JP2006019525A - Substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize further downsizing of a substrate processing apparatus.
A substrate processing apparatus for performing a predetermined process on a substrate B being transported in a substantially horizontal posture along a transport path 171 and supplying a predetermined processing liquid to the substrate B being transported. A liquid recovery type nozzle device 20 configured to recover the supplied processing liquid from the substrate B, and a processing liquid for removing the processing liquid remaining on the substrate B after the processing liquid is supplied. An air knife 30 configured to blow off the residual processing liquid on the substrate B by an air current as a removing device is arranged in series along the transport path 171.
[Selection] Figure 1

Description

  The present invention relates to a substrate processing apparatus that performs predetermined processing on a substrate including a glass substrate on which a liquid crystal, various electronic components, and the like are mounted.

  Substrates used for liquid crystal displays or the like are manufactured by sequentially loading the substrates into a plurality of processing tanks provided for each type of processing liquid, and a predetermined processing liquid is supplied in each processing tank. In general, each of them has its own processing. In order to perform such a process on the substrate, a conveyance path that passes through each processing tank is provided, and conveyance means such as a plurality of conveyance rollers are arranged along the conveyance path, and the substrate is conveyed to the conveyance means. However, it will be sent in order into each processing tank.

  When performing multiple treatments with different treatment liquids on the substrate, ensure a sufficient distance between the treatment tanks to prevent the upstream treatment liquid from being brought into the substrate and brought into the downstream treatment tank. However, this occupies a large space for substrate processing, and there is an inconvenience that the effective use of the manufacturing space is hindered.

  In order to eliminate such inconvenience, there is a case where a method of spraying the processing liquid from the spray nozzle onto the substrate being transported along the transport path may be employed. According to such a treatment liquid spraying method, the treatment solution can be uniformly applied to the entire substrate as described above, and the treatment time is shortened compared to the immersion method.

By the way, in recent years, there has been proposed a liquid recovery type nozzle device as described in Patent Document 1 in which a processing liquid supplied to a substrate on the downstream side in the transport direction is recovered from the substrate on the upstream side.
JP 2002-280340 A

  In the conventional spray nozzle method, since a large amount of processing liquid remains on the substrate after processing, a required processing length is necessary to surely remove the residual processing liquid. A form in which the liquid was reliably drained by the liquid draining member after dripping from above was necessary. Further, even when the liquid recovery type nozzle device described in Patent Document 1 is applied to the substrate processing apparatus to which the spray nozzle device is applied, the types of the two nozzle devices are greatly different, and the liquid recovery type nozzle device is different in the processing liquid. Due to the difference of recovering much, it is difficult to simply replace and apply.

  The present invention has been made in view of such a situation, and it is possible to further reduce the size of the substrate processing space while ensuring the efficient use of the processing liquid, and also to increase the efficiency of the substrate processing. An object of the present invention is to provide a substrate processing apparatus that can be realized.

  The invention described in claim 1 is a substrate processing apparatus for performing a predetermined process on a substrate being transferred in a substantially horizontal posture along a transfer path, and supplying a processing liquid toward the substrate being transferred to perform substrate processing. And a liquid recovery type nozzle part for recovering the processed processing liquid from the substrate, and a liquid for blowing off the processing liquid on the substrate immediately downstream of the substrate recovery path of the liquid recovery type nozzle part The cutting part is arranged in series along the conveyance path.

  By adopting such a configuration, the substrate introduced into the substrate processing apparatus is first processed by the processing liquid supplied from the liquid recovery type nozzle unit while being transported, and a large amount of processing liquid is recovered. Then, the processed substrate reaches the liquid draining section, and the liquid draining process is performed on the remaining processing liquid by the liquid draining section. For this reason, even if a liquid draining part is provided at a position immediately downstream of the liquid recovery type nozzle device, an accurate liquid draining process is performed. Therefore, the liquid recovery type nozzle part and the liquid draining part can be arranged compactly in the substrate transport direction, and the processing efficiency can be improved.

  According to a second aspect of the present invention, in the first aspect of the present invention, one unit of the substrate processing unit is formed by the liquid recovery type nozzle unit and the liquid draining unit, and a plurality of units of the substrate processing unit are provided in the transport path. And different types of processing liquids are used in the substrate processing units of each unit.

