JP2006013281A - Ceramic package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive ceramic package, hot is harmless to human body and employing a connecting member tender for atmosphere, while not generating faults in external connecting terminals or the connecting members and high in airtight reliability, and to provide its manufacturing method. <P>SOLUTION: The ceramic package 10 is provided with a groove 16, utilizing one of the principal surfaces of a ceramic substrate 11 as the bottom surface of a cavity section 14. External connection terminals 13 are connected via connecting members 15, 15a between the ceramic substrate 11 and a ceramic frame body 12 consisting of the same material as the ceramic substrate 11, so that the upper surface of the tip end is exposed at the side of the cavity section 14. In this case, the connecting members 15, 15a are constituted of V<SB>2</SB>O<SB>5</SB>base unleaded glass or epoxy resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a ceramic package for mounting an electronic component element such as a CCD (Charge Coupled Device) type using a silicon single crystal or a MOS (Metal-Oxide-Silicon) type imaging device, and a manufacturing method thereof.

  In recent years, ceramic packages for housing electronic component elements for CCD-type and MOS-type imaging devices, etc., are equipped with electronic component elements, such as digital cameras, digital video cameras, and mobile phones with digital cameras. In response to demands for miniaturization of telephones, high reliability, low prices, etc., there is an urgent need to respond. In order to cope with this, a ceramic base made of ceramic with high hermetic reliability is used for the package, and glass that can improve the joint reliability for joining with other members attached to the ceramic base. A ceramic package using the above has been developed.

As shown in FIGS. 4A and 4B, a typical conventional ceramic package 50 is exposed on the outer periphery of one main surface of the ceramic substrate 51 so as to be exposed to the inside and the outside of the package. A metal external connection terminal 52 is electrically connected to the electronic component element and electrically connected to the outside on the outside with a bonding material 53 such as glass, and further, if necessary. A frame-shaped ceramic frame body 54 is joined to the top with a joining material 53 such as glass. The ceramic package 50 is formed so as to include a cavity portion 55 for mounting an electronic component element at the center of the package. The ceramic base 51 and the ceramic frame 54 constituting the ceramic package 50 are formed by pressing a granulated powder formed by mixing a binder or the like with a ceramic powder such as alumina (Al ₂ O ₃ ) using a press die. Baked at a high temperature to produce a fired body. The external connection terminal 52 is made of a metal plate having a thermal expansion coefficient similar to that of ceramic, and is formed in a lead frame shape by etching, punching, or the like. Further, the bonding material 53 for bonding the ceramic base 51 or the ceramic frame 54 and the external connection terminal 52 is usually a powdery powder containing lead oxide (PbO) having a low melting point and high solubility, for example, PbO. -B ₂ O ₃ system lead glass is used.

  In the conventional method of manufacturing the ceramic package 50, after bonding material is spread on the ceramic substrate 51, the external connection terminals 52 are placed, and the bonding material is melted to bond the external connection terminals 52 to the ceramic substrate 51. Yes. If necessary, the bonding material is spread on the ceramic base 51 and the ceramic frame 54, and then the external connection terminal 52 is sandwiched between them to melt the bonding material, so that the ceramic base 51, the external connection terminal 52, And the joined body which consists of the ceramic frame 54 is formed. Since lead glass has a low melting point, the melting temperature for bonding is low, and the external connection terminal 52 can be easily bonded with high airtight reliability. Further, in the plating film forming process of the external connection terminal 52 after assembly, since lead glass is excellent in water resistance and acid resistance, there is no problem of deterioration of the glass or airtight reliability.

  However, lead is harmful to the human body, and lead leached out from the waste of electronic equipment using lead glass causes soil pollution and underground pollution, which is also an environmental problem. Measures are urgently needed. Therefore, recently, various lead-free glasses have been developed so that bonding materials for assembling ceramic packages that house electronic component elements can be bonded in accordance with the properties of each member of the assembly.

