[go: up one dir, main page]

JP2006190764A - Surface mount type LED - Google Patents

Surface mount type LED Download PDF

Info

Publication number
JP2006190764A
JP2006190764A JP2005000691A JP2005000691A JP2006190764A JP 2006190764 A JP2006190764 A JP 2006190764A JP 2005000691 A JP2005000691 A JP 2005000691A JP 2005000691 A JP2005000691 A JP 2005000691A JP 2006190764 A JP2006190764 A JP 2006190764A
Authority
JP
Japan
Prior art keywords
resin
circuit pattern
led chip
circuit patterns
resin substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005000691A
Other languages
Japanese (ja)
Inventor
Haruyuki Watanabe
晴志 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2005000691A priority Critical patent/JP2006190764A/en
Priority to TW094142210A priority patent/TWI387123B/en
Priority to CN200510003522.8A priority patent/CN100481430C/en
Publication of JP2006190764A publication Critical patent/JP2006190764A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W90/754—

Landscapes

  • Led Device Packages (AREA)

Abstract

【課題】本発明は、樹脂基板に実装されたＬＥＤチップをトランスファーモールドによって樹脂封止する際に、モールド金型の型締め圧力が加わってもクラック、破損、うねり等を生じないような樹脂基板を使用した表面実装型ＬＥＤを提供することにある。
【解決手段】絶縁樹脂体３の表面側の対向する両縁部に一対の回路パターン４ａ、５ａが形成されており、回路パターン４ａ、５ａの内側端部４ｂ、５ｂは、円弧状に形成され、各端部４ｂ、５ｂからは夫々互いに対向するように内側に向かって一対の回路パターン４ｃ、５ｃが延びている。そして、回路パターン４ｃの先端部にはＬＥＤチップ１が実装され、ＬＥＤチップ１の上側電極はボンディングワイヤ６を介して電極パターン５ｃに接続され、ＬＥＤチップ１とボンディングワイヤ６が透光性樹脂によって樹脂封止されている。
【選択図】 図３The present invention relates to a resin substrate that does not cause cracking, breakage, undulation, etc. even when the mold clamping pressure is applied when the LED chip mounted on the resin substrate is resin-sealed by transfer molding. An object of the present invention is to provide a surface-mount type LED using LED.
A pair of circuit patterns 4a and 5a are formed on opposite edges on the surface side of an insulating resin body 3, and inner end portions 4b and 5b of the circuit patterns 4a and 5a are formed in an arc shape. A pair of circuit patterns 4c and 5c extend inward from the end portions 4b and 5b so as to face each other. The LED chip 1 is mounted on the tip of the circuit pattern 4c, the upper electrode of the LED chip 1 is connected to the electrode pattern 5c through the bonding wire 6, and the LED chip 1 and the bonding wire 6 are made of translucent resin. Resin-sealed.
[Selection] Figure 3

Description

本発明は、表面実装型ＬＥＤに関するものであり、詳しくは絶縁樹脂体の表面に回路パターンを形成した樹脂基板を使用した表面実装型ＬＥＤに関する。   The present invention relates to a surface mount LED, and more particularly to a surface mount LED using a resin substrate having a circuit pattern formed on the surface of an insulating resin body.

従来の表面実装型ＬＥＤには下記のようなものがある。それは、図７に示すように、絶縁樹脂体５０の表面側の対向する両端部に一対の回路パターン５１ａ、５１ｂが形成され、各回路パターン５１ａ、５１ｂは縁部から側面側を経て裏面側に回り込んだ状態に形成されている。また、絶縁樹脂体５０の表面側の回路パターン５１ａ、５１ｂは夫々互いに対向するように内側に向かって延びている。   Conventional surface mount LEDs include the following. As shown in FIG. 7, a pair of circuit patterns 51a and 51b are formed at opposite end portions on the front surface side of the insulating resin body 50, and each circuit pattern 51a and 51b passes from the edge portion to the back surface side through the side surface side. It is formed in a wraparound state. The circuit patterns 51a and 51b on the surface side of the insulating resin body 50 extend inward so as to face each other.

そして、上記構成の樹脂基板５２の内側に延びた回路パターン５１ａ、５１ｂのうち、一方の回路パターン５１ａの先端部には半田或いは導電性接着剤等の導電部材（図示せず）を介してＬＥＤチップ５３が実装され、ＬＥＤチップ５３の下側電極と回路パターン５１ａとの電気的導通が図られている。ＬＥＤチップ５３の上側電極はボンディングワイヤ５４を介して他方の回路パターン５１ｂに接続され、ＬＥＤチップ５３の上側電極と回路パターン５１ｂとの電気的導通が図られている。   Of the circuit patterns 51a and 51b extending to the inside of the resin substrate 52 having the above-described configuration, the LED pattern is connected to the tip of one circuit pattern 51a via a conductive member (not shown) such as solder or conductive adhesive. The chip 53 is mounted, and electrical conduction between the lower electrode of the LED chip 53 and the circuit pattern 51a is achieved. The upper electrode of the LED chip 53 is connected to the other circuit pattern 51b via the bonding wire 54, and electrical connection between the upper electrode of the LED chip 53 and the circuit pattern 51b is achieved.

更に、ＬＥＤチップ５３及びボンディングワイヤ５４が覆われるように透光性樹脂５５によって樹脂封止され、ＬＥＤチップ５３を水分、塵埃及びガス等の外部環境から保護し、且つボンディングワイヤ５４を振動及び衝撃等の機械的応力から保護するようにしたものである（例えば、特許文献１参照。）。   Further, the LED chip 53 and the bonding wire 54 are covered with resin so as to cover the LED chip 53, the LED chip 53 is protected from the external environment such as moisture, dust and gas, and the bonding wire 54 is vibrated and shocked. It protects from mechanical stress such as (see, for example, Patent Document 1).

