JP2006179718A - Blue optical element package and optical element package manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a blue optical element package which is small in size and high in accuracy and cost reduction.
A blue light transmissive resin layer 4 is formed of a blue light transmissive resin material having a characteristic of maintaining flexibility even in a cured state, and the whole is sealed with a light shielding resin layer 5 except for an input / output surface 4a. . The light shielding resin layer 5 is formed by filling the cavity 25 with a light shielding resin material in a state where the input / output surface 4 a of the blue light transmitting resin layer 4 is abutted against the inner surface of the molding die 24.
[Selection] Figure 9

Description

  The present invention relates to a blue optical element package, that is, a blue light receiving element package that receives a blue light signal and converts it into an electric signal, or a blue light emitting element package that converts an electric signal into a blue light signal and emits it, and an optical element package, The present invention relates to a method of manufacturing a light receiving element package that receives an optical signal and converts it into an electric signal, or a light emitting element package that converts an electric signal into an optical signal and emits it.

  In various electronic devices and the like, an optical element package for converting an optical signal and an electric signal is mounted. As shown in FIG. 12, the conventional optical element package 100 is configured by mounting an optical element chip 101 on a main surface 102a of a chip substrate (wiring substrate) 102, and is mounted on a mounting board via the chip substrate 102. Mounting is performed by a flip chip mounting method or the like. The optical element chip 101 has an element function having a predetermined layer structure on the main surface 103a of the semiconductor substrate 103, which has a function of converting an optical signal into an electric signal or converting an electric signal into an optical signal by a thin film technique and emitting the signal. The layer 104 and the input / output electrode 105 connected to the element function layer 104 through an appropriate circuit pattern (not shown) are formed.

  The optical element package 100 includes a connection land formed on the input / output electrode 105 and the chip substrate 102 by a wire bonding process in a state where the optical element chip 101 is bonded to the main surface 102a of the optical element chip 101 with respect to the chip substrate 102. 106 is connected by a wire 107 and mounted. In the optical element package 100, the surface of the element functional layer 104 constitutes a functional surface 104a that serves as an optical input unit that receives an optical signal or an optical output unit that emits an optical signal. Cover and protect with etc. In the optical element package 100, a light shielding resin layer 109 that suppresses exposure to the outer peripheral portion to increase light efficiency and holds the glass plate 108 is provided on the main surface 102a of the chip substrate 102 so as to surround the optical element chip 101. .

  In the conventional optical element package 100, the light shielding resin layer 109 is formed on the outer surface of the connection land 106 on the main surface 102 a of the chip substrate 102. It was difficult to achieve downsizing due to the large external shape. Further, in the conventional optical element package 100, it is difficult to realize cost reduction because a process of having the glass plate 108 and joining the minute glass plate 108 to the opening edge of the light shielding resin layer 109 is required.

  For example, in Patent Document 1, a sensor in which a sensor layer and a sensor electrode terminal are formed on an insulating substrate is fixed on a support material, and the epoxy resin is dropped after wire bonding the sensor electrode terminal and the electrode on the support material. A sensor with a fixed wire is disclosed. In the sensor, the surface of the sensor layer is covered with an insulating layer, and a necessary portion is left by photoetching. Further, the insulating layer is opened by a transfer molding process and sealed with resin.

JP 61-32535 A

  In electronic devices and the like, miniaturization and weight reduction, multi-functionality, and high functionality are achieved, and low cost is required, and an optical element package mounted on a mounting board is also required to be realized. The technique of Patent Document 1 described above is effective for miniaturization because the mold resin layer holds the wire and the joint portion. However, in this prior application technology, with the miniaturization of the sensor, the process of forming the insulating layer on the sensor layer or the process of forming the mold resin layer that opens only the necessary portions of the sensor layer requires higher precision. However, there is a problem that it is troublesome and the yield is poor and the cost cannot be reduced.

  By the way, in an optical element package, instead of a glass plate, a light-transmitting resin layer is applied by a so-called potting technique in which a light-transmitting resin that transmits light of a specific wavelength is directly dropped onto an optical input unit or optical output unit and then cured. In the same manner as a semiconductor package or the like, the whole is sealed with a light shielding resin. In a general red / infrared light optical element package, for example, a red / infrared light transmitting resin NT-8000 series manufactured by Nitto Denko is used. Such an optical element package has good characteristics because it has a small optical loss with respect to red / infrared light, is mass-produced by a simple process, and is provided at a relatively low cost.

