JP2006013117A - Inductor structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inductor structure which is small, has a simple structure, is easy to manufacture, can use an existing manufacturing facility as it is, and is suppressed at a low manufacturing cost.
In an inductor structure including a substrate in which at least one inductor is embedded, the substrate is a multilayer substrate composed of a laminate of a plurality of base layers, and penetrates the base layer and / or the multilayer substrate. In this case, the inductor is formed by selectively removing a conductor layer formed on an inner wall of a through hole formed through the base layer and / or the multilayer substrate. It comprises so that it may consist of a coil-shaped conductor pattern.
[Selection] Figure 1

Description

  The present invention relates to an inductor, and more particularly to an inductor structure including a substrate having at least one inductor embedded therein. The inductor structure of the present invention is small in size, easy to manufacture, and has a high degree of freedom in design change. Therefore, it is advantageous for manufacturing various devices such as multilayer wiring boards, semiconductor devices, and transformers (transformers). Can be used.

  At present, as is well known, there are a wide variety of semiconductor devices, and there are various methods for mounting elements necessary for completion of the semiconductor device on a substrate such as a printed circuit board. Here, printed circuit boards and the like have been downsized in recent years, and when manufacturing a semiconductor device or mounting a semiconductor device or the like, an active element such as a semiconductor element (for example, an IC chip, an LSI chip, etc.) or a capacitor, for example, It is important how to efficiently arrange passive elements such as resistors and inductors on the printed circuit board, in other words, how to effectively use the board space. Typically, a mounting technique is employed in which a printed circuit board is a multilayer board, and capacitors, resistors, inductors, and the like, which are passive elements, are embedded therein.

  For example, a build-up multilayer substrate provided with a pattern coil is known (Patent Document 1). As shown in FIG. 14, in the case of this build-up multilayer substrate 101, C-shaped coil patterns 102a to 102d are formed on the surfaces of the respective layers 101a, 101b and 101c, and the coil patterns are formed by the build-up vias 103a to 103c. 102a to 102d are connected to form a spiral coil as a whole, and thus a desired reactance value can be obtained in the substrate pattern. However, in the case of this build-up multilayer substrate, it is difficult to accurately align the patterns because the coil pattern must be formed in the formation of each layer and the coil patterns must be connected by the build-up via. The manufacturing process is also very complicated. In addition, when an inductor is formed on a multilayer substrate, the inductance obtained depends on the number of layers of each layer of the multilayer substrate, so that the manufacturing cost increases as the substrate is multilayered.

  It has also been proposed to reduce the size of the printed circuit board by forming a coil structure on the surface of the printed circuit board in the conventional method inside the substrate (through hole) (Patent Document 2). In this coil structure, wiring patterns 203 and 202 are respectively formed on both front and back surfaces of an insulating substrate 201 having a through hole 201a shown in FIG. In addition, a spiral thread 201b is formed on the inner wall of the through hole 201a, and a spiral coil 204 made of a conductive film is formed on the top. Further, conductors 205 and 206 are connected to both ends of the coil 204, and the printed circuit board P is completed. However, in the case of this coil structure, the purpose is to simply reduce the size of the printed circuit board used in the mobile phone, so the present invention is to solve the formation of the inductor in the multilayer substrate and the design in the inductor. It does not teach at all about expanding the degree of freedom of change, voluntary control of inductance, the availability of existing manufacturing equipment, and diversification of application fields.

JP 2001-77538 A (Claims, FIG. 1) JP 2001-85228 A (Claims, FIG. 1)

  An object of the present invention is to solve the above-described problems in a multilayer substrate including an inductor.

  Therefore, an object of the present invention is to effectively use the board space, is small, has a simple configuration, is easy to manufacture, can use existing manufacturing equipment as it is, and has a manufacturing cost. Another object of the present invention is to provide an inductor structure that is held down at a low level.