上記従来の表面実装型ＬＥＤを製作するに際しては、透光性樹脂による樹脂封止工程に於いて、一般的にはトランスファーモールド法による樹脂成形が行なわれる。その方法を示すのが図８及び図９であり、図８は平面図、図９は図８のＡ−Ａ断面図である。ＬＥＤチップ５３が実装された樹脂基板５２をトランスファーモールド金型の上金型５６と下金型５７とで挟んで型締めし、上金型５６に設けられたキャビティ５８内に透光性樹脂５５を注入して封止樹脂成形するものである。
特開２００２−１１０８６４号公報 When manufacturing the conventional surface-mounted LED, resin molding is generally performed by a transfer molding method in a resin sealing process using a translucent resin. FIG. 8 and FIG. 9 show the method, FIG. 8 is a plan view, and FIG. 9 is a cross-sectional view taken along line AA of FIG. The resin substrate 52 on which the LED chip 53 is mounted is clamped between the upper mold 56 and the lower mold 57 of the transfer mold, and the translucent resin 55 is placed in the cavity 58 provided in the upper mold 56. Is molded by sealing resin.
JP 2002-110864 A

ところで、トランスファーモールドにおいては、モールド時に樹脂基板の不必要な部分に封止樹脂である透光性樹脂が漏れ出さないように、ＬＥＤチップが実装された樹脂基板をモールド金型の上金型と下金型とで挟んで圧縮荷重による型締めが行なわれる。その際、樹脂基板には型締めによる荷重が加わるためにクラック６１が発生する可能性がある。   By the way, in the transfer mold, the resin substrate on which the LED chip is mounted is used as an upper mold of the mold die so that the translucent resin as the sealing resin does not leak to unnecessary portions of the resin substrate at the time of molding. Clamping by compression load is performed by sandwiching with the lower mold. At that time, there is a possibility that the crack 61 may occur because a load due to mold clamping is applied to the resin substrate.

クラック６１の発生は絶縁樹脂体に形成された回路パターンの形状と圧縮荷重による加圧位置との関係に因るところが大きく、上記表面実装型ＬＥＤは樹脂基板に最もクラック６１の発生し易い形態となっている。   The generation of the crack 61 is largely due to the relationship between the shape of the circuit pattern formed in the insulating resin body and the pressure position due to the compressive load, and the surface mount LED has the form in which the crack 61 is most easily generated on the resin substrate. It has become.

なぜならば、絶縁樹脂体５０に形成された一対の回路パターン５１ａ、５１ｂの夫々の内側端部５９ａ、５９ｂが直線状に形成され、該直線状の回路パター５１ａ、５１ｂの端部５９ａ、５９ｂの夫々と、同様に直線状に設けられたモールド金型の上金型５６のキャビティ５８開口縁部６０ａ、６０ｂとが線接触した状態で圧縮荷重される。そのために全ての荷重が回路パター５１ａ、５１ｂの端部５９ａ、５９ｂに集中し、該端部５９ａ、５９ｂから絶縁樹脂体５０内部に伸びるクラック６１が生じたり、甚だしい場合は樹脂基板５２が損傷することにもなる。絶縁樹脂体５０がガラスエポキシ樹脂の場合は、ガラス布のうねりによって樹脂基板へのクラック６１の発生が助長される場合がある。   This is because the inner end portions 59a and 59b of the pair of circuit patterns 51a and 51b formed on the insulating resin body 50 are formed in a straight line, and the end portions 59a and 59b of the linear circuit patterns 51a and 51b are formed. Similarly, a compressive load is applied in a state in which the opening edges 60a and 60b of the cavity 58 of the upper mold 56 of the mold mold, which are also provided in a straight line, are in line contact. For this reason, all loads are concentrated on the end portions 59a and 59b of the circuit putters 51a and 51b, and cracks 61 extending from the end portions 59a and 59b to the inside of the insulating resin body 50 are generated. In severe cases, the resin substrate 52 is damaged. It will also be. When the insulating resin body 50 is a glass epoxy resin, the generation of cracks 61 in the resin substrate may be promoted by the undulation of the glass cloth.

そこで、本発明は上記問題に鑑みて創案なされたもので、樹脂基板に実装されたＬＥＤチップをトランスファーモールドによって樹脂封止する際に、モールド金型の型締め圧力が加わってもクラック、破損、うねり等を生じないような樹脂基板を使用した表面実装型ＬＥＤを提供することにある。   Therefore, the present invention was devised in view of the above problems, and when the LED chip mounted on the resin substrate is resin-sealed by transfer molding, even if the mold clamping pressure is applied, cracking, breakage, An object of the present invention is to provide a surface-mounted LED using a resin substrate that does not cause undulation or the like.

