JP2006185650A - Circuit board manufacturing method, electro-optical device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate bonding technique capable of reliably ensuring electrical continuity between substrates.
An OLED substrate 100 and a wiring substrate 120 are fixed using a conductive adhesive 140 having a high viscosity and an internal sealant 141 having a low viscosity. Specifically, the conductive adhesive 140 is disposed on each electrode pad 124 exposed on the surface of the wiring substrate 120, and the outer peripheral sealing insulating adhesive 150 is disposed on the outer peripheral portion (A in FIG. 2). , B). Next, an internal sealant 141 containing a spacer or a desiccant is disposed on the entire inner surface 160 of the wiring board 120 (see FIG. 2C), and the OLED board 100 and the wiring board 120 are aligned. Thereafter, both substrates are bonded using a vacuum bonding apparatus equipped with a vacuum pump or the like (see D in FIG. 2).
[Selection] Figure 2

Description

  The present invention relates to a method for manufacturing a circuit board in which two substrates are bonded, an electro-optical device, and an electronic apparatus.

  As one of flat panel displays, there is an organic EL display device using an organic electroluminescence element (hereinafter referred to as an organic EL element) as a light emitting element. Since this organic EL display device is a self-luminous type, it has a feature that a viewing angle is wide. In addition, since the organic EL display device emits light only for necessary pixels, there is an advantage that power consumption is small as compared with a liquid crystal display device which is a backlight type display device.

The organic EL display device having such a feature generally has a structure in which an organic EL element responsible for light emission and a drive circuit for driving the organic EL element are formed on a glass substrate. A structure in which a substrate (hereinafter referred to as an OLED substrate) on which a substrate is mounted and a substrate (hereinafter referred to as a wiring substrate) on which a drive circuit or wiring is mounted are bonded together by a conductive adhesive or an insulating adhesive (internal sealing material) It has been proposed (for example, see Patent Document 1 below).
According to such a structure, the formation of an organic EL element that requires a relatively low-temperature process and the formation of a drive circuit and wiring that require a relatively high-temperature process can be performed independently. Cost can be reduced.

Japanese Patent Laid-Open No. 11-3048

  However, depending on the materials used for the conductive adhesive and the insulating adhesive and the method of bonding the substrates, the adhesion between the substrates is not sufficient, and the organic EL element and the drive circuit connected by the conductive adhesive During this period, there was a problem that a conduction failure occurred.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a substrate bonding technique that can reliably establish electrical continuity between substrates.

  In order to achieve the above object, a circuit board manufacturing method according to the present invention includes a first substrate on which an electro-optical element forming a pixel is formed, and a second substrate on which a drive circuit for driving the electro-optical element is formed. A method for manufacturing a circuit board, wherein a conductive adhesive that electrically connects the electro-optic element and the drive circuit is formed on a metal pad formed on the second substrate. A step of disposing, a step of disposing an internal sealant having a viscosity lower than that of the conductive adhesive on the second substrate on which the conductive adhesive is disposed, the second substrate, and the first And a step of bonding the substrate to the substrate.

  According to this manufacturing method, an internal sealant having a lower viscosity than the viscosity of the conductive adhesive that electrically connects the substrates is used as the sealant that seals the space sandwiched between the substrates. . In other words, since an adhesive having a higher viscosity than the internal sealant is used as the conductive adhesive, the internal adhesive is applied onto the substrate after the conductive adhesive is placed on the second substrate. However, the conductive adhesive does not spread and spread. By bonding the second substrate and the first substrate in such a state, it is possible to ensure electrical continuity between the substrates.

  Here, in the manufacturing method, it is a step performed prior to the step of disposing the internal sealing agent, and an outer periphery having a higher viscosity than the internal sealing agent on the outer peripheral portion of the second substrate. The method further includes the step of disposing a partial sealant, wherein the step of disposing the internal sealant includes disposing the internal sealant in a region surrounded by the outer peripheral portion sealant. Since the viscosity of the outer peripheral sealant is set higher than the viscosity of the internal sealant, the problem that the applied internal sealant flows out of the substrate can be reliably prevented.

