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Publication number
JP2006156969A5
JP2006156969A5 JP2005306607A JP2005306607A JP2006156969A5 JP 2006156969 A5 JP2006156969 A5 JP 2006156969A5 JP 2005306607 A JP2005306607 A JP 2005306607A JP 2005306607 A JP2005306607 A JP 2005306607A JP 2006156969 A5 JP2006156969 A5 JP 2006156969A5
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JP
Japan
Prior art keywords
semiconductor device
compound layer
organic compound
transistor
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005306607A
Other languages
Japanese (ja)
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JP2006156969A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005306607A priority Critical patent/JP2006156969A/en
Priority claimed from JP2005306607A external-priority patent/JP2006156969A/en
Publication of JP2006156969A publication Critical patent/JP2006156969A/en
Publication of JP2006156969A5 publication Critical patent/JP2006156969A5/ja
Withdrawn legal-status Critical Current

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Claims (14)

有機素子とトランジスタを並列に接続した構成を有するメモリセルを複数有し
数の前記メモリセル直列に接続されることを特徴とする半導体装置。
Has a plurality of Rume Moriseru to have a structure of connecting the organic element and the transistor in parallel,
It is the memory cell of the multiple semiconductor device characterized by being connected in series.
有機素子とトランジスタを並列に接続した構成を有するメモリセルを複数有し
数の前記メモリセル直列に接続され、NAND型メモリを構成することを特徴とする半導体装置。
Has a plurality of Rume Moriseru to have a structure of connecting the organic element and the transistor in parallel,
The memory cells of several are connected in series, wherein a constituting the NAND type memory.
有機素子とトランジスタを直列に接続した構成を有するメモリセルを複数有し
数の前記メモリセル並列に接続されることを特徴とする半導体装置。
Has a plurality of Rume Moriseru to have a structure of connecting the organic element and a transistor in series,
The semiconductor device is the memory cell of the multiple, characterized in that connected in parallel.
有機素子とトランジスタを直列に接続した構成を有するメモリセルを複数有し
数の前記メモリセル並列に接続され、NOR型メモリを構成することを特徴とする半導体装置。
Has a plurality of Rume Moriseru to have a structure of connecting the organic element and a transistor in series,
It is the memory cell of multiple connected in parallel, wherein a constituting the NOR type memory.
請求項1乃至請求項4のいずれか一において、In any one of Claims 1 thru | or 4,
前記メモリセルの信号を検出する手段を有することを特徴とする半導体装置。A semiconductor device comprising means for detecting a signal of the memory cell.
請求項において、
前記メモリセルの信号を検出する手段は、センスアンプを有することを特徴とする半導体装置。
In claim 5 ,
It means for detecting the signal of the Memorise Le A semiconductor device characterized by having a sense amplifier.
請求項1乃至請求項のいずれかにおいて、
前記有機素子は有機化合物層を有し、前記有機化合物層は、電子輸送材料またはホール輸送材料を含むことを特徴とする半導体装置。
In any one of claims 1 to 6,
The organic element has an organic compound layer, the organic compound layer, a semiconductor device which comprises an electron transport material or hole transport material.
請求項1乃至請求項のいずれかにおいて、
前記有機素子は有機化合物層を有し、前記有機化合物層は、光を照射することによって電気抵抗が変化する材料を含むことを特徴とする半導体装置。
In any one of claims 1 to 6,
The organic element has an organic compound layer, the organic compound layer, a semiconductor device which comprises a material whose electric resistance is changed by irradiating light.
請求項において、
前記有機化合物層は、レーザ光の照射により導電性が変化することを特徴とする半導体装置。
In claim 7 ,
The semiconductor device according to claim 1, wherein the organic compound layer has conductivity changed by laser light irradiation.
請求項1乃至請求項のいずれかにおいて、
前記有機素子は有機化合物層を有し、前記有機化合物層は、電圧または電流を印加することによって電気抵抗が変化する材料を含むことを特徴とする半導体装置。
In any one of claims 1 to 6,
The organic element has an organic compound layer, the organic compound layer, a semiconductor device which comprises a material whose electric resistance is changed by applying a voltage or current.
請求項1乃至請求項10のいずれかにおいて、
前記有機素子は、半導体基板、ガラス基板、または可撓性基板上に設けられることを特徴とする半導体装置。
In any one of claims 1 to 10,
The organic element is a semiconductor device, characterized in that provided in the semiconductor substrate, a glass substrate or a flexible substrate.
請求項1乃至請求項11のいずれかにおいて、
前記トランジスタは、薄膜トランジスタであることを特徴とする半導体装置。
In any one of claims 1 to 11,
The transistor is a semiconductor device which is a thin film transistor.
請求項1乃至請求項12のいずれかに記載された半導体装置を有するICカード、ICタグ、RFIDタグ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ、または衣類。 An IC card, an IC tag, an RFID tag, a transponder, a banknote, a securities, a passport, an electronic device, a bag, or clothing having the semiconductor device according to any one of claims 1 to 12 . 請求項1乃至請求項12のいずれかに記載された半導体装置を有し、電源回路、クロック発生回路、データ復調回路、データ変調回路、制御回路、及びインターフェイス回路のいずれか一を少なくとも有するRFIDタグ。 It includes a semiconductor device according to any one of claims 1 to 12, the power supply circuit, a clock generation circuit, the data demodulation circuit, a data modulation circuit, control circuit, and an RFID having at least any one of the interface circuits tag.
JP2005306607A 2004-10-29 2005-10-21 Semiconductor device, ic card, ic tag, rf-id tag, transponder, bill, negotiable securities, passport, electronic apparatus, baggage, and clothing Withdrawn JP2006156969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005306607A JP2006156969A (en) 2004-10-29 2005-10-21 Semiconductor device, ic card, ic tag, rf-id tag, transponder, bill, negotiable securities, passport, electronic apparatus, baggage, and clothing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004317398 2004-10-29
JP2005306607A JP2006156969A (en) 2004-10-29 2005-10-21 Semiconductor device, ic card, ic tag, rf-id tag, transponder, bill, negotiable securities, passport, electronic apparatus, baggage, and clothing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011115579A Division JP2011211215A (en) 2004-10-29 2011-05-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JP2006156969A JP2006156969A (en) 2006-06-15
JP2006156969A5 true JP2006156969A5 (en) 2008-09-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005306607A Withdrawn JP2006156969A (en) 2004-10-29 2005-10-21 Semiconductor device, ic card, ic tag, rf-id tag, transponder, bill, negotiable securities, passport, electronic apparatus, baggage, and clothing