A ceramic package using lead-free glass is proposed that uses lead-free glass as a bonding material for hermetically sealing the cavity with a lid after the electronic component element is housed in the cavity of the ceramic substrate. (For example, refer to Patent Document 1 and Patent Document 2).
JP 2001-308213 A JP 2003-192378 A

However, the conventional ceramic package and the manufacturing method thereof as described above have the following problems.
(1) Conventional lead-free glass usually has a high melting temperature for bonding. For example, when lead-free glass such as Sn—P ₂ O ₅ or Bi is used, the melting temperature is as high as about 500 ° C. Therefore, in order to use the bonding material to join the ceramic base and the external connection terminal, even if the Ni plating film, the sintering treatment, and the Au plating film are formed on the external connection terminal, the external connection terminal is discolored. In addition, bonding wires are not attached to the external connection terminals in wire bonding with electronic component elements. Further, for example, when lead-free glass such as Sn—P ₂ O ₅ or Bi is melted in a nitrogen atmosphere, the wettability of the glass is poor, resulting in insufficient bonding and making assembly impossible.
(2) Since conventional lead-free glass has low water resistance and acid resistance, after an electronic component element is mounted in the cavity and hermetically sealed with a lid, for example, an example of a plating film on an external connection terminal In the plating process for forming a certain Sn plating film or the like, the deterioration of the glass or the decrease in airtight reliability occurs.
The present invention has been made in view of such circumstances, and is a package using a bonding material that is harmless to the human body and friendly to the environment, and has high hermetic reliability that does not cause defects in the external connection terminals and the bonding material. An object of the present invention is to provide an inexpensive ceramic package and a manufacturing method thereof.

A ceramic package according to the present invention that meets the above-mentioned object has a groove in a shape surrounding one of the main surface of the ceramic substrate as a bottom surface of the cavity portion and surrounding the periphery of the bottom surface. A ceramic package in which an external connection terminal is bonded via a bonding material so that the upper surface of one end is exposed on the cavity side, and the bonding material is a V ₂ O ₅ system It consists of lead-free glass or epoxy resin.
Here, in the ceramic package, it is preferable that the surface of the external connection terminal is provided with the Ni plating film, and then the surface subjected to the sintering process is provided with the Au plating film.

A method for manufacturing a ceramic package according to the present invention that meets the above-described object is a method for manufacturing a ceramic package in which an external connection terminal is bonded with a bonding material between a ceramic base and a ceramic frame made of the same material as the ceramic base. In the method, the lead frame for forming the external connection terminal is composed of a lead terminal portion and a tie bar portion for supporting the lead terminal portion. After forming the Ni plating film on the surface of the lead frame before joining with the joining material, the sintering is performed. A step of applying a treatment and further applying an Au plating film, and the bonding material is made of V ₂ O ₅ lead-free glass. The lead frame is brought into contact with the bonding material fixed to the ceramic substrate and the lead terminal portion is placed on the lead frame. The ceramic frame is brought into contact with a bonding material fixed to the ceramic frame so that the upper surface side of the tip of the ceramic is exposed from the opening of the ceramic frame, and fired in a nitrogen atmosphere to remelt each bonding material. A step of joining the ceramic base body, the lead frame, and the ceramic frame body, and a step of cutting and removing the tie bar portion of the lead frame to form a joined body of the ceramic base body, the external connection terminal, and the ceramic frame body.

  A method for manufacturing a ceramic package according to the present invention that meets the above-described object is a method for manufacturing a ceramic package in which an external connection terminal is bonded with a bonding material between a ceramic base and a ceramic frame made of the same material as the ceramic base. In the method, the lead frame for forming the external connection terminal is composed of a lead terminal portion and a tie bar portion for supporting the lead terminal portion. After forming the Ni plating film on the surface of the lead frame before joining with the joining material, the sintering is performed. A step of applying a treatment and further applying an Au plating film, a bonding material made of an epoxy resin, a step of spreading the bonding material on one main surface of each of the ceramic substrate and the ceramic frame, and spreading on the ceramic substrate A lead frame is brought into contact with the bonding material, and the upper surface side of one end of the lead terminal portion is ceramic on the lead frame. The ceramic frame body is brought into contact with a bonding material fixed to the ceramic frame body so as to be exposed from the opening of the frame frame body, and is heated in an air atmosphere or a nitrogen atmosphere to cure each of the bonding materials. A step of bonding the base body, the lead frame, and the ceramic frame body, and a step of cutting and removing the tie bar portion of the lead frame to form a bonded body of the ceramic base body, the external connection terminal, and the ceramic frame body.