  According to such a configuration, the substrate is transported along the transport path, so that it is processed by a plurality of types of processing liquids by passing through the substrate processing unit of each unit. In addition, since the amount of the processing liquid in the upstream substrate processing unit accompanying the substrate and brought into the downstream substrate processing unit can be reduced as compared with the conventional one, the distance between the substrate processing units is compared with the conventional one. Can be as short as possible.

  According to a third aspect of the present invention, in the second aspect of the present invention, an etching unit, a cleaning unit, and a drying unit are provided from the upstream side of the conveyance path as the substrate processing units, and the etching unit performs an etching process on the substrate. Etching solution is used as a processing solution to be applied, the cleaning unit uses pure water as a processing solution to clean the substrate, and the drying unit is used for drying the liquid draining unit. It is characterized by that.

  According to such a configuration, the substrate being transported along the transport path is first subjected to an etching process in which an etching solution is supplied in the etching unit, and then subjected to a cleaning process in which pure water is supplied in the cleaning unit. Finally, after the drying process is performed by the air flow supplied from the liquid draining unit in the drying unit, the product is discharged to the next process.

  According to a fourth aspect of the invention, in the invention according to any one of the first to third aspects, the liquid recovery type nozzle portion and the liquid draining portion have a substrate carry-in port and a substrate carry-out port on opposite wall surfaces. An air introducing means for introducing clean air into the processing apparatus main body, the air introducing means being disposed in the processing apparatus main body in which the transfer path is formed between the substrate carry-in port and the substrate carry-out port; And an exhaust means for exhausting the air inside.

  According to such a configuration, the substrate introduced into the processing apparatus main body from the substrate carry-in entrance along the transport path is sequentially transported to the liquid recovery type nozzle section and the liquid cutting section provided in the processing apparatus main body, and each nozzle After a predetermined process is performed by the apparatus, it is discharged out of the system from the substrate carry-out port. In addition, since clean air from the air introduction means is always introduced into the processing apparatus main body and air in the processing apparatus main body is always exhausted by the exhaust means, even if the processing liquid splashes or floats in the processing apparatus main body. Even if particles are present, they are accompanied by exhaust and discharged out of the system, whereby a clean atmosphere is always maintained in the processing apparatus main body.

  According to the first aspect of the present invention, the substrate introduced into the substrate processing apparatus is first processed by the processing liquid supplied from the liquid recovery type nozzle unit while being transported, and subsequently in the liquid wet state to the liquid draining unit. Since the liquid draining process is performed by the liquid draining unit and the amount of the processing liquid brought to the downstream side along with the wetted substrate can be reduced as much as possible, the longitudinal length of the substrate processing apparatus is conventionally increased. Can be made as short as possible.

  Therefore, despite the adoption of a liquid recovery type nozzle to reduce the size and running cost of the substrate processing equipment, the distance to the next process is increased to minimize the introduction of the processing liquid into the next process. The conventional inconvenience that must be avoided can be eliminated, and the substrate processing apparatus can be made compact, thereby contributing to reduction in apparatus cost and running cost.

  According to the second aspect of the present invention, the substrate is transported along the transport path so that the substrate is processed by a plurality of types of processing liquids by passing through the substrate processing unit of each unit, and the upstream side. Since the amount of the processing liquid of the substrate processing unit accompanying the substrate and brought into the downstream substrate processing unit can be reduced compared to the conventional one, the distance between the substrate processing units is made as short as possible compared to the conventional one. Thus, it becomes possible to process the substrate in one apparatus main body and without partitioning, and the apparatus cost and running cost of the substrate processing apparatus for processing the substrate using a plurality of types of processing liquids can be reduced. Can contribute.

  According to the third aspect of the present invention, the substrate being transported along the transport path is first subjected to the etching process in which the etching solution is supplied in the etching unit, and then the pure water is supplied in the cleaning unit. Since the cleaning process is performed, and finally the drying process is performed by the air flow supplied from the liquid draining unit in the drying unit, a series of etching processes including cleaning and drying are performed by passing each processing unit through the substrate. Can be applied.

  According to the fourth aspect of the present invention, clean air from the air introducing means is always introduced into the processing apparatus main body, and air in the processing apparatus main body is always exhausted by the exhaust means. Even if particles and droplets of processing liquid are floating inside, these particles and droplets are discharged to the outside of the system along with the exhaust, and thus the atmosphere inside the processing device main body can always be kept clean. However, it is possible to reliably prevent inconveniences such as contamination due to a contaminated atmosphere in the processing apparatus main body.

