JP2006100348A - Manufacturing method of physical quantity sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing physical quantity sensor by which a physical quantity sensor chip is inclined by using a pair of metallic molds which integrally mold a lead frame provided with stages, frames, connectors, and projects; and a physical quantity sensor chip arranged on the stages and the injury of an elastically deformable sheet arranged on the internal surface of one of the metallic molds can be prevented. <P>SOLUTION: The method of manufacturing physical quantity sensor includes a first clamping step of inclining the stages 7 and 9 by plastically deforming a connector 17a by pressing projecting pieces 19 and 21 by means of the internal surface F1 of one F, having the elastically deformable sheet on its internal surface F1 of the pair of metallic molds E and F by bringing the metallic molds E and F nearer to each other; and a second clamping step of fixing the lead frame in the metallic molds E and F by again bringing the molds E and F nearer to each other after the projecting pieces 19 and 21 are separated from the sheet S by separating the molds E and F from each other. In the first clamping step, the relative position of the metallic molds E and F when the molds E and F are brought nearer to each other is more separated from that of the molds E and F in the second clamping step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a physical quantity sensor that measures the azimuth and direction of a physical quantity such as magnetism and gravity.

2. Description of the Related Art Recently, mobile terminal devices such as mobile phones have appeared that have a GPS (Global Positioning System) function for displaying user position information. In addition to this GPS function, by providing a function for accurately detecting geomagnetism and a function for detecting acceleration, it is possible to detect the azimuth, direction, or movement direction in the three-dimensional space of the mobile terminal device carried by the user. it can.
In order to provide the mobile terminal device with the functions described above, it is necessary to incorporate a physical quantity sensor such as a magnetic sensor or an acceleration sensor in the mobile terminal device. Further, in order to be able to detect the orientation and acceleration in the three-dimensional space by such a physical quantity sensor, it is necessary to incline the installation surface of the physical quantity sensor chip.

Here, various types of physical quantity sensors described above are currently provided. For example, a magnetic sensor that detects magnetism and does not tilt the installation surface is known as one of them. This magnetic sensor is mounted on the surface of a substrate and is one magnetic sensor chip (physical quantity sensor chip) that is sensitive to magnetic components of external magnetic fields in two directions (X and Y directions) orthogonal to each other along the surface. And the other magnetic sensor chip that is placed on the surface of the substrate and is sensitive to the magnetic component of the external magnetic field in the direction perpendicular to the surface (Z direction).
This magnetic sensor measures the geomagnetic component as a vector in a three-dimensional space using the magnetic component detected by the pair of magnetic sensor chips.

  However, this magnetic sensor has the disadvantage that the thickness (height relative to the Z direction) increases because the other magnetic sensor chip is placed in a state of being perpendicular to the surface of the substrate. Therefore, in order to make the thickness as small as possible, a physical quantity sensor (see, for example, Patent Documents 1 to 3) in which the installation surface is inclined as described above is preferably used.

  Further, as this type of physical quantity sensor, there is an acceleration sensor as described in Patent Document 1. In this one-side beam structure acceleration sensor, the acceleration sensor chip (physical quantity sensor chip) is inclined in advance with respect to the mounting substrate, so that even if the sensor packaging is placed on the surface of the mounting substrate, it depends on the inclination direction. In addition, the sensitivity in the predetermined axis direction can be kept high, and the sensitivity in the other axis direction including the direction along the surface of the substrate can be reduced.

By the way, the above-described inclination of the physical quantity sensor chip is performed, for example, when forming a resin mold part that integrally fixes the physical quantity sensor chips 51 and 53 and the leads 55 as shown in FIG.
That is, a protruding portion 63 that protrudes in the thickness direction from the stage portions 59 and 61 in advance to a thin plate-like lead frame including the frame portion 57 including the leads 55 and the stage portions 59 and 61 supported by the frame portion 57. , 65 are formed. Then, when the frame part 57 is sandwiched between a pair of molds G and H for forming the resin mold part, the projecting parts 63 and 65 of the lead frame are pressed by the inner surface H1 of one mold H, thereby providing a stage. The parts 59 and 61 and the physical quantity sensor chips 51 and 53 attached thereto are inclined.
When forming the resin mold portion, an elastically deformable sheet 67 that prevents resin burrs on the leads 55 or easily separates the mold H and the resin is formed by a gold that defines the resin molding space. It arrange | positions to the inner surface H1 of the type | mold H (for example, refer patent document 4).
JP-A-9-292408 JP 2002-156204 A JP 2004-128473 A JP 2003-133350 A

By the way, as described above, when the physical quantity sensor chips 51 and 53 are inclined, the protrusions 63 and 65 move on the inner surface H1 while the sheet 67 is pressed against the inner surface H1 of the mold H. The sheet 67 is pulled by the protrusions 63 and 65. Here, when the elastic deformation of the sheet 67 cannot follow the pulling speed by the protrusions 63 and 65, and when the pulling amount by the protrusions 63 and 65 is long, there is a problem that the sheet 67 is torn.
The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a method of manufacturing a physical quantity sensor that can prevent damage to a sheet.

In order to solve the above problems, the present invention proposes the following means.
According to a first aspect of the present invention, there is provided a stage portion on which the physical quantity sensor chip is placed, a frame portion having leads arranged around the physical portion, a connecting portion for connecting them, and at least one of the stage portion in the vertical direction. A preparation step of preparing a lead frame made of a thin metal plate having a protruding portion protruding in one side, a bonding step of bonding the physical quantity sensor chip to each stage portion, and the physical quantity sensor chip and the lead are electrically connected A wiring step of connecting the lead frame and a sheet of elastically deformable thin film disposed on the inner surface of at least one mold of the pair of molds sandwiching the lead frame from above and below. The connecting portion and the pair of molds are moved relative to each other in a direction to approach each other, and the protrusion is pressed by the inner surface on which the sheet is arranged, and the connection A first clamping step in which at least the plastic part is deformed and the stage part is inclined with respect to the frame part, and the pair of molds are separated from each other until the protruding part and the sheet are separated from each other, A second clamping step of fixing the lead frame in the mold by moving a pair of molds in a direction approaching each other; and injecting resin into the mold to resin the lead frame and the physical quantity sensor chip The lead frame in the second clamping step when the pair of molds are moved closer to each other in the first clamping step. The physical quantity cell is characterized in that it is the same as or far from the relative position of the pair of molds when the is fixed in the mold. We have proposed a method of manufacturing a support.