  However, such an optical element package has a problem in that the yield characteristics are low due to peeling or contamination due to the poor adhesion characteristics of the light transmitting resin to the optical element chip. Further, in such an optical element package, since the heat resistance of the light-transmitting resin is low, it is necessary to perform soldering under a lower temperature condition during the mounting process on the mounting board.

  On the other hand, in the optical element package, with the practical use of blue light emitting diodes with a wavelength of about 400n, it has been adopted in, for example, the optical system for Blue-ray Disc (Blu-ray Disc) to achieve miniaturization and high performance. ing. Also in such a blue optical element package, it is preferable to form a light transmission type resin layer on the blue optical element chip by a potting technique as in the above-described red / infrared light optical element package. However, the currently available blue light transmission type resin has the property of maintaining flexibility even in a cured state, and is not suitable for use as a package resin, so it has been put to practical use. Not. As a blue light transmission resin, for example, a blue light transmission resin EG6301 made of Toray Dow Corning Silicone is provided.

  Accordingly, an object of the present invention is to provide a blue optical element package that is small, highly accurate, and inexpensive. It is another object of the present invention to provide a method for manufacturing a small and highly accurate optical element package that is intended to reduce costs and improve productivity.

  The blue optical element package according to the present invention that achieves the above-described object includes a blue optical element chip, a blue light transmitting resin layer, and a light shielding resin layer. In the optical element package, a blue optical element chip has an optical input unit or an optical output unit and an input / output electrode on the main surface of a semiconductor substrate, and converts blue light received by the optical input unit into an electrical signal or optically. A predetermined element functional layer that emits blue light based on an electrical signal from the output unit is formed. In the optical element package, the blue light transmissive resin layer covers the optical input part or the optical output part with a blue light transmissive resin that retains flexibility even in a cured state, and is on the element functional layer of the blue optical element chip. It is formed. In the optical element package, the light-shielding resin layer faces the blue light-transmitting resin layer to the outside and holds the wires connected to the input / output electrodes to encapsulate the optical element chip. In the optical element package, the light-shielding resin layer is molded from the light-shielding resin that is injected into the cavity of the molding die in which the optical element chip is loaded in the cavity by pressing the blue light-transmissive resin layer on the inner surface. Is done.

  In the blue optical element package configured as described above, a blue light transmitting resin that is not suitable as a resin for a package is used because of its flexibility in a cured state. A highly accurate blue light-transmitting resin layer is formed on the optical input unit or the optical output unit by a simple process. In the blue optical element package, the optical input portion or the optical output portion is covered with the blue light transmissive resin layer, so that the blue light transmittance is improved and the adhesion of dust, dust and the like is prevented. In the blue optical element package, the entire optical element chip and wires are mechanically and electrically protected by sealing the whole except the blue light transmitting resin layer with a light shielding resin layer having a slightly larger outer shape than the optical element chip. Thus, the reliability is improved and the size can be reduced to be almost the same as that of the optical element chip. In the blue optical element package, the blue light-transmitting resin layer maintains adhesion to the optical input part or the optical output part, so that it can be mounted on a mounting board without conditioning the low-temperature process in the subsequent process. Is possible.

  Moreover, the manufacturing method of the optical element package according to the present invention that achieves the above-described object includes an optical element chip forming step, a light-transmitting resin layer forming step, and a light-blocking resin layer forming step. An optical element package is manufactured in which the optical element chip is sealed with a light-shielding resin layer that holds the wires connected to the input / output electrodes while facing the resin layer outward. In the optical element package manufacturing method, in the optical element chip forming step, an optical input part that receives an optical signal or an optical output part that emits an optical signal and an input / output electrode are formed on the top surface of the semiconductor substrate. Then, an optical element chip is formed by converting a light signal received by the optical input unit into an electric signal or forming a predetermined element function layer that emits an optical signal based on the electric signal from the optical output unit. In the optical element package manufacturing method, in the light transmissive resin layer forming step, the resin layer formed on the element functional layer of the optical element chip is subjected to a patterning process for opening the optical input portion or the optical output portion, and the opening portion. A light transmissive resin layer that covers the optical input portion or the optical output portion is formed by filling and curing a liquid light transmissive resin. In the optical element package manufacturing method, in the light shielding resin layer molding step, a molding die for molding the light shielding resin layer for sealing the optical element chip is used, and the light transmitting resin layer is placed in the cavity of the molding die. The light shielding resin is injected into the cavity in a state in which the optical element chip is loaded while being pressed against the inner surface, thereby forming a light shielding resin layer.