  FIG. 1 is an explanatory view in cross-sectional view showing an embodiment of a substrate processing apparatus according to the present invention, and FIG. 2 is an explanatory view in plan view. In this embodiment, an example of an etching processing apparatus that performs an etching process on a substrate is given as the substrate processing apparatus 10. As shown in FIG. 1, a substrate processing apparatus 10 includes an etching unit 12 that performs an etching process on a substrate B in a processing unit main body 11 that has a rectangular parallelepiped shape, and a substrate B that is derived from the etching unit 12. A cleaning unit 13 that performs a cleaning process on the substrate B and a drying unit 14 that performs a drying process on the substrate B derived from the cleaning unit 13 are provided.

  A substrate carry-in port 15 is opened on the upstream side wall 111 (right side in FIG. 1) of the processing apparatus main body 11, and the substrate carry-out port 16 is located on the downstream side wall 112 at a position facing the substrate carry-in port 15. Is open. Between the substrate carry-in port 15 and the substrate carry-out port 16, a plurality of carry rollers 17 are arranged in parallel at an equal pitch in the substrate carrying direction (the direction toward the left in FIG. 1). A transport path 171 for transporting the substrate B in the processing apparatus main body 11 is formed on the substrate 17. Each transport roller 17 is driven to rotate counterclockwise in FIG. 1 by driving of a drive motor (not shown).

  Therefore, the substrate B introduced from outside the system into the processing apparatus main body 11 through the substrate carry-in port 15 is transported toward the downstream side of the transport path 171 by the driving rotation of each transport roller 17 and is etched by the etching unit 12. After the processing, the cleaning unit 13 performs the cleaning process, and finally the drying unit 14 performs the drying process, and then the substrate is discharged out of the system via the substrate carry-out port 16.

  The cleaning unit 13 includes a first cleaning unit 130 on the upstream side (right side in FIG. 1) and a second cleaning unit 130 ′ adjacent to the first cleaning unit 130 on the downstream side. The first cleaning unit 130 performs a normal cleaning process on the substrate B derived from the etching unit 12, whereas the second cleaning unit 130 ′ performs a further advanced cleaning process on the substrate B. It is something to apply.

  A first hopper 121 is provided at a position below the etching unit 12 in the processing apparatus main body 11, a second hopper 131 is provided at a position below the first cleaning unit 130, and the second cleaning unit 130 ′. A third hopper 132 is provided at a lower position, and a fourth hopper 141 is provided at a lower position of the drying unit 14. Then, after the processing liquid dripped from the substrate B being transported along the transport path 171 is received by the first to fourth hoppers 121, 131, 132, 141, a gas-liquid separator to be described later from the opening at the bottom. 181 is appropriately discharged.

  In addition, in the space above the conveyance path 171 in the etching unit 12 and the cleaning unit 13, no partition wall is provided to partition each unit, whereas at the boundary position between the second cleaning unit 130 ′ and the drying unit 14, An upper partition wall 114 suspended from the top plate 113 of the processing apparatus main body 11 to a position directly above the conveyance path 171 is provided, and water droplets and the like generated in the etching unit 12 and the cleaning unit 13 are dried by the upper partition wall 114. 14 is prevented from entering.

  Further, the length of the second cleaning unit 130 ′ in the substrate transport direction is set to be longer than the length of the first cleaning unit 130. The reason for this is to secure a space for performing a particle formation preventing process by the liquid holding nozzle device 40 described later on the substrate B after the final cleaning process.

  Then, the substrate B introduced into the processing apparatus main body 11 is subjected to an etching process using an etching solution in the etching unit 12, a first-stage cleaning process is performed in the first cleaning unit 130, and a second cleaning unit. After the finishing cleaning process is performed in 130 ′, the drying process is performed on the substrate B that has been cleaned in the drying unit 14.