  According to the physical quantity sensor manufacturing method of the present invention, in the first clamping step, the relative position of the pair of dies is the same as or more than the relative position of the pair of dies in the second clamping step of fixing the lead frame. Since the stage is stopped at a distance, the inclination angle of the stage portion due to the pressing of the protruding portion in the first clamping step is smaller than the inclination angle in the second clamping step. That is, after the stage portion is inclined in the first clamping step, the stage portion is further inclined in the second clamping step.

Since the stage portion is tilted based on the plastic deformation of the connecting portion, even if the pair of molds are separated from each other after the first clamping step, the stage portion is held in an inclined state or slightly spring-backed. As a result, the inclination returns a little. Therefore, in the second clamping step, when the relative position of the pair of molds approaches, even if the tilting angle of the stage part in the first clamping step is further inclined, or the relative position of the molds is the same, Since the stage portion is further inclined from the inclination angle of the stage portion after the spring back, in any case, the stage portion is inclined to a predetermined angle.
In the first clamping step, the sheet moves along the inner surface of the mold in a state where the protruding portion is in contact with the sheet, so that the sheet is pulled and elastically deformed by the protruding portion. Since the protrusions are separated from the sheet when they are separated from each other, the sheet is elastically restored to the state before being pulled by the protrusions.

As described above, since the inclination of the stage portion due to the pressing of the protruding portion is performed in two clamping processes, the sheet of the sheet by the protruding portion is compared with the case where the stage portion is inclined to a predetermined angle in one clamping step. The amount of elastic deformation can be reduced.
In addition, when the molds are separated from each other after the first clamping step, as described above, the sheet pulled by the protruding portion is elastically restored, and the inclined state of the stage portion is maintained. In the 2 clamp process, the contact position of the protrusion with respect to the sheet is different from the contact position in the first clamp process. Even if the relative positions of the pair of molds in the two clamping processes are the same, the contact positions are similarly different in the second clamping process after the spring back after the first clamping process. Therefore, even if the protruding portion bites into the sheet in the first clamping step and the notch is formed in the sheet, the protruding portion does not enter the notch again in the second clamping step, and the notch can be prevented from becoming large. .

  In the case where the protrusion bites into the sheet, the cutout formed in the sheet increases as the movement distance of the mold in the state where the protrusion is in contact with the sheet increases. Since the tilting of the stage part is performed in two clamping processes, the mold moves with the protruding part in contact with the sheet as compared with the case where the stage part is tilted to a desired angle in one clamping process. The distance becomes shorter. Therefore, the growth of the notch due to the pressing of the protruding portion can be suppressed.

  According to a second aspect of the present invention, in the method of manufacturing a physical quantity sensor according to the first aspect, after the first clamping step, an angle of the stage portion inclined with respect to the frame portion after the second clamping step is θ2. A method of manufacturing a physical quantity sensor is proposed in which an angle θ1 of the stage portion inclined with respect to the frame portion is set to 0.5 × θ2 <θ1 ≦ 0.8 × θ2.

  According to the physical quantity sensor manufacturing method of the present invention, when the angle θ1 of the stage portion after the first clamping step is larger than 0.5 times the angle θ2 of the stage portion after the second clamping step, The angle at which the stage portion is inclined in the second clamping step is smaller than the angle θ1 of the stage portion that is inclined in the first clamping step. In this case, the distance that the molds are brought closer to each other in the state in which the protruding portion is in contact with the sheet in the second clamping step is shorter than that in the first clamping step.

Therefore, compared to the case of the first clamping step, the length that the mold presses the protruding portion in the second clamping step is shortened, so that the amount of protrusion of the protruding portion into the sheet in the second clamping step is reduced. Can do.
The reason why the angle θ1 of the stage portion in the first clamping step is set to 0.8 times or less of the angle θ2 of the stage portion in the second clamping step is that the protrusion that moves on the inner surface of the mold in the first clamping step. This is to prevent the movement length from becoming excessively long and the sheet from being damaged based on this.

  According to a third aspect of the present invention, in the physical quantity sensor manufacturing method according to the second aspect, the relative movement speed of the pair of molds in the first clamping step is a mold clamping speed at which elastic deformation of the sheet can follow. There is proposed a method of manufacturing a physical quantity sensor, wherein a relative moving speed of the pair of molds in the second clamping step is larger than the clamping speed.

  According to the physical quantity sensor manufacturing method of the present invention, in the first clamping step, the molds are moved relative to each other at a clamping speed capable of following the elastic deformation of the sheet. The speed of the projecting portion that moves the sheet is such that the sheet is elastically deformed uniformly throughout the sheet. For this reason, in the 1st clamp process, even if the movement distance of a projection part is large, a sheet | seat does not generate | occur | produce damage. In the second clamping step in which the movement distance of the protrusion is small, even if the relative movement speed of the mold is made larger than the mold clamping speed and the sheet is locally elastically deformed, the length of the sheet pulled by the protrusion is increased. Therefore, the sheet is not damaged.

  According to a fourth aspect of the present invention, there is provided a stage portion on which the physical quantity sensor chip is mounted, a frame portion having leads arranged around the physical portion, a connecting portion for connecting them, and at least one of the stage portion in the vertical direction. A preparation step of preparing a lead frame made of a thin metal plate having a protruding portion protruding in one side, a bonding step of bonding the physical quantity sensor chip to each stage portion, and the physical quantity sensor chip and the lead are electrically connected And a sheet arrangement in which an elastically deformable thin film sheet is disposed on the inner surface of one of the molds facing the projecting portion of the pair of molds sandwiching the lead frame from above and below. The lead frame is fixed in the mold by relatively moving in the direction of bringing the pair of molds close to each other, and the sheet is disposed A clamping step of pressing the protruding portion by a surface to deform the connecting portion and inclining the stage portion with respect to the frame portion; and injecting resin into the mold to inject the lead frame and the physical quantity sensor chip A mold step of integrally molding the pair of molds with a resin, and in the clamping step, at least in the state in which the protruding portion is in contact with the sheet, the pair of metal molds is clamped at a clamping speed capable of following the elastic deformation of the sheet. The manufacturing method of the physical quantity sensor characterized by moving a type | mold relatively is proposed.

