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JP2006039667A - Area division analog resistive touch panel - Google Patents

Area division analog resistive touch panel Download PDF

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Publication number
JP2006039667A
JP2006039667A JP2004214605A JP2004214605A JP2006039667A JP 2006039667 A JP2006039667 A JP 2006039667A JP 2004214605 A JP2004214605 A JP 2004214605A JP 2004214605 A JP2004214605 A JP 2004214605A JP 2006039667 A JP2006039667 A JP 2006039667A
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transparent conductive
conductive film
area
touch panel
divided
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Kazuyuki Yoshifusa
和幸 吉房
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FCL Components Ltd
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Fujitsu Component Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To solve problems caused by increase in the number of wiring patterns due to area division for improving reliability in an area division analog resistance film touch panel. <P>SOLUTION: On a glass plate 111, wiring patterns 119-1 to 119-4 are formed between dispersed relay electrodes 118-1 to 118-4 and aligned external connection terminals 120-1 to 120-4. Four upper division transparent conductive film parts 133-1 to 133-4 on the lower face of a film 130 are connected to the relay electrodes 118-1 to 118-4 individually. No wiring pattern is formed on the film 130. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はエリア分割アナログ抵抗膜タッチパネルに係り、特に、同一タッチパネル内に複数の独立したアナログ入力エリアを有し多点同時入力を可能にするエリア分割アナログ抵抗膜タッチパネルに関する。   The present invention relates to an area-divided analog resistive touch panel, and more particularly to an area-divided analog resistive touch panel that has a plurality of independent analog input areas in the same touch panel and enables multipoint simultaneous input.

エリア分割アナログ抵抗膜タッチパネルは、異なるエリアを同時に押す操作を行った場合に各エリア毎に押し操作された点の座標を出力できるという多点同時入力機能を備えたものである。よって、エリア分割アナログ抵抗膜タッチパネルを使用すれば、別々の箇所を順次押す操作の他に、キーボードにおいて入力キーとシフトキーとを同時に押し下げ操作をすると同じような操作をすることが可能となる。   The area-divided analog resistive touch panel is provided with a multi-point simultaneous input function capable of outputting the coordinates of the pressed points for each area when the different areas are simultaneously pressed. Therefore, if the area-divided analog resistive touch panel is used, it is possible to perform the same operation by simultaneously pressing the input key and the shift key on the keyboard in addition to the operation of sequentially pressing different portions.

エリアを分割すると各エリア毎に外部接続端子へ延在する配線パターンが必要になって配線パターンの数が増えることになる。この増えた複数本の配線パターンをタッチパネルの信頼性を損ねないようにして配置することが重要となる。   Dividing the area requires a wiring pattern extending to the external connection terminal for each area, increasing the number of wiring patterns. It is important to arrange the increased number of wiring patterns so as not to impair the reliability of the touch panel.

図１は従来のエリア４分割アナログ抵抗膜タッチパネル１０を分解して示す。図２（Ａ）はフィルム下面の透明導電膜及び配線パターンを示し、同図（Ｂ）はガラス板上面の透明導電膜、配線パターン及びダイオード等を示す。図３は図１に示すタッチパネル１０からガラス板上面の透明導電膜に電位勾配を形成する手段を取り除いた構成、即ち、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す。Ｘ１−Ｘ２が横方向、Ｙ１−Ｙ２が縦方向、Ｚ１−Ｚ２が厚さ方向である。   FIG. 1 is an exploded view of a conventional area-divided analog resistive touch panel 10. FIG. 2A shows the transparent conductive film and wiring pattern on the lower surface of the film, and FIG. 2B shows the transparent conductive film, wiring pattern and diode on the upper surface of the glass plate. FIG. 3 shows a configuration in which a means for forming a potential gradient in the transparent conductive film on the upper surface of the glass plate is removed from the touch panel 10 shown in FIG. The configuration is shown. X1-X2 is the horizontal direction, Y1-Y2 is the vertical direction, and Z1-Z2 is the thickness direction.

エリア４分割アナログ抵抗膜タッチパネル１０は、下側の長方形のガラス板１１の上側にフィルム３０が周囲を両面テープでもって接着してあり、且つ、フレキシブルケーブル４０がＸ１方向に延びている構成であり、同時に押し操作することが可能である四つのエリア１〜４を有する。   The area-divided analog resistive touch panel 10 has a configuration in which a film 30 is adhered to the upper side of a lower rectangular glass plate 11 with a double-sided tape, and a flexible cable 40 extends in the X1 direction. , Having four areas 1 to 4 that can be pushed simultaneously.

ガラス板１１は、四つの辺１１ａ〜１１ｄを有する。ガラス板１１上面の全面に絶縁膜１２が形成され、絶縁膜１２上の中央にアナログ抵抗膜である長方形の下部透明導電膜１３が形成してある。下部透明導電膜１３の周囲の部分が額縁１１ｅである。額縁１１ｅの部分に、Ｌ字形状の配線パターン１４，１５、複数のダイオードチップ１６ａ、１６ｂ、１６ｃ、１６ｄ、多数の点電極１７ａ、１７ｂ、１７ｃ、１７ｄ、整列している中継電極１８−１〜１８−４、配線パターン１９−１〜１９−４、外部接続用端子２０−１〜２０−６等が形成してある。電圧モニター用の手段は省略してある。また、額縁１３の部分には、最上面に絶縁膜２１が形成してあり、配線パターン１４，１５等が覆われており、外部接続用端子２０−１〜２０−６及び中継電極１８−１〜１８−４は露出している。   The glass plate 11 has four sides 11a to 11d. An insulating film 12 is formed on the entire upper surface of the glass plate 11, and a rectangular lower transparent conductive film 13 that is an analog resistance film is formed in the center on the insulating film 12. A peripheral portion of the lower transparent conductive film 13 is a frame 11e. L-shaped wiring patterns 14 and 15, a plurality of diode chips 16 a, 16 b, 16 c and 16 d, a large number of point electrodes 17 a, 17 b, 17 c and 17 d, and relay electrodes 18-1 aligned in the frame 11 e portion. 18-4, wiring patterns 19-1 to 19-4, external connection terminals 20-1 to 20-6, and the like are formed. The means for voltage monitoring is omitted. In addition, an insulating film 21 is formed on the uppermost surface of the frame 13, and the wiring patterns 14, 15 and the like are covered, and the external connection terminals 20-1 to 20-6 and the relay electrode 18-1 are covered. .About.18-4 are exposed.