  For the cleaning process and the like, a pair of liquid recovery type nozzle devices (liquid recovery type nozzles) facing the etching unit 12, the first cleaning unit 130, and the second cleaning unit 130 ′ vertically opposite to each other with the transport path 171 interposed therebetween. Part) 20 and a pair of upper and lower air knives (liquid cutting parts) 30 in the etching part 12 and the first cleaning part 130 with the conveyance path 171 sandwiched immediately downstream of the liquid recovery type nozzle device 20. Are provided. On the other hand, in the second cleaning unit 130 ′, a pair of upper and lower liquid holding nozzle devices 40 are provided in a state where the conveyance path 171 is sandwiched downstream of the liquid recovery nozzle device 20.

  The liquid cleaning nozzle device 40 is provided in the second cleaning unit 130 ′ because the full drying process by the air knife 30 is performed by the drying unit 14, so that the substrate B is dried in the second cleaning unit 130 ′. This is because there is no need to perform a drying process with the air knife 30.

  Further, the air knife 30 is not provided in the second cleaning unit 130 ′ because the substrate B that has been subjected to the final cleaning process by the liquid recovery type nozzle device 20 is naturally in the period until it reaches the drying unit 14. In such a case, the particles may adhere to the front and back surfaces of the substrate B or may have a watermark. A nozzle device 40 is provided. By discharging ultrapure water from the liquid holding nozzle device 40 toward the front and back surfaces of the substrate B, it is possible to prevent particles and watermarks from being generated on the substrate B by the drying process in the drying unit 14. .

  In the vicinity of the substrate processing apparatus 10, a processing liquid supply source 50 for supplying a processing liquid to the liquid recovery type nozzle apparatus 20 and the liquid holding nozzle apparatus 40 is installed. The processing liquid supply source 50 includes an etching liquid supply source 51 that supplies an etching liquid mainly composed of hydrofluoric acid to the liquid recovery nozzle apparatus 20 of the etching unit 12, and a liquid recovery type nozzle apparatus 20 of the first cleaning unit 130. The first cleaning water supply source 52 supplies cleaning water to the second cleaning water supply source 53, and the second cleaning water supply source 53 supplies ultrapure water to the liquid recovery nozzle device 20 of the second cleaning unit 130 '.

  In the drying unit 14, a pair of upper and lower air knives 30 disposed so as to sandwich the conveyance path 171 are provided on the upstream side and the downstream side, respectively. Each of the air knives 30 is disposed obliquely toward the upstream side so that the discharge port faces the transport path 171. An air supply device 60 that supplies the compressed air to the air knife 30 is provided in the vicinity of the apparatus main body 11. The pressurized air from the air supply device 60 is also supplied to the air knife 30 of the etching unit 12 and the cleaning unit 13.

  Then, the substrate B introduced into the drying unit 14 is first drained by the upstream air knife 30 and then sufficiently dried by the downstream air knife 30. Here, by disposing the air knife 30 obliquely, liquid draining and drying are effectively performed. The substrate B that has been dried by the drying unit 14 is discharged out of the system through the substrate carry-out port 16 and is sent to the next step. In addition, the air knife 30 in this drying part 14 does not need to provide the downstream air knife 30, when it can fully dry only with a pair of upper and lower upstream.

  FIG. 3 is a perspective view for explaining the liquid recovery type nozzle device 20, the air knife 30, and the liquid holding nozzle device 40. The liquid recovery type nozzle device 20 and the liquid holding nozzle device 40 are the second cleaning unit 130 ′. In addition, the air knife 30 is shown in a state provided in the drying unit 14 respectively. As shown in FIG. 3, the liquid recovery nozzle device 20 includes an upper nozzle device 201 provided on the upper side of the transport path 171 and a lower nozzle device 202 disposed on the lower side so as to face the upper nozzle device 201. ing.

  As shown in FIG. 4, the liquid recovery type nozzle device 20 includes a pair of upper and lower nozzle bodies 21 having a rectangular parallelepiped shape that is long in the substrate width direction orthogonal to the substrate transport direction (direction orthogonal to the paper surface of FIG. 4). Each of the inlet pipe 22 connected to the downstream end of the nozzle body 21 in the substrate transport direction, the outlet pipe 23 connected to the upstream end of the substrate transport direction, and the pair of upper and lower nozzle bodies 21. A long and narrow liquid inlet 24 that is formed in the opposite surface so as to communicate with the inlet tube 22 and that is elongated in the width direction of the substrate perpendicular to the substrate transport direction, and is arranged opposite to the inlet 24 so as to communicate with the outlet tube 23. The liquid outlet port 25 is provided.