Country Status (1)

Country Link
JP (1) JP2006156969A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008046116A (en) * 2006-07-20 2008-02-28 Semiconductor Energy Lab Co Ltd Position information detecting system and position information detection method
EP1881338B1 (en) 2006-07-20 2011-09-07 Semiconductor Energy Laboratory Co., Ltd. Position information detection system and position information detection method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3761300B2 (en) * 1997-09-30 2006-03-29 株式会社東芝 Shift register memory element
JP2000113152A (en) * 1998-10-05 2000-04-21 Hitachi Maxell Ltd Magnetic stripe tape with built-in non-contact memory element, and IC card and IC tag manufactured using the same
KR20020030272A (en) * 2000-03-28 2002-04-24 롤페스 요하네스 게라투스 알베르투스 Integrated circuit with programmable memory element
JP2002026283A (en) * 2000-06-30 2002-01-25 Seiko Epson Corp Multi-layered memory device and method of manufacturing the same
JP2003243631A (en) * 2002-02-18 2003-08-29 Mitsubishi Electric Corp Thin film magnetic storage device, wireless chip using the same, distribution management system and manufacturing process management system
JP2004103212A (en) * 2002-07-15 2004-04-02 Toshiba Corp Magnetic random access memory
DE602004027214D1 (en) * 2003-02-14 2010-07-01 Fuji Electric Holdings SWITCHING ELEMENT
JP4167513B2 (en) * 2003-03-06 2008-10-15 シャープ株式会社 Nonvolatile semiconductor memory device
US6868025B2 (en) * 2003-03-10 2005-03-15 Sharp Laboratories Of America, Inc. Temperature compensated RRAM circuit

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