  According to the method of manufacturing a physical quantity sensor according to the present invention, in the clamping process, the sheet moves on the inner surface of the mold while the protruding part is in contact with the sheet, so that the sheet is elastically deformed by being pulled by the protruding part. Here, since the moving speed of the protruding portion is a low speed according to the mold clamping speed, only a part of the sheet does not locally extend, that is, the entire sheet can be uniformly extended.

According to a fifth aspect of the invention, in the physical quantity sensor manufacturing method according to the fourth aspect, in the clamping step, a relative moving speed of the pair of molds until the protrusion comes into contact with the sheet is set. The manufacturing method of the physical quantity sensor characterized by being larger than the said mold clamping speed is proposed.
According to the physical quantity sensor manufacturing method of the present invention, the time required for the clamping process can be shortened by making the relative movement speed of the mold larger than the mold clamping speed in a state where the protrusion and the sheet are not in contact with each other. Can do.

The invention according to claim 6 is the method of manufacturing a physical quantity sensor according to any one of claims 1 to 5, wherein, in the preparation step, a tip of the protruding portion is rounded. The manufacturing method of the physical quantity sensor characterized by including this is proposed.
According to the method of manufacturing a physical quantity sensor according to the present invention, even if the leading end of the protruding portion and the sheet come into contact with each other in the two clamping steps, the leading end of the protruding portion prevents the sheet from being cut into the sheet, It is possible to reliably prevent the sheet from being damaged due to the formation of the notch.

As described above, according to the invention according to claim 1, by performing the inclination of the stage portion by pressing the protruding portion in two clamping steps, it is possible to suppress the sheet from being excessively stretched by the protruding portion. Therefore, it is possible to prevent the sheet from being damaged.
Furthermore, even if a notch is formed in the sheet by the protruding portion in the first clamping step, the notch can be prevented from becoming large in the second clamping step, and the notch of the sheet due to the pressing of the protruding portion in each clamping step can be prevented. Since growth can also be suppressed, damage to the sheet due to this notch can also be prevented.

  According to the invention of claim 2, since the amount of protrusion of the protrusion into the sheet in the second clamping step can be made smaller than in the case of the first clamping step, the angle of the stage portion based on the protrusion of the protrusion The shift of θ2 can be reduced. Therefore, the inclination angle of the physical quantity sensor chip mounted on the stage unit can be set with high accuracy.

  According to the invention of claim 3, the time required for the second clamping step can be shortened by bringing the pair of dies closer to each other at a speed larger than the moving speed in the first clamping step in the second clamping step. Therefore, the manufacturing efficiency of the physical quantity sensor can be improved.

  According to the invention of claim 4, in the state in which the protruding portion is in contact with the sheet, the entire sheet is moved by relatively moving the pair of molds in the direction in which the pair of molds are brought closer by the clamping speed capable of following the elastic deformation of the sheet. Therefore, the occurrence of damage to the sheet due to the pulling of the protruding portion can be prevented.

  Moreover, according to the invention which concerns on Claim 5, since the time which a clamp process requires can be shortened, the manufacturing efficiency improvement of a physical quantity sensor can be aimed at.

  According to the invention of claim 6, the tip of the protrusion is rounded, so that the tip of the protrusion is not affected even if the tip of the protrusion contacts the sheet in the two clamping processes. It is possible to prevent a notch from being formed by biting into the sheet, and to reliably prevent damage to the sheet based on the formation of the notch.

1 to 8 show a first embodiment of the present invention, and a magnetic sensor (physical quantity sensor) manufactured by a manufacturing method according to this embodiment includes two magnetic sensor chips inclined with respect to each other. The direction and the magnitude of the external magnetic field are measured by using a lead frame formed by pressing and etching a metal plate made of a thin copper plate or the like.
As shown in FIGS. 1 and 2, the lead frame 1 includes two stage portions 7 and 9 for placing magnetic sensor chips (physical quantity sensor chips) 3 and 5 formed in a rectangular plate shape in plan view, and a stage portion. 7 and 9, and the stage portions 7 and 9 and the frame portion 11 are integrally formed. The frame portion 11 includes a rectangular frame portion 13 formed in a rectangular shape in plan view so as to surround the stage portions 7 and 9, and a plurality of leads 15 and 17 protruding inward from the rectangular frame portion 13. Consists of.

Here, the lead 15 is electrically connected to bonding pads (not shown) of the magnetic sensor chips 3 and 5. The lead 17 is a suspension lead for fixing the stage portions 7 and 9 to the rectangular frame portion 13, and one end portion (connecting portion) 17 a of the lead 17 is connected to the one end portion 7 a of each stage portion 7 and 9. It connects with the side edge part located in the both ends of 9a side. In addition, the side edge part of each stage part 7 and 9 has shown the edge part of the width direction of each stage part 7 and 9 orthogonal to the direction in which the two stage parts 7 and 9 are arranged.
One end portion 17a of the lead 17 is formed to be thinner than other portions of the lead 17, and can be easily plastically deformed when the stage portions 7 and 9 are inclined.

The two stage portions 7 and 9 are arranged side by side along one side of the rectangular frame portion 13 and are formed so as to place the magnetic sensor chips 3 and 5 on the surfaces 7c and 9c, respectively.
A pair of projecting pieces (projecting portions) 19 and 21 projecting toward the back surfaces 7d and 9d of the stage portions 7 and 9 are formed on the other end portions 7b and 9b of the stage portions 7 and 9 facing each other. These projecting pieces 19 and 21 are for inclining the stage portions 7 and 9. These projecting pieces 19 and 21 are formed in a substantially rod shape, and the projecting piece 19 of the stage portion 7 and the projecting piece 21 of the stage portion 9 are arranged to face each other.
Of the lead frame 1 configured in this way, the regions inside the leads 15 and 17 including the stage portions 7 and 9 are formed thinner than other portions of the lead frame 1 by photo-etching, for example, half It is formed in the thickness dimension. This photo-etching process is performed before the metal sheet is pressed.