  Another object of the present invention is to provide an inductor structure capable of forming an inductor on a multilayer substrate and extending the degree of freedom of design change and arbitrarily controlling the inductance of the inductor. .

  Furthermore, an object of the present invention is to expand and diversify the field of utilization of the inductor structure by making use of the above-described features of the inductor structure.

  These and other objects of the present invention will be readily understood from the following detailed description.

According to the present invention, the above-mentioned object is an inductor structure including a substrate in which at least one inductor is embedded, wherein the substrate is a multilayer substrate made of a laminate of a plurality of base layers, An inductor is formed through the base layer and / or the multilayer substrate, wherein the inductor is
(1) It consists of a coiled conductor pattern formed by selectively removing a conductor layer formed on the inner wall of a through hole formed through the base layer and / or the multilayer substrate, or (2) It is achieved by an inductor structure comprising a conductor coil wound in a predetermined pattern on an outer peripheral surface of a rod-like insulator screwed into an inductor forming portion of the base layer and / or the multilayer substrate. Can do.

  According to a preferred aspect of the present invention, a coiled conductor pattern constituting an inductor is passed through a thread cutting tool having a thread, a number of threads and a pitch corresponding to the conductor pattern, for example, a tapping screw. It can be formed by screwing into the hole and threading until the inner wall of the through hole is partially exposed from the surface of the conductor layer.

  According to another preferred embodiment, a threading tool such as a tapping screw is used as the rod-shaped insulator, and a conductor coil such as a metal wire is wound around the thread groove of the threading tool. An inductor derived from the conductor coil can be formed.

  As will be understood from the following detailed description, according to the present invention, in manufacturing the inductor structure, the board space can be effectively utilized, so that the structure can be miniaturized. In addition, this inductor structure has a simple configuration, is easy to manufacture, and can reduce the manufacturing cost.

  Furthermore, according to the present invention, since a special processing step is not required for manufacturing the inductor structure, the target inductor structure can be manufactured using the existing manufacturing equipment as it is. The ability to produce an embedded inductor structure without significant changes in the process of manufacturing the substrate is an effect that can be noticed by those skilled in the art.

  Further, according to the present invention, an inductor can be formed on a multilayer substrate, and the inductor is formed in the form of a coiled conductor pattern on the inner wall of the through hole, or in the form of a conductor coil embedded in a predetermined portion. Since the inductor can be formed, it is possible to expand the degree of freedom of design change and to arbitrarily control the inductance of the inductor. For example, when forming an inductor from a coiled conductor pattern, the inductance is flexibly changed by adjusting the hole diameter of the through hole, the number of turns of the cutting blade of the thread cutting tool, the pitch, etc., and an optimized inductance is provided. An inductor structure can be provided. Further, when an inductor is formed from a conductor coil, an inductor structure with an optimized inductance can be provided by adjusting the number of turns of the conductor coil, the pitch, and the like, thereby flexibly changing the inductance.

  Furthermore, according to the present invention, the field of use of the inductor structure can be expanded and diversified by taking advantage of the above-described characteristics of the inductor structure. For example, the inductor structure of the present invention can be advantageously used for manufacturing various devices such as a multilayer wiring board, a semiconductor device, and a transformer.

  The inductor structure according to the present invention can be advantageously implemented in various forms. DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the following form.

  An inductor structure according to the present invention includes a substrate and at least one inductor fabricated within the substrate. Here, the “inductor” has a structure in which a conductor is wound in a coil shape (concentric cylindrical shape), and is completed by connecting both ends of the conductor to terminals provided on the front surface and the back surface of the substrate, respectively. be able to. In the case of the present invention, the inductor is formed so as to be embedded in the inside of the substrate. In particular, as described in detail below, the through-hole (via, through-hole) formed through the inside of the substrate is formed. Etc.) is used for forming the inductor. That is, the inductor forming conductor is preferably a coiled conductor pattern formed on the inner wall of the through hole, or otherwise contacts the inner wall of the through hole on the outer peripheral surface of the rod fitted in the through hole. Thus, the conductor coil is wound.