The ceramic package according to claim 1 and claim 2 dependent thereon has one main surface of the ceramic substrate as a bottom surface of the cavity portion and has a groove so as to surround the periphery of the bottom surface. A ceramic package in which an external connection terminal is bonded via a bonding material between a base body and a ceramic frame made of the same material so that the top surface of one tip is exposed on the cavity side. Since it is made of V ₂ O ₅ -based lead-free glass or epoxy resin, the groove can prevent the bonding material from flowing into the cavity part, and the wall surface of the cavity part, which is the mounting part of the electronic component element, can be appropriately heightened. The electronic component element can be stably mounted, and after mounting the electronic component element, the lid is attached to the ceramic frame body with adhesive resin or the like with high airtight reliability. Together so it is possible. In addition, the bonding material is lead-free and harmless to the human body, and is friendly to the environment. In addition, since the bonding material has a low melting temperature and can be bonded at a low temperature, and the oxidation of the external connection terminal can be prevented, discoloration of the external connection terminal and occurrence of bonding wire non-bonding in the wire bond of the external connection terminal occur. Can be prevented. Furthermore, when V ₂ O ₅ -based lead-free glass is used as a bonding material for a ceramic base or a ceramic frame and an external connection terminal, the glass can be melted in a nitrogen atmosphere to prevent oxidation of the external connection terminal. The wettability is good, and even if an Au plating film is formed on the surface of the external connection terminal, it is possible to prevent the occurrence of assembly failure due to insufficient bonding.

  In particular, in the ceramic package according to claim 2, since the Ni plating film is applied to the surface of the external connection terminal and the Au plating film is applied to the surface subjected to the sintering treatment, the bonding material is lead-free glass. In this case, even if the bonding material is low in water resistance and acid resistance, there is no occurrence of discoloration or the like even if the plating treatment is performed before joining, and the plating treatment after joining is not required, and is generated by the plating treatment. It is possible to prevent the deterioration of the glass and the occurrence of deterioration in airtight reliability. In addition, the external connection terminals can be prevented from exuding Ni to Au at a high temperature during bonding by forming the Ni plating film after forming the Ni plating film and then forming the Au plating film. Further, it is possible to prevent the occurrence of oxidation at the time of bonding heating.

