JP2006168233A - Liquid discharge head and inkjet recording apparatus - Google Patents

Abstract

An object of the present invention is to reduce troubles caused by cracking or peeling of a sealing portion for sealing an inner lead of an electric wiring board (TAB).
A head substrate H1100, which is an element chip, is aligned with a device hole H1302 of an electric wiring substrate H1300, and both are fixed to a base plate H1200 via a support plate H1400. The inner lead H1303 of the electrical wiring board H1300 is connected to the electrical connection portion of the head board H1100, the chip substrate sealing material 19 is filled around the head board H1100, and the inner lead H1303 is connected to the ILB from the surface side of the electrical wiring board H1300. Sealing is performed with the sealing material 20. In order to prevent the ILB sealing material 20 from flowing out onto the chip periphery sealing material 19, a recess 22 for capturing the ILB sealing material 20 is provided on the surface of the electric wiring board H 1300.
[Selection] Figure 1

Description

  The present invention relates to a liquid discharge head and an ink jet recording apparatus using the same.

As shown in FIG. 17, which is a conventional ink jet recording apparatus disclosed in Patent Document 1, an upper plate member which is a silicon substrate having discharge pressure generating means and an orifice plate having discharge port arrays 116. 117, etc., and an electric wiring substrate (head substrate 110, which is an element chip on which an electrical connection portion for electrical connection to the outside is formed, an external signal input terminal 131, a device hole 132, an inner lead 133, etc. TAB) 130 and a support plate (not shown) that holds the electrical wiring substrate 130 and has an opening surrounding the head substrate 110. As shown in FIG. 18, the head substrate 110 includes the electrical connection portion and the inner lead 133. Is held by the base plate 200 so as to be connected, and the periphery of the head substrate 110 is filled with a chip peripheral sealing material 119. Is, the electrical connection between the inner lead 133 and the head substrate 110 is sealed by the ILB sealant 120.
JP 2002-79675 A

  In the above-described conventional liquid discharge head, a part of the ILB sealing material 120 flows onto the previously-sealed sealing material 119 around the chip, and the flowed end portion becomes a thin skin state to generate sink marks 120a. was there. That is, in an ideal sealing state of the ILB sealing material 120 and the chip periphery sealing material 119, the one in which the ILB sealing material 120 is applied on the electric wiring board 130 as shown in FIG. Due to the fluidity of the ILB sealing material 120, a part of the ILB sealing material 120 flows into the chip peripheral sealing material 119 as shown in FIG.

  As described above, when a part of the ILB sealing material 120 flows onto the chip peripheral sealing material 119, the sink of the ILB sealing material 120 that has flowed onto the chip peripheral sealing material 119 due to a change in the external heat or the like. A crack is generated in 120a, and accordingly, a crack is also generated in the chip periphery sealing material 119. As a result, there is a possibility that the reliability of the ink discharge performance is lowered.

  In addition, since the surface of the electrical wiring board is made of polyimide, the adhesion to the sealing material is usually weak, and the entire surface of the orifice plate is applied to the sealing material that has cracked on the surface of the electrical wiring board during high-speed printing. When the blade for wiping off contacts, the sealing material is peeled off from the surface of the electric wiring board during the ink wiping operation, and this causes a defect such that the ink penetrates into the inner lead connecting portion and corrodes. In this case, the peeled off sealing material may tear off and adhere to the orifice plate.In addition, the ink has been improved and the use of an unprecedented ink solvent has been strengthened in order to improve the quality of printing in the future. In the case of alkalinization or the like, a defect that the sealing material is peeled off from the surface of the electrical wiring board and the sealing material interface and the ink penetrates into the inner lead portion and corrodes may cause serious performance deterioration. .

  The present invention has been made in view of the above-mentioned unsolved problems of the conventional techniques, and can reduce troubles in the sealing portion of the electric wiring board and improve the reliability of the discharge performance and ink jet recording. The object is to provide an apparatus.

  In order to achieve the above object, a liquid discharge head according to the present invention includes an element chip having discharge means for discharging a liquid, an electric wiring board having an inner lead connection portion connected to an electric connection portion of the element chip, A sealing portion for sealing the inner lead connecting portion from the surface side of the electrical wiring board, and a recess for capturing the sealing material of the sealing portion is formed on the surface of the electrical wiring board. It is characterized by being.