  On the other hand, on the downstream side of the second cleaning water supply source 53, as shown in FIG. 3, a delivery pump 531 for sending the ultrapure water of the second cleaning water supply source 53 is provided. The delivery pump 531 is connected to the introduction pipes 22, and the outlet pipes 23 are connected to a suction pump 532 provided in the vicinity of the processing apparatus main body 11. Therefore, when the ultrapure water from the second cleaning water supply source 53 is introduced into each introduction pipe 22 by driving the delivery pump 531, the ultrapure water is sandwiched between the upper and lower nozzle devices 201 and 202. The liquid lead-out port is supplied between the front and back surfaces of the substrate B and the opposing surfaces of the upper and lower nozzle bodies 21 via the liquid introduction port 24 and does not leak outside through the gap between the substrate B and the nozzle body 21 due to capillary action. It will move in the direction of 25. Then, the ultrapure water that has reached the liquid outlet 25 is sucked through the outlet pipe 23 by the driving of the suction pump 532 and discharged out of the system.

  Further, a plurality of support rollers 26 that support the substrate B are provided on the upper surface side of the lower nozzle body 21, and the substrate B is supported by these support rollers 26, thereby the substrate B and the lower nozzle body. A passage through which ultrapure water passes is formed between the upper surface of 21.

  By adopting such a liquid recovery type nozzle device 20, a reliable cleaning process is realized by supplying the necessary minimum amount of ultrapure water to the substrate B. Therefore, substrate cleaning using expensive ultrapure water is performed. It can contribute to reduction of the running cost of processing.

  As shown in FIG. 3, the air knife 30 has a pentagonal shape in a side view and is elongated in the substrate width direction, and a tapered nozzle portion 32 formed on the front end side of the air knife body 31. An air introduction pipe 33 connected to the proximal end side of the air knife body 31 is provided. An air blowing slit 321 that is long in the substrate width direction is provided at the tip of the nozzle portion 32. Therefore, the pressurized air delivered by driving the air supply device 60 is introduced into the air knife body 31 through the air introduction pipe 33 and then blown toward the substrate B from the air blowing slit 321. The ultrapure water adhering to the front and back surfaces of the substrate B is blown off by the pressurized airflow.

  The air knife 30 is set so as to be inclined with respect to the transport direction of the substrate B. By doing so, the blowing air discharged from the air blowing slit 321 acts as a component force of the pressing force on the cleaning water adhering to the substrate B in the substrate width direction. Compared to the case where the direction is perpendicular to the transport direction, the cleaning water adhering to the substrate B is efficiently removed.

  As shown in FIG. 3, the liquid holding nozzle device 40 is provided between the liquid recovery type nozzle device 20 and the air knife 30 and is provided in a pair of upper and lower sides so as to sandwich the conveyance path 171. 41, an introduction pipe 42 connected to one end of the nozzle pipe 41, and introduced with ultrapure water from the second cleaning water supply source 53 by driving the delivery pump 531, and a substrate B in each nozzle pipe 41. A plurality of nozzle holes 43 drilled at an equal pitch over substantially the entire length in the longitudinal direction are provided on the opposed surfaces.

  Ultrapure water is sprayed on the front and back surfaces of the substrate B from the nozzle holes 43 of the liquid holding nozzle device 40 provided in a pair of upper and lower sides with the transport path 171 interposed therebetween, so that the liquid recovery nozzle device 20 performs the cleaning process. The substrate B is prevented from drying before reaching the air knife 30 and is further subjected to a final cleaning process by the spray water from the liquid holding nozzle device 40. In the state where the drying process is performed, it is possible to reliably prevent the occurrence of inconvenience that particles adhere to the front and back surfaces of the substrate B.

  In the present embodiment, the liquid holding nozzle device 40 is located closer to the liquid recovery type nozzle device 20 than the intermediate position between the liquid recovery type nozzle device 20 and the air knife 30, and as much as possible. It is provided at a position close to the recovery type nozzle device 20. The reason for this is that the liquid recovery type nozzle device 20 has only a minimum amount of ultrapure water coming into contact with the substrate B, so that the amount of adhering water is small. Therefore, the cleaned part of the substrate B is the liquid recovery type. Since natural drying proceeds immediately from the moment when the nozzle device 20 is detached, the liquid holding nozzle device 40 is installed as close to the liquid recovery type nozzle device 20 as possible to avoid this.