上記課題を解決するために、本発明の請求項１に記載された発明は、絶縁樹脂体の表面に回路パターンを形成した樹脂基板の前記回路パターン上にＬＥＤチップを実装し、該ＬＥＤチップを覆うように封止樹脂で封止した表面実装型ＬＥＤであって、前記樹脂基板は少なくとも一方の面の対向する両縁部に一対の回路パターンが形成され、前記一対の回路パターンは該回路パターンの端部の一部から互いに対向するように夫々内側に向かって延びており、前記内側に向かって延びた部分を除いた前記回路パターンの端部は、少なくとも１つ以上の曲線若しくは前記回路パターンが延びた方向に略垂直な方向の樹脂基板の端部に対して非平行な少なくとも１つ以上の直線、又は、これらの組み合わせによって形成されていることを特徴とするものである。   In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention is such that an LED chip is mounted on the circuit pattern of a resin substrate having a circuit pattern formed on the surface of an insulating resin body, and the LED chip is mounted. A surface-mount type LED sealed with a sealing resin so as to cover, wherein the resin substrate has a pair of circuit patterns formed on opposite edges of at least one surface, and the pair of circuit patterns is the circuit pattern Each of the end portions of the circuit pattern extends inward so as to be opposed to each other, and the end portion of the circuit pattern excluding the inward extending portion has at least one curve or the circuit pattern. Is formed by at least one straight line that is non-parallel to the end portion of the resin substrate in a direction substantially perpendicular to the extending direction, or a combination thereof. It is.

また、本発明の請求項２に記載された発明は、請求項１において、前記曲線は、円の一部若しくは楕円の一部を構成する弧状、又は、これらの組み合わせによって形成されていることを特徴とするものである。   In the invention described in claim 2 of the present invention, in claim 1, the curve is formed by an arc shape constituting a part of a circle or a part of an ellipse, or a combination thereof. It is a feature.

また、本発明の請求項３に記載された発明は、請求項１又は２の何れか１項において、前記封止樹脂はエポキシ樹脂及びシリコーン樹脂のうちの１つからなることを特徴とするものである。   The invention described in claim 3 of the present invention is characterized in that, in any one of claims 1 and 2, the sealing resin is made of one of an epoxy resin and a silicone resin. It is.

本発明の表面実装型ＬＥＤは、ＬＥＤチップを実装する樹脂基板に形成された一対の回路パターンの表面側の内側端部を少なくとも１つ以上の曲線若しくは回路パターンが延びた方向に略垂直な方向の樹脂基板の端部に対して非平行な少なくとも１つ以上の直線、又は、これらの組み合わせによって形成し、ＬＥＤチップの樹脂封止工程に於けるモールド金型に設けられた封止樹脂成形用のキャビティ開口縁部の形状と上記回路パターンの表面側の内側端部の形状とを異なるものとした。その結果、樹脂封止工程に於いて樹脂基板の回路パターンの表面側の内側端部に加わる型締め圧縮荷重は分散された荷重の一部が点で加わるものであり、樹脂基板に対するクラック、破損、うねり等の不具合の発生を抑制することができる。   In the surface-mounted LED of the present invention, at least one curved line or a direction substantially perpendicular to the direction in which the circuit pattern extends at the inner end of the surface side of the pair of circuit patterns formed on the resin substrate on which the LED chip is mounted For forming a sealing resin provided in a molding die in a resin sealing process of an LED chip, which is formed by at least one straight line non-parallel to the end of the resin substrate or a combination thereof The shape of the edge of the cavity opening and the shape of the inner end on the surface side of the circuit pattern are different. As a result, in the resin sealing process, the mold-clamping compressive load applied to the inner end of the circuit pattern on the resin substrate is a part of the dispersed load, and cracks and breakage of the resin substrate The occurrence of problems such as swells can be suppressed.

以下、この発明の好適な実施形態を図１〜図６を参照しながら、詳細に説明する（同一部分については同じ符号を付す）。尚、以下に述べる実施形態は、本発明の好適な具体例であるから、技術的に好ましい種々の限定が付されているが、本発明の範囲は、以下の説明において特に本発明を限定する旨の記載がない限り、これらの実施形態に限られるものではない。   Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6 (the same parts are denoted by the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. Unless stated to the effect, the present invention is not limited to these embodiments.

図１は本実施形態に係わる表面実装型ＬＥＤの樹脂封止工程に於ける平面図、図２は図１のＡ−Ａ断面図、図３は完成図である。複数個のＬＥＤチップ１を実装する多面取りの樹脂基板２は、絶縁樹脂体３の表面側の対向する両縁部に銅等の導電部材からなる一対の回路パターン４ａ、５ａが形成されており、各回路パターン４ａ、５ａは絶縁樹脂体３の縁部から側面側を経て裏面側に回り込んだ状態に形成されている。   FIG. 1 is a plan view in a resin sealing process of a surface-mounted LED according to the present embodiment, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. A multi-sided resin substrate 2 on which a plurality of LED chips 1 are mounted has a pair of circuit patterns 4a and 5a made of a conductive member such as copper formed on opposite edges on the surface side of the insulating resin body 3. The circuit patterns 4a and 5a are formed in a state of wrapping around from the edge of the insulating resin body 3 to the back surface side through the side surface side.

そして、絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂは、略同一曲率の円弧が複数個接続された状態に形成されており、各端部４ｂ、５ｂからは複数箇所に於いて夫々互いに対向するように内側に向かって一対の回路パターン４ｃ、５ｃが延びている。   And the inner side edge parts 4b and 5b of each surface side circuit pattern 4a and 5a of the insulating resin body 3 are formed in a state where a plurality of arcs having substantially the same curvature are connected, and from each of the edge parts 4b and 5b, A pair of circuit patterns 4c and 5c extend inward so as to face each other at a plurality of locations.