  In the method of manufacturing the optical element package according to the present invention having the above-described steps, the optical input unit or the optical output unit is formed by a simple process of forming the light-shielding resin layer in a state where the light-transmitting resin layer is pressed against the cavity inner surface. Thus, an optical element package having a highly accurate light-transmitting resin layer that does not condition a low-temperature process in a subsequent process is maintained. In the method of manufacturing an optical element package, the entire optical element chip and wires are mechanically and electrically protected by sealing the whole except the light-transmitting resin layer with a light-shielding resin layer having a slightly larger outer shape than the optical element chip. As a result, an optical element package that is improved in reliability and reduced in size and having an outer shape substantially equivalent to that of the optical element chip is efficiently manufactured.

  According to the blue optical element package of the present invention, high-accuracy blue light that covers and adheres to the optical input unit or the optical output unit using a blue light transmitting resin that is not suitable as a package resin material. Since it has a transparent resin layer and has a light-shielding resin layer that seals the whole with a slightly larger outer shape than the optical element chip except this blue light transparent resin layer, it has excellent blue light transmission characteristics In addition, the reliability can be improved, and the size can be reduced and the cost can be reduced by improving the productivity.

  Further, according to the method for manufacturing an optical element package according to the present invention, the light-shielding resin layer is formed in a state where the light-transmitting resin layer is pressed against the inner surface of the cavity, so that the adhesion to the optical input unit or the optical output unit is improved. It is possible to efficiently manufacture an optical element package having a highly accurate light-transmitting resin layer that is held and improved in reliability. In the method of manufacturing an optical element package, the entire optical element chip and wires are mechanically and electrically protected by sealing the whole except the light-transmitting resin layer with a light-shielding resin layer having a slightly larger outer shape than the optical element chip. As a result, it is possible to improve the reliability and efficiently manufacture a miniaturized optical element package having an outer shape substantially equivalent to that of the optical element chip.

  Hereinafter, an optical element package 1 shown as an embodiment of the present invention and a manufacturing method thereof will be described in detail with reference to the drawings. The optical element package 1 is a blue light receiving element package that is mounted on, for example, an optical head of a Blu-ray disc recorder and receives return light emitted from a blue light emitting diode and reflected by a recording surface of the Blu-ray disc. . The optical element package 1 may be an optical element package that is provided in an optical signal waveguide and receives an optical signal transmitted through an optical fiber or the like, or a light emitting element package that emits an optical signal.

  As shown in FIG. 1, an optical element package 1 includes a conventionally provided blue optical element chip (hereinafter abbreviated as a chip) 2, a chip substrate 3 on which the chip 2 is mounted, and a blue light transmitting resin. A layer (hereinafter abbreviated as a light-transmitting resin layer) 4, a light shielding resin layer 5, and the like. The chip 2 has a function of receiving a blue light signal transmitted through an appropriate optical signal transmission path, converting it into an electric signal, and outputting it to the chip substrate 3 side. In the chip 2, although not described in detail, an element function layer 7 having a multilayer structure that performs the above-described optical signal-electric signal conversion function is formed on the main surface 6 a of the semiconductor substrate 6 by a semiconductor technique. A large number of external input / output electrodes 8 are formed through a wiring pattern (not shown) located in the outer peripheral region of the first electrode.

  In the optical element package 1, the chip substrate 3 is formed in an outer shape larger than the semiconductor substrate 6 of the chip 2 described above by an organic wiring substrate, a ceramic wiring substrate, or the like. On the chip substrate 3, the chip 2 is mounted on the first main surface 3 a, an appropriate wiring pattern (not shown) is formed surrounding the mounting area of the chip 2, and a large number of connection lands 9 are formed. . On the chip substrate 3, an appropriate wiring pattern (not shown) is formed on the second main surface 3b side, and a large number of mounting electrodes 10 are formed. In the chip substrate 3, the wiring pattern or connection land 9 on the first main surface 3 a side and the wiring pattern or mounting electrode 10 on the second main surface 3 b side are appropriately interlayer-connected by vias (not shown). Needless to say, the chip substrate 3 may be a multilayer wiring substrate.

  In the optical element package 1, the chip 2 is positioned in a region surrounded by the connection lands 9 on the first main surface 3 a with respect to the chip substrate 3, and the second main surface 6 b of the semiconductor substrate 6 is used as a bonding surface. It is die-bonded and bonded by heat curing. The chip substrate 3 is subjected to a wire bonding process to the bonded chip 2, and the external input / output electrode 8 facing the connection land 9 is connected by the wire 11, so that the chip 2 is attached to the first main surface. Mount on 3a. The chip substrate 3 is flip-chip mounted by the mounting electrode 10 on the second main surface 3b side when the optical element package 1 is mounted on a mounting board or the like (not shown).