  On the other hand, as shown in FIG. 1, a guide tube 18 that guides the derivation of gas-liquid in the processing apparatus main body 11 is provided in the lower part of the first to fourth hoppers 121, 131, 132, 141. Each guide tube 18 has its lower end opened to face the bottom of the processing apparatus body 11, and an exhaust tube 19 is branched in the middle of the guide tube 18. A predetermined gas-liquid separator 181 is provided at a branching position of the guide pipe 18 with respect to the exhaust pipe 19, and the clean air and the processing liquid collected in the guide pipe 18 are separated by the gas-liquid separator 181. The processing liquid is led out from the lower end opening of the guide tube 18 to the bottom of the processing apparatus main body 11, while the used air that has passed through the etching unit 12, the cleaning unit 13, and the drying unit 14 is directed to the exhaust pipe 19. It has become.

  Each exhaust pipe 19 is connected at its downstream end to a central exhaust pipe (exhaust means) 74 disposed in the vicinity of the substrate processing apparatus 10 for sucking exhaust from various places in the factory. Therefore, the spent air in the exhaust pipe 19 separated by the gas-liquid separator 181 is collected in the centralized exhaust pipe 74 and subjected to a predetermined dust collection process by a dust collector (not shown) installed in the factory. Later, it will be discharged out of the system.

  Each exhaust pipe 19 is provided with an adjustment damper 191 for adjusting the amount of suction air. The adjustment damper 191 adjusts the opening degree when the pressurized air is discharged from the air knife 30 in the etching unit 12, the first cleaning unit 130, and the drying unit 14, and when the compressed air is not discharged. Thus, the pressure in the processing apparatus main body 11 can always be set to a preset negative pressure environment.

  That is, when pressurized air is discharged from the air knife 30, this is detected by a predetermined sensor, and this detection signal is input to a control device (not shown), whereby a control signal from the control device is received. The amount of used air sucked into the adjustment damper 191 is increased by increasing the opening of the adjustment damper 191 based on this control signal, and the discharge of pressurized air from the air knife 30 is stopped. Then, this is detected by a predetermined sensor, and the opening degree of the adjustment damper 191 is reduced by a control signal from the control device based on this detection signal, and the amount of suction of used air is reduced. Yes.

  By controlling the opening degree of the adjustment damper 191, the pressures in the etching unit 12, the cleaning unit 13, and the drying unit 14 are always constant regardless of the discharge and stoppage of pressurized air from the air knife 30.

  As described above in detail, the substrate processing apparatus 10 according to the present invention performs predetermined processing on the substrate B being transported in a substantially horizontal posture along the transport path 171, and performs predetermined processing on the substrate B being transported. As a processing liquid supply device for supplying the processing liquid, a liquid recovery type nozzle device 20 configured to recover the supplied processing liquid from the substrate B and the substrate B after the processing liquid is supplied remain on the substrate B. Since the air knife 30 configured to blow off the residual processing liquid on the substrate B by an air flow is disposed in series along the transport path 171 as a processing liquid removing device that removes the processing liquid that is being removed. The substrate B introduced into the processing apparatus 10 is first processed by the processing liquid supplied from the liquid recovery type nozzle apparatus 20 while being transported, and subsequently reaches the air knife 30 in a liquid wet state. As a result, the processing liquid is separated, and the processing liquid is separated at a portion where different types of liquid are used adjacently, such as the etching section 12 and the cleaning section 130, and is brought downstream along with the wet substrate B. The amount of processing liquid can be reduced as much as possible.

  Therefore, despite the adoption of the liquid recovery type nozzle device 20 for downsizing the substrate processing apparatus 10 and reducing the running cost, the distance to the next process is minimized in order to minimize the introduction of the processing liquid into the next process. The conventional inconvenience that must be lengthened is resolved, and the substrate processing apparatus 10 can be reduced in size and contribute to reduction in running cost.