According to a third aspect of the present invention, there is provided a method for manufacturing a ceramic package, wherein a lead frame for forming an external connection terminal includes a lead terminal portion and a tie bar portion that supports the lead terminal portion. After forming the Ni plating film, a sintering process is performed, an Au plating film is further applied, and the bonding material is made of V ₂ O ₅ lead-free glass. The lead frame abuts on the bonding material affixed to the ceramic base, and the top surface of one end of the lead terminal portion is the opening of the ceramic frame body. The ceramic frame is brought into contact with the bonding material fixed to the ceramic frame so as to be exposed from the substrate, and fired in a nitrogen atmosphere to remelt each bonding material. A step of joining the ceramic base body, the lead frame, and the ceramic frame body, and a step of cutting and removing the tie bar portion of the lead frame to form a joined body of the ceramic base body, the external connection terminal, and the ceramic frame body. In addition to providing lead-free bonding materials that are harmless to the human body and provide an environmentally friendly manufacturing method, it is possible to provide a sintering method for Ni plating film and bonding by lowering the melting temperature during bonding with V ₂ O ₅ lead-free glass. It is possible to provide a manufacturing method that can prevent diffusion of Ni into Au at a high temperature and prevent discoloration of external connection terminals and non-bonding of bonding wires. Moreover, since V ₂ O ₅ -based lead-free glass can be baked in a nitrogen atmosphere, there is no occurrence of poor glass wettability with the external connection terminal, oxidation of the external connection terminal can be prevented, and oxidation has occurred in the external connection terminal. Since there is no need for post-bonding plating performed in some cases, it is possible to provide a manufacturing method that prevents deterioration of glass and deterioration of hermetic reliability. In addition, the ceramic frame can provide a manufacturing method in which the height of the wall surface of the cavity portion on which the electronic component element is mounted is set to an appropriate height so that the electronic component element can be stably mounted, and after the electronic component element is mounted In addition, it is possible to provide a manufacturing method in which the lid body is bonded to the ceramic frame body with an adhesive resin or the like with airtight reliability.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a ceramic package, wherein a lead frame for forming an external connection terminal is composed of a lead terminal portion and a tie bar portion supporting the lead terminal portion. After forming the Ni plating film, the sintering process is performed, and the Au plating film is further applied, and the bonding material is made of an epoxy resin, and the bonding material is spread on one main surface of each of the ceramic substrate and the ceramic frame. A lead frame is brought into contact with the bonding material spread on the ceramic substrate, and is fixed to the ceramic frame so that the upper surface of one end of the lead terminal portion is exposed from the opening of the ceramic frame on the lead frame The ceramic frame is brought into contact with each other through the bonded material and heated in an air atmosphere or a nitrogen atmosphere to cure each of the bonded materials. A step of joining the base substrate, the lead frame, and the ceramic frame, and a step of cutting and removing the tie bar portion of the lead frame to form a joined body of the ceramic base, the external connection terminal, and the ceramic frame. In addition to providing lead-free bonding materials that are harmless to the human body and providing an environmentally friendly manufacturing method, they are easy-to-handle resin bonding materials that can be heated in either reducing or oxidizing atmospheres and are inexpensive. A method for manufacturing a simple package can be provided. In addition, since the heating temperature is low, oxidation of the external connection terminals can be prevented, and a manufacturing method that does not require plating after bonding, which has been performed when the external connection terminals are oxidized, can be provided. In addition, the ceramic frame can provide a manufacturing method in which the height of the wall surface of the cavity portion on which the electronic component element is mounted is set to an appropriate height so that the electronic component element can be stably mounted, and after the electronic component element is mounted In addition, it is possible to provide a manufacturing method in which the lid body is bonded to the ceramic frame body with an adhesive resin or the like with airtight reliability.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a plan view of a ceramic package according to an embodiment of the present invention, a longitudinal sectional view taken along line AA ′, and FIGS. 2A and 2B are respectively the same. FIGS. 3A and 3B are partial explanatory views of the ceramic package manufacturing method, and FIGS. 3A and 3B are partial explanatory views of the ceramic package manufacturing method, respectively.

1A and 1B, in a ceramic package 10 according to an embodiment of the present invention, an external connection terminal 13 mounts an electronic component element between a ceramic base 11 and a ceramic frame 12. The upper surface of one tip is exposed on the cavity 14 side, which is a portion, and the other tip is projected outside the package, and the joint material 15 joined to the ceramic substrate 11 and the ceramic frame. It is comprised by joining via the joining material 15a. Here, the ceramic substrate 11 is made of alumina (Al ₂ O ₃ ), which is an example of ceramic, aluminum nitride (AlN), or the like, and this granulated powder material is press-molded using a mold to form a molded body. Further, it is fired to form a fired body. At the time of press forming to form the formed body, the groove 16 is formed in a shape surrounding the bottom surface of the cavity portion 14 on the surface side where the bonding material 15 is formed on the ceramic base 11. On the other hand, the ceramic frame body 12 is made of the same material as the ceramic base body 11, is press-molded into a frame shape with the outer dimensions being substantially the same as the ceramic base body 11, and the center portion is cut out, and then fired to form a fired body. is doing. The external connection terminal 13 is made of a metal plate having a thermal expansion coefficient approximate to that of ceramic such as KV (Fe—Ni—Co alloy, trade name “Kovar”) or 42 alloy (Fe—Ni alloy). It is formed by etching, punching or the like.

Bonding materials 15 and 15a are respectively provided on the surfaces of the ceramic base body 11 and the ceramic frame body 12 between which the external connection terminals 13 are sandwiched. The bonding materials 15 and 15a are bonded to each other without containing lead. V ₂ O ₅ -based lead-free glass having a low melting point with a low melting temperature and capable of firing in a nitrogen atmosphere is used. The V ₂ O ₅ lead-free glass is spread on the surfaces of the ceramic substrate 11 and the ceramic frame 12 by screen printing or the like, and is fixed by firing. Alternatively, the bonding materials 15 and 15a are made of an epoxy resin that does not contain lead and can be heated in a nitrogen atmosphere or an air atmosphere at a low melting point with a low melting temperature during bonding. The epoxy resin is spread on the surfaces of the ceramic substrate 11 and the ceramic frame 12 by screen printing or the like.