  The optical element package 1 includes the above-mentioned Toray Dow Corning Silicone blue light transmissive resin in which the light transmissive layer 4 has a blue light transmissive characteristic and has a property of maintaining flexibility even in a cured state. EG6301 is used, and is formed to have a predetermined thickness on the main surface 6a of the semiconductor substrate 6 by a light transmission layer forming process described in detail later. The light transmission layer 4 is formed by patterning on the main surface 6a of the semiconductor substrate 6 so as to cover the functional element layer 7 and to expose the external input / output electrodes 8 described above. For the light transmission layer 4, an appropriate silicon-based transparent resin or epoxy-based transparent resin having blue light transmission characteristics is used, both of which have the characteristics described above.

  The optical element package 1 is molded by an injection molding process, which will be described later, using a black epoxy resin or the like used to seal the element, while the light shielding resin layer 5 blocks light used as a sealing resin for a general semiconductor package. Is done. As shown in FIG. 1, the light shielding resin layer 5 is formed on the main surface 3a of the chip substrate 3 so that the light receiving surface 4a of the light transmitting layer 4 faces outward and is integrated with the outer periphery thereof. The The light-shielding resin layer 5 prevents the element function layer 7 from receiving irregular light from the surroundings, and fixes and holds the wires 11 that connect the external input / output electrodes 8 to the opposing connection lands 9. Thus, the chip 2 is sealed on the chip substrate 3.

  In the optical element package 1 configured as described above, the return light composed of blue light reflected by the recording surface of the Blu-ray disc is received from the light receiving surface 4a of the light transmission layer 4 to receive the element function of the chip 2. Guide to layer 7. In the optical element package 1, the chip 2 performs a predetermined photoelectric conversion process on the return light received by the element function layer 7 to generate an electrical signal. In the optical element package 1, an electric signal is transmitted from the light transmission layer 4 to the connection electrode 9 of the chip substrate 3 through the external input / output electrode 8 and the wire 11, and the mounting electrode 10 through the via. To the mounting board side.

  In the optical element package 1, the element functional layer 7 is covered with the light transmissive resin layer 4 formed of a blue light transmissive resin that has not been used as a conventional package resin. Cost reduction is achieved by simplifying the process and improving productivity. In the optical element package 1, the chip 2 is sealed with the light-shielding resin layer 5 in a state where the element functional layer 7 is covered with the light-transmitting resin layer 4, thereby improving the reliability and the blue light receiving characteristics. Be able to.

  In the optical element package 1, the entire portion excluding the light transmitting resin layer 4 constituting the light receiving surface 4 a is sealed with the light shielding resin layer 5, so that intrusion of dust, moisture, or the like into the element function layer 7 or the internal circuit portion is performed. The reliability is improved by surely preventing. In the optical element package 1, the light shielding resin layer 5 regulates the warp of the chip substrate 3 and holds the wires 11, thereby improving the reliability. In the optical element package 1, the light-shielding resin layer 5 suppresses the influence of irregular light in the light-transmitting resin layer 4, thereby improving the light receiving efficiency.

  Note that the present invention is not limited to the blue light receiving element package shown as the above-described embodiment. For example, the light transmitting resin layer 4 is made of, for example, a red / infrared light transmitting material manufactured by Nitto Denko. It is also applied to a red light receiving element package molded with resin NT-8000 series. In such a red light receiving element package, since the adhesion between the light transmitting resin layer 4 and the element functional layer 7 is improved, the reliability can be improved and a low temperature process can be realized in a mounting process on a mounting substrate or the like. To do.

  The manufacturing process of the optical element package 1 described above includes a chip forming process for producing a plurality of chips 2 on a large wafer 15 and a light for forming a light transmitting resin layer 4 on each chip 2. A transparent resin layer forming step, and a wafer cutting step of cutting each chip 2 individually. The manufacturing process of the optical element package 1 includes a chip mounting process in which each chip 2 is die-bonded on a large-sized wiring board material 16, a wire bonding process, a chip sealing process, and an optical element package 1 that is divided into pieces. Process. In the chip formation process, the element function layer 7 having a multilayer structure that performs an optical signal-electric signal conversion function is formed on the main surface 15a of the wafer 15 by a thin film technique at a predetermined interval. Correspondingly, external input / output electrodes 8 are formed respectively.

  The light transmissive resin layer forming step includes a photosensitive resin layer forming step of forming a photosensitive resin layer 17 on the main surface 15a of the wafer 15 on which the element functional layer 7 is formed as shown in FIG. The photosensitive resin layer 17 is a resin layer formed to form the opening 18 corresponding to the light-transmitting resin layer 4 formed on each chip 2 and is formed with a slight thickness. The photosensitive resin layer 17 is formed by bonding, for example, a sheet-like resin film in consideration of controlling the layer thickness, and is formed by a spin coat method or the like generally applied when forming the resin layer. You may do it.