  The substrate is a multilayer substrate composed of a laminate of a plurality of base layers in order to sufficiently bring out the effects of the inductor structure of the present invention. In this multilayer substrate, the through hole may penetrate only the base layer or may penetrate the entire multilayer substrate. The multilayer substrate, which is a base layer and a laminate thereof, can be formed from various conductive and / or insulative materials generally employed for multilayer substrates. For example, a conductive material suitable for forming the base layer is a conductive metal such as copper, gold, or silver. The conductive base layer may be formed by plating, coating, printing, or the like, or may be formed by sticking a foil or a film. Insulating materials suitable for the formation of the base layer are insulating plastic materials, such as ceramic materials such as epoxy resins and polyimide resins, and others. The insulating base layer may be formed by plating, coating, printing, or the like, or may be formed by sticking a foil or a film.

  In a multilayer substrate, the base layer may be formed by stacking a required number of base layers having the same or similar properties (conductive or insulating), or the conductive base layer and the insulating base layer may be alternately arranged. It may be laminated. Although the multilayer substrate can be formed by laminating any number of base layers, the number of base layers is usually in the range of about 4 to 10 layers. In the attached drawings, a multilayer substrate in which three base layers are stacked is shown for simplicity of explanation.

  The multilayer substrate can additionally have various functional elements and other elements (hereinafter also referred to as “components”) on the front surface, back surface, or inside depending on the desired configuration of the inductor structure. .

  For example, the multilayer substrate can have a wiring pattern (also referred to as “wiring”, “wiring layer”, or the like) at an arbitrary position. That is, the multilayer substrate is preferably a multilayer wiring substrate. The wiring pattern can be formed on the front surface, the back surface, or the inside (for example, the base layer) of the multilayer substrate by a subtractive method or an additive method. In addition, as a method for forming a wiring pattern, conventional techniques such as a photolithography method, a transfer method, a mask printing method, and a pattern plating method can be used. Furthermore, through-hole plating or IVH (non-through via hole) Thus, the wiring patterns can be electrically connected between the layers. A suitable material for forming the wiring pattern is a conductive metal such as copper, aluminum, gold, or silver (or an alloy if necessary).

  The multilayer substrate can have any functional element on the front surface, the back surface, or the inside of the multilayer substrate. Here, the “functional element” means an active element such as a semiconductor element (for example, an IC chip, a VLSI chip, etc.), a passive element such as a capacitor or a register, and other elements, and is limited to a specific element. It is not something. These functional elements may be used alone or in combination of two or more.

  Furthermore, the multilayer substrate can have arbitrary components on the front surface, the back surface, or the inside of the multilayer substrate. Here, the “component” means any layer, film, component or the like that is essential for manufacturing the inductor structure or used as desired, for example, a circuit component such as an electrode, an external connection terminal, or the like. .

  In the inductor structure of the present invention, the inductor can be constituted by a coiled conductor pattern formed by selectively removing the conductor layer formed on the inner wall of the through hole on one surface. FIG. 1 is a cross-sectional view showing a preferred embodiment of an inductor structure according to the present invention configured as described above, and FIG. 2 shows an example of a threading tool used for manufacturing the inductor structure of FIG. FIG. 3 is a cross-sectional view sequentially illustrating a method of manufacturing the inductor structure of FIG. In the figure, copper plating is used to form the conductor layer. However, if necessary, other conductor metals may be used, and a thin film may be formed by a method other than plating.

  Referring to FIG. 1, a multilayer substrate 1 includes three base layers 1-1, 1-2, and 1-3. These base layers can be integrated using a laminating method generally used for the production of multilayer substrates. On the surface of the multilayer substrate 1, there is an upper wiring pattern 11 formed by patterning of copper plating, and the end thereof is electrically connected to the land 13. On the other hand, the lower surface of the multilayer substrate 1 has a lower wiring pattern 12 formed by copper plating patterning, and the end thereof is electrically connected to the land 13.