配線パターン１４、１５はガラス板１１の対角の位置に配置しており、Ｘ方向に延在する配線パターン部分１４Ｘ，１５ＸとＹ方向に延在する配線パターン部分部分１４Ｙ，１５Ｙとを有する。ダイオードチップ１６ａは配線パターン部分１４Ｙと点電極１７ａとの間に、ダイオードチップ１６ｂは配線パターン部分１５Ｙと点電極１７ｂとの間に、共にＸ２が順方向である向きで接続してある。ダイオードチップ１６ｃは配線パターン部分１５Ｘと点電極１７ｃとの間に、ダイオードチップ１６ｄは配線パターン部分１４Ｘと点電極１７ｄとの間に、共にＹ１が順方向である向きで接続してある。また、配線パターン１４、１５は夫々外部接続用端子２０−５、２０−６を有する。外部接続用端子２０−５にＶｃｃを印加し、外部接続用端子２０−６をグランド電位とすると、点電極１７ｂに電圧が印加され、下部透明導電膜１３には点電極１７ｂから点電極１７ａに向かって即ちＸ２側からＸ１方向に向かって電位が下がる電位勾配が形成される。上記とは逆に外部接続用端子２０−６にＶｃｃを印加し、外部接続用端子２０−５をグランド電位とすると、点電極１７ｃに電圧が印加され、下部透明導電膜１３には点電極１７ｃから点電極１７ｄに向かって即ちＹ１側からＹ２方向に向かって電位が下がる電位勾配が形成される。Ｌ字形状の配線パターン１４，１５、複数のダイオードチップ１６ａ、１６ｂ、１６ｃ、１６ｄ、多数の点電極１７ａ、１７ｂ、１７ｃ、１７ｄが、電圧を印加されて下部透明導電膜１３にＸ方向及びＹ方向の電位勾配を形成させる電位勾配形成手段を構成する。   The wiring patterns 14, 15 are arranged at diagonal positions on the glass plate 11, and have wiring pattern portions 14X, 15X extending in the X direction and wiring pattern portion portions 14Y, 15Y extending in the Y direction. The diode chip 16a is connected between the wiring pattern portion 14Y and the point electrode 17a, and the diode chip 16b is connected between the wiring pattern portion 15Y and the point electrode 17b in the direction in which X2 is the forward direction. The diode chip 16c is connected between the wiring pattern portion 15X and the point electrode 17c, and the diode chip 16d is connected between the wiring pattern portion 14X and the point electrode 17d in such a direction that Y1 is the forward direction. The wiring patterns 14 and 15 have external connection terminals 20-5 and 20-6, respectively. When Vcc is applied to the external connection terminal 20-5 and the external connection terminal 20-6 is set to the ground potential, a voltage is applied to the point electrode 17b, and the lower transparent conductive film 13 is applied from the point electrode 17b to the point electrode 17a. A potential gradient is formed in which the potential decreases from the X2 side toward the X1 direction. Contrary to the above, when Vcc is applied to the external connection terminal 20-6 and the external connection terminal 20-5 is set to the ground potential, a voltage is applied to the point electrode 17c, and the point electrode 17c is applied to the lower transparent conductive film 13. A potential gradient is formed such that the potential decreases from the Y1 side toward the point electrode 17d, that is, from the Y1 side toward the Y2 direction. L-shaped wiring patterns 14 and 15, a plurality of diode chips 16a, 16b, 16c and 16d, and a large number of point electrodes 17a, 17b, 17c and 17d are applied to the lower transparent conductive film 13 in the X direction and Y A potential gradient forming means for forming a potential gradient in the direction is configured.

フィルム３０は、Ｘ１側の辺にフレキシブルケーブル４０の接続のための切欠３１を有する。切欠３１は上記の外部接続用端子２０−１〜２０−６が露出する大きさである。フィルム３０の下面には、その中央に、上部透明導電膜３３が形成してある。上部透明導電膜３３はエッチングで形成された十字のスリット３２でもって４つの上部分割透明導電膜部３３−１〜３３−４に分割されている。また、フィルム３０の下面には、前記の中継電極１８−１〜１８−４に対応して中継電極３４−１〜３４−４が整列して形成してあり、更に、上部分割透明導電膜部３３−１から延在して中継電極３４−１に到る配線パターン３５−１、上部分割透明導電膜部３３−２から延在して中継電極３４−２に到る配線パターン３５−２、上部分割透明導電膜部３３−３から延在して中継電極３４−３に到る配線パターン３５−３、上部分割透明導電膜部３３−４から延在して中継電極３４−４に到る配線パターン３５−４が形成してある。特に、配線パターン３５−４、３４−３は、切欠３１の奥側の狭い部分３０ａを通って延びている。   The film 30 has a notch 31 for connecting the flexible cable 40 on the side on the X1 side. The notch 31 is large enough to expose the external connection terminals 20-1 to 20-6. An upper transparent conductive film 33 is formed on the lower surface of the film 30 at the center thereof. The upper transparent conductive film 33 is divided into four upper divided transparent conductive film portions 33-1 to 33-4 by a cross slit 32 formed by etching. In addition, relay electrodes 34-1 to 34-4 are formed on the lower surface of the film 30 so as to correspond to the relay electrodes 18-1 to 18-4, and the upper divided transparent conductive film portion is further formed. A wiring pattern 35-1 extending from 33-1 to the relay electrode 34-1, a wiring pattern 35-2 extending from the upper divided transparent conductive film portion 33-2 to the relay electrode 34-2, A wiring pattern 35-3 extending from the upper divided transparent conductive film portion 33-3 to the relay electrode 34-3, and extending from the upper divided transparent conductive film portion 33-4 to the relay electrode 34-4. A wiring pattern 35-4 is formed. In particular, the wiring patterns 35-4 and 34-3 extend through the narrow portion 30 a on the back side of the notch 31.

フレキシブルケーブル４０は、フレキシブルなテープ状のシート上に複数の配線パターンが平行に形成してあり、Ｘ２端側部分４０ａは上記切欠３１に対応する大きさであり、ここに、上記の外部接続用端子２０−１〜２０−６に対応して端子が並んでいる構成である。   In the flexible cable 40, a plurality of wiring patterns are formed in parallel on a flexible tape-like sheet, and the X2 end side portion 40a has a size corresponding to the notch 31. It is the structure where the terminal is located in a line corresponding to the terminals 20-1 to 20-6.

ガラス板１１とフィルム３０とは、上部分割透明導電膜部３３−１〜３３−４がスペーサによって形成される隙間を介して下部透明導電膜１３上に対向し、中継電極３４−１〜３４−４が夫々中継電極１８−１〜１８−４と接続された状態にある。フレキシブルケーブル４０のＸ２端側部分４０ａがフィルム３０の切欠３１内に収まってガラス板１１上に接着してあり、フレキシブルケーブル４０の端子４０ａが外部接続用端子２０−１〜２０−６と接続されている。   The glass plate 11 and the film 30 are opposed to the lower transparent conductive film 13 through a gap in which the upper divided transparent conductive film portions 33-1 to 33-4 are formed by spacers, and the relay electrodes 34-1 to 34-34. 4 are connected to the relay electrodes 18-1 to 18-4, respectively. The X2 end side portion 40a of the flexible cable 40 is accommodated in the notch 31 of the film 30 and adhered to the glass plate 11, and the terminals 40a of the flexible cable 40 are connected to the external connection terminals 20-1 to 20-6. ing.

