JP2006160348A - Packing method for top cover tape, carrier tape and electronic parts - Google Patents

Abstract

An electronic component can be stored in a stable state regardless of external dimensions or terminal arrangement.
The embossed carrier tape 11 and the top cover tape 14 are turned upside down so that a semiconductor device 12 is dropped from a recess 13 onto an adhesive layer 18 to be bonded. The semiconductor device 12 is fixed to the adhesive layer 18 even when the embossed carrier tape 11 and the top cover tape 14 are turned upside down and the top cover tape 14 is up, and the terminal portion 12b is fixed to the side wall 13a in the recess 13 or There is no contact with the bottom 13b. At the time of mounting, the top cover tape 14 is irradiated with ultraviolet rays by an ultraviolet lamp 19, whereby the adhesive layer 18 reacts to reduce the adhesive strength. As a result, the semiconductor device 12 falls by its own weight onto the recess 13 of the embossed carrier tape 11, and the semiconductor device 12 can be easily adsorbed by the mounting machine.
[Selection] Figure 2

Description

  The present invention relates to a top cover tape for taping packaging for storing electronic components such as a semiconductor device in which terminals for mounting are arranged on one side face represented by BGA (Ball Grid Array) and LGA (Land Grid Array). , Carrier tape and a method for packing electronic components using them.

  2. Description of the Related Art In recent years, with the reduction in size and weight of electronic devices, electronic parts such as semiconductor devices and chip parts have been required to be reduced in mounting area to PWB (Printed Wiring Board). In order to meet this requirement, for example, many BGA or LGA type semiconductor devices having mounting terminals arranged on the lower surface are employed as semiconductor devices (see Patent Document 1).

  In general, the packaging of these semiconductor devices is often taped packaging using carrier tape that is easy to handle and has good mounting efficiency for electronic components. Embossed tape packaging using embossed carrier tape is the mainstream.

  5A and 5B are diagrams showing a configuration of a conventional embossed taping packaging, in which FIG. 5A is a plan view and FIG. 5B is a cross-sectional view taken along the line CC in FIG.

  As shown in FIGS. 5A and 5B, the embossed carrier tape 31 has a plurality of recesses 33 arranged at regular intervals along the length direction by compressed air, pressing, vacuum forming, or the like. A feed hole 36 is provided on the side. Further, the semiconductor device 32 is accommodated in the recess 33, and then a top cover tape 34 is bonded by thermocompression bonding so as to cover the recess 33. In the figure, reference numeral 35 denotes an adhesive portion between the embossed carrier tape 31 and the top cover tape 34.

  The concave portion 33 is generally a rectangular parallelepiped, but the bottom peripheral edge portion 32a of the semiconductor device 32 is received by the side wall 33a, and the terminal portion 32b of the semiconductor device 32 comes into contact with the side wall 33a or the bottom portion 33b. In order to prevent adhesion of antistatic treatment carbon or the like added or applied to the embossed carrier tape 31, as described in Patent Document 1, the inclination angle and depth of the side wall 33 a are These are designed to have predetermined dimensions corresponding to the semiconductor device 32 having various external dimensions.

  Normally, as shown in FIG. 6, an embossed carrier tape 31 bonded with a top cover tape 34 is wound around a reel 37 and shipped in cardboard or the like.

The embossed taping packaging uses the feed hole 36 during mounting, peels off the top cover tape 34 while feeding the embossed carrier tape 31 from the reel 37, takes out the semiconductor device 32, and mounts it on a PWB or the like. Alternatively, the mounting speed can be increased as compared with magazine packaging, and in recent years, the number of shipping forms of the semiconductor device 32 has increased.
JP 2000-33969 A

  However, in the conventional embossed carrier tape 31 for embossed taping packaging, the storage position of the semiconductor device 32 is easily shifted in the recess 33 during transportation or the like, and it is difficult to maintain a stable storage state. The lighter the device 32 is, the more difficult it is to be fitted in the recess 33 in a tilted state, and it becomes difficult to return to the original horizontal storage state, and the semiconductor device 32 cannot be satisfactorily adsorbed by mounting equipment or the like. was there.

  Similarly, in order to carry out an appearance inspection of the terminal portion 32b of the semiconductor device 32, it is difficult in the housed state where the terminal portion 32b of the semiconductor device 32 is facing up because a problem occurs in the adsorption of the semiconductor device 32 during mounting. there were.

  Further, when the side wall 33a is designed so that the terminal portion 32b does not contact the side wall 33a or the bottom portion 33b when the bottom surface of the peripheral edge portion 32a of the semiconductor device 32 and the outermost peripheral terminal of the terminal portion 32b are close to each other, the inclination is reduced. Since the angle approaches 90 °, the semiconductor device 32 may be fitted into the side wall 33a during storage or removal or transportation, and may not be adsorbed by mounting equipment or the like.