In the circuit board manufacturing method according to the present invention, a first substrate on which an electro-optical element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optical element is formed are pasted. A method of manufacturing a combined circuit board, wherein the electro-optic element and the drive circuit are electrically connected to a position corresponding to a metal pad formed on the second board in the first board. A step of disposing a conductive adhesive, a step of disposing an internal sealing agent having a viscosity lower than that of the conductive adhesive on the first substrate on which the conductive adhesive is disposed, and the second substrate. And a step of attaching the first substrate to the first substrate.
As described above, the conductive adhesive and the internal sealing agent may be disposed on the first substrate instead of the second substrate on which the metal pad is formed.
Here, in the manufacturing method, it is a step performed prior to the step of disposing the internal sealing agent, and an outer periphery having a higher viscosity than the internal sealing agent on the outer peripheral portion of the first substrate. In the step of disposing the internal sealant, the internal sealant may be disposed in a region surrounded by the outer periphery sealant. Since the viscosity of the outer peripheral sealant is set to be higher than the viscosity of the internal sealant, it is possible to reliably prevent the problem that the applied internal sealant flows out of the substrate as described above. Can do.

  In the step of bonding the substrates, it is preferable that the second substrate and the first substrate are bonded in a vacuum state. As described above, by depressurizing to a vacuum state and bonding the two substrates using a difference in atmospheric pressure, it is possible to bond them without causing a gap between the substrates.

Moreover, the aspect whose viscosity ratio of the said internal sealing agent when based on the said conductive adhesive is 1/2 or less is preferable. By setting to such a viscosity ratio, it is possible to prevent a problem that the conductive adhesive spreads and spreads by the application of the internal sealant.
Moreover, the aspect in which the spacer which has a particle size according to the gap between board | substrates is contained in the said internal sealing agent is preferable. By including such a spacer in the internal sealant, a desired gap between the substrates can be reliably maintained.
Moreover, the aspect in which the said internal sealing agent contains the desiccant is preferable. By including such a desiccant in the internal sealant, it is possible to remove moisture and the like inside the substrate.

  In the circuit board manufacturing method according to the present invention, a first substrate on which an electro-optical element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optical element is formed are pasted. A method of manufacturing a circuit board having a combined structure, wherein a conductive adhesive that electrically connects the electro-optic element and the drive circuit is disposed on a metal pad formed on the second substrate. A step, a step of disposing an internal sealant having a viscosity lower than that of the conductive adhesive on the first substrate, and a step of bonding the second substrate and the first substrate together. It is characterized by that.

  According to this manufacturing method, an internal sealant having a lower viscosity than the viscosity of the conductive adhesive that electrically connects the substrates is used as the sealant that seals the space sandwiched between the substrates. . In other words, since an adhesive having a higher viscosity than the internal sealant is used as the conductive adhesive, the second substrate on which the conductive adhesive is disposed and the first substrate on which the internal sealant is disposed. Even when the substrates are bonded together, the conductive adhesive is not spread and spread, and electrical conduction between the substrates can be ensured.

  Here, in the manufacturing method, it is a step performed prior to the step of disposing the internal sealing agent, and an outer periphery having a higher viscosity than the internal sealing agent on the outer peripheral portion of the first substrate. The method further includes the step of disposing a partial sealant, wherein the step of disposing the internal sealant includes disposing the internal sealant in a region surrounded by the outer peripheral portion sealant. Since the viscosity of the outer peripheral sealant is set higher than the viscosity of the internal sealant, the problem that the applied internal sealant flows out of the substrate can be reliably prevented.

In the circuit board manufacturing method according to the present invention, a first substrate on which an electro-optical element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optical element is formed are pasted. A method of manufacturing a circuit board having a combined structure, wherein the electro-optic element and the drive circuit are electrically connected to a position corresponding to a metal pad formed on the second substrate in the first substrate. Disposing a conductive adhesive to be connected; disposing an internal sealant having a viscosity lower than that of the conductive adhesive on the second substrate; and the second substrate and the first substrate. And a step of bonding the substrate together.
Thus, while the conductive adhesive is disposed on the first substrate, the internal sealant may be disposed on the second substrate.

  Here, in the manufacturing method, it is a step performed prior to the step of disposing the internal sealing agent, and an outer periphery having a higher viscosity than the internal sealing agent on the outer peripheral portion of the second substrate. In the step of disposing the internal sealant, the internal sealant may be disposed in a region surrounded by the outer peripheral portion sealant. Since the viscosity of the outer peripheral sealant is set to be higher than the viscosity of the internal sealant, it is possible to reliably prevent the problem that the applied internal sealant flows out of the substrate as described above. Can do.

  The circuit board manufactured by the method described above may be applied to the electro-optical device. Here, the electro-optical device refers to a device including a liquid crystal element, an electrophoretic element having a dispersion medium in which electrophoretic particles are dispersed, an EL element, and the like, and a device in which a thin film transistor or the like is applied to a driving circuit.