  The light transmissive resin layer forming step includes a masking step of superimposing a mask 20 provided with an opening 19 at a portion facing each element functional layer 7 on the photosensitive resin layer 17 as shown in FIG. The mask 20 shields other parts so that only the part facing the opening 19 can be exposed to each element functional layer 7.

  The light transmissive resin layer forming step includes a step of patterning the opening 18 by performing a photolithography process on the photosensitive resin layer 17. In the photolithography process, as is well known, the photosensitive resin layer 17 facing the opening 19 of the mask 20 is exposed and then developed to remove the photosensitive resin at the exposed portion, as shown in FIG. An opening 18 that exposes each element functional layer 7 to the outside is formed.

  As shown in FIG. 5, the light transmissive resin layer forming step is performed by using a blue light transmissive resin liquid 21 such as the above-described liquid Toray Dow Corning silicone blue light transmissive resin EG6301 in each opening 18 using, for example, a dispenser. A blue light transmissive resin liquid filling step. In the blue light transmissive resin liquid filling step, even if the thickness of the photosensitive resin layer 17 is not so precise and there is some variation in the depth of each opening 18, the filling amount of the blue light transmissive resin liquid 21 It is possible to form the light-transmitting resin layer 4 having a predetermined thickness by controlling the above. In the blue light transmissive resin liquid filling process, when the photosensitive resin layer 17 is formed by a precise layer forming process, the blue light transmissive resin liquid 21 is filled in each opening 18 by, for example, a printing method or the like. It is also possible to do.

  In the light transmitting resin layer forming step, the light transmitting resin layer 4 is formed by curing the blue light transmitting resin 21 in each opening 18 of the photosensitive resin layer 17 by performing heat treatment. The light transmissive resin layer 4 retains flexibility without being hardened even in a cured state due to the characteristics of the blue light transmissive resin. In the light transmissive resin layer forming step, etching is performed to remove the photosensitive resin layer 17 from the main surface 15a of the wafer 15, so that each element functional layer 7 is formed into a light transmissive resin layer as shown in FIG. On the main surface 15 a of the wafer 15, a large number of chips 2 that are sealed by 4 and expose the external input / output electrodes 8 are formed. In the light transmitting resin layer forming step, since the etching process is performed in a state where the precise element function layer 7 is sealed with the light transmitting resin layer 4, there is an influence on the element function layer 7 by the etching solution. Is prevented.

  In the wafer cutting step, the wafer 15 is cut into the size of the semiconductor substrate 6 between the adjacent external input / output electrodes 8 by the dicer 22 which omits the details, and each chip 2 is made one by one as shown in FIG. Carve out. In each chip 2, the element functional layer 7 is sealed with the light-transmitting resin layer 4 as described above, so that the influence of the cooling water supplied when the wafer 15 is cut or the mounting process on the chip substrate 3 is performed. The handling property is improved. In each chip 2, as shown in the figure, the element functional layer 7 is sealed by the light transmitting resin layer 4 on the main surface 6 a of the semiconductor substrate 6, and a large number of chips 2 are formed around the light transmitting resin layer 4. External input / output electrodes 8 are formed.

  Each chip 2 manufactured through the above processes is die-bonded to a large-sized wiring board 16 by a chip mounting process. Although not described in detail, a large number of connection lands 9 are formed on the wiring board 16 so as to surround the bonding region of each chip 2, and the connection lands 9 are formed on the bottom side via vias formed in the inner layer. In addition, a large number of mounting electrodes 10 are formed respectively. In the chip mounting process, for example, a thermosetting adhesive is applied to the second main surface 6a of the semiconductor substrate 6 and die-bonded onto the mounting region of the wiring board 16, and the adhesive is heated and cured to cure each chip 2. To fix.

  In the wire die bonding process, each chip 2 and the wiring board 16 are electrically connected. In the wire die bonding process, the external input / output electrodes 8 formed on the main surface 6a of the semiconductor substrate 6 and the connecting lands 9 facing each other are connected by wires 11, respectively, so that the package intermediate body 23 shown in FIG. To manufacture.