The ceramic package 10 is made of a V ₂ O ₅ lead-free glass or a ceramic base body 11 and a ceramic frame body 12 which are fixed when the epoxy resin bonding materials 15 and 15a are glass, or spread when the resin is a resin. In between, the external connection terminal 13 is sandwiched and heated to re-melt the bonding materials 15 and 15a in the case of glass, or to be cured and bonded in the case of resin, and to the inner peripheral wall surface of the ceramic frame 12 The cavity base 14 is formed with the ceramic substrate 11.

When the bonding materials 15 and 15a are V ₂ O ₅ lead-free glass, the ceramic package 10 has a melting temperature of about 400 ° C., and a normal lead-free glass such as Sn—P ₂ O ₅ or Bi It is lower than about 500 ° C. of lead-free glass or the like, and discoloration or oxidation due to heating of the external connection terminal 13 can be suppressed. Further, it is not necessary to form a Su plating film or the like after bonding, and no plating treatment is required even if the bonding materials 15 and 15a have low water resistance and low acid resistance. It is possible to prevent a decrease in the airtight reliability of the part. Furthermore, when the bonding materials 15 and 15a are epoxy resin, the ceramic package 10 has a low heating temperature for bonding, and can prevent discoloration or oxidation due to heating of the external connection terminal 13, It is not necessary to form a Su plating film or the like after bonding, and it is possible to prevent the deterioration of the bonding materials 15 and 15a and the decrease in the airtight reliability of the bonded portion.

  For the external connection terminal 13 made of a metal plate such as KV or 42 alloy, after forming a Ni plating film on the surface of the metal plate, the Ni plating film is sintered at a temperature of about 1000 ° C. in a reducing atmosphere, for example. Thereafter, an Au plating film is preferably formed on the Ni plating film. Due to the sintering treatment of the Ni plating film, even if there is bonding heating of the bonding materials 15 and 15a on the surface of the external connection terminal 13, diffusion of Ni into Au can be prevented. Since the occurrence of non-bonding of the bonding wire to the external connection terminal 13 can be prevented, it is not necessary to form a Su plating film or the like after bonding. Therefore, the ceramic package 10 has no plating treatment even if the water resistance and acid resistance of the bonding materials 15 and 15a are low, so that the deterioration of the bonding materials 15 and 15a and the decrease in the airtight reliability of the bonding portion can be prevented. Can do.

Next, a method for manufacturing the ceramic package 10 according to an embodiment of the present invention will be described with reference to FIGS. 2 (A), 2 (B), 3 (A), and 3 (B).
As shown in FIG. 2A, the ceramic substrate 11 used in the method for manufacturing the ceramic package 10 according to the embodiment of the present invention is a mixture of ceramic powder such as Al ₂ O ₃ and a binder, for example. The granulated powder raw material produced by drying the aqueous solution with a spray dryer is press-molded into a substantially rectangular shape of a desired size using a press die comprising an upper die, a lower die, and a die. It is manufactured by forming a molded body and further firing it at a high temperature of about 1550 ° C. in a firing furnace to form a fired body. The ceramic base 11 is press-formed into a desired shape, and at the same time, a frame-like groove 16 made of a recess having a width of about 0.5 mm and a depth of about 0.5 mm is formed on one main surface of the ceramic base 11. The inner side surrounded by the groove 16 serves as the bottom surface of the cavity portion 14 for mounting the electronic component element. In addition, the ceramic base 11 is press-formed into a desired shape, and at the same time, a notch 17 is provided at each intermediate portion of two opposing sides of the rectangular shape (two sides in the short side direction in FIG. 2A). ing.