制御回路装置によってフレキシブルケーブル４０を通して点電極１７ｂ及び点電極１７ｃに電圧Ｖｃｃが交互に印加され下部透明導電膜１３にＸ方向の電位勾配及びＹ方向の電位勾配が交互に形成される。エリア１を押す操作を行うと、上部分割透明導電膜部３３−１のうち下部透明導電膜１３と接触された点に応じた電位の信号が上部分割透明導電膜部３３−１、配線パターン３５−１、中継電極３４−１、中継電極１８−１、配線パターン１９−１、外部接続用端子２０−１、フレキシブルケーブル４０を介して制御回路装置に送られる。即ち、押し操作した点の電位が上部分割透明導電膜部３３−１を通して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア２を押す操作を行うと、押し操作した点の電位が上部分割透明導電膜部３３−２、配線パターン３５−２、中継電極３４−２、中継電極１８−２、配線パターン１９−２、外部接続用端子２０−２、フレキシブルケーブル４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア３を押す操作を行うと、押し操作した点の電位が上部分割透明導電膜部３３−３、配線パターン３５−３、中継電極３４−３、中継電極１８−３、配線パターン１９−３、外部接続用端子２０−３、フレキシブルケーブル４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア４を押す操作を行うと、押し操作した点の電位が上部分割透明導電膜部３３−４、配線パターン３５−４、中継電極３４−４、中継電極１８−４、配線パターン１９−４、外部接続用端子２０−４、フレキシブルケーブル４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。   A voltage Vcc is alternately applied to the point electrode 17b and the point electrode 17c through the flexible cable 40 by the control circuit device, and a potential gradient in the X direction and a potential gradient in the Y direction are alternately formed in the lower transparent conductive film 13. When the operation of pressing area 1 is performed, a signal having a potential corresponding to a point of the upper divided transparent conductive film portion 33-1 that is in contact with the lower transparent conductive film 13 is transmitted to the upper divided transparent conductive film portion 33-1 and the wiring pattern 35. -1, relay electrode 34-1, relay electrode 18-1, wiring pattern 19-1, external connection terminal 20-1, and flexible cable 40, it is sent to the control circuit device. In other words, the potential of the pushed point is detected through the upper divided transparent conductive film portion 33-1, and the X and Y coordinates of the pushed point are determined. When the operation of pushing the area 2 is performed, the potential of the pushed point becomes the upper divided transparent conductive film portion 33-2, the wiring pattern 35-2, the relay electrode 34-2, the relay electrode 18-2, the wiring pattern 19-2, The X and Y coordinates of the point detected and pushed through the external connection terminal 20-2 and the flexible cable 40 are determined. When the operation of pushing the area 3 is performed, the potential of the pushed point becomes the upper divided transparent conductive film portion 33-3, the wiring pattern 35-3, the relay electrode 34-3, the relay electrode 18-3, the wiring pattern 19-3, The X and Y coordinates of the point detected and pressed through the external connection terminal 20-3 and the flexible cable 40 are determined. When the operation of pushing the area 4 is performed, the potential of the pushed point is changed to the upper divided transparent conductive film portion 33-4, the wiring pattern 35-4, the relay electrode 34-4, the relay electrode 18-4, the wiring pattern 19-4, The X and Y coordinates of the point detected and pushed through the external connection terminal 20-4 and the flexible cable 40 are determined.

よって、エリア１〜４を同時に押し操作すると、各押し操作した点のＸ，Ｙ座標が別々に且つ同時に割り出される。
特開平１１−１６１４２５号公報 Therefore, if the areas 1 to 4 are simultaneously pressed, the X and Y coordinates of the points that have been pressed are determined separately and simultaneously.
JP-A-11-161425

ここでガラス板１１上に配線パターンを形成する場合と、フィルム３０上に配線パターンを形成する場合とを比較してみる。配線パターンは何れも導電ペーストをスクリーン印刷する手法によって形成されている。フィルム３０については上部透明導電膜３３の十字のスリット３２をエッチングで形成していることから表面に洗浄の残りや保護膜の残渣が残り易く、印刷性がよくない。また、フィルム３０上に形成された配線パターンは、タッチパネルの操作によってストレスを受ける虞れがあり、また、タッチパネルの表面が損傷した場合にその影響を受ける虞れもある。   Here, a case where a wiring pattern is formed on the glass plate 11 and a case where a wiring pattern is formed on the film 30 will be compared. All of the wiring patterns are formed by a screen printing method using a conductive paste. Since the cross slits 32 of the upper transparent conductive film 33 are formed by etching for the film 30, the cleaning residue and the protective film residue are likely to remain on the surface, and the printability is not good. In addition, the wiring pattern formed on the film 30 may be stressed by the operation of the touch panel, and may be affected when the surface of the touch panel is damaged.

上記のエリア４分割アナログ抵抗膜タッチパネル１０では、中継電極１８−１〜１８−４及び中継電極３４−１〜３４−４がフレキシブルケーブル４０が接続される個所の近くに配置してある。このため、フィルム３０側に比較的長い経路の配線パターン３５−１〜３５−４が形成してある構成となっており、エリア４分割アナログ抵抗膜タッチパネル１０は信頼性の点で問題があった。   In the area-divided analog resistive touch panel 10 described above, the relay electrodes 18-1 to 18-4 and the relay electrodes 34-1 to 34-4 are arranged near the portion where the flexible cable 40 is connected. For this reason, the wiring pattern 35-1 to 35-4 having a relatively long path is formed on the film 30 side, and the area 4-divided analog resistive touch panel 10 has a problem in reliability. .

また、フィルム３０には切欠３１が形成してあるので、切欠３１に臨んでいる部分３０ａは狭くなっており、この部分を通る配線パターン３５−３、３５−４は、幅を例えば０．５ｍｍ程度にまで狭くする必要があり、信頼性が低下してしまい、押し操作したときの上部分割透明導電膜部から外部接続端子までの区間の電気抵抗であるＯＮ抵抗も増大してしまう。図１では図示の便宜上、部分３０ａは広くなっているけれども、実際には、部分３０ａは非常に狭い。   Further, since the cutout 31 is formed in the film 30, the portion 30a facing the cutout 31 is narrow, and the wiring patterns 35-3 and 35-4 passing through this portion have a width of, for example, 0.5 mm. It is necessary to make it narrow to a certain extent, the reliability is lowered, and the ON resistance which is the electrical resistance in the section from the upper divided transparent conductive film portion to the external connection terminal when pushed is also increased. In FIG. 1, for convenience of illustration, the portion 30a is wide, but in practice, the portion 30a is very narrow.

また、エリヤの数を増やすと、フィルム３０に形成する配線パターンの数が多くなって、特に上記の狭い部分３０ａを通る配線パターンの数が多くなって、配線パターンの幅を更に狭くする必要がある。しかし、これは殆ど不可能であり、エリヤの数を例えば５以上に増やすことは殆ど不可能であった。   Further, when the number of areas is increased, the number of wiring patterns formed on the film 30 is increased, and in particular, the number of wiring patterns passing through the narrow portion 30a is increased, so that it is necessary to further reduce the width of the wiring pattern. is there. However, this was almost impossible, and it was almost impossible to increase the number of areas to 5 or more, for example.

そこで、本発明は上記の課題を解決したエリア分割アナログ抵抗膜タッチパネルタッチパネル及びタッチパネル装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide an area-divided analog resistive touch panel touch panel and a touch panel device that have solved the above problems.

そこで、本発明は、上部板に上部透明導電膜が形成してあり、該上部透明導電膜がスリットで分割された複数の上部分割透明導電膜部を有する構成であり、且つ、下部板に、アナログ抵抗膜である下部透明導電膜、電圧を印加されて上記下部透明導電膜にＸ方向及びＹ方向の電位勾配を形成させる電位勾配形成手段、外部に接続するための外部接続用端子を有する構成であり、且つ、押し操作された位置の電位が上記上部透明導電膜を通して検出される構成であるエリア分割アナログ抵抗膜タッチパネルにおいて、
上記各上部分割透明導電膜部から上記外部接続用端子までの配線パターンを専ら上記下部板に形成してなる構成としたことを特徴とする。 Therefore, the present invention has an upper transparent conductive film formed on the upper plate, the upper transparent conductive film having a plurality of upper divided transparent conductive film portions divided by slits, and the lower plate, A lower transparent conductive film as an analog resistance film, a potential gradient forming means for applying a voltage to form a potential gradient in the X direction and the Y direction in the lower transparent conductive film, and an external connection terminal for connecting to the outside In the area-divided analog resistive touch panel, in which the potential at the pressed position is detected through the upper transparent conductive film,
A wiring pattern from each of the upper divided transparent conductive film portions to the external connection terminal is exclusively formed on the lower plate.