  In the chip sealing step, the package intermediate 23 is loaded into the cavity 25 of the molding die 24, and the light shielding resin layer 5 that seals each chip 2 is injection molded. Although the details of the molding die 24 are omitted, for example, the mold clamping operation of the movable die 24B is performed in a state where the package intermediate body 23 is positioned in the cavity 25 of the stationary die 24A. In the molding die 24, the cavity 25 is manufactured so that its height is equal to the thickness of the package intermediate body 23, and the light transmitting resin layer 4 is formed on the inner surface 24 b of the movable die 24 </ b> B in the clamped state as shown in FIG. 9. The light receiving surface 4b is pressed.

  In the chip sealing step, a light-blocking resin material such as black epoxy resin is injected from the nozzle 25a into the cavity 25 of the molding die 24, and the movable die 24B with respect to the stationary die 24A is passed through a predetermined curing time. The mold opening operation is performed. In the chip sealing step, the light-shielding resin layer 5 is formed on the main surface of the wiring board 16 so that the transparent resin layer 4 of each chip 2 faces only the light-receiving surface 4b outward and seals the outer periphery. . The light-shielding resin layer 5 seals and hardens the wires 11 that connect the external input / output electrodes 8 and the connecting lands 9 facing each other, thereby preventing the occurrence of peeling or the like at the connection site.

  In the chip sealing step, the light-shielding resin layer 5 with high accuracy is molded by a simple molding die by skillfully utilizing the characteristics of the blue light transmission resin material. In the chip sealing step, as described above, the light transmitting resin layer 4 formed of the blue light transmitting resin material that retains flexibility even in the cured state presses the light receiving surface 4b against the inner surface 24b of the movable mold 24B. The light shielding resin layer 5 is molded by the light shielding resin material injected into the cavity 25 while being elastically deformed. Therefore, in the chip sealing process, each chip 2 is reliably prevented from generating burr of the light shielding resin material on the light receiving surface 4b of the light transmitting resin layer 4, and the light shielding resin layer 5 is formed. In the chip sealing process, it is not necessary to form each light-transmitting resin layer 4 with high precision or to strictly control the height position with respect to the wiring substrate 16 and die-bond, thereby simplifying the process and improving productivity. To be able to.

  In the cutting process, the wiring substrate 16 is sized between the adjacent chips 2 by the dicer 22 whose details are omitted as shown in FIG. 10 with respect to the package intermediate body 23 taken out from the molding die 24. The optical element package 1 is manufactured by cutting into pieces one by one.

  The manufacturing process of the optical element package 1 described above has been described with respect to the manufacturing process of the blue light receiving element package using the blue light transmitting resin, but is also applied to the manufacturing process of the red / infrared light optical element package. Of course. The optical element package 1 is manufactured by forming the light-shielding resin layer 5 in a state where the light-receiving surface 4b of the light-transmitting resin layer 4 is pressed against the inner surface 24b of the molding die 24, so that the light-transmitting resin layer with respect to the semiconductor substrate 6 is formed. 4 is manufactured, and the light receiving surface 4b is prevented from generating burr of the light shielding resin material.

  In the manufacturing process of the optical element package 1, the optical element package 1 having the light-transmitting resin layer 4 integrated with the light-shielding resin layer 5 is manufactured using a simple process and a simple molding die 24. Costs and manufacturing costs are reduced, and an inexpensive optical element package 1 is obtained. In the manufacturing process of the optical element package 1, the light transmitting resin layer 4 that seals the element functional layer 7 is formed on the wafer 15, so that the handling in the subsequent process is simplified and the productivity is improved. Become.

  In the embodiment described above, the optical element package 1 in which the chip 2 is provided on the first main surface 3a of the chip substrate 3 has been described. However, instead of the chip substrate 3, for example, a metal frame having a large number of terminal pieces and The present invention can also be applied to an optical element package in which the chip 2 is integrated. The optical element package 30 shown in FIG. 11 is a so-called gull-wing type optical element package, and includes a chip 2 manufactured through the above-described steps, a lead frame 31, and a sealing resin layer 32.

  In the optical element package 30, the lead frame 31 has a die bond portion 33 for die-bonding the chip 2, although details thereof are omitted, and surrounds the die bond portion 33 and each tip portion is integrated by a connecting portion (not shown). And a large number of terminal pieces 34. The optical element package 30 is assembled by connecting the external input / output electrode 8 and the terminal piece 34 facing the chip 2 with the wire 11 on the die bonding portion 33. In the optical element package 30, the lead frame 31 assembled with the chip 2 is mounted in a cavity of a molding die (not shown), and the sealing resin layer 32 is molded. After the optical element package 30 is taken out from the molding die after a predetermined curing time, the optical element package 30 is subjected to a connecting portion cutting step for separating the terminal pieces 34 protruding from the sealing resin layer 32 from the lead frame 31. Manufactured.