  Providing a recess on the surface of the electrical wiring board to prevent the sealing material of the sealing part that seals the inner lead connection part from flowing out beyond the predetermined sealing area, resulting from cracks in the sealing part, etc. The deterioration of reliability due to leakage of liquid such as ink is avoided.

  In addition, the adhesive area between the electrical wiring board and the sealing material is improved by the increase in the adhesion area of the sealing part to the sealing material due to the recess on the electrical wiring board and the anchor effect, and the inner lead due to peeling of the sealing material It is possible to realize a more reliable liquid discharge head that suppresses the intrusion of liquid into the connection portion and suppresses the occurrence of connection failure due to corrosion of the inner lead connection portion.

  As shown in FIG. 1, a print head H1001 that is a liquid discharge head includes an upper plate member (nozzle plate) 17 having discharge port arrays 16 that are discharge means, discharge pressure generating means and an electrically external device as will be described later. An electric wiring board having an inner lead connecting part by an external signal input terminal H1301, a device hole H1302, and an inner lead H1303. (TAB) H1300, support board H1400 having an opening that holds electrical wiring board H1300 and surrounds head board H1100, and the head board H1100 is supported so that the electrical connection part of head board H1100 and inner lead H1303 are connected. It has a base plate H1200 that fixes and supports the plate H1400 The periphery of the head substrate H1100 fixed in the device hole H1302 is filled with a chip peripheral sealing material 19 that forms a first sealing portion, and the electrical connection between the inner lead H1303 and the head substrate H1100 is the second. It is sealed with an ILB sealing material 20 that forms a sealing portion.

  In the application region of the ILB sealing material 20 on the electric wiring substrate H1300, a recess 22 is provided in a portion close to the inner lead connection portion. That is, as shown in FIG. 2, a non-penetrating recess 22 for storing a part of the ILB sealing material 20 is provided so that the ILB sealing material 20 does not flow onto the chip periphery sealing material 19.

  In this way, using an electrical wiring board provided with a recess that is a concave step that does not penetrate in the application region of the ILB sealing material, a part of the applied ILB sealing material is captured in this recess. This prevents the ILB sealing material from flowing onto the chip peripheral sealing material. Further, the ILB sealing material filled in the recesses has an effect of preventing peeling of the surface of the electric wiring board and the ILB sealing material interface due to an increase in the adhesion area and an anchor effect. Needless to say, the recesses on the surface of the electric wiring board are arranged to avoid the wiring area of the inner leads.

  As the sealing material, a thermosetting epoxy resin, a room temperature curing silicone resin, or the like is used.

  As shown in FIG. 1, a recess 22 that is a vertical hole (depth 0.1 mm) of □ 1.0 mm × 0.4 mm is provided on the surface of the electric wiring board H1300. The electric wiring board H1300 is pressure-bonded to the support plate H1400 to which the head substrate H1100 is bonded at a predetermined position so that the inner leads H1303 are aligned, and then ILB connection is performed, and then the chip peripheral sealing material 19 and the ILB sealing are performed. Sealing with the material 20 was performed. At this time, as shown in FIG. 2, it was confirmed that the recess 22 was partially filled with the ILB sealing material 20, and the ILB sealing material 20 did not flow onto the chip peripheral sealing material 19. .

  As the sealing material, a thermosetting one-pack type epoxy resin sealing material having higher hardness after thermosetting than the chip peripheral sealing material 19 is used as the ILB sealing material 20. A thermosetting one-pack type epoxy resin sealing material having higher fluidity than the stopper 20 was used, and these were simultaneously cured.

  The ink jet printer, which is a recording apparatus on which the print head H1001 thus mounted, is mounted is subjected to an H / S test, an ink wiping blade durability test, and a blade durability test after ink immersion (PCT). Similar to the example, the same performance evaluation was performed for the comparative example having no recess in the electrical wiring board. The H / S test applies a thermal shock from 0 ° C. to 100 ° C. and gives 100 cycles of thermal shock at each temperature of 30 minutes. In the ink wiping blade durability test, an H-NBR blade is used and the orifice plate portion made of the upper plate member 17 is continuously wiped to evaluate the number of times the blades are wiped when the sealing materials 19 and 20 are peeled off. It is. Ink immersion (PCT) is to place the print head H1001 in ink adjusted to pH 11 and store it at 120 ° C. and 2 atm for 10 hours.