本発明によれば、各上部分割透明導電膜部から外部接続用端子までの配線パターンを専ら下部板に形成した構成であるため、エリア分割に伴って配線パターンの本数が増えることに関連して発生する問題を解決して、信頼性の向上を図ることができる。   According to the present invention, since the wiring pattern from each upper divided transparent conductive film portion to the external connection terminal is exclusively formed on the lower plate, the number of wiring patterns increases with area division. It is possible to improve the reliability by solving the problems that occur.

次に本発明の実施の形態について説明する。   Next, an embodiment of the present invention will be described.

図４は本発明の実施例１になるエリア４分割アナログ抵抗膜タッチパネル１１０を分解して示す。図５（Ａ）はフィルム下面の透明導電膜及び配線パターンを示し、同図（Ｂ）はガラス板上面の透明導電膜、配線パターン及びダイオード等を示す。図６は図４に示すタッチパネル１１０からガラス板上面の透明導電膜に電位勾配を形成する手段を取り除いた構成、即ち、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す。Ｘ１−Ｘ２が横方向、Ｙ１−Ｙ２が縦方向、Ｚ１−Ｚ２が厚さ方向である。   FIG. 4 shows an exploded view of the area-divided analog resistive touch panel 110 according to the first embodiment of the present invention. FIG. 5A shows the transparent conductive film and wiring pattern on the lower surface of the film, and FIG. 5B shows the transparent conductive film, wiring pattern and diode on the upper surface of the glass plate. FIG. 6 shows a configuration in which a means for forming a potential gradient in the transparent conductive film on the upper surface of the glass plate is removed from the touch panel 110 shown in FIG. The configuration is shown. X1-X2 is the horizontal direction, Y1-Y2 is the vertical direction, and Z1-Z2 is the thickness direction.

図４、図５、図６中、図１乃至図３に示す構成部分と対応する部分には１００を加算した符号を付す。   4, 5, and 6, components corresponding to the components illustrated in FIGS. 1 to 3 are denoted by reference numerals obtained by adding 100.

エリア４分割アナログ抵抗膜タッチパネル１１０は、下部板としての長方形のガラス板１１１の上側に上部板としてのフィルム１３０が周囲を両面テープでもって接着してあり、且つ、フレキシブルケーブル１４０がＸ１方向に延びている構成であり、同時に押し操作することが可能である四つのエリア１〜４を有する。   In the area-divided analog resistive touch panel 110, a film 130 as an upper plate is bonded to the upper side of a rectangular glass plate 111 as a lower plate with a double-sided tape, and a flexible cable 140 extends in the X1 direction. And has four areas 1 to 4 that can be pushed simultaneously.

ガラス板１１１は、四つの辺１１１ａ〜１１１ｄを有する。ガラス板１１１上面の全面に絶縁膜１１２が形成され、絶縁膜１１２上の中央にアナログ抵抗膜である長方形の下部透明導電膜１１３が形成してある。下部透明導電膜１１３の周囲の部分が額縁１１１ｅである。額縁１１１ｅの部分に、Ｌ字形状の配線パターン１１４，１１５、複数のダイオードチップ１１６ａ、１１６ｂ、１１６ｃ、１１６ｄ、多数の点電極１１７ａ、１１７ｂ、１１７ｃ、１１７ｄ、分散している中継電極１１８−１〜１１８−４、分散している配線パターン１１９−１〜１１９−４、Ｘ１側に整列している外部接続用端子１２０−２、１２０−１、１２０−３〜１２０−６等が形成してある。電圧モニター用の手段は省略してある。また、額縁１１３の部分には、最上面に絶縁膜２１が形成してあり、配線パターン１１４，１１５、配線パターン１１９−１〜１１９−４等が覆われており、外部接続用端子１２０−１〜１２０−６及び中継電極１１８−１〜１１８−４は露出している。配線パターン１１４，１１５、１１９−１〜１１９−４は全て幅の制約を受けず、全て幅は１．０ｍｍである。   The glass plate 111 has four sides 111a to 111d. An insulating film 112 is formed on the entire upper surface of the glass plate 111, and a rectangular lower transparent conductive film 113, which is an analog resistance film, is formed at the center on the insulating film 112. A portion around the lower transparent conductive film 113 is a frame 111e. L-shaped wiring patterns 114 and 115, a plurality of diode chips 116a, 116b, 116c, and 116d, a large number of point electrodes 117a, 117b, 117c, and 117d, and distributed relay electrodes 118-1 to 118d are disposed on the frame 111e. 118-4, distributed wiring patterns 119-1 to 119-4, external connection terminals 120-2, 120-1, 120-3 to 120-6 and the like aligned on the X1 side are formed. . The means for voltage monitoring is omitted. In addition, an insulating film 21 is formed on the uppermost surface of the frame 113 and covers the wiring patterns 114 and 115, the wiring patterns 119-1 to 119-4, and the like, and the external connection terminal 120-1 To 120-6 and the relay electrodes 118-1 to 118-4 are exposed. The wiring patterns 114, 115, and 119-1 to 119-4 are all not limited by the width, and the width is 1.0 mm.

配線パターン１１４、１１５はガラス板１１１の対角の位置に配置しており、Ｘ方向に延在する配線パターン部分１１４Ｘ，１１５ＸとＹ方向に延在する配線パターン部分１１４Ｙ，１１５Ｙとを有する。ダイオードチップ１１６ａは配線パターン部分１１４Ｙと点電極１１７ａとの間に、ダイオードチップ１１６ｂは配線パターン部分１１５Ｙと点電極１１７ｂとの間に、共にＸ２が順方向である向きで接続してある。ダイオードチップ１１６ｃは配線パターン部分１１５Ｘと点電極１１７ｃとの間に、ダイオードチップ１１６ｄは配線パターン部分１１４Ｘと点電極１１７ｄとの間に、共にＹ１が順方向である向きで接続してある。また、配線パターン１１４、１１５は夫々外部接続用端子１２０−５、１２０−６を有する。外部接続用端子１２０−５にＶｃｃを印加し、外部接続用端子１２０−６をグランド電位とすると、点電極１１７ｂに電圧が印加され、下部透明導電膜１１３には点電極１１７ｂから点電極１１７ａに向かって即ちＸ２側からＸ１方向に向かって電位が下がる電位勾配が形成される。上記とは逆に外部接続用端子１２０−６にＶｃｃを印加し、外部接続用端子１２０−５をグランド電位とすると、点電極１１７ｃに電圧が印加され、下部透明導電膜１１３には点電極１１７ｃから点電極１１７ｄに向かって即ちＹ１側からＹ２方向に向かって電位が下がる電位勾配が形成される。Ｌ字形状の配線パターン１１４，１１５、複数のダイオードチップ１１６ａ、１１６ｂ、１１６ｃ、１１６ｄ、多数の点電極１１７ａ、１１７ｂ、１１７ｃ、１１７ｄが、電圧を印加されて下部透明導電膜１１３にＸ方向及びＹ方向の電位勾配を形成させる電位勾配形成手段を構成する。   The wiring patterns 114 and 115 are arranged at diagonal positions on the glass plate 111, and have wiring pattern portions 114X and 115X extending in the X direction and wiring pattern portions 114Y and 115Y extending in the Y direction. The diode chip 116a is connected between the wiring pattern portion 114Y and the point electrode 117a, and the diode chip 116b is connected between the wiring pattern portion 115Y and the point electrode 117b in a direction in which X2 is the forward direction. The diode chip 116c is connected between the wiring pattern portion 115X and the point electrode 117c, and the diode chip 116d is connected between the wiring pattern portion 114X and the point electrode 117d so that Y1 is in the forward direction. The wiring patterns 114 and 115 have external connection terminals 120-5 and 120-6, respectively. When Vcc is applied to the external connection terminal 120-5 and the external connection terminal 120-6 is set to the ground potential, a voltage is applied to the point electrode 117b, and the lower transparent conductive film 113 is applied from the point electrode 117b to the point electrode 117a. A potential gradient is formed in which the potential decreases from the X2 side toward the X1 direction. Contrary to the above, when Vcc is applied to the external connection terminal 120-6 and the external connection terminal 120-5 is set to the ground potential, a voltage is applied to the point electrode 117c, and the point electrode 117c is applied to the lower transparent conductive film 113. A potential gradient is formed in which the potential decreases from Y1 toward the point electrode 117d, that is, from the Y1 side toward the Y2 direction. L-shaped wiring patterns 114 and 115, a plurality of diode chips 116a, 116b, 116c and 116d, and a large number of point electrodes 117a, 117b, 117c and 117d are applied to the lower transparent conductive film 113 in the X direction and Y direction. A potential gradient forming means for forming a potential gradient in the direction is configured.