  Further, such an electro-optical device may be applied to an electronic device. Here, the electronic apparatus refers to a general apparatus having a certain function including the electro-optical device according to the present invention, and includes, for example, an electro-optical device and a memory. The configuration is not particularly limited, but for example, an IC card, a mobile phone, a video camera, a personal computer, a head-mounted display, a rear-type or front-type projector, a fax machine with a display function, a digital camera finder, a portable TV, A DSP device, PDA, electronic notebook, electronic bulletin board, advertising display, etc. are included.

  Hereinafter, an electro-optical device according to an embodiment of the present invention will be described using an organic EL display device (electro-optical device) having a top emission structure as an example.

First Embodiment FIG. 1 is a diagram (sectional view) showing a configuration of an organic EL display device 200 of the present embodiment. The organic EL display device shown in FIG. 1 has a configuration in which an OLED substrate 100 including an organic EL element and a wiring substrate 120 including a drive circuit, wiring, and the like for driving the organic EL element are disposed to face each other.

  The OLED substrate (first substrate) 100 includes a transparent substrate 101 such as a glass substrate or a flexible substrate, a transparent electrode (anode) 102 made of ITO or the like and formed on the transparent substrate 101, and the surface of the transparent electrode 102 Are formed on the surface of the transparent electrode 102, the organic layer 104 formed in the opening of the partition wall 103, and the surface of the organic layer 104. In addition, an electrode (cathode) 105 made of aluminum or the like and a separator 106 are included.

  The organic layer 104 has a structure in which, for example, a hole transport layer, a light emitting layer, and an electron transport layer (all not shown) are sequentially laminated. The hole transport layer is a mixture of polyethylene dioxythiophene and polystyrene sulfonic acid. The light emitting layer is formed of a polydialkylfluorene derivative or the like, and the electron transport layer is formed of calcium, lithium, an oxide thereof, fluoride, or the like.

  The organic EL element (electro-optical element) includes an anode 102, an organic layer 104, and a cathode 105, and the light emitting layer of the organic layer 105 emits light by supplying current to the organic layer 104 via the anode 102 and the cathode 105. Then, the emitted light is emitted to the outside through the anode 102 and the transparent substrate 101.

  The wiring substrate (second substrate) 120 includes a base 121 made of a glass substrate or a flexible substrate, an insulating layer 122 formed on the base 121, and a circuit mounted at a predetermined position on the insulating layer 122. The chip 123 includes an electrode pad 124 in which a part of the wiring formed inside the insulating layer 122 is exposed on the wiring substrate 120. The circuit chip (driving circuit) 123 includes a thin film transistor (TFT) used for driving an organic EL element mounted on the OLED substrate 100 and other circuit elements.

The OLED substrate 100 and the wiring substrate 120 are fixed by a conductive adhesive 140, an internal sealant 141, and an insulating adhesive for sealing an outer peripheral portion described later.
The conductive adhesive 140 is obtained by dispersing conductive particles such as carbon particles, silver particles, and copper particles in, for example, an epoxy-based or phenol-based thermosetting adhesive, and the cathode 105 and the wiring substrate 120 of the OLED substrate 100. The electrode pads (metal pads) 124 are in contact with each other. The conductive adhesive 140 fixes the OLED substrate 100 and the wiring substrate 120 and electrically connects the organic EL element on the OLED substrate 100 side and the wiring 124 on the wiring substrate 120 side (that is, establishes electrical continuity). Also serves as a function.

  Here, when the viscosity of the conductive adhesive 140 is too low, the applied conductive adhesive spreads, so that it cannot be disposed at a desired position or mixed with the internal sealant 141. There arises a problem such as an end. In view of such circumstances, in the present embodiment, for example, a conductive adhesive 140 having a viscosity of 200 Pa · s or more (in the case of an E-type viscometer of 10 rpm; the same applies to the following viscosity) is used. The viscosity of the conductive adhesive 140 is preferably about 200 to 500 Pa · s. Further, in view of the weakness of the organic EL element to a solvent and low heat resistance, it is preferable to use a non-solvent type adhesive, for example, a thermosetting type conductive adhesive that cures at 100 ° C. or less. . The characteristics of the adhesive described above are the same for the insulating adhesive for sealing the outer peripheral portion (described later) except that it does not contain conductive fine particles.