  As shown in Table 1 at the end, as a result of the H / S test, cracks in the chip peripheral sealing material did not occur in this example. Further, as a result of the ink wiping blade durability test, it was confirmed that the durability of the comparative example was about 1.4 times that of the conventional example. In the blade durability test after ink immersion, 1.3 times durability was confirmed. Thus, a highly reliable inkjet printer could be obtained.

  As shown in FIG. 3, the electrical wiring board H1300 was provided with a recess 23 that is a concave lateral hole (depth 0.1 mm) of □ 0.2 mm × 1.0 mm. As in Example 1, it was confirmed that the recess 23 was filled with the ILB sealing material, and the ILB sealing material did not flow onto the chip periphery sealing material. When the effect confirmation test was carried out in the same manner as in Example 1, as shown in Table 1, no cracking around the chip sealing material after the H / S test occurred. Further, the durability of the ink wiping blade was confirmed to be about 1.3 times that of the conventional one, and the blade durability test after the ink PCT was confirmed to be about 1.3 times the durability. Thus, a highly reliable inkjet printer could be obtained.

  As shown in FIG. 4, a recess 24, which is a concave round hole (depth 0.1 mm) of φ0.5 mm, was provided. As in Example 1, it was confirmed that the recess 24 was filled with the ILB sealing material, and the ILB sealing material did not flow onto the chip periphery sealing material. When the effect confirmation test was carried out in the same manner as in Example 1, as shown in Table 1, no cracking around the chip sealing material after the H / S test occurred. Further, the durability of the ink wiping blade was confirmed to be about 1.2 times that of the conventional one, and the durability of the blade after the ink PCT was confirmed to be about 1.1 times. Thus, a highly reliable inkjet printer could be obtained.

  As shown in FIG. 5, a large number of narrow recesses 25, which are concave vertical holes (depth 0.1 mm) of □ 0.5 mm × 0.1 mm, are provided so as to avoid the wiring portion of the inner lead H1303. As in Example 1, it was confirmed that the recess 25 was filled with the ILB sealing material, and the ILB sealing material did not flow onto the chip periphery sealing material. When the effect confirmation test was carried out in the same manner as in Example 1, as shown in Table 1, no cracking around the chip sealing material after the H / S test occurred. In addition, the durability of the ink wiping raid was confirmed to be about 1.2 times that of the conventional method, and the durability of the blade after the ink PCT was confirmed to be about 1.1 times. Thus, a highly reliable inkjet printer could be obtained.

  Next, the overall configuration of the ink jet recording apparatus using the print head H1001 according to the first embodiment will be described. As shown in FIGS. 6 to 8, the printing operation mechanism housed and held in the printer main body M1000 includes an automatic feeding unit M3022 that automatically feeds a print medium (recording medium) into the printer main body M1000. A print medium sent one by one from the automatic feeding unit M3022 is guided to a desired print position, and a transport unit M3029 is configured to guide the print medium from the print position to the discharge unit M3030, and the print medium transported to the print position The printing unit includes a printing unit that performs predetermined printing, and a recovery unit M5000 that performs recovery processing on the printing unit.

  The printing unit includes a carriage M4001 that is movably supported by a carriage shaft M4021, and a head cartridge H1000 that is detachably mounted on the carriage M4001.

(Head cartridge H1000)
The head cartridge H1000 that constitutes a part of the print unit will be described with reference to FIGS. That is, in the head cartridge H1000, as shown in FIG. 9, a tank holder H1500 on which an ink tank H1900 for storing ink is mounted, and ink supplied from the ink tank H1900 via the tank holder H1500 according to print information. A print head H1001 that discharges from the discharge port array 16; The head cartridge H1000 employs a so-called cartridge system that is detachably mounted on the carriage M4001.

  For the head cartridge H1000 shown here, for example, black, light cyan, light magenta, cyan, magenta, and yellow independent ink tanks H1900 are provided to enable high-quality color printing for photographs. By operating an elastically deformable detachable lever H1901 that is provided in each ink tank H1900 and can be locked with respect to the head cartridge H1000, each of them is attached to the tank holder H1500 of the print head H1001. Can be removed.

  As shown in the exploded perspective view of FIG. 9, the print head H1001 includes a head substrate H1100, a base plate H1200, an electric wiring substrate H1300, a support plate H1400, and the like. , And a seal rubber H1800.