フィルム１３０は、Ｘ１側の辺にフレキシブルケーブル１４０の接続のための切欠１３１を有する。切欠１３１は上記の外部接続用端子１２０−１〜１２０−６が露出する大きさである。フィルム１３０の下面には、その全面に、上部透明導電膜１３３が形成してある。上部透明導電膜１３３はエッチングで形成された十字のスリット１３２でもって４つの上部分割透明導電膜部１３３−１〜１３３−４に分割されている。１３３−１ａ〜１３３−４ａはエリア対応上部分割透明導電膜部であり、上部分割透明導電膜部１３３−１〜１３３−４のうち下部透明導電膜１１３に対向する部分、即ち、エリア１〜４に対応する部分である。   The film 130 has a notch 131 for connecting the flexible cable 140 on the X1 side. The notch 131 is sized to expose the external connection terminals 120-1 to 120-6. An upper transparent conductive film 133 is formed on the entire lower surface of the film 130. The upper transparent conductive film 133 is divided into four upper divided transparent conductive film portions 133-1 to 133-4 by cross slits 132 formed by etching. Reference numerals 133-1a to 133-4a denote area-corresponding upper divided transparent conductive film portions, and portions of the upper divided transparent conductive film portions 133-1 to 133-4 that face the lower transparent conductive film 113, that is, areas 1-4. It is a part corresponding to.

１３４−１〜１３４−４は導電接着予定部であり、点形状であり、夫々上部分割透明導電膜部１３３−１〜１３３−４の中であって、夫々エリア対応上部分割透明導電膜部１３３−１ａ〜１３３−４ａに近い場所に配置してある。この導電接着予定部１３４−１〜１３４−４が上部分割透明導電膜部１３３−１〜１３３−４に形成してあるので、図１及び図２（Ａ）に示されている配線パターン３５−１〜３５−４に対応する配線パターン及び中継電極３４−１〜３４−４に対応する中継電極は形成されていない。このようにフィルム１３０には配線パターンが一切形成されていないため、エリア４分割アナログ抵抗膜タッチパネル１１０は図１に示す従来のエリア４分割アナログ抵抗膜タッチパネル１０に比較して高い信頼性を有する。   Reference numerals 134-1 to 134-4 denote conductive adhesion planned portions, which are dot-shaped, respectively, in the upper divided transparent conductive film portions 133-1 to 133-4, and each corresponding to the area corresponding upper divided transparent conductive film portion 133. -1a to 133-4a. Since the conductive bonding scheduled portions 134-1 to 134-4 are formed in the upper divided transparent conductive film portions 133-1 to 133-4, the wiring pattern 35- shown in FIG. 1 and FIG. The wiring patterns corresponding to 1 to 35-4 and the relay electrodes corresponding to the relay electrodes 34-1 to 34-4 are not formed. As described above, since no wiring pattern is formed on the film 130, the area four-divided analog resistive touch panel 110 has higher reliability than the conventional area four-divided analog resistive touch panel 10 shown in FIG.

なお、ガラス板１１１上の中継電極１１８−１〜１１８−４は、上記の導電接着予定部１３４−１〜１３４−４の配置に対応して配置してある。   The relay electrodes 118-1 to 118-4 on the glass plate 111 are arranged corresponding to the arrangement of the conductive bonding scheduled portions 134-1 to 134-4.

フレキシブルケーブル１４０は、フレキシブルなテープ状のシート上に複数の配線パターンが平行に形成してあり、Ｘ２端側部分１４０ａは上記切欠１３１に対応する大きさであり、ここに、上記の外部接続用端子１２０−１〜１２０−６に対応して端子が並んでいる構成である。   In the flexible cable 140, a plurality of wiring patterns are formed in parallel on a flexible tape-like sheet, and the X2 end side portion 140a has a size corresponding to the notch 131. In this configuration, the terminals are arranged corresponding to the terminals 120-1 to 120-6.

ガラス板１１１とフィルム１３０とは、エリア対応上部分割透明導電膜部１３３−１ａ〜１３３−４ａがスペーサによって形成される隙間を介して下部透明導電膜１１３上に対向し、導電接着予定部１３４−１〜１３４−４が夫々中継電極１１８−１〜１１８−４と導電接着されて接続された状態にある。フレキシブルケーブル１４０のＸ２端側部分１４０ａがフィルム１３０の切欠１３１内に収まってガラス板１１１上に接着してあり、フレキシブルケーブル１４０の端子１４０ａが外部接続用端子１２０−１〜１２０−６と接続されている。   The glass plate 111 and the film 130 are opposed to the lower transparent conductive film 113 through a gap in which the area-corresponding upper divided transparent conductive film parts 133-1a to 133-4a are formed by spacers, and the conductive adhesion planned part 134- 1 to 134-4 are connected to the relay electrodes 118-1 to 118-4 by conductive bonding. The X2 end side portion 140a of the flexible cable 140 is accommodated in the notch 131 of the film 130 and adhered onto the glass plate 111, and the terminal 140a of the flexible cable 140 is connected to the external connection terminals 120-1 to 120-6. ing.