Next, a method for manufacturing the magnetic sensor will be described.
First, the lead frame 1 described above is prepared (preparation process), and the magnetic sensor chips 3 and 5 are bonded to the surfaces 7c and 9c of the stage portions 7 and 9, respectively (adhesion process), and a wire 23 is arranged to provide a magnetic sensor. Bonding pads (not shown) arranged on the surfaces of the chips 3 and 5 are electrically connected to the leads 17 (wiring process). When the wire 23 is disposed, the bonding portion between the wire 23 and the magnetic sensor chips 3 and 5 and the bonding portion between the leads 17 are mutually changed at the stage of tilting the stage portions 7 and 9. The material of the wire 23 is preferably easy to bend and soft.

Next, as shown in FIG. 3, the rectangular frame portion 13 of the lead frame 1 is disposed on the surface E2 of the mold E having the recess E1. At this time, the leads 15 and 17, the stage portions 7 and 9, the magnetic sensor chips 3 and 5, and the protruding pieces 19 and 21 inside the rectangular frame portion 13 are arranged above the recess E <b> 1. In this state, the magnetic sensor chips 3 and 5, the stage portions 7 and 9, and the protruding pieces 19 and 21 are arranged in order from the concave portion E1 side to the upper side.
A mold F having a flat surface (inner surface) F1 is disposed above the projecting pieces 19 and 21, and is configured to sandwich the rectangular frame portion 13 of the lead frame 1 together with the mold E described above from above and below. ing. On the flat surface F1 of the mold F, a sheet S for preventing resin burrs on the leads 15 and for facilitating the separation of the mold F and the resin is disposed (sheet disposing step). The sheet S is formed in a thin film shape and is elastically deformable.

Thereafter, the mold F is moved in a direction approaching the mold E, and the tip portions 19a and 21a of the projecting pieces 19 and 21 are pressed by the flat surface F1 of the mold F on which the sheet S is arranged as shown in FIG. (First clamping step). At this time, the one end portion 17a of the lead 17 is plastically deformed so that the stage portions 7 and 9 rotate around the axis connecting the one end portion 17a of the lead 17 positioned at the side end portion of each stage portion 7 and 9, respectively. At the same time, the stage portions 7 and 9 are inclined with respect to the lead 17.
Further, at this time, the sheet S is pulled by the projecting pieces 19 and 21 because the tip portions 19a and 21a of the projecting pieces 19 and 21 move along the inner surface F1 of the mold F in a state where the projecting pieces 19 and 21 are in contact with the sheet S. The sheet S is elastically deformed. Further, at this time, the leading end portions 19a and 21a of the protruding pieces 19 and 21 bite into the sheet S, so that notches S1 and S2 are formed in the sheet S.

In this state, the flat surface F1 of the mold F on which the sheet S is arranged is not in contact with the rectangular frame portion 13 shown in FIG. 3, that is, the lead frame 1 is fixed in the pair of molds E and F. It has not been. In this state, the magnetic sensor chips 3 and 5 together with the stage portions 7 and 9 are inclined with respect to the lead 17 at a predetermined angle θ1.
Further, the moving speed (clamping speed) of the mold F in the first clamping step is large enough to follow the elastic deformation of the sheet S, that is, flat according to the movement of the mold F. The moving speed of the tip end portions 19a and 21a of the projecting pieces 19 and 21 moving on the surface F1 is large enough for the sheet S to be elastically deformed uniformly over the entire surface, and the sheet S is locally elastically deformed. It becomes harder to tear than the case.

Thereafter, the mold F is moved in a direction to separate the mold F from the mold E to a position where the leading ends 19a, 21a of the projecting pieces 19, 21 and the sheet S are separated from each other, and then the mold F is again moved to the mold. The lead frame 1 is fixed to the molds E and F by moving in a direction approaching E (second clamping step).
When the mold F is moved away from the mold E in the direction in which the mold F is separated, the sheet S is elastically restored and is in a state before being pulled by the projecting pieces 19 and 21 as shown in FIG. In addition, since the one end portion 17a of the lead 17 is plastically deformed in the first clamping step, the stage portions 7 and 9 are inclined at the predetermined angle θ1 described above even when the pair of molds E and F are separated from each other. Is held in the state.

As shown in FIG. 6, when the lead frame 1 is fixed in the molds E and F from a state where the pair of molds E and F are separated from each other, the tip end portions 19a and 19a of the projecting pieces 19 and 21 are provided. 21a comes into contact with the sheet S again, and the sheet S is pulled again by the projecting pieces 19 and 21, and is elastically deformed. However, as described above, when the protruding pieces 19 and 21 are separated from the sheet S, the sheet S is elastically restored and the inclined state of the stage portions 7 and 9 is maintained. The contact position between the tips 19a and 21a of the protruding pieces 19 and 21 and the sheet S in the process is different from the contact position in the first clamping process. Therefore, in the second clamping step, the protruding pieces 19 and 21 do not enter the notches S1 and S2 formed in the first clamping step, and the notches S1 and S2 can be prevented from becoming large.
In order to make it difficult for the tip portions 19a, 21a of the protruding pieces 19, 21 to bite into the surface of the sheet S or to reduce the size of the notches S1, S2, it is preferable to form the sheet S from a hard material, It is also preferable to form the surface of the sheet S smoothly so that the friction between the tip portions 19a and 21a of the protruding pieces 19 and 21 and the surface of the sheet S is reduced.

  When the lead frame 1 is fixed in the molds E and F in the second clamping step, the rectangular frame portion 13 shown in FIG. 3 is sandwiched between the molds E and F. That is, in the second clamping process, the molds E and F are stopped at a position closer to the first clamping process, so that the tip portions 19a and 21a of the protruding pieces 19 and 21 are further pressed by the flat surface F1 of the mold F. The magnetic sensor chips 3 and 5 together with the stage portions 7 and 9 are inclined at a predetermined angle θ2 larger than the predetermined angle θ1 in the first clamping step.