  The multilayer substrate 1 has a through hole 3 penetrating therethrough. The through hole 3 can be formed using mechanical drilling, laser drilling, or the like according to the material of the multilayer substrate, the hole diameter and shape of the through hole. The inner wall of the through hole 3 is provided with a coiled conductor pattern 2 formed by selectively removing a conductor layer made of copper plating, as shown. Since the conductor pattern 2 has a strip shape and extends in an inner wall of the through hole 3 in a spiral shape, the underlying multilayer substrate 1 is exposed at the cut 2 a of the conductor pattern 2. The coiled conductor pattern 2 is electrically connected to the lands 13 provided on the front and back surfaces of the multilayer substrate 1 to complete the inductor.

  The coiled conductor pattern can be formed in the through hole 3 having a conductor layer made of copper plating on the inner wall by using various cutting tools. Screws, taps, threading dies and the like can be used advantageously. In particular, a tapping screw 4 as shown in FIG. 2 is useful in the practice of the present invention. As shown in the figure, the tapping screw 4 has a thread 5 that can act as a cutting blade on its outer peripheral surface, and a cut 2a (see FIG. 1) of the conductor pattern 2 at the top 5a of each thread. It is possible to form. That is, the coiled conductor pattern has a thread cutting tool having a thread, the number of threads and a pitch corresponding to the conductor pattern, preferably a tapping screw inserted into the through hole, and the inner wall of the multilayer substrate is partially Can be advantageously formed by threading until exposed.

  The inductor structure 10 shown in FIG. 1 can be advantageously manufactured using the tapping screw 4 of FIG. 2, for example, as shown in order in FIG.

  First, as shown in FIG. 3A, a through hole 3 is opened at a predetermined position of a multilayer substrate 1 prepared in advance. As the opening means, for example, laser processing can be used.

  Next, the conductor layer 2 is formed on the inner wall of the through hole 3 by copper plating. Simultaneously with the copper plating, an upper wiring pattern 11 and a lower wiring pattern 12 are also formed. Note that the upper wiring pattern 11 and the lower wiring pattern 12 may be formed by performing copper plating under masking of unnecessary portions, or otherwise, unnecessary portions may be removed by etching or the like after the copper plating is formed. Also good. According to another method, the upper wiring pattern 11 and the lower wiring pattern 12 may be formed by bonding unnecessary portions by etching or the like after bonding a copper foil to the formation site.

  After the conductor layer 2 is formed on the inner wall of the through hole 3 by copper plating, the tapping screw 4 of FIG. 2 is screwed so as to penetrate the through hole 3 as shown in FIG. The tapping screw 4 preferably has an outer diameter slightly larger than the hole diameter of the through hole 3. As the tapping screw 4 advances in the direction of the arrow, the conductor layer 2 and the underlying multilayer substrate 1 are spirally removed by the cutting blade, and the cutting powder of the conductor layer 2 and the multilayer substrate 1 is discharged to the outside of the through hole 3. It will be done. The remaining conductor layer 2 becomes a coil shape, thereby completing the inductor. Here, the inductance, which is a characteristic value of the inductor, depends on the hole diameter of the through hole, the number of turns and the pitch (interval) of the cutting blade of the tapping screw, and can be flexibly changed regardless of the configuration of the substrate. Become.

  FIG. 3C shows a state after the tapping screw 4 has finished penetrating the through hole 3 of the multilayer substrate 1. Subsequently, the tapping screw 4 is pulled out from the multilayer substrate 1. By manufacturing the inductor structure according to the procedure as described above, an inductor independent of the number of layers of the multilayer substrate can be formed.