制御回路装置によってフレキシブルケーブル１４０を通して点電極１１７ｂ及び点電極１１７ｃに電圧Ｖｃｃが交互に印加され下部透明導電膜１１３にＸ方向の電位勾配及びＹ方向の電位勾配が交互に形成される。エリア１を押す操作を行うと、エリア対応上部分割透明導電膜部１３３−１ａのうち下部透明導電膜１３と接触された点に応じた電位の信号がエリア対応上部分割透明導電膜部１３３−１ａ、上部分割透明導電膜部１３３−１のうちエリア対応上部分割透明導電膜部１３３−１ａの外側の部分、導電接着予定部１３４−１、中継電極１１８−１、配線パターン１１９−１、外部接続用端子１２０−１、フレキシブルケーブル１４０を介して制御回路装置に送られる。即ち、押し操作した点の電位が上部分割透明導電膜部１３３−１を通して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア２を押す操作を行うと、押し操作した点の電位がエリア対応上部分割透明導電膜部１３３−２ａ、上部分割透明導電膜部１３３−２のうちエリア対応上部分割透明導電膜部１３３−２ａの外側の部分、導電接着予定部１３４−２、中継電極１１８−２、配線パターン１１９−２、外部接続用端子１２０−２、フレキシブルケーブル４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア３を押す操作を行うと、押し操作した点の電位がエリア対応上部分割透明導電膜部１３３−３ａ、上部分割透明導電膜部１３３−３のうちエリア対応上部分割透明導電膜部１３３−３ａの外側の部分、導電接着予定部１３４−３、中継電極１１８−３、配線パターン１１９−３、外部接続用端子１２０−３、フレキシブルケーブル４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。エリア４を押す操作を行うと、押し操作した点の電位がエリア対応上部分割透明導電膜部１３３−４ａ、上部分割透明導電膜部１３３−４のうちエリア対応上部分割透明導電膜部１３３−４ａの外側の部分、導電接着予定部１３４−４、中継電極１１８−４、配線パターン１１９−４、外部接続用端子１２０−４、フレキシブルケーブル１４０を介して検出され、押し操作した点のＸ，Ｙ座標が割り出される。   The voltage Vcc is alternately applied to the point electrode 117b and the point electrode 117c through the flexible cable 140 by the control circuit device, and a potential gradient in the X direction and a potential gradient in the Y direction are alternately formed in the lower transparent conductive film 113. When an operation of pressing area 1 is performed, a signal having a potential corresponding to a point in contact with the lower transparent conductive film 13 in the area-corresponding upper divided transparent conductive film portion 133-1a generates an area-corresponding upper divided transparent conductive film portion 133-1a. Of the upper divided transparent conductive film part 133-1, the outer part of the area corresponding upper divided transparent conductive film part 133-1a, the conductive adhesion planned part 134-1, the relay electrode 118-1, the wiring pattern 119-1, and the external connection It is sent to the control circuit device via the terminal 120-1 and the flexible cable 140. In other words, the potential of the pressed point is detected through the upper divided transparent conductive film portion 133-1, and the X and Y coordinates of the pressed point are determined. When the area 2 is pressed, the potential at the pressed point is the area-corresponding upper divided transparent conductive film portion 133-2a among the upper divided transparent conductive film portion 133-2a and the upper divided transparent conductive film portion 133-2. X, Y of the point detected and pushed through the outer portion of the wire, the conductive bonding scheduled portion 134-2, the relay electrode 118-2, the wiring pattern 119-2, the external connection terminal 120-2, the flexible cable 40 Coordinates are determined. When the area 3 is pressed, the potential of the pressed point is the area-corresponding upper divided transparent conductive film part 133-3a among the upper divided transparent conductive film part 133-3a and the upper divided transparent conductive film part 133-3. X, Y of the point detected and pushed through the outer portion of the wire, the conductive bonding planned portion 134-3, the relay electrode 118-3, the wiring pattern 119-3, the external connection terminal 120-3, and the flexible cable 40 Coordinates are determined. When the area 4 is pressed, the potential of the pressed point is the area-corresponding upper divided transparent conductive film portion 133-4a and the upper divided transparent conductive film portion 133-4. X, Y of the point detected and pushed through the outer portion of the wire, the conductive bonding planned portion 134-4, the relay electrode 118-4, the wiring pattern 119-4, the external connection terminal 120-4, and the flexible cable 140 Coordinates are determined.

エリア１〜４を同時に押し操作すると、各押し操作した点のＸ，Ｙ座標が別々に且つ同時に割り出される。   When the areas 1 to 4 are simultaneously pressed, the X and Y coordinates of the points that are pressed are determined separately and simultaneously.

上記のエリア４分割アナログ抵抗膜タッチパネル１１０は、フィルム１３０には配線パターンが一切形成されていない状態で構成してあるため、フィルム１３０上に配線パターンを形成した場合の問題点、即ち、印刷性がよくない、タッチパネルの操作によってストレスを受ける虞れがある、タッチパネルの表面が損傷した場合にその影響を受ける虞れがある、切欠１３１に臨んでいる部分を通る配線パターンは幅を狭くする必要がある等の問題点が全て解決され、従来に比較して高い信頼性を有する。また、各エリア対応上部分割透明導電膜部と外部接続用端子との間を接続する全ての配線パターン１１９−１〜１１９−４がガラス板１１１上に形成されているため、幅を少しも狭くしないで配線パターンの数を増やすことが可能となり、よって、エリアの数を５以上の数に増やすことも可能である。   The area-divided analog resistive touch panel 110 is configured in a state where no wiring pattern is formed on the film 130. Therefore, there is a problem when a wiring pattern is formed on the film 130, that is, printability. The wiring pattern that passes through the part facing the notch 131 needs to be narrowed. The wiring pattern may be affected by the operation of the touch panel, or may be affected when the surface of the touch panel is damaged. All the problems such as there are solved, and the reliability is higher than the conventional one. Moreover, since all the wiring patterns 119-1 to 119-4 that connect between the upper divided transparent conductive film corresponding to each area and the external connection terminals are formed on the glass plate 111, the width is slightly narrowed. Without increasing the number of wiring patterns, the number of areas can be increased to 5 or more.

図７は本発明の実施例２になるエリア４分割アナログ抵抗膜タッチパネル１１０Ａを分解して示す。図８は図４に示すタッチパネル１１０からガラス板上面の透明導電膜に電位勾配を形成する手段を取り除いた構成、即ち、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す。図７及び図８中、図４及び図６と対応する部分には同じ符号を付す。   FIG. 7 is an exploded view of an area-divided analog resistive touch panel 110A according to the second embodiment of the present invention. FIG. 8 shows a configuration in which a means for forming a potential gradient in the transparent conductive film on the upper surface of the glass plate is removed from the touch panel 110 shown in FIG. The configuration is shown. 7 and 8, the same reference numerals are given to the portions corresponding to those in FIGS. 4 and 6.

エリア４分割アナログ抵抗膜タッチパネル１１０Ａは、フィルム１３０に上部透明導電膜１３３Ａをエリア１〜４に対応する部分に限って有し、各エリア対応上部分割透明導電膜部１３３−１ａ〜１３３−４ａの外側の縁に沿ってＬ字形状の電極２００−１〜２００−４を有し、各Ｌ字形状電極２００−１〜２００−４が夫々ガラス板１１１上の中継電極１１８−１〜１１８−４と接続されている構成である。Ｌ字形状の電極２００−１はエリア対応上部分割透明導電膜部１３３−１ａのＸ方向に延在する縁に沿う電極部２００−１ＸとＹ方向に延在する縁に沿う電極部２００−１Ｙとよりなる。他のＬ字形状の電極２００−２、２００−３、２００−４も同じである。３０１〜３０４は各Ｌ字形状電極２００−１〜２００−４のうち中継電極１１８−１〜１１８−４と接続される接続予定部である。   The area 4-divided analog resistive touch panel 110A has the upper transparent conductive film 133A on the film 130 only in a portion corresponding to the areas 1 to 4, and each of the area corresponding upper divided transparent conductive film portions 133-1a to 133-4a. L-shaped electrodes 200-1 to 200-4 are provided along the outer edges, and the L-shaped electrodes 200-1 to 200-4 are respectively connected to the relay electrodes 118-1 to 118-4 on the glass plate 111. It is the structure connected with. The L-shaped electrode 200-1 includes an electrode portion 200-1X along the edge extending in the X direction of the area-corresponding upper divided transparent conductive film portion 133-1a and an electrode portion 200-1Y along the edge extending in the Y direction. And more. The same applies to the other L-shaped electrodes 200-2, 200-3, and 200-4. Reference numerals 301 to 304 denote connection planned portions connected to the relay electrodes 118-1 to 118-4 among the L-shaped electrodes 200-1 to 200-4.