  On the other hand, the ceramic frame body 12 used in the method for manufacturing the ceramic package 10 according to the embodiment of the present invention is press-molded using the same granulated powder raw material as that for producing the ceramic substrate 11, and the outer dimensions are set. After being press-molded into a frame shape in which the central portion is hollowed out in substantially the same manner as the ceramic substrate 11, the ceramic substrate 11 is further fired in a firing furnace in the same manner as the ceramic substrate 11 to produce a fired body. The ceramic frame body 12 is also provided with a cutout portion 17a having the same shape at substantially the same position as the ceramic base body 11. Further, the size of the cutout width between the long sides of the ceramic frame 12 is formed to be slightly larger than the width between the long sides of the grooves 16 provided in the ceramic base 11.

Then, a bonding material 15 made of a glass paste of V ₂ O ₅ lead-free glass is spread on the surface of the outer portion from the groove 16 formed on one main surface of the ceramic substrate 11 by screen printing or the like and dried. Then, it is fixed by firing at a temperature of about 400 ° C. or lower. Further, on one main surface of the frame shape of the ceramic frame 12, a bonding material 15 a made of a glass paste of V ₂ O ₅ lead-free glass is spread by screen printing or the like and dried, and then about 400 ° C. or less. It is fixed by firing at a temperature.

  Next, as shown in FIG. 2B, the lead frame 18 for forming the external connection terminals 13 has a thermal expansion coefficient that is the same as that of the ceramic substrate 11 such as KV or 42 alloy, or the ceramic of the ceramic frame 12. This metal plate is made of an approximate metal plate, and this metal plate is processed by etching or punching to open one end of the plurality of lead terminal portions 19 on the inner peripheral side and the other end of the lead terminal portion 19 on the outer peripheral side. It is formed in a desired shape so as to be connected to the tie bar portion 20 supported by. The lead frame 18 is formed with a Ni plating film made of Ni plating, Ni alloy plating, or the like. The lead frame 18 on which the Ni plating film is formed is sintered at a temperature of about 1000 ° C. in a reducing atmosphere. Further, an Au plating film is formed on the lead frame 18 subjected to the sintering process. The lead frame 18 is subjected to sintering after forming the Ni plating film to form an Au plating film, thereby preventing Ni diffusion to Au even if the lead frame 18 is heated after the Au plating film is formed. Can do. The lead frame 18 is positioned so as to be exposed to the notches 17 and 17a of the ceramic base 11 and the ceramic frame 12 when the lead frame 18 is overlapped with the ceramic base 11 and the ceramic frame 12. A portion 21 is provided.

  Next, the ceramic substrate 11 to which the bonding material 15 is fixed is placed on a bonding alignment jig (not shown) that can be inserted by fitting with the outer dimensions of the ceramic substrate 11 with the bonding material 15 side facing up. Placed. As shown in FIG. 3A, the lead frame 18 is formed on the upper surface of the bonding material 15 fixed to the ceramic substrate 11, through holes or notches provided in the alignment portion 21 of the lead frame 18. Are brought into contact with each other through a guide pin provided in a bonding alignment jig. Further, the ceramic frame 12 is bonded to the upper surface of the lead frame 18 and fixed to the ceramic frame 12 so that the upper surface side of one end of the lead terminal portion 19 is exposed from the opening of the ceramic frame 12. It contacts through the material 15a. The laminated body in which the ceramic base 11, the lead frame 18, and the ceramic frame 12 are superposed is fired in a nitrogen atmosphere to remelt and bond the bonding materials 15 and 15a.

  Next, as shown in FIG. 3B, the joined body of the ceramic base 11, the lead frame 18, and the ceramic frame 12 is removed by cutting the tie bar portion 20 from the lead frame 18 with a cutting line 22. A joined body of the ceramic base 11, the external connection terminal 13, and the ceramic frame 12 is formed.

  Next, another method for manufacturing the ceramic package 10 according to the embodiment of the present invention will be described. Basically, it is manufactured in the same manner as the method for manufacturing the ceramic package 10 described above, except that an epoxy resin is used for the bonding materials 15 and 15a. The epoxy resin bonding materials 15 and 15a are formed by laminating the ceramic substrate 11, the lead frame 18, and the ceramic frame 12 in a state of being spread on the ceramic substrate 11 and the ceramic frame 12 by screen printing or the like. The The laminated body is heated in an air atmosphere or a nitrogen atmosphere to cure the epoxy resin bonding materials 15 and 15a, thereby bonding the ceramic base 11, the lead frame 18, and the ceramic frame 12. Yes. Further, as in the case described above, the joined body is formed by cutting the tie bar portion 20 from the lead frame 18 with the cutting line 22 and removing it, thereby joining the ceramic base body 11, the external connection terminal 13, and the ceramic frame body 12. Is forming.