  Further, the optimum value of the inclination angle and depth of the side wall 33a varies depending on the external dimensions of the semiconductor device 32 and the arrangement position of the terminal portions 32b, and it is difficult to make the embossed carrier tape 31 sharable.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a top cover tape, a carrier tape, and an electronic component that can stably store electronic components regardless of external dimensions or terminal arrangements. It is to provide a packing method.

  In order to achieve the above object, the invention according to claim 1 is directed to a carrier tape provided with a recess in which an electronic component is stored with a terminal for mounting the electronic component facing downward, and the opening of the recess is provided. The top cover tape is bonded so as to cover, and an adhesive layer to which the electronic component is bonded is provided on a contact surface with the carrier tape.

  According to a second aspect of the present invention, in the top cover tape according to the first aspect, the adhesive layer is an adhesive that reacts with light or heat.

  The invention according to claim 3 is a packaging method of an electronic component in which a mounting terminal is arranged on one side surface, and the electronic component is placed in a recess for storing the electronic component on a carrier tape, and the terminal side is directed downward. And a step of adhering the top cover tape to the upper surface of the carrier tape, and bonding the carrier tape and the top cover tape, and then inverting the top cover tape to turn the electron on the adhesive layer of the top cover tape. A step of adhering components, and a step of reducing the adhesive force in the adhesive layer of the top cover tape and peeling the electronic components from the top cover tape before taking out the electronic components from the carrier tape. To do.

  According to a fourth aspect of the present invention, in the carrier tape, an adhesive layer is provided on the upper surface of the flat portion, and the electronic component is bonded to the adhesive layer with the terminal side facing upward. The top cover tape provided with is adhered.

  The invention according to claim 5 is the carrier tape according to claim 4, wherein the adhesive layer is a pressure-sensitive adhesive that reacts to light or heat.

  The invention according to claim 6 is a packaging method of an electronic component in which a mounting terminal is arranged on one side surface, and the electronic component is placed on an adhesive layer on an upper surface of a flat portion of a carrier tape, and the terminal side is directed upward. Bonding the top cover tape having a recess for protecting electronic components on the top surface of the carrier tape, and winding the carrier tape and the top cover tape on the transport reel after bonding the carrier tape and the top cover tape, Before taking out the electronic component from the carrier tape, the method has a step of reducing the adhesive force of the electronic component in the adhesive layer of the carrier tape.

  According to a seventh aspect of the present invention, in the electronic component packaging method according to the sixth aspect, the step of inspecting the appearance of the terminal side of the electronic component housed in the recess in a state where the top cover tape is bonded to the carrier tape. It is characterized by including.

  According to the top cover tape, the carrier tape, and the electronic component storage method according to the present invention, the adhesive layer is provided on the top cover tape or the carrier tape, and the electronic component is adsorbed so that the electronic component is transported after embossed taping packaging. It can be prevented from being tilted and inserted into the side wall, and the appearance inspection can be performed with the terminal part of the electronic component facing up, and the embossed carrier tape and top cover tape can be used in common. Realization is possible.

  From the above, it is possible to reduce the operation loss due to the improvement of the suction yield when mounting electronic components or the switching of the taping machine jig tool when storing the electronic components in the embossed carrier tape. Since the mold for forming the top cover tape can be shared, the cost of the embossed taping packaging process can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
Fig.1 (a), (b) is a figure which shows the structure of the embossed taping packaging using the top cover tape which concerns on 1st Embodiment of this invention, (a) is a top view, (b) is (a). It is AA sectional drawing in.

  As shown in FIGS. 1 (a) and 1 (b), the embossed carrier tape 11 has a plurality of recesses 13 arranged at regular intervals along the length direction by compressed air, pressing, vacuum forming, or the like. Is provided with a feed hole 16. Further, the semiconductor device 12 is adhered and fixed to the adhesive layer 18 of the top cover tape 14 so that the terminal portion 12b of the semiconductor device 12 does not contact the side wall 13a or the bottom portion 13b in the recess 13. Further, a top cover tape 14 is bonded to the embossed carrier tape 11 so as to cover the recess 13. In the figure, reference numeral 15 denotes an adhesive portion between the embossed carrier tape 11 and the top cover tape 14.

  FIGS. 2A to 2D are explanatory views for explaining the process of the packaging method in embossed taping packaging using the top cover tape according to the first embodiment.

  First, as illustrated in FIG. 2A, the terminal portion 12 b of the semiconductor device 12 is accommodated in the recess 13 of the embossed carrier tape 11, and then the adhesive layer 18 is provided so as to cover the recess 13. The top cover tape 14 is adhered. In this state, the feed hole 16 is used to wind and store the reel.