各エリア１〜４を押す操作を行った場合に、押し操作した点の電位は、エリア対応上部分割透明導電膜部１３３−１ａ〜１３３−４ａを通してＬ字形状電極２００−１〜２００−４のうち押し操作した点に最も近い部分でピックアップされ、ＯＮ抵抗は大きくはならない。   When the operation of pressing each area 1 to 4 is performed, the potential of the pressed point is applied to the L-shaped electrodes 200-1 to 200-4 through the area corresponding upper divided transparent conductive film portions 133-1a to 133-4a. The pickup is picked up at the part closest to the point where the push operation is performed, and the ON resistance does not increase.

図４に示すエリア４分割アナログ抵抗膜タッチパネル１１０においては、各エリア１〜４の面積が大きい場合であって、各エリア１〜４のうち導電接着予定部１３４−１〜１３４−４から遠い場所を押し操作した場合には、ＯＮ抵抗が大きくなりすぎて座標の検出が不能となる虞れがある。即ち、各エリア１〜４のうち導電接着予定部１３４−１〜１３４−４から遠い場所は不感場所となる虞れがある。   In the area 4-divided analog resistive touch panel 110 shown in FIG. 4, the areas 1 to 4 are large, and the areas 1 to 4 are far from the conductive bonding scheduled portions 134-1 to 134-4. When is pressed, there is a possibility that the ON resistance becomes too large to detect the coordinates. That is, in each of the areas 1 to 4, a place far from the conductive bonding scheduled portions 134-1 to 134-4 may be a dead place.

しかし、上記の実施例２になるエリア４分割アナログ抵抗膜タッチパネル１１０Ａにおいては、各エリア１〜４の面積が大きい場合であっても、座標の検出が不能となる不感場所が形成されてしまうことがなくなる。   However, in the area 4-divided analog resistive touch panel 110A according to the second embodiment described above, even if the areas 1 to 4 are large, a dead place where the coordinates cannot be detected is formed. Disappears.

図９は本発明の実施例３になるエリア４分割アナログ抵抗膜タッチパネル１１０Ｂを簡略化して示す。エリア４分割アナログ抵抗膜タッチパネル１１０Ｂは、図７及び図８に示す上記の実施例２になるエリア４分割アナログ抵抗膜タッチパネル１１０Ａの変形例的なものであり、所定のサイズである各Ｌ字形状電極２００−１〜２００−４のうち中継電極１１８−１〜１１８−４との接続予定部３０１ａ〜３０４ａが外部接続用端子１２０−１〜１２０−４が並んでいる側であるＸ１側寄りの場所であるようにしてある。各Ｌ字形状電極２００−１〜２００−４は共にＸ１側寄りに位置する接続予定部３０１ａ〜３０４ａで各中継電極１１８−１〜１１８−４と接続されている。   FIG. 9 shows a simplified area four-division analog resistive touch panel 110B according to a third embodiment of the present invention. The area 4-divided analog resistive touch panel 110B is a modification of the area 4-divided analog resistive touch panel 110A according to the second embodiment shown in FIGS. 7 and 8, and each L-shaped having a predetermined size. Of the electrodes 200-1 to 200-4, the portions 301a to 304a to be connected to the relay electrodes 118-1 to 118-4 are closer to the X1 side where the external connection terminals 120-1 to 120-4 are arranged. It is supposed to be a place. Each of the L-shaped electrodes 200-1 to 200-4 is connected to the relay electrodes 118-1 to 118-4 at connection planned portions 301a to 304a located closer to the X1 side.

この構成によれば、ガラス板１１１上の配線パターン１１９−１〜１１９−４の長さが図７及び図８のエリア４分割アナログ抵抗膜タッチパネル１１０Ａの対応する配線パターンの長さに比べて短くなる。よって、ＯＮ抵抗が更に低くなり、また、配線パターンを形成する材料も節約できる。   According to this configuration, the length of the wiring patterns 119-1 to 119-4 on the glass plate 111 is shorter than the corresponding wiring pattern length of the area 4-division analog resistance touch panel 110A in FIGS. Become. Therefore, the ON resistance is further reduced, and the material for forming the wiring pattern can be saved.

図１０は本発明の実施例４になるエリア４分割アナログ抵抗膜タッチパネル１１０Ｃを簡略化して示す。エリア４分割アナログ抵抗膜タッチパネル１１０Ｃは、図４乃至図６に示す上記の実施例１になるエリア４分割アナログ抵抗膜タッチパネル１１０の変形例的なものであり、導電接着予定部１３４−１ａ〜１３４−４ａが各上部分割透明導電膜部１３３−１〜１３３−４のうち外部接続用端子１２０−１〜１２０−４が並んでいる側であるＸ１側寄りの場所であるようにしてある。各上部分割透明導電膜部１３３−１〜１３３−４は共にＸ１側寄りに位置する導電接着予定部１３４−１ａ〜１３４−４ａで各中継電極１１８−１〜１１８−４と接続されている。   FIG. 10 shows a simplified area four-division analog resistive touch panel 110C according to the fourth embodiment of the present invention. The area 4-divided analog resistive touch panel 110C is a modification of the area 4-divided analog resistive touch panel 110 according to the first embodiment shown in FIGS. -4a is a position closer to the X1 side, which is the side where the external connection terminals 120-1 to 120-4 are arranged, among the upper divided transparent conductive film portions 133-1 to 133-4. Each of the upper divided transparent conductive film parts 133-1 to 133-4 is connected to the relay electrodes 118-1 to 118-4 at conductive bonding scheduled parts 134-1 a to 134-4 a located closer to the X1 side.

この構成によれば、ガラス板１１１上の配線パターン１１９−１〜１１９−４の長さが図４乃至図６のエリア４分割アナログ抵抗膜タッチパネル１１０の対応する配線パターンの長さに比べて短くなる。よって、ＯＮ抵抗が更に低くなり、また、配線パターンを形成する材料も節約できる。   According to this configuration, the length of the wiring patterns 119-1 to 119-4 on the glass plate 111 is shorter than the corresponding wiring pattern length of the area 4-division analog resistance touch panel 110 of FIGS. Become. Therefore, the ON resistance is further reduced, and the material for forming the wiring pattern can be saved.