上記構成の樹脂基板２の内側に向かって延びた一対の回路パターン４ｃ、５ｃのうち、一方の回路パターン４ｃの先端部には半田或いは導電性接着剤等の導電部材（図示せず）を介してＬＥＤチップ１が実装され、ＬＥＤチップ１の下側電極と回路パターン４ｃ，４ａとの電気的導通が図られている。ＬＥＤチップ１の上側電極はボンディングワイヤ６を介して他方の回路パターン５ｃに接続され、ＬＥＤチップ１の上側電極と回路パターン５ｃ、５ａとの電気的導通が図られている。   Of the pair of circuit patterns 4c and 5c extending toward the inner side of the resin substrate 2 having the above-described configuration, a leading end portion of one circuit pattern 4c is interposed with a conductive member (not shown) such as solder or a conductive adhesive. The LED chip 1 is mounted so that the lower electrode of the LED chip 1 and the circuit patterns 4c and 4a are electrically connected. The upper electrode of the LED chip 1 is connected to the other circuit pattern 5c through the bonding wire 6, and electrical connection between the upper electrode of the LED chip 1 and the circuit patterns 5c, 5a is achieved.

このように、複数個のＬＥＤチップ１が実装された樹脂基板２は、ＬＥＤチップ１及びボンディングワイヤ６とを樹脂封止するためにトランスファーモールド金型の上金型７と下金型８とで挟んで型締めされる。その場合、樹脂基板２の一対の回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂが受ける型締めによる圧縮荷重は、上金型７に封止樹脂成形のために設けられたキャビティ９の開口縁部１０に沿って加わる。このとき、開口縁部１０と絶縁樹脂体３及び回路パターン４ａ、４ｃ、５ａ、５ｃとの接触は、透光性樹脂１２と回路パターンと絶縁樹脂体３の３つの材料が重なる複数の接触点１１を形成する。接触点１１は、従来の構造に比べて、少なくとも図３に示した４箇所の接触点１１が増加する。これにより、型締めによる圧縮荷重を多数の接触点１１を有して受けることになる。また、開口縁部１０と回路パターンの内側端部が直線接触で一致することもない。   As described above, the resin substrate 2 on which the plurality of LED chips 1 are mounted is composed of the upper mold 7 and the lower mold 8 of the transfer mold in order to seal the LED chip 1 and the bonding wire 6 with resin. The mold is clamped. In that case, the compressive load caused by clamping the inner end portions 4b and 5b of the pair of circuit patterns 4a and 5a of the resin substrate 2 is caused by the cavity 9 provided in the upper mold 7 for molding the sealing resin. Add along the opening edge 10. At this time, the contact between the opening edge 10 and the insulating resin body 3 and the circuit patterns 4a, 4c, 5a, and 5c is a plurality of contact points at which three materials of the translucent resin 12, the circuit pattern, and the insulating resin body 3 overlap. 11 is formed. Compared with the conventional structure, at least four contact points 11 shown in FIG. Thereby, the compression load by mold clamping is received with many contact points 11. Further, the opening edge 10 and the inner end of the circuit pattern do not coincide with each other by linear contact.

従って、樹脂基板２の接触点１１に加わる荷重は圧縮荷重の全荷重のうち分散された一部が加わるのみであり、回路パターン４ａ、５ａの端部４ｂ、５ｂからクラックが生じるほどの圧力を受けることはなく、トランスファーモールド工程で樹脂基板２にクラックによる不具合を発生させることはない。ましてや、樹脂基板２が損傷することもなく、絶縁樹脂体３がガラスエポキシ樹脂の場合でもガラス布のうねりが生じることはなく、樹脂基板２へのクラックの発生が助長されることもない。また、キャビティの開口縁部１０が絶縁樹脂体３と直線接触で一致しなくなるので、絶縁樹脂体３にかかる圧力が減少し、クラックの発生を抑止する。   Accordingly, the load applied to the contact point 11 of the resin substrate 2 is only a part of the total load of the compression load, and the pressure is high enough to cause cracks from the end portions 4b and 5b of the circuit patterns 4a and 5a. It does not receive, and the malfunction by a crack is not generated in the resin substrate 2 at a transfer mold process. In addition, the resin substrate 2 is not damaged, and even when the insulating resin body 3 is a glass epoxy resin, the glass cloth does not swell, and the occurrence of cracks in the resin substrate 2 is not promoted. Further, since the opening edge 10 of the cavity does not coincide with the insulating resin body 3 by linear contact, the pressure applied to the insulating resin body 3 is reduced, and the generation of cracks is suppressed.

このような状態で樹脂基板２を挟んで型締した上金型７のキャビティ９内にエポキシ樹脂或いはシリコーン樹脂等の透光性樹脂１２を注入して硬化することによってＬＥＤチップ１及びボンディングワイヤ６を樹脂封止する。そして最後に樹脂封止された樹脂基板２を切断することによって図３で示すような表面実装型ＬＥＤ１３が完成する。   In this state, the LED chip 1 and the bonding wire 6 are obtained by injecting and curing a light-transmitting resin 12 such as an epoxy resin or a silicone resin into the cavity 9 of the upper mold 7 clamped with the resin substrate 2 interposed therebetween. Is sealed with resin. Finally, the resin-sealed resin substrate 2 is cut to complete the surface-mounted LED 13 as shown in FIG.

よって、完成された表面実装型ＬＥＤ１３においては、絶縁樹脂体３の表面側の対向する両縁部に一対の回路パターン４ａ、５ａが形成されており、各回路パターン４ａ、５ａは絶縁樹脂体３の縁部から側面側を経て裏面側に回り込んだ状態に形成されている。   Thus, in the completed surface mount LED 13, a pair of circuit patterns 4 a and 5 a are formed on both opposing edges on the surface side of the insulating resin body 3, and each circuit pattern 4 a and 5 a is formed of the insulating resin body 3. It is formed in a state of wrapping around from the edge to the back side through the side surface side.