  Next, when the embossed carrier tape 11 and the top cover tape 14 are wound around the reel, the embossed carrier tape 11 and the top cover tape 14 are turned upside down as shown in FIG. 12 drops from the recess 13 onto the adhesive layer 18 and adheres to the adhesive layer 18.

  As shown in FIG. 2C, the semiconductor device 12 is fixed to the adhesive layer 18 even when the embossed carrier tape 11 and the top cover tape 14 are turned upside down so that the top cover tape 14 is on top. The part 12b does not contact the side wall 13a or the bottom part 13b in the recess 13. In this state, it is stored in cardboard or the like and shipped.

  At the time of mounting after transportation, as shown in FIG. 2D, when the top cover tape 14 is irradiated with UV light by an ultraviolet (UV) lamp 19, the adhesive layer 18 reacts and the adhesive strength is reduced. As a result, the semiconductor device 12 is dropped by its own weight onto the concave portion 13 of the embossed carrier tape 11, and the semiconductor device 12 is easily sucked by the mounting machine.

  According to the packaging method of the first embodiment, the size of the semiconductor device 12 that is allowed to be accommodated in the recess 13 of the embossed carrier tape 11 is widened, and the commonality of the embossed carrier tape 11 can be realized.

  In the first embodiment, the adhesive layer 18 is continuously arranged in a sheet shape, but the adhesive layer 18 is divided and arranged on the top cover tape 14 so as to arrange only the portion of the embossed carrier tape 11 that covers the recess 13. May be.

  The pressure-sensitive adhesive as the adhesive layer 18 is not only a UV curable material as described above, but also a material that foams in response to UV and reduces the adhesive force to the semiconductor device 12 or reacts to heat. Thus, a material that reduces the adhesive strength may be used.

  Further, in the first embodiment, the embossed carrier tape, the top cover tape, and the semiconductor device are taken as an example. However, the same is true even when implemented in a punch carrier type such as plastic or paper, or in a chip component other than the semiconductor device. An effect is obtained.

(Second Embodiment)
3 (a) and 3 (b) are diagrams showing a configuration during transport of embossed taping packaging using the carrier tape according to the second embodiment of the present invention, (a) is a plan view, and (b) is (a) It is a BB sectional view in).

  As shown in FIGS. 3A and 3B, an adhesive layer 28 is disposed on the flat portion of the carrier tape 21, and the semiconductor device 22 is adhered to the adhesive layer 28 at regular intervals. A feed hole 26 is provided.

  On the carrier tape 21, an embossed stop cover tape 24 in which a plurality of recesses 23 are arranged at regular intervals along the length direction by compressed air, pressing, vacuum forming, or the like is attached to the side wall 23a or the bottom 23b in the recess 23. The terminal portion 22b of the semiconductor device 22 is bonded so as not to contact. In the figure, reference numeral 25 denotes an adhesive portion between the carrier tape 21 and the embossed stop cover tape 24.

  4A to 4C are cross-sectional views for explaining the steps of the packaging method in embossed taping packaging using the carrier tape according to the second embodiment.

  First, as shown in FIG. 4A, the terminal portion 22b of the semiconductor device 22 is bonded upward at a predetermined position of the adhesive layer 28 on the flat portion of the carrier tape 21, and then a recess 23 is provided. The emboss stop cover tape 24 is adhered and covered by thermocompression bonding or the like. In this example, it is desirable that the embossed stop cover tape 24 has a strength equal to or higher than that of a conventional embossed carrier tape.

  In this state, by adopting a transparent material for the embossed stop cover tape 24, it is possible to confirm the missing portion of the terminal portion 22b, the variation in the height, the displacement of the arrangement, and the like by the appearance inspection. Thereafter, the tapes 21 and 24 after bonding are wound around the reel using the feed holes 26 and stored.

  Further, as shown in FIG. 4B, the semiconductor device 22 is turned upside down on the carrier tape 21 and the embossed stop cover tape 24 and fixed to the adhesive layer 28 even when the embossed stop cover tape 24 is down. Is done. For this reason, the terminal part 22b does not contact the side wall 23a or the bottom part 23b in the recess 23. In this state, it is stored in a cardboard box and shipped.

  At the time of mounting after transportation, as shown in FIG. 4C, UV irradiation is performed from the back surface of the carrier tape 21 with a UV lamp 29 to reduce the adhesive force of the adhesive layer 28. This facilitates the adsorption of the semiconductor device 22 from the adhesive layer 28 of the carrier tape 21 by the mounting machine.