  The internal sealing agent 141 is formed of, for example, an epoxy-based or phenol-based thermosetting adhesive, and has a function of fixing the OLED substrate 100 and the wiring substrate 120 and sealing between the OLED substrate 100 and the wiring substrate 120. I also serve. In this embodiment, an adhesive having a viscosity (for example, 100 Pa · s or less) lower than that of the conductive adhesive 140 is used as the internal sealant 141 so as to wet and spread over the entire surface of the substrate after application. Here, the viscosity ratio of the internal sealant 141 when the conductive adhesive 140 is used as a reference is preferably about ½ or less (for example, the viscosity of the conductive adhesive 140 is 200 Pa · s). The viscosity of the internal sealant 141 may be 100 Pa · s), and other viscosity ratios may be used. The internal sealant 141 contains a substantially spherical spacer (not shown), and a uniform gap is secured between the OLED substrate 100 and the wiring substrate 120 by the spacer. Note that the particle diameter (for example, 10 μm) and the shape of the spacer to be put in the insulating adhesive 142 may be appropriately determined according to the desired gap size and the like. In addition to the spacer, the internal sealant 141 may be blended (contained) with a desiccant for removing moisture and the like sandwiched between the substrates. As the desiccant, for example, a liquid desiccant (such as a transparent thin film rehydrating agent for an organic EL display) can be used, but the present invention is not limited to this, and a powdery desiccant may be used. Hereinafter, a method for bonding the OLED substrate 100 and the wiring substrate 120 will be described with reference to FIGS. 2 and 3.

<First bonding method>
FIG. 2 is a diagram for explaining the first bonding method.
First, the conductive adhesive 140 is disposed on each electrode pad 124 exposed on the surface of the wiring board 120 by using a screen printing method, a dispenser, or the like (see A shown in FIG. 2), and then on the outer periphery of the wiring board 120. An insulating adhesive 150 for sealing the outer peripheral portion (outer peripheral portion sealing agent) 150 is disposed using a dispenser or the like (see B shown in FIG. 2). As described above, the characteristic of the insulating adhesive 150 for sealing the outer peripheral portion is the same as that of the conductive adhesive 140 except that it does not contain conductive fine particles, and its viscosity is about 200 to 500 Pa · s. (That is, a viscosity higher than that of the internal sealant 141). Note that the coating thickness of the conductive adhesive 140 and the coating thickness of the outer peripheral sealing insulating adhesive 150 are set to be larger than the coating thickness of the internal sealing agent 141.

  Next, an internal sealant 141 mixed with a spacer and a desiccant (both not shown) is disposed in a region 160 surrounded by the insulating adhesive 150 for sealing the outer periphery on the wiring board (FIG. 2). See C). As described above, the viscosity of the conductive adhesive 140 and the viscosity of the outer peripheral sealing insulating adhesive 150 are set higher than the viscosity of the internal sealant 141. Even if it is disposed on the entire inner surface 160, the conductive adhesive 140 and the insulating adhesive 150 for sealing the outer peripheral portion are not spread and spread. A dispenser may be used when disposing the internal sealing agent 141, but other coating methods such as a spin coating method and a slit coating method may be used.

  And after aligning the OLED board | substrate 100 and the wiring board 120, both board | substrates are bonded together in a vacuum state using the vacuum bonding apparatus provided with the vacuum pump etc. (refer D shown in FIG. 2). Specifically, the inside of the apparatus is reduced to a vacuum state using a vacuum pump, the two substrates are aligned in this state, and the vacuum is broken after stacking the substrates (that is, using the pressure difference). Bond without gaps. After bonding, the conductive adhesive 140, the internal sealant 141, and the outer peripheral sealing insulating adhesive 150 are cured by heating at a temperature of 100 ° C., for example. When a UV curable resin is used for the outer peripheral sealing insulating adhesive 150 or the like, it may be cured by irradiating ultraviolet rays. In the above description, the conductive adhesive 140, the internal sealant 141, and the outer peripheral sealing insulating adhesive 150 are disposed on the metal pad 124 of the wiring board 120, but not the wiring board 120 but the OLED. You may arrange | position to the board | substrate 100. FIG. Specifically, the conductive adhesive 140 is disposed at a position corresponding to the metal pad 124 in the OLED substrate 100, and the internal sealant 141 and the outer peripheral sealing insulating adhesive 150 are also disposed on the OLED substrate 100. . Further, instead of using the first bonding method described above, the following second bonding method may be used.