  As shown in FIG. 10, the head substrate H1100 includes a plurality of electrothermal transducers that are a plurality of ejection pressure generating means for ejecting ink onto one surface of the silicon substrate 11 that is the main body, and power to each electrothermal transducer. An electrical wiring such as aluminum is supplied by a film forming technique, and a plurality of ink paths and a plurality of discharge ports corresponding to the electrothermal transducer are formed by a photolithography technique. An ink passage for supplying ink is formed to open on the back surface. The head substrate H1100 is bonded and fixed to the base plate H1200, and an ink supply path H1201 for supplying ink to the head substrate H1100 is formed here. Further, a support plate H1400 having an opening H1401 is bonded and fixed to the base plate H1200, and an electrical wiring substrate H1300 that is electrically connected to the head substrate H1100 is joined to the support plate H1400. . The electrical wiring substrate H1300 is for applying an electrical signal for ejecting ink to the head substrate H1100. The electrical wiring substrate H1300 is located at an end portion of the electrical wiring corresponding to the head substrate H1100 and the printer body M1000. And an external signal input terminal H1301 for receiving an electrical signal from the tank. The external signal input terminal H1301 is positioned and fixed on the back side of a tank holder H1500 described later.

  A flow path forming member H1600 is fixed to a tank holder H1500 that detachably holds the ink tank H1900, for example, by ultrasonic welding, and an ink flow path H1501 from the ink tank H1900 to the flow path forming member H1600 is formed. A filter H1700 is provided at the ink tank side end of the ink flow path H1501 that engages with the ink tank H1900, and can prevent dust from entering from the outside. A seal rubber H1800 is attached to the engaging portion with the ink tank H1900 so that ink can be prevented from evaporating from the engaging portion.

  A tank holder H1500 in which a flow path forming member H1600, a filter H1700, a seal rubber H1800, and the like are integrally assembled is bonded to a print head H1001 including a head substrate H1100, a base plate H1200, an electrical wiring substrate H1300, a support plate H1400, and the like. The head cartridge H1000 is configured by coupling through an agent or the like.

(Carriage M4001)
As shown in FIG. 7, a carriage M4001 on which the head cartridge H1000 is mounted is engaged with a carriage cover M4002 for guiding the head cartridge H1000 to a predetermined mounting position on the carriage M4001, and a tank holder H1500 of the head cartridge H1000. In addition, a head set lever M4007 that presses the head cartridge H1000 to be set at a predetermined mounting position is provided.

  That is, the head set lever M4007 is provided at the upper part of the carriage M4001 so as to be rotatable with respect to the head set lever shaft, and a spring-set head set plate (not shown) at the engaging portion with the head cartridge H1000. The head cartridge H1000 is attached to the carriage M4001 while pressing the head cartridge H1000 by this spring force, and the head set lever M4007, the head set lever shaft, the head set plate, etc. function as the attaching / detaching means of the present invention. ing.

  A contact FPC (Flexible Print Cable) (not shown) is provided at another engagement portion of the carriage M4001 with the head cartridge H1000, and a contact portion on the contact FPC and a contact portion (external signal input terminal) provided on the head cartridge H1000. ) H1301 is in electrical contact with each other so that various information for printing can be exchanged and power can be supplied to the head cartridge H1000.

  An elastic member such as rubber (not shown) is provided between the contact portion of the contact FPC and the carriage M4001, and the contact portion H1301 and the carriage M4001 are formed by the elastic force of the elastic member and the pressing force by a headset lever spring (not shown). It is designed to enable reliable contact with the The contact FPC is connected to a carriage substrate (not shown) mounted on the back surface of the carriage M4001.

(Print head H1001)
The print head H1001 that constitutes a part of the head cartridge H1000 will be described in more detail with reference to FIGS. The base plate H1200 is formed of alumina (Al ₂ O ₃ ) having a thickness of, for example, 0.5 to 10 mm. As a material constituting the base plate H1200, a linear expansion coefficient of a material of the head substrate H1100 is used. Any material having an equivalent linear expansion coefficient and a thermal conductivity equal to or higher than that of the material of the head substrate H1100 may be used. For example, silicon (Si), aluminum nitride (AlN), zirconia ( ZrO ₂ ), silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), or tungsten (W) may be used. The base plate H1200 is formed with respective ink supply paths H1201 for supplying a plurality of inks to the head substrate H1100. The ink passages 12 of the head substrate H1100 correspond to the ink supply paths H1201 of the base plate H1200, respectively. In addition, the head substrate H1100 is bonded and fixed to the base plate H1200 at a predetermined position with high accuracy.