In addition, the relative position of the pair of molds E and F in the first clamping process has a relationship between the predetermined angle θ1 in the first clamping process and the predetermined angle θ2 in the second clamping process.
0.7 × θ2 ≦ θ1 ≦ 0.8 × θ2,
It is set to be. According to this relationship, since the predetermined angle θ1 in the first clamping process is larger than half of the predetermined angle θ2 in the second clamping process, the angle at which the stage portions 7 and 9 are inclined in the second clamping process is the first angle. It becomes smaller than the predetermined angle θ1 that is inclined in the clamping process. In this case, the distance by which the mold F is moved in a state where the protruding pieces 19 and 21 are in contact with the sheet S in the second clamping step is shorter than that in the first clamping step.

Accordingly, since the length of the mold F that presses the protruding pieces 19 and 21 in the second clamping step is shortened, the amount of biting of the protruding pieces 19 and 21 into the sheet S is smaller than that in the first clamping step. Become.
The reason why the predetermined angle θ1 in the first clamping step is 0.8 times or less than the predetermined angle θ2 in the second clamping step is that the protruding pieces 19 and 21 that move on the inner surface F1 of the mold F in the first clamping step. This is to prevent the movement length of the sheet S from becoming excessively long and the sheet S from being damaged based on this.

  Further, when the mold F is moved in the direction approaching the mold E in the second clamping process, the mold F is moved at a speed higher than the moving speed in the first clamping process. At this time, the moving speed of the projecting pieces 19 and 21 moving on the inner surface F1 of the mold F becomes higher than the speed at which the elastic deformation of the sheet can follow, and the elastic deformation of the sheet S accompanying this is locally detected. However, the length of the sheet S pulled by the protruding pieces 19 and 21 is smaller than that in the first clamping step.

After this second clamping step, molten resin is injected into the molds E and F with the tip portions 19a and 21a of the projecting pieces 19 and 21 pressed by the flat surface F1 of the mold F, and the magnetic sensor chip. A resin mold portion for filling 3 and 5 in the resin is formed (molding process). As a result, as shown in FIGS. 7 and 8, the magnetic sensor chips 3 and 5 are fixed inside the resin mold portion 27 in a state of being inclined with respect to each other. The resin used here is preferably a material having high fluidity so that the predetermined angles of the magnetic sensor chips 3 and 5 and the stage portions 7 and 9 are not changed by the flow of the resin.
Finally, the rectangular frame portion 13 is cut off to divide the leads 15 and 17 individually, and the manufacture of the magnetic sensor 30 is completed.

  The magnetic sensor chips 3 and 5 provided in the magnetic sensor 30 manufactured as described above are embedded in the resin mold portion 27 and inclined at a predetermined angle θ2 with respect to the lower surface 27a of the resin mold portion 27, respectively. ing. Further, the one end portions 3b, 5b of the magnetic sensor chips 3, 5 facing each other face the upper surface 27c side of the resin mold portion 27, and the surfaces 3a, 5a are inclined at an acute angle. Here, the acute angle indicates an angle θ3 formed by the front surface 7a of the stage portion 7 and the back surface 9d of the stage portion 9, and this angle θ3 is equal to the sum of the two predetermined angles θ2 described above. .

The magnetic sensor chip 3 is sensitive to magnetic components in two directions of an external magnetic field, and these two sensitive directions are directions orthogonal to each other along the surface 3a of the magnetic sensor chip 3 (A direction and B). Direction).
The magnetic sensor chip 5 is sensitive to magnetic components in two directions of an external magnetic field, and these two sensitive directions are directions orthogonal to each other along the surface 5a of the magnetic sensor chip 5 (C direction and D direction).

Furthermore, a plane defined by the A and B directions along the surface 3a (A-B plane) and a plane defined by the C and D directions along the surface 5a (C-D plane) are acute with each other. It intersects at an angle θ3.
Note that the angle θ3 formed by the AB plane and the CD plane is greater than 0 ° and not greater than 90 °. Theoretically, if the angle is greater than 0 °, the three-dimensional geomagnetic orientation Can be measured. However, in practice, the angle is preferably 20 ° or more, and more preferably 30 ° or more.

The back surfaces 15 a of the plurality of leads 15 for electrically connecting the magnetic sensor chips 3 and 5 to the outside are exposed on the lower surface 27 a side of the resin mold portion 27. One end portion 15 b of the lead 15 is electrically connected to the magnetic sensor chips 3 and 5 by a wire 23, and the connection portion is embedded in the resin mold portion 27.
For example, the magnetic sensor 30 is mounted on a substrate in a portable terminal device (not shown). In this portable terminal device, the geomagnetic direction measured by the magnetic sensor 30 is shown on the display panel of the portable terminal device.

According to the method of manufacturing the magnetic sensor 30 described above, the stage portions 7 and 9 are inclined by pressing the projecting pieces 19 and 21 separately in two clamping processes, so that the sheet formed by the projecting pieces 19 and 21 in each clamping process. Since the amount of elastic deformation of S can be reduced and the sheet S can be prevented from being stretched excessively, the sheet S can be prevented from being damaged.
Further, even if the notches S1 and S2 are formed in the sheet S by the protruding pieces 19 and 21 in the first clamping step, it is possible to prevent the notches S1 and S2 from becoming large in the second clamping step. Damage to the sheet S can also be prevented.

  When the protruding pieces 19 and 21 bite into the sheet S, the cutout formed in the sheet S increases as the moving distance of the mold F with the protruding pieces 19 and 21 in contact with the sheet S increases. In the present embodiment, the stage portions 7 and 9 are inclined by two pressing steps by pressing the projecting pieces 19 and 21, so that the stage portions 7 and 9 are inclined to a desired angle in one clamping step. Compared with the case where it carries out, the movement distance of the metal mold | die F in the state which the protrusions 19 and 21 contacted the sheet | seat S becomes short. Therefore, the growth of the notch due to the pressing of the protruding pieces 19 and 21 can be suppressed, and damage to the sheet S can be prevented.