  Also in the optical element package 30, each chip 2 is formed with a light transmitting resin layer 4 that seals the element functional layer 7 on the wafer 15, and the light receiving surface 4 a of each light transmitting resin layer 4 is formed on the inner surface of the cavity. The lead frame 31 is loaded into a molding die so as to be pressed, and the sealing resin layer 32 is molded. Therefore, the entire optical element package 30 is sealed by the sealing resin layer 32 with only the light receiving surface 4a of the light transmitting resin layer 4 facing outward as shown in the figure. In the optical element package 30, the sealing resin layer 32 is formed of a light shielding resin material in the same manner as the light shielding resin layer 5 described above.

  Also in the optical element package 30 configured as described above, the element functional layer 7 is covered with the light-transmitting resin layer 4 formed of a blue light-transmitting resin that has not been used as a conventional resin for a package. In addition, the cost can be reduced by simplifying material costs and manufacturing processes and improving productivity. Also in the optical element package 30, the chip 2 is sealed with the sealing resin layer 32 in a state where the element functional layer 7 is covered with the light transmitting resin layer 4, thereby improving the reliability and the blue light receiving characteristics. Become figured.

  In the optical element package 30, the entire portion excluding the light transmitting resin layer 4 and each terminal piece 34 constituting the light receiving surface 4 a is sealed with the light shielding resin layer 5, so that dust or dirt on the element function layer 7, the internal circuit portion, etc. Reliability is improved by reliably preventing intrusion of moisture and the like. In the optical element package 30, the sealing resin layer 32 holds the wire 11, thereby improving the reliability. In the optical element package 30, the sealing resin layer 32 suppresses the influence of the scattered light in the light transmitting resin layer 4, thereby improving the light receiving efficiency. Of course, the optical element package 30 is not limited to the blue light receiving element package, and is also applicable to the red light receiving element package.

It is sectional drawing of an optical element package. It is a manufacturing process figure of an optical element package, and is explanatory drawing of the photosensitive resin layer formation process which forms the photosensitive resin layer on the main surface of the wafer in which the element function layer and the external output electrode were formed. It is explanatory drawing of the masking process which piled up the mask on the photosensitive resin layer. It is explanatory drawing of the patterning process of patterning an opening part in the photosensitive resin layer. It is explanatory drawing of the light transmissive resin liquid filling process which fills each opening part of the photosensitive resin layer with a light transmissive resin liquid. It is explanatory drawing of the removal process of the photosensitive resin layer. It is explanatory drawing of the cutting process of a wafer. It is explanatory drawing of the die-bonding process of the chip element to a wiring board. It is explanatory drawing of the process of loading the package intermediate body which passed through the die-bonding process and the wire bonding process to a shaping die, and shape | molding the light shielding resin layer. It is explanatory drawing of the cutting process of a wiring board. It is sectional drawing of the gull wing type | mold optical element package shown as other embodiment. It is sectional drawing of the conventional optical element package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical element package, 2 chip | tip (blue optical element chip | tip), 3 chip | tip board | substrate (wiring board), 4 light transmission resin layer, 5 light shielding resin layer, 6 semiconductor substrate (wafer), 7 element functional layer, 8 external input / output electrode , 9 Connection land, 10 Mounting electrode, 11 Wire, 15 Wafer, 16 Wiring board, 17 Photosensitive resin layer, 18 Opening, 19 Opening, 20 Mask, 21 Blue light transmitting resin liquid, 22 Dicer, 23 Package intermediate, 24 Mold, 25 Cavity, 30 Optical element package, 31 Lead frame, 32 Sealing resin layer, 33 Die bond part, 34 Terminal piece

Claims (8)