  The support plate H1400 is formed of alumina having a thickness of, for example, 0.5 to 1 mm. Like the base plate H1200, the support plate H1400 has a linear expansion coefficient equivalent to that of the head substrate H1100, and its thermal conductivity. It is preferable that the material has the same or higher thermal conductivity. The support plate H1400 has an opening H1401 larger than the outer dimension of the head substrate H1100 bonded and fixed to the base plate H1200, so that the head substrate H1100 and the electrical wiring substrate H1300 can be electrically connected in substantially the same plane. The back surface of the electric wiring board H1300 is bonded and fixed to the support plate H1400. The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the head substrate H1100. A device hole H1302 for incorporating the head substrate H1100 and a connection terminal that is an electrical connection portion of the head substrate H1100. 14 and an external signal input terminal H1301 for receiving an electrical signal from the printer main body M1000 located at the end of the wiring.

  The head substrate H1100 is obtained by forming discharge pressure generating means, an ink chamber 15 and the like on a silicon substrate 11 having a thickness of 0.5 to 1 mm using a film forming technique.

  The silicon substrate 11 is formed with an elongated ink passage 12 penetrating therethrough. The ink passage 12 is formed by anisotropic etching using the crystal structure of the silicon substrate 11. That is, when the crystal plane of the surface of the silicon substrate 11 is (100) and the crystal plane in the thickness direction is (111), anisotropic etching is performed using an alkaline etching solution such as KOH, TMAH, or hydrazine. Thus, the ink passage 12 having an inclined surface with an angle of about 54.7 degrees is formed. On both sides of the ink passage 12, a plurality (for example, 128 pieces on one side) of the electrothermal transducers 13 arranged in two rows at predetermined intervals along the longitudinal direction of the ink passage 12 are formed in a state where they are shifted from each other by a half pitch. It constitutes a discharge pressure generating means.

  In addition to the electrothermal transducer 13 and the connection terminal 14, the silicon substrate 11 is provided with electrical wiring (not shown) that conducts the electrothermal transducer 13 and the connection terminal 14. A drive signal for the electrothermal transducer 13 is supplied together with drive power from a drive IC (not shown). On the silicon substrate 11, an upper plate member 17 having a plurality of discharge port arrays 16 respectively facing the electrothermal transducer 13 through an ink chamber 15 communicating with the ink passage 12 is formed. That is, an ink path 18 communicating with the ink passage 12 and the individual ink chambers 15 is formed between the upper plate member 17 and the silicon substrate 11, and these are formed by photolithography technology in the same manner as the ejection port array 16. It is formed together with the plate member 17. On the connection terminal 14 side of the upper plate member 17, a groove-like dam portion 21 extending along the arrangement direction of the connection terminals 14 is formed, and an ILB sealing material 20 described later is connected to the connection terminal 14 and the inner member. When applying to the connection portion with the lead H1303, the ILB sealing material 20 is prevented from flowing into the weir portion 21 and flowing out to the discharge port array 16 side.

  The liquid supplied into each ink chamber 15 from the ink passage 12 boils as the electrothermal transducer 13 generates heat, when a drive signal is given to the corresponding electrothermal transducer 13 in the ink chamber 15. The air is generated from the discharge port array 16 by the pressure of the generated bubbles.

  A rectangular opening H1401 surrounding the head substrate H1100 is formed in the support plate H1400, and the side surface of the head substrate is protected from ink, dust, and the like in this opening and a groove formed on the side surface of the base plate H1200 and the head substrate H1100. A chip peripheral sealing material 19 for filling is filled. The thickness t of the support plate H1400 is thicker than the height from the surface of the base plate H1200 to the upper end of the connection terminal 14 of the head substrate H1100 so that the inner leads H1303 of the electrical wiring substrate H1300 do not contact the edge of the head substrate H1100. Is set.