Furthermore, the amount of biting of the protruding pieces 19 and 21 into the sheet S in the second clamping step can be made smaller than in the case of the first clamping step, so that the predetermined stage portions 7 and 9 based on the biting of the protruding pieces 19 and 21 are predetermined. The shift of the angle θ2 can be reduced. Therefore, the relative angle θ3 between the two magnetic sensor chips 3 and 5 can be set with high accuracy.
Further, since the amount of biting of the protruding pieces 19 and 21 into the sheet S in the second clamping step can be reduced, the area of the protruding pieces 19 and 21 exposed outward from the lower surface 27a of the resin mold portion 27 can be reduced. . Therefore, when the lead 15 is plated for soldering after the magnetic sensor 30 is manufactured, even if a plating film is formed on the protruding pieces 19 and 21 exposed from the lower surface 27a of the resin mold portion 27, this plating is performed. The length by which the film protrudes from the lower surface 27a of the resin mold portion 27 can be reduced, and the magnetic sensor 30 can be easily mounted on a substrate such as a portable terminal device. The formation of the plating film improves the wettability of the solder with respect to the lead 15 and is necessary for electrically connecting the lead 15 and the substrate with the solder when the magnetic sensor 30 is mounted on the substrate.

  In addition, when the mold F is moved in the direction approaching the mold E in the second clamping process, the clamping process is required by moving the mold F at a speed higher than the moving speed in the first clamping process. Since the time can be shortened, the manufacturing efficiency of the magnetic sensor 30 can be improved. In the second clamping step, the length of the sheet S pulled by the projecting pieces 19 and 21 is smaller than that in the first clamping step, so that the mold F has a higher speed than the moving speed in the first clamping step. Even if the sheet is moved, even if the elastic deformation of the sheet S by the protruding pieces 19 and 21 is locally performed, the sheet S is not damaged.

In the first embodiment, when the pair of dies E and F are separated from each other after the first clamping step, the stage portions 7 and 9 are held in an inclined state at a predetermined angle θ1. However, the inclination is not limited to this, and the inclination may be slightly returned by a slight springback. In this case, it is desirable to set the relationship with the predetermined angle θ2 in the second clamping step, 0.7 × θ2 ≦ θ1 ≦ 0.8 × θ2, where θ1 is the inclination angle after the springback.
Moreover, although the speed | rate which moves the metal mold | die F in the direction approaching the metal mold | die E in a 2nd clamp process was made larger than the time of a 1st clamp process, it is not restricted to this, For example, metal mold | dies in each clamp process The moving speeds of the mold F may be made equal. However, it is preferable that the moving speed be set to such a magnitude that the elastic deformation of the sheet S can follow.
Furthermore, the relationship between the predetermined angle θ1 in the first clamping step and the predetermined angle θ2 in the second clamping step is 0.7 × θ2 ≦ θ1 ≦ 0.8 × θ2, but is not limited to this, and at least 0 0.5 × θ2 <θ1 ≦ 0.8 × θ2.

  In addition, a pair of molds in each clamping step so that the relationship between the predetermined angle θ1 in the first clamping step and the predetermined angle θ2 in the second clamping step is 0.5 × θ2 <θ1 ≦ 0.8 × θ2. It is not limited to setting the relative positions of E and F, and may be divided into at least two clamping steps. Also in this configuration, the amount of biting of the protruding pieces 19 and 21 into the sheet S in each clamping process is smaller than that performed in one clamping process, so the relative angle θ3 of the two magnetic sensor chips 3 and 5 is. Can be set with high accuracy. In addition, since the protruding length of the plating film attached to the protruding pieces 19 and 21 exposed from the lower surface 27a of the resin mold portion 27 can be reduced, the magnetic sensor 30 can be easily mounted on a substrate such as a portable terminal device.

Further, in the first clamping process, the relative position of the pair of molds E and F is stopped at a position farther than the relative position of the pair of molds E and F in the second clamping process for fixing the lead frame 1. However, the present invention is not limited to this. For example, the relative positions of the pair of molds E and F may be stopped at the same position as in the second clamping step.
Even in the case of the above configuration, even if the spring back is generated in the first clamping process and the inclination of the stage portions 7 and 9 is slightly returned, the inclination can be further inclined from the inclination angle θ1 after the spring back in the second clamping process. Therefore, the stage portions 7 and 9 can be inclined to the predetermined angle θ2. Even in this configuration, since the contact positions of the protruding pieces 19 and 21 with respect to the sheet S are different from each other in the two clamping processes, the protruding pieces 19 and 21 bite into the sheet S and cut out in the sheet S in the first clamping process. Even if is formed, the protruding pieces 19 and 21 do not enter the notch again in the second clamping step, and the notch can be prevented from becoming large.

Next, a second embodiment according to the present invention will be described. The magnetic sensor manufacturing method according to the second embodiment is different from the first embodiment only in the clamping process. Here, only the clamping process will be described, and the description of the other processes will be omitted.
In this embodiment, after performing the same wiring process as in the first embodiment, the mold F is moved in the direction approaching the mold E to fix the lead frame 1 in the molds E and F, The protruding pieces 19 and 21 are pressed by the mold F provided with the sheet S to deform the one end portion 17a of the lead 17, and the stage portions 7 and 9 are inclined with respect to the frame portion 11 at a predetermined angle θ2 (clamping process). . Then, similarly to the first embodiment, the molding process is performed, and finally, the rectangular frame portion 13 is cut off to complete the manufacture of the magnetic sensor 30. Note that the deformation of the one end portion 17a in the clamping process may be either elastic deformation or plastic deformation.

  In the clamping process described above, the moving speed of the mold F approaching the mold E is adjusted as shown in the graph of FIG. The horizontal axis of this graph indicates the position of the mold F in the clamping process, and the larger this value, the closer the pair of molds E and F are to each other. The zero point on the horizontal axis indicates a position where the protruding pieces 19 and 21 and the sheet S are separated from each other and the mold F is sufficiently separated from the mold E. X1 indicates the position of the mold F when the tip portions 19a and 21a of the projecting pieces 19 and 21 contact the sheet S, and X2 indicates that the lead frame 1 is fixed by the pair of molds E and F. The position of the mold F is shown. X3 indicates a midway position between the contact position X1 and the fixed position X2. The vertical axis of the graph indicates the moving speed of the mold F that moves forward toward the mold E.