従来のエリア４分割アナログ抵抗膜タッチパネルを分解して示す図である。It is a figure which decomposes | disassembles and shows the conventional area 4 division | segmentation analog resistive touch panel. （Ａ）はフィルム下面の透明導電膜及び配線パターンを示し、（Ｂ）はガラス板上面の透明導電膜、配線パターン及びダイオード等を示す図である。(A) shows the transparent conductive film and wiring pattern on the lower surface of the film, and (B) shows the transparent conductive film, wiring pattern and diode on the upper surface of the glass plate. 図１のタッチパネルにおいて、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す図である。FIG. 2 is a diagram showing a configuration of a portion of the touch panel of FIG. 1 that takes out the potential of the coordinate where each area is pressed through an upper transparent conductive film. 本発明の実施例１のエリア４分割アナログ抵抗膜タッチパネルを分解して示す図である。It is a figure which decomposes | disassembles and shows the area 4 division | segmentation analog resistive touch panel of Example 1 of this invention. （Ａ）はフィルム下面の透明導電膜及び配線パターンを示し、（Ｂ）はガラス板上面の透明導電膜、配線パターン及びダイオード等を示す図である。(A) shows the transparent conductive film and wiring pattern on the lower surface of the film, and (B) shows the transparent conductive film, wiring pattern and diode on the upper surface of the glass plate. 図４のタッチパネルにおいて、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す図である。FIG. 5 is a diagram showing a configuration of a portion of the touch panel of FIG. 4 that takes out the potential of the coordinate where each area is pressed through an upper transparent conductive film. 本発明の実施例２のエリア４分割アナログ抵抗膜タッチパネルを分解して示す図である。It is a figure which decomposes | disassembles and shows the area 4 division | segmentation analog resistive touch panel of Example 2 of this invention. 図７のタッチパネルにおいて、各エリアの押し操作された座標の電位を上部透明導電膜を通して取り出す部分の構成を示す図である。FIG. 8 is a diagram showing a configuration of a portion of the touch panel of FIG. 7 that takes out the potential of the coordinate where each area is pushed through the upper transparent conductive film. 本発明の実施例３のエリア４分割アナログ抵抗膜タッチパネルを概略的に示す図である。It is a figure which shows roughly the area 4 division | segmentation analog resistive film touch panel of Example 3 of this invention. 本発明の実施例４のエリア４分割アナログ抵抗膜タッチパネルを概略的に示す図である。It is a figure which shows roughly the area 4 division | segmentation analog resistive touch panel of Example 4 of this invention.

符号の説明Explanation of symbols

１〜４ エリア
１１０，１１０Ａ〜１１０Ｃ エリア４分割アナログ抵抗膜タッチパネル
１１１ ガラス板
１１１ｅ 額縁
１１２，１２１ 絶縁膜
１１３ 下部透明導電膜
１１６ａ〜１１６ｄ ダイオードチップ
１１７ａ〜１１７ｄ 点電極
１１８−１〜１１８−４ 中継電極
１１９−１〜１１９−４ 配線パターン
１２０−１〜１２０−６ 外部接続用端子
１３０ フィルム
１３２ スリット
１３３ 上部透明導電膜
１３３−１〜１３３−４ 上部分割透明導電膜部
１３３−１ａ〜１３３−４ａ エリア対応上部分割透明導電膜部
１３４−１〜１３４−４、１３４−１ａ〜１３４−４ａ 導電接着予定部
１４０ フレキシブルケーブル
２００−１〜２００−４ Ｌ字形状電極
３０１〜３０４、３０１ａ〜３０４ａ 接続予定部 1 to 4 area 110, 110A to 110C area 4 divided analog resistive film touch panel 111 glass plate 111e frame 112, 121 insulating film 113 lower transparent conductive film 116a to 116d diode chip 117a to 117d point electrode 118-1 to 118-4 relay electrode 119-1 to 119-4 Wiring pattern 120-1 to 120-6 External connection terminal 130 Film 132 Slit 133 Upper transparent conductive film 133-1 to 133-4 Upper divided transparent conductive film portion 133-1a to 133-4a Area Corresponding upper divided transparent conductive film part 134-1 to 134-4, 134-1a to 134-4a Conductive adhesion planned part 140 Flexible cable 200-1 to 200-4 L-shaped electrode 301 to 304, 301a to 304a Connection planned part

Claims (5)

上部板に上部透明導電膜が形成してあり、該上部透明導電膜がスリットで分割された複数の上部分割透明導電膜部を有する構成であり、且つ、下部板に、アナログ抵抗膜である下部透明導電膜、電圧を印加されて上記下部透明導電膜にＸ方向及びＹ方向の電位勾配を形成させる電位勾配形成手段、外部に接続するための外部接続用端子を有する構成であり、且つ、押し操作された位置の電位が上記上部透明導電膜を通して検出される構成であるエリア分割アナログ抵抗膜タッチパネルにおいて、
上記各上部分割透明導電膜部から上記外部接続用端子までの配線パターンを専ら上記下部板に形成してなる構成としたことを特徴とするエリア分割アナログ抵抗膜タッチパネル。 An upper transparent conductive film is formed on the upper plate, the upper transparent conductive film has a plurality of upper divided transparent conductive film portions divided by slits, and the lower plate is an analog resistance film. A transparent conductive film; potential gradient forming means for applying a voltage to form a potential gradient in the X direction and the Y direction in the lower transparent conductive film; an external connection terminal for external connection; and a push In the area-divided analog resistive touch panel, in which the potential at the operated position is detected through the upper transparent conductive film,
An area-divided analog resistive touch panel, wherein a wiring pattern from each upper divided transparent conductive film portion to the external connection terminal is formed exclusively on the lower plate. 請求項１に記載のエリア分割タッチパネルにおいて、
上記下部板に形成してある上記配線パターンが、上記各上部分割透明導電膜部の一部と接続してある構成としたことを特徴とするエリア分割アナログ抵抗膜タッチパネル。 In the area division | segmentation touchscreen of Claim 1,
An area-divided analog resistive touch panel, wherein the wiring pattern formed on the lower plate is connected to a part of each upper divided transparent conductive film portion. 請求項２に記載のエリア分割タッチパネルにおいて、
上記下部板に形成してある上記配線パターンが上記各上部分割透明導電膜部の一部と接続してある場所が、各上部分割透明導電膜部のうち上記外部接続用端子に近い場所であるように構成したことを特徴とするエリア分割アナログ抵抗膜タッチパネル。 The area division touch panel according to claim 2,
A place where the wiring pattern formed on the lower plate is connected to a part of each upper divided transparent conductive film portion is a place near each external connection terminal in each upper divided transparent conductive film portion. An area-divided analog resistive touch panel characterized by being configured as described above. 請求項１に記載のエリア分割タッチパネルにおいて、
上記各上部分割透明導電膜部は、その縁に沿ってＬ字形状の電極を有し、
上記下部板に形成してある上記配線パターンが上記Ｌ字形状電極と接続してある構成としたことを特徴とするエリア分割アナログ抵抗膜タッチパネル。 In the area division | segmentation touchscreen of Claim 1,
Each upper divided transparent conductive film part has an L-shaped electrode along its edge,
An area-divided analog resistive touch panel, wherein the wiring pattern formed on the lower plate is connected to the L-shaped electrode. 請求項４に記載のエリア分割タッチパネルにおいて、
上記下部板に形成してある上記配線パターンが上記Ｌ字形状電極と接続してある場所が、上記Ｌ字形状電極のうち上記外部接続用端子に近い場所であるように構成したことを特徴とするエリア分割アナログ抵抗膜タッチパネル。
In the area division | segmentation touchscreen of Claim 4,
The place where the wiring pattern formed on the lower plate is connected to the L-shaped electrode is configured to be a place near the external connection terminal in the L-shaped electrode. Area-divided analog resistive touch panel.
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