A blue light signal that has an optical input unit or an optical output unit and an input / output electrode on the main surface of the semiconductor substrate and that is received by the optical input unit is converted into an electrical signal or blue based on the electrical signal from the optical output unit A blue optical element chip formed with a predetermined element functional layer for emitting an optical signal;
It is formed by curing a liquid blue light transmissive resin that retains flexibility even in a cured state, and is formed on the element functional layer of the blue optical element chip so as to cover the optical input part or the optical output part. A blue light-transmitting resin layer,
A light-shielding resin layer that faces the blue light-transmitting resin layer and holds the wires connected to the input / output electrodes and seals the blue optical element chip;
The light-shielding resin layer is molded by a light-shielding resin that is injected into the cavity of a molding die in which the blue optical element chip is loaded into the cavity by pressing the blue light-transmissive resin layer on the inner surface. A blue optical element package.   The blue optical element chip is bonded to the main surface of the wiring board while the semiconductor substrate is bonded to the main surface of the wiring board and the input / output electrodes are wire-bonded to a connection land formed on the wiring board. The blue optical element package according to claim 1, wherein the blue optical element package is sealed with the light-shielding resin layer formed on the molding die.   In a state where the blue optical element chip is wire-bonded to each terminal piece having the input / output electrodes formed on the lead frame, the whole is loaded into the cavity of the molding die, and the light-shielding resin layer is molded. The blue optical element package according to claim 1, wherein the blue optical element package is sealed. An optical signal having an optical input unit or an optical output unit and an input / output electrode on the main surface of the semiconductor substrate, converted into an electrical signal from the optical input unit, or based on the electrical signal from the optical output unit An optical element chip forming step of forming an optical element chip formed by forming a predetermined element functional layer that emits light;
The resin layer formed on the element functional layer of the optical element chip is subjected to a patterning process for opening the optical input portion or the optical output portion, and the opening portion is filled with a liquid light-transmitting resin and cured. A light transmissive resin layer forming step of forming a light transmissive resin layer covering the optical input part or the optical output part,
A molding die for molding the light-shielding resin layer for sealing the optical element chip is used. After the optical element chip is loaded by pressing the light-transmitting resin layer into the cavity of the molding die, the light shielding is performed. A light-shielding resin layer molding step of injecting a light-sensitive resin into the cavity to mold a light-shielding resin layer,
An optical element package in which the optical element chip is sealed with the light-shielding resin layer that holds the wires connected to the input / output electrodes while facing the light-transmitting resin layer outward is manufactured. Manufacturing method of optical element package. The optical element chip forming step and the light-transmitting resin layer forming step collectively form a large number of the optical element chips on the main surface of the wafer, and each of the optical element chips transmits the light transmitting material. A step of forming a functional resin layer,
As a post-process of the light transmissive resin layer forming step, a wafer cutting step of cutting the wafer and cutting the optical element chips one by one, and each of the cut optical element chips on the main surface of the wiring board, respectively. After performing a wire bonding step for connecting the connection land formed on the wiring board and connecting the input / output electrode,
A light-shielding resin layer molding step for collectively sealing a plurality of the optical element chips with the light-shielding resin layer on the wiring board;
The wiring board and the light-shielding resin layer are cut and a wiring board cutting step for cutting the optical element packages one by one is performed. 5. The method of manufacturing an optical element package according to claim 4, wherein an optical element package in which the optical element chip is sealed with the light-shielding resin layer that holds the wire connected to the connection land is manufactured. The optical element chip has a function of converting a blue light signal received by the optical input unit into an electric signal in the element function layer, or a blue light signal based on the electric signal is generated in the element function layer and emitted from the optical output unit. A blue optical element chip having a function of
The light transmissive resin layer is molded by a blue light transmissive resin that retains flexibility even in a cured state,
In the light-shielding resin layer molding step, the light-shielding resin is placed in the cavity in a state in which each optical element chip is loaded into the cavity of the molding die by pressing the light-transmitting resin layer formed on the inner surface. The method for manufacturing an optical element package according to claim 4, wherein the light shielding resin layer is molded by injection. The light-transmitting resin layer forming step
A photosensitive resin layer forming step of covering the element functional layer on the main surface of the semiconductor substrate and forming a photosensitive resin layer over the entire surface;
A patterning step of forming an opening in the opposite portion of the optical input portion or the optical output portion by a photolithographic method with respect to the photosensitive resin layer;
A light transmissive resin filling step of filling the liquid transmissive resin into each of the openings;
A light transmissive resin curing step of curing each of the light transmissive resins;
The method for manufacturing an optical element package according to claim 4, further comprising a photosensitive resin layer removing step of removing the photosensitive resin layer insulating layer from the main surface of the semiconductor substrate. As a subsequent step of the light transmissive resin layer forming step,
A wafer cutting step of cutting the wafer to cut the optical element chips one by one and a wire bonding step of connecting the cut optical element chips to the input / output electrodes of the lead frame terminal pieces. After
A light-shielding resin layer molding step in which the lead frame is loaded into a cavity of the molding die, and a large number of the optical element chips are collectively sealed with a light-shielding resin layer;
The light-transmitting resin layer is exposed to the outside through a cutting step of cutting the light-shielding resin layer and the lead portion of the lead frame and cutting the optical element packages one by one. 5. The optical element package in which the optical element chip is sealed with the light-shielding resin layer that holds the wire connecting the electrode and the terminal piece and protrudes the terminal piece. The manufacturing method of the optical element package of description.

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