  The print head manufacturing procedure described above will be briefly described with reference to FIGS. 14 to 16. First, the head substrate H1100 is integrally bonded to a predetermined position on the surface of the base plate H1200 using an adhesive, and then the base plate H1200. The ink supply path H1201 and the ink path 12 of the silicon substrate 11 are communicated with each other. The adhesive used here is preferably an ink-resistant one that can form a low-viscosity and thin adhesive layer (for example, 50 μm or less) and has a relatively high hardness after curing. A thermosetting adhesive as a component can be used. The adhesive is applied around the ink supply path H1201 formed in the base plate H1200 so that the ink does not leak from the ink supply path H1201 to the outside. Similarly, a support plate H1400 is joined to the surface of the base plate H1200 using an adhesive so as to surround the head substrate H1100 (see FIG. 14).

  Thereafter, the electric wiring board H1300 is bonded and fixed to the support plate H1400. At this time, the inner lead H1303 of the electric wiring board H1300 is positioned to the connection terminal 14 of the head board H1100 so that it can be connected. Electrical connection is made by technology (see FIG. 15).

  Next, the chip periphery sealing material 19 is poured into a space formed by the head substrate H1100 on the base plate H1200 and the opening H1401 of the support plate H1400. At this time, the chip periphery sealing material 19 is poured below the inner lead H1303 from the opening on the side surface of the head substrate (see FIG. 16). The chip periphery sealing material 19 seals at least the side surface of the head substrate H1100, the connection terminal 14, and the lower portion of the inner lead H1303.

  Next, after the chip periphery sealing material 19 is cured, the ILB sealing material 20 is applied to the upper portion of the inner lead H1303 so as to cover the inner lead H1303, and then cured and sealed (see FIGS. 11 and 12). The ILB sealing material 20 and the chip periphery sealing material 19 are sealing materials having different characteristics because of different uses. However, as shown in FIG. 10, the recess 22 is formed on the surface of the electric wiring board H1300. Therefore, a part of the ILB sealing material 20 can be prevented from flowing out onto the chip peripheral sealing material 19.

1A and 1B show a main part of a print head according to a first embodiment, where FIG. 1A is a perspective view and FIG. 1B is a perspective view showing only an electric wiring board of FIG. It is a schematic cross section which shows the sealing part of the print head of FIG. It is a top view which expand | deploys and shows only the electrical wiring board by Example 2. FIG. It is a top view which expand | deploys and shows only the electrical wiring board by Example 3. FIG. It is a top view which expand | deploys and shows only the electrical wiring board by Example 4. FIG. It is a perspective view which shows the external appearance of an inkjet printer. It is a perspective view which shows the state which removed the exterior member of the inkjet printer. FIG. 4 is a perspective view of a state in which an ink tank is incorporated in a head cartridge. FIG. 4 is an exploded perspective view of the head cartridge as viewed obliquely from below. It is a perspective view shown in the state where an electric wiring board of a print head was separated. It is sectional drawing which shows the sealing part of a print head. It is sectional drawing taken along the AA line of FIG. It is a partially broken perspective view explaining an element chip. It is sectional drawing which shows the state before joining with an electrical wiring board. It is sectional drawing which shows the state which joined the electrical wiring board. It is sectional drawing which shows the state with which the chip | tip periphery sealing agent was filled. It is a figure explaining a prior art example. It is a figure explaining the sealing state by an ILB sealing material and a chip periphery sealing material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Silicon substrate 12 Ink path 13 Electrothermal converter 14 Connection terminal 15 Ink chamber 16 Discharge port array 17 Upper plate member 18 Ink path 19 Chip periphery sealing material 20 ILB sealing material 21 Weir part 22, 23, 24, 25 Concave Location H1001 Print head H1100 Head substrate H1200 Base plate H1201 Ink supply path H1300 Electrical wiring board (TAB)
H1302 Device hole H1303 Inner lead H1400 Support plate

Claims (4)

  An element chip having a discharge means for discharging a liquid, an electric wiring substrate having an inner lead connection portion connected to the electric connection portion of the element chip, and sealing the inner lead connection portion from the surface side of the electric wiring substrate And a recess for capturing the sealing material of the sealing portion is formed on the surface of the electric wiring board.   The liquid discharge head according to claim 1, wherein the electrical wiring board further includes a device hole, and further includes another sealing portion that seals the periphery of the element chip provided in the device hole. .   3. The liquid discharge head according to claim 1, wherein the sealing material is a thermosetting resin or a room temperature curable resin.   An ink jet recording apparatus comprising: the liquid discharge head according to claim 1; and a transport unit that transports a recording medium so as to face the liquid discharge head.

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