  The ceramic package and the manufacturing method thereof according to the present invention are not only a ceramic package for mounting an electronic component element for an imaging device and a manufacturing method thereof, but also a normal high demand for downsizing, high reliability, low price, etc. It can be used as a ceramic package for mounting an electronic component element and a manufacturing method thereof.

(A), (B) is a top view of the ceramic package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view. (A), (B) is a partial explanatory drawing of the manufacturing method of the ceramic package, respectively. (A), (B) is a partial explanatory drawing of the manufacturing method of the ceramic package, respectively. (A), (B) is the top view of the conventional ceramic package, respectively, and the B-B 'line longitudinal cross-sectional view.

Explanation of symbols

  10: Ceramic package, 11: Ceramic substrate, 12: Ceramic frame, 13: External connection terminal, 14: Cavity, 15, 15a: Bonding material, 16: Groove, 17: Notch, 18: Lead frame, 19 : Lead terminal part, 20: Tie bar part, 21: Positioning part, 22: Cutting line

Claims (4)

One main surface of the ceramic substrate is the bottom surface of the cavity part, and has a groove in a shape surrounding the periphery of the bottom surface, between the ceramic substrate and the ceramic frame made of the same material as the ceramic substrate, A ceramic package joined via a joining material so that the external connection terminal exposes the top surface of one tip on the cavity part side,
The ceramic package, wherein the bonding material is made of V ₂ O ₅ lead-free glass or epoxy resin.   2. The ceramic package according to claim 1, wherein a surface of the external connection terminal is coated with a Ni plating film, and then a surface subjected to sintering is coated with an Au plating film. In a method for manufacturing a ceramic package, in which external connection terminals are each joined by a joining material between a ceramic base and a ceramic frame made of the same material as the ceramic base,
The lead frame for forming the external connection terminal comprises a lead terminal portion and a tie bar portion that supports the lead terminal portion, and after forming a Ni plating film on the surface of the lead frame before joining with the joining material, Applying sinter treatment and further applying Au plating film;
The bonding material is made of V ₂ O ₅ based lead-free glass, the bonding material is spread on one main surface of each of the ceramic base body and the ceramic frame, and fired and fixed;
The lead frame abuts on the bonding material fixed to the ceramic base, and the upper surface of one end of the lead terminal portion is exposed on the lead frame from the opening of the ceramic frame. The ceramic frame is brought into contact with the bonding material fixed to the body, fired in a nitrogen atmosphere to remelt the bonding materials, and the ceramic base, the lead frame, and the ceramic frame are bonded. And a process of
A method of manufacturing a ceramic package, comprising: cutting and removing the tie bar portion of the lead frame to form a joined body of the ceramic base body, the external connection terminal, and the ceramic frame body. In a method for manufacturing a ceramic package, in which external connection terminals are each joined by a joining material between a ceramic base and a ceramic frame made of the same material as the ceramic base,
The lead frame for forming the external connection terminal comprises a lead terminal portion and a tie bar portion that supports the lead terminal portion, and after forming a Ni plating film on the surface of the lead frame before joining with the joining material, Applying sinter treatment and further applying Au plating film;
The bonding material is made of an epoxy resin, and the bonding material is spread on one main surface of each of the ceramic base and the ceramic frame; and
The lead frame is brought into contact with the bonding material spread on the ceramic base, and the top surface of one end portion of the lead terminal portion is exposed from the opening of the ceramic frame body on the lead frame. The ceramic frame body is brought into contact with the bonding material fixed to the frame body, and the bonding material is cured by heating in an air atmosphere or a nitrogen atmosphere. The ceramic base body, the lead frame, and the ceramic Joining the frame,
A method of manufacturing a ceramic package, comprising: cutting and removing the tie bar portion of the lead frame to form a joined body of the ceramic base body, the external connection terminal, and the ceramic frame body.

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