そして、絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂは、円弧状に形成されており、各端部４ｂ、５ｂからは夫々互いに対向するように内側に向かって一対の回路パターン４ｃ、５ｃが延びている。   And the inner side edge part 4b, 5b of each surface side circuit pattern 4a, 5a of the insulating resin body 3 is formed in circular arc shape, and it goes inside from each edge part 4b, 5b so that it may mutually mutually oppose. A pair of circuit patterns 4c and 5c extends.

上記構成の樹脂基板２の内側に向かって延びた一対の回路パターン４ｃ、５ｃのうち、一方の回路パターン４ｃの先端部には半田或いは導電性接着剤等の導電部材（図示せず）を介してＬＥＤチップ１が実装され、ＬＥＤチップ１の下側電極と回路パターン４ｃ，４ａとの電気的導通が図られている。ＬＥＤチップ１の上側電極はボンディングワイヤ６を介して他方の回路パターン５ｃに接続され、ＬＥＤチップ１の上側電極と回路パターン５ｃ、５ａとの電気的導通が図られている。   Of the pair of circuit patterns 4c and 5c extending toward the inner side of the resin substrate 2 having the above-described configuration, a leading end portion of one circuit pattern 4c is interposed with a conductive member (not shown) such as solder or a conductive adhesive. The LED chip 1 is mounted so that the lower electrode of the LED chip 1 and the circuit patterns 4c and 4a are electrically connected. The upper electrode of the LED chip 1 is connected to the other circuit pattern 5c through the bonding wire 6, and electrical connection between the upper electrode of the LED chip 1 and the circuit patterns 5c, 5a is achieved.

そしてＬＥＤチップ１及びボンディングワイヤ６を覆うようにエポキシ樹脂或いはシリコーン樹脂等の透光性樹脂１２によって樹脂封止している。特に、透光性樹脂１２が樹脂基板２の絶縁樹脂体３及び回路パターン４ａ、５ａと接触する下辺１４、１５は直線状に形成され、絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂは円弧状に形成されている。つまり、透光性樹脂１２が樹脂基板１２の絶縁樹脂体３及び回路パターン４ａ、５ａと接触する下辺１４、１５の形状と絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂの形状を異なる形状にすることによって樹脂封止工程に於ける樹脂基板２に対するクラック、破損、うねり等の不具合を阻止し、高い製造歩留まりを確保するようにしている。   The LED chip 1 and the bonding wire 6 are sealed with a light-transmitting resin 12 such as an epoxy resin or a silicone resin. In particular, the lower sides 14 and 15 where the translucent resin 12 comes into contact with the insulating resin body 3 and the circuit patterns 4a and 5a of the resin substrate 2 are formed in a straight line, and the surface side circuit patterns 4a and 5a of the insulating resin body 3 are formed. The inner ends 4b and 5b are formed in an arc shape. That is, the shape of the lower sides 14 and 15 where the translucent resin 12 is in contact with the insulating resin body 3 and the circuit patterns 4a and 5a of the resin substrate 12, and the inner end portions 4b of the surface-side circuit patterns 4a and 5a of the insulating resin body 3 By making the shape of 5b different, problems such as cracks, breakage, and undulations in the resin substrate 2 in the resin sealing step are prevented, and a high manufacturing yield is secured.

図４及び図５は他の実施形態に係わる表面実装型ＬＥＤの樹脂封止工程を示すものであり、図４は平面図、図５は図４のＡ−Ａ断面図である。図６はその完成図である。   4 and 5 show a resin sealing process of a surface-mounted LED according to another embodiment, FIG. 4 is a plan view, and FIG. 5 is a cross-sectional view taken along line AA of FIG. FIG. 6 is a completed drawing.

図４及び図５で示した樹脂封止工程の、図１及び図２で示した樹脂封止工程に対する違いは、絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂが回路パターン４ａ、４ｂが内側に延びた方向に略垂直な方向の樹脂基板２の端部に対して非平行な直線で形成されていることのみであり、その他は全て上記実施形態と同様である。そのため詳細な説明は省略するが、図１及び図２の説明で述べたように、この場合も樹脂基板２の一対の回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂが受ける型締めによる圧縮荷重は、上金型７に封止樹脂成形のために設けられたキャビティ９の開口縁部１０に沿って加わる。このとき、開口縁部１０と絶縁樹脂体３及び回路パターン４ａ、４ｃ、５ａ、５ｃとの接触は、透光性樹脂１２と回路パターンと絶縁樹脂体３の３つの材料が重なる複数の接触点１１を形成する。接触点１１は、従来の構造に比べて、少なくとも図６に示した４箇所の接触点１１が増加する。これにより、型締めによる圧縮荷重を多数の接触点１１を有して受けることになる。また、開口縁部１０と回路パターンの内側端部が直線接触で一致することもない。   The difference between the resin sealing step shown in FIGS. 4 and 5 with respect to the resin sealing step shown in FIGS. 1 and 2 is that the inner end portions 4b and 5b of the surface-side circuit patterns 4a and 5a of the insulating resin body 3 are different. However, the circuit patterns 4a and 4b are only formed in a straight line non-parallel to the end portion of the resin substrate 2 in a direction substantially perpendicular to the direction in which the circuit patterns 4a and 4b extend inward. is there. Therefore, although detailed description is omitted, as described in the description of FIG. 1 and FIG. 2, in this case as well, due to the mold clamping received by the inner end portions 4 b and 5 b of the pair of circuit patterns 4 a and 5 a of the resin substrate 2. The compressive load is applied along the opening edge 10 of the cavity 9 provided in the upper mold 7 for molding the sealing resin. At this time, the contact between the opening edge 10 and the insulating resin body 3 and the circuit patterns 4a, 4c, 5a, and 5c is a plurality of contact points at which three materials of the translucent resin 12, the circuit pattern, and the insulating resin body 3 overlap. 11 is formed. As compared with the conventional structure, at least four contact points 11 shown in FIG. Thereby, the compression load by mold clamping is received with many contact points 11. Further, the opening edge 10 and the inner end of the circuit pattern do not coincide with each other by linear contact.