  As shown in FIG. 9, in the clamping process, the mold E is accelerated from the initial position (X = 0) where the projecting pieces 19 and 21 and the sheet S are separated from each other to the speed Vmax. And then decelerate to a moving speed (clamping speed) V1 sufficiently smaller than Vmax before the mold F reaches the contact position X1. Similar to the first clamping step of the first embodiment, the moving speed V1 is a speed at which the elastic deformation of the sheet S can follow, and the sheet S is moved as a whole as the protruding pieces 19 and 21 move. It is a speed that can be elastically deformed uniformly.

Thereafter, the mold F moves from the contact position X1 to the midway position X3 while further decelerating from the moving speed V1, and stops moving the mold F for a predetermined time, for example, 3 seconds at the midway position X3. This movement stop is performed in order to stabilize the plastic deformation of the one end portion 17 a of the lead 17, that is, in order to stably tilt the stage portions 7 and 9 with respect to the frame portion 11.
Finally, the clamping process is completed when the mold F moves from the midway position X3 to the fixed position X2 at a speed lower than the moving speed V1.

According to the method for manufacturing the magnetic sensor 30 described above, in the state where the protruding pieces 19 and 21 are in contact with the sheet S, the direction in which the mold F is brought closer to the mold E by the moving speed V1 at which the elastic deformation of the sheet S can follow. Therefore, the entire sheet S can be uniformly stretched by the protruding pieces 19 and 21, so that the occurrence of damage to the sheet S due to the pulling of the protruding pieces 19 and 21 can be suppressed.
In addition, since the mold F is brought close to the mold E at a speed higher than the moving speed V1 until the protruding pieces 19 and 21 come into contact with the sheet S, the time required for the clamping process can be shortened, and the manufacturing efficiency of the magnetic sensor 30 is increased. Improvements can be made.

In the second embodiment, the speed of the mold F is continuously changed in the clamping step. However, the speed of the mold F is at least from the initial position (X = 0) to the contact position X1. And the moving speed V1 may be larger than the moving speed V1 and the moving speed V1 or less between the contact position X1 and the fixed position X2. Further, when the improvement in manufacturing efficiency of the magnetic sensor 30 is not taken into consideration, the speed of the mold F from the initial position (X = 0) to the fixed position X2 may be the moving speed V1 or less.
Further, in the second embodiment, since the mold F is not separated from the projecting pieces 19 and 21 after the stage portions 7 and 9 are inclined as in the first embodiment, the one end portion 7a is plastic. Not limited to deformation, it may be elastically deformed.

Moreover, in each clamp process of the 1st, 2nd embodiment mentioned above, although the metal mold | die F moved, it is not restricted to this, The metal mold | dies E and F should just move relatively.
In the first and second embodiments, the tip portions 19a and 21a of the projecting pieces 19 and 21 have a shape that cuts into the sheet S to form a notch. .

That is, for example, as shown in FIGS. 10A and 10B, the protruding pieces 19 and 21 are formed from the back surfaces 19c and 21c to the front surfaces 19b and 21b in the punching process for forming the lead frame 1 from a metal thin plate. The tip portions 19a, 21a on the back surfaces 19c, 21c side of the projecting pieces 19, 21 may be formed into a smooth round shape.
In the case of this configuration, the leading end portions 19a, 21a of the protruding pieces 19, 21 and the sheet S are in contact with each other, but the leading end portions 19a, 21a of the protruding pieces 19, 21 have a rounded shape. Therefore, it is possible to prevent the leading end portions 19a and 21a of the projecting pieces 19 and 21 from biting into the sheet S and prevent the cutout from being formed, and to reliably prevent the sheet S from being damaged due to the formation of the cutout.

The tip portions 19a and 21a of the projecting pieces 19 and 21 are not limited to being formed by punching as described above, and the tip portions 19a and 21a of the projecting pieces 19 and 21 are at least rounded. It only has to be. That is, for example, as shown in FIG. 11, even if the tip portions 19a and 21a are bent so that the back surfaces of the tip portions 19a and 21a of the protruding pieces 19 and 21 have a convex rounded shape. I do not care. As shown in FIG. 12, this bending process is preferably performed at the same time when the projecting pieces 19 and 21 are bent with respect to the stage portions 7 and 9 using a mold or the like.
Further, when the bending process is performed, as shown in FIGS. 13 and 14, the front surfaces 19b and 21b and the back surfaces 19c and 21c of the front end portions 19a and 21a of the projecting pieces 19 and 21 are subjected to photo-etching processing, and the front ends You may form the thickness dimension of the parts 19a and 21a thinner than another part. In the case of this configuration, the tip portions 19a and 21a can be easily bent.

Further, the protruding pieces 19 and 21 are formed on the other end portions 7c and 9c of the stage portions 7 and 9 facing each other. However, the present invention is not limited to this, and at least the end portions of the stage portions 7 and 9 are formed. It only has to be formed.
Further, the protruding pieces 19 and 21 are projected to the rear surfaces 7d and 9d side of the stage portions 7 and 9, but are pressed by at least the molds E and F for forming the resin mold portion 27 so that the stage portions 7 and 9 9 and the magnetic sensor chips 2 and 3 may be configured to be inclined.

  Further, the stage portions 7 and 9 are formed in a substantially rectangular shape in plan view. However, the present invention is not limited to this, and it is sufficient that at least the magnetic sensor chips 3 and 5 are formed so as to be able to adhere to the surfaces 7a and 9a. . That is, the stage portions 7 and 9 may be formed in, for example, a circular shape or an oval shape in a plan view, or may be provided with holes penetrating in the thickness direction or formed in a mesh shape. .

