting head 103 when the flow meter 104 indicates a flow rate of 0 (that is, the mounting head 103 moves when the mounting head 103 moves from the reference position L until it contacts the electronic component). The height information of the electronic component X is acquired from the movement amount (M), the reference position L of the mounting head, and the distance from the reference portion 601 to the constant distance portion 602. For example, when it is known in advance that the height of the electronic component is H1 when the movement amount of the mounting head 103 is M1, if the movement amount of the mounting head 103 is detected as (M1 + ΔM), As height information, (H1-ΔM) is specified.

  The movement amount M is detected by a movement amount detection means. In this embodiment, the movement amount M is calculated by magnetically detecting the degree of expansion of the elastic body 603.

  The contact detection means is not limited to the flow meter 104, and a light amount sensor for detecting the amount of light is installed at a position facing the inside of the suction nozzle 102, and the value obtained from the light amount sensor is equal to or less than a threshold value. It may be determined that the electronic component is in contact with the suction nozzle 102. This is determined from the fact that the external light is blocked because the electronic component and the suction nozzle 102 are in contact with each other.

  Further, a pressure sensor may be provided in the mounting head, and the contact may be directly detected based on the pressure when the suction nozzle 102 contacts the electronic component.

FIG. 9 is a diagram schematically illustrating a case where the mounting order of electronic components is changed.
The height information of the various electronic components X held in the component supply unit 11 is acquired in advance, and the component supply means 111 is arranged in the order of the height of the electronic components X as shown in FIGS. Are lined up. The movement of the component supply unit 11 is controlled so as to supply the electronic components in order from the electronic component X having the lowest height, that is, in the order of the arranged component supply means 111.

  Next, it is assumed that there is no electronic component held in the third component supply unit 111 from the left, and the component supply unit 111 holding the same functional electronic component X is replaced.

  Here, as a result of acquiring the height of the newly set electronic component X by the height information acquisition unit 12 as described above, the height of the electronic component is the fifth from the left as shown in FIG. Assume that the height of the third electronic component from the left is higher than the height of the electronic component located. In this case, if the electronic component X is supplied and mounted in order from the end of the component supply means 111 in accordance with the movement of the component supply unit 11 set in advance, the third electronic component X from the left with the highest height is It is mounted on the printed circuit board before the fourth or fifth electronic component X from the lower left, and is mounted first when mounting the fourth electronic component X from the left on the printed circuit board. There is a possibility that the third electronic component from the left and the suction nozzle interfere with each other.

  Therefore, the mounting order determination unit 13 reconstructs the mounting order from the height information of each electronic component X acquired in advance, and the component supply unit 111 picks up the components in the order given at the bottom of FIG. The movement of the component supply unit 11 is controlled so as to be arranged in the unit.

  As described above, whenever the component supply unit 111 is replaced, the height information of the electronic component held by the replaced component supply unit 111 is acquired at the time of suction before the electronic component is transported onto the substrate. Thus, it is possible to determine in advance the order in which the interference can be avoided. Therefore, it is possible to avoid the generation of a defective printed board due to interference, and the mounting quality can be improved.

  Further, since the height acquisition of these parts and the determination of the mounting order are automatically performed, it is possible to avoid human error and labor for manual replacement work, and it is possible to improve work efficiency.

  Next, the component mounting apparatus 10 that has determined the mounting order mounts electronic components according to the determined order.

  The electronic component is mounted by pressing the electronic component adsorbed by the mounting head 103 located at the mounting portion (FIG. 4: position E) into the printed board. Here, when the electronic component held in the component supply means 111 after replacement is mounted, since the height of the electronic component set in advance and the height of the electronic component actually held are different, the pushing amount The control unit 14 controls the mounting head 103 so that the push-in amount is optimized based on the component height information acquired at the time of determining the mounting order.

  As described above, even if there is a difference in the height of the electronic component due to the replacement of the component supply means 111, it is possible to avoid poor connection with the printed circuit board due to insufficient push-in of the electronic component or damage to the electronic component or printed circuit board due to excessive push-in. Is possible.

  As mentioned above, although embodiment of this invention was described, this invention is not necessarily limited to the said embodiment.

  For example, an IC tag, which is a height information storage unit, is attached to each of the component supply units 111, the height information of the electronic component corresponding to the IC tag is stored, and the height is increased every time the component supply unit 111 is replaced. The information acquisition unit 12 may acquire the height information of the electronic component by reading the information stored in the IC tag. This makes it possible to omit the height measuring means as described above. The IC tag may be attached to a component tape 110 provided in the component supply means 111, a reel 113 around which the tape is wound, and a tape feeder 114 corresponding thereto. The IC tag is an RFID (Radio Frequency Identification) that includes an IC memory and can read and write information from a reader / writer without contact.

  Also, the height information of the electronic component can be acquired only when replacing the electronic component in which the diameter of the nozzle tip holding the electronic component is larger than the size of the electronic component and the tip of the nozzle protrudes from the electronic component. It doesn't matter.

  In this embodiment, the combination of the component tape 110, the reel 113, and the tape feeder 114 is exemplified as the component supply unit 111. However, the component supply unit 111 is not limited to this, and an electronic component is stored in the case. However, the type or the like of the bulk feeder that sequentially provides electronic components from the case is not limited as long as the components can be provided.

  Further, in the present embodiment, the rotary head type component mounting apparatus is illustrated, but a general-purpose mounting machine that moves the mounting head between the component supply unit and the mounting substrate by an XY robot, in particular, a plurality of mounting devices as shown in FIG. The present invention can also be applied to other types of component mounting apparatuses such as a modular mounter type component mounting apparatus that holds and mounts electronic components at once.