従って、樹脂基板２の接触点１１に加わる荷重は圧縮荷重の全荷重のうち分散された一部が加わるのみであり、回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂからクラックが生じるほどの圧力を受けることはなく、トランスファーモールド工程で樹脂基板２にクラックによる不具合を発生させることはない。ましてや、樹脂基板２が損傷することもなく、絶縁樹脂体３がガラスエポキシ樹脂の場合でもガラス布のうねりが生じることはなく、樹脂基板２へのクラックの発生が助長されることもない。また、キャビティの開口縁部１０が絶縁樹脂体３と直線接触で一致しなくなるので、絶縁樹脂体３にかかる圧力が減少し、クラックの発生を抑止する。   Therefore, the load applied to the contact point 11 of the resin substrate 2 is only a part of the total load of the compression load, and the cracks are generated from the inner end portions 4b and 5b of the circuit patterns 4a and 5a. The resin substrate 2 is not subjected to cracks in the transfer molding process. In addition, the resin substrate 2 is not damaged, and even when the insulating resin body 3 is a glass epoxy resin, the glass cloth does not swell, and the occurrence of cracks in the resin substrate 2 is not promoted. Further, since the opening edge 10 of the cavity does not coincide with the insulating resin body 3 by linear contact, the pressure applied to the insulating resin body 3 is reduced, and the generation of cracks is suppressed.

図６は上記実施形態の表面実装型ＬＥＤを示している。図１に示した実施形態との違いは、絶縁基板２の一対の回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂが、絶縁樹脂体３の各表面側回路パターン４ａ、５ａの内側端部４ｂ、５ｂが回路パターン４ａ、４ｂが内側に延びた方向に略垂直な方向の樹脂基板２の端部に対して非平行な直線で形成されていることのみであり、その他は図１で示した実施形態と同様である。   FIG. 6 shows the surface-mounted LED of the above embodiment. The difference from the embodiment shown in FIG. 1 is that the inner end portions 4b, 5b of the pair of circuit patterns 4a, 5a of the insulating substrate 2 are the inner ends of the surface side circuit patterns 4a, 5a of the insulating resin body 3, respectively. The portions 4b and 5b are only formed by straight lines that are not parallel to the end portion of the resin substrate 2 in a direction substantially perpendicular to the direction in which the circuit patterns 4a and 4b extend inward. This is the same as the embodiment shown.

なお、一対の回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂの形状は、樹脂封止工程においてモールド金型に設けられた封止樹脂成形用のキャビティの開口縁部と線状に接しない形状であれば良く、少なくとも１つ以上の曲線若しくは回路パターン４ａ、５ａが延びた方向に略垂直な方向の樹脂基板２の端部に対して非平行な少なくとも１つ以上の直線、又は、これらの組み合わせによって形成された形状であれば良い。   The shapes of the inner end portions 4b and 5b of the pair of circuit patterns 4a and 5a are in linear contact with the opening edge of the cavity for molding resin molding provided in the mold in the resin sealing process. At least one curved line or at least one straight line non-parallel to the end of the resin substrate 2 in a direction substantially perpendicular to the direction in which the circuit patterns 4a and 5a extend, or Any shape formed by a combination of these may be used.

例えば、一対の回路パターン４ａ、５ａの夫々の内側端部４ｂ、５ｂの形状が曲線の場合、円の一部若しくは楕円の一部を構成する弧状、又は、これらの組み合わせによって形成することが可能である。   For example, when the shape of each inner end 4b, 5b of the pair of circuit patterns 4a, 5a is a curve, it can be formed by an arc shape constituting a part of a circle or a part of an ellipse, or a combination thereof. It is.

以上述べたように、本発明の表面実装型ＬＥＤは、ＬＥＤチップを実装する樹脂基板に形成された一対の回路パターンの表面側の内側端部を少なくとも１つ以上の曲線若しくは回路パターンが延びた方向に略垂直な方向の樹脂基板の端部に対して非平行な少なくとも１つ以上の直線、又は、これらの組み合わせによって形成し、ＬＥＤチップの樹脂封止工程に於けるモールド金型に設けられた封止樹脂成形用のキャビティ開口縁部の形状と上記回路パターンの表面側の内側端部の形状とを異なるものとした。   As described above, in the surface-mount type LED of the present invention, at least one curve or circuit pattern extends at the inner ends on the surface side of the pair of circuit patterns formed on the resin substrate on which the LED chip is mounted. It is formed by at least one straight line that is non-parallel to the edge of the resin substrate in a direction substantially perpendicular to the direction, or a combination thereof, and is provided in the mold die in the resin sealing process of the LED chip. The shape of the edge of the cavity opening for molding the sealing resin was different from the shape of the inner end on the surface side of the circuit pattern.