<Second bonding method>
FIG. 3 is a diagram for explaining the second bonding method.
First, as in the first bonding method, the conductive adhesive 140 is disposed on each electrode pad 124 exposed on the surface of the wiring substrate 120 by using a screen printing method, a dispenser, or the like (see A in FIG. 3). .
Next, the outer peripheral sealing insulating adhesive 150 is disposed not on the wiring substrate 120 but on the outer peripheral portion of the OLED substrate 100 using a dispenser or the like (see B shown in FIG. 3). Then, an internal sealant 141 containing a spacer and a desiccant (both not shown) is disposed in a region 160 ′ surrounded by the insulating adhesive 150 for sealing the outer periphery on the OLED substrate (FIG. 3). See C).

  Then, after aligning the inverted wiring board 120 and the OLED substrate 100, the two substrates are bonded together in a vacuum state using the above-described vacuum bonding apparatus (see D shown in FIG. 3). After bonding, the conductive adhesive 140, the internal sealant 141, and the outer peripheral sealing insulating adhesive 150 are cured by heating at a temperature of 100 ° C., for example. As described above, the conductive adhesive 140 and the internal sealant 141 are not provided on any one of the substrates (in this embodiment, the wiring board 120), but the conductive adhesive 140 and the internal sealant 141 are separately provided. May be provided on the substrate (the wiring substrate 120 and the OLED substrate 100). Contrary to the above description, the conductive adhesive 140 is disposed at a position corresponding to the metal pad 124 in the OLED substrate 100, while the internal sealant 141 and the insulating adhesive for sealing the outer peripheral portion are provided on the wiring substrate 120. 150 may be arranged.

  As described above, according to the present embodiment, by using a conductive adhesive having a viscosity higher than that of the internal sealant, electrical conduction between the OLED substrate and the wiring substrate can be reliably obtained. it can. Further, by bonding the OLED substrate and the wiring substrate in a vacuum using the difference in atmospheric pressure, it is possible to bond the two substrates without any gap.

  In the above-described embodiment, the wiring substrate 120 is not particularly mentioned, but it can be applied to either an active matrix or a passive matrix. Further, the spacer may be contained not only in the internal sealant 141 but also in the conductive adhesive 140 or the insulating adhesive 150 for sealing the outer peripheral portion. Moreover, if the environment of the space which forms an organic EL element is maintained favorable, it is not necessary to mix | blend a desiccant with an internal sealing agent.

Second Embodiment Next, electronic devices to which the organic EL display device of the above-described embodiment can be applied will be exemplified. In the following description, the organic EL display device 200 is taken as a representative, but the same applies to the other organic EL display devices 200a to 200e.

  4 and 5 are diagrams illustrating examples of electronic devices to which the above-described organic EL display device can be applied. FIG. 4A shows an application example to a mobile phone. The mobile phone 230 includes an antenna portion 231, an audio output portion 232, an audio input portion 233, an operation portion 234, and the organic EL display device 200 of the present invention. Yes. Thus, the organic EL display device according to the present invention can be used as a display unit. FIG. 4B shows an application example to a video camera. The video camera 240 includes an image receiving unit 241, an operation unit 242, an audio input unit 243, and the organic EL display device 200 of the present invention.

  FIG. 4C shows an application example to a portable personal computer (so-called PDA). The computer 250 includes a camera unit 251, an operation unit 252, and the organic EL display device 200 according to the present invention. FIG. 4D shows an application example to a head-mounted display. The head-mounted display 260 includes a band 261, an optical system storage unit 262, and the organic EL display device 200 according to the present invention.

  FIG. 5A shows an application example to a television, and the television 300 includes the organic EL display device 200 according to the present invention. It should be noted that the organic EL display device according to the present invention can be similarly applied to a monitor device used in a personal computer or the like. FIG. 5B shows an application example to a roll-up television, and the roll-up television 310 includes the organic EL display device 200 according to the present invention.

  The organic EL display device according to the present invention is not limited to the above-described example, and can be applied to various electronic devices having a display function. For example, in addition to these, it can also be used for a fax machine with a display function, a finder for a digital camera, a portable TV, an electronic notebook, an electric bulletin board, a display for advertisements, and the like.

  The present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, in the above-described embodiment, an organic EL display device has been described as an example of an electro-optical device having a structure in which two substrates are bonded to each other. However, various other electro-optical devices (display devices) are available. It is possible to apply to.