In the embodiment of the present invention, the two magnetic sensor chips 3 and 5 are inclined with respect to axes parallel to each other. However, the present invention is not limited to this. For example, the reference axes orthogonal to each other are centered. The two magnetic sensor chips 3 and 5 may be inclined. In this case, the two sensitive directions (for example, the A and D directions in FIG. 7) of the two magnetic sensor chips 3 and 5 orthogonal to each other can be set along the lower surface 27a of the resin mold portion 27. The magnetism along the lower surface 27a can be accurately measured.
Furthermore, in the embodiment of the present invention, the description is applied to a magnetic sensor that detects a magnetic direction in a three-dimensional space. However, the present invention is not limited to this, and a physical quantity sensor that measures at least the azimuth and orientation in a three-dimensional space If it is. Here, the physical quantity sensor may be, for example, an acceleration sensor equipped with an acceleration sensor chip that detects the magnitude and direction of acceleration instead of the magnetic sensor chip.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

It is a top view which shows the lead frame used for the manufacturing method of the magnetic sensor which concerns on the 1st Embodiment of this invention. FIG. 2 is a side sectional view of the lead frame of FIG. 1. FIG. 2 is a side sectional view showing a method for inclining a stage portion in the lead frame of FIG. 1. FIG. 2 is a side sectional view showing a method for inclining a stage portion in the lead frame of FIG. 1. FIG. 2 is a side sectional view showing a method for inclining a stage portion in the lead frame of FIG. 1. FIG. 2 is a side sectional view showing a method for inclining a stage portion in the lead frame of FIG. 1. It is a top view which shows the magnetic sensor manufactured using the lead frame of FIG. It is a sectional side view of the magnetic sensor of FIG. It is a graph which shows the movement history of the metal mold | die in a clamp process in the manufacturing method of the magnetic sensor which concerns on the 2nd Embodiment of this invention. The protrusion piece of the lead frame used for the manufacturing method of the magnetic sensor which concerns on other embodiment of this invention is shown, (a) is an enlarged side view, (b) shows the state by which a protrusion piece is formed by punching. It is an expanded sectional view shown. It is a sectional side view which shows the magnetic sensor manufactured by the manufacturing method which concerns on other embodiment of this invention. FIG. 12 is a side cross-sectional view showing the bending process of the protruding piece in the magnetic sensor of FIG. 11. It is a sectional side view which shows the magnetic sensor manufactured by the manufacturing method which concerns on other embodiment of this invention. It is a sectional side view which shows the magnetic sensor manufactured by the manufacturing method which concerns on other embodiment of this invention. It is a sectional side view which shows the manufacturing method of the conventional physical quantity sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Lead frame, 3, 5 ... Magnetic sensor chip (physical quantity sensor chip), 7, 9 ... Stage part, 11 ... Frame part, 15, 17 ... Lead, 17a ... One end portion (connecting portion), 19, 21 ... projecting piece (projecting portion), 19a, 21a ... tip portion, 30 ... magnetic sensor (physical quantity sensor), E, F ... mold, F1 ... Flat surface (inner surface), S ... sheet

Claims (6)

A stage portion on which the physical quantity sensor chip is placed, a frame portion having leads arranged around it, a connecting portion for connecting them, and a protruding portion that protrudes at least in one of the vertical directions from the stage portion; Preparing a lead frame made of a thin metal plate having
Adhering step of adhering the physical quantity sensor chip to each stage part;
A wiring step of electrically connecting the physical quantity sensor chip and the lead;
Of the pair of molds sandwiching the lead frame from above and below, a sheet disposing step of arranging an elastically deformable thin film sheet on the inner surface of at least one mold opposed to the projecting portion;
The pair of molds are moved relative to each other in a direction close to each other to press the protruding portion by the inner surface on which the sheet is arranged, and at least plastically deform the connecting portion and incline the stage portion with respect to the frame portion A first clamping step,
The pair of molds are pulled apart from each other until the projecting portion and the sheet are separated from each other, and the pair of molds are moved again toward each other to fix the lead frame in the mold. A second clamping step;
A molding step of injecting resin into the mold and integrally molding the lead frame and the physical quantity sensor chip with resin;
The relative position of the pair of molds when the pair of molds are brought close to each other in the first clamping step is the pair of the pair of molds when the lead frame is fixed in the mold in the second clamping step. A method of manufacturing a physical quantity sensor, characterized by being the same as or farther from a relative position of a mold. The angle of the stage portion inclined with respect to the frame portion after the second clamping step is set as θ2, and the angle θ1 of the stage portion inclined with respect to the frame portion after the first clamping step is set,
0.5 × θ2 <θ1 ≦ 0.8 × θ2,
The method of manufacturing a physical quantity sensor according to claim 1, wherein: The relative movement speed of the pair of molds in the first clamping step is a mold clamping speed at which elastic deformation of the sheet can follow.
The physical quantity sensor manufacturing method according to claim 2, wherein a relative moving speed of the pair of molds in the second clamping step is larger than the mold clamping speed. A stage portion on which the physical quantity sensor chip is placed, a frame portion having leads arranged around it, a connecting portion for connecting them, and a protruding portion that protrudes at least in one of the vertical directions from the stage portion; Preparing a lead frame made of a thin metal plate having
Adhering step of adhering the physical quantity sensor chip to each stage part;
A wiring step of electrically connecting the physical quantity sensor chip and the lead;
Of the pair of molds sandwiching the lead frame from above and below, a sheet disposing step of arranging an elastically deformable thin film sheet on the inner surface of one mold facing the protruding portion;
The pair of molds are moved relative to each other in a direction to move the pair of molds closer to each other, the lead frame is fixed in the mold, the projecting portion is pressed by the inner surface on which the sheet is arranged, and the connecting portion is deformed. A clamping step of inclining the stage portion with respect to the frame portion;
A molding step of injecting resin into the mold and integrally molding the lead frame and the physical quantity sensor chip with resin;
A physical quantity sensor that relatively moves the pair of molds at a clamping speed at which elastic deformation of the sheet can follow at least in a state in which the protruding portion is in contact with the sheet during the clamping step. Manufacturing method.   5. The physical quantity sensor according to claim 4, wherein, in the clamping step, a relative moving speed of the pair of molds until the protrusion comes into contact with the sheet is larger than the clamping speed. Manufacturing method. 6. The method of manufacturing a physical quantity sensor according to claim 1, wherein the preparation step includes a processing step in which a tip of the protruding portion is rounded.

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