その結果、樹脂封止工程に於いて樹脂基板の回路パターンの表面側の内側端部に加わる型締め圧縮荷重は分散された荷重の一部が点で加わるものであり、樹脂基板に対するクラック、破損、うねり等の不具合の発生を抑制することができる。等の優れた効果を奏するものである。   As a result, in the resin sealing process, the mold-clamping compressive load applied to the inner end of the circuit pattern on the resin substrate is a part of the dispersed load, and cracks and breakage of the resin substrate The occurrence of problems such as swells can be suppressed. And the like.

本発明に係わる表面実装型ＬＥＤの実施形態の樹脂封止工程を示す平面図である。It is a top view which shows the resin sealing process of embodiment of the surface mount type LED concerning this invention. 図１のＡ−Ａ断面図である。It is AA sectional drawing of FIG. 本発明に係わる表面実装型ＬＥＤの実施形態を示す斜視図である。It is a perspective view which shows embodiment of the surface mount type LED concerning this invention. 本発明に係わる表面実装型ＬＥＤの他の実施形態の樹脂封止工程を示す平面図である。It is a top view which shows the resin sealing process of other embodiment of the surface mount type LED concerning this invention. 図４のＡ−Ａ断面図である。It is AA sectional drawing of FIG. 本発明に係わる他の表面実装型ＬＥＤの実施形態を示す斜視図である。It is a perspective view which shows embodiment of the other surface mount type LED concerning this invention. 従来例に係わる表面実装型ＬＥＤの実施形態を示す斜視図である。It is a perspective view which shows embodiment of the surface mount type LED concerning a prior art example. 従来例に係わる表面実装型ＬＥＤの実施形態の樹脂封止工程を示す平面図である。It is a top view which shows the resin sealing process of embodiment of the surface mount type LED concerning a prior art example. 図８のＡ−Ａ断面図である。It is AA sectional drawing of FIG.

符号の説明Explanation of symbols

１ ＬＥＤチップ
２ 樹脂基板
３ 絶縁樹脂体
４ａ 回路パターン
４ｂ 内側端部
４ｃ 回路パターン
５ａ 回路パターン
５ｂ 内側端部
５ｃ 回路パターン
６ ボンディングワイヤ
７ 上金型
８ 下金型
９ キャビティ
１０ 開口縁部
１１ 接触点
１２ 透光性樹脂
１３ 表面実装型ＬＥＤ
１４ 下辺
１５ 下辺 DESCRIPTION OF SYMBOLS 1 LED chip 2 Resin board 3 Insulation resin body 4a Circuit pattern 4b Inner edge part 4c Circuit pattern 5a Circuit pattern 5b Inner edge part 5c Circuit pattern 6 Bonding wire 7 Upper metal mold | die 8 Lower mold | die 9 Cavity 10 Opening edge part 11 Contact point 12 Translucent resin 13 Surface mount LED
14 Lower side 15 Lower side

Claims (3)

絶縁樹脂体の表面に回路パターンを形成した樹脂基板の前記回路パターン上にＬＥＤチップを実装し、該ＬＥＤチップを覆うように封止樹脂で封止した表面実装型ＬＥＤであって、前記樹脂基板は少なくとも一方の面の対向する両縁部に一対の回路パターンが形成され、前記一対の回路パターンは該回路パターンの端部の一部から互いに対向するように夫々内側に向かって延びており、前記内側に向かって延びた部分を除いた前記回路パターンの端部は、少なくとも１つ以上の曲線若しくは前記回路パターンが延びた方向に略垂直な方向の樹脂基板の端部に対して非平行な少なくとも１つ以上の直線、又は、これらの組み合わせによって形成されていることを特徴とする表面実装型ＬＥＤ。   An LED chip is mounted on the circuit pattern of a resin substrate having a circuit pattern formed on the surface of an insulating resin body, and is sealed with a sealing resin so as to cover the LED chip, and the resin substrate Is formed with a pair of circuit patterns on opposite edges of at least one surface, and the pair of circuit patterns extends inward from a part of the end of the circuit pattern, respectively, The end of the circuit pattern excluding the portion extending inward is non-parallel to at least one curve or the end of the resin substrate in a direction substantially perpendicular to the direction in which the circuit pattern extends. A surface-mount type LED formed by at least one straight line or a combination thereof. 前記曲線は、円の一部若しくは楕円の一部を構成する弧状、又は、これらの組み合わせによって形成されていることを特徴とする請求項１に記載の表面実装型ＬＥＤ。   The surface-mounted LED according to claim 1, wherein the curved line is formed by an arc shape forming a part of a circle or a part of an ellipse, or a combination thereof. 前記封止樹脂はエポキシ樹脂及びシリコーン樹脂のうちの１つからなることを特徴とする請求項１又は２の何れか１項に記載の表面実装型ＬＥＤ。   The surface-mount type LED according to claim 1, wherein the sealing resin is made of one of an epoxy resin and a silicone resin.
JP2005000691A 2005-01-05 2005-01-05 Surface mount type LED Pending JP2006190764A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005000691A JP2006190764A (en) 2005-01-05 2005-01-05 Surface mount type LED
TW094142210A TWI387123B (en) 2005-01-05 2005-11-30 Surface mounted LEDs
CN200510003522.8A CN100481430C (en) 2005-01-05 2005-12-30 Surface installing emitting LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005000691A JP2006190764A (en) 2005-01-05 2005-01-05 Surface mount type LED

Publications (1)

Publication Number Publication Date
JP2006190764A true JP2006190764A (en) 2006-07-20

Family

ID=36797705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005000691A Pending JP2006190764A (en) 2005-01-05 2005-01-05 Surface mount type LED

Country Status (3)