  In the inductor structure of the present invention, the inductor is constituted by a conductor coil wound in a predetermined pattern on the outer peripheral surface of the rod-like insulator screwed into the inductor formation portion of the multilayer board on another surface. Can do. FIG. 4 is a cross-sectional view showing a preferred embodiment of the inductor structure according to the present invention configured as described above, and FIG. 5 shows an example of a threading tool used for manufacturing the inductor structure of FIG. FIG. 6 is an explanatory view of a multilayer substrate used for manufacturing the inductor structure of FIG. 4, and FIG. 7 is a step in the method of manufacturing the inductor structure of FIG. It is sectional drawing which showed.

  Referring to FIG. 4, the inductor structure 10 includes a multilayer substrate 1. As will be described in detail with reference to FIG. 6, the multilayer substrate 1 includes three base layers 1-1, 1-2, and 1-3. These base layers can be integrated using a laminating method generally used for the production of multilayer substrates. On the upper surface of the base layer 1-1 of the multilayer substrate 1, there is an upper wiring pattern 11 formed by patterning of copper foil, as shown in FIG. 6B, and a land 11a is formed at the inductor formation site. Yes. On the other hand, on the lower surface of the base layer 1-3 of the multilayer substrate 1, as shown in FIG. 6C, there is a lower wiring pattern 12 formed by patterning of a copper foil, and a land 12a is formed at the inductor forming portion. Has been.

  In the case of the illustrated inductor structure 10, as shown in FIG. 7, a rod-shaped inductor 6 (FIG. 5) having a conductor coil 7 wound around the outer peripheral surface in a predetermined pattern at the inductor forming portion of the multilayer substrate 1. Inductors are completed by screwing in). As illustrated, one end of the conductor coil 7 is electrically connected to the land 11a, while the other end is electrically connected to the land 12a. After mounting the inductor in this manner, the upper wiring pattern 11 is covered with the copper plating 14, while the lower wiring pattern 12 is covered with the copper plating 15.

  Here, the rod-shaped inductor used for forming the inductor is shown in FIG. 5 as an example, but may have other configurations. Typically, the rod-shaped inductor is preferably a threading tool, for example, a tapping screw, and a conductor coil is preferably wound around a thread groove portion of the threading tool. The conductor coil can be formed from various materials, but is preferably formed from a metal wire such as a copper wire in consideration of conductivity, workability, strength, and the like. According to the present invention, the inductance obtained can be changed flexibly by changing the material and the number of turns of the conductor coil.

  The inductor structure according to the present invention can produce a high-performance and useful device by arbitrarily combining it with functional elements and components. For example, a transformer can be manufactured by forming two through holes in a multilayer substrate and arranging an annular conductor core through the through holes.

  For example, FIG. 8 is a cross-sectional view showing a preferred example of a transformer incorporating the inductor structure of the present invention. Although there is a difference that the transformer 30 is formed with two through holes, each of the transformers 30 is formed after forming an inductor structure having a configuration as illustrated by the method described with reference to FIGS. The annular conductor core 31 is disposed so as to penetrate the through hole, and the end thereof is connected to the lands 11 a and 11 b made of copper plating provided on the multilayer substrate 1. In the case of the illustrated example, an ordinary iron core is used as the conductor core 31 in the transformer.

  In the illustrated transformer, although the iron core is used as the conductor core 31, the material of the conductor core can be changed according to the desired inductance, which is one of the features of the present invention. That is, the conductor core is arranged for the purpose of increasing the inductance, but if a core material with high permeability is used, a large inductance can be obtained with a small number of windings, but at a high frequency, the loss increases. As a result, the temperature coefficient also increases. Therefore, it is necessary to select the core material in consideration of the operating frequency. In other words, since the inductance can be changed by the core material, according to the present invention, the inductance can be adjusted by changing the material of the core material without changing the shape of the inductor (coil). . Examples of the core material that can be used for adjusting the inductance include silicon steel plates, metal alloys such as permalloy, ferrite, and dust core. Further, instead of these core materials, nonmagnetic materials made of organic materials, ceramics, or the like may be used.