  The present invention can be applied to a component mounting apparatus that mounts components on a substrate, and in particular, can be applied to a component mounting apparatus that mounts components on a substrate with high density.

It is a perspective view which shows the external appearance of the component mounting apparatus concerning embodiment. It is the perspective view which showed schematically the positional relationship of a components supply part and a rotary head. It is a perspective view which shows an electronic component, the component tape holding this, and the reel around which this was wound. It is the figure which showed typically the relationship between the position of a mounting head, and the work content. It is a flowchart which shows the operation | movement of the said mounting head at the time of paying attention to one of the mounting heads. It is a block diagram which shows the structure of the component mounting apparatus concerning embodiment. It is a flowchart which shows operation | movement of the component mounting apparatus based on replacement | exchange of a component supply means. It is a figure which shows typically the state of the height measurement of an electronic component. It is the figure which showed typically the case where the mounting order of an electronic component is changed. It is a perspective view which shows a modular mounter type component mounting apparatus exemplarily. It is a side view which shows typically the interference state of the nozzle which adsorbs and hold | maintains components, and the components already mounted | worn.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting apparatus 11 Component supply part 12 Height information acquisition part 13 Mounting order determination part 14 Push amount control part 15 XY table 100 Rotary head 101 Rotary base 102 Adsorption nozzle 103 Mounting head 104 Flowmeter 110 Component tape 111 Component supply means 112 Suction opening 113 Reel 114 Tape feeder 601 Reference part 602 Constant distance part 603 Elastic body

Claims (21)

In a component mounting apparatus having a mounting means for holding and transporting a component and mounting the component on a board, a component mounting method for determining the order of mounting the components,
Height information acquisition step for acquiring the height information of the component before the mounting means conveys the component to the mounting position of the board;
A mounting order determination step for determining a mounting order of components based on the height information of the components acquired in the height information acquisition step.   The component mounting method according to claim 1, wherein the height information acquisition step further acquires component height information when the mounting unit abuts on the component. The component mounting apparatus further includes a component supply unit including a plurality of component supply means for providing the same component to the mounting means,
2. The component mounting method according to claim 1, wherein the height information acquisition step further acquires component height information when the component supply means is replaced.   The height information acquisition step further includes calculating and acquiring the height of the component from the amount of movement of the mounting unit when the mounting unit moves from a predetermined position until it contacts the component. Component mounting method. The mounting means further includes a suction nozzle for holding the component by vacuum suction,
The height information acquisition step further calculates and acquires the height of the component from the amount of movement of the mounting means when the mounting means moves from a predetermined position to a position where the air flow rate in the suction nozzle becomes a predetermined threshold. The component mounting method according to claim 4.   The height information acquisition step further includes the height of the component based on the amount of movement of the mounting means when the mounting means moves from a predetermined position to a position where the amount of light in the region facing the part surface to be held by the mounting means becomes a predetermined threshold. The component mounting method according to claim 4, wherein the component mounting method is obtained by calculating.   The height information acquisition step further determines the height of the component from the amount of movement of the mounting means when the mounting means moves from a predetermined position to a position where the pressure when the mounting means and the component contact each other is a predetermined threshold. The component mounting method according to claim 4, wherein the component mounting method is obtained by calculation.   4. The component mounting method according to claim 3, wherein the height information obtaining step further obtains component height information from a height information storage unit provided in the component supply unit.   4. The component mounting method according to claim 3, wherein the height information acquisition step further acquires component height information from an IC (Integrated Circuit) tag provided in the component supply means. The component mounting method further includes:
2. The pressing amount control step of controlling a pressing amount of the component when the mounting means mounts the component on the board based on the height information of the component acquired in the height information acquiring step. The component mounting method described in 1. In a component mounting apparatus having a mounting means for holding and transporting a component and mounting the component on a board,
A component mounting apparatus comprising: height information acquisition means for acquiring component height information before conveying the component onto the substrate.   12. The component mounting apparatus according to claim 11, wherein the height information acquisition unit further acquires component height information when the mounting unit contacts the component. The component mounting apparatus further includes a component supply unit including a plurality of component supply means for providing the same component to the mounting means,
The component mounting apparatus according to claim 11, wherein the height information acquisition unit further acquires component height information when the component supply unit is replaced. The height information acquisition means includes
The component mounting apparatus according to claim 11, further comprising a height detection unit provided in the mounting unit. The height detecting means includes
A movement amount detection means for detecting a movement amount in the height direction of the mounting means;
Contact detecting means for detecting whether or not the mounting means is in contact with a component,
The component mounting apparatus according to claim 14, wherein the height of the component is detected from an amount of movement of the mounting unit when the mounting unit moves from a predetermined position until it contacts the component.   The component mounting apparatus according to claim 13, wherein the height information acquisition unit acquires height information from a height information storage unit included in the component supply unit.   17. The component mounting apparatus according to claim 16, wherein the height information storage means is an IC (Integrated Circuit) tag. The component mounting apparatus further includes
The component mounting apparatus according to claim 11, further comprising: a mounting order determining unit that determines a component mounting order based on the height information of the component obtained by the height information acquiring unit. The component mounting apparatus further includes
12. The pressing amount control means for controlling the pressing amount of the component when the mounting means mounts the component on the board based on the height information of the component obtained by the height information acquisition means. The component mounting apparatus described in 1. A program for determining the order in which components are mounted, targeting a component mounting apparatus having a mounting means for holding and transporting components and mounting the components on a board,
A program for causing a computer to execute the steps included in the component mounting method according to claim 1. A computer-readable recording medium on which a program for determining a mounting order of components is recorded, intended for a component mounting apparatus having mounting means for holding and transporting components and mounting the components on a board. And
A recording medium on which the program according to claim 20 is recorded.

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