Country Link
JP (1) JP2006190764A (en)
CN (1) CN100481430C (en)
TW (1) TWI387123B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7985980B2 (en) 2007-10-31 2011-07-26 Sharp Kabushiki Kaisha Chip-type LED and method for manufacturing the same
KR101119172B1 (en) 2007-02-05 2012-03-21 삼성전자주식회사 Light emitting diode module and display device using the same
WO2013116114A1 (en) * 2012-02-02 2013-08-08 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US8536605B2 (en) 2011-11-28 2013-09-17 Bridgelux, Inc. Micro-bead blasting process for removing a silicone flash layer
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9461023B2 (en) 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
US10347807B2 (en) 2011-01-09 2019-07-09 Bridgelux Inc. Packaging photon building blocks with top side connections and interconnect structure

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6632725B2 (en) * 2016-06-29 2020-01-22 三菱電機株式会社 Display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210456U (en) * 1985-07-04 1987-01-22
JPH01163352U (en) * 1988-04-30 1989-11-14
JPH01171055U (en) * 1988-05-24 1989-12-04

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210456A (en) * 1985-07-05 1987-01-19 Mitsubishi Heavy Ind Ltd Piston of reciprocating type engine
JPS6213321A (en) * 1985-07-11 1987-01-22 Nippon Radiator Co Ltd Method for mutually welding synthetic resin parts by high frequency induction heating method
JPH01282844A (en) * 1988-05-09 1989-11-14 Nec Corp Resin-sealed semiconductor device
JP2667521B2 (en) * 1989-07-04 1997-10-27 住友重機械工業株式会社 Resin pressure detector for injection molding machine
US5623181A (en) * 1995-03-23 1997-04-22 Iwasaki Electric Co., Ltd. Multi-layer type light emitting device
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5962971A (en) * 1997-08-29 1999-10-05 Chen; Hsing LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights
JP3553405B2 (en) * 1999-03-03 2004-08-11 ローム株式会社 Chip type electronic components
JP3172947B2 (en) * 1999-10-22 2001-06-04 ラボ・スフィア株式会社 Lighting device using luminous body
US20060189013A1 (en) * 2005-02-24 2006-08-24 3M Innovative Properties Company Method of making LED encapsulant with undulating surface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210456U (en) * 1985-07-04 1987-01-22
JPH01163352U (en) * 1988-04-30 1989-11-14
JPH01171055U (en) * 1988-05-24 1989-12-04

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119172B1 (en) 2007-02-05 2012-03-21 삼성전자주식회사 Light emitting diode module and display device using the same
US7985980B2 (en) 2007-10-31 2011-07-26 Sharp Kabushiki Kaisha Chip-type LED and method for manufacturing the same
US8206999B2 (en) 2007-10-31 2012-06-26 Sharp Kabushiki Kaisha Chip-type LED and method for manufacturing the same
US9985004B2 (en) 2011-01-09 2018-05-29 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US9653437B2 (en) 2011-01-09 2017-05-16 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US11411152B2 (en) 2011-01-09 2022-08-09 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure
US9130139B2 (en) 2011-01-09 2015-09-08 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9312465B2 (en) 2011-01-09 2016-04-12 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US10840424B2 (en) 2011-01-09 2020-11-17 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure
US10347807B2 (en) 2011-01-09 2019-07-09 Bridgelux Inc. Packaging photon building blocks with top side connections and interconnect structure
US9893039B2 (en) 2011-01-09 2018-02-13 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US10325890B2 (en) 2011-01-09 2019-06-18 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US9461023B2 (en) 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
US8536605B2 (en) 2011-11-28 2013-09-17 Bridgelux, Inc. Micro-bead blasting process for removing a silicone flash layer
US8803180B2 (en) 2011-11-28 2014-08-12 Bridgelux, Inc. Micro-bead blasting process for removing a silicone flash layer
WO2013116114A1 (en) * 2012-02-02 2013-08-08 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure

Also Published As

Publication number Publication date
CN100481430C (en) 2009-04-22
CN1819175A (en) 2006-08-16
TW200625700A (en) 2006-07-16
TWI387123B (en) 2013-02-21

Similar Documents

Publication Publication Date Title
JP2005294736A (en) Manufacturing method of semiconductor light emitting device
WO2016084483A1 (en) Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device
JP2020038914A (en) Semiconductor device
TWI588948B (en) Flat pin type semiconductor device
JP2006190764A (en) Surface mount type LED
WO2013039052A1 (en) Package and light-emitting device
CN112382576A (en) Semiconductor device and method for manufacturing the same
JP2002064224A (en) Light emitting diode and method of manufacturing the same
JP6345608B2 (en) Semiconductor device
JP2008205107A (en) Back-mounted LED
CN219085958U (en) module
WO2016143317A1 (en) Electronic device and manufacturing method thereof
JP2006049624A (en) Light emitting element
JP2005353802A (en) Light emitting diode
JP2009094189A (en) Semiconductor package with connector
JP2008294132A (en) Mold package and manufacturing method thereof
JP4737664B2 (en) Surface mount type solid electrolytic capacitor and manufacturing method thereof
JP4989929B2 (en) Optical semiconductor device
US7417308B2 (en) Stack type package module and method for manufacturing the same
JP7450576B2 (en) semiconductor equipment
CN213519919U (en) Power device and power module
JP2009182230A (en) Resin-sealed semiconductor device and manufacturing method thereof
JP5946943B1 (en) Semiconductor package
JP2019508908A (en) Packaging structure with solder balls and method of manufacturing the packaging structure
JPH0642348Y2 (en) Semiconductor device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100629

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100706

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100902

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101130