  In addition, the inductor structure of the present invention can be combined with an active element, a passive element, or the like to manufacture a semiconductor device or other electronic device.

  For example, FIG. 9 is a cross-sectional view showing a preferred example of a semiconductor device incorporating the inductor structure of the present invention. The semiconductor device 20 includes a multilayer wiring board 1 composed of three base layers 1-1, 1-2, and 1-3. The base layer 1-1 has a wiring pattern 21 on its upper surface, the base layer 1-2 has a conductor pattern 22 on its upper surface, and the base layer 1-3 has a wiring pattern 23 on its upper surface. A wiring pattern 24 is provided on the lower surface. As shown in the figure, an inductor formed by embedding a rod-shaped inductor 6 with a conductor coil 7 as shown in FIG. 5 is formed in the base layer 1-2. Therefore, in the illustrated semiconductor device 20, the wiring pattern 21 reaches the wiring pattern 22 via the via 28, the wiring pattern 22 reaches the wiring pattern 23 via the inductor, and further, the wiring pattern 23 passes through the via 29. Thus, a series of electrical circuits reaching the wiring pattern 24 is completed. In the illustrated semiconductor device 20, a semiconductor element (IC chip) 26 is mounted on the base layer 1-1 via an adhesive layer 25, and the semiconductor element 26 and the wiring pattern 21 are connected via bonding wires 27. Connected. Although not shown here, the semiconductor element 26 may be connected to the wiring pattern 21 by a flip chip bonding method instead of the wire bonding method as shown.

  Here, the necessity of adjusting the inductance obtained when the inductor is formed in the through hole of the multilayer substrate according to the present invention will be described.

  FIG. 10 is a schematic diagram showing an example of an LC parallel resonant circuit applicable to the implementation of the present invention, and FIG. 11 shows an inductance L = using the LC parallel resonant circuit of FIG. It is the graph which plotted the result of having performed simulation of S parameter S21 (passage characteristic) at 1 nH. Further, FIG. 12 is a graph plotting the result of the simulation of the S parameter S21 (passage characteristic) with the inductance L = 1.5 nH using the LC parallel resonant circuit of FIG. Note that the LC parallel resonance circuit as shown in FIG. 10 can be advantageously used for impedance matching purposes, for example, in communication devices such as mobile phones, antennas attached to radios, and the like.

  As can be understood from the S21 simulation results shown in FIGS. 11 and 12, the resonance point is changed by changing the inductance, and when L = 1 nH, resonance occurs near the frequency = 1 GHz, while L When = 1.5 nH, resonance occurs near the frequency = 0.8 GHz. Further, the amount of attenuation changes with the change of the resonance point, and it can be seen that the amount of attenuation is larger when L = 1 nH than when L = 1.5 nH. Since the attenuation value indicates that the characteristic impedance is closer to 50Ω as the value is larger, it is considered that better characteristics are obtained when L = 1 nH than when L = 1.5 nH. be able to. Thus, in order to resonate at a specified frequency, adjustment of the inductance is indispensable.

  Subsequently, an inductance adjustment method will be described with reference to FIG. FIG. 13 shows an inductor having the same configuration as that shown in FIG. 5. However, in the case of the illustrated inductor, a configuration in which the coil 7 is wound around the iron core 7 is adopted. In this inductor, the coil 7 can increase the magnetic flux as the cross-sectional area S is wider and as the magnetic path (path through which the magnetic flux passes) l is shorter. Also, the magnetic flux has the property of gathering where there is little magnetic resistance. Therefore, the magnetic flux can be increased by inserting the ferromagnetic material 6 having a high magnetic permeability into the internal space surrounded by the coil 7. Therefore, when a large inductance is desired and the coil 7 is desired to be miniaturized, the object can be achieved by inserting the iron core 7 which is a ferromagnetic material having a high magnetic permeability. The inductance L can be expressed by the following equation (1).