It is a figure which shows the structure of the organic electroluminescence display which concerns on 1st Embodiment of this invention. It is a figure which shows the 1st bonding method which concerns on the same embodiment. It is a figure which shows the 2nd bonding method which concerns on the same embodiment. FIG. 6 is a diagram illustrating a configuration of an electro-optical device according to a second embodiment. It is the figure which illustrated the composition of the electronic equipment concerning the embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... OLED board | substrate, 101 ... Transparent base material, 102 ... Transparent electrode, 103 ... Septum, 104 ... Organic layer, 105 ... Cathode, 106 ... Separator, 12 ... Wiring board, 121 ... Base material, 122 ... Insulating layer, 123 ... Circuit chip 124... Electrode pad 140... Conductive adhesive 141. Internal sealant 142. Insulating adhesive 150. Insulating adhesive 150 for sealing outer peripheral portion 200 Organic EL display device

Claims (14)

A method for manufacturing a circuit board, in which a first substrate on which an electro-optic element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optic element is formed are bonded together,
Disposing a conductive adhesive electrically connecting the electro-optic element and the drive circuit on a metal pad formed on the second substrate;
A step of disposing an internal sealing agent having a viscosity lower than that of the conductive adhesive on the second substrate on which the conductive adhesive is disposed;
And a step of bonding the second substrate and the first substrate together. It is a step performed prior to the step of disposing the internal sealant, and further includes a step of disposing an outer peripheral portion sealant having a higher viscosity than the internal sealant on the outer peripheral portion of the second substrate. ,
The method for manufacturing a circuit board according to claim 1, wherein in the step of arranging the internal sealing agent, the internal sealing agent is arranged in a region surrounded by the outer peripheral portion sealing agent. A method for manufacturing a circuit board, in which a first substrate on which an electro-optic element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optic element is formed are bonded together,
Disposing a conductive adhesive that electrically connects the electro-optic element and the drive circuit at a position corresponding to a metal pad formed on the second substrate in the first substrate;
Disposing an internal sealant having a viscosity lower than that of the conductive adhesive on the first substrate on which the conductive adhesive is disposed;
And a step of bonding the second substrate and the first substrate together. It is a step performed prior to the step of disposing the internal sealant, and further includes the step of disposing an outer peripheral portion sealant having a higher viscosity than the internal sealant on the outer peripheral portion of the first substrate. ,
The method for manufacturing a circuit board according to claim 3, wherein in the step of arranging the internal sealing agent, the internal sealing agent is arranged in a region surrounded by the outer peripheral portion sealing agent.   5. The circuit board manufacturing method according to claim 1, wherein in the step of bonding the substrates, the second substrate and the first substrate are bonded together in a vacuum state. Method.   The circuit board according to any one of claims 1 to 5, wherein a viscosity ratio of the internal sealing agent when the conductive adhesive is used as a reference is 1/2 or less. Production method.   The method for manufacturing a circuit board according to any one of claims 1 to 6, wherein the internal sealing agent contains a spacer having a particle size corresponding to a gap between the substrates. .   The method for manufacturing a circuit board according to claim 1, wherein the internal sealing agent contains a desiccant. A method for manufacturing a circuit board having a structure in which a first substrate on which an electro-optic element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optic element is formed are bonded together. ,
Disposing a conductive adhesive electrically connecting the electro-optic element and the drive circuit on a metal pad formed on the second substrate;
Disposing an internal sealant having a lower viscosity than the conductive adhesive on the first substrate;
And a step of bonding the second substrate and the first substrate together. It is a step performed prior to the step of disposing the internal sealant, and further includes the step of disposing an outer peripheral portion sealant having a higher viscosity than the internal sealant on the outer peripheral portion of the first substrate. ,
The method for manufacturing a circuit board according to claim 9, wherein in the step of disposing the internal sealing agent, the internal sealing agent is disposed in a region surrounded by the outer peripheral portion sealing agent. A method for manufacturing a circuit board having a structure in which a first substrate on which an electro-optic element constituting a pixel is formed and a second substrate on which a drive circuit for driving the electro-optic element is formed are bonded together. ,
Disposing a conductive adhesive that electrically connects the electro-optic element and the drive circuit at a position corresponding to a metal pad formed on the second substrate in the first substrate;
Disposing an internal sealant having a viscosity lower than that of the conductive adhesive on the second substrate;
And a step of bonding the second substrate and the first substrate together. It is a step performed prior to the step of disposing the internal sealant, and further includes a step of disposing an outer peripheral portion sealant having a higher viscosity than the internal sealant on the outer peripheral portion of the second substrate. ,
The method for manufacturing a circuit board according to claim 11, wherein in the step of arranging the internal sealing agent, the internal sealing agent is arranged in a region surrounded by the outer peripheral portion sealing agent.   An electro-optical device comprising a circuit board manufactured by the method according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 13.

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