  Further, the liquid recovery nozzle device 20 and the air knife 30 form one unit of substrate processing unit (in this embodiment, the etching unit 12 and the first cleaning unit 130). Arranged in series along the transfer path 171 (in this embodiment, the etching unit 12 and the cleaning unit 13 are arranged in series), and different types of processing liquids are employed in the substrate processing units of each unit. Therefore, in this embodiment, since the etching liquid is used as the processing liquid in the etching unit 12 and the cleaning water is used as the processing liquid in the first cleaning unit 130, the substrate B is transported along the transport path 171. Thus, processing with a plurality of types of processing liquids can be performed by passing through the substrate processing units (etching unit 12 and first cleaning unit 130) of each unit. Moreover, since the liquid recovery type nozzle device 20 is employed as the processing liquid supply device, the amount of the processing liquid in the upstream substrate processing unit accompanying the substrate B is brought into the downstream substrate processing unit compared to the conventional amount. As a result, the distance between the substrate processing units can be made as short as possible compared to the conventional one, and the substrate processing apparatus 10 that processes the substrate B using a plurality of types of processing liquids can be used. It can contribute to reduction of apparatus cost and running cost.

  In the present embodiment, an etching unit 12, a cleaning unit 13 and a drying unit 14 are provided as upstream of the transport path 171 as each substrate processing unit, and the etching unit 12 uses a processing liquid to perform an etching process on the substrate B. In the cleaning unit 13, pure water is used as a processing solution for cleaning the substrate B, and in the drying unit 14, the air knife 30 is used for drying, so that the substrate is transported along the transport path 171. The substrate B being processed is first subjected to an etching process in which an etching solution is supplied in the etching unit 12, then subjected to a cleaning process in which pure water is supplied in the cleaning unit 13, and finally in the drying unit 14 to an air knife. The drying process is performed by the airflow supplied from 30. Therefore, a series of etching processes including cleaning and drying can be performed on the substrate B by passing each of the processing units (the etching unit 12, the cleaning unit 13, and the drying unit 14) through the substrate B.

  Further, the liquid recovery type nozzle device 20 and the air knife 30 have a substrate carry-in port 15 and a substrate carry-out port 16 respectively opened on the upstream side wall 111 and the downstream side wall 112 facing each other. Since the transport path 171 is formed between the outlet 16 and the processing apparatus main body 11, the substrate B introduced into the processing apparatus main body 11 from the substrate carry-in entrance 15 along the transport path 171 is Then, it is sequentially transported to the liquid recovery type nozzle device 20 and the air knife 30 provided in the processing apparatus main body 11, and after being subjected to predetermined processing by each nozzle device, it is discharged out of the system from the substrate carry-out port 16. In addition, the processing apparatus main body 11 is provided with a clean air blower 61 for introducing clean air and a centralized exhaust pipe 74 for exhausting the air in the processing apparatus main body 11. The clean air from the clean air blower 61 is always introduced, and the air in the processing apparatus main body 11 is always exhausted through the central exhaust pipe 74. Therefore, even if there are droplets or floating particles of the processing liquid in the processing apparatus main body 11, they are accompanied by exhaust and discharged out of the system, so that the atmosphere in the processing apparatus main body 11 can always be kept clean. The problem that the substrate B is contaminated due to the contaminated atmosphere in the processing apparatus main body 11 can be reliably prevented.

  The present invention is not limited to the above embodiment, and includes the following contents.

  (1) In the above embodiment, the substrate processing apparatus 10 is exemplified as one that performs the etching process on the substrate B. However, the present invention is limited to the substrate processing apparatus 10 that is used for the etching process. Instead, the entire substrate processing apparatus 10 may be used for cleaning processing. In this case, the etching solution supply source 51 is replaced with a cleaning water treatment source.

  (2) In the above-described embodiment, the liquid holding nozzle device 40 is not provided in the etching unit 12 and the first cleaning unit 130. However, in the present invention, the etching unit 12 and the first cleaning unit 130 are used for liquid holding. The nozzle device 40 is not limited to being provided, and the liquid holding nozzle device 40 may also be provided in these substrate processing units according to the type and situation of the substrate processing. By doing so, since the processing in the etching unit 12 and the first cleaning unit 130 is a two-stage process of the liquid recovery type nozzle device 20 and the liquid holding nozzle device 40, more effective substrate processing is realized. be able to.

  (3) In the above embodiment, after the cleaning process discharged from the liquid recovery type nozzle device 20 in the cleaning process of the substrate B with ultrapure water using the liquid recovery type nozzle device 20 in the second cleaning unit 130 ′. Although the ultrapure water is discharged out of the system, instead of this, the ultrapure water after the cleaning process may be returned to the first cleaning unit 130 for reuse.