  In the above equation, k is the Nagaoka coefficient (coefficient determined by the diameter and length of the coil; obtained using a coefficient table), μ is the magnetic permeability, a is the radius of the coil, and n is the coil's radius. The number of turns. From this equation, it will be understood that the inductance L is proportional to the square of the number of turns n, the square of the radius of the coil a, the permeability, and inversely proportional to the magnetic path l.

It is sectional drawing which showed one preferable form of the inductor structure by this invention. It is the perspective view which showed an example of the thread cutting tool used for manufacture of the inductor structure of FIG. FIG. 3 is a cross-sectional view illustrating a manufacturing method of the inductor structure of FIG. 1 in order. FIG. 6 is a cross-sectional view showing another preferred embodiment of an inductor structure according to the present invention. It is the perspective view which showed an example of the thread cutting tool used for manufacture of the inductor structure of FIG. It is explanatory drawing of the multilayer circuit board used for manufacture of the inductor structure of FIG. FIG. 5 is a cross-sectional view showing a method for manufacturing the inductor structure of FIG. 4. It is sectional drawing which showed a preferable example of the transformer incorporating the inductor structure of this invention. It is sectional drawing which showed a preferable example of the semiconductor device incorporating the inductor structure of this invention. It is the schematic diagram which showed an example of LC parallel resonance circuit applicable to implementation of this invention. It is the graph which plotted the result of having simulated the passage characteristic using the LC parallel resonance circuit of Drawing 10 (A). It is the graph which plotted the result of having conducted the simulation of the passage characteristic using the LC parallel resonance circuit of Drawing 10 (B). It is a schematic diagram for demonstrating the adjustment method of the inductance in the inductor structure of this invention. It is a perspective view of the conventional built-up multilayer substrate provided with the pattern coil. It is sectional drawing of the conventional printed circuit board provided with the coil structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer substrate 2 Conductor layer 3 Through hole 4 Thread cutting tool 5 Thread 6 Rod-shaped inductor 7 Conductor coil 10 Inductor structure 11 Conductor pattern 12 Conductor pattern 13 Land 20 Semiconductor device 30 Transformer

Claims (11)

An inductor structure including a substrate in which at least one inductor is embedded, wherein the substrate is a multilayer substrate composed of a laminate of a plurality of base layers, and penetrates the base layer and / or the multilayer substrate. An inductor is formed, wherein the inductor is
(1) It consists of a coiled conductor pattern formed by selectively removing a conductor layer formed on the inner wall of a through hole formed through the base layer and / or the multilayer substrate, or (2) An inductor structure comprising a conductor coil wound in a predetermined pattern on an outer peripheral surface of a rod-like insulator screwed into an inductor formation portion of the base layer and / or the multilayer substrate.   In the inductor according to (1), the coiled conductor pattern is inserted into the through hole by inserting a threading tool having a cutting blade having a thread, the number of threads, and a pitch corresponding to the conductor pattern. The inductor structure according to claim 1, wherein the inductor structure is formed by threading until it is partially exposed.   The inductor structure according to claim 2, wherein the threading tool is a tapping screw.   In the inductor according to (2), the rod-shaped insulator is a threading tool, the conductor coil is wound around the thread groove, and is placed in the through hole. The inductor structure according to claim 1.   The inductor structure according to claim 4, wherein the threading tool is a tapping screw.   The inductor structure according to claim 1, 4 or 5, wherein the conductor coil is a metal wire.   The inductor structure according to claim 1, wherein the multilayer substrate is a multilayer wiring substrate.   The inductor structure according to claim 1, further comprising an active element and / or a passive element.   It is a semiconductor device, The inductor structure of any one of Claims 1-8 characterized by the above-mentioned.   The inductor structure according to any one of claims 1 to 3, wherein the inductor structure is a transformer having two through holes and an annular conductor core disposed through the through holes. .   The inductor structure according to claim 10, wherein a material of the conductor core is changed according to a desired inductance in the transformer.

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