  By the packaging method of the second embodiment, the size of the semiconductor device 22 that is allowed to adhere to the flat portion of the carrier tape 21 is widened, and the commonality of the embossed stop cover tape 24 can be realized.

  In the second embodiment, the adhesive layer 28 is continuously arranged in the form of a sheet, but the adhesive layer 28 is divided and placed on the carrier tape 21 so as to be arranged only on the portion of the embossed stop cover tape 24 that covers the recess 23. You may arrange.

  Further, in the second embodiment, unlike the first embodiment, the semiconductor device 22 is fixed at a predetermined position before the carrier tape 21 and the emboss stop cover tape 24 are bonded. Therefore, it is useful for packing the semiconductor device 22 or the like whose peripheral portion is easily damaged, such as a BGA package using a resin substrate.

  The material of the pressure-sensitive adhesive layer 28 is not limited to the UV curable material as described above, but the material that foams in response to UV and reduces the adhesive force to the semiconductor device 22 or the adhesive in response to heat or the like. It may be a material that reduces the force.

  In the second embodiment, the emboss stop cover tape, the carrier tape, and the semiconductor device are taken as an example. However, the same applies to the punch carrier type such as plastic and paper, or chip components other than the semiconductor device. An effect is obtained.

  INDUSTRIAL APPLICABILITY The present invention is applied to a top cover tape for embossed taping packaging, an embossed carrier tape, and a semiconductor device packaging method, and is particularly useful when housing a semiconductor device, an electronic component, or the like in which mounting terminals are arranged on the lower surface. It is.

It is a figure which shows the structure at the time of transport of the embossed taping packaging using the top cover tape which concerns on 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional drawing in (a). (A)-(d) is sectional drawing for demonstrating the process of the packaging method of embossed taping packaging using the top cover tape which concerns on 1st Embodiment. It is a figure which shows the structure at the time of the transport of embossed taping packaging using the embossed carrier tape which concerns on 2nd Embodiment of this invention, (a) is a top view, (b) is BB sectional drawing in (a). (A)-(c) is sectional drawing for demonstrating the process of the packaging method of embossed taping packaging using the embossed carrier tape which concerns on 2nd Embodiment. It is a figure which shows the structure at the time of the conventional embossed taping packaging, (a) is a top view, (b) is CC sectional drawing in (a). Perspective view of a reel for general embossed taping packaging

Explanation of symbols

11, 21 (embossed) carrier tape 12, 22 Semiconductor device 12b, 22b Terminal portion 13, 23 Recessed portion 13a, 23a Recessed side wall 13b, 23b Recessed bottom portion 14, 24 (Embossed) Top cover tape 15, 25 Adhesive portion 16, 26 Feed hole 18, 28 Adhesive layer 19, 29 UV lamp 37 Reel

Claims (7)

  An electronic component is a top cover tape that is bonded to a carrier tape provided with a recess for receiving the electronic component mounting terminal facing downward so as to cover the opening of the recess, the carrier tape A top cover tape characterized in that an adhesive layer for adhering the electronic component is provided on the contact surface.   The top cover tape according to claim 1, wherein the adhesive layer is an adhesive that reacts to light or heat.   A packaging method for an electronic component in which a mounting terminal is arranged on one side, the step of storing the electronic component in a recess for storing the electronic component in a carrier tape with the terminal side facing downward, and the carrier tape Adhering a top cover tape to the upper surface of the substrate, adhering the carrier tape and the top cover tape, and then attaching the electronic component to the adhesive layer of the top cover tape by turning it upside down, and the carrier A method of packaging an electronic component comprising the steps of lowering the adhesive strength of the adhesive layer of the top cover tape and peeling the electronic component from the top cover tape before taking out the electronic component from the tape.   An adhesive layer is provided on the upper surface of the flat part, an electronic component is adhered to the adhesive layer with the terminal side facing upward, and a top cover tape provided with a recess for protecting the electronic component covering the electronic component is adhered. Features carrier tape.   The carrier tape according to claim 4, wherein the adhesive layer is an adhesive that reacts with light or heat.   A packaging method for an electronic component in which terminals for mounting are arranged on one side, the step of adhering the electronic component to an adhesive layer on an upper surface of a flat portion of the carrier tape, the terminal side facing upward, and the carrier tape A step of bonding a top cover tape having a recess for protecting electronic components on the upper surface, a step of winding the carrier tape and the top cover tape and winding them on a transport reel, and before taking out the electronic components from the carrier tape And a step of reducing the adhesive force of the electronic component in the adhesive layer of the carrier tape.   The electronic component packaging method according to claim 6, further comprising a step of performing an appearance inspection on a terminal side of the electronic component housed in the recess while the top cover tape is bonded to the carrier tape.

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