  (4) In the above embodiment, the circular nozzle hole 43 for discharging the cleaning water to the liquid holding nozzle device 40 is formed in the nozzle tube 41, but the present invention discharges the cleaning water. The portion is not limited to the circular nozzle hole 43, but may be a square hole, a polygonal hole, a star hole, or the like, or a slit may be employed instead of the hole. A predetermined nozzle member may be attached.

  (6) In the above embodiment, the liquid holding nozzle device 40 in the second cleaning unit 130 ′ is provided at a substantially intermediate position between the liquid recovery type nozzle device 20 and the air knife 30. The liquid holding nozzle device 40 is not limited to being provided at the intermediate position, and the installation position may be set as appropriate based on various conditions relating to substrate processing such as the type of substrate B and operating conditions.

It is explanatory drawing of the cross sectional view which shows one Embodiment of the substrate processing apparatus which concerns on this invention. It is explanatory drawing of planar view of the substrate processing apparatus shown in FIG. It is a perspective view which shows the state by which the liquid collection | recovery type nozzle apparatus, the air knife, and the nozzle apparatus for liquid holding were each provided in the 2nd washing | cleaning part, and the air knife in the drying part. It is sectional drawing of the side view of the liquid collection | recovery type nozzle apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 11 Processing apparatus main body 111 Upstream side wall 112 Downstream side wall 113 Top plate 114 Partition wall 12 Etching part 121 First hopper 13 Cleaning part 130 First cleaning part 130 'Second cleaning part 131 Second hopper 132 Third hopper 14 Drying unit 141 Fourth hopper 15 Substrate carry-in port 16 Substrate carry-out port 17 Transport roller 171 Transport path 18 Guide tube 181 Gas-liquid separator 19 Exhaust tube 191 Adjustment damper 20 Liquid recovery type nozzle device (liquid recovery type nozzle unit)
201 Upper Nozzle Device 202 Lower Nozzle Device 21 Nozzle Body 22 Introducing Pipe 23 Outlet Pipe 24 Liquid Inlet 25 Liquid Outlet 30 Air Knife (Liquid Cutting Section)
31 Air knife body 32 Nozzle portion 321 Air blowing slit 33 Air introduction pipe 40 Liquid holding nozzle device 41 Nozzle pipe 42 Introduction pipe 43 Nozzle hole 50 Treatment liquid supply source 51 Etching liquid supply source 52 First cleaning water supply source 53 Second Washing water supply source 531 Delivery pump 532 Suction pump 60 Air supply device 61 Clean air blower (air introduction means)
74 Central exhaust pipe (exhaust means)
B board

Claims (4)

  A substrate processing apparatus for performing predetermined processing on a substrate being transported in a substantially horizontal posture along a transport path, supplying a processing liquid toward the substrate being transported to perform substrate processing, and processing liquid after processing A liquid recovery type nozzle part for recovering the liquid from the substrate, and a liquid draining part for blowing off the processing liquid on the substrate by blowing air on the downstream side of the substrate transfer path of the liquid recovery type nozzle part in the transfer path. A substrate processing apparatus which is arranged in series along the substrate.   One unit of substrate processing unit is formed by the liquid recovery type nozzle unit and the liquid draining unit, and a plurality of units of substrate processing units are arranged in series along the transport path. 2. The substrate processing apparatus according to claim 1, wherein different types of processing liquids are used.   Each substrate processing unit is provided with an etching unit, a cleaning unit, and a drying unit from the upstream side of the conveyance path, and the etching unit uses an etching solution as a processing solution for performing an etching process on the substrate. The substrate processing apparatus according to claim 2, wherein the unit uses pure water as a processing liquid to clean the substrate, and the drying unit uses the liquid draining unit for drying.   The liquid recovery nozzle unit and the liquid draining unit have a substrate carry-in port and a substrate carry-out port on opposite wall surfaces, and a process in which the transport path is formed between the substrate carry-in port and the substrate carry-out port. 2. An apparatus according to claim 1, further comprising: an air introduction unit that is disposed in the apparatus main body and introduces clean air into the processing apparatus main body; and an exhaust unit that exhausts the air in the processing apparatus main body. Item 4. The substrate processing apparatus according to any one of Items 1 to 3.

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